阅读说明：本技术 天线装置 (Antenna assembly ) 是由 蔡宗翰 李冠锋 吴湲琳 于 2019-04-29 设计创作，主要内容包括：本发明提供一种天线装置,包括第一天线对。第一天线对包括第一天线单元以及与第一天线单元并列设置的第二天线单元。第一天线单元包括沿第一长度方向延伸的第一膜。第二天线单元包括沿第二长度方向延伸的第二膜。第一长度方向与第二长度方向之间的角度的范围为75度至105度。(The present invention provides a kind of antenna assembly, including first antenna pair.First antenna is to the second antenna element for including first antenna unit and being set side by side with first antenna unit.First antenna unit includes the first film extended along the first length direction.Second antenna element includes the second film extended along the second length direction.The range of angle between first length direction and the second length direction is 75 degree to 105 degree.)

1. a kind of antenna assembly characterized by comprising

One first antenna pair, the first antenna is to including:

One first antenna unit, including one first film extended along one first length direction；And

One second antenna element is set side by side with the first antenna unit, and second antenna element includes along one second One second film that length direction extends；

Wherein the range of the angle between first length direction and second length direction is 75 degree to 105 degree.

2. antenna assembly as described in claim 1, which is characterized in that further include:

One second antenna pair, adjacent to the first antenna pair, second antenna is to including a third antenna unit, and described the Triantennary unit includes the tertiary membrane extended along a third length direction；

Wherein the range of the angle between the third length direction and first length direction is 0 degree to 15 degree.

3. antenna assembly as claimed in claim 2, which is characterized in that further include one first driving assembly and third driving Component, first driving assembly and first film are electrically connected, and the third driving assembly electrically connects with the tertiary membrane It connects, first driving assembly and the third driving assembly are driven in order.

4. antenna assembly as claimed in claim 3, which is characterized in that the first antenna unit further includes a connection pad, and institute It states the first film to be electrically connected by the connection pad and first driving assembly, wherein the thickness of the connection pad is greater than described first The thickness of film.

5. antenna assembly as described in claim 1, which is characterized in that further include a packing material, be set to described first It is contacted in antenna element and with first film.

6. antenna assembly as described in claim 1, which is characterized in that first film is a multilayered structure comprising one absolutely Edge layer and a conductive layer.

7. antenna assembly as described in claim 1, which is characterized in that the first antenna unit further include a first electrode with The second electrode that the first electrode is oppositely arranged, and first film is set to the first electrode and the second electrode Between.

8. antenna assembly as claimed in claim 7, which is characterized in that first film includes a first part and one second Part, the first part is than the second part far from the connection pad, and the first part is Chong Die with the first electrode, The thickness of the second part is greater than the thickness of the first part.

9. antenna assembly as claimed in claim 7, which is characterized in that first film include an at least hole, it is described at least One hole is not Chong Die with the first electrode.

10. antenna assembly as claimed in claim 7, which is characterized in that the second electrode includes a slit, the slit edge One the 5th length direction extends, the range of the angle between the 5th length direction and first length direction be 0 degree extremely 15 degree.

Technical field

The invention relates to a kind of antenna assembly, in particular to including (the MEMS- based on MEMS Based) the antenna array of antenna element.

Background technique

Comprising the electronic product including display panel, such as smartphone, tablet computer, laptop, display With TV etc., it has also become the indispensable necessity of modern society.With flourishing for this portable electronic product, consumption Person entertains very high expectation to the quality, function and price of these products.These electronic products are commonly equipped with ability to communicate.

Antenna is widely used in the communication function of electronic product, is the necessary component of all wireless devices, most existing Antenna include resonator (resonator).Recently, liquid crystal molecule is used as the tuning block in rf-resonator.It is specific and Speech, liquid crystal antenna assembly can generate different dielectric coefficients by electric field is adjusted, to control the direction of rotation of liquid crystal molecule, into And adjust phase, amplitude or the direction of propagation of electromagnetic wave.

However, some difficulties may be suffered from using liquid crystal molecule in antenna assembly, for example, liquid crystal molecule may Be limited to speed that they can be switched, they can operating temperature range, long-term operation reliability etc..Therefore, it develops It is many desired that the antenna structure of other reliable tuning blocks, which can be used,.

Summary of the invention

The present invention provides a kind of antenna assembly, including first antenna pair.First antenna to include first antenna unit and The second antenna element being set side by side with first antenna unit.First antenna unit includes first extended along the first length direction Film.Second antenna element includes the second film extended along the second length direction.Between first length direction and the second length direction Angle range be 75 degree to 105 degree.

In one embodiment of this invention, which further includes the second antenna pair.Second antenna is to adjacent to described First antenna pair, for the second antenna to including a third antenna unit, third antenna unit includes extending along a third length direction A tertiary membrane.Wherein the range of the angle between third length direction and the first length direction is 0 degree to 15 degree.

In one embodiment of this invention, which further includes the first driving assembly and third driving assembly.The One driving assembly and the first film are electrically connected, and third driving assembly and tertiary membrane are electrically connected, and the first driving assembly and third are driven Dynamic component is driven in order.

In one embodiment of this invention, first antenna unit further includes a connection pad.First film drives by connection pad and first Dynamic component is electrically connected.Wherein the thickness of connection pad is greater than the thickness of the first film.

In one embodiment of this invention, which further includes packing material.Packing material is set to first antenna It is contacted in unit and with the first film.

In one embodiment of this invention, the first film is a multilayered structure comprising an insulating layer and a conductive layer.

In one embodiment of this invention, first antenna unit further includes first electrode and is oppositely arranged with first electrode Second electrode.First film is set between first electrode and second electrode.

In one embodiment of this invention, the first film includes first part and second part.First part is than second Divide far from connection pad, and first part is Chong Die with first electrode, the thickness of second part is greater than the thickness of first part.

