Manufacturing method of mica plate with blind holes

文档序号:1791409 发布日期:2021-11-05 浏览:16次 中文

阅读说明:本技术 一种带盲孔云母板的制造方法 (Manufacturing method of mica plate with blind holes ) 是由 潘渡江 吴学领 黎钊 卢智虎 于 2021-07-04 设计创作,主要内容包括:本发明涉及云母材料加工领域,提供一种带盲孔云母板的制造方法,所述制造方法是通过一叠云母纸原材料与另一款带通孔的云母板组合在一起,热压制成带盲孔的云母板。本发明方法简单可靠,适于批量生产,能有效满足市场需求。(The invention relates to the field of mica material processing, and provides a method for manufacturing a mica plate with blind holes. The method is simple and reliable, is suitable for batch production, and can effectively meet market requirements.)

1. A manufacturing method of a mica plate with blind holes is characterized by comprising the following steps:

(1) cutting a large mica paper raw material into a plurality of small-sized mica papers according to the size requirement according to the length and width of the appearance of a mica plate product, and then stacking the mica papers according to the thickness requirement of the mica plate product to form a first mica paper raw material and a second mica paper raw material, wherein the thicknesses of the first mica paper raw material and the second mica paper raw material are determined according to the specification of a finished product;

(2) the second mica paper raw material is hot-pressed by a hot press, the hot-pressing temperature is set between 100 ℃ and 300 ℃, the pressure is set between 0MPa and 40MPa, the hot-pressing time is set between 0.1 hour and 20 hours, and a first mica plate is formed after the hot pressing is finished and is of a plate-shaped structure with a certain thickness, and the thickness is equal to the depth of the blind hole;

(3) machining the first mica plate, manufacturing a through hole by machining according to the shape and the size and the position requirements of the blind hole of the mica plate product, wherein the front projection shape and the position requirements of the through hole are the same as those of the blind hole, and forming a second mica plate with the through hole after machining is finished;

(4) stacking a first mica paper raw material and a single second mica plate according to the size requirement of a mica plate product, putting the mica paper raw material and the single second mica plate into a hot press for hot pressing, wherein the hot pressing temperature is set to be between 100 and 300 ℃, the pressure is set to be between 0 and 40MPa, and the hot pressing time is set to be between 0.1 and 20 hours, and the first mica paper raw material and the second mica plate are hot pressed to form a whole plate, namely the third mica plate with blind holes is obtained;

(5) and processing the appearance of the third mica plate to obtain the required mica plate product with the blind holes.

2. The method for manufacturing the mica plate with the blind holes as set forth in claim 1, wherein: the first mica plate machine processes the mode of making the through-hole and includes punching, laser cutting or milling machine carving.

3. The method for manufacturing the mica plate with the blind holes as set forth in claim 1, wherein: and (4) when hot pressing is carried out in the step (4), processing a third mica plate on a laminated layer by the hot press, or processing a plurality of third mica plates in a flat paving mode.

4. The method for manufacturing the mica plate with the blind holes as set forth in claim 1, wherein: and (4) during hot pressing in the step (4), filling the support into the through hole of the second mica plate for hot pressing, and removing the support after the hot pressing is finished.

Technical Field

The invention relates to the field of mica material processing, in particular to a method for manufacturing a mica plate with blind holes.

Background

At present, a core component of a new energy electric automobile developed in China is a lithium battery pack, a lithium battery can emit a large amount of heat in the working process, and can generate high temperature under extreme conditions to cause potential safety hazards to vehicles and people, so that a mica plate taking mica as a material is often assembled on the surface of the lithium battery. The mica plate is mainly characterized by super high temperature resistance and excellent insulating property. The electric automobile can generate high temperature when working abnormally, and the mica plate can effectively prevent the high temperature from directly acting on a cab and a rear seat of the automobile, so that the sufficient escape time is provided for people in the automobile. At present, the manufacturing industry of mica plates rarely relates to the mica plate with blind holes, and the processing and manufacturing methods are rare, so that the mica plate with the novel structure needs to be researched to meet the changing requirements of the new energy electric automobile market.

Disclosure of Invention

The invention aims to overcome the defects in the prior art, and provides a manufacturing method of a mica plate with blind holes, which is simple and reliable and can effectively meet the production requirements of the market.

The purpose of the invention is realized by the following technical scheme.

A manufacturing method of a mica plate with blind holes comprises the following steps:

(1) cutting a large mica paper raw material into a plurality of small-sized mica papers according to the size requirement according to the length and width of the appearance of a mica plate product, and then stacking the mica papers according to the thickness requirement of the mica plate product to form a first mica paper raw material and a second mica paper raw material, wherein the thicknesses of the first mica paper raw material and the second mica paper raw material are determined according to the specification of a finished product;

(2) the second mica paper raw material is hot-pressed by a hot press, the hot-pressing temperature is set between 100 ℃ and 300 ℃, the pressure is set between 0MPa and 40MPa, the hot-pressing time is set between 0.1 hour and 20 hours, and a first mica plate is formed after the hot pressing is finished and is of a plate-shaped structure with a certain thickness, and the thickness is equal to the depth of the blind hole;

(3) machining the first mica plate, manufacturing a through hole by machining according to the shape and the size and the position requirements of the blind hole of the mica plate product, wherein the front projection shape and the position requirements of the through hole are the same as those of the blind hole, and forming a second mica plate with the through hole after machining is finished;

(4) stacking a first mica paper raw material and a single second mica plate according to the size requirement of a mica plate product, putting the mica paper raw material and the single second mica plate into a hot press for hot pressing, wherein the hot pressing temperature is set to be between 100 and 300 ℃, the pressure is set to be between 0 and 40MPa, and the hot pressing time is set to be between 0.1 and 20 hours, and the first mica paper raw material and the second mica plate are hot pressed to form a whole plate, namely the third mica plate with blind holes is obtained;

(5) and processing the appearance of the third mica plate to obtain the required mica plate product with the blind holes.

