阅读说明：本技术 微机械陀螺仪 (Micromechanical gyroscope ) 是由 阚枭 占瞻 马昭 杨珊 李杨 陈秋玉 洪燕 黎家健 于 2021-08-09 设计创作，主要内容包括：本发明提供了一种微机械陀螺仪,包括基底、固定于基底的至少两个检测结构、以及连接相邻检测结构的耦合梁,每一检测结构包括固定于基底的锚点、悬置于基底上并与锚点连接的圆环形振动结构、多个面内换能器以及多个面外换能器,面内换能器绕圆环形振动结构的中心分布在圆环形振动结构的外侧,面外换能器绕圆环形振动结构的中心分布于圆环形振动结构下方或上方,该检测结构工作在结构面内的3θ体振动驱动模态以及工作在结构面外的第2阶弯曲体振动检测模态,两个体振动模态可相互互换。本发明的微机械陀螺仪可以提高检测灵敏度。(The invention provides a micromechanical gyroscope which comprises a substrate, at least two detection structures fixed on the substrate and a coupling beam connected with adjacent detection structures, wherein each detection structure comprises an anchor point fixed on the substrate, a circular ring vibration structure suspended on the substrate and connected with the anchor point, a plurality of in-plane transducers and a plurality of out-of-plane transducers, the in-plane transducers are distributed on the outer side of the circular ring vibration structure around the center of the circular ring vibration structure, the out-of-plane transducers are distributed below or above the circular ring vibration structure around the center of the circular ring vibration structure, the detection structure works in a 3 theta body vibration driving mode in the structural plane and a 2 nd-order bending body vibration detection mode outside the structural plane, and the two body vibration modes can be mutually exchanged. The micromechanical gyroscope of the invention can improve the detection sensitivity.)

1. A micromechanical gyroscope is characterized by comprising a substrate, at least two detection structures fixed on the substrate, and a coupling beam connected with the adjacent detection structures and forming mechanical coupling, wherein each detection structure comprises an anchor point fixed on the substrate, a circular ring vibration structure suspended on the substrate and forming mechanical coupling with the anchor point, a plurality of in-plane transducers used for coupling a mechanical field and an electric field in a plane where the detection structure is located, and a plurality of out-of-plane transducers used for coupling the out-of-plane mechanical field and the electric field where the detection structure is located, the in-plane transducers are distributed on the outer side of the circular ring vibration structure around the center of the circular ring vibration structure, each in-plane transducer is fixedly connected with the substrate, and the two adjacent in-plane transducers are arranged at intervals; the out-of-plane transducers are distributed above or below the annular vibration structure around the center of the annular vibration structure, each out-of-plane transducer is fixedly connected with the substrate and arranged at intervals with the annular vibration structure, and two adjacent out-of-plane transducers are arranged at intervals;

the circular ring vibration structure in one detection structure is connected with the circular ring vibration structure in the adjacent detection structure through the coupling beam, so that the motion of the two adjacent detection structures is related; the detection structure works in two body vibration modes, wherein the two body vibration modes comprise a 3 theta body vibration driving mode working in the detection structure surface and a 2 nd-order bending body vibration detection mode working out of the detection structure surface, and the two body vibration modes can be mutually exchanged.

2. The micromachined gyroscope of claim 1, wherein: the annular vibration structure is sleeved outside the anchor point and is fixedly connected with the anchor point in an abutting mode.

3. The micromachined gyroscope of claim 1, wherein: the ring-shaped vibration structure is sleeved outside the anchor point, the ring-shaped vibration structure and the anchor point are arranged at intervals, each detection structure further comprises a connecting beam arranged between the ring-shaped vibration structure and the anchor point, and the connecting beam is used for connecting the ring-shaped vibration structure and the anchor point.

4. The micromachined gyroscope of claim 3, wherein: the number of the connecting beams in each detection structure is 3M, and M is an integer greater than or equal to 1.

