阅读说明：本技术 一种合金贴片电阻、其加工设备以及加工工艺 (Alloy chip resistor, and processing equipment and processing technology thereof ) 是由 胡紫阳 邓小辉 李智德 于 2021-08-02 设计创作，主要内容包括：本发明涉及电阻加工技术领域,涉及一种合金贴片电阻、其加工设备以及加工工艺。本发明将激光熔覆与激光焊接整合在一起,可用于电阻带状材料的焊接和后处理,使其在原材料阶段进行激光熔覆,在电阻体带材上形成绝缘涂层,直接对具有阻焊功能的电阻带状材料进行裁切,无需对单颗合金贴片电阻处理,加工效率极高。(The invention relates to the technical field of resistor processing, in particular to an alloy chip resistor, processing equipment and a processing technology thereof. The invention integrates laser cladding and laser welding together, can be used for welding and post-processing of the resistance strip material, leads the resistance strip material to be subjected to laser cladding at the raw material stage, forms an insulating coating on the resistance strip material, directly cuts the resistance strip material with the resistance welding function, does not need to carry out resistance processing on a single alloy patch, and has extremely high processing efficiency.)

1. The alloy chip resistor processing technology is characterized by comprising the following steps:

preparing an electrode strip and a resistor strip for processing the alloy chip resistor, and welding the electrode strip and the resistor strip into a splicing strip material by adopting laser; preparing a cladding material for laser cladding, melting the cladding material by laser, cladding the cladding material on the resistor strip of the splicing strip material to form a cladding layer, and cutting the cladded splicing strip material to form the alloy chip resistor.

2. The alloy patch resistor machining process of claim 1, wherein the process parameters in the laser cladding process include: the laser power is 2000W-5000W; the laser scanning speed is 8m/min-30 m/min; the laser cladding time is 0.01s-0.08 s; the thickness of the cladding layer is 0.1mm-0.5 mm.

3. The alloy chip resistor processing technology according to claim 1, wherein when the electrode strip and the resistor strip are welded into the splicing strip material by laser, the alloy chip resistor processing technology further comprises the following steps:

the electrode strips are respectively arranged on two sides of the resistor body strip, the electrode strips and the resistor body strip are pre-fixed by spot welding to be beneficial to laser welding, the pre-fixed electrode strips and the resistor body strip are welded by laser to form a splicing strip material, inert gas is blown in the laser welding process, and the laser welding track is in a straight line shape between two spot welding positions.

4. The alloy patch resistor processing technology of claim 1, wherein the process parameters in the laser welding process comprise: the laser power is 600W-2500W; the laser scanning speed is 5m/min-20 m/min; the transmission speed of the electrode strip and the resistor strip is 7-15 m/min; the thickness of the electrode strip and the resistor strip is 0.3mm-3 mm.

5. The alloy patch resistor processing technology of claim 1, wherein the laser cladding material is silicon oxide powder, and the silicon oxide powder comprises one or a combination of more than two of silicon dioxide, ceramic material or silicon monoxide.

6. The alloy patch resistor processing technology of claim 1, wherein before laser melting cladding material, silicon oxide powder is dried at 130-180 ℃.

7. The alloy chip resistor processing technology according to claim 1, wherein after the electrode strip and the resistor strip are welded into the splicing strip material by laser, the alloy chip resistor processing technology further comprises the following steps:

and measuring the resistance value of the splicing tape material, carrying out laser oil removal and/or impurity removal treatment on the resistor body strip of the splicing tape material and the welding part of the resistor body strip and the electrode strip, and simultaneously comparing the real-time resistance value of the splicing tape material in the laser cleaning process with a standard threshold value to judge whether the splicing tape material is completely cleaned by laser.

8. The alloy chip resistor machining equipment is characterized by comprising an electrode strip material feeding frame, a resistor strip material feeding frame, a laser welding mechanism, a laser cladding mechanism and a winding frame, wherein the electrode strip material feeding frame and the resistor strip material feeding frame are arranged on the feeding side of the laser welding mechanism and convey electrode strips and resistor strips to the laser welding mechanism, the electrode strips and the resistor strips are welded into a splicing strip material by the welding mechanism through laser, the splicing strip material is conveyed to the laser cladding mechanism by the laser welding mechanism, the cladding material is clad on the resistor strips of the splicing strip material by the laser cladding mechanism to form a cladding layer, and the winding frame winds the cladding-finished splicing strip material.

