阅读说明：本技术 研磨抛光模拟方法、系统及研磨抛光工艺转移方法 (Grinding and polishing simulation method and system and grinding and polishing process transfer method ) 是由 罗元玠 王右勋 林沛群 施志轩 黄甦 于 2021-01-04 设计创作，主要内容包括：一种研磨抛光模拟方法、系统及研磨抛光工艺转移方法,研磨抛光模拟方法包括以下步骤：取得研磨抛光设备进行工件的研磨或抛光作业的感测信息；依据此感测信息识别出多个模型参数；依据加工路径、多个工艺参数以及此些模型参数计算出至少一品质参数。(A grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transfer method are provided, wherein the grinding and polishing simulation method comprises the following steps: acquiring sensing information of grinding or polishing operation of a workpiece by grinding and polishing equipment; identifying a plurality of model parameters according to the sensing information; at least one quality parameter is calculated according to the processing path, the plurality of process parameters and the model parameters.)

1. A lapping simulation system comprising:

the sensing unit is used for acquiring sensing information of the grinding or polishing operation of the workpiece by the grinding and polishing equipment;

the identification unit is used for identifying a plurality of model parameters according to the sensing information; and

and the simulation unit is used for calculating at least one quality parameter according to the processing path, the plurality of process parameters and the model parameters.

2. The lapping simulation system of claim 1, further comprising:

a processing path generating unit for generating the processing path according to the workpiece.

3. The polishing simulation system of claim 1, wherein the identification unit defines a range, receives the sensing information from the sensing unit for a robot to guide the workpiece to contact points of the polishing apparatus within the range, receives the at least one quality parameter from the simulation unit, calculates an error between the sensing information and the at least one quality parameter, and obtains the model parameters corresponding to the at least one quality parameter when the error is below a threshold value to identify the model parameters.

4. The polishing simulation system of claim 1, wherein the simulation unit builds a physical model of the polishing apparatus according to the polishing apparatus, builds a physical model of the workpiece according to the workpiece, and inputs the processing path, the process parameters and the model parameters into the physical model of the polishing apparatus and the physical model of the workpiece to calculate the at least one quality parameter.

5. The lapping simulation system of claim 1, wherein the process parameters comprise lapping contact point, belt number, workpiece speed, belt/polisher speed, feed depth, workpiece material, or original surface quality of the workpiece.

6. The lapping simulation system of claim 1, wherein the model parameters comprise geometry parameters of lapping equipment and workpieces, belt tension, distortion correction parameters, or wear correction parameters.

7. The polishing simulation system of claim 1, wherein the at least one quality parameter comprises a forward/tangential force distribution, a material removal rate, a surface roughness, or a coverage rate.

8. The lapping simulation system of claim 1, wherein the sensed information comprises six-axis force information, workpiece geometry variation, surface roughness, or workpiece surface condition.

9. The lapping simulation system of claim 1, further comprising:

and the external sensing unit is used for obtaining the model parameters from the grinding and polishing equipment and the workpiece.

10. A lapping and polishing simulation method, comprising:

acquiring sensing information of grinding or polishing operation of a workpiece by grinding and polishing equipment;

identifying a plurality of model parameters according to the sensing information; and

and calculating at least one quality parameter according to the processing path, the plurality of process parameters and the model parameters.

11. The lapping simulation method of claim 10, further comprising:

generating the processing path according to the workpiece.

12. The polishing simulation method of claim 10, wherein the step of identifying the model parameters according to the sensed information comprises:

defining a range;

receiving the sensing information of a plurality of contact points of the workpiece and the grinding and polishing equipment in the range guided by the robot;

receiving the at least one quality parameter and calculating an error between the sensing information and the at least one quality parameter; and

and obtaining the model parameters corresponding to the at least one quality parameter when the error is lower than a threshold value so as to identify the model parameters.

