阅读说明：本技术 一种纹理基板的制作方法、纹理基板及电子设备 (Manufacturing method of texture substrate, texture substrate and electronic equipment ) 是由 祝鹏辉 于 2021-07-15 设计创作，主要内容包括：本申请公开了一种纹理基板的制作方法、纹理基板及电子设备,其中,该方法包括：提供一基板；在基板的第一表面形成第一保护层；对第一保护层进行烘干处理,以使第一保护层皲裂形成纹理；对基板进行蚀刻处理,以对皲裂区域露出的基板进行至少部分去除,以在基板上形成纹理；去除基板上的第一保护层,以得到纹理基板。通过上述方式,本申请能够丰富纹理基板表面的纹理图案。(The application discloses a manufacturing method of a texture substrate, the texture substrate and electronic equipment, wherein the method comprises the following steps: providing a substrate; forming a first protective layer on the first surface of the substrate; drying the first protective layer to enable the first protective layer to be cracked to form textures; etching the substrate to at least partially remove the substrate exposed in the chapped area to form a texture on the substrate; and removing the first protective layer on the substrate to obtain the texture substrate. Through the mode, the texture pattern on the surface of the texture substrate can be enriched.)

1. A method for manufacturing a texture substrate is characterized by comprising the following steps:

providing a substrate;

forming a first protective layer on the first surface of the substrate;

drying the first protective layer to enable the first protective layer to be cracked to form textures;

etching the substrate to at least partially remove the substrate exposed from the chapped area to form a texture on the substrate;

and removing the first protective layer on the substrate to obtain the texture substrate.

2. The method of claim 1, wherein the first protective layer comprises a primer layer and a topcoat layer,

the forming a first protective layer on the first surface of the substrate includes:

forming a primer layer on the first surface of the substrate;

standing the substrate at room temperature for 60-120 min;

forming a topcoat layer on the primer layer;

and standing the substrate at room temperature for 30-60 min to enable the first protective layer to crack, and exposing a part of the substrate from the cracked part of the first protective layer.

3. The method of claim 2,

the thickness of the primer layer is 25-35 μm, and the thickness of the finishing paint layer is 15-25 μm.

4. The method of claim 2,

forming a primer layer on the first surface of the substrate, including:

spraying a primer on the first surface of the substrate to form a primer layer, wherein the primer comprises an organic coating and a resin; and/or the presence of a gas in the gas,

the forming of a topcoat layer on the primer layer includes:

spraying a topcoat on the primer layer to form a topcoat layer, the topcoat including an inorganic phosphate.

5. The method of claim 1,

before forming the first protective layer on the first surface of the substrate, the method further comprises:

and forming a second protective layer on the second surface of the substrate to protect the second surface of the substrate when the substrate is subjected to etching treatment.

6. The method of claim 1,

the drying process of the first protection layer includes:

and baking the first protective layer for 10-30 min at the ambient temperature of 70-90 ℃.

7. The method of claim 1,

the etching treatment of the substrate includes:

washing and soaking the substrate for 1min-1.5 min;

soaking the substrate for 1-2 min by using mixed acid;

soaking the substrate for 2-3 min at normal temperature by adopting hydrofluoric acid with the concentration of 3-5%;

and washing and soaking the substrate for 1min-1.5 min.

8. The method of claim 1,

the etching treatment of the substrate includes:

washing and soaking the substrate for 1min-1.5 min;

soaking the substrate for 1-2 min by using mixed acid;

soaking the substrate with frosting liquid at normal temperature for 2-6 min;

soaking the substrate for 1-2 min by using sulfuric acid solution with the concentration of 15-20%;

and washing and soaking the substrate for 1min-1.5 min.

9. The method of claim 1,

removing the first protective layer on the substrate to obtain a textured substrate, comprising:

soaking the substrate for 50-70 min by using a sodium hydroxide solution with the concentration of 10-15% and the temperature of 80-100 ℃;

and cleaning the surface of the substrate by ultrasonic waves and an alkaline cleaning agent at the ambient temperature of 40-60 ℃ for 90-150 s.

10. A textured substrate prepared by the method of any one of claims 1 to 9.

11. An electronic device comprising the textured substrate of claim 10.

Technical Field

The present disclosure relates to the field of texture substrate technology, and more particularly, to a method for manufacturing a texture substrate, a texture substrate and an electronic device.