9. The alloy chip resistor processing equipment according to claim 8, further comprising a laser cleaning mechanism, wherein the laser cleaning mechanism is arranged between the laser welding mechanism and the laser cladding mechanism, the laser cleaning mechanism performs laser degreasing and/or impurity removal treatment on the resistor body strip of the splicing belt material and the welding position of the resistor body strip and the electrode strip, and meanwhile, the real-time resistance value of the splicing belt material is compared with a standard threshold value to judge whether the splicing belt material is completely cleaned by laser.

10. The alloy chip resistor is characterized by comprising electrodes and a resistor body, wherein the electrodes are welded on two sides of the resistor body through laser, a cladding layer is arranged on the resistor body, the electrodes comprise main pole pieces and connecting pole pieces, the connecting pole pieces are obliquely arranged on the main pole pieces, and free ends of the connecting pole pieces are connected with the resistor body, so that the resistor body is inwards sunken relative to the electrodes to form a cladding groove.

Technical Field

The invention relates to the technical field of resistor processing, in particular to an alloy chip resistor, processing equipment and a processing technology thereof.

Background

The alloy chip resistor is a resistor which adopts alloy as a current medium and is often used for sampling current in a circuit. For feeding back the varying current in the circuit in order to further control or influence the variation of the current. The products mainly used are as follows: battery protection board, power source, frequency converter, lamps and lanterns, motor etc..

The existing laser equipment for the strip-shaped materials only has a welding function, and meanwhile, the existing alloy resistor influences the risk of the resistance of the upper plate due to tin climbing, so that the resistance after the upper plate is poor, single product is required to be subjected to resistance welding treatment, the processing efficiency of the alloy resistor is low, and the normal production of enterprises is not facilitated.

Disclosure of Invention

The invention aims to provide an alloy chip resistor, processing equipment and a processing technology thereof, which do not need to process a single alloy chip resistor and have extremely high processing efficiency.

In order to solve the technical problems, the technical scheme adopted by the invention for solving the technical problems is as follows:

an alloy chip resistor processing technology comprises the following steps:

preparing an electrode strip and a resistor strip for processing the alloy chip resistor, and welding the electrode strip and the resistor strip into a splicing strip material by adopting laser; preparing a cladding material for laser cladding, melting the cladding material by laser, cladding the cladding material on the resistor strip of the splicing strip material to form a cladding layer, and cutting the cladded splicing strip material to form the alloy chip resistor.

Further, the process parameters in the laser cladding process include: the laser power is 2000W-5000W; the laser scanning speed is 8m/min-30 m/min; the laser cladding time is 0.01s-0.08 s; the thickness of the cladding layer is 0.1mm-0.5 mm.

Further, when the electrode strip and the resistor strip are welded into the splicing strip material by adopting laser, the method also comprises the following steps:

the electrode strips are respectively arranged on two sides of the resistor body strip, the electrode strips and the resistor body strip are pre-fixed by spot welding to be beneficial to laser welding, the pre-fixed electrode strips and the resistor body strip are welded by laser to form a splicing strip material, inert gas is blown in the laser welding process, and the laser welding track is in a straight line shape between two spot welding positions.

Further, the process parameters in the laser welding process include: the laser power is 600W-2500W; the laser scanning speed is 5m/min-20 m/min; the transmission speed of the electrode strip and the resistor strip is 7-15 m/min; the thickness of the electrode strip and the resistor strip is 0.3mm-3 mm.

Further, the laser cladding material is silicon oxide powder, and the silicon oxide powder comprises one or a combination of more than two of silicon dioxide, ceramic material or silicon monoxide.

Further, before melting the cladding material by laser, drying the silicon oxide powder at 130-180 ℃.

Further, after the electrode strip and the resistor strip are welded into a splicing strip material by laser, the method further comprises the following steps:

and measuring the resistance value of the splicing tape material, carrying out laser oil removal and/or impurity removal treatment on the resistor body strip of the splicing tape material and the welding part of the resistor body strip and the electrode strip, and simultaneously comparing the real-time resistance value of the splicing tape material in the laser cleaning process with a standard threshold value to judge whether the splicing tape material is completely cleaned by laser.

