阅读说明：本技术 一种高速多功能自动贴片方法 (High-speed multifunctional automatic chip mounting method ) 是由 周虎雄 于 2021-08-05 设计创作，主要内容包括：本发明提供一种高速多功能自动贴片设备,包括底座,贴片机主体,支撑块,输送机构,倒U型支架,移动贴装头机构,缓存盒,推动杆,对应板和手持杆；高速多功能自动贴片方法的具体步骤如下；整理材料和工件,调整好设备进行材料输送,使需要贴装的材料对应进行贴装,进行贴片后的工件降温和进行收集和移动。本发明在进行贴装的过程中,通过输送机构4上端后面设置的风力降温设备,对输送机构4带动的贴装后的工件进行风力降温工作,方便在使用的过程中进行降温工作,增加降温功能。(The invention provides high-speed multifunctional automatic chip mounting equipment which comprises a base, a chip mounter main body, a supporting block, a conveying mechanism, an inverted U-shaped support, a movable chip mounting head mechanism, a cache box, a pushing rod, a corresponding plate and a handheld rod, wherein the supporting block is arranged on the base; the high-speed multifunctional automatic surface mounting method comprises the following specific steps; arranging materials and workpieces, adjusting equipment to carry out material conveying, correspondingly mounting the materials to be mounted, cooling the workpieces subjected to mounting, collecting and moving the workpieces. In the mounting process, the mounted workpiece driven by the conveying mechanism 4 is subjected to wind cooling through the wind cooling equipment arranged behind the upper end of the conveying mechanism 4, so that the cooling operation is conveniently carried out in the using process, and the cooling function is increased.)

1. A high-speed multifunctional automatic patch method is characterized by comprising the following specific steps;

the method comprises the following steps: arranging materials and workpieces, arranging the materials used for mounting, placing accessories in the mounting process in the cache box 7, pushing the corresponding plate 9 to move, and enabling the accessories to be in order;

step two: adjusting equipment to convey materials, placing the arranged materials at the upper end of the conveying mechanism 4 to convey the materials, and simultaneously enabling the movable mounting head mechanism 6 to move accessories inside the cache box 7 to the upper end of the materials;

step three: correspondingly mounting the materials to be mounted, well corresponding the materials to the accessories, and then heating the positions where the materials are connected with the accessories for mounting;

step four: cooling the pasted workpiece, selecting proper cooling equipment, and installing the equipment at a proper position behind the upper end of the conveying mechanism 4, so that the cooling equipment cools the pasted workpiece, and selecting the proper pasted workpiece for observation and detection;

step five: the automatic mounting machine is used for collecting and moving mounted workpieces, collecting the mounted workpieces, and then arranging and moving the workpieces to complete multifunctional automatic mounting work.

2. A high-speed multi-function automatic sheet attaching method according to claim 1, wherein in said first step, the material correspondence is performed, the material is moved to a position where the lower end of the head attaching mechanism 6 is moved, and then the attachment is moved to a position where the upper end of the material is moved by moving the head attaching mechanism 6.

3. A high-speed multi-functional automatic die bonding method according to claim 1, wherein in the second step, the material connection position is heated, and after the material is attached, the die bonder main body 2 is heated to the position corresponding to the material, and the die bonder head mechanism 6 is moved to perform the residual heat operation to the position corresponding to the attachment.

4. A high-speed multifunctional automatic sheet attaching method according to claim 1, wherein in the third step, the attachment is completed by butting the material, pushing the attachment to move by moving the attaching head mechanism 6, and then bringing the attachment into contact with the material while performing fusion work on the contact position.

5. A high-speed multifunctional automatic patch attaching method according to claim 1, wherein in the first step, the attached material is conveyed, and the attached workpiece is moved by the conveying mechanism 4.

6. A high-speed multifunctional automatic patch attaching method as claimed in claim 1, wherein in the second step, a cooling mechanism is fixed at a proper position at the upper end of the conveying device, and before work, a wind cooling device at a proper position is selected to be installed at a proper position behind the upper end of the conveying device 4, so that the work piece can be cooled conveniently after being attached.

