阅读说明：本技术 天线组件及包括天线组件的装置 (Antenna module and device including antenna module ) 是由 金德龙 郑培墨 俞昌佑 于 2018-04-02 设计创作，主要内容包括：本发明提供一种天线组件和包括所述天线组件的天线装置,所述天线组件包括：多个天线元件；第一PCB,其一面上设置有所述多个天线元件；多个空腔滤波器,其设置在所述第一PCB的另一面上,且与所述多个天线元件电连接；以及第二PCB,在其一面上与所述多个空腔滤波器电连接,且至少包括功率放大器、数字处理电路、校准网络,所述第二PCB包括沿着相互平行的方向延长的一个以上第一处理区域和一个以上第二处理区域,在所述第一处理区域和所述第二处理区域中所述数字处理电路仅布置在第二处理区域上,在所述第一处理区域和所述第二处理区域中所述功率放大器仅布置在所述第一处理区域上。(The present invention provides a kind of antenna module and the antenna assembly including the antenna module, and the antenna module includes: mutiple antennas element；First PCB is provided with the multiple antenna element in one side；A plurality of cavities filter is arranged on the another side of the first PCB, and be electrically connected with the multiple antenna element；And the 2nd PCB, it is electrically connected at a surface thereof with the multiple cavity filter, and include at least power amplifier, digital processing circuit, calibration network, 2nd PCB includes along more than one extended first processing region of generally parallel orientation and more than one second processing region, the digital processing circuit described in first processing region and the second processing region is arranged only on second processing region, and the power amplifier described in first processing region and the second processing region is arranged only on first processing region.)

1. a kind of antenna module, characterized by comprising:

Mutiple antennas element；

First PCB is provided with the multiple antenna element in one side；

A plurality of cavities filter is arranged in the another side of the first PCB, and is electrically connected with the multiple antenna element；With And

2nd PCB is electrically connected with the multiple cavity filter at a surface thereof, and include at least power amplifier, number at Circuit, calibration network are managed,

2nd PCB include to more than one extended first processing region of generally parallel orientation and more than one at second Region is managed, the digital processing circuit described in first processing region and the second processing region is arranged only at second processing Region, the power amplifier described in first processing region and the second processing region are arranged only at first processing Region.

2. antenna module as described in claim 1, which is characterized in that

Be formed with port areas, the port areas along first processing region and the second processing region a part Side extends,

First processing region and the second processing region to be formed with the port areas substrate on one end on The vertical direction in the side of formation extends, and the one side in first processing region and the second processing region is formed with being located at It states on the substrate of port areas and the side that is formed at one end is close and arranges.

3. antenna module as described in claim 1, which is characterized in that

Be formed with port areas, the port areas along first processing region extension on one side,

First processing region and the second processing region are prolonged to the direction parallel with the extended direction in the port areas It is long, first processing region be located at be formed with the side that is formed on the substrate of the port areas and at one end close to and cloth It sets.

4. antenna module as claimed in claim 2 or claim 3, which is characterized in that

First processing region and second processing region are alternately arranged.

5. antenna module as described in claim 1, which is characterized in that

The digital processing circuit and the calibration network by being formed on the 2nd PCB with PCB pattern,

2nd PCB is connect in a manner of face contact with the filter.

6. antenna module as claimed in claim 5, which is characterized in that

The second processing region is directly connected to by wiring and the port areas.

7. a kind of antenna assembly comprising the antenna module of claim 1 comprising:

Body housing is arranged in below the 2nd PCB of the antenna module, and is formed with elongated slot；

Divergence type radiator is removably disposed at below the body housing, and has radiator body and cooling fin,

The divergence type radiator can receive the heat occurred by the 2nd PCB by the elongated slot.