13. The polishing simulation method of claim 10, wherein the step of calculating the at least one quality parameter according to the processing path, the process parameters and the model parameters comprises:

establishing a physical model of the grinding and polishing equipment according to the grinding and polishing equipment;

establishing a physical model of the workpiece according to the workpiece; and

inputting the processing path, the process parameters and the model parameters into the physical model of the grinding and polishing equipment and the physical model of the workpiece to calculate the at least one quality parameter.

14. The method of claim 10, wherein the process parameters include an abrasive polishing contact point, a belt number, a workpiece speed, a belt/polisher speed, a feed depth, a workpiece material, or a workpiece original surface quality.

15. The method of claim 10, wherein the model parameters include geometry parameters of the polishing equipment and workpiece, belt tension, distortion correction parameters, or wear correction parameters.

16. The method of claim 10, wherein the at least one quality parameter comprises a normal/tangential force distribution, a material removal rate, a surface roughness, or a coverage rate.

17. The lapping simulation method of claim 10, wherein the sensed information comprises six-axis force information, workpiece geometry variation, surface roughness, or workpiece surface condition.

18. The lapping simulation method of claim 10, further comprising:

the model parameters are obtained from the polishing apparatus and the workpiece.

19. A grinding and polishing process transfer method comprises the following steps:

establishing a first simulation environment, wherein the first simulation environment corresponds to a first real environment with a first grinding and polishing device and a first robot, and comprises a first grinding and polishing device physical model and a first workpiece physical model;

acquiring first sensing information of the first grinding and polishing equipment and the first robot for grinding or polishing a first workpiece;

identifying a plurality of first model parameters according to the first sensing information;

inputting a first processing path, a plurality of first process parameters and the first model parameters into the first grinding and polishing equipment physical model and the first workpiece physical model to calculate at least one first quality parameter;

establishing a second simulation environment, wherein the second simulation environment corresponds to a second real environment with a second grinding and polishing device and a second robot, and comprises a second grinding and polishing device physical model and a second workpiece physical model;

acquiring first calibration information associated with the first grinding and polishing device and the first robot, acquiring second calibration information associated with the second grinding and polishing device and the second robot, and calibrating the first simulation environment and the second simulation environment according to the first calibration information and the second calibration information respectively;

analyzing the first simulation environment and the second simulation environment to obtain difference information; and

and inputting at least a part of the first processing path, the first process parameters and the first model parameters into the physical model of the second grinding and polishing equipment and the physical model of the second workpiece according to the difference information so as to simulate the second grinding and polishing equipment and the second robot to grind or polish the second workpiece and calculate at least one second quality parameter.

20. The method of claim 19, wherein the first calibration information comprises a position calibration of the first robot and the first polishing apparatus, a size calibration of a clamping jaw unit of the first robot, a variation correction of the first workpiece, or an additional rotation axis calibration of the first polishing apparatus, and the second calibration information comprises a position calibration of the second robot and the second polishing apparatus, a size calibration of a clamping jaw unit of the second robot, a variation correction of the second workpiece, or an additional rotation axis calibration of the second polishing apparatus.

21. The method of claim 19, wherein inputting at least a portion of the first processing path, the first process parameters, and the first model parameters into the second lapping and polishing tool physical model and the second workpiece physical model according to the difference information comprises:

when the first workpiece is the same as the second workpiece and the first robot and the first polishing device are configured in the same way as the second robot and the second polishing device,

and inputting the first processing path, the first process parameter and the first model parameter into the second grinding and polishing equipment physical model and the second workpiece physical model.

22. The method of claim 19, wherein inputting at least a portion of the first processing path, the first process parameters, and the first model parameters into the second lapping and polishing tool physical model and the second workpiece physical model according to the difference information comprises:

when the first workpiece and the second workpiece are the same but the first robot and the first polishing apparatus are configured differently from the second robot and the second polishing apparatus,

identifying a plurality of second model parameters, an

And inputting the first processing path, the first process parameter and the second model parameters into the second grinding and polishing equipment physical model and the second workpiece physical model.