In one embodiment of this invention, the first film includes an at least hole.An at least hole not with first electrode weight It is folded.

In one embodiment of this invention, second electrode includes a slit.Slit extends along the 5th length direction, and the 5th is long The range for spending the angle between direction and the first length direction is 0 degree to 15 degree.

Detailed description of the invention

For the above objects, features and advantages of the present invention can be clearer and more comprehensible, below in conjunction with attached drawing to tool of the invention Body embodiment elaborates, in which:

Fig. 1 shows according to some embodiments of the invention, the upper schematic diagram of antenna assembly；

Fig. 2A and Fig. 2 B is shown according to some embodiments of the invention, depending on showing in the amplification of the antenna element in antenna assembly It is intended to；

Fig. 3 shows according to some embodiments of the invention, the partial enlargement diagram of the antenna assembly of Fig. 1；

Fig. 4 A shows according to some embodiments of the invention that the section along the antenna assembly of the line segment A-A ' in Fig. 1 shows It is intended to；

Fig. 4 B shows according to some embodiments of the invention, the partial enlargement diagram of the region R in Fig. 4 A；

Fig. 5 A~5C shows according to some embodiments of the invention, the circuit diagram of film and driving assembly；

Fig. 6 A~6F shows according to some embodiments of the invention that it is traditional thread binding to be formed by day in the intermediate stage of manufacturing method The partial cutaway schematic view set；

Fig. 7 A~7D shows according to some embodiments of the invention, the partial cutaway schematic view of antenna assembly.

Symbol description:

10 antenna assemblies；

100 antennas pair；

100a first antenna unit；

100A first antenna pair；

The second antenna element of 100b；

The second antenna pair of 100B；

100c third antenna unit；

The 4th antenna element of 100d；

102 first substrates；

104 the second substrates；

106 first electrodes；

108 second electrodes；

The first driving assembly of 110a；

The second driving assembly of 110b；

110c third driving assembly；

The 4th driving assembly of 110d；

112 films；

The first side 112a；

112b second side；

112c first part；

112p second part；

112 ' first layers；

112 " the second layers；

114 first connection pads；

116 slits；

118 guide holes；

119 conducting wires；

120 holes；

122 waveguides；

The first insulating layer of 124a；

124b second insulating layer；

126 distance members；

128 second connection pads；

130 packing materials；

132 sacrificial layers；

200 first controllers；

300 second controllers；

A-A ' line segment；

C conductive terminal；

D₁First distance；

D₂Second distance；

D₃Third distance；

DL1, DL2, DL3 data line；

E₁First length direction；

E₂Second length direction；

E₃Third length direction；

E₄4th length direction；

E₅5th length direction；

L₁First length；

L₂Second length；

L₃Third length；

L₄4th length；

M alignment mark；

The region R；

SL scan line；

T₁First thickness；

T₂Second thickness；

T₃Third thickness；

W₁First width；

W₂Second width；

W₃Third width；

θ₁、θ₂、θ₃、θ₄Angle.

Specific embodiment

It elaborates below for the structure and its manufacturing method of antenna assembly provided by the invention.It is to be understood that Narration below provides many different embodiments, to implement the different patterns of some embodiments of the invention.Spy as described below Fixed component and arrangement mode only simply clearly describes some embodiments of the invention.Certainly, these only to illustrate rather than this The restriction of invention.Duplicate label or mark may be used in different embodiments.These are repeated only for simply clearly chatting Some embodiments of the invention are stated, not representing has any association between the different embodiments and/or structure discussed.Furthermore work as Describe a first material layer be set in a second material layer or on when, including first material layer directly connects with second material layer The situation of touching.Alternatively, also may between be separated with the situations of one or more other materials layers, in this case, first material layer and the It may be not directly contacted between two material layers.

It should be understood that the component or device in attached drawing can exist with various forms well-known to those skilled in the art. In addition, relativity term, such as " lower " or " bottom " or " higher " or " top " may be used in embodiment, to describe schema A component for another component relativeness.It will be appreciated that if making it turn upside down the device overturning of schema, The component then described in " lower " side will be as the component in " higher " side.

Although moreover, it will be understood that term " first ", " second ", " third " etc. can be used herein to describe various groups Part, component, region, layer, part and/or section, these components, component, region, layer, part or section should not be by these terms It limits.These terms are intended merely to distinguish different components, component, region, layer, part or section.Therefore, discussed below one First assembly, component, region, layer, part or section can be referred to as one second group without departing from teachings of the present invention Part, component, region, layer, part or section.

The embodiment of the present invention can cooperate schema to understand together, and schema of the invention is also considered as a part of invention description. It should be understood that schema of the invention is not drawn to scale, in fact, the size of component may be zoomed in or out arbitrarily Clearly to show feature of the invention.In addition, being schematically painted structure and device for simplicity of illustration.

Here, " about ", " about ", " substantial " term be generally represented in the 20% of a given value or range, preferably It is in 10%, is more preferably in 5% or within 3% or within 2% or within 1% or within 0.5%.Given quantity herein It is quantity about, that is, in the case where no certain illustrated " about ", " about ", " substantial ", can still implies " about ", " greatly About ", the meaning of " substantial ".

Unless otherwise defined, whole terms (including technology and scientific words) as used herein have leads with belonging to the present invention The normally understood identical connotation of the technical staff in domain.It is appreciated that, these terms for example define in usually used dictionary Term, should be interpreted to have with the relevant technologies and background of the invention or the consistent meaning of context, without should with one ideal Change or excessively formal mode is interpreted, unless having special definition in the embodiment of the present invention.

In addition, in some embodiment of the invention, about engagement, term such as " connection ", " interconnection " of connection etc., unless Especially definition, otherwise can refer to two structures is directly to contact, or be also referred to as two structures and non-direct contact, wherein having other Structure is set between this two structures.And this also may include that two structures are all removable or two about the term of engagement, connection The all fixed situation of a structure.