7. A high-speed multifunctional automatic patch attaching method according to claim 1, wherein in the third step, the cooling mechanism is operated to cool the workpiece, and in operation, the cooling device is operated to drive the attached workpiece to start moving through the conveying mechanism 4 and pass through the lower end of the cooling device, so as to facilitate cooling of the attached workpiece.

Technical Field

The invention belongs to the technical field of chip mounting equipment, and particularly relates to a high-speed multifunctional automatic chip mounting method.

Background

A chip mounter, also called a mounter or a surface mounting system, is a device configured behind a dispensing machine or a screen printer in a production line to accurately place surface mounted components on a PCB pad by moving a mounting head, and the chip mounter is an automatic chip mounting device used in SMT production.

However, the existing patch method has the problems that the material arrangement work is inconvenient to carry out in the use process, the cooling work after the patch is inconvenient to carry out in the use process and the collection and arrangement are inconvenient to carry out in the use process.

Therefore, it is necessary to invent a high-speed multifunctional automatic patch method.

Disclosure of Invention

In order to solve the technical problems, the invention provides a high-speed multifunctional automatic patch attaching method, which aims to solve the problems that the conventional patch attaching method is inconvenient to carry out material arrangement work in the using process, is inconvenient to carry out cooling work after patch attachment in the using process and is inconvenient to carry out collection and arrangement in the using process.

A high-speed multifunctional automatic chip mounting device comprises a base 1, a chip mounter main body 2, a supporting block 3, a conveying mechanism 4, an inverted U-shaped support 5, a movable chip mounting head mechanism 6, a cache box 7, a pushing rod 8, a corresponding plate 9 and a handheld rod 10, wherein the chip mounter main body 2 is in bolted connection with the middle position of the upper end of the base 1; the lower ends of the supporting blocks 3 are respectively bolted to the front of the left side of the middle position of the upper end of the base 1 and the back of the left side of the middle position of the upper end of the base 1; the upper end of the supporting block 3 is respectively connected with the front of the lower end and the back of the lower end of the conveying mechanism 4 through bolts; the lower end of the inverted U-shaped bracket 5 is respectively bolted at the middle positions of the left side and the right side of the upper end of the chip mounter main body 2; the movable mounting head mechanism 6 is arranged on the outer wall of the upper end of the inverted U-shaped bracket 5; the buffer box 7 is connected to the middle position of the right side of the upper end of the chip mounter main body 2 through a bolt; the push rod 8 penetrates through the middle position of the right side of the cache box 7; the left end of the push rod 8 is connected with the middle position inside the right side of the corresponding plate 9 in a shaft mode; the left end of the push rod 8 is connected with the middle position of the left side of the handheld rod 10 through a bolt.

The high-speed multifunctional automatic paster method specifically comprises the following steps:

the method comprises the following steps: arranging materials and workpieces, arranging the materials used for mounting, placing accessories in the mounting process in the cache box 7, pushing the corresponding plate 9 to move, and enabling the accessories to be in order;

step two: adjusting equipment to convey materials, placing the arranged materials at the upper end of the conveying mechanism 4 to convey the materials, and simultaneously enabling the movable mounting head mechanism 6 to move accessories inside the cache box 7 to the upper end of the materials;

step three: correspondingly mounting the materials to be mounted, well corresponding the materials to the accessories, and then heating the positions where the materials are connected with the accessories for mounting;

in the third step: correspondingly mounting the materials to be mounted, wherein in the first step, the materials are correspondingly mounted, the materials are moved to a proper position at the lower end of the movable mounting head mechanism 6, and then the accessories are moved to a proper position at the upper end of the materials by moving the mounting head mechanism 6;

secondly, heating the material connecting position, heating the position corresponding to the material by the chip mounter main body 2 after the material is corresponding to the material, and performing waste heat work on the position corresponding to the accessory by moving the mounting head mechanism 6;