23. The method of claim 19, wherein inputting at least a portion of the first processing path, the first process parameters, and the first model parameters into the second lapping and polishing tool physical model and the second workpiece physical model according to the difference information comprises:

when the first workpiece is different from the second workpiece and the configuration of the first robot and the first polishing device is different from the configuration of the second robot and the second polishing device,

a plurality of second model parameters are identified,

comparing the first workpiece with the second workpiece to obtain the same parts of the first workpiece and the second workpiece, an

And inputting the first processing path corresponding to the same part, the first process parameter corresponding to the same part and the second model parameters into the second grinding and polishing equipment physical model and the second workpiece physical model.

Technical Field

The invention relates to a simulation method, a simulation system and a process transfer method, in particular to a grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transfer method.

Background

With the development of industry, many processing procedures have been automated, especially in the grinding and polishing procedures, which have been performed by a lot of manual work, and robot arms or robots are now used instead of manual work. Although the polishing process is gradually automated, it still requires tedious and tedious manual work to adjust various parameters of the equipment to ensure the processing quality under different products, processing requirements and different hardware equipment configurations. On the other hand, the prior art also has the defect that the grinding and polishing process cannot be transferred across production lines.

Therefore, there is a need for a simulation system and method for simulating a polishing process to overcome the disadvantages of requiring a lot of manpower and time to adjust various parameters of the equipment, and a need for a process transfer method to overcome the problem that the polishing process cannot be transferred across production lines.

Disclosure of Invention

The invention relates to a grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transfer method, which reduce the time for manually adjusting equipment parameters by using a mode of simulating grinding and polishing operation. And the grinding and polishing process can be transferred among different production lines according to the commonality and the difference information among the different production lines.

According to an embodiment of the present invention, a grinding and polishing simulation method is provided. And acquiring sensing information of the grinding or polishing operation of the workpiece by the grinding and polishing equipment. A plurality of model parameters are identified according to the sensing information. At least one quality parameter is calculated according to the processing path, the plurality of process parameters and the model parameters.

According to another embodiment of the present invention, a grinding and polishing simulation system is provided. The grinding and polishing simulation system comprises a sensing unit, an identification unit and a simulation unit. The sensing unit is used for acquiring sensing information of the grinding and polishing operation of the workpiece by the grinding and polishing equipment. The identification unit is used for identifying a plurality of model parameters according to the sensing information. The simulation unit is used for calculating at least one quality parameter according to the processing path, the plurality of process parameters and the model parameters.

According to an embodiment of the present invention, a method for transferring a polishing process is provided. And establishing a first simulated environment, wherein the first simulated environment corresponds to a first real environment with first grinding and polishing equipment and a first robot, and the first simulated environment comprises a first grinding and polishing equipment physical model and a first workpiece physical model. First sensing information of the first workpiece grinding or polishing operation performed by the first grinding and polishing equipment and the first robot is obtained. A plurality of first model parameters are identified according to the first sensing information. The first processing path, a plurality of first process parameters and the first model parameters are input into the first grinding and polishing equipment physical model and the first workpiece physical model to calculate at least one first quality parameter. And establishing a second simulation environment, wherein the second simulation environment corresponds to a second real environment with a second grinding and polishing device and a second robot, and the second simulation environment comprises a second grinding and polishing device physical model and a second workpiece physical model. First calibration information associated with the first polishing apparatus and the first robot and second calibration information associated with the second polishing apparatus and the second robot are obtained, and the first simulation environment and the second simulation environment are calibrated respectively according to the first calibration information and the second calibration information. And analyzing the first simulation environment and the second simulation environment to obtain difference information. And inputting at least a part of the first processing path, the first process parameters and the first model parameters into a second grinding and polishing equipment physical model and a second workpiece physical model according to the difference information so as to simulate the second grinding and polishing equipment and a second robot to grind or polish the second workpiece and calculate at least one second quality parameter.

