阅读说明：本技术 一种大尺寸透镜阵列加工及组装方法 (Large-size lens array processing and assembling method ) 是由 杨欢 王强 方亮 张辉 李国俊 周崇喜 于 2021-08-18 设计创作，主要内容包括：本发明涉及一种大尺寸透镜阵列加工及组装方法,该方法包括：(1)选取精抛光的基片作为定位板基板,在基片表面涂布光刻胶；(2)将设计好的掩模板图形通过光刻工艺转移到硅片上；(3)用半导体刻蚀工艺将硅片上的图形刻蚀为相应的孔基板；(4)选取玻璃片作为承载基板,将对准图案沉积在承载基板上；(5)将第(3)步中得到的定位板与承载基板通过对准标记进行对准；(6)将事先加工好的多个透镜,放置入定位板的孔中；(7)在透镜侧面涂布粘接剂,待粘接固化完成后得到透镜阵列。本发明制作的大尺寸透镜阵列,由于有半导体工艺制造的定位板,排布方式灵活,相对位置精度较高,可广泛应用于对透镜阵列位置精度要求较高的成像等领域。(The invention relates to a method for processing and assembling a large-size lens array, which comprises the following steps: (1) selecting a finely polished substrate as a positioning plate substrate, and coating photoresist on the surface of the substrate; (2) transferring the designed mask plate pattern onto a silicon chip through a photoetching process; (3) etching the pattern on the silicon wafer into a corresponding hole substrate by using a semiconductor etching process; (4) selecting a glass sheet as a bearing substrate, and depositing an alignment pattern on the bearing substrate; (5) aligning the positioning plate obtained in the step (3) with the bearing substrate through an alignment mark; (6) placing a plurality of lenses which are processed in advance into holes of a positioning plate; (7) and coating an adhesive on the side surface of the lens, and obtaining the lens array after the bonding and curing are finished. The large-size lens array manufactured by the invention has flexible arrangement mode and higher relative position precision due to the positioning plate manufactured by the semiconductor process, and can be widely applied to the fields of imaging and the like with higher requirements on the position precision of the lens array.)

1. A method for processing and assembling a large-size lens array is characterized by comprising the following steps:

(1) selecting a finely polished substrate as a positioning plate substrate, and coating a layer of photoresist on the surface of the substrate in a spin coating manner;

(2) transferring a designed mask plate pattern onto the substrate through a photoetching process, wherein in the mask plate pattern, the size of an opening of the pattern is equivalent to the overall dimension of the lens, and the arrangement mode is consistent with the expected lens arrangement mode;

(3) etching the pattern on the substrate into corresponding holes by using a semiconductor etching process to form a positioning plate substrate with holes, or obtaining the positioning plate substrate with holes by using a high-precision machining or high-precision laser processing mode;

(4) selecting a finely polished glass sheet as a bearing substrate, and depositing an alignment mark on the bearing substrate in a chromium plating and photoetching process mode;

(5) aligning the positioning plate substrate obtained in the step (3) with the bearing substrate through the alignment mark, and bonding and fixing by using an adhesive;

(6) placing a plurality of lenses which are processed in advance into holes of a positioning plate substrate in a one-to-one correspondence mode according to an expected lens arrangement mode;

(7) and coating an adhesive on the side surface of the lens, and obtaining the lens array after the bonding and curing are finished.

2. The method as claimed in claim 1, wherein the method further comprises: the substrate is made of optical glass, silicon or optical polymer material.

3. The method as claimed in claim 1, wherein the method further comprises: the etching process in the step (3) is Reactive Ion Etching (RIE) or inductively coupled plasma etching (ICP).

4. The method as claimed in claim 1, wherein the method further comprises: and (5) and (7) adopting epoxy glue or ultraviolet curing glue as the adhesive.

5. The method as claimed in claim 1, wherein the method further comprises: in the step (4), depositing the alignment mark on the carrier substrate in a manner of chrome plating plus a photolithography process specifically includes: firstly, making an alignment mark on a bearing substrate by a photoetching process, wherein the size and the position of the alignment mark are consistent with those of a mark on a positioning plate substrate, then plating a layer of chromium on the bearing substrate by a vacuum sputtering process, and finally cleaning patterns except the alignment mark on the bearing substrate by acetone.

Technical Field

The invention relates to a method for processing and assembling a large-size lens array.

Background

In recent years, with the development of integrated optics and illumination optics, a great demand has arisen for lens arrays of various arrangements. The demand of large-size (generally, the diameter of a single lens is more than 1mm) lens arrays is particularly outstanding, and the conventional processing method of the large-size lens arrays at present comprises the following steps: 1. the splicing method can realize a large-area small-F-number lens array, and has the defects of large accumulated error and uncontrollable lens position; 2. the semiconductor etching method can realize a lens array with high position precision, and has the defects that a large-size and small-F-number lens unit cannot be realized; 3. the laser processing method, like the semiconductor etching method, also cannot realize a large-sized, small F-number lens unit.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the defects of the prior art are overcome, and the lens array processing and assembling method which can meet the position precision requirement and can realize large size and small F number is provided.

