阅读说明：本技术 电子设备、拍摄装置以及移动体 (Electronic apparatus, imaging device, and moving object ) 是由 安部弘行 于 2020-03-12 设计创作，主要内容包括：电子设备具有第一基板、第二基板、第一金属板材、以及第二金属板材。第一基板以及第二基板搭载电子部件并以主面相互对置的方式朝向层叠方向配置。第一金属板材具有介于第一基板和第二基板之间并且与第一基板以及第二基板各自所搭载的电子部件直接或间接地抵接的平板部、以及覆盖第一基板的侧面的一部分的第一遮蔽部。第二金属板材具有覆盖第二基板的侧面整周和从第一金属板材露出的第一基板的侧面的第二遮蔽部。第一金属板材和第二金属板材直接或间接地抵接。(The electronic device is provided with a first substrate, a second substrate, a first metal plate and a second metal plate. The first substrate and the second substrate are mounted with electronic components and arranged with their principal surfaces facing each other in the stacking direction. The first metal plate material has a flat plate portion that is interposed between the first substrate and the second substrate and that directly or indirectly contacts electronic components mounted on the first substrate and the second substrate, and a first shielding portion that covers a part of a side surface of the first substrate. The second metal plate has a second shielding part covering the entire periphery of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate. The first metal plate material and the second metal plate material are directly or indirectly abutted.)

1. An electronic device having:

a first substrate and a second substrate on which electronic components are mounted and which are arranged in a stacking direction with principal surfaces facing each other;

a first metal plate material having a flat plate portion interposed between the first substrate and the second substrate and directly or indirectly abutting the electronic component mounted on each of the first substrate and the second substrate, and a first shielding portion covering a part of a side surface of the first substrate; and

a second metal plate member having a second shielding portion covering the entire periphery of a side surface of the second substrate and a side surface of the first substrate exposed from the first metal plate member,

the first metal plate material and the second metal plate material are directly or indirectly abutted.

2. The electronic device of claim 1,

the second metal plate has at least one detent,

the first metal plate material and the second metal plate material are directly abutted by the engaging portion.

3. The electronic device of claim 2,

the second metal plate material has a gap in a circumferential direction of the second base plate,

the two locking portions are adjacent to each other with the gap therebetween.

4. The electronic device of any of claims 1-3,

the first substrate and the second substrate are connected by a flexible substrate,

the flexible substrate is covered with the second shielding portion when viewed from a direction perpendicular to the stacking direction.

5. The electronic device of any of claims 1-4,

the first substrate has an imaging element as the electronic component on a side opposite to a surface facing the flat plate portion.

6. A photographing apparatus has:

a first substrate and a second substrate on which electronic components are mounted and which are arranged in a stacking direction with principal surfaces facing each other;

a first metal plate material having a flat plate portion interposed between the first substrate and the second substrate and directly or indirectly abutting the electronic component mounted on each of the first substrate and the second substrate, and a first shielding portion covering a part of a side surface of the first substrate; and

a second metal plate member having a second shielding portion covering the entire periphery of a side surface of the second substrate and a side surface of the first substrate exposed from the first metal plate member,

the first metal plate material and the second metal plate material are directly or indirectly abutted.

7. A moving body on which the imaging device according to claim 6 is mounted.

Technical Field

The present disclosure relates to an electronic apparatus, an imaging device, and a moving object.

Background

In an electronic apparatus such as an in-vehicle camera, it is required to perform various processes with a small size and at a high speed. As the circuit board is multilayered and highly integrated for miniaturization, radiation noise and heat generation of the electronic device of the circuit board increase. Therefore, the following structure is proposed: the circuit board is covered with a shield member over the entire side surface thereof, and is brought into contact with a heat conductive member formed of a soft material such as silicone gel (see patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese patent application laid-open No. 2011-259101.

Disclosure of Invention

In order to solve the above problems, an electronic device according to a first aspect includes:

a first substrate and a second substrate on which electronic components are mounted and which are arranged in a stacking direction with principal surfaces facing each other;

a first metal plate material having a flat plate portion interposed between the first substrate and the second substrate and directly or indirectly abutting the electronic component mounted on each of the first substrate and the second substrate, and a first shielding portion covering a part of a side surface of the first substrate; and

a second metal plate member having a second shielding portion covering the entire periphery of a side surface of the second substrate and a side surface of the first substrate exposed from the first metal plate member,

the first metal plate material and the second metal plate material are directly or indirectly abutted.

