阅读说明：本技术 一种传递式芯片封装装置 (Transmission type chip packaging device ) 是由 吴斌 于 2021-09-30 设计创作，主要内容包括：本发明公开了一种传递式芯片封装装置,属于芯片封装领域,一种传递式芯片封装装置,通过对向控变绳以及传递磁引模块的设置,在注入熔融环氧树脂后,控制两个电磁板通断电,使多个对向控变绳沿着远离通电电磁板的方向逐渐受到向下的吸引力,对重组动片产生向下拉扯力,使其朝向胶封层形变,对胶封层产生波浪式的挤压力,使内部的空隙塌陷,并迫使熔融的环氧树脂重分布,进而有效消除空隙,相较于现有技术,大幅度降低固化后胶封层内的空隙含量,有效保证胶封后芯片的散热性以及其使用时的稳定性。(The invention discloses a transmission type chip packaging device, which belongs to the field of chip packaging, and is characterized in that through the arrangement of opposite direction control change ropes and a transmission magnetic guiding module, after molten epoxy resin is injected, the on-off of two electromagnetic plates is controlled, so that a plurality of opposite direction control change ropes gradually receive downward attraction along the direction far away from the electrified electromagnetic plates, a downward pulling force is generated on a heavy component moving plate, the heavy component moving plate is deformed towards a glue sealing layer, wave-shaped extrusion force is generated on the glue sealing layer, the inner gap is collapsed, the molten epoxy resin is forced to be redistributed, and further the gap is effectively eliminated.)

1. The utility model provides a transmission type chip packaging hardware, includes fixed die plate (2), install the controller on fixed die plate (2), fixed die plate (2) upper end is connected with movable mould board (1) through a plurality of cylinders (3), movable mould board (1) lower extreme fixed connection presses module (4), the encapsulation groove that has and presses module (4) to correspond is dug to fixed die plate (2) upper end, it is fixed with the injecting glue pipe to run through on movable mould board (1) and the pressure module (4), its characterized in that: the inner wall of the packaging groove is fixedly connected with a packaging disc (5), a magnetic transmission module is arranged in a space enclosed by the packaging groove and the packaging disc (5), the lower end of the packaging disc (5) is provided with a chute, the left end and the right end of the chute are provided with ejectors, the transmission magnetic attraction module comprises a plurality of transmission movable plates (6) which are connected with the sliding groove in a sliding way and are uniformly distributed and electromagnetic plates (7) which are fixedly embedded at the left inner bottom end and the right inner bottom end of the packaging groove, the upper end part of the electromagnetic plate (7) corresponds to the lower end part of the transmission movable plate (6), a rectifying groove is chiseled at the inner bottom end of the pressing module (4), the top end in the rectifying groove is fixedly connected with a subtend control variable rope (8), the mouth part of the rectifying groove is fixedly connected with a recombination movable sheet (9), the lower end part of the opposite direction control variable rope (8) is fixedly connected with a recombination moving sheet (9), and the ejector and the electromagnetic plate (7) are electrically connected with the controller.

2. The pass-through chip packaging apparatus of claim 1, wherein: the recombination rotor (9) is of an elastic structure, and the recombination rotor (9) is in a stretched state.

3. The pass-through chip packaging apparatus of claim 2, wherein: the lower end part of the pressing module (4) and the opening part of the packaging disc (5) are both subjected to corner cutting, and the corner cutting of the pressing module and the corner cutting of the packaging disc are matched with each other.

4. The pass-through chip packaging apparatus of claim 1, wherein: the transmission movable plate (6) comprises a magnetic moving rod (61) corresponding to the electromagnetic plate (7), a sliding block (63) connected with the sliding groove in a sliding mode and a plurality of limiting ropes (62) fixedly connected between the magnetic moving rod (61) and the sliding block (63), and limiting wings (64) are fixedly connected to two ends of the sliding block (63) along the extending direction of the sliding groove.

5. The pass-through chip packaging apparatus of claim 4, wherein: the sliding block (63) and the limiting wings (64) are both elastic structures, and the magnetic rod (61) is made of ferromagnetic materials.