In addition, term " length direction " is defined as the direction of the long axis along or parallel to object.And long axis is defined as indulging The straight line at the center of object is extended through to ground (lengthwise).For long and narrow or oval object, long axis closest to Its longitudinal full-size.For not having the object of clear long axis, long axis can represent the minimum rectangle that can surround the object Long axis.

In addition, term " in the range of the first numerical value to second value " indicates that the range includes the first numerical value, second Numerical value and other numerical value between them.

According to some embodiments of the present invention, a kind of antenna assembly is provided, the antenna assembly includes to use micro-electro-mechanical systems The antenna element for structure of uniting.In addition, antenna element arranges in a specific way, so that electromagnetic wave caused by antenna assembly is substantial Therefore it can improve signal quality provided by antenna assembly for (circular-polarized) of circular polarization.By this Kind of configuration, antenna assembly can be more energy saving, and antenna assembly more preferably in multiple directions can send or receive letter by signal conformance Number.

Fig. 1 shows according to some embodiments of the invention, the upper schematic diagram of antenna assembly 10.It should be understood that in order to It is clear to illustrate, some components of antenna assembly 10 are omitted in Fig. 1, for example, first substrate 102 (head substrate).Furthermore Ying Li Solution, according to some embodiments of the invention, can add additional features in antenna assembly.It is as described below according to some embodiments Partial Feature can be substituted or delete.

Fig. 1 is please referred to, antenna assembly 10 includes mutiple antennas to 100, and each antenna can further include two antenna lists to 100 Member, for example, first antenna unit 100a and the second antenna element 100b.Antenna is set to first substrate 102 and the second base to 100 Between plate 104 (as shown in Figure 4 A).Antenna can be arranged on first substrate 102 to 100 with multiple signal wires and controller, with shape At antenna array.In some embodiments, antenna is to 100 and scan line SL, data line DL1, data line DL2 and data line DL3 It is electrically connected.Specifically, scan line SL can be electrically connected with the driving assembly of antenna element (for example, first shown in Fig. 1 Driving assembly 110a or the second driving assembly 110b).Data line DL1, data line DL2 and data line DL3 can respectively with antenna list First electrode 106, second electrode 108 and the film 112 of member are electrically connected.

In addition, scan line SL can be electrically connected with the first controller 200.First controller 200 can be used as the row of array (row) controller.In some embodiments, scan line SL can be electrically connected with the first more than one controller 200, for example, Scan line SL can be electrically connected with two the first controllers 200.In other words, antenna assembly 10 may include bilateral drive system (dual-side driving system) is to control the signal of scan line SL.Bilateral drive system can reduce the electricity of signal wire The distorted signals problem that resistance-capacitive load (RC load) or unilateral drive system may cause.On the other hand, data line DL1, number It can be electrically connected with second controller 300 according to line DL2 and data line DL3.Second controller 300 can be used as the column of array (column) controller.First controller 200 and second controller 300 can transmit signals to antenna element or from antennas Unit receives signal and handles signal.In addition, the first controller 200 and second controller 300 can be electrically connected to each other.It is aforementioned Scan line, data line and the controller of array can adjust and control unlatching/closing of antenna element.

In addition, as shown in Figure 1, for control second electrode 108 signal data line DL2 also with multiple conductive terminals (conductive terminal) C connection, conductive terminal C can electrically connect with the data line DL2 being set on first substrate 102 Connect (as shown in Figure 4 A).Conductive terminal C may be disposed at communications zone or communication region (as shown in Figure 1) of array.

On the other hand, alignment mark M may be disposed in the second substrate 104 in antenna assembly 10.In some embodiments, First substrate 102 also may include corresponding alignment mark M, so that first substrate 102 and the second substrate 104 (second electrode 108) It can be aligned in assembling.In some embodiments, alignment mark M may be disposed at the angle of the second substrate 104 or first substrate 102 Near falling.In addition, settable more than one alignment mark M.In some embodiments, it can be formed and be aligned by patterning process Mark M.Patterning process may include light lithographic process or screen painting processing procedure.

Then, A and Fig. 2 B, Fig. 2A and Fig. 2 B are shown according to some embodiments of the invention referring to figure 2., antenna assembly 10 In first antenna unit 100a amplification upper schematic diagram.As shown in Figure 2 A, first antenna unit 100a may include the first electricity Pole 106, film 112 and the first connection pad 114.First electrode 106 and second electrode 108 are positioned opposite to each other, first electrode 106 with Second electrode 108 can be respectively as the top electrodes and bottom electrode of first antenna unit 100a.In some embodiments, first Electrode 106 can be electrically connected by guide hole (via) 118 and data line DL1.

First electrode 106, second electrode 108 and the first connection pad 114 can be formed by conductive material.In some embodiments, First electrode 106, second electrode 108 and the first connection pad 114 respectively may include copper, aluminium, molybdenum, tungsten, gold, chromium, nickel, platinum, titanium, copper conjunction Gold, aluminium alloy, molybdenum alloy, tungsten alloy, billon, evanohm, nickel alloy, platinum alloy, titanium alloy, other suitable conductive materials Or combination above-mentioned, but not limited to this.In some embodiments, first electrode 106, second electrode 108 and the first connection pad 114 can It is formed by transparent conductive material.For example, first electrode 106, second electrode 108 and the first connection pad 114 respectively may include indium Tin-oxide (ITO), tin oxide (SnO), indium zinc oxide (IZO), indium gallium zinc (IGZO), indium tin zinc oxide (ITZO), its Its suitable transparent conductive material or combination above-mentioned, but not limited to this.In some embodiments, the 106, second electricity of first electrode Pole 108 and the first connection pad 114 can be formed by conducting polymer.For example, conducting polymer may include poly- (3,4- ethylene dioxies Thiophene)-poly styrene sulfonate (poly (3,4-ethylenedioxythiophene)-poly (styrenesulfonate), PEDOT:PSS), polythiophene (polythiophene, PT), polypyrrole (polypyrrole, PPY) or polyphenylene sulfide (polyphenylene sulfide, PPS).