The technical scheme for solving the technical problems is as follows:

a large-size lens array processing and assembling method comprises the following steps:

(1) selecting a finely polished substrate as a positioning plate substrate, and coating a layer of photoresist on the surface of the substrate in a spin coating manner;

(2) transferring a designed mask plate pattern onto the substrate through a photoetching process, wherein in the mask plate pattern, the size of an opening of the pattern is equivalent to the overall dimension of the lens, and the arrangement mode is consistent with the expected lens arrangement mode;

(3) etching the pattern on the substrate into corresponding holes by using a semiconductor etching process to form a positioning plate substrate with holes, or obtaining the positioning plate substrate with holes by using a high-precision machining or high-precision laser processing mode;

(4) selecting a finely polished glass sheet as a bearing substrate, and depositing an alignment mark on the bearing substrate in a chromium plating and photoetching process mode;

(5) aligning the positioning plate substrate obtained in the step (3) with the bearing substrate through the alignment mark, and bonding and fixing by using an adhesive;

(6) placing a plurality of lenses which are processed in advance into holes of a positioning plate substrate in a one-to-one correspondence mode according to an expected lens arrangement mode;

(7) and coating an adhesive on the side surface of the lens, and obtaining the lens array after the bonding and curing are finished.

Wherein the substrate is made of optical glass, silicon or optical polymer material.

Wherein, the etching process in the step (3) is Reactive Ion Etching (RIE) or inductively coupled plasma etching (ICP).

Wherein, the adhesive in the step (5) and the step (7) is epoxy adhesive or ultraviolet curing adhesive.

In the step (4), depositing the alignment mark on the carrier substrate in a manner of chrome plating plus a photolithography process specifically includes: firstly, making an alignment mark on a bearing substrate by a photoetching process, wherein the size and the position of the alignment mark are consistent with those of a mark on a positioning plate substrate, then plating a layer of chromium on the bearing substrate by a vacuum sputtering process, and finally cleaning patterns except the alignment mark on the bearing substrate by acetone.

Compared with the prior art, the invention mainly has the following advantages:

the invention adopts a method of combining a semiconductor process with a traditional optical processing process, realizes the requirements of the size and the F number of a single lens, and simultaneously realizes the requirement of the position precision of each lens unit in the lens array.

Drawings

FIG. 1 is a schematic view of the bonding assembly of a carrier substrate and a positioning plate according to the present invention;

FIG. 2 is a schematic diagram of a lens array according to the present invention.

Detailed Description

The invention is described in detail below with reference to the figures and the detailed description. The following examples are only illustrative of the present invention, and the scope of the present invention shall include the full contents of the claims.

Example 1: a37-way lens array is manufactured by the method of the invention. FIG. 1 is a schematic view of a bonding assembly of a carrier substrate and a positioning plate according to embodiment 1 of the present invention; fig. 2 is a schematic diagram of the lens array formed by placing each lens into a corresponding hole in the embodiment 1 of the present invention.

The method specifically comprises the following steps:

(1) firstly, selecting a silicon wafer with the size of 30mm multiplied by 30mm and the thickness of 1mm as a substrate of a positioning plate, and spin-coating a layer of photoresist by using a spin coater;

(2) transferring the designed mask plate pattern onto a silicon wafer through a photoetching process, wherein the size of the pattern opening is phi 3mm, the hole interval is 3.1mm multiplied by 3.1mm, and the arrangement mode is shown in the attached drawing 1;

(3) etching the pattern on the silicon wafer into a corresponding positioning plate by using Inductively Coupled Plasma (ICP), as shown in the upper right of FIG. 1;

(4) selecting a finely polished quartz plate as a bearing substrate, wherein the diameter of the quartz plate is 50mm, the thickness of the quartz plate is 2mm, firstly making an alignment mark on the quartz plate by a photoetching process, the size and the position of the mark are consistent with those of the mark on a positioning plate, then plating a layer of chromium with the thickness of 100nm by using a vacuum sputtering process, and finally cleaning patterns except the alignment mark by using organic solvents such as acetone;

(5) aligning the positioning plate obtained in the step (3) with the bearing substrate through an alignment mark, and bonding and fixing the positioning plate and the bearing substrate by using ultraviolet curing glue, as shown in fig. 1;

(6) processing 37 lenses in an optical cold processing mode, wherein the diameter of the lenses is 2.95mm, the focal length of the lenses is 10mm, and placing the lenses into holes of a positioning plate in a one-to-one correspondence mode according to a desired arrangement mode;

(7) and coating epoxy glue on the side surface of each lens, and waiting for 24 hours to cure to obtain the lens array.

The invention adopts a method of combining a semiconductor process with a traditional optical processing process, realizes the requirements of the size and the F number of a single lens, and simultaneously realizes the requirement of the position precision of each lens unit in the lens array.

The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can understand that the modifications or substitutions within the technical scope of the present invention are included in the scope of the present invention.