6. The pass-through chip packaging apparatus of claim 1, wherein: the opposite direction control variable rope (8) comprises a fixed plate (81) which is fixedly connected with the top end in the rectifying groove and is provided with a sliding hole, a high-low rope (82) which movably penetrates through the fixed plate (81), a magnetic auxiliary ball (831) and a movable magnetic ball (832) which are respectively connected to two end parts of the high-low rope (82), and the magnetic auxiliary ball (831) and the movable magnetic ball (832) are fixedly connected with a recombination movable plate (9).

7. The pass-through chip packaging apparatus of claim 6, wherein: high low rope (82) are including solid gentle end (821) and fixed connection at hollow end (822) of solid gentle end (821) tip, place ball (10) in hollow end (822), ball (10) tip extends to outside hollow end (822), the inside bottom end of slide opening is dug and is had the tip that is located outside hollow end (822) with ball (10) to the spacing groove that matches.

8. The pass-through chip package device of claim 7, wherein: the graphene-coated spherical ball is characterized in that a gap enclosed between the hollow end (822) and the spherical ball (10) is filled with graphene particles, and the hollow end (822) is provided with powder passing micropores.

9. The pass-through chip packaging apparatus of claim 6, wherein: the reorganization moving plate (9) is last to cut a plurality of through-holes that correspond with moving magnetic ball (832) respectively, moving plate (11) under fixedly connected with in the through-hole, moving plate (11) and moving magnetic ball (832) fixed connection down, moving plate (12) are gone up to the fixedly connected with of the vice ball (831) outer end of magnetic motion, go up moving plate (12) edge and reorganization moving plate (9) fixed connection.

10. The pass-through chip package device of claim 9, wherein: the recombined moving plate (9) is of a hard plate-shaped structure, and the lower moving plate (11) and the upper moving plate (12) are both of elastic structures.

Technical Field

The invention relates to the field of chip packaging, in particular to a transmission type chip packaging device.

Background

The package is also referred to as a package for mounting a semiconductor integrated circuit chip, which not only serves to mount, fix, seal, protect the chip and enhance thermal conductivity, but also serves as a bridge for connecting the chip's internal world to external circuits-the contacts on the chip are connected to the pins of the package housing by wires, which in turn are connected to other devices by wires on the printed circuit board. Therefore, packaging technology is a critical ring for many integrated circuit products.

In the prior art, when the chip is encapsulated by epoxy resin, gaps are easy to exist in the epoxy resin formed by pouring, so that the heat dissipation performance and the stability in use of the epoxy resin are affected, and the quality of the encapsulated chip is affected.

Disclosure of Invention

1. Technical problem to be solved

In view of the problems in the prior art, an object of the present invention is to provide a transmission type chip packaging apparatus, wherein by arranging opposing direction control change ropes and a transmission magnetic guiding module, after injecting molten epoxy resin, the two electromagnetic plates are controlled to be powered on and powered off, so that the opposing direction control change ropes gradually receive a downward attraction force along a direction away from the powered electromagnetic plates, a downward pulling force is generated on a heavy component moving plate, the heavy component moving plate deforms toward an encapsulation layer, a wavy extrusion force is generated on the encapsulation layer, so as to collapse inner gaps and force the molten epoxy resin to redistribute, thereby effectively eliminating the gaps.

2. Technical scheme

In order to solve the above problems, the present invention adopts the following technical solutions.