In some embodiments, second electrode 108 further includes slit formed therein (slot) 116.Slit 116 can be The hollow region being set in second electrode 108, slit 116 can be configured with specific direction to generate the electromagnetism with desired orientation Wave.In some embodiments, slit 116 may be configured as substantial parallel with film 112.Although should be understood that narrow in schema Seam 116 has rectangular shape, but according to some other embodiments, slit 116 can have other suitable shapes.In addition, can Slit 116 is formed by patterning process.Patterning process may include light lithographic process or screen painting processing procedure.

As shown in Figure 2 A, film 112 may be disposed between first electrode 106 and second electrode 108.Film 112 can connect with first Pad 114 contacts.Antenna assembly 10 can include one or more of the first connection pad 114.In some embodiments, film 112 is fixed on first On connection pad 114.Specifically, film 112 can be arranged across first electrode 106, this part will be in being explained below.In addition, Film 112 can be electrically connected (as shown in Figure 1) by the first connection pad 114 and the first driving assembly 110a.In some embodiments, One connection pad 114 can be electrically connected by conducting wire 119 and guide hole 118 and the first driving assembly 110a.

Film 112 can be formed by conductive material.In some embodiments, film 112 can be formed by metal material.In some implementations In example, the material of film 112 may include copper, aluminium, titanium, molybdenum, tantalum, tungsten, silver, gold, copper alloy, aluminium alloy, titanium alloy, molybdenum alloy, tantalum Alloy, tungsten alloy, silver alloy, billon, other suitable metal materials or combination above-mentioned, but not limited to this.Film 112 can be by Semiconductor material is formed, for example, silicon, germanium or silicon carbide etc..Film 112 can also be formed by conducting polymer above-mentioned.

Brought forward is stated, and film 112 is set between first electrode 106 and second electrode 108.It should be noted that according to film 112 with The position of the variation of current potential between first electrode 106 or between film 112 and second electrode 108, film 112 may change.The The voltage of one electrode 106 may be different from the voltage of second electrode 108.Specifically, can be by controlling the first driving assembly Potential difference between 110a and film 112 and first electrode 106 or second electrode 108 changes the voltage of film 112.Therefore, controllably Film 112 and the capacitor between first electrode 106 or second electrode 108.It on the other hand, can be by second controller 300 and number According to the voltage of line DL1 control first electrode 106.For example, when the potential difference between film 112 and first electrode 106 increases, film 112 can become closer first electrode 106, that is, and it is mobile towards first electrode 106, and between film 112 and first electrode 106 Capacitor correspondingly increases.Conversely, when the first driving assembly 110a reduces the potential difference between film 112 and first electrode 106, film 112 can become further away from first electrode 106, that is, and it is mobile towards second electrode 108, and between film 112 and first electrode 106 Capacitor accordingly decreases.Accordingly, first antenna list can be adjusted by the structure based on MEMS as described above is used The capacitor of first 100a.

It is moreover observed that first electrode 106 can preferably have sufficiently large size, so that first electrode 106 can Enough electric fields are provided to control the movement of film 112.For example, first electrode 106 has the first width W₁And first length L₁.In some embodiments, the first width W of first electrode 106₁Greater than the second width W of the first connection pad 114₂.In some realities It applies in example, the first length L of first electrode 106₁Greater than the second length L of the first connection pad 114₂.In some embodiments, first First length L of electrode 106₁Greater than the third width W of film 112₃.In addition, the first connection pad 114 preferably has sufficiently large ruler It is very little, steadily to maintain and fix film 112.In some embodiments, the second length L of the first connection pad 114₂Greater than film 112 Third width W₃.In addition, film 112 can be Chong Die with slit 116.In some embodiments, first distance D₁It is defined as the of film 112 The distance between side 112a and slit 116, second distance D₂It is defined as between second side 112b of film 112 and slit 116 Distance.Second side 112b is oppositely arranged with the first side 112a.In some embodiments, first distance D₁With second distance D₂ The range of ratio be about 0.1 to about 10, or about 0.5 to about 2.Moreover, it will be understood that although slit 116, which has, is greater than film 112 the 4th length L₄Third length L₃(for example, as shown in Figure 2 B), according to some other embodiments, the length of slit 116 It is smaller than the 4th length L of film 112₄.In other words, slit 116 can not protrude from the boundary of film 112.

In addition, as shown in Figure 2 B, the film 112 of first antenna unit 100a can further include an at least hole 120.Hole 120 can be as produced by the particular step in manufacturing method, this part will be in being described later.In some embodiments, hole 120 can be located at except the region of first electrode 106.In other words, the hole 120 of film 112 may be not Chong Die with first electrode 106.

Then, referring to figure 3., Fig. 3 is shown according to some embodiments of the invention, and the part of the antenna assembly 10 of Fig. 1 is put Big schematic diagram.It will hereinafter be indicated with the same or similar component above or layer with the same or similar label, multiple component Or material, manufacturing method and the function of layer with it is described previously same or similar, so part will not be described in great detail below.Fig. 3 Two pairs of antennas of antenna assembly 10 are painted to 100, first antenna to 100A and the second antenna to 100B, to chat line pair tomorrow and day The configuration and arrangement of line unit.First antenna 100B is arranged adjacent to the second antenna 100A.Specifically, first antenna pair 100A and the second antenna can connect 100B with different scanning line SL.In other words, first antenna is to 100A and the second antenna pair 100B can be located at not going together for array.First antenna is to the first antenna that 100A includes with first antenna unit 100a arranged in parallel Unit 100a and the second antenna element 100b.Second antenna is to the third that 100B includes with third antenna unit 100c arranged in parallel Antenna element 100c and the 4th antenna element 100d.Brought forward is stated, the second antenna element 100b, third antenna unit 100c and the 4th Antenna element 100d can have and the same or similar structure of first antenna unit 100a described in Fig. 2A.