Drawings

FIG. 1 is a schematic diagram of a lapping simulation system, a lapping apparatus, a robot, and a workpiece;

FIG. 2 is a flow chart of a polishing simulation method according to an embodiment of the present invention;

FIG. 3 is a flow chart showing the sub-steps of steps S110 and S120 according to one embodiment of the present invention;

FIG. 4 is a diagram illustrating the range defined by the recognition unit according to an embodiment of the invention;

FIG. 5 is a flow chart showing the sub-steps of step S130 according to one embodiment of the present invention;

FIG. 6 is a schematic diagram of a physical model of a polishing apparatus and a physical model of a workpiece according to an embodiment of the invention;

FIG. 7 is a flow chart illustrating a method for transferring a polishing process according to an embodiment of the invention;

FIG. 8 is a schematic diagram illustrating a polishing process transfer according to an embodiment of the invention;

FIG. 9 is a schematic diagram illustrating a first workpiece and a second workpiece according to an embodiment of the invention.

In the above drawings, the reference numerals have the following meanings:

100: grinding and polishing simulation system

110: sensing unit

120: identification unit

130: analog unit

140: machining path generating unit

150: input interface

200: grinding and polishing equipment

300: robot

400: workpiece

And (3) SI: sensing information

MP: model parameters

QP: quality parameter

PP: process parameters

PT: machining path

S110, S120, S121, S122, S123, S124, S125, S126, S127, S130, S131, S132, S133, S210, S220, S230, S240, S250, S260: step (ii) of

R: range of

TP: contact point

210: physical model of grinding and polishing equipment

410: physical model of workpiece

2001: first grinding and polishing equipment

2002: second grinding and polishing device

3001: first robot

3002: second robot

4001: first workpiece

4002: second workpiece

EV 1: a first simulation environment

EV 2: second simulation environment

GMD 1: first grinding and polishing equipment physical model

GMD 2: second grinding and polishing equipment physical model

WMD 1: first workpiece physical model

WMD 2: second workpiece physical model

4001-1, 4002-1: the first part

4001-2, 4002-2: the second part

Detailed Description

Referring to fig. 1, a schematic diagram of a polishing simulation system 100, a polishing apparatus 200, a robot 300, and a workpiece 400 is shown. The polishing simulation system 100 includes a sensing unit 110, an identifying unit 120, a simulation unit 130, a processing path generating unit 140, and an input interface 150. The sensing unit 110 is, for example, a force sensor, a displacement sensor, a surface roughness meter or a vision sensor, and is used for sensing various sensing information SI of a polishing apparatus 200 and a robot 300 performing a polishing or grinding operation on a workpiece 400. The recognition unit 120, the simulation unit 130 and the processing path generation unit 140 are, for example, a circuit, a chip or a circuit board. The input interface 150 is, for example, a touch screen or a keyboard.

Please refer to fig. 1 and fig. 2. FIG. 2 is a flow chart of a polishing simulation method according to an embodiment of the invention. In step S110, the sensing unit 110 obtains sensing information SI of the grinding and polishing operation of the workpiece 400 performed by the grinding and polishing apparatus 200. Although in fig. 1, the robot 300 grasps the workpiece 400 to contact the grinding and polishing apparatus 200 to perform a grinding or polishing work. In one embodiment, the robot 300 may also grasp the grinding and polishing device 200 to contact the workpiece 400 to perform a grinding or polishing operation (not shown). The method of the present invention is applicable to both configurations, but is not limited thereto. In this step, the sensing unit 110 only needs to acquire the sensing information SI of the polishing apparatus 200 and the workpiece 400, instead of acquiring the sensing information of the robot 300. The sensing information SI includes, for example, six-axis force information, a workpiece geometric variation amount, a surface roughness, or a workpiece surface state.

In step S120, the identification unit 120 identifies a plurality of model parameters MP according to the sensing information SI. Referring to fig. 3, a flowchart of the sub-steps of steps S110 and S120 according to an embodiment of the invention is shown. Steps S110 and S120 include steps S121 to S127.