8. antenna assembly as claimed in claim 7, which is characterized in that

Processing region in first processing region and the second processing region as relatively high pyrotoxin is arranged in described The edge side of 2nd PCB forms the lower region of the edge side of the processing region as relatively high pyrotoxin in the 2nd PCB Domain is formed with the elongated slot of the body housing, and is disposed with the divergence type radiator.

9. antenna assembly as claimed in claim 7, which is characterized in that

Protruding portion, the protruding portion and described second are formed on the radiator body of the divergence type radiator Below PCB contact and by can the 2nd PCB directly receive heat transfer.

10. antenna assembly as claimed in claim 7, which is characterized in that

The divergence type radiator is made of the material that pyroconductivity is higher than the body housing.

Technical field

The present invention relates to antenna assembly and antenna modules, more particularly to a kind of antenna assembly for wireless communication And antenna module used in antenna assembly.

Background technique

Wireless communication technique is for example, multiple-input and multiple-output (Multiple Input Multiple Output, MIMO) skill Art is on transmitter by different transmittings as the technology for increasing data transfer by using mutiple antennas breakthroughly Antenna emits different data, distinguishes the spatial reuse of transmitting data by signal processing appropriate on the receiver (Spatial multiplexing) method.

Therefore, with increasing the quantity of dual-mode antenna simultaneously to increase channel capacity, to can transmit more data.Example Antenna amount is such as increased to 10, then compared to current single antenna system, when using same frequency bandwidth, it can be ensured that about 10 times of channel capacity.

8 antennas at most can be used in the advanced long term evolution of 4G (4GLTE-advanced), at present in pre-5G rank The product for being equipped with 64 or 128 antennas is being developed in section, is being expected in 5G using the base with greater number antenna Station arrangement, and referred to as extensive MIMO (Massive MIMO) technology.Compared with the bi-dimensional cellular (Cell) runed at present, such as Tab phenolphthaleinum enters Massive MIMO technology, since 3D beam forming (3D-Beamforming) can be achieved, is then referred to as full dimension MIMO (Full Dimension MIMO, FD-MIMO).

In Massive MIMO technology, as the increase transmitter of antenna amount and the quantity of filter are consequently increased. However due to the rent or space constraints by setting place, small and light and low-cost RF component (day is produced Line/filter/power amplifier/transceiver etc.), by left and right using the success or failure of the antenna assembly of Massive MIMO technology. Massive MIMO needs high power to spread over area, but electric quantity consumption caused by this high power and calorific value It will play the role of negative factor during reducing weight and size.

Summary of the invention

(1) technical problems to be solved

As a result, the present invention it is to be solved the technical issues of be to provide it is a kind of with can effective radiator structure antenna assembly.

In addition, the present invention another technical problem to be solved is to provide a kind of not only minimized but also light-weighted laminated construction Mimo antenna component and antenna assembly including the antenna module.

(2) technical solution

To solve the above-mentioned problems, according to an aspect of the present invention, a kind of antenna module is provided and including antenna module Antenna assembly, the antenna module include:

Mutiple antennas element；First PCB is provided with the multiple antenna element in one side；A plurality of cavities filter, The another side of first PCB is set, and is electrically connected with the multiple antenna element；And the 2nd PCB, at a surface thereof with The multiple cavity filter electrical connection, and power amplifier, digital processing circuit, calibration network are included at least, described second PCB includes to more than one extended first processing region of generally parallel orientation and more than one second processing region, in institute It states digital processing circuit described in the first processing region and the second processing region and is arranged only at second processing region, described Power amplifier described in first processing region and the second processing region is arranged only at first processing region.

Other records based on this specification can derive other means solved the problems, such as except the content of record naturally.

Detailed description of the invention

Fig. 1 is the end perspective view for the antenna assembly that one embodiment of the invention is related to.

Fig. 2 is the figure for being illustrated the laminated construction for the Massive mimo antenna system that one embodiment of the invention is related to.

Fig. 3 is the exploded view for the Massive mimo antenna for taking one embodiment of the invention of the laminated construction of Fig. 2 to be related to.