5. The micromachined gyroscope of claim 4, wherein: each connecting beam comprises a first supporting beam and a second supporting beam symmetrically arranged with the first supporting beam, one end of the first supporting beam is connected with the anchor point, and the other end of the first supporting beam is connected with the annular vibration structure; one end of the second supporting beam is connected with the anchor point, and the other end of the second supporting beam is connected with the annular vibration structure.

6. The micromachined gyroscope of claim 1, wherein: an insulating layer is arranged on the substrate, and the anchor point, the in-plane transducer and the out-of-plane transducer are connected with the substrate through the insulating layer.

7. The micromachined gyroscope of claim 1, wherein: the anchor point is arranged inside or outside the annular vibration structure.

8. The micromachined gyroscope of claim 1, wherein: the number of the in-plane transducers in each detection structure is 3N, the number of the out-of-plane transducers is 2N, and N is an integer greater than or equal to 1.

9. The micromachined gyroscope of claim 1, wherein: 3N the interior transducer wind ring shape vibration structure's center evenly distributed, 2N the off-plate transducer wind ring shape vibration structure's center evenly distributed.

10. The micromachined gyroscope of claim 1, wherein: the transduction form of the in-plane transducer comprises one or more combinations of capacitance, inductance, thermoelectricity and piezoelectricity; the transduction form of the out-of-plane transducer comprises one or more combinations of capacitance, inductance, thermoelectricity and piezoelectricity.

[ technical field ] A method for producing a semiconductor device

The invention relates to the field of turnover inclination detection, in particular to a micromechanical gyroscope.

[ background of the invention ]

A micro Mechanical gyroscope, i.e., a mems (micro Electro Mechanical systems) gyroscope, is a typical angular velocity microsensor, and has wide applications in the consumer electronics market due to its advantages of small size, low power consumption, and convenient processing. With the gradual improvement of performance in recent years, MEMS gyroscopes are widely used in the fields of industry, automobiles, virtual reality, and the like.

At present, in the traditional body vibration type overturning/inclining detection structure form, most typical disc-shaped body vibration overturning/inclining detection structures of ADI and GIT, the two typical units adopt the in-plane 2 theta vibration shape of the structure as a driving mode and adopt the out-of-plane 3 rd order bending vibration shape of the structure as a detection mode. However, based on the coriolis effect angle analysis, the matching degree between the driving mode and the detection mode of the detection structure is poor, the moving mass of the driving mode part does not participate in the coriolis effect, and the coriolis gain is low, so that the sensitivity and the accuracy of the disk gyroscope are not high enough.

Therefore, there is a need to provide an improved micromechanical gyroscope to address the above-mentioned problems.

[ summary of the invention ]

The invention aims to provide a micromechanical gyroscope which can improve detection sensitivity.

The technical scheme of the invention is as follows: a micromechanical gyroscope comprises a substrate, at least two detection structures fixed on the substrate, and a coupling beam connected with the adjacent detection structures and forming mechanical coupling, wherein each detection structure comprises an anchor point fixed on the substrate, a circular ring vibration structure suspended on the substrate and forming mechanical coupling with the anchor point, a plurality of in-plane transducers used for coupling a mechanical field and an electric field in a plane where the detection structure is located, and a plurality of out-of-plane transducers used for coupling the mechanical field and the electric field outside the plane where the detection structure is located, the in-plane transducers are distributed on the outer side of the circular ring vibration structure around the center of the circular ring vibration structure, each in-plane transducer is fixedly connected with the substrate, and the two adjacent in-plane transducers are arranged at intervals; the out-of-plane transducers are distributed above or below the annular vibration structure around the center of the annular vibration structure, each out-of-plane transducer is fixedly connected with the substrate and arranged at intervals with the annular vibration structure, and two adjacent out-of-plane transducers are arranged at intervals;

the circular ring vibration structure in one detection structure is connected with the circular ring vibration structure in the adjacent detection structure through the coupling beam, so that the motion of the two adjacent detection structures is related; the detection structure works in two body vibration modes, wherein the two body vibration modes comprise a 3 theta body vibration driving mode working in the detection structure surface and a 2 nd-order bending body vibration detection mode working out of the detection structure surface, and the two body vibration modes can be mutually exchanged.

