阅读说明：本技术 用于检测数据的设备 (Equipment for detection data ) 是由 R·S·黑斯特贝格 O·丰克 E·弗兰克森 E·布塞 于 2018-04-26 设计创作，主要内容包括：根据本发明的设备涉及一种用于检测视觉数据的设备。在此,在摄像机壳体内,多个电子构件布置在至少两个电路板上。根据本发明,多个电路板连接成一个电路板堆叠,其中,在至少一个电路板的区域中在面向另一电路板的侧上实现至少一个凹部,在所述至少一个凹部中可以容纳布置在另一电路板上的构件。此外,根据本发明的数字摄像机可选地在电路板的区域中具有至少一个轮廓铣削部,所述至少一个轮廓铣削部尤其关于数字摄像机中的图像传感器实现高度平衡。此外,接口的连接设备的机械固定装置集成到与电路板堆叠连接的一个或多个固定元件中以及壳体部分借助具有预紧的至少一个夹具的连接是本发明的主题。此外,本发明涉及一种用于电接通的方法,借助所述方法能够制造根据本发明的用于检测数据的设备的主要的组成部分。(Equipment according to the present invention is related to a kind of equipment for detecting vision data.Here, multiple electronic components are arranged at least two circuit boards in camera housing.According to the present invention, multiple circuit boards connect into a circuit board and stack, wherein, at least one recess portion is realized on the side towards another circuit board in the region of at least one circuit board, the component being arranged on another circuit board can be accommodated at least one described recess portion.In addition, digital camera according to the present invention optionally has at least one Profile milling portion in the region of circuit board, at least one described Profile milling portion realizes high balance especially with respect to the imaging sensor in digital camera.In addition, the mechanical fastening system of the connection equipment of interface is integrated into and stacks in one or more fixing elements of connection with circuit board and housing parts by having the connection of at least one fixture pre-tightened are subject of the present invention.In addition, the main component part of the equipment according to the present invention for detection data can be manufactured by the method the present invention relates to a kind of method for electrically connecting.)

1. a kind of equipment for detecting vision data, the equipment is configured to digital camera (1), and the digital camera exists There are multiple electronic components (12) in camera housing (2), which is characterized in that in the camera housing (2), at least two Circuit board, which is stackedly arranged and connects into a circuit board, stacks (8), also, at least one of described circuit board is in its face There is at least one recess portion (15) in the region of the side of another circuit board into the circuit board, be used for receiving and be arranged in Electronic component (12) on another circuit board.

2. equipment according to claim 1, which is characterized in that at least one described recess portion at least one circuit board (15) at least one depth milling portion is embodied as in order to accommodate electronic component (12).

3. the equipment according at least one of above claim, which is characterized in that the circuit board stacks (8) by three Circuit board realizes that a circuit board structure in three circuit boards is connection circuit board (8c), wherein the recess portion (15) At least extend in the region of connection circuit board (8c) to accommodate the electronic component (12).

4. a kind of equipment for detecting vision data, the equipment is configured to digital camera (1), and the digital camera exists There are multiple electronic components (12) in camera housing (2), which is characterized in that at least one circuit board is equipped with the wheel of depth (T) Wide milling portion (14) is to realize high balance.

5. equipment according to claim 4, which is characterized in that by the high balance more particularly to according to carrying The thickness (D) of the circuit board of imaging sensor (9) and height (S) realization of described image sensor (9) will be arranged in sensor Imaging sensor (9) on circuit board (8b) is positioned accurately in the optical system of the digital camera (1).

6. a kind of equipment for detecting vision data, the equipment is configured to digital camera (1), and the digital camera exists There are multiple electronic components (12) in camera housing (2), which is characterized in that at least one mechanical connecting device (16c) is integrated Into at least one fixing element (16a) of arrangement on circuit boards.

7. equipment according to claim 6, which is characterized in that at least one described fixing element (16a) is arranged in interface (16) in the region of each connection equipment and being mechanically fixed for electrical connection section is realized.

8. the equipment according to any one of claim 6 and 7, which is characterized in that the connection equipment of interface (16) is realized For USB connection equipment, CSI-2- connection equipment and/or I/O connection equipment.

