阅读说明：本技术 振动感测装置感测振动的方法以及振动感测装置 (The method and vibration sensing device of vibration sensing device sense vibrations ) 是由 端木鲁玉 付博 李欣亮 方华斌 于 2019-08-22 设计创作，主要内容包括：本发明公开了一种振动感测装置感测振动的方法以及振动感测装置。该方法振动感测装置包括：壳体,在壳体的内部形成腔体；压力产生装置,所述压力产生装置包括弹性元件和质量元件,所述弹性元件设置在所述腔体内；所述质量元件通过所述弹性元件悬置在所述腔体内,并能随所述弹性元件一起在所述腔体内移动,所述质量元件和所述弹性元件将所述腔体分隔为密闭的第一腔室和第二腔室；以及压力感测装置,压力感测装置分别与第一腔室和第二腔室连通；方法包括：通过压力感测装置获取第一腔室和第二腔室之间的压强差；以及通过压强差计算压力感测装置所在位置的振动状态。(The invention discloses the methods and vibration sensing device of a kind of vibration sensing device sense vibrations.This method vibration sensing device includes: shell, forms cavity in the inside of shell；Pressure generator, the Pressure generator include elastic element and mass elements, and the elastic element setting is in the cavity；The mass elements are suspended in the cavity by the elastic element, and can be moved in the cavity with the elastic element, and the cavity is divided into closed first chamber and second chamber by the mass elements and the elastic element；And pressure-sensing device, pressure-sensing device are connected to first chamber and second chamber respectively；Method includes: the pressure difference obtained between first chamber and second chamber by pressure-sensing device；And the vibrational state of pressure-sensing device position is calculated by pressure difference.)

1. a kind of method of vibration sensing device sense vibrations, it is characterised in that: the vibration sensing device includes:

Shell forms cavity in the inside of the shell；

Pressure generator, the Pressure generator include elastic element and mass elements, and the elastic element is arranged in institute It states in cavity；The mass elements are suspended in the cavity by the elastic element, and can be with the elastic element It moves in the cavity, the cavity is divided into closed first chamber and by the mass elements and the elastic element Two chambers；And

Pressure-sensing device, the pressure-sensing device are connected to the first chamber and the second chamber respectively；

The described method includes: obtaining the pressure between the first chamber and the second chamber by the pressure-sensing device Difference；And

The vibrational state of the pressure-sensing device position is calculated by the pressure difference.

2. according to the method described in claim 1, it is characterized by: the mass elements include the pressure-sensing device, institute Pressure-sensing device is stated to connect with the elastic element.

3. according to the method described in claim 2, it is characterized by: the elastic element includes the interconnecting piece for being located at middle part, encloses Around the elastic portion of interconnecting piece setting and around the edge part of elastic portion setting, the edge part is connect with the shell, the company Socket part is connect with the mass elements.

4. according to the method described in claim 3, it is characterized by: the mass elements further include substrate, the pressure-sensing Device is fixed on the substrate, and the substrate is connect with the interconnecting piece, is provided with through-hole, the pressure on the substrate The side of the detecting part of power sensing device is exposed to first chamber, and the other side of the detecting part passes through the through-hole and described the Two chambers；Or

The side of the detecting part of the pressure-sensing device is exposed to second chamber, and the other side of the detecting part passes through described logical Hole is connected to the first chamber.

5. according to the method described in claim 2, it is characterized by: the elastic element include support construction and with the support The flexible sheet of structure connection, one end of the support construction are connect with the mass elements, and the other end is interior with the shell Wall connection, the flexible sheet are arranged around the mass elements.

6. according to the method described in claim 5, it is characterized by: the pressure-sensing device is tied by setting in the support Conductor on structure is connect with external circuit.

7. a kind of vibration sensing device, it is characterised in that: include:

Shell forms cavity in the inside of the shell；

Pressure generator, the Pressure generator include elastic element and mass elements, and the elastic element is arranged in institute It states in cavity；The mass elements are suspended in the cavity by the elastic element, and can be with the elastic element It moves in the cavity, the cavity is divided into closed first chamber and by the mass elements and the elastic element Two chambers；And

Pressure-sensing device, the pressure-sensing device are connected to the first chamber and the second chamber respectively, the pressure Power sensing device is configurable for sensing the pressure difference between the first chamber and the second chamber.