Optionally, the annular vibration structure is sleeved outside the anchor point and is fixedly connected with the anchor point in an abutting mode.

Optionally, the circular ring-shaped vibration structure is sleeved outside the anchor point, the circular ring-shaped vibration structure and the anchor point are arranged at intervals, each detection structure further comprises a connecting beam arranged between the circular ring-shaped vibration structure and the anchor point, and the connecting beam connects the circular ring-shaped vibration structure and the anchor point.

Optionally, the number of the connecting beams in each of the detecting structures is 3M, where M is an integer greater than or equal to 1.

Optionally, each connecting beam comprises a first supporting beam and a second connecting beam symmetrically arranged with the first supporting beam, one end of the first supporting beam is connected with the anchor point, and the other end of the first supporting beam is connected with the annular vibration structure; one end of the second supporting beam is connected with the anchor point, and the other end of the second supporting beam is connected with the annular vibration structure.

Optionally, an insulating layer is disposed on the substrate, and the anchor point, the in-plane transducer, and the out-of-plane transducer are connected to the substrate through the insulating layer.

Optionally, the anchor point is arranged inside or outside the circular ring vibration structure.

Optionally, the number of the in-plane transducers in each of the circular mass blocks is 3N, and the number of the out-of-plane transducers is 2N, where N is an integer greater than or equal to 1.

Optionally, 3N in-plane transducers are uniformly distributed around the center of the circular ring-shaped vibration structure, and 2N out-of-plane transducers are uniformly distributed around the center of the circular ring-shaped vibration structure.

Optionally, the transduction form of the in-plane transducer comprises one or more combinations of capacitance, inductance, thermoelectricity and piezoelectricity; the transduction form of the out-of-plane transducer comprises one or more combinations of capacitance, inductance, thermoelectricity and piezoelectricity.

The invention has the beneficial effects that: the micromechanical gyroscope comprises at least two detection structures, which are mechanically coupled by a coupling beam. The detection structure works in two body vibration modes, wherein the two body vibration modes comprise a 3 theta body vibration driving mode working in the plane of the detection structure and a 2 nd-order bending body vibration detection mode working out of the plane of the detection structure. The two individual vibration modes can be mutually exchanged, and the mode shapes of the two individual vibration modes are highly matched with the Coriolis effect, so that the Coriolis gain is obviously improved. Angular momentum and linear momentum conservation between two modals have lower anchor point structure loss simultaneously, and detect through the difference of interior transducer and off-plate transducer, realize the angular vibration, the line vibration autoimmunity effect to external disturbance, and then can improve the sensitivity that detects the structure.

[ description of the drawings ]

Fig. 1 is a schematic structural diagram of a first micromechanical gyroscope according to the present invention;

FIG. 2 is a cross-sectional view of the micromachined gyroscope of FIG. 1 taken along the direction P-P;

FIG. 3 is a schematic diagram of a Coriolis force theoretically applied to a micromechanical gyroscope in an applied embodiment, wherein the micromechanical gyroscope is vibrated by a 3 θ body and enters a driving mode when the micromechanical gyroscope receives an X-axis angular velocity;

fig. 4 is a schematic diagram of an actual detection mode excited when a micromechanical gyroscope in the embodiment of the present application, which enters a driving mode through vibration of a 3 θ body, receives an X-axis angular velocity;

fig. 5 is a schematic structural diagram of a second micromechanical gyroscope according to the present invention;

FIG. 6 is a cross-sectional view of the micromachined gyroscope of FIG. 5 taken along the direction H-H;

FIG. 7 is a schematic view of a first connection of a plurality of masses according to an embodiment of the present application;

FIG. 8 is a schematic view of a second connection of a plurality of masses according to an embodiment of the present application;

FIG. 9 illustrates a method of using a first micromachined gyroscope according to the present invention;

fig. 10 illustrates a second method of using a micromachined gyroscope according to the present invention.