9. a kind of equipment for detecting vision data, the equipment is configured to digital camera (1), and the digital camera exists There are multiple electronic components (12) in camera housing (2), which is characterized in that lower part of the housing (2b) is by least one elasticity Fixture (3) and upper part of the housing (2a) are clamped.

10. the method at least two circuit boards of the one kind for electronic component to be electrically connected to digital camera (1), wherein At least one electronic chip is welded on the circuit board, which is characterized in that so execution welding process, so that making soldering paste such as This fusing, so that at least one of described electronic chip is only heated once by welding process.

11. according to the method described in claim 10, it is characterized in that, only heating primary electronic chip is configured to image biography Sensor (9).

12. according to claim 1 in 0 and 11 at least one of described method, which is characterized in that not only will in the method Electronic component is welded at least two circuit boards, and at least two circuit board is welded to one another into a circuit sheetpile Folded (8).

13. method described at least one of 0 to 12 according to claim 1, which is characterized in that used welding process passes through Reflow Soldering recycles to realize.

Technical field

The equipment and one kind for detection data that the present invention relates to a kind of in the sense that digital camera are for making The method for making the equipment for detection data.This digital camera usually has at least one imaging sensor or conversion core The optical information of arrival is converted into attached electric signal by piece.The known digital camera for example with so-called CCD chip Machine.

The camera housing for the optical system that usually there is this digital camera carrying to be consisted of multiple lenses.In the light The sensor for vision data to be converted into electric data is disposed with behind system.Additionally, this digital camera is logical Often with having control element and memory component.In addition, at least one interface is usually arranged, it is used to be led to other equipment Letter.In digital camera, mass data is transmitted between different electronic components.

Background technique

Such as the basic structure of this digital camera is described in 1432240 A1 of EP.In DE 102,005 027 892 It illustrates in A1 for the solution by sensor arrangement in camera housing.

For this digital camera, not only in private domain but also in commercial field, there are a variety of application fields.Accordingly Digital camera be also increasingly used in production and control device and/or be used in combination with industrial robot.

In the case where many applications, need digital camera and provided optical information very high quality, Furthermore it correspondingly to go back relative cost advantageously and provide digital camera with very constant high quality.

Furthermore, it is necessary to smaller and smaller video camera, the available structure space in camera housing is further as a result, It is restricted.

The production optimized for the cost aspect of digital camera is advantageous, component, such as shell and optical component It can be used for different camera types, the camera type is different for example in terms of used imaging sensor.However, Different imaging sensors generally entails different structure heights, thus must optics device of the expense highland realization for video camera The profession arrangement of the imaging sensor of part.

According to the prior art, interface (such as in the form of I/O connectors) for being communicated with other equipment Attachment device is configured to separated electric connecting device and mechanical connection equipment.Electric connecting device is typically soldered on circuit board, and Mechanical connection equipment is realized on camera housing.Therefore, in order to ensure mechanical connection equipment and electric connecting device are correct each other Ground orientation, the circuit board for carrying electric connecting device must orient with limiting relative to camera housing.This needs digital camera Interior separated circuit board, because sensor circuit board compared to the circuit board for carrying the connection equipment there is different orientations to want It asks.Furthermore it is known that structure need the flexible connection between each circuit board, lead to cost and when necessary signal integrity Problem.

The combination of above-mentioned requirement can't be met by hitherto known methods and equipment.

Summary of the invention

Therefore, the task of the present invention is the configuration for so realizing a kind of element being arranged in camera housing, make to have leisure Between demand optimized.

According to the present invention, this task is solved in the following way, and the circuit board of digital camera so constructs, so that electric At least one of road plate, which has, for example passes through depth millingRealize at least one recess portion, it is described extremely A few recess portion accommodates other circuit boards for being arranged in digital camera at least one recess (Tasche) being designed in this way On component at least part.

Another task of the invention is digital camera so to be constructed, so that even if in the number for different structure series In the case that word video camera uses different imaging sensors, (such as it can also be filtered using with affiliated optical component always Light device, coverslip or camera lens) identical camera housing.