8. vibration sensing device according to claim 7, it is characterised in that: the mass elements include the pressure-sensing Device, the pressure-sensing device are connect with the elastic element.

9. vibration sensing device according to claim 8, it is characterised in that: the elastic element includes the company positioned at middle part Socket part, around the elastic portion of interconnecting piece setting and around the edge part of elastic portion setting, the edge part is connect with the shell, The interconnecting piece is connect with the mass elements.

10. vibration sensing device according to claim 8, it is characterised in that: the mass elements further include substrate, described Pressure-sensing device is fixed on the substrate, and the substrate is connect with the interconnecting piece, is provided on the substrate logical Hole, the side of the detecting part of the pressure-sensing device are exposed to first chamber, and the other side of the detecting part passes through described logical Hole is connected to the second chamber；Or

The side of the detecting part of the pressure-sensing device is exposed to second chamber, and the other side of the detecting part passes through described logical Hole is connected to the first chamber.

11. vibration sensing device according to claim 8, it is characterised in that: the elastic element include support construction and The flexible sheet connecting with the support construction, one end of the support construction are connect with the mass elements, the other end and institute The inner wall connection of shell is stated, the flexible sheet is arranged around the mass elements.

12. vibration sensing device according to claim 11, it is characterised in that: the pressure-sensing device is existed by setting Conductor in the support construction is connect with external circuit.

13. vibration sensing device according to claim 10, it is characterised in that: the mass elements further include signal amplification Device, the signal amplifier are set on the substrate, and the signal amplifier is connect with the pressure-sensing device.

14. vibration sensing device according to claim 7, it is characterised in that: the elastic element include flexible sheet or Person's damping glue.

15. vibration sensing device according to claim 7, it is characterised in that: the shell includes setting around the substrate The side wall set and the bottom opposite with the substrate, are provided with pad on the outside of the bottom, and the pad passes through embedded Conductor in the side wall is connect with the pressure-sensing device.

16. vibration sensing device according to claim 7, it is characterised in that: it further include annular brace portion, the annular branch The outside of the elastic element is arranged in support part, and connect with the elastic element, and the shell includes upper casing and lower casing, institute It states upper casing and the lower casing is sealedly connected on the opposite two sides of the annular brace portion, the upper casing and the mass-element respectively The first chamber is formed between part, and the second chamber is formed between the lower casing and the mass elements.

Technical field

The present invention relates to vibration-sensing technical fields, more particularly, to a kind of side of vibration sensing device sense vibrations Method and vibration sensing device.

Background technique

Existing vibration sensing device generally includes shell and is arranged in the intracorporal mass block of shell.Mass block is outstanding by vibrating diaphragm It sets in the inside of shell.Shell has open end.The base plate seals of pressure-sensing device are connected to open end.Substrate and shell The opposite side of body is provided with MEMS chip, asic chip, further includes the shell being arranged in outside MEMS chip and asic chip.Base Plate has intercommunicating pore.MEMS chip is connected to by intercommunicating pore with the inner cavity of shell.

At work, vibration sensing device is fixed in equipment to be measured.In equipment work, vibration is transmitted to shell On body, the vibration of shell sounding is driven.Since mass block has the quality of setting, and vibrating diaphragm has elasticity, therefore mass block can phase Shell is vibrated.The vibration of the mass block is so that the volume of the chamber of vibrating diaphragm two sides changes.Since inner cavity is close It closes, therefore will lead to the indoor volume sounding variation of chamber, the indoor pressure of chamber changes therewith.MEMS chip senses pressure Variation can generate corresponding electric signal.The electric signal is transmitted to external circuit after asic chip amplifies.External circuit acquisition The electric signal.

However, existing vibration sensing device is only capable of the variation of the pressure of one chamber of sensing, sensing sensitivity is low.

Accordingly, it is desirable to provide a kind of new technical solution, to solve the above technical problems.

Summary of the invention

It is an object of the present invention to provide the new solutions of a kind of method of vibration sensing device sense vibrations.