Background

With the progress of technology, people can improve the aesthetic feeling and touch feeling of a substrate by forming textures on the surface of the substrate. At present, a common technology for realizing the texture substrate is a yellow light process, but in the yellow light process, a photomask is required to be manufactured for exposure of yellow light, and only one pattern texture can be formed on one photomask, so that the texture pattern on the surface of the substrate is single, and the requirement of pursuing personalization of a user cannot be met.

Disclosure of Invention

A first aspect of an embodiment of the present application provides a method for manufacturing a textured substrate, where the method includes: providing a substrate; forming a first protective layer on the first surface of the substrate; drying the first protective layer to enable the first protective layer to be cracked to form textures; etching the substrate to at least partially remove the substrate exposed in the chapped area to form a texture on the substrate; and removing the first protective layer on the substrate to obtain the texture substrate.

In a second aspect, the present invention provides a textured substrate, which is prepared by the foregoing method for manufacturing a textured substrate.

A third aspect of the embodiments of the present application provides an electronic device, which includes the foregoing texture substrate.

The beneficial effect of this application is: unlike the prior art, the present application provides a substrate; forming a first protective layer on the first surface of the substrate; drying the first protective layer to enable the first protective layer to be cracked to form textures; etching the substrate to at least partially remove the substrate exposed in the chapped area to form a texture on the substrate; and removing the first protective layer on the substrate to obtain the texture substrate. The texture substrate is characterized in that the first protective layer is naturally cracked to form textures, different texture patterns can be formed, and therefore after the substrate is etched on the basis of the first protective layer, the texture patterns identical to those of the first protective layer can be correspondingly formed, and the texture substrate is different from the texture substrate formed by a photomask adopting fixed patterns.

Drawings

In order to more clearly illustrate the technical solutions in the present application, the drawings required in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor. Wherein:

fig. 1 is a schematic flow chart illustrating a method for manufacturing a textured substrate according to an embodiment of the present disclosure;

FIG. 2 is a schematic structural diagram of a substrate and a first protective layer provided by the present application before being cracked;

FIG. 3 is a flowchart illustrating an embodiment of step S12 in FIG. 1;

FIG. 4 is a schematic view of a substrate and a first protective layer provided by the present application after being cracked;

FIG. 5 is a flowchart illustrating an embodiment of step S14 in FIG. 1;

FIG. 6 is a schematic flow chart illustrating a method of fabricating a textured substrate according to an embodiment of the present disclosure;

FIG. 7 is a schematic structural view of a substrate and a second passivation layer provided herein before the first passivation layer is cracked;

FIG. 8 is a flowchart illustrating an embodiment of step S25 in FIG. 6;

FIG. 9 is a schematic view of a structure after a substrate etch process;

FIG. 10 is a schematic view of the texture pattern of three textured substrates of the present application;

fig. 11 is a schematic structural diagram of an embodiment of an electronic device according to the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first" and "second" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1 to 5, fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a textured substrate provided by the present application, fig. 2 is a schematic flow chart of a structure of the substrate and a first protective layer provided by the present application before being cracked, fig. 3 is a schematic flow chart of an embodiment of step S12 in fig. 1, fig. 4 is a schematic flow chart of the substrate and the first protective layer provided by the present application after being cracked, and fig. 5 is a schematic flow chart of an embodiment of step S14 in fig. 1.

As shown in fig. 1, the method for manufacturing the textured substrate may include the following steps:

step S11: a substrate is provided.

The substrate may be formed of one material or may be formed of a plurality of different materials. For example, the substrate may be formed of one or more of glass, metal, and plastic. Wherein, the glass can be mirror glass or AG (Anti-glass) glass, also called Anti-reflection glass and Anti-glare glass.

The substrate may be transparent (e.g., translucent, fully transparent) or may have a color, such as red, yellow, green, blue, and the like. The substrate can be made of a material with color, or a layer of pigment, such as colored paint, can be coated on the transparent substrate in the later period, so that the substrate and a color film layer formed in the later period are matched to form the required color.

Alternatively, the color and material of the substrate may be selected according to actual conditions. In this embodiment, a glass substrate is used as an example of the substrate.

The shape of the substrate may not be limited to a plate shape, but may also be some irregular shapes, and the shape of the substrate is not limited in this embodiment. The substrate may include a plurality of surfaces, and the first surface may be one of the plurality of surfaces of the substrate. In other embodiments, the number of the first surfaces may be plural. In this embodiment, the plurality of fingers is at least two.