According to the present invention, which solves in the following manner, determine one of imaging sensor and optical device/it is more A circuit board has Profile milling portion, which so reduces the thickness of the circuit board or the thickness of circuit board stacking, So that on the case inside for being arranged in digital camera supporting member and circuit board combine with the adhesive between supporting member, Can so matching image sensor and optical device spacing so that imaging sensor may be arranged at restriction about optics device In the plane of part.

Another task of the invention is so to construct the interface for being communicated with other equipment of digital camera, The mistake orientation of the mechanical connecting device and electrical plug contact portion for allowing to exclude to be associated with interface relative to each other (Fehlausrichtung)。

According to the present invention, which solves in the following way: the attachment device in camera side of interface is not according to existing There is technology as electrical contacts and be arranged in circuit board Shangdi and mechanical connecting device is arranged in the realization of shell Shangdi, but it is common Ground is arranged on the circuit board of digital camera.

Another task of the invention be realize camera housing at least two parts can reverse connection, this can reverse connection Fast quick-detach and it can be latched and ensure being reliably connected for housing parts.

According to the present invention, which solves in the following manner, and the connection of housing parts is by least one fixture reality Existing, at least one described fixture has due to its special shape design and pre-tightens (Vorspannung), which generates fixation The recuperability of the interconnecting piece of housing parts.

Multiple realization possibilities in structure set forth below and method and technology can choose individually or each other group Ground is closed to realize.

In a preferred embodiment, digital camera according to the present invention has the video camera being made up of multiple pieces. Shell.At least two circuit boards are disposed in camera housing, described at least one image of at least two circuit board bearings passes Sensor and electric components attached and other.

At least two circuit boards are connected to each other to circuit board stacking by welding.Here, one in circuit board is advantageously It is configured to sensor circuit board, carries at least one imaging sensor, also, another circuit board structure is main circuit board, At least one master chip as control element is carried, at least one described master chip is advantageously configured as ASIC, FPGA or place Manage device.

At least one of circuit board has at least one recess portion on its side towards another circuit board, works as circuit board When connecting into circuit board stacking, at least one described recess portion forms following recess between corresponding circuit board: in the concave The component for the corresponding height being arranged on other circuit boards can be accommodated.Advantageously, at least one recess portion is embodied as depth milling Portion.

It is also contemplated that the structure that the circuit board being made of three circuit boards stacks, wherein advantageously, a circuit board structure It makes as sensor circuit board, a circuit board structure is connection circuit board and a circuit board structure is main circuit board.At this In embodiment, the depth milling portion for being used to form the recess between circuit board can completely or at least partially be arranged in connection In circuit board, so that different sensor circuit board and main circuit board can come by the matching of the cost advantages of connection circuit board It is combined with each other.Optionally, depth milling portion can additionally extend in sensor circuit board.In addition, by using connection electricity Road plate the recess with bigger height may be implemented in the case where the thickness of other circuit boards remains unchanged, thus can also To accommodate the component with bigger structure height.

In addition, digital camera according to the present invention is at least one circuit board in a kind of advantageous embodiment There is Profile milling portion, the thickness which reduces the thickness of circuit board or circuit board stacks in region.

Particularly advantageously, Profile milling portion be arranged at the outmost fringe region of sensor circuit board and with sensing The thickness of device circuit board, the structure height of imaging sensor are arranged in camera shooting for what sensor circuit board or circuit board stacked Image sensing is limited in combination with the thickness of adhesive between the intracorporal supporting member of casing and supporting member and circuit board stacking Position of the device in DV.

A kind of embodiment according to the present invention of digital camera includes at least one electricity at least one recess portion Road plate and at least one circuit board at least one Profile milling portion, at least one described recess portion for accommodate be arranged in it is another Component on one circuit board, at least one the described position of Profile milling portion for realizing imaging sensor in digital camera Matching is realized by three circuit boards in this embodiment --- it is configured to a sensor circuit board, a connection circuit The circuit board stacking of plate and a main circuit board --- composition is particularly advantageous, because above-mentioned spy can so be realized Property, so that for each circuit board, it is only necessary to most a type of millings, it is possible thereby to reduce manufacturing cost.