The utility model provides a transmission type chip packaging hardware, includes the fixed die plate, install the controller on the fixed die plate, the fixed die plate upper end is connected with the movable mould board through a plurality of cylinders, movable mould board lower extreme fixed connection presses the module, the package groove that corresponds with moulding-die piece is dug to the fixed die plate upper end, it is fixed with the injecting glue pipe to run through on movable die plate and the pressure module, package inslot inner wall fixedly connected with encapsulation dish, be equipped with transmission magnetism module in the space that encapsulation groove and encapsulation dish enclose, encapsulation dish lower extreme is dug there is the spout, both ends are all installed the catapult about the spout, and after the electromagnetism board circular telegram, when a plurality of transmission movable plates of gathering, accessible catapult produced the impact to the transmission movable plate of a plurality of gathers, makes it disperse, when being convenient for circular telegram again, the wave fluctuation deformation of reorganization movable plate transmission formula, transmission magnetism module includes the transmission movable plate of a plurality of evenly distributed with spout sliding connection and fixes the electricity of inlaying in the left and right sides of encapsulation inslot bottom The magnetic sheet, when the electromagnetism board to the difference circular telegram, the deformation direction of reorganization movable plate is different, compares in the setting of an electromagnetism board, effectively avoids being difficult to the less condition of deformation or deformation volume because of keeping away from electromagnetism board one side reorganization movable plate, makes melting epoxy's redistribution effect better, the end is corresponding under electromagnetism board upper end and the transmission movable plate, the bottom cuts a rectifier tank in the moulding-die block, the opposite direction accuse of rectifier tank internal top end fixedly connected with becomes the rope, rectifier tank mouth portion fixedly connected with reorganizes the movable plate, the end and reorganization movable plate fixed connection under the opposite direction accuse becomes the rope, catapult and electromagnetism board all with controller electric connection.

Furthermore, the restructuring rotor is of an elastic structure and is in a stretched state, so that after power failure, the restructuring rotor can restore to a straight state, and further drives the opposite direction control variable rope to restore to the original state, and when the electromagnetic plate is powered on again, the opposite direction control variable rope still can enable the restructuring rotor to deform towards the inside of the rubber sealing layer.

Furthermore, the lower end of the pressing module and the opening of the packaging disc are both subjected to corner cutting, and the corners of the pressing module and the corners of the packaging disc are matched with each other, so that the distance between the pressing module and the chip is effectively controlled, and a certain space is provided for the adhesive sealing layer.

Furthermore, the transmission movable plate includes the magnetic pole that corresponds with the electromagnetic plate, with spout sliding connection's slider and fixed connection a plurality of spacing ropes between magnetic pole and slider, along the extending direction of spout, the equal fixedly connected with spacing wing in both ends of slider.

Further, slider and spacing wing are elastic construction, the magnetic pole is made for ferromagnetic material, it possesses magnetism after the electromagnetism board circular telegram, thereby can adsorb its magnetic pole that closes on, this magnetic pole adsorbs rather than the magnetic pole that closes on again afterwards, present a plurality of transmission movable plates of the gathering of transmission formula, thereby the active area of whole magnet of crescent, make a plurality of transmission movable plates gather after to the gradual production adsorption affinity of a plurality of subtend accuse change ropes of upper portion, thereby make to reorganize the movable plate and present the undulate deformation that appears along the direction of keeping away from circular telegram electromagnetic plate emergence gradually, it is better to the redistribution effect of melting epoxy.

Furthermore, the opposite direction control variable rope comprises a fixed plate fixedly connected with the top end in the rectifying groove and provided with a slide hole, a high-low rope movably penetrating through the fixed plate, and a magnetic auxiliary ball and a moving magnetic ball respectively connected to two end parts of the high-low rope, wherein the magnetic auxiliary ball and the moving magnetic ball are fixedly connected with the recombinant moving piece, and when magnetic attraction is received, the moving magnetic ball moves downwards to drive the magnetic auxiliary ball to move upwards, so that the longitudinal deformation range of the whole recombinant moving piece is effectively expanded, and the redistribution effect on the fused epoxy resin is better.

Further, the height rope includes solid gentle end and the hollow end of fixed connection at solid gentle end tip, the ball has been placed in the hollow end, the ball tip extends to outside the hollow end, the bottom end is cut out in the slide opening has the tip that lies in outside the hollow end with the ball to the spacing groove that matches, the setting of a plurality of balls, when making the height rope move on the stationary plate, turns into rolling friction with sliding friction, improves the smooth and easy nature of removal, makes it be difficult for being damaged simultaneously, and the spacing groove makes the height rope difficult emergence turn-ups condition when removing in the slide opening in addition, effectively guarantees hollow end one end and moves towards the lower inner wall of slide opening all the time.