The invention also comprises alloy chip resistor processing equipment which comprises an electrode strip material placing frame, a resistor strip material placing frame, a laser welding mechanism, a laser cladding mechanism and a winding frame, wherein the electrode strip material placing frame and the resistor strip material placing frame are arranged on the feeding side of the laser welding mechanism and convey electrode strips and resistor strips to the laser welding mechanism, the welding mechanism welds the electrode strips and the resistor strips into splicing strip materials by adopting laser, the laser welding mechanism conveys the splicing strip materials to the laser cladding mechanism, the laser cladding mechanism claddes the cladding materials on the resistor strips of the splicing strip materials to form cladding layers, and the winding frame winds the cladded splicing strip materials.

The laser cleaning mechanism is arranged between the laser welding mechanism and the laser cladding mechanism, laser oil removal and/or impurity removal treatment is carried out on the resistor body strip of the splicing belt material and the welding position of the resistor body strip and the electrode strip by the laser cleaning mechanism, and meanwhile, the real-time resistance value of the splicing belt material is compared with a standard threshold value so as to judge whether the splicing belt material is completely cleaned by laser.

The invention also comprises an alloy patch resistor, which comprises an electrode and a resistor body, wherein the electrode is welded on two sides of the resistor body through laser, a cladding layer is arranged on the resistor body, the electrode comprises a main pole piece and a connecting pole piece, the connecting pole piece is obliquely arranged on the main pole piece, and the free end of the connecting pole piece is connected with the resistor body, so that the resistor body is inwards sunken relative to the electrode to form a cladding groove.

The invention has the beneficial effects that:

the invention integrates laser cladding and laser welding together, can be used for welding and post-processing of the resistance strip material, leads the resistance strip material to be subjected to laser cladding at the raw material stage, forms an insulating coating on the resistance strip material, directly cuts the resistance strip material with the resistance welding function, does not need to carry out resistance processing on a single alloy patch, and has extremely high processing efficiency.

Drawings

FIG. 1 is a schematic diagram of an alloy chip resistor processing technique according to the present invention.

FIG. 2 is a schematic diagram of the alloy chip resistor processing equipment of the present invention.

FIG. 3 is a process flow diagram of the present invention.

FIG. 4 is a schematic diagram of the alloy patch resistance of the present invention.

The reference numbers in the figures illustrate: 1. a material placing frame; 2. an electrode strip; 3. resistor body strips; 4. a laser welding mechanism; 5. a laser cleaning mechanism; 6. a laser cladding mechanism; 7. a winding frame; 8. an electrode; 81. a main pole piece; 82. connecting the pole pieces; 9. a resistor body; 10. a cladding layer;

Detailed Description

The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.

Referring to fig. 1-4, a process for processing an alloy chip resistor includes the following steps:

preparing an electrode strip material 2 and a resistor body strip material 3 for processing an alloy chip resistor, and welding the electrode strip material and the resistor body strip material into a splicing strip material by adopting laser; preparing a cladding material for laser cladding, melting the cladding material by laser, cladding the cladding material on the resistor strip of the splicing strip material to form a cladding layer, and cutting the cladded splicing strip material to form the alloy chip resistor.

The invention integrates laser cladding and laser welding together, can be used for welding and post-processing one-step molding of the resistance strip material, carries out laser cladding on the raw material stage, forms an insulating coating on the resistance strip material, directly cuts the resistance strip material with the resistance welding function, does not need to carry out resistance processing on a single alloy patch, reduces the manual input, and improves the precision and the working efficiency of production and processing.

The technological parameters in the laser cladding process comprise: the laser power is 2000W-5000W; the laser scanning speed is 8m/min-30 m/min; the laser cladding time is 0.01s-0.08 s; the thickness of the cladding layer is 0.1mm-0.5 mm.

When adopting laser welding to become the concatenation area material with electrode strip and resistance body strip, still include:

the electrode strips are respectively arranged on two sides of the resistor body strip, the electrode strips and the resistor body strip are pre-fixed by spot welding to be beneficial to laser welding, the pre-fixed electrode strips and the resistor body strip are welded by laser to form a splicing strip material, inert gas is blown in the laser welding process, and the laser welding track is in a straight line shape between two spot welding positions.

The electrode strip and the resistor strip are pre-fixed by spot welding, and because the electrode strip and the resistor strip are not in the agreed horizontal plane, a special fixture is not needed for fixing, and meanwhile, the gap between the electrode strip and the resistor strip can be eliminated, so that the welding quality is further ensured,

inert gases (such as nitrogen, argon and the like) are blown in the laser welding process, so that the oxidation of the strip in the high-temperature (about 3000 ℃) welding process is avoided, meanwhile, the welded strip is slowly cooled, and the welding cooling quality is ensured.