In a kind of advantageous embodiment of digital camera according to the present invention, it is used for and other equipment to realize At least one attachment device of the interface communicated is disposed at least one fixing element circuit board heap is stacked on, such as It is configured to so-called fastener (Fastener).

Fastener is following fixing element: the fixing element realizes the machine of at least one attachment device of at least one interface Tool connects equipment and the fixing element connects in the region of the arrangements of electric connection of at least one interface with corresponding circuit board.

The arrangements of electric connection of interface is for example embodied as the socket with electrical plug contact portion, and fastener is with additional Tightening device or apparatus for fastening are mechanically fixed against the plug connection of interface.

Fastener can for example realize with 90 ° or 180 ° of embodiment, so as to by the attachment device of interface correspondingly It is arranged in the side or rear of camera housing.Here, the angle describes the stacking side that attachment device is stacked relative to circuit board To plugging direction.

In addition, digital camera according to the present invention is used at least one fixture in a kind of advantageous embodiment It is connected in by the part of camera housing, at least one described fixture has due to its shape to be pre-tightened, which fixes The connection of the part of camera housing.

Particularly advantageously, camera housing is divided into two parts, the two parts have in the region of its connecting side In external structure, which forms the receiving portion for being used at least one fixture.

In a kind of advantageous embodiment, at least one fixture is made and of sheet metal (Blech) in its longitudinal direction side There is protrusion upwards, which is for example realized by one or more bending sections in the transverse direction of fixture.This is prominent Realize the preload of fixture in the portion of rising.In the end of longitudinal direction side, fixture is respectively provided with a fixed device, and the fixation device is for example logical The local buckling of fixture is crossed to realize.In an end of fixture, the contained structure of bending section and shell side is realized in combination Undercut portions (Hinterschnitt) and the realization spring element at the other end.

Advantageously, the contained structure on the part of camera housing respectively by the seamed edge that is arranged on housing parts come It realizes, is arranged substantially in parallel with the connection plane of housing parts, also, fixture can be fixed behind.

In order to connect housing parts, at least one fixture be can be positioned in the region of the contained structure of shell side And it can extend in a longitudinal direction and on the protrusion for exerting a force to fixture, then, the curved end of fixture It can be positioned at behind the seamed edge of housing parts attached.Due to fixture preload and the recuperability that occurs is connected in protection Direction on work.

In addition, the present invention relates to a kind of for electronic component to be electrically connected at least two circuit boards of digital camera Method, wherein at least one electronic chip is welded at least one circuit board, wherein by least two circuit boards that This is welded, which is characterized in that so execution welding process, so that at least one electronic chip is only added by welding process It is hot primary.

Particularly, consider in the case where the method according to the present invention for connection, protect in the welding process at least One temperature sensitive imaging sensor.

Therefore, in the first step, successively assembled on the upper side and lower side and soldered sensor circuit board is (except described Other than at least one imaging sensor).In the second step, it is successively assembled on the upper side and lower side and welds main circuit Plate, and assemble in a further step when necessary and be welded to connect circuit board.After corresponding assembly and welding, by circuit board It is stored in the relevant storage part of board type (pallet).The circuit needed for stacking for circuit board is taken out from these pallets Plate.

Circuit board is formed in the following manner to stack: being taken out main circuit board from the storage part attached and is positioned main circuit Next plate takes out the circuit board (such as given by connection circuit board or sensor circuit board) to connect with main circuit board, Solder flux is applied at least one of circuit board to be connected, circuit board to be connected is placed on main circuit board, weight It is multiple it is previously mentioned from taking out circuit board to be connected the step of, until sensor circuit board to be placed on to the heap being thusly-formed It is stacked on, then solder flux is applied on sensor circuit board and/or on the downside of imaging sensor, and imaging sensor is put It sets on sensor circuit board and the welding process of script (its be advantageously implemented as Reflow Soldering circulation), passes through the weldering of the script Each circuit board that termination process stacks circuit board is connected to each other and connects and connects imaging sensor and sensor circuit board It connects and connects.