Further, the space intussuseption that encloses between hollow end and the ball is filled with graphite alkene granule, the hollow is served and is provided with the powder micropore, and when ball and slide opening department extrusion contact, this department hollow end receives great deformability, and the graphite alkene granule of being convenient for is oozed along crossing the powder micropore, realizes the lubrication between rope and the fixed plate of height.

Furthermore, a plurality of through holes respectively corresponding to the moving magnetic balls are drilled on the recombined moving plate, a lower moving plate is fixedly connected in each through hole, the lower moving plate is fixedly connected with the moving magnetic balls, an upper moving plate is fixedly connected to the outer ends of the magnetic auxiliary balls, the edge of the upper moving plate is fixedly connected with the recombined moving plate, the recombined moving plate is of a hard plate-shaped structure, the lower moving plate and the upper moving plate are both of elastic structures, the lower moving plate deforms downwards when the electromagnetic plate is powered on, the upper moving plate deforms upwards to realize redistribution of the molten epoxy resin, and the magnetic auxiliary balls collide with the hard recombined moving plate when the upper moving plate recovers deformation during power failure, so that certain vibration force is generated, on one hand, collapse of gaps in the molten epoxy resin is further promoted, the amount of the gaps in the cured and molded adhesive sealing layer is reduced, on the other hand, the upper surface of the molten epoxy resin is effectively leveled under the action of micro-vibration force, the flatness and the uniformity of the formed adhesive sealing layer are better.

3. Advantageous effects

Compared with the prior art, the invention has the advantages that:

(1) this scheme becomes the setting of rope and transmission magnetism module of drawing through subtend accuse, after pouring into melting epoxy into, control two electromagnetic plates break-make electricity, make a plurality of subtend accuse change the rope and receive decurrent appeal along the direction of keeping away from circular telegram electromagnetic plate gradually, produce the power of pulling downwards to the recombinant motion piece, make its orientation glue the seal deformation, to gluing the extrusion force that the seal produced the wave formula, make inside space collapse, and force melting epoxy redistribution, and then effectively eliminate the space, compare in prior art, reduce substantially and glue intraformational void content of seal after the solidification, effectively guarantee to glue the thermal diffusivity of back chip and its stability when using.

(2) The recombination rotor is of an elastic structure and is in a stretched state, so that after power failure, the recombination rotor can restore to a straight state, and further drives the opposite direction control variable rope to restore to the original state, and when the electromagnetic plate is powered on again, the opposite direction control variable rope still can enable the recombination rotor to deform towards the inside of the rubber sealing layer.

(3) The mouth parts of the lower end part of the pressing module and the packaging disc are all subjected to corner cut setting, the corner cut of the pressing module and the corner cut of the packaging disc are matched with each other, the distance between the pressing module and a chip is effectively controlled, and a certain space is provided for a glue sealing layer.

(4) Slider and spacing wing are elastic construction, the magnetic pole is made for ferromagnetic material, it possesses magnetism after the electromagnetism board circular telegram, thereby can adsorb its magnetic dynamic pole that closes on, this magnetic dynamic pole adsorbs rather than the magnetic dynamic pole that closes on again after, present a plurality of transmission movable plates of the gathering of transmission formula, thereby the area of action of crescent whole magnet, make a plurality of transmission movable plates gather after to go up a plurality of subtend accuse change rope of part and progressively produce the adsorption affinity, thereby make to reorganize the movable plate present and take place gradually along the direction of keeping away from circular telegram electromagnetism board and present wavy undulation, the redistribution effect that makes to melting epoxy is better.