Fig. 4 is the son that filter is combined on the first PCB for being combined with the antenna element that one embodiment of the invention is related to The exploded view of assembly.

Fig. 5 is the perspective view for illustrating the component arrangement structure on the 2nd PCB that one embodiment of the invention is related to.

Fig. 6 is the perspective view for illustrating the component arrangement structure on the 2nd PCB that another embodiment of the present invention is related to.

Fig. 7 is the perspective view for illustrating the component arrangement structure on the 2nd PCB that another embodiment of the present invention is related to.

Fig. 8 is the part for illustrating the 2nd PCB and other body housing and radiator that further embodiment of this invention is related to Exploded perspective view.

Specific embodiment

The embodiment of the present invention is described in detail referring to the drawings as follows.When marking appended drawing reference, even if identical Technical characteristic occurs in different drawings, has also used identical appended drawing reference as far as possible.Moreover, it is furthermore noted that in the whole text In specification, if it is considered to illustrating that may result in present subject matter unclear to technical characteristic known to correlation and function Chu, then description is omitted.

Fig. 1 is the end perspective view for the antenna assembly that one embodiment of the invention is related to.

The antenna assembly that one embodiment of the invention is related to may include antenna module 10, antenna body 20 and power supply module 30。

The antenna assembly that one embodiment of the invention is related to is converted electric energy into as a kind of as the energy of wireless receiving and dispatching electric wave Transformation and consumer, along with a large amount of heat of generation during energy conversion and consumption.If inside body housing Radio receiving transmitting module overheat, then device lifetime will substantially reduce.Moreover, the increase of the temperature with radio receiving transmitting module, wirelessly The sensitivity of transceiver module will be different.In particular, the temperature deviation of the position based on radio receiving transmitting module can cause different radio Sensitivity variations between transceiver module.Spirit between this sensitivity variations or different location based on radio receiving transmitting module temperature Sensitivity deviation not only hinders the transmitting-receiving accuracy of antenna assembly, but also thus can reduce transmitting-receiving speed.In order to solve as described above The problem of, the present invention propose it is a kind of in the laminated construction of Massive mimo antenna in terms of the size of antenna assembly and weight Have the advantage that and can carry out the Massive mimo antenna of efficient heat generation.The advantage can structure and conduct based on antenna module It constitutes the composition of the PCB of one of component of antenna module and realizes.In this specification, first to the composition of antenna assembly and antenna The laminated construction of component carries out after roughly illustrating, is illustrated to the composition for the PCB for constituting antenna module.

Fig. 2 is the figure for being illustrated the laminated construction for the Massive mimo antenna system that one embodiment of the invention is related to.

Fig. 3 is the exploded view for the MassiveMIMO antenna for taking one embodiment of the invention of the laminated construction of Fig. 2 to be related to. Fig. 4 is the son that filter 130 is combined on the first PCB120 for being combined with the antenna element 100 that one embodiment of the invention is related to The exploded view of assembly.In addition, filter 130 used in the present invention can be cavity filter 130 as an example.

Antenna body 20 is to exemplify with the structure of Massive mimo antenna in Fig. 2.As Massive mimo antenna Antenna body 20 include antenna house 210 (radome), be externally formed with the radiator of such as cooling fin 221 of heat dissipation 220 220 (heat sink) and the antenna module 10 (antenna assembly) arranged between them.Antenna module 10 can make by The morphosis that the module that digital element is constituted is combined with laminated construction.

Specifically, the laminated construction that one embodiment of the invention of Fig. 2 diagram is related to can be by including being combined with mutiple antennas member First PCB120 of part, the filter 130 being electrically connected with the signal wire of the first PCB120 and the 2nd PCB140, digital processing electricity Road, the analog processing circuit for forming power amplifier, the 2nd PCB140 including calibration network component constitute.Fig. 2 diagram In the laminated construction that one embodiment of the invention is related to, calibration network is formed in veneer together with power amplifier and digital processing circuit On, it is attached between power amplifier, calibration network, digital processing circuit, filter 130 without RF cable.Moreover, Fig. 2 Laminated construction compared with the prior art, be made of the less number of plies.