Feature according to the present invention allows to be manufactured in the following manner the digital camera with especially small structure space: It can realize, only in the stacked on all electronic components (connection including communication interface for realizing video camera of a circuit board heap Including equipment), which, which stacks, can be accurately located at camera shooting corresponding to the given requirement of the orientation to imaging sensor In machine.

Detailed description of the invention

It is schematically depicted in the drawings illustrative embodiment of the invention.

Fig. 1 shows the perspective view of camera housing；

Fig. 2 shows the cut-away view of digital camera according to the present invention amplified in the region of fixture, which is used for Connection lower part of the housing clamps relative to each other with upper part of the housing and by these structural details；

Fig. 3 shows the perspective view of the amplification of the fixture according to Fig. 1；

Fig. 4 shows the fragmentary sectional view for the amplification that circuit board according to the present invention stacks；

Fig. 5 shows the vertical vertical section for the component being arranged in camera housing；

Fig. 6 shows the side view that the circuit board according to the present invention of digital camera stacks；

Fig. 7 shows the perspectivity top view that the circuit board according to the present invention of digital camera stacks；

The circuit board according to the present invention that Fig. 8 shows the digital camera with fixing element stacks；

Fig. 9 shows the circuit sheetpile according to the present invention of the digital camera of the alternative embodiment with fixing element It is folded；

Figure 10 shows another diagram of the circuit board layout in camera housing；

Figure 11 shows the circuit board layout according to Figure 10 of the imaging sensor with substitution；

Figure 12 shows the circuit board layout according to Figure 10 and Figure 11 with another substitute as imaging sensor；

Figure 13 shows the view of the circuit board with set welding region and depth milling portion；

Figure 14 shows the flow chart for illustrating the production process of main circuit board；

Figure 15 shows the flow chart for illustrating the production process of sensor circuit board；

Figure 16 is shown for illustrating in the case where manufacturing the general arrangement for the circuit board that circuit board according to the present invention stacks Production procedure another flow chart.

Specific embodiment

The basic of the camera housing (2) of digital camera according to the present invention (1) can be seen that by the perspective view in Fig. 1 Structure.Camera housing (2) is made of lower part of the housing (2b) and upper part of the housing (2a).Lower part of the housing (2b) and upper part of the housing (2a) It is connected to each other by two fixtures (3).Fixture (3) is made of retractable and elastic material (such as steel).

Zinc casting is used especially to be proved to be symbol as the material for manufacturing lower part of the housing (2b) and/or upper part of the housing (2a) Purpose is closed, because it is possible thereby to realizing fine structure in the case where relatively thin wall thickness.

It is disposed in the region of the upside of (2a) in the upper housing multiple cooling ribs (4), so as to which heat dissipation is arrived Ambient enviroment.Lower part of the housing (2b), which has, is embodied as the lens holder apparatus (5) of circular flange, and the lens holder apparatus is to arriving The opening that enters of lower part of the housing (2b) carries out limit.In the inner space of camera housing (2), with lens holder apparatus (5) It has been disposed adjacently optical component, such as one or more optical lenses or optical filter.

In addition, tool is described two there are two installing equipment (6) in the region of (2b) in the lower part of the housing for camera housing (2) Installation equipment is embodied as screw thread (Schraubgewinde) and described two installation equipment for example in the embodiment shown It can be used for connecting digital camera (1) with tripod or holding meanss.

Fig. 2 shows the fragmentary sectional views of amplification of the digital camera (1) in the region for the fixture (3) installed.

Enclosure interior is partly show in the left area of figure.In the lower part of the housing at (2b), have for optical filter The contact pin (7) of bearing shape (Profil) goes out in interior pleurapophysis.It is disposed with circuit board above the contact pin and stacks (8), the circuit board Stack has two circuit boards being connected to each other in the embodiment shown, and described two circuit board structures are a main circuit Plate (8a) and a sensor circuit board (8b).Sensor circuit board (8b) carries on its side being below in figure Imaging sensor (9).