In addition, an imaging apparatus according to a second aspect includes:

a first substrate and a second substrate on which electronic components are mounted and which are arranged in a stacking direction with principal surfaces facing each other;

a first metal plate material having a flat plate portion interposed between the first substrate and the second substrate and directly or indirectly abutting the electronic component mounted on each of the first substrate and the second substrate, and a first shielding portion covering a part of a side surface of the first substrate; and

a second metal plate member having a second shielding portion covering the entire periphery of a side surface of the second substrate and a side surface of the first substrate exposed from the first metal plate member,

the first metal plate material and the second metal plate material are directly or indirectly abutted.

In addition, a moving object according to a third aspect is mounted with an imaging device, the imaging device including:

a first substrate and a second substrate on which electronic components are mounted and which are arranged in a stacking direction with principal surfaces facing each other;

a first metal plate material having a flat plate portion interposed between the first substrate and the second substrate and directly or indirectly abutting the electronic component mounted on each of the first substrate and the second substrate, and a first shielding portion covering a part of a side surface of the first substrate; and

a second metal plate member having a second shielding portion covering the entire periphery of a side surface of the second substrate and a side surface of the first substrate exposed from the first metal plate member,

the first metal plate material and the second metal plate material are directly or indirectly abutted.

Drawings

Fig. 1 is a layout diagram showing a mounting position of an electronic apparatus according to a first embodiment on a mobile object.

Fig. 2 is a cross-sectional view showing a schematic configuration of the electronic apparatus of fig. 1, the cross-sectional view being cut so as to pass through an optical axis of the photographing optical system.

Fig. 3 is a cross-sectional view of the electronic apparatus of fig. 1 rotated by 90 ° about the optical axis from the cross-section of fig. 2.

Fig. 4 is a front perspective view showing the appearance of the first substrate and the second substrate of fig. 2 and 3.

Fig. 5 is a rear perspective view showing the appearance of the first substrate and the second substrate of fig. 2 and 3.

Fig. 6 is a perspective view showing an appearance of the first metal plate material of fig. 2 and 3.

Fig. 7 is a plan expanded view of the first metal plate material of fig. 6.

Fig. 8 is a perspective view showing an appearance of the second metal plate material of fig. 2 and 3.

Fig. 9 is a plan expanded view of the second metal plate material of fig. 8.

Fig. 10 is a perspective view showing an external appearance of the first housing of fig. 2 and 3.

Fig. 11 is a perspective view showing an external appearance of the second housing of fig. 2 and 3.

Fig. 12 is a view showing a method of manufacturing the electronic device of fig. 2 and 3, and showing a process of assembling the third metal plate material and the imaging element cover to the imaging optical system.

Fig. 13 is a diagram showing a method of manufacturing the electronic device of fig. 2 and 3, and showing a step of assembling the first substrate to the imaging optical system.

Fig. 14 is a view showing a method of manufacturing the electronic device of fig. 2 and 3, and showing another step of assembling the first substrate and the second substrate to the first metal plate material.

Fig. 15 is a diagram showing a method of manufacturing the electronic device of fig. 2 and 3, and showing still another step of assembling the first substrate and the second substrate to the first metal plate material.

Fig. 16 is a view showing a method of manufacturing the electronic device of fig. 2 and 3, and showing a step of assembling the second metal plate member to the first metal plate member.

Fig. 17 is a perspective view showing an external appearance of an internal structure of the electronic device of fig. 2 and 3.

Fig. 18 is a perspective view showing an external appearance of another internal structure of the electronic apparatus according to the second embodiment.

Fig. 19 is a perspective view showing an appearance of the first metal plate material included in the internal structure of fig. 18.

Fig. 20 is a perspective view showing an appearance of the first metal plate material of fig. 19 viewed from a different angle from that of fig. 19.

Fig. 21 is a plan expanded view of the first metal sheet of fig. 19.

Fig. 22 is a perspective view showing an appearance of the second metal plate material included in the internal structure of fig. 18.

Fig. 23 is a plan expanded view of the second metal plate material of fig. 22.

Fig. 24 is a view showing a method of manufacturing the internal structure of fig. 18, and is a view showing a step of assembling the first metal plate material to the first substrate.

Fig. 25 is a view showing a state in which the first metal plate material shown in fig. 24 is assembled to the first substrate.

Fig. 26 is a view showing a method of manufacturing the internal structure of fig. 18, and is a view showing a step of assembling the second substrate to the imaging optical system.

Detailed Description

In electronic equipment, shielding against radiation noise and further improvement in heat dissipation with a compact structure are required. An object of the present disclosure is to provide an electronic device, an imaging apparatus, and a moving object that have shielding properties against radiation noise and further improve heat dissipation properties with a simple structure.

Hereinafter, an electronic apparatus, an imaging device, and a moving object according to a first embodiment of the present disclosure will be described with reference to the drawings.

Specifically, the electronic device according to the first embodiment is, for example, an imaging apparatus. As shown in fig. 1, an electronic device 10 applied to the imaging apparatus of the first embodiment is mounted on a mobile body 11, for example.