It can be understood that the usage of the base plate that this embodiment provided is various, and the base plate can be applied to electronic equipment, for example cell-phone, panel computer, notebook computer, intelligent wearing equipment etc. to the cell-phone is the example, and the base plate can be screen protection apron, battery visor, camera visor, fingerprint module visor etc.. Therefore, when the substrate is a screen protection cover plate, a camera protection cover, or a fingerprint module protection cover, the substrate is generally required to be at least partially transparent, so that light can pass through the substrate and enter the electronic device or exit from the electronic device.

In other embodiments, the substrate may also be applied to an ornament other than an electronic device, so as to improve the decoration effect by using the texture pattern on the substrate, and the texture of different patterns may be obtained according to the manufacturing method provided in this embodiment, so that the texture pattern of the substrate may be enriched, and the decoration effect of the ornament may be further improved.

It should be noted that the decoration may be any kind of object, and the substrate may be combined with the decoration in any kind of manner (e.g., adhering, welding, clamping), so as to improve the decoration effect of the decoration. For example, the decoration may be a glass door, and it is understood that the glass door is commonly used as a toilet door, a wardrobe door, a kitchen door, etc., and needs to have a certain decoration when functioning as a partition. Taking a bathroom door as an example, generally, glass with low transparency is inlaid on the bathroom door, and in order to improve aesthetic feeling, a pattern is generally designed on the glass of the bathroom door to improve decorative effect, so that the embodiment can provide the glass with personalized patterns and apply the glass to the bathroom door. In addition, the substrate itself can be used as a decoration, for example, the substrate can be a cup, specifically a glass, and the outer surface of the glass generally has a texture pattern to improve the aesthetic feeling and the touch feeling of the cup. The outer surface of the cup here is the first surface of the cup, i.e. the side which can be in contact with the cup when the user holds the cup. When a user holds the cup, the texture pattern on the first surface of the cup can improve the touch feeling of the user and can prevent slipping.

Step S12: a first protective layer is formed on the first surface of the substrate.

As shown in fig. 2, the first surface 11 of the substrate 10 is generally a surface that can be viewed or touched by a user. Specifically, the first surface 11 may be a surface that a user may view or contact after the substrate 10 is mounted on a corresponding device or object. For example, taking a mobile phone as an example, the substrate 10 may be a rear case of the mobile phone, where the rear case includes a decoration surface and a mounting surface that are oppositely disposed, where the decoration surface is a surface far away from the display screen, and after the rear case is mounted on the electronic device, a user can directly view and touch the decoration surface; the mounting surface is a surface proximate to the display screen that is generally not viewable and touchable by a user when the rear housing is mounted to the electronic device. In the present embodiment, the first surface 11 of the substrate 10 is a decorative surface of the rear housing, and the second surface 12 of the substrate 10 is a mounting surface of the rear housing (the second surface will be further described in the following embodiments). In other embodiments, the first surface of the substrate may also be a decorative surface of the rear housing, and the second surface of the substrate may be a mounting surface of the rear housing.

Optionally, the mobile phone rear shell may be a curved surface, a plane or a glass with a different surface shape, and may have a color. Correspondingly, the substrate used should also be a shaped substrate that fits the desired back shell pattern. Generally, the mobile phone rear shell is a curved glass cover plate, and the camera protection cover adopted by the rear camera is a flat glass cover plate.

Optionally, at least a partial region of the first surface 11 of the substrate 10 has the first protection layer 20, i.e. the first protection layer 20 may partially cover the first surface 11. As shown in fig. 4, after the first protective layer 20 is cracked, a cracked region 23 and a protective region 24 are formed, wherein the cracked region 23 corresponds to a cracked portion of the first protective layer 20 for exposing the substrate 10; the protection region 24 corresponds to a portion of the first protective layer 20 that is not cracked, for protecting the substrate 10.

As shown in fig. 3, in some embodiments, step S12 may include sub-steps S121-S124:

step S121: a primer layer is formed on the first surface of the substrate.

As shown in fig. 2 and 3, in some embodiments, the first protective layer includes a primer layer and a topcoat layer, and a surface tension difference may be generated between the topcoat layer and the primer layer, thereby generating a high shrinkage rate and forming cracks, so that the first protective layer has a textured pattern.

