阅读说明：本技术 接合结构体及其制造方法以及电动机及其制造方法 (Bonded structure and its manufacturing method and motor and its manufacturing method ) 是由 山崎浩次 加东智明 于 2018-01-26 设计创作，主要内容包括：接合结构体,是包含通过Zn系钎料(2)而被接合的Cu系被接合材料(1)的接合结构体,在Zn系钎料与Cu系被接合材料之间具备包含第1合金相(3)、第2合金相(4)及第3合金相(5)的接合部,第1合金相(3)是具有Cu<Sub>5</Sub>Zn<Sub>8</Sub>的基本组成的合金相,第3合金相(5)是一部分与第1合金相相接的、具有CuZn<Sub>4</Sub>或CuZn<Sub>5</Sub>的基本组成的合金相,第2合金相(4)是在第1合金相与第3合金相的界面所形成的具有CuZn<Sub>3</Sub>的基本组成的合金相,在与接合方向平行的截面中,所述第1合金相与所述第3合金相的界面处的所述第2合金相所占的比例不到80％。由此,能够得到Zn系钎料与Cu系被接合材料的接合部处的空隙的形成受到抑制的接合可靠性高的接合结构体。(Bonded structure, it is the Cu system comprising being engaged by Zn brazing filler metal (2) by the bonded structure of grafting material (1), had the joint portion comprising the 1st alloy phase (3), the 2nd alloy phase (4) and the 3rd alloy phase (5) between grafting material in Zn brazing filler metal and Cu system, the 1st alloy phase (3) is with Cu 5 Zn 8 The alloy phase formed substantially, the 3rd alloy phase (5) be it is that a part connects with the 1st alloy, with CuZn 4 Or CuZn 5 The alloy phase formed substantially, the 2nd alloy phase (4) is to be formed by the interface of the 1st alloy phase and the 3rd alloy phase with CuZn 3 The alloy phase formed substantially, in the section parallel with direction of engagement, ratio shared by the 2nd alloy phase of the interface of the 1st alloy phase and the 3rd alloy phase is less than 80%.Thereby, it is possible to the high bonded structures of the joint reliability for obtaining Zn brazing filler metal and Cu system is suppressed by the formation in the gap at the joint portion of grafting material.)

1. a kind of bonded structure is the bonded structure for being engaged Zn brazing filler metal and Cu system by grafting material,

Between grafting material, had in the Zn brazing filler metal and the Cu system and is closed comprising the 1st alloy phase, the 2nd alloy phase and the 3rd The joint portion of metallographic,

1st alloy is mutually that the Cu system at the joint portion is formed by by grafting material side with Cu₅Zn₈Base The alloy phase of this composition,

3rd alloy is mutually that the Zn brazing filler metal side at the joint portion is formed, the Cu system is by grafting material side It is that a part in face connects with the 1st alloy, have CuZn₄Or CuZn₅The alloy phase formed substantially,

2nd alloy is mutually to be formed by the interface of the 1st alloy phase and the 3rd alloy phase with CuZn₃It is basic The alloy phase of composition,

In the section parallel with direction of engagement, the 1st alloy phase is closed with the described 2nd of the interface of the 3rd alloy phase Ratio shared by metallographic is less than 80%.

2. bonded structure according to claim 1, wherein the Zn brazing filler metal include it is bigger than 0wt% and less than The Al of 15wt%.

3. bonded structure according to claim 1 or 2, it includes: the Al system engaged by the Zn brazing filler metal By grafting material.

4. bonded structure according to any one of claim 1-3, wherein the Zn brazing filler metal include Ga, In, Sn, It is more than any in Mg, Ge, Mn, Sb, Cr, Bi, P, V, Si.

5. bonded structure described in any one of -4 according to claim 1, wherein the Cu system by grafting material include Sn, It is more than any in Fe, Zn, Cr, Mn, Ni, Si, C, Al, S, P, W, Mg, Be, Ti, Ag, Au.

6. a kind of motor, has:

As the Cu system by the spiral of grafting material and

Other engaged with the spiral by the Zn brazing filler metal by grafting material,

Had with described other by the joint portion of grafting material in the spiral and according to any one of claims 1-5 connects Close structural body.

7. a kind of manufacturing method of bonded structure, be by Zn brazing filler metal heating melting and by comprising Cu system by grafting material The joint method being brazed by grafting material,

Cu system when by the soldering is by the maximum temperature reached control of grafting material and the joint interface of the Zn brazing filler metal It is made as less than 560 DEG C.

8. the manufacturing method of bonded structure according to claim 7, wherein described to be connect by grafting material comprising Al system Condensation material.

9. the manufacturing method of bonded structure according to claim 7 or 8, wherein the Zn brazing filler metal includes than 0wt% The big and Al less than 15wt%.

10. the manufacturing method of bonded structure according to claim 8, wherein the Zn brazing filler metal is free of Al.

11. a kind of manufacturing method of motor, wherein the Cu system is the spiral of motor by grafting material, comprising:

Using the manufacturing method of bonded structure described in any one of claim 7-10 come by the spiral and other connect The process that condensation material is engaged.

Technical field

The present invention relates to use bonded structure and its manufacturing method and electricity of the Cu system by grafting material and Zn brazing filler metal Motivation and its manufacturing method.

Background technique

Generally, the excellent electric conductivity of copper (Cu), aluminium (Al), it is also more inexpensive as material cost, therefore as electronic The spiral of machine (motor) etc., mainly as with the insulation-coated copper spiral such as enamel paint or aluminium spiral come using.For spiral, adopt With the high joint method of electric conductivity by its be electrically connected for the terminal or lead that cross electric current and connect to power supply.As Especially there is heat resistance, do not make the joint method melted by grafting material, the influence of surface natural disposition is smaller, select soldering Situation is in the majority.Particularly, in the case where being Cu by grafting material, P-Cu Brazing Materials specified in JIS Z 3264-1985 are used Situation it is in the majority.As P-Cu Brazing Materials, there are BCuP-1~6, solidus (is at low temperature solid state, heats up and start phase transformation For the temperature of liquid condition), (phenomenon opposite with solidus is at high temperature liquid condition, cools down and start phase transformation liquidus curve For the temperature of solid state) it is respectively 645 DEG C~710 DEG C of solidus, 720 DEG C~925 DEG C or so of liquidus curve.The fusing point of copper is about 1085 DEG C, therefore can not will be melted and be brazed by the copper of grafting material.But although the conductivity of P-Cu Brazing Materials copper is high, But the conductivity of phosphorus is low, thus while also relying on brazing conditions, but conductivity becomes 15IACS% hereinafter, very low.In addition, If it is considered that versatility so that in the case where also using aluminium (fusing point is about 660 DEG C) as by grafting material apart from copper It is able to use, as solder, preferred liquid phase line is 500 DEG C of materials below.

As indicated above, it is desirable to have, fusing point is low, also high and cost is also low, balancing good to a certain extent for conductivity Solder.Therefore, Zn brazing filler metal is of concern.The fusing point of Zn itself is 420 DEG C, if the Al of addition 5wt% or so, becomes Eutectic alloy, fusing point are reduced to 380 DEG C or so, it may be said that are the very excellent solders of workability.

About the bonded structure and joint method for being engaged Cu system by grafting material Zn brazing filler metal, it has been disclosed that have following Content.

In patent document 1, the spiral about the motor (motor) towards compressor, discloses and is wound in aluminium spiral The position of the winding is used using zinc and aluminium as the solder of principal component the connected structure being brazed by copper spiral.

In addition, disclosing following joint method and connected structure in patent document 2, which includes: in Cu ZnAl eutectic solder is clamped between substrate and semiconductor element, is heated up while applying load, and ZnAl eutectic solder is melted And the process for forming ZnAl solder layer；With the work for making it cool down while applying load to above-mentioned ZnAl solder layer and engaging Sequence.

In addition, to be disclosed in patent document 3 by grafting material be Al, uses Zn-Al alloy as insertion material Material alloys, at 420 DEG C diffusion bonding connected structure and joint technology.

Intermetallic compound, In are formed by the joint interface in Zn and Cu secondly, being disclosed about in patent document 4 SiC as semiconductor component forms TiN layer as barrier layer, Zn layers and Cu layers is sequentially formed under it, in Zn layers and Cu layers Interface, Zn layers are reacted with Cu layers, formed CuZn₅Layer, Cu₅Zn₈Layer.

Summary of the invention

Subject to be solved by the invention

With regard to use Cu system by the bonded structure of grafting material and Zn brazing filler metal for, as described above, for for example constituting The Cu system spiral of various motor and the joint portion of electrode terminal or lead etc..But at the joint portion, sometimes 200~250 DEG C or so high temperature energization movement in joint interface contact resistance increase, occur poor flow, become problem.But for Its mechanism, reply means, are still unaware of.