It can also be seen that fixture (3) are equipped with material bending portion in its end regions in Fig. 2.Lower right shows in Fig. 2 Bending section region (3b) out is used to hang the shape (10) attached of (2b) in the lower part of the housing first below.It is left in Fig. 2 The other bending section region (3a) that top can be seen that on fixture (3) is for sandwiching (Einclippen) to upper part of the housing (2a) Correspondence shape (Gegenprofil) (11) in.

Perspective in Fig. 3 illustrates the structure of fixture (3), which has on the direction that it longitudinally extends slightly bends Bending section (3c).In the state of installation, bending section (3c) is substantially in the mistake from lower part of the housing (2b) to upper part of the housing (2a) It crosses in region and extends.The elastic elongation of bending section (3c) gripping clamping apparatus (3) when sandwiching.

In installment state, be associated with upper part of the housing (2a) bending section region (3a) it is corresponding with upper part of the housing (2a) outside Shape (11) forms undercut portions.The bending section region (3b) for being associated with lower part of the housing (2b) is configured to be divided into two-part spring element Part.It is divided into the rounded outer profiles that two parts make it possible to be matched with camera lens bogey (5) in the region of shape (10).

In addition, fixture (3) tool is there are two installing auxiliary part (3d), described two installing auxiliary parts are embodied as in fixture (3) Recess portion.

It avoids bonding or tightening at shell (2) by the use of fixture (3).Furthermore, it is possible to be opened with the very short time Pin is to execute installation process.

Fig. 4 shows the cross section that circuit board stacks (8).Circuit board stacks (8) tool, and there are two circuit board, described two circuits Plate structure is a main circuit board (8a) and a sensor circuit board (8b).

Other than the imaging sensor (9) with sensor glass (9a), not only on sensor circuit board (8b) but also Electronic component (12) are disposed on main circuit board (8a), the electronic component for example can be structured as capacitor, resistor, two Pole pipe and/or IC.

In addition, the construction of main circuit board (8a) carrying digital camera (1) is the control element of master chip (13), the main core Piece is embodied as ASIC in an example shown.

Sensor circuit board (8b) has Profile milling portion (14) in being located above on the side with lower section in Fig. 4 for it, Position of the imaging sensor (9) in digital camera (1) can be influenced by the Profile milling portion.In addition, sensor circuit There are two recess portion (15), described two recess portions are embodied as depth milling portion and form main circuit board (8a) and sensing plate (8b) tool Recess between device circuit board (8b), the recess are used to accommodate the component (12) between circuit board.

By the metallization in the region in the face of the limit recess portion (15) of circuit board, may be implemented to so constructing Recess in accommodate component (12) electromagnetic shielding.

Other than master chip (13), the connection equipment of interface (16) is disposed on main circuit board (8a), the connection equipment With fixing element (16a) and I/O connectors (16b).

Fig. 5 with the cross-sectional diagram of digital camera (1) illustrate in the region of circuit board using Profile milling portion (14) with Just thus, it is possible to execute high balanceFirst it can also be seen that using folder in the cross-sectional diagram Tool (3) is for connecting lower part of the housing (2b) and upper part of the housing (2a).The thickness (S) of imaging sensor (9) is for that can answer Different images sensor (9) in digital camera according to the present invention (1) is variable, but in any individual feelings It is given under condition.It is in the case where according to the present invention using Profile milling portion (14) of depth (T) it is possible that so real Existing high balance, so that defining the position of imaging sensor (9) relative to the reference planes (E) of the fixation of digital camera (1) Height (H) can be matched corresponding to system requirements.

Here, can slightly be matched by selection sensor circuit board (8b), which has corresponding In the selected thickness (D).Pass through the adhesive used when circuit board to be stacked to (8) and is mounted in camera housing (2) The further matching of height (H) may be implemented.Here, applying adhesive to the supporting member attached in enclosure interior space (17) it is applied on and/or in the region of Profile milling portion (14) on sensor circuit board (8b), and makes camera housing (2) sensor circuit board (8b) orientation.Next, adhesive curing and in the region of supporting member (17) by sensor electricity Road plate (8a) is connected with camera housing (2).However, only can be by viscous in solidification in very limited region This possibility is realized in the contraction of mixture and the after hardening expansion relevant to temperature of adhesive.