According to an aspect of the invention, there is provided a kind of method of vibration sensing device sense vibrations.Described in this method Vibration sensing device includes: shell, forms cavity in the inside of the shell；Pressure generator, the Pressure generator Including elastic element and mass elements, the elastic element setting is in the cavity；The mass elements pass through the elasticity Element suspends in the cavity, and can move in the cavity with the elastic element, the mass elements and institute It states elastic element and the cavity is divided into closed first chamber and second chamber；And pressure-sensing device, the pressure Sensing device is connected to the first chamber and the second chamber respectively；The described method includes: being filled by the pressure-sensing Set the pressure difference obtained between the first chamber and the second chamber；And the feeling of stress is calculated by the pressure difference Survey the vibrational state of device position.

Optionally, the mass elements include the pressure-sensing device, the pressure-sensing device and the elasticity member Part connection.

Optionally, the elastic element includes the interconnecting piece positioned at middle part, the elastic portion around interconnecting piece setting and surrounds The edge part of elastic portion setting, the edge part are connect with the shell, and the interconnecting piece is connect with the mass elements.

Optionally, the mass elements further include substrate, and the pressure-sensing device is fixed on the substrate, described Substrate is connect with the interconnecting piece, is provided with through-hole on the substrate, and the side of the detecting part of the pressure-sensing device is sudden and violent It is exposed to first chamber, the other side of the detecting part is connected to by the through-hole with the second chamber；Or

The side of the detecting part of the pressure-sensing device is exposed to second chamber, and the other side of the detecting part passes through institute Through-hole is stated to be connected to the first chamber.

Optionally, the elastic element includes support construction and the flexible sheet that connect with the support construction, the branch One end of support structure is connect with the mass elements, and the other end is connect with the inner wall of the shell, and the flexible sheet surrounds institute State mass elements setting.

Optionally, the pressure-sensing device passes through the conductor being arranged in the support construction and connect with external circuit.

A kind of vibration sensing device another aspect of the present disclosure provides.The device includes: shell, described The inside of shell forms cavity；Pressure generator, the Pressure generator include elastic element and mass elements, the bullet Property element setting in the cavity；The mass elements are suspended in the cavity by the elastic element, and can be with institute It states elastic element to move in the cavity together, the cavity is divided into closed by the mass elements and the elastic element First chamber and second chamber；And pressure-sensing device, the pressure-sensing device respectively with the first chamber and institute State second chamber connection；And pressure-sensing device, the pressure-sensing device respectively with the first chamber and described second Chamber, the pressure-sensing device are configurable for sensing the pressure between the first chamber and the second chamber Difference.

Optionally, the mass elements include the pressure-sensing device, the pressure-sensing device and the elasticity member Part connection.

Optionally, the elastic element includes the interconnecting piece positioned at middle part, around interconnecting piece setting elastic portion and surround The edge part of elastic portion setting, the edge part are connect with the shell, and the interconnecting piece is connect with the mass elements.

Optionally, the mass elements further include substrate, and the pressure-sensing device is fixed on the substrate, described Substrate is connect with the interconnecting piece, is provided with through-hole on the substrate, and the side of the detecting part of the pressure-sensing device is sudden and violent It is exposed to first chamber, the other side of the detecting part is connected to by through-hole with the second chamber；Or

The side of the detecting part of the pressure-sensing device is exposed to second chamber, and the other side of the detecting part passes through logical Hole is connected to the first chamber.

Optionally, the elastic element includes support construction and the flexible sheet that connect with the support construction, the branch One end of support structure is connect with the mass elements, and the other end is connect with the inner wall of the shell, and the flexible sheet surrounds institute State mass elements setting.

Optionally, the pressure-sensing device passes through the conductor being arranged in the support construction and connect with external circuit.

Optionally, the mass elements further include signal amplifier, and the signal amplifier is set on the substrate, The signal amplifier is connect with the pressure-sensing device.

Optionally, the elastic element includes flexible sheet or damping glue.

Optionally, the shell includes the side wall around substrate setting and the bottom opposite with the substrate, In It is provided with pad on the outside of the bottom, the pad passes through the conductor and the pressure-sensing device that are embedded in the side wall Connection.

