阅读说明：本技术 一种电子封装微焊点在高温条件下的热迁移实验装置 (A kind of thermophoresis experimental provision of Electronic Packaging microbonding point under the high temperature conditions ) 是由 杨栋华 杜飞 冉藤 翟翔 田将 秦浩桐 杨明波 张春红 于 2019-09-29 设计创作，主要内容包括：本发明公开了一种电子封装微焊点在高温条件下的热迁移实验装置,包括底座,所述底座上设有横向滑轨,两个横向滑块滑动配合连接于横向滑轨上,一个横向滑块上固定有加热机构,另一个横向滑块上固定有冷却机构,所述加热机构的加热面和冷却机构的冷却面竖向布置；所述加热面和冷却面上可拆卸连接有用于横向放置试样的样品台,试样两端分别与加热机构的加热面和冷却机构的冷却面接触。其结构简单,能够适用于较高温度的热迁移实验,有效避免除温度梯度外其他因素对实验结果的影响,能够在钎料熔化的同时发生热迁移,使金属原子通过液态钎料发生迁移,可以极大地减小热迁移阻力,极大地提高热迁移效率。(The invention discloses a kind of thermophoresis experimental provision of Electronic Packaging microbonding point under the high temperature conditions, including pedestal, the pedestal is equipped with horizontal slide rail, two transverse slider sliding connections are in horizontal slide rail, heating mechanism is fixed on one transverse slider, cooling body is fixed on another transverse slider, the heating surface of the heating mechanism and the cooling surface of cooling body are vertically arranged；It is removably connected with the sample stage for laterally disposed sample on the heating surface and cooling surface, the sample both ends cooling face contact with the heating surface of heating mechanism and cooling body respectively.Its structure is simple, the thermophoresis that can be suitable for higher temperature is tested, effectively avoid influence of the other factors to experimental result in addition to temperature gradient, thermophoresis can occur while brazing filler metal melts, migrate metallic atom by liquid solder, thermophoresis resistance can greatly be reduced, greatly improve thermophoresis efficiency.)

1. a kind of thermophoresis experimental provision of Electronic Packaging microbonding point under the high temperature conditions, it is characterised in that: including pedestal (1), The pedestal (1) is equipped with horizontal slide rail (2), and the sliding connection of two transverse sliders (3) is on horizontal slide rail (2), and one It is fixed with heating mechanism (4) on transverse slider (3), is fixed with cooling body (5), the heating on another transverse slider (3) The heating surface of mechanism (4) and the cooling surface of cooling body (5) are vertically arranged；It is removably connected on the heating surface and cooling surface For the sample stage (6) of laterally disposed sample (7), sample (7) both ends heating surface and cooling body with heating mechanism (4) respectively (5) cooling face contact.

2. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 1 under the high temperature conditions, feature exist In: the material of the sliding block (3) and sample stage (6) is uralite, refractory brick, glass fibre, foamed cement, aeroge One of felt, mineral wool and alumina silicate.

3. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 1 or 2 under the high temperature conditions, feature Be: the heating mechanism (4) includes the heating core being fixed on sliding block (3) and the hot end control system connecting with heating core, The heating temperature of heating core is adjusted by hot end control system, realizes the adjusting to the microbonding point hot-side temperature of sample (7).

4. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 3 under the high temperature conditions, feature exist In: the heating core is covered in addition to the other faces of heating surface using thermal insulation material, and the thermal insulation material is glass fibre, foaming water One of mud, aerogel blanket, mineral wool and alumina silicate etc..

5. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 1 or 2 under the high temperature conditions, feature Be: the temperature regulating range of the cooling surface of the cooling body (5) is 80 DEG C of 0 ~ ﹣.

6. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 1 or 2 under the high temperature conditions, feature Be: the sample stage (6) include lateral connection portion (62) for placing sample (7) and with heating mechanism (4) or cooler The vertical interconnecting piece (61) that structure (5) is detachably connected, one end of the lateral connection portion (62) are upper with vertical interconnecting piece (61) End is fixedly connected, and the upper surface of lateral connection portion (62) is equipped with the accommodation groove (63) for laterally disposed sample (7).

7. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 1 or 2 under the high temperature conditions, feature Be: the sample stage (6) include lateral connection portion (62) for placing sample (7) and with heating mechanism (4) or cooler The vertical interconnecting piece (61) that structure (5) is detachably connected, the quantity of the vertical interconnecting piece (61) are two, lower end and lateral connection The end in portion (62) is fixedly connected, and is formed between two vertical interconnecting pieces (61) and is held the space that sample (7) pass through.

Technical field

The present invention relates to a kind of extreme temperature gradient devices, and in particular to a kind of Electronic Packaging microbonding point is under the high temperature conditions Thermophoresis experimental provision.

Background technique

As we enter big data era, mobile device is ubiquitous.The foundation of Internet of Things makes person to person, people and machine Device, machine become ubiquitous with exchanging for machine.Artificial intelligence AI has obtained extensive exploitation, it more or less affects me The every aspect lived.These variations promote the quick update of Electronic Packaging and device, in mobile device and mainframe computer Need more highdensity transistor.However, the miniaturization impetus of the very large-scale integrated of the transistor based on Moore's Law is Slow down.Currently, the most promising method of extension Moore's Law is the three-dimensional collection for integrating (2D IC) from the two dimension of circuit to circuit At (3D IC).By taking solder joint as an example, from 760 μm of maximum ball grid array (BGA) to 100 μm of medium size Solder Joint in Flip Chip, And the micro convex point for the minimum dimension that diameter is 10 μm in 3D IC technology, the requirement of encapsulation field butt welding spot size are more and more tighter Lattice.

In the near future, the diameter of solder joint is likely lower than 10 μm.When spot size is from when narrowing down to 10 μm for 100 μm, 1000 times of volume-diminished, the variation of microstructure is obviously.Traditional solder joint is mainly made of interface I MC and solder, During welding spot size persistently reduces, the ratio of solder joint total volume shared by IMC is higher and higher, or even eventually forms and only count The full IMC solder joint of a or dozens of crystal grain composition.With the lasting reduction of welding spot size, encapsulation field professional is to complete The development trend of IMC solder joint causes sufficiently to pay attention to.

When solder joint is all made of IMC, the properties of solder joint will be with traditional solder joint by there is big difference, can to encapsulation Evaluation criterion by property can be also very different.In addition, metallic atom has higher energy when temperature is higher, interface is anti- It should be easier to carry out.Studies have shown that formation speed of the IMC under solid-liquid interface reaction is remote when temperature is more than the fusing point of solder Higher than interfacial reactions, and the presence of extreme temperature gradient can also induce the fast-growth of interface I MC.

CN110174432A discloses a kind of thermophoresis experimental provision of Electronic Packaging microbonding point, the device from top to bottom according to Secondary includes heating mechanism, fixture and cooling body, and the fixture is set in the space between heating mechanism and cooling body, is used for Fixed sample, the cooling body include outer housing, inner housing and refrigeration machine, are equipped with the chamber for accommodating coolant liquid inside the inner housing Body, outer cover are equipped with outer housing, and the outer housing is fitted closely with inner housing, and the refrigeration machine runs through shell by connecting line Body and inner housing are connected to cavity；The outer housing is made by thermal insulation material, and evacuation is equipped at position corresponding with fixture and is lacked Mouthful, so that the sample in fixture is directly bonded with interior shell surface.Since sample is vertically arranged, when heating mechanism temperature is excessively high When, the solder in weld seam will melt, the heating mechanism of sample upper end due to gravity will extruded sample, and then make It obtains solder to overflow from weld seam, influences experimental result, therefore, the load temperature for the sample being vertically arranged cannot be excessively high.

Summary of the invention

The object of the present invention is to provide a kind of thermophoresis experimental provision of Electronic Packaging microbonding point under the high temperature conditions, knots Structure is simple, and the thermophoresis that can be suitable for higher temperature is tested, and effectively avoids in addition to temperature gradient other factors to experimental result Influence, thermophoresis can occur while brazing filler metal melts, migrate metallic atom by liquid solder, can be very big Ground reduces thermophoresis resistance, greatlys improve thermophoresis efficiency.