[ detailed description ] embodiments

The invention is further described with reference to the following figures and embodiments.

MEMS (Micro-Electro Mechanical Systems) refers to a complete Micro-electromechanical system integrating Mechanical elements, Micro sensors, Micro actuators, and signal processing and control circuits, interface circuits, communication and power supplies. Micromechanical gyroscopes, i.e., MEMS gyroscopes, are commonly used in a variety of portable electronic devices, such as mobile phones, IPADs, AR \ VR wearable devices, and the like. Are often used to detect physical quantities related to rotation, such as angular velocity. The micromechanical gyroscope can realize somatosensory interaction between a user and equipment, and has wide application prospect.

It should be noted that the micromechanical gyroscope utilizes the principle of coriolis force (also called coriolis force) generation to detect the angular velocity. The coriolis force is an inertial force to which an object in a rotating reference frame is subjected while in motion. In the design of micromechanical gyroscopes, it is first necessary to produce a moving mass. At this time, the mass is in the inertial system, and only a preset motion state is maintained, and the motion state is called a driving mode. When the mass block in the driving mode is rotated, the mass block keeps moving in the original driving mode due to inertia. However, when the mass is observed in the rotational system, it is found that the mass is displaced in a direction perpendicular to the direction of the angular velocity. At this time, it is considered that the mass is subjected to an inertial force in a direction perpendicular to the angular velocity, such an inertial force is called coriolis force, and the direction of the coriolis force can be determined by a right-hand rule. The mass is observed in a rotating system, and besides the original motion of the mass is maintained, the mass also generates displacement in the direction of the Cogowski force, and the motion state is called a detection mode. And detecting the position change of the mass block in the direction of the Cogowski force, and converting the position change into an electric signal to output. The angular velocity can be calculated by measuring the displacement of the mass block in the direction of the Cogowski force, and the angular velocity can be detected.

The micromechanical gyroscope performs detection based on the coriolis effect, and thus can measure a physical quantity related to an angular velocity. Illustratively, a micromechanical gyroscope may measure an amount of roll, an amount of tilt, an angular velocity, or an angular acceleration, among others. The micromechanical gyroscope can measure one of a plurality of measurement values, and can also measure a plurality of measurement values simultaneously. It should be noted that, in an object located in the XOY plane, rotation of the object along the X axis of the coordinate system is called flipping, rotation along the Y axis of the coordinate system is called tilting, and both flipping and tilting are essentially rotations and are related to angular velocity. It is to be understood that, with the exchange of the X-axis and the Y-position, the micromechanical gyroscope for detecting the amount of inversion may be changed to a micromechanical gyroscope for detecting the amount of inclination, and the micromechanical gyroscope for detecting the amount of inclination may also be changed to a micromechanical gyroscope for detecting the amount of inversion.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a first micro-mechanical gyroscope according to the present invention, and fig. 2 is a cross-sectional view of the micro-mechanical gyroscope in fig. 1 along a P-P direction. The present embodiment provides a micromechanical gyroscope 100, where the micromechanical gyroscope 100 includes a substrate 1, at least two detection structures 4, and a coupling beam 7. The base 1 is used to provide support for the components and the sensing structure 4 is used to sense the quantity to be measured. Wherein the detection structures 4 are fixed to the substrate 1 and adjacent detection structures 4 are connected by a coupling beam 7 to form a mechanical coupling.