It optionally, further include annular brace portion, the annular brace portion is arranged in the outside of the elastic element, and with The elastic element connection, the shell include upper casing and lower casing, and the upper casing and the lower casing are sealedly connected on described respectively The opposite two sides of annular brace portion, form the first chamber between the upper casing and the mass elements, the lower casing with The second chamber is formed between the mass elements.

It was found by the inventors of the present invention that in the prior art, feeling of stress only is arranged in first chamber or second chamber Device is surveyed, senses the pressure change of a chamber only to detect the vibrational state of examined object.In the embodiments of the present disclosure, by It is shifting in the volume of first chamber and second chamber, therefore the pressure difference of two chambers is compared to the pressure of a chamber Variation is big, therefore the sensitivity of the method for sensing sense vibrations is higher.

By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its Advantage will become apparent.

Detailed description of the invention

It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even With its explanation together principle for explaining the present invention.

Fig. 1 is the schematic diagram according to the vibration sensing device of one embodiment of the disclosure.

Fig. 2 is the schematic diagram according to the vibrational structure of one embodiment of the disclosure.

Fig. 3 is the structural schematic diagram according to the vibration sensing device of one embodiment of the disclosure.

Fig. 4 is the structural schematic diagram according to another vibration sensing device of one embodiment of the disclosure.

Description of symbols:

11: sense film；12: substrate；13: back chamber；14: vibrating diaphragm；15: first chamber；16: second chamber；17: substrate；18: Support construction；19: conductor；20:ASIC chip；21: via hole；22: pad；23: through-hole；24: damping glue；25: annular brace portion； 26: shell；26a: upper casing；26b: lower casing.

Specific embodiment

Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally The range of invention.

Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention And its application or any restrictions used.

Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable In the case of, the technology, method and apparatus should be considered as part of specification.

It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without It is as limitation.Therefore, other examples of exemplary embodiment can have different values.

It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.

According to one embodiment of the disclosure, a kind of method of vibration sensing device sense vibrations is provided.The vibration sense Surveying device is bone vocal print sensing device, environment sensing device etc..As shown in Figure 1, vibration sensing device includes: shell 26, pressure Generation device and pressure-sensing device.

Cavity is formed in the inside of shell 26.For example, the material of shell 26 is metal, plastics or pcb board.Shell 26 Shape is cylindric, cuboid etc..

Pressure generator includes elastic element and mass elements.Elastic element is arranged in the cavity.Elastic element is used for Elastic-restoring force is provided for mass elements.For example, elastic element include interconnecting piece, around interconnecting piece setting elastic portion and surround The edge part of vibration section setting.Elastic deformation can occur for elastic portion, to provide elastic-restoring force.Edge part and shell 26 Inner wall connection.

Mass elements are suspended in the cavity by elastic element, and can be moved in the cavity with elastic element.For example, Mass elements are connect with interconnecting piece.Mass elements and elastic element separate the cavity into closed first chamber 15 and second chamber 16.First chamber 15 and second chamber 16 have the volume of setting.The gas of sealing predetermined pressure in two chambers.Gas is sky Gas, nitrogen, inert gas etc..

Pressure-sensing device is connected to first chamber 15 and second chamber 16 respectively.Pressure-sensing device is for sensing first The pressure difference of chamber 15 and second chamber 16.For example, pressure-sensing device is electrodynamic transducers, piezoelectric transducer, vortex Formula sensor, inductance type transducer, capacitance type sensor etc..

For example, pressure-sensing device is two, the pressure of two chambers is sensed respectively, and by the calculating of processing unit, Obtain the pressure difference of two chambers.

It is also possible that pressure-sensing device is one, and it is exposed to first chamber 15 and second chamber 16.Pressure-sensing Device is capacitance type sensor, which can directly sense the pressure difference of two chambers.

This method comprises: obtaining the pressure difference between first chamber 15 and second chamber 16 by pressure-sensing device；With And

The vibrational state of pressure-sensing device position is calculated by pressure difference.