In addition, the use of expander board (18) is shown in FIG. 5, which carries additional electronic chip (19) (such as being configured to FPGA) and the memory component (20) for example in the form of at least one RAM module, also, extension electricity Road plate can be connect by connection plug (21) with main circuit board.

Addedly to Fig. 5, Fig. 6 shows the thickness (D) of sensor circuit board (8b) and the thickness of imaging sensor (9) again (S) and the arrangement of the depth (T) of Profile milling portion (14).The side view that circuit board according to the present invention stacks (8) is shown here Figure, which, which stacks, has main circuit board (8a) and sensor circuit board (8b).

Fig. 7 shows the sensing that imaging sensor (9) stacks (8) in the circuit board according to the present invention of digital camera (1) The perspective view of arrangement on device circuit board (8b).Further, it can be seen that being arranged in multiple electronics on sensor circuit board (8b) Component (12).It is disposed with fixing element (16a) in the region of main circuit board (8a), may be implemented two by the fixing element Two connection equipment of interface (16) are mechanically fixed.

It also can be realized according to the present invention: being divided into two by a part is associated at least one interface (16) respectively Divide ground or is divided into more partly implementations fixing element (16a).

As the electronic component (12) attached can be used for example flash memory, block-condenser, voltage regulator, power supply, Clock generator and/or protection circuit.Corresponding component can also be applied in multiple embodiments.

According to the diagram in Fig. 8, other than master chip (13) and other electronic component (12), stacked in circuit board (8) connectors (23) be there also is provided on main circuit board (8a) and two external connections with fixing element (16a) are set Standby (16).

Connectors (23) are used as the connection possibility of optional expander board (18), as shown in Figure 5.

In the advantageous embodiment shown in, the connection equipment of interface (16) is respectively provided with an arrangements of electric connection (16b), which realizes the female contact of script, also, the arrangements of electric connection is at least electrically connected with main circuit board (8a) It connects.Such as USB interface, CSI-2 interface or I/O interface may be implemented in this socket.The fixing element (16a) attached is arranged in In the region of arrangements of electric connection (16b) and be for example fixed on by welding and/or being mechanically connected main circuit board (8b) and/or Circuit board stacks on (8).

Advantageously, fixing element (16a) is made of solid material (such as zinc casting body) and has at least one machinery even Connection device (16c), at least one mechanical connecting device are for example configured to screw thread.The fixed member of single-piece as shown in fig. 8 Part (16a) is directionally arranged relative to main circuit board (8a) is in 90 °.

A kind of embodiment party of (8) is stacked according to the circuit board according to the present invention for illustrating digital camera (1) in Fig. 9 Formula, digital camera fixing element (16a) with single-piece in 90 ° of part orientation and 180 ° of part orientation.

Figure 10 shows the Profile milling portion (14) of depth (T) with perspective view in the region of sensor circuit board (8b) again Arrangement on sensor circuit board (8b) of arrangement and small imaging sensor (9).Imaging sensor (9) has significant surface Product (F).The thickness (D) of used sensor circuit board (8b) is matched with used imaging sensor generally according to the present invention (9).The protection cap of imaging sensor (9) is usually realized by glass plate (not shown).

It is stacked between the circuit board of (8) by the way that electronic component (12) is integrated in circuit board, it is possible to, it realizes with non- The digital camera (1) of often compact structural shape.It is particularly likely to, passes through main circuit board (8a) and sensor circuit board The good connection of (8b) when necessary minimizes required block-condenser.Especially can with the direct welding of execution circuit plate, with Just connectors are saved.Here, being automatically realized circuit board phase due to the surface stress of the scolding tin material of liquid in welding The scolding tin material of folded accurate positioning, the liquid connects corresponding pad on circuit boards.

In addition, extraordinary signal integrity also may be implemented in the case where realizing high-speed data connection.

The circuit board layout with various sizes of imaging sensor (9) is shown respectively in Figure 11 and Figure 12.