Each detection structure 4 comprises an anchor point 3, a toroidal vibrating structure 2, a plurality of in-plane transducers 8 and a plurality of out-of-plane transducers 9. Wherein, anchor point 3 is fixed in on the basement 1, and ring shape vibration structure 2 hangs on basement 1 and forms mechanical coupling with anchor point 3, and ring shape vibration structure 2 is connected with basement 1 through anchor point 3. The annular vibration structure 2 is used for generating corresponding displacement change under the action of Cogowski force, the in-plane transducer 8 is used for coupling a mechanical field and an electric field in a plane where the detection structure is located, and the in-plane transducer 8 can realize conversion between electric energy and in-plane mechanical energy of the annular vibration structure 2, namely the in-plane transducer 8 can drive the in-plane motion of the annular vibration structure 2 or convert the in-plane displacement of the annular vibration structure 2 into an electric signal. The out-of-plane transducer 9 is used for coupling a mechanical field and an electric field outside a plane where the detection structure is located, and the out-of-plane transducer 9 can realize conversion between electric energy and out-of-plane mechanical energy of the circular ring vibration structure 2, namely the out-of-plane transducer 9 can drive out-of-plane motion of the circular ring vibration structure 2 or convert out-of-plane displacement of the circular ring vibration structure 2 into an electric signal. The in-plane transducer 8 cooperates with the out-of-plane transducer 9 to enable detection of the quantity to be measured by the detection structure 4.

The in-plane transducers 8 are distributed on the outer side of the annular vibration structure 2 around the center of the annular vibration structure 2, each in-plane transducer 8 is fixedly connected with the substrate 1, and two adjacent in-plane transducers 8 are arranged at intervals; the out-of-plane transducer 9 is distributed above or below the circular ring vibration structure 2 around the center of the circular ring vibration structure 2, specifically, in this embodiment, the out-of-plane transducer 9 is distributed between the circular ring vibration structure 2 and the substrate 1 around the center of the circular ring vibration structure, and alternatively, the out-of-plane transducer 9 may also be distributed on one side of the circular ring vibration structure 2 away from the substrate 1 around the center of the circular ring vibration structure. In the present embodiment, each of the out-of-plane transducers 9 is fixedly connected to the substrate 1 and spaced apart from the circular ring shaped vibrating structure 2, and two adjacent out-of-plane transducers 9 are spaced apart.

The circular ring vibration structure 2 in one detection structure 4 is connected with the circular ring vibration structure 4 in the adjacent detection structure 4 through a coupling beam 7, so that the motions of the two adjacent detection structures 4 are related. It will be appreciated that a single detection structure 4 may enable detection to be measured, and that multiple detection structures 4 are connected by a coupling beam 7 to enable kinematic association with each other. Illustratively, the micromechanical gyroscope includes 2 detection structures 4, which include two circular ring-shaped vibrating structures 2. In the driving mode, the circular ring-shaped vibrating structures 2 can be driven to move in phase. The two annular vibration structures 2 move in the same phase, so that the strength of an electric signal can be improved, and the sensitivity is further improved. Of course, the two vibrating structures may also move in anti-phase, thereby achieving differential detection to be measured.

The detection structure 4 operates in two bulk vibration modes, including a 3 θ bulk vibration drive mode operating in-plane of the detection structure 4, and a 2 nd order bending bulk vibration detection mode operating out-of-plane of the detection structure 4.

Referring to fig. 3, fig. 3 is a schematic diagram of a theoretical coriolis force applied to a micro-mechanical gyroscope in the application embodiment, which enters a detection mode by a 3 θ mode motion, when receiving an X-axis angular velocity. When the circular ring vibration structure 2 is vibrated by the 3 theta body to enter a driving mode, the micromechanical gyroscope receives an angular velocity omega along the X axis_XIn theory, the circular ring-shaped vibration structure 2 can be divided into four equally-distributed areas, the direction of the coriolis force is determined according to the right-hand rule, and the coriolis force F borne by mass points in two adjacent areas is determined according to the right-hand rule_kThe direction is opposite. In a theoretical detection mode, two symmetrical ends of the circular ring-shaped vibration structure 2 move towards the positive direction of the Z axis, and the other two symmetrical ends move towards the negative direction of the Z axis.