thirdly, butting materials, pushing the accessories to move by moving the mounting head mechanism 6, then enabling the accessories to be in contact with the materials, and simultaneously carrying out fusion work on contact positions to finish mounting work;

step four: cooling the pasted workpiece, selecting proper cooling equipment, and installing the equipment at a proper position behind the upper end of the conveying mechanism 4, so that the cooling equipment cools the pasted workpiece, and selecting the proper pasted workpiece for observation and detection;

in the fourth step: cooling the pasted workpiece, and in the first step, conveying the pasted material, and moving the pasted workpiece through a conveying mechanism 4;

secondly, fixing a cooling mechanism at a proper position at the upper end of the conveying device, and selecting a proper position wind power cooling device to be installed at a proper position behind the upper end of the conveying device 4 before work, so that the work piece can be conveniently cooled after mounting;

thirdly, enabling the cooling mechanism to work to cool the workpiece, enabling the cooling equipment to start working in the working process, driving the mounted workpiece to start moving through the conveying mechanism 4, and enabling the mounted workpiece to pass through the lower end of the cooling equipment, so that the mounted workpiece is conveniently cooled;

fourthly, observing and sorting the cooled workpieces, and sampling and observing the mounted workpieces in the cooling process to finish the work;

step five: the automatic mounting machine is used for collecting and moving mounted workpieces, collecting the mounted workpieces, and then arranging and moving the workpieces to complete multifunctional automatic mounting work.

Preferably, in the fourth step, the installed cooling equipment adopts wind power cooling equipment, and wind power adjustable wind power cooling equipment is selected.

Preferably, in the first step, the left side of the corresponding plate 9 is glued with a silica gel pad, so that the protection work can be conveniently carried out in the process of corresponding to the workpiece, and the attachment is prevented from being damaged to influence the work mounting work.

Preferably, in the second step, the movable mounting head mechanism 6 is connected with a suction moving mechanism, so that the accessory can be conveniently adsorbed and moved in the accessory taking process.

Compared with the prior art, the invention has the beneficial effects that:

in the invention, in the mounting process, the accessories are placed in the cache box 7, and then the corresponding plate 9 is pushed, so that the corresponding plate 9 is in contact with the left side of the accessories, the accessories can be conveniently aligned in the process of working, and the mounting quality is prevented from being influenced by the deflection of the accessories in the mounting process; in the mounting process, the mounted workpiece driven by the conveying mechanism 4 is subjected to wind cooling through the wind cooling equipment arranged behind the upper end of the conveying mechanism 4, so that the cooling work in the use process is facilitated, and the cooling function is increased; then, arranging and storing equipment is arranged at the rear end of the conveying mechanism 4 in the using process, so that work piece arrangement and transportation work can be conveniently carried out after mounting.

Drawings

Fig. 1 is a schematic structural view of the present invention.

Fig. 2 is a flow chart of an automated patch method.

Fig. 3 is a flow chart of the docking material.

Fig. 4 is a flow chart of cooling the workpiece after the mounting.

In the figure: 1. a base; 2. a chip mounter main body; 3. a support block; 4. a conveying mechanism; 5. an inverted U-shaped bracket; 6. a moving mounting head mechanism; 7. a cache box; 8. a push rod; 9. a corresponding plate; 10. the rod is held in the hand.