The mobile body 11 may include, for example, a vehicle, a ship, an airplane, and the like. The vehicle may include, for example, an automobile, an industrial vehicle, a railway vehicle, a living vehicle, a fixed-wing aircraft running on a runway, and the like. Automobiles may include, for example, passenger cars, trucks, buses, motorcycles, and trackless buses, among others. Industrial vehicles may include, for example, agricultural-oriented and construction-oriented industrial vehicles, and the like. Industrial vehicles may include, for example, fork lift trucks, golf carts, and the like. Agricultural-oriented industrial vehicles may include, for example, tractors, tillers, transplanters, harvesting binders, combines, mowers, and the like. Construction-oriented industrial vehicles may include, for example, dozers, power shovels, forklifts, cranes, dumpers, road rollers, and the like. The vehicle may comprise a human powered vehicle. The classification of the vehicle is not limited to the above. For example, an automobile may include an industrial vehicle capable of traveling on a road. The multiple categories may include the same vehicle. Vessels may include, for example, marine jets, boats, and tankers, among others. The aircraft may include, for example, fixed-wing aircraft, rotary-wing aircraft, and the like.

As shown in fig. 2 and 3, the electronic device 10 includes a first substrate 12, a second substrate 13, a first metal plate material 14, and a second metal plate material 15. The electronic apparatus 10 may further include a photographing optical system 16, a first housing 17, and a second housing 18.

As shown in fig. 4 and 5, the first substrate 12 is flat. The first substrate 12 may be substantially rectangular. As shown in fig. 2 and 3, the first substrate 12 is provided with an imaging element 19 as an electronic component on the side opposite to the surface facing the flat plate portion 23 described later. The imaging element 19 is, for example, a ccd (charge Coupled device) image sensor or a cmos (complementary Metal Oxide semiconductor) image sensor, and generates an image signal by imaging an optical image formed on a light receiving surface. The first substrate 12 has electronic components 20 mounted on at least one principal surface. The electronic component 20 drives the imaging element 19 or processes an image signal generated by the imaging element 19.

As shown in fig. 4 and 5, the second substrate 13 is flat. The second substrate 13 may be substantially rectangular. The second substrate 13 has electronic components 20 mounted on at least one main surface. The electronic component 20 drives the imaging element 19 or processes an image signal generated by the imaging element 19. The second substrate 13 may be provided with a first connector 21 on one main surface thereof for electrical connection with the second housing 18.

The first substrate 12 may be electrically connected to the second substrate 13 through the flexible substrate 22. As shown in fig. 4, the imaging element 19 of the first substrate 12 and the first connector 21 of the second substrate 13 can be mounted on the same main surface in a state where the entire flexible substrate 22 is extended in a flat plate shape.

As shown in fig. 2 and 3, in the electronic device 10, the first substrate 12 and the second substrate 13 are arranged in the stacking direction such that their main surfaces face each other.

As shown in fig. 6, the first metal plate 14 includes a flat plate portion 23 and a first shielding portion 24.

The flat plate portion 23 is flat. The flat plate portion 23 may be substantially rectangular and wider than the first substrate 12 and the second substrate 13. As shown in fig. 2 and 3, in the electronic apparatus 10, the flat plate portion 23 is interposed between the first substrate 12 and the second substrate 13 in the stacking direction. In the electronic device 10, the main surface of the flat plate portion 23 is substantially parallel to the main surfaces of the first substrate 12 and the second substrate 13.

As shown in fig. 6, the flat plate portion 23 has an opening 25 in the vicinity of the side connected to the first shielding portion 24. The opening 25 may be substantially rectangular. As shown in fig. 2, in the electronic device 10, the opening 25 is locked to the two locking portions 33 of the second metal plate material 15.

In the electronic device 10, the flat plate portion 23 directly or indirectly contacts the electronic component 20 mounted on each of the first substrate 12 and the second substrate 13. In the electronic device 10, the flat plate portion 23 is indirectly in contact with the imaging element 19 as an electronic component via the heat sink 27 and the first substrate 12, for example. In the electronic device 10, the flat plate portion 23 is indirectly in contact with the electronic component 20 mounted on the second substrate 13 via the heat sink 27, for example. The heat sink 27 may be formed of a soft material having shape-following properties and relatively high thermal conductivity, such as silicone rubber containing a filler.

As shown in fig. 6, the first shielding portion 24 is erected along a part of the outer edge of the flat plate portion 23 on the main surface side of the flat plate portion 23 facing the first substrate 12. For example, the first shielding portion 24 is provided upright along the entire one side of the flat plate portion 23 and a part of both sides sandwiching the one side. As shown in fig. 2 and 3, in the electronic apparatus 10, the first shielding portion 24 covers a part of the side surface of the first substrate 12.