When in use, which is installed in examined object, for example, the pass in the joint of people, robot Section etc..The vibration of examined object drives shell 26 to vibrate, due to the inertia of mass elements and the elastic recovery of elastic element The collective effect of power, therefore the opposite shell 26 of mass elements meeting vibrates.The vibration of mass elements and elastic element is so that first The volume of chamber 15 and second chamber 16 changes, since two chambers are all closed chambers, therefore first chamber 15 and The pressure of gas in two chambers 16 can change.

In this example embodiment, the pressure difference of pressure-sensing device sensing first chamber 15 and second chamber 16, and by pressure difference Be converted to electric signal, such as voltage signal, current signal or capacitance signal etc..Electric signal is to be detected by calculating to obtain The vibrational state of object.For example, amplitude size, vibration frequency etc..

The inventors found that in the prior art, pressure only is arranged in first chamber 15 or second chamber 16 Sensing device senses the pressure change of a chamber only to detect the vibrational state of examined object.In the embodiments of the present disclosure, Since the volume of first chamber 15 and second chamber 16 is shifting, therefore compared to one chamber of the pressure difference of two chambers Pressure change it is big, therefore the sensitivity of the method for sensing sense vibrations is higher.

In one example, as shown in Figure 3-4, mass elements include pressure-sensing device.Pressure-sensing device and elasticity Element connection.For example, pressure-sensing device is MEMS chip.MEMS chip includes substrate 12 and sense film 11.During substrate 12 is Hollow structure.Sense film 11 is piezoelectric element, capacity cell, pressure drag component etc..One end of substrate 12 is arranged in sense film 11, and covers Lid hollow structure.Hollow structure forms back chamber 13.The other end of substrate 12 is connect with elastic element.Substrate 12 is connected to vibrating diaphragm 14 Interconnecting piece.Edge part is connect with the inner wall of shell 26.Sense film 11 is connected by metal wire with external circuit.

In this example embodiment, pressure-sensing device itself has the quality of setting, by the quality of itself as mass-element Part, without other mass elements are arranged, this makes the structure of vibration sensing device simpler.

In other examples, mass elements are also possible to the element being separately provided.

The usual very little of the volume of pressure-sensing device, connect with vibrating diaphragm 14 it is relatively difficult, and substrate 12 be usually hard Material is not easy to connect with vibrating diaphragm 14.In one example, mass elements further include substrate 17.For example, substrate 17 is pcb board. Pressure-sensing device is fixed on substrate 17.For example, MEMS chip is welded on substrate 17.MEMS chip by metal wire with Circuit connection on pcb board.

As described in Figure 2, substrate 17 is connect with interconnecting piece.Through-hole 23 is provided on substrate 17.Through-hole 23 is circular hole, square hole Deng.The side of the detecting part (for example, sense film 11) of pressure-sensing device is exposed to first chamber 15, and the other side of detecting part is logical Through-hole 23 is crossed to be connected to second chamber 16；Or

The side of the detecting part (for example, sense film 11) of pressure-sensing device is exposed to second chamber 16, detecting part it is another Side is connected to by through-hole 23 with first chamber 15.

In this example embodiment, substrate 17 has bigger connection area compared with pressure-sensing device (such as MEMS chip). For example, directly substrate 17 is bonded on vibrating diaphragm 14 by binder.

In addition, substrate 17 increases the quality of mass elements, under identical vibration, the amplitude of mass elements is bigger, this makes The sensitivity of vibration sensing device is higher.

In addition, the difficulty that through-hole 23 is opened up on substrate 17 is small, it is easy to process.

In this example embodiment, vibrating diaphragm 14 and mass elements body vibration, vibration are balanced.

In other examples, it is also possible to the vibration of the generation lack of balance of vibrating diaphragm 14 and mass elements.For example, such as Fig. 3-4 Shown, elastic element includes support construction 18 and the flexible sheet that connect with support construction 18.One end of support construction 18 and matter Element connection is measured, the other end is connect with the inner wall of shell 26.For example, support construction 18 plays substrate 17, pressure-sensing device To the effect of support.Flexible sheet is arranged around mass elements.For example, the material of support construction 18 is plastics, metal.Elastic membrane Piece is film-form, vibrating diaphragm 14 as escribed above.