In the actual detection, please refer to fig. 4, where fig. 4 is a schematic diagram of an actual detection mode excited when the micro-mechanical gyroscope entering the detection mode through 3 θ mode motion receives an X-axis angular velocity in the embodiment of the present application. The detection mode may be a 2 nd order bending mode out of the structural plane, which matches the direction of the theoretical coriolis force excited by the drive mode. When the driving mode of the annular vibration structure is the in-plane 3 theta vibration mode, the Coriolis force applied to the annular vibration structure is the same as the motion direction of the annular vibration structure under the 2 nd order bending vibration mode. The method realizes the matching between theory and actual situation and improves the detection sensitivity.

It should be noted that, in practical applications, not all parts in the driving mode can participate in the coriolis motion, or the generated displacement can be consistent with the theoretical displacement direction and displacement amount. In the application process of an actual product, some parts in the mass block can generate displacement in the 'correct direction' under the action of the Goldcell force, and other parts in the mass block can not generate displacement due to various reasons or generate displacement which is not accordant with the theory. In the related art, the annular vibration structure usually adopts an in-plane 2 θ vibration mode as a driving mode, and adopts an out-of-plane 3 rd order bending vibration mode as a detection mode. Theoretically, with the in-plane 2 θ vibration pattern, when receiving the angular velocity in the X-axis negative direction, the coriolis force applied to the upper half of the circular ring vibration structure is in the Z-axis positive direction, and the coriolis force applied to the lower half is in the Z-axis negative direction (or the coriolis force applied to the upper half is in the Z-axis negative direction, and the lower half is in the Z-axis positive direction). Theoretically, the circular ring-shaped vibrating structure should be flipped around the X-axis. In practice, however, the circular ring-shaped vibrating structure enters the detection mode with an out-of-plane 3 rd order bending mode. The direction of the Coriolis force applied to the annular vibration structure under the in-plane 2 theta vibration mode is different from the movement direction of the annular vibration structure under the out-of-plane 3 rd-order bending vibration mode. This mismatch between reality and theory results in a lower sensitivity of the gyroscope. The matching degree of the driving mode (in-plane 2 theta mode) and the detection mode (out-of-plane 3 rd order bending mode) is poor, the Coriolis gain is only 0.29, the quality factor is low, and the sensitivity is low. In the embodiment of the present application, the micromechanical gyroscope 100 uses the in-plane 3 θ bulk vibration as a driving mode, and uses the out-of-plane 2 nd order bending bulk vibration as a detection mode. The direction of the Coriolis force received by the circular ring vibration structure 2 in the driving mode after the circular ring vibration structure receives the force to be measured is the same as the movement direction of the circular ring vibration structure 2 in the detection mode, the situation that the driving mode is not matched with the detection mode is reduced, and the detection sensitivity is improved.

It should be noted that micromechanical gyroscope 100 may also operate in the 2 nd order bending body vibration driving mode out of plane of detection structure 4 and in the 3 θ body vibration detection mode in plane of detection structure 4. The in-plane transducer 8 can drive the circular ring-shaped vibration structure 2 to vibrate in an in-plane 3 theta body to enter a driving mode, and correspondingly, the out-plane transducer 9 detects displacement changes of the 2 nd order bending body out of the plane of the circular ring-shaped vibration structure 2. The out-of-plane transducer 9 can also drive the circular ring-shaped vibration structure 2 to enter a driving mode through out-of-plane 2 nd-order bending body vibration, and correspondingly, the in-plane transducer 8 detects the displacement of the circular ring-shaped vibration structure 2 under in-plane 3 theta body vibration.