As shown in figure 3, the film 112 of first antenna unit 100a can be along the first length direction E₁Extend, the second antenna element The film 112 of 100b can be along the second length direction E₂Extend.In some embodiments, the first length direction E₁With the second length direction E₂Between angle, θ₁Range be about 75 degree to about 105 degree, or about 85 degree to about 95 degree.

In addition, the film 112 of third antenna unit 100c is along third length direction E₃Extend.In some embodiments, third Length direction E₃With the first length direction E₁Between angle, θ₂The range of (not being painted) is about 0 degree to about 15 degree, or about 0 degree extremely About 5 degree.In some embodiments, third length direction E₃It substantially can be with the first length direction E₁In parallel.In other words, third day The film 112 of line unit 100c substantially can be parallel with the film 112 of first antenna unit 100a.Particularly, antenna element and antenna Correspondence is arranged with particular orientation, and making electromagnetic wave caused by antenna assembly 10 substantially can be circular polarization.In this way, can Improve signal quality provided by antenna assembly 10.In some embodiments, antenna assembly 10 can receive or transmit dextrorotation entelechy Change (right-hand circular polarization, RHCP) or left-hand circular polarization (left-hand circular Polarization, LHCP) signal.

In addition, antenna assembly 10 can further include be set to antenna to 100 side waveguide 122 (such as Fig. 4 A institute Show).Specifically, waveguide 122 may be disposed at 104 lower section of the second substrate.Film 122 may be disposed at first electrode 106 and waveguide 122 Between.Waveguide 122 can provide feedback wave (feed wave) for antenna assembly 10.Present wave can by 116 radiated electromagnetic wave of slit, and The direction of electromagnetic wave can be adjusted by the antenna element for being set to 116 top of slit.In some embodiments, by waveguide The 122 feedback waves provided can be along the 4th length direction E₄It advances.In some embodiments, third length direction E₃With the 4th length side To E₄Between angle, θ₃Range be about 30 degree to about 60 degree, or be about 40 degree to about 50 degree.In addition, slit 116 can be along the 5th Length direction E₅Extend.In some embodiments, the 5th length direction E₅With the 4th length direction E₄Between angle, θ₄Range It is about 30 degree to about 60 degree, or is about 40 degree to about 50 degree.In some embodiments, although not being illustrated in schema, third Length direction E₃With the 5th length direction E₅Between the range of angle be about 0 degree to about 15 degree.As shown in figure 3, third length side To E₃Not with the 5th length direction E₅In parallel.In other words, for antenna element, the length direction of the length direction of slit and film it Between angle range be about 0 degree to about 15 degree in the range of.

As shown in figure 3, first antenna unit 100a and the second antenna element 100b can respectively with the first driving assembly 110a And second driving assembly 110b be electrically connected.Similarly, third antenna unit 100c and the 4th antenna element 100d can respectively with Third driving assembly 110c and the 4th driving assembly 110d is electrically connected.More specifically, the first driving assembly 110a and second Driving assembly 110b can be electrically connected with the film 112 of the film 112 of first antenna unit 100a and the second antenna element 100b respectively. Third driving assembly 110c and the 4th driving assembly 110d can respectively with the film 112 and the 4th antenna list of third antenna unit 100c The film 112 of first 100d is electrically connected.As aforementioned, first antenna can be from different scan lines to 100B to 100A and the second antenna SL connection.In some embodiments, the first driving assembly 110a and third driving assembly 110c can be driven in order.Some In embodiment, the second driving assembly 110b and the 4th driving assembly 110d can be driven in order.

Then, A, Fig. 4 A are shown according to some embodiments of the invention referring to figure 4., along the line segment A-A's ' in Fig. 1 The diagrammatic cross-section of antenna assembly 10.In order to clearly illustrate the structure of antenna assembly 10, some components are omitted in figure, for example, Signal wire (scan line SL and data line DL) etc..As shown in Figure 4 A, antenna assembly 10 may include be set to the second substrate 104 one The waveguide 122 of side.In addition, second electrode 108 may be disposed at the other side of the second substrate 104.Waveguide 122 and second electrode 108 It may be disposed at the opposite side of the second substrate 104.As described above, first substrate 102 and the second substrate 104 can be used as antenna assembly 10 Head substrate and bottom substrate.First electrode 106 and second electrode 108 are respectively arranged at first substrate 102 and the second substrate On 104.First electrode 106 and second electrode 108 are positioned opposite to each other.In some embodiments, first electrode 106 and the second electricity It pole 108 can be by different voltage bias (biased).In some embodiments, first substrate 102 and the second substrate 104 can be respective Include glass, quartz, sapphire (sapphire), silicon (Si), germanium (Ge), polycarbonate (polycarbonate, PC), polyamides Imines (polyimide, PI), polyethylene terephthalate (polyethylene terephthalate, PET), rubber, glass Glass fiber, other high molecular materials, other suitable baseplate materials or combination above-mentioned, but not limited to this.In some embodiments In, the second substrate 104 can be formed by wafer.