In the above technical solution, the first mica board machine is processed to make the through hole by means of punching, laser cutting, milling machine carving, and the like, but not limited to these means (even non-machining means such as chemical etching may be used).

In the above technical scheme, during the hot pressing in the step (4), the hot press may process one third mica plate in one lamination, or process a plurality of third mica plates in a tiled manner, and the hot press may use one lamination at a time, or use a plurality of laminations at a time.

In the above technical scheme, during the hot pressing in the step (4), the support is inserted into the through hole of the second mica plate for hot pressing, so that bulging can be avoided, and the support is removed after the hot pressing is completed.

The manufacturing method of the mica plate with the blind holes, disclosed by the invention, is characterized in that a stack of mica paper raw materials is combined with another mica plate with the through holes, and the mica plate with the blind holes is prepared by hot pressing. The method is simple and reliable, is suitable for batch production, and can effectively meet market requirements.

Drawings

FIG. 1 is a schematic structural diagram of a mica board product with blind holes.

FIG. 2 is a flow chart of the method of the present invention.

FIG. 3 is a schematic view of a second mica paper raw material hot-pressed to form a first mica board.

FIG. 4 is a schematic view of the first mica board being processed to form the second mica board.

FIG. 5 is a schematic view of the first mica paper raw material and the second mica board being hot-pressed to form a third mica board.

FIG. 6 is a schematic view of a third mica board processed to form a mica board product.

Wherein: 1-a first blind hole, 2-a second blind hole, and 3-a third blind hole.

Detailed Description

The present invention will be described in detail with reference to specific examples, but the present invention is not limited to these examples.

As shown in FIG. 1, an example of a structure of a mica board product with blind holes is shown, and the structure comprises three different types of blind holes, and the manufacturing method provided by the method of the invention relates to three types of blind hole models including but not limited to blind holes with any geometric shapes. The thickness of the mica plate product is between 0.2 and 30mm, and the depth of the blind hole is between 0.1 and 29.9 mm.

Examples

As shown in fig. 2, the present embodiment provides a method for manufacturing a mica plate with blind holes, which includes the following steps:

(1) according to the length and width of the appearance of a mica plate product, a large piece of mica paper raw material (the mica paper contains glue which is dried, and the thickness of the mica paper is between 0.01mm and 0.15 mm) is cut into a plurality of small-sized mica paper according to the size requirement, and the size needs to be kept with a proper allowance, so that the appearance can be conveniently cut by a rear machine. Then, according to the thickness requirement of the mica plate product, a plurality of mica paper are stacked to form a first mica paper raw material and a second mica paper raw material, wherein the thicknesses of the first mica paper raw material and the second mica paper raw material can be the same or different, and are specifically determined according to the specification of the mica plate product.

(2) The second mica paper raw material is hot-pressed by a hot press, the hot-pressing temperature is set between 100 ℃ and 300 ℃, the pressure is set between 0MPa and 40MPa, the hot-pressing time is set between 0.1 hour and 20 hours (the hot-pressing time is influenced by the hot-pressing product quantity, the strength of the mica plate and other performance requirements), the first mica plate is formed after the hot pressing is finished, and a plate-shaped structure with a certain thickness is formed, as shown in fig. 3. The thickness of the first mica plate is equal to the depth of the blind hole.

(3) And machining the first mica plate, and manufacturing the through hole by a machining method according to the shape and the size and the position requirements of the blind hole of the finished mica plate, wherein the front projection shape and the position requirements of the through hole are the same as those of the blind hole. The first mica plate machine can be used for making the through holes by means of stamping, laser cutting, milling machine carving and the like, but is not limited to the methods (even non-machining methods such as chemical etching can be used for realizing the through holes). After the machining is completed, a second mica board with through holes is formed, as shown in fig. 4.

(4) The first mica paper raw material and the single second mica plate are stacked together according to the size requirement of the mica plate product, and are put into a hot press for hot pressing, the hot pressing temperature is set between 100 ℃ and 300 ℃, the pressure is set between 0MPa and 40MPa, the hot pressing time is set between 0.1 hour and 20 hours, and the first mica paper raw material and the second mica plate are hot pressed together to form a whole plate, namely a third mica plate, wherein the third mica plate has the shape of blind holes, as shown in figure 5. It should be noted that, during hot pressing, the hot press may process one third mica plate in one lamination, or may process a plurality of third mica plates in a flat laying manner, and the hot press may use one lamination at a time, or may use a plurality of laminations at a time. In addition, the blind holes can bulge due to lack of support during hot pressing, so that supports with matched shapes can be plugged into the through holes of the second mica plate for hot pressing, bulging can be avoided, and the supports can be removed after the hot pressing is finished.

(5) The length and width of the appearance of the hot-pressed third mica plate are larger than those of the finished product, so the appearance of the third mica plate needs to be processed. The third mica plate is processed by machining (including but not limited to punching, laser cutting, milling, and the like) or other processing methods, so as to obtain the mica plate product with the required design, as shown in fig. 6.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the scope of the present invention is not limited thereto, and all equivalent variations made according to the spirit of the present invention should be covered within the scope of the present invention.

Details not described in this specification are within the skill of the art that are well known to those skilled in the art.

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