As shown in fig. 6, the first shielding portion 24 has a first fixing portion 26. In the present embodiment, the first shielding portion 24 has a first fixing portion 26 at a substantially central portion of a side facing a side connected to the flat plate portion 23. As shown in fig. 2 and 3, the first metal plate member 14 is fixed to the lens barrel 16A accommodating the photographing optical system 16 by the first fixing portion 26. The first fixing portion 26 is fixed to the lens barrel 16A of the photographing optical system 16 by, for example, engagement, but is not limited thereto, and welding, adhesion by an adhesive, fastening by screw fastening, or the like may be applied.

The first metal plate material 14 is formed by bending a predetermined portion of a metal plate material, in other words, a metallic flat plate having a desired shape as shown in fig. 7. In fig. 7, a straight line curved to the front side is indicated by a broken line, and a straight line curved to the back side is indicated by a one-dot chain line. Therefore, by stretching the bent portion of the first metal plate member 14 to be planar, any portions of the first metal plate member 14 do not interfere with each other and are separated from each other. The first metal plate material 14 may be formed of a metal having high thermal conductivity, such as copper.

As shown in fig. 8, the second metal plate material 15 has a second shielding portion 28.

The second shielding portion 28 has a substantially rectangular square tubular shape, and one side of the rectangle in the axial cross section and a part of both sides sandwiching the one side protrude in the axial direction in a C-shape. That is, the second shielding portion 28 includes a substantially rectangular, square-cylindrical full shielding portion 30 and a square-cylindrical partial shielding portion 29 in which a part of the circumferential direction is cut away continuously from the full shielding portion 30 in the axial direction. As shown in fig. 2 and 3, in the electronic device 10, the second metal plate member 15 covers the entire periphery of the side surface of the second substrate 13 and the side surface of the first substrate 12 exposed from the first metal plate member 14. In this structure, the full shield portion 30 covers the entire circumference of the side surface of the second substrate 13. In addition, the partial shielding portion 29 covers the side surface of the first substrate 12 exposed from the first metal plate material 14.

As shown in fig. 8, the second shielding portion 28 has a second fixing portion 31 at an end portion on the axial direction side of the partial shielding portion 29. That is, the second shielding portion 28 has a second fixing portion 31 at an edge portion of the partial shielding portion 29 opposite to the direction in which the full shielding portion 30 continues. In the present embodiment, the second fixing portion 31 is disposed on a surface sandwiched by the other two surfaces among the three surfaces of the partial shielding portion 29. As shown in fig. 2, the second metal plate material 15 is fixed to the lens barrel 16A accommodating the photographing optical system 16 by the second fixing portion 31. The second fixing portion 31 is fixed to the lens barrel 16A of the photographing optical system 16 by, for example, engagement, but is not limited thereto, and welding, adhesion by an adhesive, fastening by screw fastening, or the like may be applied.

As shown in fig. 8, the full shield portion 30 of the second shield portion 28 has a gap 32 in the circumferential direction. The gap 32 is a gap between ends at which the end portions of the flat metal plate material face each other when the second metal plate material 15 is formed by bending the flat metal plate material. The full-shielding portion 30 of the second shielding portion 28 has two locking portions 33 adjacent to each other with the gap 32 therebetween in the vicinity of the gap 32. The two locking portions 33 are located at the axial end of the full shield portion 30. As shown in fig. 2, in the electronic device 10, the two locking portions 33 are locked to the opening 25 of the first metal plate member 14.

As shown in fig. 8, in the second shielding portion 28, the second fixing portion 31 and the two locking portions 33 are provided on surfaces facing each other. Thus, as shown in fig. 2, when the first metal plate member 14 and the second metal plate member 15 are attached to the electronic apparatus 10, the first fixing portion 26 of the first metal plate member 14 and the second fixing portion 31 of the second metal plate member 15 sandwich the lens barrel 16A accommodating the photographing optical system 16 from two directions perpendicular to the optical axis.

The second metal plate member 15 is formed by bending a predetermined portion of a metal plate member, in other words, a metallic flat plate having a desired shape as shown in fig. 9. In fig. 9, a straight line curved to the front surface side is indicated by a broken line, and a straight line curved to the back surface side is indicated by a one-dot chain line. Therefore, by stretching the bent portion of the second metal plate member 15 to be planar, any portions of the second metal plate member 15 do not interfere with each other and are separated. The second metal plate material 15 may be formed of a metal having high thermal conductivity, such as copper.

The imaging optical system 16 is constituted by optical elements such as lenses. The imaging optical system 16 is designed so that optical characteristics such as an angle of view and a depth of field have desired values. The imaging optical system 16 forms an object image to be imaged on a light receiving surface of the imaging element 19.