The technological parameters in the laser welding process comprise: the laser power is 600W-2500W; the laser scanning speed is 5m/min-20 m/min; the transmission speed of the electrode strip and the resistor strip is 7-15 m/min; the thickness of the electrode strip and the resistor strip is 0.3mm-3 mm.

The laser cladding material is silicon oxide powder, and the silicon oxide powder comprises one or a combination of more than two of silicon dioxide, ceramic materials or silicon monoxide.

The silicon oxide cladding material is selected, so that the laser cladding technology can be applied to the resistor industry, convenience is provided for the function and the structural design of the resistor, and meanwhile, the silicon oxide cladding layer is applied to the resistor material, so that the surface of the resistor material has the capabilities of high temperature resistance, insulation and oxidation resistance, the heat dissipation can be improved, and the electrical performance of the resistor material is improved.

The metal-based cladding layer is mainly used in the market, and is applied to mechanical structural parts to enhance the mechanical properties of materials.

Before melting the cladding material by laser, drying the silicon oxide powder at 130-180 ℃.

After the electrode strip and the resistor body strip are welded into a splicing strip material by adopting laser, the method further comprises the following steps:

and measuring the resistance value of the splicing tape material, carrying out laser oil removal and/or impurity removal treatment on the resistor body strip of the splicing tape material and the welding part of the resistor body strip and the electrode strip, and simultaneously comparing the real-time resistance value of the splicing tape material in the laser cleaning process with a standard threshold value to judge whether the splicing tape material is completely cleaned by laser.

The invention also comprises alloy chip resistor processing equipment which comprises an electrode strip material feeding frame 1, a resistor strip material feeding frame, a laser welding mechanism 4, a laser cladding mechanism 6 and a winding frame 7, wherein the electrode strip material feeding frame and the resistor strip material feeding frame are arranged on the feeding side of the laser welding mechanism and convey electrode strips and resistor strips to the laser welding mechanism, the welding mechanism welds the electrode strips and the resistor strips into splicing strip materials by adopting laser, the laser welding mechanism conveys the splicing strip materials to the laser cladding mechanism, the laser cladding mechanism claddes cladding materials on the resistor strips of the splicing strip materials to form cladding layers, and the winding frame winds the cladding-finished splicing strip materials.

The laser cladding device is characterized by further comprising a laser cleaning mechanism 5, wherein the laser cleaning mechanism is arranged between the laser welding mechanism and the laser cladding mechanism, the laser cleaning mechanism carries out laser oil removal and/or impurity removal treatment on the resistor body strip of the splicing belt material and the welding position of the resistor body strip and the electrode strip, and meanwhile, the real-time resistance value of the splicing belt material is compared with a standard threshold value so as to judge whether the splicing belt material is completely cleaned by laser.

The left side of the device is provided with a material placing frame, the right side of the device is provided with a material receiving frame, the middle of the device is provided with three stations of laser welding, cleaning and cladding, the raw material used for production is a strip, the moving speed of the strip material is controlled by the material placing frame and the material receiving frame, and the strip material is processed by the three stations of laser welding, laser cleaning and laser cladding.

The multifunctional equipment integrates three functions of laser welding, laser cleaning and laser cladding, can simultaneously perform the three functions, greatly improves the treatment efficiency of welding, cleaning and cladding of strip-shaped raw materials, and is convenient and fast to use.

The invention also comprises an alloy patch resistor, which comprises an electrode 8 and a resistor body 9, wherein the electrode is welded on two sides of the resistor body through laser, a cladding layer 10 is arranged on the resistor body, the electrode comprises a main pole piece and a connecting pole piece, the connecting pole piece is obliquely arranged on the main pole piece 81, the free end of the connecting pole piece 82 is connected with the resistor body, so that the resistor body is inwards recessed relative to the electrode to form a cladding groove, the cladding layer is conveniently covered on the resistor body, the resistance welding function is increased, meanwhile, the cladding layer can also cover a part of the connecting pole piece, and the risk that the resistance value of the upper plate is influenced by tin climbing is further avoided.

During production and manufacturing, a red copper (electrode) strip and a resistance strip are welded into a splicing strip material, then laser cladding is carried out, a silicon oxide material is cladded on the middle resistance material, and finally the required alloy chip resistor is processed by cutting equipment such as a punch and the like.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.