(5) The opposite direction control variable rope comprises a fixed plate fixedly connected with the top end in the rectifying groove and provided with a sliding hole, a high-low rope movably penetrating through the fixed plate, and a magnetic auxiliary ball and a moving magnetic ball which are respectively connected to two end parts of the high-low rope, wherein the magnetic auxiliary ball and the moving magnetic ball are fixedly connected with the recombination moving piece, and when magnetic attraction force is received, the moving magnetic ball moves downwards to drive the magnetic auxiliary ball to move upwards, so that the longitudinal deformation range of the whole recombination moving piece is effectively expanded, and the redistribution effect on the fused epoxy resin is better.

(6) The height rope includes solid gentle end and the hollow end of fixed connection at solid gentle end tip, the ball has been placed in the hollow end, the ball tip extends to outside the hollow end, the bottom end is opened and is chisel out has the tip that is located outside the hollow end with the ball to the spacing groove that matches in the slide opening, the setting of a plurality of balls, when making the height rope move on deciding the board, turn into rolling friction with sliding friction, improve the smooth and easy nature of removal, make it difficult damaged simultaneously, spacing groove makes the height rope difficult turn-ups condition that takes place when removing in the slide opening in addition, effectively guarantee hollow end one end lower inner wall towards the slide opening all the time.

(7) The space intussuseption that encloses between hollow end and the ball is filled with graphite alkene granule, and the hollow is served and is provided with the powder micropore, and when ball and slide opening department extrusion contact, this department hollow end receives great deformability, and the graphite alkene granule of being convenient for oozes along crossing the powder micropore, realizes the lubrication between rope and the fixed plate of height.

(8) The restructuring rotor is provided with a plurality of through holes which respectively correspond to the moving magnetic balls, a lower rotor is fixedly connected in the through holes, the lower rotor is fixedly connected with the moving magnetic balls, the outer end of the magnetic auxiliary ball is fixedly connected with an upper rotor, the edge of the upper rotor is fixedly connected with the restructuring rotor, the restructuring rotor is of a hard plate structure, and the lower rotor and the upper rotor are both of elastic structures, when the electromagnetic plate is electrified, the lower moving plate deforms downwards, the upper moving plate deforms upwards, redistribution of the molten epoxy resin is realized, meanwhile, when the upper moving plate is restored to deform during power failure, the magnetic auxiliary ball collides with the hard recombinant moving plate, thereby generating a certain vibration force, on one hand, further promoting the collapse of the gaps in the molten epoxy resin and reducing the amount of the gaps in the adhesive sealing layer after curing and molding, on the other hand, under the action of micro-vibration force, the upper surface of the fused epoxy resin is effectively smoothed, so that the formed adhesive sealing layer has better flatness and uniformity.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic view of a partial structure of a lamination block according to the present invention;

FIG. 3 is a schematic structural view of a cross section at the package tray of the present invention;

FIG. 4 is a schematic view of the transfer plate of the present invention;

FIG. 5 is a schematic structural diagram of the subtend controlled variable rope according to the present invention;

FIG. 6 is a schematic structural view of a section of a high-low rope according to the present invention;

FIG. 7 is a schematic view of the construction of the end portions of the high and low cords of the present invention;

FIG. 8 is a schematic diagram of a modified structure of a re-assembled rotor portion after the magnetic attraction transfer module is powered on;

FIG. 9 is a schematic diagram of a partially modified structure of a re-assembled rotor of an electromagnetic plate after being energized according to the present invention;

fig. 10 is a schematic view of the configuration before and after the change of the facing control change rope in the power-on state in embodiment 2 of the present invention.

The reference numbers in the figures illustrate:

the device comprises a movable template 1, a fixed template 2, an air cylinder 3, a pressure module 4, a packaging disc 5, a transmission movable plate 6, a magnetic rod 61, a limiting rope 62, a sliding block 63, a limiting wing 64, an electromagnetic plate 7, an opposite direction control rope 8, a fixed plate 81, a high-low rope 82, a solid flexible end 821, a hollow end 822, a magnetic auxiliary ball 831, a magnetic movable ball 832, a recombination movable piece 9, a round ball 10, a lower movable piece 11 and an upper movable piece 12.