As shown in fig. 10, the first frame 17 may be a tubular shape having a rectangular cross section. As shown in fig. 2 and 3, the first housing 17 can house the photographing optical system 16 such that the optical axis of the photographing optical system 16 substantially coincides with the axis of the first housing 17 and the photographing optical system 16 is exposed from one opening. The first housing 17 can house the first substrate 12 so that the imaging element 19 is fixed to the imaging optical system 16 at a predetermined position and in a predetermined posture. The first frame 17 may house the second substrate 13, the first metal plate material 14, and the second metal plate material 15 so as to satisfy the above-described configuration with respect to the first substrate 12.

As shown in fig. 2 and 3, a third metal plate material 34 and an imaging element cover 35 surrounding the side surface in the stacking direction of the imaging elements 19 are provided between the imaging optical system 16 and the first substrate 12. The third metal plate material 34 may be formed of a metal having high thermal conductivity, such as copper. The third metal plate 34 and the imaging element cover 35 radiate heat generated by the imaging element 19 to the outside. The imaging element cover 35 may be formed of a soft material having shape-following properties and relatively high thermal conductivity, such as silicone rubber containing a filler.

As shown in fig. 11, the second frame 18 may have a plate-like portion and a quadrangular prism extending perpendicular to a main surface of the plate-like portion. The second housing 18 may have a second connector 36 that can be fitted to the first connector 21. The second frame body 18 may have a fourth metal plate material 37. As shown in fig. 2 and 3, in the electronic device 10, the fourth metal plate material 37 abuts against the second metal plate material 15. The second housing 18 may be sealed in a flat plate-like portion to an opening on the image side of the first housing 17 on the side opposite to the side where the photographing optical system 16 is exposed, that is, in the optical axis direction of the photographing optical system 16.

Next, a method of manufacturing the electronic device 10 will be described below.

As shown in fig. 12, a third metal plate member 34 and an imaging element cover 35 are attached to the image side of the lens barrel 16A accommodating the imaging optical system 16 in the optical axis direction of the imaging optical system 16. The third metal plate 34 is fixed to the lens barrel 16A of the photographing optical system 16 by a third fixing portion 38 of the third metal plate 34.

As shown in fig. 13, the first substrate 12 is fixed on the image side of the imaging optical system 16 in the optical axis direction such that the imaging optical system 16 faces the imaging element 19.

As shown in fig. 14, the flat plate portion 23 of the first metal plate 14 is attached to the first substrate 12. The heat sink 27 may be used to attach the flat plate portion 23 of the first metal plate material 14 to the first substrate 12. At this time, the first shielding portion 24 of the first metal plate material 14 does not cover the portion of the first substrate 12 where the flexible substrate 22 is provided. In addition, the first metal plate 14 is fixed to the lens barrel 16A by the first fixing portion 26.

As shown in fig. 15, the flexible substrate 22 is folded back, and the second substrate 13 is attached to the flat plate portion 23. The heat sink 27 may be used to attach the flat plate portion 23 of the first metal plate material 14 to the second substrate 13.

As shown in fig. 16, the second metal plate member 15 is attached so as to cover the periphery of the second substrate 13 from the first connector 21 side in the optical axis direction of the photographing optical system 16. The two locking portions 33 of the second metal plate material 15 are locked to the opening 25 of the first metal plate material 14. Further, the second metal plate member 15 is fixed to the lens barrel 16A of the photographing optical system 16 by the second fixing portion 31. Thus, as shown in fig. 17, an internal structure 39 of the electronic device 10 is configured.

As shown in fig. 2 and 3, the second substrate 13 is connected to the second housing 18 by fitting the first connector 21 to the second connector 36. Thereby, the fourth metal plate material 37 abuts against the second metal plate material 15. Then, the first housing 17 is covered with the second housing 18 so as to cover the inner structure 39. That is, the first housing 17 is covered with the second housing 18 so as to cover the imaging optical system 16, the first substrate 12, the second substrate 13, the first metal plate material 14, and the second metal plate material 15. The electronic apparatus 10 is manufactured by fixing the first housing 17 to the second housing 18 in a state where the first housing 17 covers the internal structure 39. For example, welding, adhesion with an adhesive, fastening by screwing, or the like is applied to the first frame 17 and the second frame 18.

The electronic device 10 according to the first embodiment having the above configuration includes the flat plate portion 23, and the flat plate portion 23 is interposed between the first substrate 12 and the second substrate 13 and indirectly contacts the imaging element 19 mounted on the first substrate 12 and the electronic component 20 mounted on the second substrate 13. With this configuration, since the imaging element 19 mounted on the first substrate 12 and the electronic component 20 mounted on the second substrate 13, which are heat sources, are close to the flat plate portion 23 having a higher thermal conductivity than the heat sink 27 in general, the heat dissipation of the electronic device 10 is improved as compared with a configuration in which only the heat sink 27 is interposed.