Specifically, a primer may be sprayed on the first surface of the substrate to form a primer layer. In addition, the primer may be applied to the first surface of the substrate by a coating method such as brush coating or dip coating. For example, the spray coating may be a spray gun or a disc atomizer, and is applied to the surface of an object to be coated by dispersing into uniform and fine droplets by means of pressure or centrifugal force. Spraying can be classified into air spraying, airless spraying, electrostatic spraying, and various derivatives of the above basic spraying forms, such as high flow, low pressure atomized spraying, thermal spraying, automatic spraying, multiple spray, and the like.

The primer may include organic paint and resin, and the organic paint may be tung oil, linseed oil, soybean oil, fish oil, etc. Organic paint and resin belong to film-forming materials, besides, the primer also contains a solvent, mainly a dispersion medium (comprising various organic solvents and water), and is generally used for diluting the film-forming materials to form viscous liquid so as to facilitate production and construction. The proportion of each component in the primer can be selected according to the actual situation, and is not limited herein.

Optionally, the thickness of the primer layer is 20 μm to 40 μm (micrometers), for example, 25 μm, 30 μm, and 40 μm may be possible.

Step S122: standing the substrate at room temperature for 60-120 min.

Alternatively, the standing time of the substrate may be selected according to actual conditions, and may be, for example, 70min, 80min, 90min (minutes), or the like.

Step S123: and forming a finishing paint layer on the primer layer.

Specifically, a topcoat may be sprayed on the primer layer to form a topcoat layer. The top coat is covered on the base coat, and can provide covering power. Besides spraying, the finishing paint can be coated on the primer layer by coating methods such as brushing and dipping.

Wherein the topcoat may include an inorganic phosphate. In this embodiment, the crack, which is a channel for subsequent etching of the substrate, is formed by high shrinkage due to a surface tension difference of the topcoat including inorganic phosphate on the organic coating, and the same texture pattern appears on the substrate after a certain time of etching.

Alternatively, the thickness of the topcoat layer may be 10 μm to 30 μm, for example, 15 μm, 20 μm and 25 μm.

The primer and topcoat may be collectively referred to herein as crack protection oils.

Step S124: and standing the substrate at room temperature for 30-60 min to crack the first protective layer and expose part of the substrate from the cracked part of the first protective layer.

Alternatively, the standing time of the substrate may be selected according to actual conditions, and may be 35min, 40min, 55min, or the like.

In this step, the still standing can be continued or finished according to the cracking degree of the first protective layer, and the next step is carried out. For example, when the degree of cracking of the first protective layer is satisfied, the description may proceed to the next drying process, so that the substrate may be finished standing, and then proceed to step S13. If the cracking degree of the first protective layer is not met, the next drying treatment cannot be carried out, and therefore the substrate needs to be kept standing. Here, the cracking degree is related to the depth and width of the crack, and generally, when the cracking degree is satisfied, the crack is deep enough to expose a portion of the substrate from the cracked portion of the first protective layer, and the width of the crack can be selected according to actual conditions.

Step S13: and drying the first protective layer to enable the first protective layer to be cracked to form textures.

Specifically, the first protective layer may be baked at an ambient temperature of 70 ℃ to 90 ℃ for 10min to 30min to harden the first protective layer, and the hardened first protective layer may prevent the protected region by the first protective layer from being not etched but only the chapped region from being etched in the step of performing the etching process on the substrate, so that the same texture pattern as the first protective layer may be formed on the substrate. Optionally, during the baking process, the baking time and the baking temperature of the first protective layer can also be adjusted according to the actual condition of the first protective layer.

In one embodiment, the first protective layer may be baked at an ambient temperature of about 80 ℃ for 10 min.

Step S14: and etching the substrate to at least partially remove the exposed substrate in the chapped area so as to form texture on the substrate.

As shown in fig. 5, in the present embodiment, step S14 may include sub-steps S141-S144:

step S141: and (3) washing and soaking the substrate for 1-1.5 min.

Optionally, the substrate may be soaked with clean water for 1min to 1.5min to wet the substrate and the first protective layer on the surface of the substrate.

In one embodiment, the substrate may be soaked with clean water for 1 min.

Step S142: soaking the substrate with mixed acid for 1-2 min.