In addition, antenna assembly 10 may include the film 112 being arranged across first electrode 106.Specifically, as shown in Figure 4 A, Film 112 can have the pendency Chong Die with first electrode 106 (overhang) structure.In addition, film 112 can be set to first substrate The first connection pad 114 contact on 102.First connection pad 114 can be by film 112 and the driving assembly being set on first substrate 102 (example Such as, the first driving assembly 110a and the second driving assembly 110b) it is electrically connected.In some embodiments, (first drives driving assembly Dynamic component 110a and the second driving assembly 110b) it may include an at least active matrix driving component, for example, thin film transistor (TFT) (TFT).In In some other embodiments, driving assembly (the first driving assembly 110a and the second driving assembly 110b) may include passive drive group Part, for example, driving assembly can be controlled by IC or microchip.

Furthermore antenna assembly 10 also may include the conductive terminal C being set between first substrate 102 and the second substrate 104, First substrate 102 and the second substrate 104 can be electrically connected by conductive terminal C.In some embodiments, conductive terminal C can be Signal is transmitted between one substrate 102 and the second substrate 104.For example, conductive terminal C can will believe caused by the first substrate 102 Number it is transmitted to the second substrate 104.Brought forward is stated, and conductive terminal C can be connected to data line DL2.

Conductive terminal C can be formed by conductive material.In some embodiments, the material of conductive terminal C may include copper, aluminium, Molybdenum, tungsten, gold, chromium, nickel, copper alloy, aluminium alloy, molybdenum alloy, tungsten alloy, billon, evanohm, nickel alloy, other suitable gold Belong to material or combination above-mentioned, but not limited to this.

In addition, antenna assembly 10 can further include the first insulating layer 124a being set on first substrate 102 and be set to Second insulating layer 124b on two electrodes 108.First insulating layer 124a may be disposed at 106 top of first electrode.In some implementations In example, the first insulating layer 124a can partially or even wholly expose the first connection pad 114, connect the first connection pad 114 electrically with film 112 It connects.

First insulating layer 124a and second insulating layer 124b can be formed by insulating materials.In some embodiments, first absolutely Edge layer 124a and second insulating layer 124b respectively may include organic material, inorganic material or combination above-mentioned, but not limited to this.Institute State organic compound, the isoamyl two that organic material may include acrylic acid (acrylic) or methacrylic acid (methacrylic) class Alkene (isoprene) compound, phenol-formaldehyde (phenol-formaldehyde) resin, benzocyclobutene (benzocyclobutene, BCB), Freon C318 (perfluorocyclobutane, PECB) or combination above-mentioned, but not It is limited to this.The inorganic material may include silicon nitride, silica or silicon oxynitride or combination above-mentioned, but not limited to this.

As shown in Figure 4 A, antenna assembly 10 more may include the interval being set between first substrate 102 and the second substrate 104 Component 126.Distance member 126 can be used for strengthening the structural strength of antenna assembly 10.In some embodiments, distance member 126 It can be along substantially perpendicular to the extension of the direction of first substrate 102 or the second substrate 104 (extending also that is, along Z-direction).Some In embodiment, distance member 126 can be multiple column structures arranged in parallel.In some other embodiments, distance member 126 There can be any other suitable shape.Furthermore distance member 126 may pass through the first insulating layer 124a and/or second insulating layer 124b, and contacted with first substrate 102 and/or second electrode 108.However, in some other embodiments, distance member 126 can be not passed through the first insulating layer 124a and second insulating layer 124b.In other words, distance member 126 can not with first substrate 102 And second electrode 108 contacts.

In addition, distance member 126 can be formed by insulating materials or conductive material.In some embodiments, distance member 126 Material may include copper, silver, gold, copper alloy, silver alloy, billon or combination above-mentioned, but not limited to this.In some embodiments In, the material of distance member 126 may include polyethylene terephthalate (polyethylene terephthalate, PET), Polyethylene (polyethylene, PE), polyether sulfone (polyethersulfone, PES), polycarbonate (polycarbonate, PC), polymethyl methacrylate (polymethylmethacrylate, PMMA), glass, other suitable materials or above-mentioned Combination, but not limited to this.

As shown in Figure 4 A, according to some embodiments, conductive terminal C can be extraly by the second connection pad 128 and first substrate 102 connections.In some embodiments, the second connection pad 128 can be partially or even wholly by the first insulating layer 124a exposure.This Outside, the second connection pad 128 can be formed by conductive material, and the conductive material and aforesaid conductive material are same or similar.

In addition, antenna assembly 10 also can further include the packing material 130 being set to around film 112.In some implementations In example, packing material 130 may be disposed in antenna element and contact with film 112.In some embodiments, packing material 130 can It is partially or even wholly filled between first substrate 102 and the second substrate 104 in defined space.Packing material 130 can be Film 112 provides mechanical lubrication to reduce abrasion, and therefore, packing material 130 may be provided at what film 112 was connect with the first connection pad 114 Near position.Specifically, packing material 130 can be applied on film 112, so that film 112 less likely is easy to rupture because of vibration. In some embodiments, packing material 130 can be formed by lubricant.In some embodiments, the example of packing material 130 can Include alkane, polyglycols, polyethylene glycol, polyethers hydrocarbon, lipid, silicide, fluoride, other suitable materials or above-mentioned group It closes, but not limited to this.

In addition, in some embodiments, first substrate 102 can be filled with air, nitrogen or other suitable inert gases With the space between the second substrate 104.It, can will be between first substrate 102 and the second substrate 104 alternatively, according to some embodiments Space vacuumize.Such configuration can prevent the metallic material corrosion being set in antenna assembly 10.