Detailed Description

The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

please refer to fig. 1, a transmission type chip packaging device, which includes a fixed mold plate 2, a controller is installed on the fixed mold plate 2, the upper end of the fixed mold plate 2 is connected with a movable mold plate 1 through a plurality of cylinders 3, the lower end of the movable mold plate 1 is fixedly connected with a pressure module 4, the upper end of the fixed mold plate 2 is provided with a packaging groove corresponding to the pressure module 4, a glue injection pipe is fixedly penetrated through the movable mold plate 1 and the pressure module 4, the inner wall of the packaging groove is fixedly connected with a packaging tray 5, a transmission magnetic guiding module is arranged in a space enclosed by the packaging groove and the packaging tray 5, the lower end of the pressure module 4 and the mouth of the packaging tray 5 are all arranged at a chamfer angle, and the chamfer angles are matched with each other, the distance between the pressure module 4 and the chip is effectively controlled, and a certain space is provided for a glue packaging layer.

In addition, in the prior art, the space formed between the packaging disc 5 and the die block 4 is vacuumized before glue injection, and in the scheme, technicians can set the vacuumizing assembly as required.

Referring to fig. 2, a rectifying groove is chiseled at the bottom end of the pressing module 4, an opposite direction control variable rope 8 is fixedly connected to the top end of the rectifying groove, a recombined movable piece 9 is fixedly connected to the opening of the rectifying groove, the lower end of the opposite direction control variable rope 8 is fixedly connected to the recombined movable piece 9, the recombined movable piece 9 is of an elastic structure, and the recombined movable piece 9 is in a stretched state, so that after power failure, the recombined movable piece 9 can be restored to a straight state, and further, the opposite direction control variable rope 8 is driven to be restored to an original state, and when the electromagnetic plate 7 is powered on again, the opposite direction control variable rope 8 still can enable the recombined movable piece 9 to deform towards the inside of the sealing layer.

Referring to fig. 3, a chute is drilled at the lower end of the packaging disc 5, ejectors are installed at the left and right ends of the chute, after the electromagnetic plates 7 are powered on, when the plurality of transmission movable plates 6 are gathered, the ejectors can impact the plurality of gathered transmission movable plates 6 to disperse the transmission movable plates, so that the transmission type wave fluctuation deformation of the recombination movable plates 9 is facilitated when the electromagnetic plates 7 are powered on again, the transmission magnetic attraction module comprises a plurality of uniformly distributed transmission movable plates 6 which are connected with the chute in a sliding manner and electromagnetic plates 7 fixedly embedded at the left and right inner bottom ends of the packaging groove, when different electromagnetic plates 7 are powered on, the deformation directions of the recombination movable plates 9 are different, compared with the arrangement of one electromagnetic plate 7, the situation that the recombination movable plates 9 are difficult to deform or have smaller deformation amount at the side far away from the electromagnetic plates 7 is effectively avoided, the redistribution effect of the molten epoxy resin is better, and the upper end portions of the electromagnetic plates 7 correspond to the lower end portions of the transmission movable plates 6, the ejector and the electromagnetic plate 7 are electrically connected with the controller.

Referring to fig. 4, the transmission movable plate 6 includes a magnetic rod 61 corresponding to the electromagnetic plate 7, a sliding block 63 slidably connected to the sliding slot, and a plurality of position-limiting ropes 62 fixedly connected between the magnetic rod 61 and the sliding block 63, along the extending direction of the sliding slot, both ends of the sliding block 63 are fixedly connected with position-limiting wings 64, both the sliding block 63 and the position-limiting wings 64 are elastic structures, the magnetic rod 61 is made of ferromagnetic material, as shown in fig. 8, the electromagnetic plate 7 has magnetism after being energized so as to adsorb the magnetic rod 61 adjacent thereto, then the magnetic rod 61 adsorbs the magnetic rod 61 adjacent thereto, the plurality of transmission movable plates 6 are collected in a transmission manner, so as to gradually increase the action area of the entire magnet, so that the plurality of transmission movable plates 6 gradually generate adsorption force to the plurality of opposite direction-direction control ropes 8 at the upper portion after being collected, as shown in fig. 9, so that the recombination movable plate 9 gradually undulates along the direction away from the energized electromagnetic plate 7, the redistribution effect on the molten epoxy resin is better.