Further, in the electronic device 10 according to the first embodiment, the first shielding portion 24 and the second shielding portion 28 cover the side surface of the first substrate 12 over the entire circumference. With such a configuration, the electronic device 10 can have shielding properties against radiation noise of the electronic component 20 mounted on the first substrate 12. In the electronic device 10 according to the first embodiment, the second shielding portion 28 covers the side surface of the second substrate 13 over the entire circumference. With this configuration, the electronic device 10 can have shielding properties against radiation noise of the electronic component 20 mounted on the second substrate 13.

Further, in the electronic device 10 according to the first embodiment, the first metal plate member 14 includes the flat plate portion 23 and the first shielding portion 24. In the electronic device 10, the second metal plate material 15 has a second shielding portion 28. With such a configuration, in the electronic device 10, the flat plate portion 23 and the first shielding portion 24 having the above-described configuration and the second shielding portion 28 having the above-described configuration can be manufactured with a simple configuration without a step such as soldering.

Therefore, as described above, the electronic device 10 according to the first embodiment has shielding properties against radiation noise, and can further improve heat dissipation with a simple configuration.

In the electronic device 10 according to the first embodiment, the first metal plate material 14 and the second metal plate material 15 are in direct or indirect contact with each other. With such a configuration, the electronic device 10 can improve the heat conduction between the first metal plate material 14 and the second metal plate material 15 compared to a configuration in which they are separated from each other. Therefore, the electronic device 10 can further improve heat dissipation by transferring heat generated by a member directly or indirectly in contact with only one of the first metal plate material 14 and the second metal plate material 15 to the other metal plate material. For example, in the above-described configuration, in a configuration in which one of the first metal plate material 14 and the second metal plate material 15 is brought into contact with a heat conductor, such as the fourth metal plate material 37, for conducting heat from the inside of the electronic device 10 to the outside, the electronic device 10 can conduct heat from the other metal plate material to the heat conductor.

In the electronic device 10 according to the first embodiment, the first shielding portion 24 of the first metal plate member 14 covers a part of the side surface of the first substrate 12, and the second shielding portion 28 of the second metal plate member 15 covers a part of the side surface of the first substrate 12 exposed from the first shielding portion 24 and the entire periphery of the second substrate 13. With such a configuration, even in the electronic device 10 having a configuration in which the first substrate 12 and the second substrate 13 are connected by a wiring or the like such as the flexible substrate 22 extending from the side surface of the first substrate 12, the first substrate 12 and the second substrate 13 can be easily attached to the first metal plate material 14, and the electronic device can have a shielding property against radiation noise of the electronic component 20 mounted on each of the first substrate 12 and the second substrate 13.

In the electronic device 10 according to the first embodiment, the second metal plate material 15 has the locking portion 33, and the first metal plate material 14 and the second metal plate material 15 are directly abutted by the locking portion 33. With such a structure, the electronic apparatus 10 can increase the heat conduction between the first metal plate material 14 and the second metal plate material 15 and stably connect the first metal plate material 14 and the second metal plate material 15.

In the electronic device 10 according to the first embodiment, the second metal plate material 15 has two locking portions 33 adjacent to each other with the gap 32 interposed therebetween in the second shielding portion 28. With such a configuration, in the electronic device 10, the locking portion 33 can have elasticity, and the locking portion 33 of the second metal plate material 15 can be easily inserted into and fixed to the opening 25 of the first metal plate material 14. Furthermore, in the electronic device 10, the two locking portions 33 adjacent to each other with the gap 32 interposed therebetween are sandwiched by the opening 25, so that the gap 32 is less likely to spread, and the reduction in the shielding property can be reduced.

In the electronic device 10 according to the first embodiment, the flexible substrate 22 connecting the first substrate 12 and the second substrate 13 is covered with the second shielding portion 28. With such a configuration, the electronic device 10 can suppress a reduction in radiation noise shielding performance with respect to the electronic components 20 mounted on the first substrate 12 and the second substrate 13 while using the flexible substrate 22 which contributes to an easy manufacturing and a reduction in manufacturing cost.

Next, an electronic device 10 according to a second embodiment of the present disclosure will be described with reference to fig. 18 to 26. In the second embodiment, the structure of the internal structure of the electronic device 10 is different from that of the first embodiment. More specifically, as shown in fig. 18, in the inner structure 39-2 of the second embodiment, the shapes of the first metal plate material 14-2 and the second metal plate material 15-2 are different from the shapes of the first metal plate material 14 and the second metal plate material 15 of the inner structure 39 of the first embodiment shown in fig. 17. Hereinafter, the second embodiment will be described focusing on differences from the first embodiment. Parts having the same configurations as those of the first embodiment are denoted by the same reference numerals.

The first metal plate material 14-2 is explained with reference to fig. 19 and 20. As shown in fig. 19, the first metal plate 14-2 has a flat plate portion 23-2 and a first shielding portion 24-2.

The flat plate portion 23-2 differs from the flat plate portion 23 of the first embodiment in that the main surface thereof does not have the opening 25. The configuration of the flat plate portion 23-2 other than the point of not having the opening 25 may be the same as that of the flat plate portion 23 in the first embodiment. The relationship between the flat plate portion 23-2 and the first substrate 12 and the second substrate 13 may be the same as that of the first embodiment.

The first shielding portion 24-2 is erected along a part of the outer edge of the flat plate portion 23-2. For example, the first shielding portion 24-2 is connected to the flat plate portion 23-2 at all of any two opposing sides of the flat plate portion 23-2. The first shielding portion 24-2 is provided upright along the two sides and a part of the other two sides sandwiching the two sides. On one of two sides not connected to the first shielding portion 24-2, the first shielding portion 24-2 is erected at both end portions of the one side with a gap of a distance D. The distance D may be longer than the width of the flexible substrate 22.

The flat plate portion 23-2 has an upright portion 40 that is upright along a part of the outer edge of the flat plate portion 23-2 in the direction opposite to the first shielding portion 24-2. The main surface of the standing portion 40 faces the surface of the first shielding portion 24-2 having a gap with a distance D. The standing portion 40 is connected to the first shielding portion 24-2 and a side of the outer edge of the flat plate portion 23-2 different from the side connected to the first shielding portion 24-2.

Fig. 20 is a view showing the first metal plate material 14-2 viewed from the opposite side in the direction perpendicular to the flat plate portion 23-2 as compared with fig. 19. As shown in fig. 20, the first shielding portion 24-2 has a contact portion 41 extending to the opposite side of the standing portion 40 on the surface facing the surface having the gap with the distance D. In the electronic apparatus 10, the contact portion 41 is in contact with the third metal plate material 34.

The first metal plate material 14-2 is formed by bending a predetermined portion of a metal plate material, in other words, a metallic flat plate having a desired shape shown in fig. 21. In fig. 21, a straight line curved to the front surface side is indicated by a broken line, and a straight line curved to the back surface side is indicated by a one-dot chain line. Therefore, by stretching the bent portion of the first metal plate member 14-2 to be planar, any portions of the first metal plate member 14-2 are not separated from each other without interference. The first metal plate material 14-2 may be formed of a metal having high thermal conductivity, such as copper, for example.

As shown in fig. 22, the second metal plate material 15-2 has a second shielding portion 28-2.

The second shielding portion 28-2 has a substantially rectangular square tubular shape, and a part of either of two opposite sides of the rectangular shape in the axial cross section protrudes in the axial direction. That is, the second shielding portion 28-2 has a substantially rectangular square tubular full shielding portion 30-2 and two partial shielding portions 29-2 protruding from respective parts of two arbitrary opposite sides of the rectangle in the axial cross section and continuing from the full shielding portion 30-2 in the axial direction. The main surfaces of the two partial shielding portions 29-2 face each other. The width of the main surface of the two partial shielding portions 29-2, that is, the length in the direction perpendicular to the axial direction may be different. In the electronic device 10, the second metal plate material 15-2 covers the entire periphery of the side surface of the second substrate 13 and a part of the side surface of the first substrate 12 exposed from the first metal plate material 14-2. In this structure, the full shield portion 30-2 covers the entire periphery of the side surface of the second substrate 13, and the partial shield portion 29-2 covers a part of the side surface of the first substrate 12 exposed from the first metal plate material 14.

The two partial shielding portions 29-2 of the second shielding portion 28-2 have second fixing portions 31 at ends of sides not continuous with the full shielding portion 30-2, respectively. Thus, when the second metal plate member 15-2 is attached to the electronic apparatus 10, the two second fixing portions 31 sandwich the lens barrel 16A accommodating the photographing optical system 16 from two directions perpendicular to the optical axis.

The second shielding portion 28-2 has a gap 32 in the circumferential direction over one of the partial shielding portions 29-2 and the full shielding portion 30-2. The gap 32 is arranged substantially parallel to the axial direction. The gap 32 is a gap between ends of the metallic flat plate, which are opposed to each other when the second metal plate material 15-2 is formed by bending the flat plate. The second fixing portion 31 is located in the vicinity of the gap 32 on one side of the partial shielding portion 29-2. In the electronic device 10, the contact portion 42 adjacent to the second fixing portion 31 via the gap 32 is in contact with the third metal plate 34 in the one of the partial shielding portions 29-2.