This structure is attached between filter 130 and PCB without using RF connector, is had and is effectively reduced day The advantages of size of line component.In contrast to this, for calibration network between antenna element 110 and filter 130 Antenna module structure, calibration network is usually made of multiple switch and the RF coupler coupled with one end of each filter 130 connects It connects.Therefore, supply network can only be connected with filter 130 by RF connector, be there are problems that making weight and be become large-sized.And And in this case, since the analog board and digiboard that form power amplifier are made of different layers and each layer passes through RF company Device structure interconnected is connect, therefore there are problems that being difficult to reduce weight and size.Moreover, in this structure, due in list A large amount of element is integrated on one PCB, integration density is caused to increase, it is thus possible to cause the related problem of fever.Unlike this It is that the laminated construction for the mimo system that one embodiment of the invention of Fig. 2 diagram is related to has excellent in size, weight related aspect Point, and by reducing the component density being integrated on single PCB, it is also further had the advantage that in terms of fever.The structure For for the interface connector of digital signal processing section to be replaced with PCB pattern, RF interface connector is replaced in PCB pattern Upper carry out face contact, to further realize maximization.That is, forming digital processing circuit on the 2nd PCB140 with PCB pattern And calibration network can make advantage as described above based on the structure that the 2nd PCB140 is connect in a manner of face contact with filter 130 Maximization.

In addition, the laminated construction for the Massive mimo antenna system that one embodiment of the invention of Fig. 2 diagram is related to is excellent Point is based on transceiver circuit, power amplifier, calibration network and number at least one PCB for example on the 2nd PCB140 The special arragement construction that processing circuit all with region division and is effectively arranged further is highlighted.This special arrangement knot Structure is being inquired into a kind of because integration density increase causes to generate heat and release to be somebody's turn to do due to integrating multiple element on single PCB The heat dissipation technology of fever.Specifically, above-mentioned PCB can be the 2nd PCB140, can be based on the 2nd PCB140 to be parallel to each other Direction arrangement more than one first processing region and second processing region realize above-mentioned purpose.

Hereinafter, the special arrangement structure on single PCB of the present invention is described in detail.

Fig. 5 is the top view for illustrating the component arrangement structure on single PCB that one embodiment of the invention is related to.

Referring to Fig. 5, the PCB that one embodiment of the invention is related to may include port areas 143, the first processing region 141 and the Two processing regions 142.

Port areas 143 may be arranged at least one end of PCB.In an embodiment of the present invention, it is arranged in port areas 143 Port can be optical port.But the invention is not limited thereto, port can be for carrying out receiving and dispatching digital letter with external equipment Number or analog signal digital signal terminal or analog signal terminal.

Port areas 143 can extend along at least end edge on substrate.As an example, port areas 143 can be along A part of side in one processing region 141 or second processing region 142 extends.

Hereinafter, by the direction or port areas parallel at least end edge on the substrate for being formed with port areas 143 143 extended directions are referred to as " transverse direction ".

Therefore, in one embodiment of this invention, port areas 143 can be to transverse direction in an at least end edge for PCB substrate Extend.

In addition, following " extending region to a direction " refers to that the region length is greater than the rectangular shape of width The length direction of shape, the region of the rectangular shape is parallel to a direction.

In this specification, as the region at least provided with power amplifier circuit, refer to does not have the first processing region 141 Arrange the region of digital processing circuit.Moreover, second processing region 142 is as the region for being at least disposed with digital processing circuit, Refer to the region for not arranging power amplifier.Only, a small amount of digital processing electricity is disposed in the first processing region 141 Road, or in the case where include the relevant component of a small amount of power amplifier in second processing region 142, in impartial range It inside also should be regarded as belonging to practical range of the invention.