Referring to fig. 5, the opposite direction control variable rope 8 includes a fixed plate 81 with a sliding hole fixedly connected with the top end of the rectifying slot, a high-low rope 82 movably penetrating through the fixed plate 81, and a magnetic auxiliary ball 831 and a moving ball 832 respectively connected to two ends of the high-low rope 82, the magnetic auxiliary ball 831 and the moving ball 832 are both fixedly connected with the recombination moving piece 9, and when receiving magnetic attraction, the moving ball 832 moves down to drive the magnetic auxiliary ball 831 to move up, thereby effectively expanding the longitudinal deformation range of the whole recombination moving piece 9, and making the redistribution effect of the molten epoxy resin better.

As shown in fig. 6-7, the high and low rope 82 includes a solid flexible end 821 and a hollow end 822 fixedly connected to an end of the solid flexible end 821, a ball 10 is placed in the hollow end 822, an end of the ball 10 extends out of the hollow end 822, a limiting groove matching with an end of the ball 10 outside the hollow end 822 is formed at an inner bottom end of the sliding hole, the plurality of balls 10 are disposed so that sliding friction is converted into rolling friction when the high and low rope 82 moves on the fixed plate 81, smoothness of movement is improved, and the high and low rope is not easily damaged, and in addition, the limiting groove prevents the high and low rope 82 from being easily turned over when moving in the sliding hole, thereby effectively ensuring that one end of the hollow end 822 always faces the lower inner wall of the sliding hole, a gap formed between the hollow end 822 and the ball 10 is filled with graphene particles, fine pores are disposed on the hollow end 822, and when the ball 10 is in pressing contact with the sliding hole, the hollow end 822 is subjected to a large deformation force, the graphene particles can be conveniently seeped out along the powder passing micropores, and the high-low ropes 82 and the fixed plate 81 can be lubricated.

Through the setting of opposite direction accuse change rope 8 and transmission magnetism module of drawing, after pouring into melting epoxy into, as figure 8-9, control two electromagnetic plates 7 break-make electricity, make a plurality of opposite direction accuse change rope 8 receive decurrent appeal along the direction of keeping away from circular telegram electromagnetic plate 7 gradually, to the recombinant motion piece 9 production drag power downwards, make its orientation glue seal deformation, to gluing the extrusion force of seam production wavy, make inside space collapse, and force melting epoxy redistribution, and then effectively eliminate the space, compare in prior art, reduce the intraformational void content of gluing the seal after the solidification by a wide margin, effectively guarantee the thermal diffusivity of gluing back chip and the stability when it uses.

Example 2:

referring to fig. 10, a plurality of through holes corresponding to the moving magnetic balls 832 are drilled on the recombinant moving plate 9, a lower moving plate 11 is fixedly connected in the through holes, the lower moving plate 11 is fixedly connected with the moving magnetic balls 832, an upper moving plate 12 is fixedly connected to the outer ends of the auxiliary magnetic balls 831, the edge of the upper moving plate 12 is fixedly connected with the recombinant moving plate 9, the recombinant moving plate 9 is of a hard plate structure, both the lower moving plate 11 and the upper moving plate 12 are of an elastic structure, when the electromagnetic plate 7 is energized, the lower moving plate 11 is deformed downwards, the upper moving plate 12 is deformed upwards, redistribution of the molten epoxy resin is realized, and when the upper moving plate 12 is restored to be deformed during power failure, the auxiliary magnetic balls 831 collide with the hard recombinant moving plate 9, so as to generate a certain vibration force, on one hand, further promote collapse of voids in the molten epoxy resin, reduce the void content in the cured and molded adhesive seal layer, on the other hand, under the action of micro-vibration force, effectively smooths the upper surface of the fused epoxy resin, so that the formed glue sealing layer has better flatness and uniformity.

The remainder of this example is identical to example 1 except for the differences described above.

The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.