Figure 13 shows the underside view of sensor circuit board constructed according to the invention (8b).Sensor circuit board (8b) tool There are two recess portion (15), described two recess portions form two recesses to accommodate the component being arranged on another circuit board (12).In This, one in recess is divided into three sub- recesses.In the region of the structure without milling, sensor circuit board (8b) has more A pad (25), the multiple pad is for connecting circuit board to be connected.

In addition, there are two holes, described two holes to be used as being bound to circuit board for arrangement in the region of recess portion (15) It stacks the vent passages in the space between (8), camera housing (2) and optical filter or cover glass and to can be realized pressure flat Weighing apparatus.In the case where a possibility that no pressure balance, may be implemented in the case where variable ambient pressure furthermore from Fixed (Beschlagen) optical device in inside.Here, passing through welded connection shape between the circuit board that circuit board stacks (8) At structure be used as the filter in the meaning of labyrinth-type excluder for flowing into air and therefore prevent foreign matter (such as Dust) it is introduced into the region of imaging sensor (9).

Flow chart in Figure 14 illustrates the manufacturing process of main circuit board.In the first process steps, by paste application to electricity On the upside of road plate.The soldering paste is preferably unleaded.It is Preferably also coated in printing process, similar to using Silk-screen printing in the case where template (Schablone).Here, the thickness of template determines the amount of coated soldering paste.

Set positioning parts after (assembly), are being executed into the first fusion process (first on the upside of main circuit board Welding process).Later, the automatic visual inspection of upside is carried out.It, will be under paste application to main circuit board after circuit board rotation On side, and later by set positioning parts in the region of downside.Then, fusion process (the second welding is executed again Process) and re-start downside automatic visual inspection.After executing optical check, by each circuit board separate and by that The circuit board of this separation is inserted into attached pallet.Then the test in terms of the connection realized is executed, and last Execute functional test.

Figure 15 shows the manufacturing process of sensor circuit board.Here, first will be under paste application to sensor circuit board On side and execute the first fusion process.Then, also rotate circuit board in this case, also, by paste application to pass On the upside of sensor circuit board.Later, set electronic building brick is located on downside.Sensor is not positioned also. Then fusion process is executed, and in this case also last execute the automatic visual inspection for carrying out downside.Later, by circuit Plate is separated from each other and is arranged in pallet apart from each other.Soldering paste generally comprises scolding tin material and solder flux.

Figure 16 illustrates the manufacturing process for circuit board composition.Here, it is (main so that pallet empty first is equipped with main circuit board Plate) and then add sensor circuit board.It then will be on the downside of paste application to sensor circuit board.It is walked in another manufacture In rapid, sensor circuit board is located on main circuit board and adds sensor.Then solder flux is arranged under sensor It is located on sensor circuit board on side and by sensor.Later, the fusion process for sensor is carried out, and most laggard Row functional test.

It may be implemented by the method according to the present invention illustrated in Figure 14 to 16, assembling cmos image to circuit board In the case where sensor, relevant imaging sensor only goes through a welding process.

Next component of the present invention is summarized again, is optionally either used alone or in combination with one another.

In the particularly advantageous embodiment of one kind of the invention, for detection data equipment --- the equipment is configured to Digital camera --- there is at least one combination of the feature referred in independent claims 1,4 and 6.

On the one hand, according to the present invention, electronic component is integrated into the recess portion in circuit board stacking, thus to support reality Existing compact structure is realized.

In addition, being passed by least one Profile milling portion in the region of at least one circuit board especially with respect to image Sensor carries out high balance.

According to another variant schemes of the present invention, the mechanical fastening system of the connection equipment of interface is integrated into and circuit sheetpile In one or more fixing elements of folded connection, and according to another variant schemes of the present invention, execute special welding process with Avoid passing through welding process damage electronic component.

Finally, housing parts are connected to each other by using at least one special spring chuck, so as to can not only be real Existing housing parts are reliably connected and can be realized simple production procedure.

About internal data communication, it is preferred to use corresponding data/address bus.The definition of each camera function and The set coordination of function is preferably realized by being configured to the master chip of ASIC.