The mixed acid may include at least two of hydrofluoric acid, sulfuric acid and nitric acid, wherein the hydrofluoric acid, the sulfuric acid and the nitric acid are used for cleaning the primer remained on the first protective layer in the chapped area, and the hydrofluoric acid may also activate the first surface of the substrate. Wherein, in the mixed acid solution, the concentration of hydrofluoric acid is 0.5-1%, the concentration of sulfuric acid is 6-8%, and the concentration of nitric acid is 8-10%.

Step S143: and soaking the substrate for 2-3 min at normal temperature by adopting hydrofluoric acid with the concentration of 3-5%.

Wherein, the substrate is soaked in hydrofluoric acid with the concentration of 3-5% for 2-3 min at normal temperature, so as to at least partially remove the substrate exposed from the chapped area, thereby forming the texture on the substrate.

Step S144: and (3) washing and soaking the substrate for 1-1.5 min.

Optionally, the substrate may be soaked in clean water for 1min to 1.5min to remove hydrofluoric acid on the substrate, so as to clean the substrate.

In one embodiment, the substrate may be soaked with clean water for 1 min.

Step S15: and removing the first protective layer on the substrate to obtain the texture substrate.

Specifically, a sodium hydroxide solution with the concentration of 10-15% and the temperature of 80-100 ℃ can be adopted to soak the substrate for 50-70 min, and then ultrasonic waves and an alkaline cleaning agent are adopted to clean the surface of the substrate, wherein the environmental temperature can be 40-60 ℃, and the cleaning time can be 90-150 s(s).

Alternatively, the alkaline cleaner may have a pH of 8 to 14.

In the present embodiment, a substrate is provided; forming a first protective layer on the first surface of the substrate; drying the first protective layer to enable the first protective layer to be cracked to form textures; etching the substrate to at least partially remove the substrate exposed in the chapped area to form a texture on the substrate; and removing the first protective layer on the substrate to obtain the texture substrate. The texture substrate is characterized in that the first protective layer is naturally cracked to form textures, different texture patterns can be formed, and therefore after the substrate is etched on the basis of the first protective layer, the texture patterns identical to those of the first protective layer can be correspondingly formed, and the texture substrate is different from the texture substrate formed by a photomask adopting fixed patterns.

Referring to fig. 6 to 9, fig. 6 is a schematic flowchart illustrating a method for manufacturing a textured substrate according to an embodiment of the present disclosure, fig. 7 is a schematic structural diagram illustrating a substrate and a second passivation layer before the first passivation layer is cracked, fig. 8 is a schematic flowchart illustrating an embodiment of step S25 in fig. 6, and fig. 9 is a schematic structural diagram illustrating a substrate after being etched.

As shown in fig. 6, the method for manufacturing the textured substrate may include the following steps:

step S21: a substrate is provided.

Different from the foregoing embodiment, the present embodiment further includes processing the second surface of the substrate, specifically, forming a second protection layer on the second surface of the substrate to protect the second surface of the substrate when the substrate is subjected to the etching process, so as to avoid forming a texture pattern on the second surface of the substrate. The second surface is different from the first surface. When the substrate has a plurality of surfaces, the number of the second surfaces may be a plurality of the surfaces, or 1 of the surfaces.

In some embodiments, before step S22, a pretreatment of the substrate may be further included to clean the surface of the substrate. Specifically, the surface of the substrate can be cleaned by ultrasonic waves, the used cleaning agent is a neutral cleaning agent, the pH value is 6-8, the environmental temperature is 40-60 ℃, and the cleaning time is 40-80 s. In one embodiment, the substrate may be pretreated at an ambient temperature of 50 ℃ for a cleaning time of 60 seconds.

Step S22: and forming a second protective layer on the second surface of the substrate to protect the second surface of the substrate when the substrate is subjected to an etching process.

Step S23: a first protective layer is formed on the first surface of the substrate.

As shown in fig. 7, in the present embodiment, a second protection layer 30 is formed on the second surface 12 of the substrate 10.

Taking a mobile phone as an example, in combination with the foregoing embodiment, the second surface of the substrate may be a mounting surface of the rear shell, and specifically, a second protection layer may be formed on the mounting surface of the rear shell, and a first protection layer is formed on the decorative surface of the rear shell, so as to protect the mounting surface of the rear shell when the rear shell is subjected to etching treatment.

Specifically, the acid-resistant protective oil may be sprayed on the second surface of the substrate to form a second protective layer on the second surface of the substrate. The acid-resistant protective oil can play a role in resisting etching in the etching treatment. Wherein the main component of the acid-resistant protective oil can comprise resin, high molecular polymer, etc.