In one embodiment of the invention, the first processing region 141, which can be, is not provided only with power amplifier, but also sets It is equipped with and the analog processing circuit (transceiver circuit) of multiple transmission/reception (TX/RX) circuits and the circuit region of calibration network is provided.

As an example, cavity filter can be electrically connected by the first processing region 141 with PCB.For example, cavity filter can Piece contact terminal by being formed in the first processing region 141 is electrically connected with the first processing region 141 on PCB.

In one embodiment of the invention, the first processing region 141 can be to extending transversely.That is, the first processing region 141 can be to The direction parallel at least end edge for PCB substrate for being formed with port areas 143 extends.

Second processing region 142 can be the circuit region for being provided with digital processing circuit.Digital processing circuit may include For handling the integrated chip of digital signal and its circuit member of subsidiary component.First processing region 141 and second processing area Domain 142 can express the difference of calorific value.

That is, in one embodiment of the invention, by transceiver circuit, calibration network and power amplifier group on single PCB The region of group's arrangement may be defined as the first processing region 141, can by the region that digital processing circuit group arranges on single PCB It is defined as second processing region 142.

But the present invention is not limited thereto.However, being also not excluded for being exchanged with each other the first processing region 141 and second processing A possibility that constituent element that region 142 respectively includes.

As an example, second processing region 142 can be by being arranged in the wiring and the first treatment region of the 2nd PCB140 The element in domain 141 is electrically connected.

In one embodiment of the invention, second processing region 142 can be to extending transversely.That is, second processing region 142 can be to The direction parallel with the side of at least one end of substrate of the 2nd PCB extends, and the 2nd PCB is formed with port areas 143.

In the embodiment of diagram, the first processing region 141 can be illustratively made of 3 regions, the first processing region 141 The reliable proximal port region 143 at least one region and arrange.

In addition, second processing region 142 may be arranged between the first processing region 141 in the embodiment of diagram.That is, this In one embodiment of invention, the first processing region 141 and second processing region 142 can be alternately arranged with each other.

An embodiment according to the present invention, due to the circuit from the first processing region 141 to extending transversely and second processing of The circuit in region 142 alternates arrangement, therefore the heat that can prevent the power amplifier of 141 circuit of the first processing region from occurring Bias toward part.Moreover, as an example, lesser 142 circuit of second processing region that generates heat is relative to 141 electricity of the first processing region Road can play a kind of heat absorption and radiator function, so as to increase the cooling performance of substrate.

Fig. 6 and Fig. 7 is the top view for illustrating the component arrangement structure on the single PCB that another embodiment of the present invention is related to.

Although as the arragement construction of a graphical representation of exemplary as described above, may be disposed to make to send out in power amplifier in Fig. 5 Raw heat is less hoarded above, has structural effect, but according to the performance of system requirements, it may occur that problem.

For example, when power amplifier is densely arranged in central portion and calorific value is made to concentrate on center, and pass through at number The dispersion of reason circuit makes multiple digital high-speed signals have the signal flow for passing through power amplifier PCB internal layer and being handled When, there is the potential factor of possible priming signal distortion.

Referring to Fig. 6, the PCB that another embodiment of the present invention is related to may include port areas 143, the first processing region 141 And second processing region 142.At this point, PCB can be the folded of the Massive mimo antenna system of Fig. 2 diagram as an example 2nd PCB140 of layer structure.The PCB that another embodiment of the present invention is related to is real compared to of the invention one illustrated referring to Fig. 5 The PCB that example is related to is applied, is had differences on the direction in the first processing region 141 and second processing region 142 and structural level.With Under, with the region arragement construction and another reality of the invention of the PCB that front is related to referring to Fig. 5 one embodiment of the invention illustrated It applies based on the difference in the region arragement construction for the PCB that example is related to, is illustrated referring to Fig. 6, and omit its repeated explanation.