In step S121, the recognition unit 120 defines a range R. Referring to fig. 4, a schematic diagram of the range R defined by the identification unit 120 according to an embodiment of the invention is shown. Further, the recognition unit 120 sets a range R including or in the vicinity of the contact position based on the contact position of the workpiece 400 with the polishing apparatus 200. The range R may be cubic, spherical, or other shape. After the recognition unit 120 defines the range R, the robot 300 guides the workpiece 400 to move relative to the polishing apparatus 200 at a plurality of contact points TP in the range R, and it should be noted here that the case where the robot 300 guides the workpiece 400 to move relative to the polishing apparatus 200 may be the case where the robot 300 holds the workpiece 400 to move on the polishing apparatus 200 (i.e., "workpiece in hand"), or the case where the robot 300 holds the polishing apparatus 200 to move on the workpiece 400 (i.e., "tool in hand").

In step S122, the recognition unit 120 receives, from the sensing unit 110, sensing information SI of a plurality of contact points TP where the robot 300 guides the workpiece 400 to the polishing apparatus 200 in the range R. Further, the sensing unit 110 obtains the sensing information SI at each contact point TP, and the identifying unit 120 receives the sensing information SI.

In step S123, the identification unit 120 calculates a predicted value of the corresponding quality parameter according to the set value of the model parameter. The identification unit 120 first calculates the predicted value of the corresponding quality parameter according to a preset value of a model parameter. The set values of the model parameters are, for example, set values of geometric parameters of the polishing apparatus 200 and the workpiece 400, set values of belt tension, set values of deformation correction parameters, or set values of wear correction parameters. The predicted value of the quality parameter is, for example, a predicted value of a forward/tangential force distribution, a predicted value of a material removal rate, a predicted value of a surface roughness, or a predicted value of a coverage rate. Since the predicted value of the quality parameter is associated with the set value of the model parameter, the corresponding predicted value of the quality parameter can be calculated according to the set value of the model parameter.

In step S124, the identification unit 120 calculates whether an error between the predicted value of the quality parameter and the actual sensing information SI is lower than a threshold value. If yes, go to step S127; if not, go to step S125. More specifically, the recognition unit 120 first analyzes the quality parameters corresponding to the actual sensing information SI, for example, the recognition unit 120 analyzes the normal/tangential force distribution corresponding to the six-axis force information, analyzes the material removal rate corresponding to the geometric variation of the workpiece, and analyzes the coverage rate corresponding to the surface condition of the workpiece. Then, the identification unit 120 calculates whether an error between the predicted value of the quality parameter and the quality parameter corresponding to the actual sensing information SI is lower than a threshold value, for example, whether a Root Mean Square Error (RMSE), a Mean Square Error (MSE), a Mean Absolute Error (MAE), a Mean Absolute Percentage Error (MAPE), or a Symmetric Mean Absolute Percentage Error (SMAPE) between the predicted value of the quality parameter and the quality parameter corresponding to the actual sensing information SI is lower than the threshold value. The threshold value can be set according to different conditions.

If the error between the predicted value of the quality parameter and the actual sensing information SI is lower than the threshold value, it indicates that the set value of the model parameter in step S123 is appropriate. Then, in step S127, the identification unit 120 defines the setting value of the model parameter as the finally adopted model parameter MP. Then, step S130 is performed.

If the error between the predicted value of the quality parameter and the actual sensing information SI is not lower than the threshold value, it indicates that the set value of the model parameter in step S123 is not appropriate. Step S125 is then performed.

In step S125, the identification unit 120 determines whether the number of times of updating the set values of the model parameters is greater than a preset number of times. The preset times can be set according to different conditions. If so, it means that the error between the predicted value of the quality parameter and the actual sensing information SI cannot be made lower than the threshold within the preset number of times, so the process returns to step S122 to obtain another sensing information SI and execute the subsequent steps; if not, the number of times representing updating the set values of the model parameters is still within the preset number of times, and then step S126 is executed.