Then, B, Fig. 4 B are shown according to some embodiments of the invention referring to figure 4., and the part of the region R in Fig. 4 A is put Big schematic diagram.As shown in Figure 4 B, the thickness of film 112 can be non-uniform.In some embodiments, film 112 substantially corresponds to It is relatively thin in the middle section of first electrode 106.Specifically, film 112 may include first part 112c and second part 112p.The A part of 112c is than second part 112p further from the first connection pad 114, and first part 112c is Chong Die with first electrode 106.In In some embodiments, first part 112c is partially or even wholly Chong Die with first electrode 106.In some embodiments, film 112 First part 112c have first thickness T₁, the second part 112p of film 112 is with second thickness T₂.In some embodiments, Second thickness T₂Greater than first thickness T₁.In addition, in some embodiments, the first connection pad 114 has third thickness T₃.Some In embodiment, third thickness T₃Greater than first thickness T₁.In some embodiments, third thickness T₃Greater than second thickness T₂.Especially Ground, the thickness of film 112 in middle section can be it is relatively thin, allow film 112 to be easier or more effectively vibrate.In addition, the One connection pad 114 has certain thickness, so that it can have stable mechanical strength to maintain film 112.

Brought forward is stated, and the first connection pad 114 can have the second width W₂.In some embodiments, third distance d₃It is defined as film 112 and first connection pad 114 the distance between edge.In some embodiments, third distance d₃Greater than zero and it is less than or equal to Second width W₂0.9 times of (0 < d₃≤0.9*W₂).By such configuration, film 112 will not be too near to the side of the first connection pad 114 Edge so as to prevent static discharge (ESD) or corona discharge (corona discharge), or can provide and make a variation for manufacture Tolerance.

Then, A~5C, 5A and 5B figure are shown according to some embodiments of the invention referring to figure 5., film and driving assembly Circuit diagram.As shown in 5A and 5B figure, antenna assembly 10 can be driven by complementary metal oxide semiconductor (CMOS) structure. Furthermore in some embodiments, as shown in Figure 5A, electrostatic discharge circuit (for example, diode) and the end ME of film 112 electrically connect It connects, with protective film 112 from static discharge (ESD).It should be understood that the circuit design of ESD diode is not limited to institute in figure The circuit design shown.In some embodiments, driving circuit may include more than one ESD diode.In some embodiments, ESD diode can be electrically connected with the first connection pad 114 of antenna assembly 10.In addition, complementary metal oxide semiconductor structure It can be formed by low temperature polycrystalline silicon, but not limited to this.As shown in Figure 5 C, antenna assembly 10 can be tied by thin film transistor (TFT) (TFT) Structure is driven.Thin-film transistor structure can be upper grid thin film transistor (TFT) or lower grid thin film transistor (TFT).In addition, another film Transistor can be electrically connected with the end ME of film 112, to reset the voltage of film 112.It should be noted that in Fig. 5 A~5C, Vref expression may be set to the reference voltage of ground voltage or default voltage, and Vreset indicates to may be set to the resetting electricity of default voltage Pressure.Vref and Vreset may be set to identical value or different value.

Then, Fig. 6 A~6F is please referred to, Fig. 6 A~6F is shown according to some embodiments of the invention, in manufacturing method Between the stage be formed by the partial cutaway schematic view of antenna assembly 10.Specifically, Fig. 6 A~6F is painted the top of antenna assembly 10 The forming step of portion's electrode 106, the first connection pad 114, film 112 etc..It should be understood that in some embodiments, it can be traditional thread binding in day Set 10 manufacturing method carry out before, carry out in and/or carry out after additional operating procedure is provided.In some embodiments, described Some operations may regard be substituted or delete.In some embodiments, operation/step sequence can be interchangeable.

Fig. 6 A is please referred to, first electrode 106 and the first connection pad 114 can be formed on first substrate 102.In some embodiments In, first electrode 106 and the first connection pad 114 can be formed in identical step or different steps.In some embodiments, may be used By chemical vapor deposition process, physical vapour deposition (PVD) processing procedure, electroplating process, electroless plating processing procedure, other suitable processing procedures or preceding The combination stated forms first electrode 106 and the first connection pad 114.Furthermore it can be by patterning process by first electrode 106 and first Connection pad 114 patterns.The patterning process may include light lithographic process or screen painting processing procedure.The smooth lithographic process can wrap Develop containing light blockage coating (for example, rotary coating), soft baking, hard baking, shielding alignment, exposure, postexposure bake, photoresist, is clear It washes and dries.The etch process may include dry ecthing procedure or wet etching processing procedure.

Then, Fig. 6 B is please referred to, the first insulating layer 124a can be formed on first electrode 106 and the first connection pad 114.In detail For thin, first electrode 106 can be completely covered in the first insulating layer 124a.In some embodiments, the first insulating layer 124a can be with Conformably (conformally) is formed on first electrode 106 and the first connection pad 114.In addition, in some embodiments, the One insulating layer 124a can partly cover the first connection pad 114.In some embodiments, covering first electrode 106 and the can be formed Then the insulating materials of both one connection pads 114 removes the insulating materials of a part, to form the first insulating layer 124a.Some In embodiment, the first insulating layer 124a can have multilayered structure.

It in some embodiments, can be by chemical vapor deposition process, rotary coating process, other suitable processing procedures or preceding The combination stated forms the first insulating layer 124a.In addition, can be by using patterning process to pattern the first insulating layer 124a.

Then, Fig. 6 C is please referred to, sacrificial layer 132 can be formed on the first insulating layer 124a.In some embodiments, it sacrifices Layer 132 can also cover a part of the first connection pad 114 and contact with the first connection pad 114.In some other embodiments, sacrificial layer 132 can cover a part of the first connection pad 114 but not contact with the first connection pad 114, for example, the edge of sacrificial layer 132 and first It the edge of insulating layer 124a can substantial alignment.In some embodiments, sacrificial layer 132 can connect with the first connection pad 114 at one end Touching, and do not contacted with the first connection pad 114 in the other end.Sacrificial layer 132 is formed as facilitating the profile of formed film 112, and Film 112 forms the rear of completion and is removed.In some embodiments, sacrificial layer 132, which has, corresponds to or covers first electrode 106 Protrusion.