The second metal plate material 15-2 is formed by bending a predetermined portion of a metal plate material, in other words, a metallic flat plate having a desired shape as shown in fig. 23. In fig. 23, a straight line curved to the front surface side is indicated by a broken line, and a straight line curved to the back surface side is indicated by a one-dot chain line. Therefore, by stretching the bent portion of the second metal plate material 15-2 to be planar, any portions of the second metal plate material 15-2 are not separated from each other without interference. The second metal plate material 15-2 may be formed of a metal having high thermal conductivity, such as copper, for example.

Next, a method for manufacturing the inner structure 39-2 will be described below.

In fig. 12 and 13, as described above, the first substrate 12 is attached to the lens barrel 16A accommodating the photographing optical system 16 via the third metal plate member 34 and the photographing element cover 35.

As shown in fig. 24, the flat plate portion 23-2 of the first metal plate 14-2 is attached to the first substrate 12. The heat sink 27 may be used in attaching the flat plate portion 23-2 of the first metal plate material 14-2 to the first substrate 12. The first metal plate 14-2 is attached to the first substrate 12 in such a manner that the flexible substrate 22 of the first substrate 12 can pass through the gap of the distance D of the first shielding portion 24-2. Thereby, as shown in fig. 25, the contact portion 41 of the first metal plate material 14-2 is brought into contact with the third metal plate material 34. Fig. 25 is a view showing a state in which the first metal plate material 14-2 is attached to the first substrate 12 as viewed from fig. 19 by rotating 180 degrees about the axial direction of the lens barrel 16A. A part of the flexible substrate 22 and the second substrate 13 are not shown in fig. 25.

As shown in fig. 26, the flexible substrate 22 is folded back, and the second substrate 13 is attached to the flat plate portion 23-2. The heat sink 27 may be used for attaching the flat plate portion 23-2 of the first metal plate material 14-2 to the second substrate 13.

The second metal plate member 15-2 is attached so as to cover the periphery of the second substrate 13 from the first connector 21 side in the optical axis direction of the photographing optical system 16. The second metal plate material 15-2 is fixed to the lens barrel 16A accommodating the photographing optical system 16 by two second fixing portions 31. Thereby, the contact portion 42 of the second metal plate material 15-2 is brought into contact with the third metal plate material 34. Therefore, the first metal plate material 14-2 and the second metal plate material 15-2 indirectly abut via the third metal plate material 34. Thus, as shown in fig. 18, the internal structure 39-2 of the electronic device 10 is configured.

In the electronic device 10 of the second embodiment having the above configuration, the flat plate portion 23-2 of the first metal plate material 14-2 is not provided with an opening portion for locking the first metal plate material 14-2 and the second metal plate material 15-2 as in the first embodiment. With this configuration, the area of the flat plate portion 23 that can be directly or indirectly brought into contact with the imaging element 19 mounted on the first substrate 12 and the electronic component 20 mounted on the second substrate 13 serving as a heat source can be increased, and the heat dissipation of the electronic device 10 can be improved.

In the electronic device 10 of the present embodiment, the first metal plate material 14-2 and the second metal plate material 15-2 indirectly contact each other through the third metal plate material 34. With such a configuration, the electronic device 10 can reduce the heat conduction between the first metal plate material 14-2 and the second metal plate material 15-2 as compared with the structure in which they are in contact with each other. Therefore, in the electronic device 10, in the configuration in which one of the first metal plate material 14-2 and the second metal plate material 15-2 is close to the member greatly affected by the high temperature, even if the other is heated, the heat conduction from the other one to the one can be reduced.

The present disclosure has been described based on the drawings and the embodiments, and it is to be noted that various modifications and corrections are easily made by those skilled in the art based on the present disclosure. Therefore, it is to be noted that such variations and modifications are included in the scope of the present disclosure.

Description of the reference numerals

10 electronic device

11 moving body

12 first substrate

13 second substrate

14. 14-2 first metal sheet

15. 15-2 second metal sheet

16 photographing optical system

16A lens barrel

17 first frame body

18 second frame body

19 imaging element

20 electronic component

21 first connector

22 flexible substrate

23. 23-2 flat plate part

24. 24-2 first shield part

25 opening part

26 first fixed part

27 Heat sink

28. 28-2 second shield part

29. 29-2 partial shield

30. 30-2 full shielding part

31 second fixing part

32 voids

33 locking part

34 third metal plate

35 cover for imaging element

36 second connector

37 fourth metal sheet

38 third fixing part

39. 39-2 internal Structure

40 upright setting part

41. 42 contact part

And D distance.