In step S126, the recognition unit 120 updates the set values of the model parameters. For example, the recognition unit 120 updates the set values of the geometric parameters of the polishing apparatus 200 and the workpiece 400, the set value of the tension of the abrasive belt, the set value of the deformation correction parameter, or the set value of the wear correction parameter. Next, returning to step S123, the identification unit 120 calculates the predicted value of the corresponding updated quality parameter according to the set value of the updated model parameter. Next, step S124 is executed, and the identification unit 120 calculates whether an error between the predicted value of the updated quality parameter and the actual sensing information SI is lower than a threshold value. That is, steps S123 to S126 are a recursive process, which is repeated until the error between the predicted value of the corresponding quality parameter calculated from the set value of the model parameter and the actual sensing information SI is lower than the threshold value (step S124), or until the number of times the set value of the model parameter is updated is greater than the predetermined number of times (step S125).

In step S125, when the identification unit 120 determines that the number of times of updating the set value of the model parameter is greater than the predetermined number of times, which indicates that the initial set value of the model parameter is not selected well, the set value of the model parameter may not converge no matter how many times the set value is updated (i.e., the error cannot be made lower than the threshold value even if the number of times of repeating steps S123 to S126 exceeds the predetermined number of times), and then it is necessary to go back to step S122 of obtaining the sensing information SI and select an initial set value to restart the next calculation process of recursive comparison error.

Referring back to fig. 1 and 2, in step S130, the simulation unit 130 calculates at least one quality parameter QP according to the processing path PT, the process parameter PP, and the model parameter MP. In this embodiment, the machining path generating unit 140 generates the machining path PT according to the workpiece 400, which is the machining path PT generated by the off-line programming. The process parameters PP are input by a field person via the input interface 150. In another embodiment, the processing path PT may also be entered by a field person via the input interface 150. The process parameters PP are, for example, the point of abrasive polishing contact, the belt number, the workpiece speed, the belt/polisher speed, the feed depth, the workpiece material, or the original surface quality of the workpiece. The model parameters MP are, for example, geometric parameters of the polishing apparatus 200 and the workpiece 400, belt tension, deformation correction parameters, or wear correction parameters. The at least one quality parameter QP is, for example, a forward/tangential force profile, a material removal rate, a surface roughness, or a coverage rate. In another embodiment, the polishing simulation system 100 further includes an external sensing unit (not shown), and the polishing simulation system 100 can obtain the model parameter MP from the polishing apparatus 200 and the workpiece 400 directly through the external sensing unit. Next, the simulation unit 130 calculates at least one quality parameter QP according to the processing path PT, the process parameter PP, and the model parameter MP, as shown in fig. 1.

Next, referring to fig. 5, a flowchart of the sub-step of step S130 according to an embodiment of the invention is shown. Step S130 includes steps S131 to S133.

In step S131, the simulation unit 130 creates a physical model of the polishing apparatus according to the polishing apparatus 200. In step S132, the simulation unit 130 builds a physical model of the workpiece according to the workpiece 400. It should be noted that, the sequence of the steps S131 and S132 may be the same or may be preceded by any step, and the step S131 and the step S132 shown in fig. 5 are only an exemplary embodiment. Referring to FIG. 6, a schematic diagram of a physical model 210 of a polishing apparatus and a physical model 410 of a workpiece according to an embodiment of the invention is shown. The lapping tool physical model 210 and the workpiece physical model 410 contain known parameters:

O₁、O₂: center point of two grinding wheels

R₁、R₂: radius of grinding wheel of grinding and polishing equipment

r: local radius of curvature (not labeled) of the surface of the workpiece at the contact point

A. B: contact point of abrasive belt and two abrasive wheels at first time

C: contact point of workpiece and abrasive belt at first time

P: center point of workpiece at first time

D. E: contact point of abrasive belt with two abrasive wheels at second time

F. G: contact point of workpiece with abrasive belt at second time

P': center point of workpiece at second time

m₀：O₁To length of P

n₀：O₂To length of P

m：O₁To length of P

n：O₂To length of P

a：O₁Line to D and O₁Angle between the line connecting P

b：O₂Line to E and O₂Angle between the line connecting P

c：O₁Line to P' and O₁And O₂Angle between the connecting lines

d：O₂Line to P' and O₁And O₂Angle between the connecting lines

L: distance (O) between two grinding wheels₁To O₂Length of (2)