In some embodiments, sacrificial layer 132 may include insulating materials, for example, silica (SiOx), silicon nitride (SiNx), silicon oxynitride (SiON), aluminium oxide (AlOx), titanium oxide (TiOx) or combination above-mentioned, but not limited to this.Some In other embodiments, sacrificial layer 132 may include high molecular material, but not limited to this.It, can be by addition, in some embodiments Sacrificial layer 132 is formed using chemical vapor deposition process, rotary coating process, other suitable processing procedures or combination above-mentioned.This It outside, can be by using patterning process to pattern sacrificial layer 132.

Then, Fig. 6 D is please referred to, film 112 can be formed on sacrificial layer 132.Film 112 can cover sacrificial layer 132 and first The two sides of electrode 106 are contacted with the first connection pad 114.In other words, film 112 can be arranged across first electrode 106.In some embodiments In, film 112 can be contacted with the first insulating layer 124a.In some embodiments, film 112 can not connect with the first insulating layer 124a Touching, and sacrificial layer 132 may be disposed between film 112 and the first insulating layer 124a.In some embodiments, due to sacrificial layer 132 Profile, film 112 correspond to first electrode 106 region can be relatively thin.

In some embodiments, can by chemical vapor deposition process, physical vapour deposition (PVD) processing procedure, electroplating process, without electricity Plating processing procedure, other suitable processing procedures or combination above-mentioned form film 112.It can be by using patterning process to pattern film 112. In some embodiments, film 112 has fillet (round corner) in its areas adjacent connecting with the first connection pad 114.

Then, Fig. 6 E is please referred to, removes the part of film 112 to form hole 120, hole 120 can expose sacrificial layer 132 A part.Brought forward is stated, and hole 120 can be located at except the region Chong Die with first electrode 106.In other words, the hole 120 of film 112 It is not Chong Die with first electrode 106.Film 112 may include hole 120, be removed sacrificial layer 132 can easily.Furthermore as schemed Shown in 6E, the top of hole 120 can be greater than the bottom of hole 120.In some embodiments, the range of the diameter of hole 120 is About 1 μm to about 100 μm.In some embodiments, hole 120 can be formed by patterning process.

Then, Fig. 6 F is please referred to, sacrificial layer 132 can be removed after the formation of hole 120.Remove sacrificial layer 132 it Afterwards, film 112 can have the pendency Chong Die with first electrode 106 (overhang) structure.It in some embodiments, can be by using Etch process removes sacrificial layer 132.Etch process may include dry ecthing procedure or wet etching processing procedure.In some embodiments, it loses The etchant for scribing journey may pass through hole 120 and remove sacrificial layer 132.

More specifically, in sacrificial layer 132 by silica (SiOx), silicon nitride (SiNx), silicon oxynitride (SiON), oxidation Aluminium (AlOx), titanium oxide (TiOx) or combination above-mentioned are formed by embodiment, and etchant may include hydrofluoric acid (HF), NH₄H Or combination above-mentioned, but not limited to this.In the embodiment that sacrificial layer 132 is formed by high molecular material, etchant may include KOH Or other alkaline solutions, but not limited to this.

Then, Fig. 7 A~7D is please referred to, Fig. 7 A~7D is shown according to some embodiments of the invention, the portion of antenna assembly 10 Divide diagrammatic cross-section.Specifically, Fig. 7 A~7D is painted the different configurations of film 112.As shown in Figure 7 A, in some embodiments, Film 112 can be single layer structure.As aforementioned, film 112 can be formed by conductive material.In some embodiments, film 112 can by with it is preceding The same or similar person of metal material is stated to be formed.

Then, Fig. 7 B is please referred to, film 112 can be multilayered structure.In some other embodiments, film 112 can by two layers with On structure formed.As shown in Figure 7 B, film 112 may include first layer 112 ' and the second layer 112 ".First layer 112 ' can cover In on the second layer 112 ".In some embodiments, first layer 112 ' can be conformably set on the second layer 112 ".In addition, one In a little embodiments, first layer 112 ' and the second layer 112 " are contacted with the first connection pad 114.

In some embodiments, first layer 112 ' and the second layer 112 " can be formed by conductive material and insulating materials respectively. In some embodiments, first layer 112 ' and the second layer 112 " can be formed by insulating materials and conductive material respectively.In some realities It applies in example, the conductive material can be same or similar with conductive material above-mentioned.In some embodiments, the insulating materials can It is same or similar with insulating materials above-mentioned.

In some embodiments, a part of film 112 can have a single layer structure, and another part of film 112 can have it is more Layer structure.Fig. 7 C is please referred to, in some embodiments, part of the film 112 near the position that it connect with the first connection pad 114 can It is formed by single layer (that is, first layer 112 '), and other parts can be formed by two layers.In other words, the second layer 112 " does not connect with first Pad 114 contacts.In some embodiments, the second layer 112 " can be partially embedded into first layer 112 '.On the other hand, figure is please referred to 7D, film 112 is in the part close to its position connecting with the first connection pad 114 by two layers (that is, first layer 112 ' and the second layer 112 ") it is formed, and other parts are formed by single layer.In such embodiment, first layer 112 ' and the second layer 112 " are with first Connection pad 114 contacts.

In conclusion the present invention provides a kind of antenna assembly, antenna assembly includes the antenna using mems structure Unit.In addition, antenna element arranges in a specific way, so that electromagnetic wave caused by antenna assembly substantially can be circular polarization , therefore, signal quality provided by antenna assembly can be improved.By such configuration, antenna assembly also can be more energy saving.

Although the present invention is disclosed as above with preferred embodiment, however, it is not to limit the invention, any this field skill Art personnel, without departing from the spirit and scope of the present invention, when can make a little modification and perfect therefore of the invention protection model It encloses to work as and subject to the definition of the claims.