Detailed Description

The invention is described in detail with reference to the accompanying drawings, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, the high-speed multifunctional automatic chip mounter comprises a base 1, a chip mounter main body 2, a supporting block 3, a conveying mechanism 4, an inverted U-shaped bracket 5, a movable mounting head mechanism 6, a buffer memory box 7, a push rod 8, a corresponding plate 9 and a handheld rod 10, wherein the chip mounter main body 2 is connected to the middle position of the upper end of the base 1 through a bolt; the lower ends of the supporting blocks 3 are respectively bolted to the front of the left side of the middle position of the upper end of the base 1 and the back of the left side of the middle position of the upper end of the base 1; the upper end of the supporting block 3 is respectively connected with the front of the lower end and the back of the lower end of the conveying mechanism 4 through bolts; the lower end of the inverted U-shaped bracket 5 is respectively bolted at the middle positions of the left side and the right side of the upper end of the chip mounter main body 2; the movable mounting head mechanism 6 is arranged on the outer wall of the upper end of the inverted U-shaped bracket 5; the buffer box 7 is connected to the middle position of the right side of the upper end of the chip mounter main body 2 through a bolt; the push rod 8 penetrates through the middle position of the right side of the cache box 7; the left end of the push rod 8 is connected with the middle position inside the right side of the corresponding plate 9 in a shaft mode; the left end of the push rod 8 is connected with the middle position of the left side of the handheld rod 10 through a bolt.

The high-speed multifunctional automatic paster method specifically comprises the following steps:

s101: arranging materials and workpieces, arranging the materials used for mounting, placing accessories in the mounting process in the cache box 7, pushing the corresponding plate 9 to move, and enabling the accessories to be in order;

s102: adjusting equipment to convey materials, placing the arranged materials at the upper end of the conveying mechanism 4 to convey the materials, and simultaneously enabling the movable mounting head mechanism 6 to move accessories inside the cache box 7 to the upper end of the materials;

s103: correspondingly mounting the materials to be mounted, well corresponding the materials to the accessories, and then heating the positions where the materials are connected with the accessories for mounting;

s301: correspondingly mounting the materials to be mounted, wherein in the first step, the materials are correspondingly mounted, the materials are moved to a proper position at the lower end of the movable mounting head mechanism 6, and then the accessories are moved to a proper position at the upper end of the materials by moving the mounting head mechanism 6;

s302, heating the material connecting position, heating the position corresponding to the material by the chip mounter main body 2 after the material is corresponded, and performing waste heat work on the position corresponding to the accessory by moving the mounting head mechanism 6;

s303, butting materials, pushing the accessory to move by moving the mounting head mechanism 6, then contacting the accessory with the materials, and simultaneously fusing contact positions to finish mounting work;

s104: cooling the pasted workpiece, selecting proper cooling equipment, and installing the equipment at a proper position behind the upper end of the conveying mechanism 4, so that the cooling equipment cools the pasted workpiece, and selecting the proper pasted workpiece for observation and detection;

s401: cooling the pasted workpiece, and in the first step, conveying the pasted material, and moving the pasted workpiece through a conveying mechanism 4;

s402, fixing a cooling mechanism at a proper position at the upper end of the conveying device, and selecting a proper position wind power cooling device to be installed at a proper position behind the upper end of the conveying device 4 before work, so that the work piece can be conveniently cooled after mounting;

s403, enabling the cooling mechanism to work to cool the workpiece, enabling the cooling equipment to work in the work, driving the mounted workpiece to start moving through the conveying mechanism 4, and enabling the mounted workpiece to pass through the lower end of the cooling equipment, so that the mounted workpiece is conveniently cooled;

s404, observing and sorting the cooled workpieces, sampling and observing the mounted workpieces in the cooling process, and further finishing the work;

s105: the automatic mounting machine is used for collecting and moving mounted workpieces, collecting the mounted workpieces, and then arranging and moving the workpieces to complete multifunctional automatic mounting work.

Principle of operation

In the invention, when the automatic surface mounting machine works, the base 1 is fixed at a proper position, then an external power supply and control equipment are connected by using an external lead, then accessories are placed in the cache box 7, accessory alignment work is carried out, materials are placed at the upper end of the conveying mechanism 4, the conveying mechanism 4 drives the materials to move, then the attaching head mechanism 6 is moved to drive the accessories to move to the upper end of the materials for attaching, after attaching, the workpieces are cooled by the wind cooling mechanism arranged behind the upper end of the conveying mechanism 4, and then the conveying mechanism 4 drives the materials to move to the inside of the finishing device, thereby completing the automatic surface mounting work.

The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention.