阅读说明：本技术 一种mems麦克风及其抗吹气结构 (MEMS microphone and anti structure of blowing thereof ) 是由 *** 仪保发 于 2019-09-05 设计创作，主要内容包括：本发明涉及声电转换领域,尤其涉及一种MEMS麦克风及其抗吹气结构,包括线路板,所述线路板上设有声孔,所述线路板上方固定有外壳,所述线路板与外壳形成的声腔内固定有MEMS芯片,所述MEMS芯片通过抗吹气组件固定在前述声孔位置,所述抗吹气组件由柔性膜片、垫圈和刚性背极组成,所述柔性膜片与前述线路板相固定,所述柔性膜片上声孔位置固定有多个气孔Ⅰ,所述垫圈固定在柔性膜片与刚性背极之间,所述垫圈上与前述气孔Ⅰ对应位置固定有通孔,所述刚性背极上与垫圈上通孔对应位置固定有多个气孔Ⅱ。通过本发明能有效避免MEMS芯片上振膜被大气流冲击发生破裂,造成结构损坏,进而影响性能甚至导致麦克风失效。(The invention relates to the field of sound-electricity conversion, in particular to an MEMS microphone and an air blowing resisting structure thereof, which comprise a circuit board, wherein a sound hole is formed in the circuit board, a shell is fixed above the circuit board, an MEMS chip is fixed in a sound cavity formed by the circuit board and the shell, the MEMS chip is fixed at the position of the sound hole through an air blowing resisting assembly, the air blowing resisting assembly consists of a flexible membrane, a gasket and a rigid back electrode, the flexible membrane is fixed with the circuit board, a plurality of air holes I are fixed at the position of the sound hole in the flexible membrane, the gasket is fixed between the flexible membrane and the rigid back electrode, a through hole is fixed at the position on the gasket corresponding to the air holes I, and a plurality of air holes II are fixed at the position on the rigid back electrode corresponding to the through hole in the. The invention can effectively avoid the breakage of the diaphragm on the MEMS chip caused by the impact of the atmospheric air flow, which causes the structural damage, and further influences the performance and even causes the microphone failure.)

1. The utility model provides a MEMS microphone and anti structure of blowing thereof, includes the circuit board, its characterized in that: be equipped with the phonate hole on the circuit board, the circuit board top is fixed with the shell, the sound intracavity that circuit board and shell formed is fixed with the MEMS chip, the MEMS chip passes through the anti subassembly of blowing and fixes at aforementioned phonate hole position, the anti subassembly of blowing comprises flexible diaphragm, packing ring and rigidity back of the body utmost point, flexible diaphragm is fixed mutually with aforementioned circuit board, the phonate hole rigidity on the flexible diaphragm has a plurality of gas pockets I, the packing ring is fixed between flexible diaphragm and rigidity back of the body utmost point, correspond the rigidity with aforementioned gas pocket I on the packing ring and correspond the position and be fixed with a plurality of gas pockets II, gas pocket II is incompletely counterpointed with aforementioned gas pocket I, the ASIC chip of sound intracavity is still connected through the key metal line to the MEMS chip.

2. the MEMS microphone and the anti-blowing structure thereof according to claim 1, wherein: the flexible membrane is a film made of polytetrafluoroethylene or polyimide materials.

3. the MEMS microphone and the anti-blowing structure thereof according to claim 1, wherein: the gasket is made of metal materials such as copper, aluminum, iron and the like.

4. The MEMS microphone and the anti-blowing structure thereof according to claim 1, wherein: the number of the air holes II on the rigid back electrode is more than that of the air holes I on the flexible membrane.

[ technical field ] A method for producing a semiconductor device

the invention relates to the field of sound-electricity conversion, in particular to an MEMS (micro-electromechanical system) microphone and an anti-blowing structure thereof.

[ background of the invention ]

MEMS is a Micro-Electro mechanical System (Micro-Electro mechanical System), which refers to a sensor device with a size of several millimeters or less, and the internal structure of the sensor device is generally in the micrometer or nanometer level, and the sensor device is an independent intelligent System. Briefly, the MEMS is a silicon-based sensor formed by miniaturizing mechanical components of a conventional sensor, fixing a device on a silicon wafer (wafer) by a three-dimensional stacking technique, for example, a three-dimensional through-silicon via (TSV) technique, and finally cutting and assembling the device in a specially-customized packaging form according to different application occasions. The MEMS has the advantages of miniaturization and high integration degree which cannot be achieved by the common sensor; compared with the common forward sound MEMS microphone, the forward sound laminated structure MEMS microphone has optimized performance, higher signal-to-noise ratio and more outstanding performance advantages in the fields of voice recognition, man-machine interaction and the like;

the MEMS microphone is a microphone manufactured based on the MEMS technology, and is widely used at present based on the requirement of lightness, thinness and miniaturization of terminal equipment.

the MEMS chip structure in the MEMS microphone comprises a silicon substrate, a vibrating diaphragm and a back electrode, wherein the vibrating diaphragm and the back electrode are positioned on the substrate, the back electrode can bear larger impact due to the rigid characteristic and the porous property of the back electrode, the vibrating diaphragm is easy to deform due to the characteristics of softness, thinness and thinness, and is easy to crack under the impact of larger airflow, so that the structure is damaged, and the performance is influenced or even the microphone fails.

Therefore, the influence of strong airflow impact on the microphone is reduced, the structural integrity and the performance stability of the microphone are important protective measures, a lot of accidental product structural failures can be reduced, and the microphone is more suitable for a harsher environment.

[ summary of the invention ]

The invention aims to overcome the defects of the prior art and provides an MEMS microphone and an anti-blowing structure thereof, which can effectively reduce the influence of strong airflow impacting the microphone.

the invention can be realized by the following technical scheme:

the invention discloses an MEMS microphone and an anti-blowing structure thereof, which comprises a circuit board, wherein the circuit board is provided with a sound hole, a shell is fixed above the circuit board, an MEMS chip is fixed in an acoustic cavity formed by the circuit board and the shell, the MEMS chip is fixed at the position of the sound hole through an anti-blowing component, the anti-blowing component consists of a flexible membrane, a gasket and a rigid back electrode, the flexible diaphragm is fixed with the circuit board, a plurality of air holes I are fixed at the position of the sound hole on the flexible diaphragm, the gasket is fixed between the flexible membrane and the rigid back electrode, a through hole is fixed on the gasket at the position corresponding to the air hole I, and a plurality of air holes II are fixed on the rigid back electrode at positions corresponding to the through holes on the gasket, the air holes II are not completely aligned with the air holes I, and the MEMS chip is also connected with the ASIC chip in the sound cavity through a bonding metal wire. After strong air current passes through the phonate hole, flexible diaphragm produces deformation, this deformation forces flexible diaphragm to the motion of rigidity back of the body utmost point one side, partial region and the laminating of rigidity back of the body utmost point on the flexible diaphragm, and cover the gas pocket II that the part is not counterpointed completely, can reduce outside air current through the rigidity back of the body utmost point through closing part gas pocket II, it is corresponding, the power that sees through rigidity back of the body utmost point back air current and produces also can correspondingly diminish, can effectively avoid on the MEMS chip diaphragm to strike the emergence of breaking by the atmospheric current, cause structural damage, and then influence the performance and lead to the microphone inefficacy even.

Preferably, the flexible membrane is a film made of polytetrafluoroethylene or polyimide material. The polytetrafluoroethylene or polyimide material has the characteristic of high temperature resistance, and can ensure the service life of the microphone.

Preferably, the gasket is made of metal materials such as copper, aluminum, iron and the like.

Preferably, the number of the air holes II on the rigid back electrode is more than that of the air holes I on the flexible membrane.

Compared with the prior art, the invention has the following advantages:

The invention can effectively avoid the breakage of the diaphragm on the MEMS chip caused by the impact of the atmospheric air flow, which causes the structural damage, and further influences the performance and even causes the microphone failure.

[ description of the drawings ]

The following detailed description of embodiments of the invention is provided in conjunction with the appended drawings, in which:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of an anti-blow assembly of the present invention;

FIG. 3 is a schematic view of a rigid back pole structure of the present invention;

FIG. 4 is a schematic view of a gasket construction of the present invention;

FIG. 5 is a schematic view of a flexible membrane structure according to the present invention;

FIG. 6 is a schematic view of the structure of the anti-blow out assembly during normal airflow;

FIG. 7 is a schematic view of the structure of the anti-blow assembly during a strong air flow;

FIG. 8 is a schematic view of the structure of the anti-blow assembly when a strong air flow is passed through it;

In the figure: 1. a circuit board; 2. an anti-blow-through assembly; 201. a flexible membrane; 202. a gasket; 203. a rigid back electrode; 204. air holes I; 205. a through hole; 206. air holes II; 3. a housing; 4. an MEMS chip; 5. an ASIC chip; 6. a bonding metal wire; 7. a sound hole;

[ detailed description ] embodiments

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings:

as shown in fig. 1 to 8, the invention discloses an MEMS microphone and an anti-blowing structure thereof, comprising a circuit board 1, a sound hole 7 is arranged on the circuit board 1, a housing 3 is fixed above the circuit board 1, an MEMS chip 4 is fixed in a sound cavity formed by the circuit board 1 and the housing 3, the MEMS chip 4 is fixed at the position of the sound hole 7 through an anti-blowing component 2, the anti-blowing component 2 is composed of a flexible membrane 201, the MEMS chip comprises a gasket 202 and a rigid back electrode 203, the flexible diaphragm 201 is fixed with the circuit board 1, 5 air holes I204 are fixed at the position of a sound hole 7 on the flexible diaphragm 201, the gasket 202 is fixed between the flexible diaphragm 201 and the rigid back electrode 203, through holes 205 are fixed at the position, corresponding to the air holes I204, on the gasket 202, 13 air holes II 206 are fixed at the position, corresponding to the through holes 205 on the gasket 202, on the rigid back electrode 203, the air holes II 206 are not completely aligned with the air holes I204, and the MEMS chip 4 is further connected with the ASIC chip 5 in the sound cavity through bonding metal wires 6. For convenience of description, in this embodiment, the pressure acting on the diaphragm of the MEMS chip 4 is set as F, the force generated by the airflow through each air hole of the rigid back electrode 203 is set as F1, that is, the force generated by the airflow through each air hole of the rigid back electrode 203 acts on the diaphragm of the MEMS chip 4 after the F1 is overlapped for a certain distance, the MEMS diaphragm is damaged due to an excessively large force, if the force F is too small, the airflow is not large enough to damage the diaphragm structure inside the MEMS chip 4, the flexible diaphragm 201 does not deform, the flexible diaphragm 201 and the rigid back electrode 203 do not contact with each other, the force acting on the diaphragm is equivalent to F, the force generated by the airflow through each air hole ii 206 of the rigid back electrode 203 is denoted as F1, the force generated by the airflow after passing through the rigid back electrode 203 can be equivalent to 13F1 (here, 13 air holes ii 206 can be provided for the airflow to pass through), when the impact of the external airflow becomes large, the force F, the deformation forces the flexible membrane 201 to move towards one side of the rigid back electrode 203, the upper part of the flexible membrane 201 is attached to the rigid back electrode 203, part of the air holes II 206 which are not completely aligned are covered, the air holes II 206 of the closed part can reduce the external airflow passing through the rigid back electrode 203, and correspondingly, the force generated by the airflow after passing through the rigid back electrode 203 can be correspondingly reduced, and if the flexible membrane is not deformed, the force generated by the airflow after passing through the back electrode can be equivalent to 13F 1; if the diaphragm is deformed, as shown in fig. 7 to 8, the force generated by the airflow after passing through the rigid back electrode 203 can be approximately equivalent to 7F1, so that the structure can block the impact force of the strong airflow and can protect the internal MEMS chip 4; the vibrating diaphragm can be effectively prevented from being broken due to the impact of the atmospheric air on the MEMS chip 4, so that the structure is damaged, and the performance is influenced or even the microphone is failed.

wherein, the flexible membrane 201 is a film made of polytetrafluoroethylene material. The polytetrafluoroethylene has the characteristic of high temperature resistance, and can ensure the service life of the microphone.

Wherein, the gasket 202 is made of copper material.

The above description is only a preferred embodiment of the present invention, and it should be noted that a person skilled in the art can make various changes, modifications, substitutions and alterations to the embodiments without departing from the technical principles of the present invention, and such changes, modifications, substitutions and alterations should also be regarded as the protection scope of the present invention.