In this example embodiment, mass elements are that fulcrum is vibrated with support construction 18.Mass elements are apart from support construction 18 Distal end amplitude it is maximum, proximal end amplitude minimum connect with support construction 18.In this setup, pressure-sensing device It can equally play the role of sensing the pressure difference of two chambers.

Support construction 18 has bigger structural strength and support force compared to vibrating diaphragm 14, can effectively improve vibration sense Survey the service life of device.

In one example, as shown in Figure 3-4, pressure-sensing device by setting conductor 19 on the supporting structure 18 with External circuit connection.For example, support construction 18 is plastic material, and it is internal to form through hole, conductor 19 is set in through hole. The metal wire of pressure-sensing device is directly connect with conductor 19；Or it is connect indirectly with conductor by other equipment.

In one example, as shown in Figure 3-4, mass elements further include signal amplifier.Signal amplifier is arranged on On substrate 17.Signal amplifier is connect with pressure-sensing device.For example, signal amplifier is asic chip 20.Asic chip 20 It is integrated on substrate 17.MEMS chip is connect by metal wire with asic chip 20.Asic chip 20 passes through metal wire and substrate 17 connections.Substrate 17 is connected by the conductor 19 in support construction 18 with external circuit.In this example embodiment, signal amplifier, MEMS chip and substrate 17 are together as mass elements, this makes mass elements have bigger quality, vibration sensing device Sensitivity is higher.

For example, MEMS chip, asic chip 20 are located at 16 side of 15 side of first chamber or second chamber, this field skill Art personnel can be configured according to actual needs.

In one example, as shown in figure 4, elastic element is damping glue 24.For example, damping glue 24 includes silica gel, rubber Deng.Damping glue 24 has elasticity, is capable of providing elastic-restoring force.Damping glue 24 can also play the role of bonding, for example, solidifying Before, the side of substrate 17 and the side wall of shell 26 are bonded together by damping glue 24.Then, using heating, UV irradiation etc. Mode solidifies damping glue 24.Damping glue 24 after solidification obtains structural strength and elastic deformability.

In addition, this mode becomes easy the assembling of mass elements.

In one example, as shown in Figure 3-4, shell 26 include around substrate 17 be arranged side wall and with 17 phase of substrate Pair bottom.Pad 22 is provided on the outside of bottom.Pad 22 is filled by the conductor 19 and pressure-sensing being embedded in side wall Set connection.For example, forming via hole 21, i.e. plated through-hole in the side wall of shell 26.There is conductor 19 in via hole 21.Pad 22 is set It sets in the outside of bottom wall.Pad 22 is connect with the conductor in via hole 21.Via hole 21 is connect with the conductor 19 in support construction 18.In In use, directly pad 22 and external circuit are welded.

In one example, as in Figure 2-4, vibration sensing device further includes annular brace portion 25.Annular brace portion 25 For hollow structure.The outside of elastic element is arranged in annular brace portion 25, and connect with elastic element.Elastic element and quality Element is located in hollow structure.Annular brace portion 25, elastic element and mass elements constitute flat vibration component together.

As shown in Figure 3-4, shell 26 includes upper casing 26a and lower casing 26b.Upper casing 26a and lower casing 26b are sealedly connected on respectively The opposite two sides of annular brace portion 25.First chamber 15, lower casing 26b and mass-element are formed between upper casing 26a and mass elements Second chamber 16 is formed between part.For example, upper casing 26a and lower casing 26b are ware shape structure open at one end.Upper casing 26a's opens Mouth end and the open end of lower casing 26b are oppositely arranged on the two sides of annular brace portion 25.

In this example embodiment, the entirety of vibration sensing device includes upper casing 26a, lower casing 26b and vibration component.It is being attached When, it is only necessary to upper casing 26a and lower casing 26b are connected to the two sides of vibration component.This modular set-up mode makes The assembling of vibration sensing device becomes easy.

For example, above-mentioned pad 22 is located on upper casing 26a or lower casing 26b.Above-mentioned support construction 18 is used as shell 26 A part and annular brace portion 25 formed connect.Those skilled in the art may set according to actual needs.

Although some specific embodiments of the invention are described in detail by example, the skill of this field Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair Bright range is defined by the following claims.