The thickness of the second protective layer may be, for example, 10 μm to 50 μm, and in other embodiments, the thickness of the second protective layer may not be limited as long as the second surface of the substrate can be sufficiently protected in the etching step.

Step S24: and drying the first protective layer and the second protective layer to enable the first protective layer to be cracked to form textures, and curing the second protective layer.

Specifically, the first protective layer and the second protective layer can be baked at an ambient temperature of 70 ℃ to 90 ℃ for 10min to 30 min. In practical operation, the substrate and the first protective layer and the second protective layer on the surface of the substrate are together placed in a high-temperature environment of 70-90 ℃ for baking.

In some embodiments, before step S25, the substrate after drying may be cleaned to remove the foreign matters volatilized during the drying process. Specifically, the surface of the substrate can be cleaned by ultrasonic waves, the used cleaning agent is a neutral cleaning agent, the pH value is 6-8, the environmental temperature is 40-60 ℃, and the cleaning time is 40-80 s. In one embodiment, when the dried substrate is cleaned, the ambient temperature may be 50 ℃ and the cleaning time may be 60 s.

Step S25: and etching the substrate to at least partially remove the exposed substrate in the chapped area so as to form texture on the substrate.

In this embodiment, since the second protection layer is formed on the second surface of the substrate, when the substrate is etched, the portion protected by the second protection layer is prevented from being etched.

As shown in fig. 8, in the present embodiment, step S25 may include sub-steps S251-S254:

step S251: and (3) washing and soaking the substrate for 1-1.5 min.

Optionally, the substrate may be soaked with clean water for 1min to 1.5min to wet the substrate, the first protective layer and the second protective layer on the surface of the substrate.

In one embodiment, the substrate may be soaked with clean water for 1 min.

Step S252: soaking the substrate with mixed acid for 1-2 min.

The mixed acid may include at least two of hydrofluoric acid, sulfuric acid and nitric acid, wherein the hydrofluoric acid, the sulfuric acid and the nitric acid are used for cleaning the primer remained on the first protective layer in the chapped area, and the hydrofluoric acid may also activate the first surface of the substrate. Wherein, in the mixed acid solution, the concentration of hydrofluoric acid is 0.5-1%, the concentration of sulfuric acid is 6-8%, and the concentration of nitric acid is 8-10%.

Step S253: soaking the substrate with frosting solution at room temperature for 2-6 min.

Wherein the frosting solution can be common frosting solution or flash sand frosting solution.

Before step S253, preparation and curing of a frosting solution may be further included. In some embodiments, the frosting powder and the hydrochloric acid can be mixed according to a certain proportion and sufficiently and uniformly stirred to obtain a frosting liquid, and the frosting liquid is sealed and kept stand for 48 hours for curing. The frosting powder usually comprises fluoride (such as ammonium fluoride, potassium bifluoride, calcium fluoride) as main ingredient, and ammonium sulfate, barium sulfate, potassium sulfate and other additives. When in use, sulfuric acid or hydrochloric acid is added to prepare a frosting solution, the glass product is placed in the frosting solution, and hydrofluoric acid generated by the reaction of the frosting powder and the acid erodes the glass product to achieve the frosting effect. And then soaking the substrate for 2-6 min at normal temperature by adopting a frosting solution, so that the exposed surface of the substrate is fully reacted with the frosting solution, and at least partially removing the exposed substrate in the chapped area to form texture on the substrate.

The difference from the above embodiment is that the texture of the substrate after the frosting etching process has a grainy feel, whereas the texture obtained in the above embodiment is relatively smooth. In addition, the substrate is etched by adopting the flash sand frosting liquid, and the flash sand is adsorbed on the surface of the substrate after the substrate is etched, so that the glare effect is generated, and the decorative effect can be improved.

When the substrate is made of AG glass, the original AG sand effect of the AG glass can be the same as or different from the sand effect obtained by etching the frosting solution.

Step S254: soaking the substrate for 1-2 min by using sulfuric acid solution with the concentration of 15-20%.

Wherein, the sulfuric acid solution with the concentration of 15-20% is adopted to soak the substrate for 1-2 min, so as to remove the residual frosting solution on the substrate.

Step S255: and (3) washing and soaking the substrate for 1-1.5 min.

Optionally, the substrate may be soaked in clean water for 1min to 1.5min to remove hydrofluoric acid on the substrate, so as to clean the substrate.

In one embodiment, the substrate may be soaked with clean water for 1 min.

Step S26: and removing the first protective layer and the second protective layer on the substrate to obtain the texture substrate.

Specifically, a sodium hydroxide (NaOH) solution with the concentration of 10-15% and the temperature of 80-100 ℃ can be adopted to soak the substrate for 50-70 min, and then ultrasonic waves and an alkaline cleaning agent are adopted to clean the surface of the substrate, wherein the environmental temperature can be 40-60 ℃, and the cleaning time can be 90-150 s.

Alternatively, the alkaline cleaner may have a pH of 8 to 14.

In one embodiment, the substrate may be taken out after being soaked in 10% sodium hydroxide solution at 90 ℃ for 60min, and then the surface of the substrate may be cleaned with ultrasonic waves and alkaline cleaning agent at 50 ℃ for 120 s.

It can be understood that various embodiments of the present application may be combined, and for a step that is not described in detail in this embodiment, a corresponding position in other embodiments may be referred to, and details are not described here.

Referring to fig. 10, fig. 10 is a schematic view of texture patterns of three texture substrates according to the present application.

In this embodiment, the texture substrate is prepared by the method for manufacturing the texture substrate in any of the above embodiments. For the description of the texture substrate, the embodiment of the method for manufacturing the texture substrate can be combined, and details are not repeated herein.

Wherein, the base plate with different texture patterns can be obtained by setting different primer thicknesses and finish thicknesses and drying parameters (such as ambient temperature and baking time).

Example 1: the thickness of the primer layer is 35 mu m, the thickness of the finish layer is 25 mu m, the ambient temperature is 75-85 ℃, and the baking time is 10 min.

Example 2: the thickness of the primer layer is 30 mu m, the thickness of the finish layer is 20 mu m, the ambient temperature is 75-85 ℃, and the baking time is 20 min.

Example 2: the thickness of the primer layer is 25 mu m, the thickness of the finish layer is 15 mu m, the ambient temperature is 75-85 ℃, and the baking time is 30 min.

As shown in fig. 10, the texture pattern obtained after etching the substrate corresponding to example 1 was close to a large-texture imitation leather, the texture pattern obtained after etching the substrate corresponding to example 2 was close to a medium-texture imitation leather, and the texture pattern obtained after etching the substrate corresponding to example 2 was close to a fine-texture imitation leather. In this embodiment, the first protection layer is naturally cracked to form a natural leather texture, and the first protection layer is naturally cracked in each manufacturing process, so that different texture patterns (far looking like leather, near looking like slightly different, for example, cracks have different directions) can be formed, and the substrate can have different leather textures after the substrate is etched based on different first protection layers.

In the embodiment, the leather texture can be formed by utilizing the chapping characteristic of the crack protection oil instead of a yellow light process, compared with a single photomask in the yellow light process, the texture formed by the crack protection oil has natural flexibility, the trend of the texture veins is changed greatly, and the artistic value is higher.

Referring to fig. 11, fig. 11 is a schematic structural diagram of an embodiment of an electronic device according to the present application.

In this embodiment, the electronic device includes the textured substrate prepared by any of the foregoing embodiments.

Electronic devices include, but are not limited to, televisions, desktop computers, laptop computers, handheld computers, wearable devices, head mounted displays, reader devices, portable music players, portable games, notebook computers, ultra-mobile personal computers (μmPC), netbooks, and cicada-phone, Personal Digital Assistants (PDAs), Augmented Reality (AR), Virtual Reality (VR) devices.

The electronic device may further comprise a processor and a memory coupled to the processor for storing program data.

In particular, the processor is adapted to control itself and the memory to implement the steps of any of the above-described method embodiments. The processor may also be referred to as a CPU (Central Processing Unit). The processor may be an integrated circuit chip having signal processing capabilities. The Processor may also be a general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic, discrete hardware components. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. In addition, the processor may be implemented collectively by a plurality of integrated circuit chips.

As shown in fig. 11, in an embodiment, the electronic device may include a display module 110, a middle frame 120, and a rear case 130. The display module 110 and the rear shell 130 are respectively located on two opposite sides of the middle frame 120, and can be assembled and connected with the middle frame 120 through one or more combinations of assembly modes such as glue joint, clamping joint, welding and the like, so that a basic structure that the display module 110 and the rear shell 130 clamp the middle frame 120 together is formed after the three are assembled. Further, a cavity with a certain volume may be formed between the display module 110 and the rear case 130, and the cavity may be used to provide structural members such as the camera main body 140, the camera decoration assembly 150, the main board 160, and the battery 170, so that the electronic device 100 can implement corresponding functions. The camera decoration assembly 150 is used for decorating and protecting the camera body 140. The display module 110, the camera body 140, the camera decoration assembly 150 and other components may be electrically connected to the main board 160, the battery 170 and the like through a Flexible Printed Circuit (FPC), respectively, so that they can be supplied with electric power from the battery 170 and can execute corresponding instructions under the control of the main board 160. The camera decoration assembly 150 may be partially accommodated in the cavity, and the remaining portion is disposed through the mounting hole 131 of the rear housing 130 and protrudes out of the rear housing 130.

The position, number, shape, size and other parameters of the mounting holes 131 on the rear housing 130 can be designed reasonably according to actual requirements, and are not limited herein. In this embodiment, the number of the mounting holes 131 is one, and the mounting holes are rectangular and have four corners in smooth transition.

The rear housing 130 includes an opposite decorative surface 132 and a mounting surface 133, wherein the decorative surface 132 is a surface away from the display screen, and a user can directly view and touch the decorative surface 132 after the rear housing 130 is mounted on the electronic device 100; the mounting surface 133 is a surface proximate to the display screen, and a user is generally unable to view and touch the mounting surface 133 after the rear housing 130 is mounted to the electronic device 100. In this embodiment, the texture pattern on the rear shell 130 is manufactured by the method for manufacturing the texture substrate in any of the above embodiments, that is, the rear shell 130 is the texture substrate 10 in the above embodiments. In this embodiment, the decorative surface 132 of the rear housing 130 is a first surface of the substrate, the mounting surface 133 of the rear housing 130 is a second surface of the substrate, and during the manufacturing process, a first protective layer is formed on the decorative surface 132 of the rear housing 130 to form a texture pattern, and a second protective layer is formed on the mounting surface 133 of the rear housing 130 to protect the mounting surface 133 from being etched. In other embodiments, the decorative surface 132 of the rear case 130 is the second surface of the substrate, the mounting surface 133 of the rear case 130 is the first surface of the substrate, and correspondingly, the mounting surface 133 forms a textured pattern, and the decorative surface 132 is not etched, i.e., is not formed with a textured pattern.

Alternatively, the rear case 130 may be a glass having a curved surface, a flat surface, or an opposite surface shape, and may have a color. In some embodiments, the rear case 130 may employ mirror glass or AG glass.

Further, the edge of the display module 110 may be bent toward the middle frame 120, so that the image displayed on the display module 110 may extend from the front surface of the display module 110 to the side surface thereof in a form similar to a "waterfall". So set up, not only can reduce or even hide the black edge of display module assembly 110 to make electronic equipment 100 can provide bigger demonstration field of vision for the user, can also make display module assembly 110 build a visual effect who surrounds the demonstration, thereby make electronic equipment 100 bring one kind and be different from bang screen, water droplet screen, dig the visual experience of flat full-face screen such as hole screen, over-and-under type camera, sliding closure type camera for the user, and then increase electronic equipment 100's competitiveness. Accordingly, the edge of the rear case 130 may also be bent toward the middle frame 120, so as to improve the grip feeling and aesthetic appearance of the electronic apparatus 100.

The display module 110 may include a display screen, a touch screen, and other structural members, and the display screen may be a flexible display screen, and the like, which is not particularly limited. The material of the rear case 130 may be glass, metal, hard plastic, etc., so that the rear case 130 has a certain structural strength. Corresponding brand identification (LOGO) can also be arranged on the rear shell 130 to beautify the appearance of the electronic equipment and improve the brand identification degree.

As described above for the basic structure of the electronic device 100 provided in the present application, in other embodiments, the electronic device 100 may further include a speaker assembly, a touch assembly, and other structural members, which are not described herein again.

In the several embodiments provided in the present application, it should be understood that the disclosed method and apparatus may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of a module or a unit is merely a logical division, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some interfaces, and may be in an electrical, mechanical or other form.

Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, a network device, or the like) or a processor (processor) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.