In another embodiment of the present invention, port areas 143 can extend along at least end edge on substrate.

In another embodiment of the present invention, the first processing region 141 can be to longitudinal extension.

Hereinafter, longitudinal direction for referring to vertical transverse, that is, perpendicular to being formed with the PCB substrate of port areas 143 at least The direction of one end edge.

In addition, second processing region 142 can be to longitudinal extension in another embodiment of the present invention.

In the embodiment of diagram, second processing region 142 can be formed with port areas 143 that is, being located at two long sides The PCB and side formed at one end is close and arrange.

In addition, the first processing region 141 may be arranged between two second processing regions 142.

In another embodiment of the present invention, at least one end in second processing region 142 close can be formed in port areas 143 One end side and arrangement.Second processing region 142 can form the external signal transmitting port for port areas 143 as a result, For example, the integrated circuit wiring of optical port.

It may make up the electrical signals via port areas 143, second processing region 142 and the first processing region 141 as a result, Diameter.Moreover, for this electrical signal path or wiring, it is right without using other circuitous path, such as by through-hole (via) The structure that other layers are routed, so as to reduce the number of plies of PCB.

The component arrangement structure on single PCB being related in front referring to Fig. 5 one embodiment of the invention illustrated, i.e., horizontal cloth It sets in structure, in order to connect with such as optical port of port areas 143, the digital processing circuit in second processing region 142 needs circuitous It returns the first processing region 141 and is routed, this detour wiring for example requires to carry out on other layers of multi-layer PCB by through-hole circuitous It returns.The length and complexity of transmitting path can be increased based on the wiring of this detour, this is in high-speed digital video camera, Ke Nengyin It signals to be distorted.

In contrast to this, the another embodiment of the present invention of Fig. 6 diagram, that is, vertical arragement construction makes the length of transmitting path Degree and complexity reduce, and its electrology characteristic can be improved.By this wire structures of simplification, has and increase transmission accuracy and speed The advantages of spending.Moreover, according to this vertical arragement construction, it can be achieved that reducing the wires design difficulty of PCB, improving production efficiency and section About cost.

In addition, another embodiment according to the present invention, when the digital processing circuit in second processing region 142 is with higher multiple Miscellaneous when spending, second processing region 142 can be higher pyrotoxin compared to the first processing region 141.At this point, second processing area Domain 142 can have relatively higher temperature compared to the first processing region 141.

In another embodiment of the present invention, second processing region 142 can be disposed at the edge of PCB, fringe region compared to It is disposed with the middle section of the first processing region 141, it can be with outside air or the body housing contacted with outside air 230 It is contacted with radiator 220 with broader area.Therefore, the opposite second processing region 142 heated with high temperature is scattered Hot to will increase, the bulk temperature of PCB can be distributed with having.

In addition, being different from Fig. 6 and Fig. 7, the component arrangement structure on the PCB that another embodiment of the present invention is related to may be present Figure.The component arrangement structure on PCB that another embodiment of the present invention is related to is related to Fig. 6 another embodiment of the present invention illustrated And PCB on component arrangement structure compare, in addition to the arrangement of the first processing region 141 and second processing region 142 exist it is poor Different, other components are similar.That is, component arrangement structure and Fig. 6 on the PCB that another embodiment of the present invention is related to is of the invention The component arrangement structure on PCB that another embodiment is related to is compared, the difference lies in that the first processing region 141 and second processing The position in region 142 exchanges.The region arragement construction for the PCB being related to below with one embodiment of the invention described above with It is illustrated based on discrepancy in the region arragement construction for the PCB that another embodiment of the present invention is related to, and omits repeated explanation.

In another embodiment of the present invention, port areas 143 can extend along at least end edge on substrate.

In another embodiment of the present invention, the first processing region 141 and second processing region 142 can be to longitudinal extensions.