L_m0: length of A to C

Next, in step S133, the simulation unit 130 inputs the processing path PT, the process parameter PP and the model parameter MP into the physical model 210 of the polishing apparatus and the physical model 410 of the workpiece to calculate at least one quality parameter QP. Two-dimensional normal/tangential force distribution F, for example, with quality parameter QP as normal/tangential force distribution_2DAnd three-dimensional normal/tangential force distribution F_3DCan be obtained by the following formula one and formula two respectively:

F_2D＝f(T，r，L_m0，δ，R₁，R₂l) (type one)

Where T is belt tension (model parameter MP) and δ is the depth of cut (machining path PT).

In addition, the quality parameter QP is used as the material removal rate γ_ijFor example, the material removal rate γ_ijCan be obtained by the following formula three:

wherein C is_AFixed parameters (model parameters MP), K for correction_AParameters (model parameters MP), K related to workpiece material and abrasive belt number_tParameters (model parameters MP), V were corrected for wear_bThe belt/polisher speed (process parameters PP), V_wWorkpiece speed (process parameter PP), alpha, beta and gamma are correction factors (model parameter MP).

Although the forward/tangential force distribution and the material removal rate are used as examples, the present invention is not limited thereto.

By the grinding and polishing simulation method and the grinding and polishing simulation system, model parameters can be identified in real time during grinding and polishing operation, and at least one quality parameter is calculated. Therefore, the invention does not need to spend a great deal of manpower and time to adjust various parameters of the equipment.

Please refer to fig. 7 and 8. FIG. 7 is a flow chart illustrating a method for transferring a polishing process according to an embodiment of the invention. FIG. 8 is a schematic diagram illustrating a polishing process transfer according to an embodiment of the invention.

In step S210, a first simulated environment EV1 is established. The first simulated environment EV1 corresponds to a first real environment with the first polishing apparatus 2001 and the first robot 3001, and the first simulated environment EV1 includes a first polishing apparatus physical model GMD1 and a first workpiece physical model WMD 1.

In step S220, a polishing simulation method is performed in the first simulation environment EV 1. The lapping simulation method for this step is similar to the lapping simulation method described in fig. 2 to 4. That is, the first sensing information of the first grinding and polishing device 2001 and the first robot 3001 for grinding or polishing the first workpiece 4001 is obtained, the plurality of first model parameters are identified according to the first sensing information, and the first processing path, the plurality of first process parameters and the plurality of first model parameters are inputted into the first grinding and polishing device physical model GMD1 and the first workpiece physical model WMD1 to calculate at least one first quality parameter.

In step S230, a second simulated environment EV2 is established. The second simulated environment EV2 corresponds to a second real environment with a second polishing device 2002 and a second robot 3002, and the second simulated environment EV2 includes a second polishing device physical model GMD2 and a second workpiece physical model WMD 2.

In step S240, the first simulated environment EV1 and the second simulated environment EV2 are calibrated. First, first calibration information associated with the first polishing apparatus 2001 and the first robot 3001 and second calibration information associated with the second polishing apparatus 2002 and the second robot 3002 are obtained, and the first simulated environment EV1 and the second simulated environment EV2 are calibrated according to the first calibration information and the second calibration information, respectively. The first calibration information is, for example, positional calibration of the first robot 3001 with the first polishing apparatus 2001, dimensional calibration of a jaw jig unit of the first robot 3001, variation correction of the first workpiece 4001, or additional rotation axis calibration of the first polishing apparatus 2001. The second calibration information is, for example, positional calibration of the second robot 3002 with the second polishing apparatus 2002, dimensional calibration of a jaw jig unit of the second robot 3002, variation correction of the second workpiece 4002, or additional rotation axis calibration of the second polishing apparatus 2002.