The thermophoresis experimental provision of Electronic Packaging microbonding point of the present invention under the high temperature conditions, including pedestal, it is described Pedestal is equipped with horizontal slide rail, and two transverse slider sliding connections are fixed on a transverse slider in horizontal slide rail Heating mechanism is fixed with cooling body, the cooling of the heating surface and cooling body of the heating mechanism on another transverse slider Face is vertically arranged；The sample stage for laterally disposed sample, sample both ends are removably connected on the heating surface and cooling surface Respectively with the cooling face contact of the heating surface of heating mechanism and cooling body.

Further, the material of the sliding block and sample stage is uralite, refractory brick, glass fibre, foamed cement, gas One of gel felt, mineral wool and alumina silicate.

Further, the heating mechanism includes the heating core being fixed on sliding block and the hot end connecting with heating core control system System adjusts the heating temperature of heating core by hot end control system, realizes the adjusting to the microbonding point hot-side temperature of sample.

Further, for the heating core in addition to the other faces of heating surface are using thermal insulation material covering, the thermal insulation material is glass One of glass fiber, foamed cement, aerogel blanket, mineral wool and alumina silicate etc..

Further, the temperature regulating range of the cooling surface of the cooling body is 80 DEG C of 0 ~ ﹣.

Further, the sample stage includes lateral connection portion for placing sample and can with heating mechanism or cooling body One end of the vertical interconnecting piece of dismantling connection, the lateral connection portion is fixedly connected with the upper end of vertical interconnecting piece, lateral connection The upper surface in portion is equipped with the accommodation groove for laterally disposed sample.

Further, the sample stage includes lateral connection portion for placing sample and can with heating mechanism or cooling body The vertical interconnecting piece of dismantling connection, the quantity of the vertical interconnecting piece are two, and the end in lower end and lateral connection portion is fixed to be connected It connects, is formed between two vertical interconnecting pieces and hold the space that sample passes through.

The present invention is by the way that heating mechanism and cooling body to be fixed on transverse slider, the heating surface of heating mechanism and cooling The cooling surface of mechanism is vertically arranged；The sample stage for laterally disposed sample is fixedly connected on the heating surface and cooling surface, The laterally disposed solder that ensure that microbonding point of sample exposes in air in experiment, while under the load of temperature gradient, pricker Material due to being deposited in the weld seam of sample always under surface tension and capillarity, so that commissure brazing filler metal melts and in extreme temperature Degree gradient issues heat migration, quickly generates intermetallic compound.

Compared to the mode that existing sample is vertically arranged, the load temperature range of sample lateral arrangement is wider, and solder is molten In the weld seam for being deposited in sample always under surface tension and capillarity after change, and then can quickly, largely it prepare various complete IMC solder joint lays the foundation for the research of full IMC solder joint.

The present invention is by avoiding sample compared to the mode that existing sample is vertically arranged for sample lateral arrangement The influence that microbonding point is influenced by the gravity of heating mechanism during the experiment, and then only needs to consider temperature gradient to sample, mentions The high accuracy of thermophoresis experimental result.

The present invention is slidably matched by transverse slider and horizontal slide rail, realize between heating mechanism and cooling body away from From adjusting, thermophoresis experiment can be carried out according to the sample stage that specimen size customizes corresponding size, enhance thermophoresis experiment The versatility of device.

While brazing filler metal melts thermophoresis can occur for the present invention, migrate metallic atom by liquid solder, Thermophoresis resistance can greatly be reduced, greatly improve thermophoresis efficiency.

The configuration of the present invention is simple, it is low in cost, operate convenient, long service life.

Detailed description of the invention

Fig. 1 is structural schematic diagram of the invention；

Fig. 2 is one of the structural schematic diagram of sample stage of the invention；

The second structural representation of sample stage of the invention when Fig. 3.

In figure, 1-pedestal, 2-horizontal slide rails, 3-sliding blocks, 4-heating mechanisms, 5-cooling bodies, 6-sample stages, 61-vertical interconnecting pieces, 62-lateral connection portions, 63-accommodation grooves, 7-samples, 8-fixed blocks.

Specific embodiment

It elaborates in the following with reference to the drawings and specific embodiments to the present invention.