In another embodiment of the present invention, the first processing region 141 can be with long side that is, being formed with port areas 143 The vertical amount side of an at least end edge of PCB is close and arranges.

In addition, second processing region 142 may be arranged between two the first processing regions 141.

In another embodiment of the present invention, the reliable 143 ground cloth of proximal port region in at least one end in second processing region 142 It sets.Second processing region 142 can carry out transmitting port to the external signal of port areas 143 as a result, for example, the collection of optical port At wiring.Certainly, in this case, the first processing region 141 is arranged also close to 143 ground of port areas.

It may make up the electric signal via port areas 143, second processing region 142 and the first processing region 141 as a result, Path.Moreover, for this electrical signal path or wiring, other circuitous path, for example, without using passing through through-hole (via) structure being routed to other layers reduces the transmission path length of wiring so as to reduce layer (layer) number of PCB And complexity, so that the electrology characteristic of circuit can be improved.The component arrangement structure that another embodiment of the present invention is related to assumes that Exemplary arrangement structure when power amplifier is relatively high pyrotoxin.In this case, the first processing region 141 can be arranged At the edge of PCB, fringe region compared to the middle section for being disposed with second processing region 142, can with broader area with Outside air or the shell contacted with outside air and radiator 220 contact.It is possible to increase opposite heated with high temperature The first processing region 141 thermal diffusivity, so as to be evenly distributed the bulk temperature of PCB.

Fig. 8 is to illustrate the 2nd PCB and other body housing 230 and radiator 220 that further embodiment of this invention is related to Part combine perspective view and partial exploded perspective view.

Referring to Fig. 8, in order to further improve heat dissipation, the edge side for the PCB that another embodiment of the present invention is related to can be arranged High heat dissipation heat dissipation 220 (e.g., including the divergence type radiator 220 of cooling fin 221) separately.Here, as an example, making PCB for the object that radiates can be the 2nd PCB140.Moreover, as an example, may be arranged at the edge side of PCB, make to improve For relatively high pyrotoxin second processing region 142 (or according to design feature when the first processing region 141 is high pyrotoxin Can be the first processing region 141) heat dissipation characteristics, the radiator 220 of material of high thermal conductivity can separately be arranged under PCB Portion region.Specifically, radiator 220 can be higher than the materials such as copper, the aluminium of body housing 230 by pyroconductivity and be constituted.

As an example, radiator 220 may be provided at the lower area of the 2nd PCB140.Specifically, body housing 230 is arranged In the lower area of the 2nd PCB140, as an example, radiator 220 can be removably disposed at 230 lower part of body housing. That is, radiator 220 can be divergence type radiator 220.Moreover, radiator 220 may include radiator body 222 and cooling fin 221.Radiator 220 can directly receive the heat occurred by the 2nd PCB140 by elongated slot 231, and the heat dissipation of the 2nd PCB140 can be improved Efficiency.As an example, the elongated slot 231 for being formed in body housing 230 can be formed along the two edges face of shell, but not limited to this, It can be formed by various arrangements.From the 2nd PCB140 occur heat by be formed in body housing 230 elongated slot 231 can directly to Radiator 220 transmits.As an example, when in the first processing region 141 and second processing region 142 as relatively high pyrotoxin When processing region is arranged in the edge side of the 2nd PCB140, the processing as relatively high pyrotoxin is formed in the 2nd PCB140 Region, the 2nd PCB140 edge side lower area can be formed with the elongated slot 231 of body housing 230.Moreover, the 2nd PCB140 In be formed with processing region as relatively high pyrotoxin, the 2nd PCB140 edge side lower area and can be disposed with divergence type Radiator 220.As described above, by arranging the high component of heating efficiency close to the part with high pyrotoxin, so as to have Effect ground generates heat in the 2nd PCB140 and its peripheral portion.At this point, it is formed with contact surface between the 2nd PCB140 and radiator 220, So as to swimmingly generate heat.As an example, the upper surface of radiator 220 is formed with protruding portion 223, the protruding portion 223 and A face contact of two PCB140, so that the 2nd PCB140 be enable more swimmingly to radiate.