In step S250, the first simulated environment EV1 and the second simulated environment EV2 are analyzed to obtain difference information. The difference information is, for example, a geometric difference between the first workpiece 4001 and the second workpiece 4002, and a difference between the arrangement of the first robot 3001 and the first polishing apparatus 2001 and the arrangement of the second robot 3002 and the second polishing apparatus 2002.

In step S260, the lapping and polishing process is transferred from the first simulated environment EV1 to the second simulated environment EV2 according to the difference information. More specifically, at least a portion of the first processing path, the first process parameters and the first model parameters are input to the second GMD2 model and the second workpiece physical model WMD2 to simulate the second GMD2 model and the second robot 3002 performing the grinding or polishing operation on the second workpiece 4002, and at least one second quality parameter is calculated according to the difference information. In this step, the first processing path is, for example, a processing path on the workpiece or a processing path of the robot, and the processing path on the workpiece and the processing path of the robot have a corresponding relationship, and the processing path of the workpiece can be converted into a corresponding processing path of the robot according to different types of robots. The following is a detailed description of different cases of the difference information.

When the difference information is that the first workpiece 4001 and the second workpiece 4002 are the same, and the configurations of the first robot 3001 and the first polishing apparatus 2001 are the same as the configurations of the second robot 3002 and the second polishing apparatus 2002, the first processing path, the first process parameter, and the first model parameter are input into the second polishing apparatus physical model GMD2 and the second workpiece physical model WMD2, so as to simulate the second polishing apparatus 2002 and the second robot 3002 to perform a polishing operation on the second workpiece 4002, and calculate at least one second quality parameter.

When the difference information is that the first workpiece 4002 and the second workpiece 4002 are identical but the configurations of the first robot 3001 and the first polishing apparatus 2001 are different from the configurations of the second robot 3002 and the second polishing apparatus 2002, a plurality of second model parameters are identified in the second simulation environment EV2, and then the first processing path, the first process parameter and the second model parameters are input into the second polishing apparatus physical model GMD2 and the second workpiece physical model WMD2 to simulate the second polishing apparatus 2002 and the second robot 3002 to perform a polishing or grinding operation on the second workpiece 4002, and at least one second quality parameter is calculated.

When the difference information is that the first workpiece 4001 and the second workpiece 4002 are different, and the configurations of the first robot 3001 and the first polishing apparatus 2001 are different from the configurations of the second robot 3002 and the second polishing apparatus 2002, a plurality of second model parameters are identified in the second simulation environment EV2, the first workpiece 4001 and the second workpiece 4002 are compared to obtain an identical portion of the first workpiece 4001 and the second workpiece 4002, the first processing path corresponding to the identical portion, the first process parameters corresponding to the identical portion, and the second model parameters are input into the second polishing apparatus physical model GMD2 and the second workpiece physical model WMD2 to simulate the second polishing apparatus 2002 and the second robot 3002 to perform a polishing operation on the second workpiece 4002, and at least one second quality parameter is calculated. The same portions of the first workpiece 4001 and the second workpiece 4002 are explained as follows.

Referring to fig. 9, a schematic diagram of a first workpiece 4001 and a second workpiece 4002 according to an embodiment of the invention is shown. First workpiece 4001 includes a first portion 4001-1 and a second portion 4001-2. Second workpiece 4002 includes a first portion 4002-1 and a second portion 4002-2. The same portions of first workpiece 4001 and second workpiece 4002 are first portion 4001-1 and first portion 4002-1, which are both cylinders. Thus, after the same portion is compared, a first processing path corresponding to first portion 4001-1 of first workpiece 4001 and a first process parameter corresponding to first portion 4001-1 of first workpiece 4001 are input into second lapping and polishing apparatus physical model GMD2 and second workpiece physical model WMD 2.

Therefore, by the grinding and polishing process transfer method, the grinding and polishing process can be transferred among different production lines according to the commonality and the difference information among the different production lines.

The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.