In patent document 1, it discloses to Zn and to be brazed Cu as the solder of principal component, but the engagement for Cu and Zn The structure at interface is not illustrated in detail.In patent document 2, also with patent document 1 similarly for engagement circle of Cu and Zn The structure in face is not illustrated in detail.In patent document 3, disclose the Zn alloy material using Zn as principal component form and Fusing point, representative junction temperature, but be Al by grafting material, about the interfacial reaction with Cu, do not disclose.In patent text It offers in 4, discloses and form 2 kinds of different intermetallic compounds from Zn layers of interface at Cu layers, but about these intermetallics The relationship of object and contact resistance does not disclose.

The object of the present invention is to provide using Cu system by the bonded structure of grafting material and Zn brazing filler metal and engagement side Joint reliability excellent bonded structure and joint method in method.

Means for solving the problems

It is the Cu system comprising being engaged by Zn brazing filler metal by grafting material for bonded structure of the invention Bonded structure, which is characterized in that

The Zn brazing filler metal and the Cu system between grafting material, had comprising the 1st alloy phase, the 2nd alloy phase and The joint portion of 3rd alloy phase,

1st alloy is mutually that the Cu system at the joint portion is formed by by grafting material side with Cu₅Zn₈ The alloy phase formed substantially,

3rd alloy is mutually that the Zn brazing filler metal side at the joint portion is formed, the Cu system is by grafting material It is that a part in the face of side connects with the 1st alloy, have CuZn₄Or CuZn₅The alloy phase formed substantially,

2nd alloy is mutually to be formed by the interface of the 1st alloy phase and the 3rd alloy phase with CuZn₃ The alloy phase formed substantially,

In the section parallel with direction of engagement, the 1st alloy phase and described the of the interface of the 3rd alloy phase Ratio shared by 2 alloy phases is less than 80%.

In addition, being will be comprising Cu system by engagement material by Zn brazing filler metal heating melting for joint method of the invention The joint method of material being brazed by grafting material, which is characterized in that

Cu system when by the soldering reaches temperature by the highest of grafting material and the joint interface of the Zn brazing filler metal Degree control is less than 560 DEG C.

The effect of invention

Cu system is able to suppress by the generation in the gap at the joint interface of grafting material and Zn brazing filler metal, as a result, can obtain The bonded structure high to joint reliability.

Detailed description of the invention

Fig. 1 is the conjugation schemes figure of bonded structure shown in embodiments of the present invention 1.

Fig. 2 is the skeleton diagram before the engagement of bonded structure shown in embodiments of the present invention 1.

Fig. 3 is the skeleton diagram after the engagement of bonded structure shown in embodiments of the present invention 1.

Fig. 4 is the comparative example indicated near the joint interface of bonded structure shown in embodiments of the present invention 1 Skeleton diagram.

Fig. 5 is the embodiment indicated near the joint interface of bonded structure shown in embodiments of the present invention 1 Skeleton diagram.

Fig. 6 is the skeleton diagram for indicating the comparative example of bonded structure shown in embodiments of the present invention 1.

Fig. 7 is the skeleton diagram for indicating the embodiment of bonded structure shown in embodiments of the present invention 1.

Fig. 8 is the joint reliability test for indicating the comparative example of bonded structure shown in embodiments of the present invention 1 Cross-section photograph afterwards.

Fig. 9 is the joint reliability test for the embodiment for indicating bonded structure shown in embodiments of the present invention 1 Cross-section photograph afterwards.

Figure 10 is figure obtained by mapping to table 1 shown in embodiments of the present invention 1.

Figure 11 is the skeleton diagram before the engagement of bonded structure shown in embodiments of the present invention 2.

Figure 12 is the skeleton diagram after the engagement of bonded structure shown in embodiments of the present invention 2.

Figure 13 is figure obtained by mapping to table 2 shown in embodiments of the present invention 2.

Figure 14 is the skeleton diagram using the motor for having bonded structure of the invention.

Specific embodiment

Inventor is for using Cu system by contact resistance in the bonded structure of grafting material and Zn brazing filler metal due to height The reason of the phenomenon that warm energization acts and increases, is studied.As a result, learning: as described later, during the brazing process in Cu system quilt The joint interface of conjugant and Zn brazing filler metal forms CuZn₃Alloy phase, and then contact resistance due to applying heat to joint portion repeatedly It impacts and increases.In addition it finds: by inhibiting above-mentioned CuZn₃The formation of alloy phase can inhibit the increase of contact resistance, raising connects Close reliability.

Hereinafter, being explained in detail to the present invention.