As a part of entire shell and the radiator 220 with high heat dissipation characteristics of setting body housing can pass through benefit It is manufactured with the die casting or die-casting process for being different from body housing 230.According to the present invention, since radiator 220 is arranged in phase To the region of high temperature source, the heat dissipation performance for high-temperature area can be strengthened and drop the heat dissipation performance to relative low-heat source region, thus It can remove cooling fin 221 or reduce its size.Can reduce as a result, this disclosure relates to antenna assembly overall volume and again Amount.In addition, the first processing region 141 compared to second processing region 142 be high pyrotoxin when, the first processing region 141 can cloth The edge side in the 2nd PCB140 is set, radiator 220 may be arranged at the side for being disposed with the 2nd PCB140 of the first processing region 141 Below edge side.That is, the processing region of relatively high pyrotoxin can be arranged in the first processing region 141 and second processing region 142 In the edge side of the 2nd PCB140, radiator 220 may be arranged at the lower area of the edge side of the 2nd PCB140.Moreover, in addition Radiator 220 can extend to the first processing region 141 direction vertical with the extending direction in second processing region 142, and cloth It sets below the 2nd PCB140.In this case, radiator 220 in addition crosses the first processing region 141 and second processing It is formed in the region of the edge side of the 2nd PCB140 and arrangement in region 142, and assists the first processing region 141 and second processing It radiates in region 142.Moreover, the entire radiator that can also be disposed with below different from above-mentioned arrangement of the 2nd PCB140 220。

In turn, the desired different heat dissipation characteristics according to different product characteristic, output, the changeable high heat dissipation being separately arranged The size and structure of the radiator 220 of characteristic.For example, the length of changeable cooling fin 221.It is therefore not necessary to change this product Exterior contour can provide the heat dissipation characteristics of suitable output demand.Moreover, radiator 220 can be one-piece type or divergence type.It dissipates When hot device 220 is divergence type, according to the characteristic of product or replaceable other suitable radiators 220 are exported.

In addition, other high heat dissipation radiator 220 may include more than one contact recess portion.It contacts behind recess portion and PCB Contact, for example, can with contacted behind the region where the high heater element in second processing region 142.

That is, second processing region 142 high heater element for example, in FPGA or dynamic signal processing chip, can will The heat portion of the directing out heat dissipation locally occurred, disperses in which can make the uniformity of temperature profile of PCB as a result,.

Since the heat of the heater element locally generated directly can be carried out radiating or being extracted by contact recess portion, because This can increase the cooling fin 221 of other high heat dissipation or the radiating efficiency of radiator 220, can reduce whole system institute as a result, The size and weight of the cooling fin 221 or radiator 220 that need.

The technical idea for illustrating to being given for example only property described above the present embodiment leads technology belonging to the present embodiment For domain has the technical staff of common knowledge, various repair can be carried out in the range of the substantive characteristics without departing from the present embodiment Change and changes.Therefore, the present embodiment is not for limiting but for the technical idea for illustrating the present embodiment, and the embodiment is not It is the range for limiting the technical idea of the present embodiment.The protection scope of the present embodiment should be based on claims quilt below It explains, all technical ideas belonged in its equivalency range should be interpreted that the scope of authority for belonging to the present embodiment.

Description of symbols

10: antenna module 20: antenna body

110: antenna element 210: antenna house

120: the one PCB 220: radiator

130: filter 230: body housing

140: the two PCB 30: power supply module

The cross reference of related application

Present patent application advocates the excellent of on March 31st, 2017 South Korea's identified patent applications the 10-2017-0042127th It first weighs, and this specification includes the full content of its priority in reference form.