The form of the in-plane transducer 8 and the out-of-plane transducer 9 can be, but is not limited to, one or more combinations of capacitance, inductance, thermoelectricity, and piezoelectricity. The in-plane transducer 8 and the out-of-plane transducer 9 can generate external driving force required for exciting the circular ring vibration structure 2 to drive modal vibration, and can also acquire vibration displacement of a driving mode and vibration displacement of a detection mode. The frequency between the driving mode and the detection mode can be matched, and the function of restraining the orthogonal error of the structure is achieved.

It will be appreciated that the quantity to be measured is typically a vector having a direction and magnitude, and that the micromechanical gyroscope is calculated from the amount of variation in the displacement of different parts of the vibrating structure. Generally, mass distribution of a micromechanical gyroscope needs to be highly symmetrical, and when the mass structure is not symmetrical, although the direction to be measured can be measured when the mass structure is measured in the same size but in different directions, the measured size is likely to be different because the structural asymmetry easily causes different displacement variation. Correspondingly, the in-plane transducer 8 and the out-of-plane transducer 9 may also be arranged symmetrically.

The in-plane transducer 8 is associated with in-plane motion of the annular vibrating structure 2, and illustratively, displacement of the annular mass occurs primarily in the radial direction of the annular vibrating structure 2, depending on the motion characteristics of the in-plane 3 θ mode. The in-plane transducer 8 is spaced from the annular vibrating structure 2 and is used to drive or detect radial motion in the plane of the annular vibrating structure 2. Therefore, the in-plane transducer 8 needs to be disposed substantially in the same plane as the circular ring shaped vibrating structure 2. The in-plane transducer 8 may be disposed on the outer periphery of the circular ring shaped vibration structure 2, or may be disposed on the inner periphery of the circular ring shaped vibration structure 2. One end of the in-plane transducer 8 may be connected to the substrate 1, that is, the in-plane transducer 8 may be fixed to the substrate 1, or the in-plane transducer 8 may not be fixed to the substrate 1 and may be electrically connected to the control element through another structure.

The number of the in-plane transducers 8 is not limited, and the in-plane transducers can be matched with the in-plane 3 theta vibration mode of the annular vibration structure 2. In order to better adapt the in-plane 3 θ mode and improve the efficiency of the in-plane transducers 8, the number of the in-plane transducers 8 may be 3N, where N is an integer greater than or equal to 1. The 3N in-plane transducers 8 are uniformly distributed around the center O of the annular vibration structure 2.

When N is 1, the number of the in-plane transducers 8 is 3, and the 3 in-plane transducers 8 may be uniformly distributed at intervals of 120 ° on the outer periphery of the circular ring shaped vibrating structure 2. When N is 2, the number of the in-plane transducers 8 is 6, and the 6 in-plane transducers 8 may be uniformly distributed at intervals of 60 ° on the outer periphery of the circular ring shaped vibrating structure 2.

It is understood that when the in-plane 3 θ body vibration is used as the driving mode, the motion state of each mass point on the circular ring vibration structure 2 needs to be in accordance with the motion form of the in-plane 3 θ body vibration. In practical application, the motion of the circular ring-shaped vibrating structure 2 does not necessarily completely coincide with the in-plane 3 θ body vibration, and different driving modes can excite different detection modes, so that the accuracy of the actual driving mode is very important for the detection quality of the micromechanical gyroscope 100. In order to make the motion of each mass point on the circular ring-shaped vibration structure 2 more coincide with the in-plane 3 θ body vibration, the in-plane transducer 8 may be made into an arc shape, and when the in-plane transducer 8 is in the arc shape, the distances between the in-plane transducer 8 and the mass points on the same circumference on the circular ring-shaped vibration structure 2 are equal. Of course, the distance between two adjacent in-plane transducers 8 may be minimized to increase the accuracy of control over each particle. Of course, the in-plane transducer 8 may also be linear.

The out-of-plane transducer 9 is associated with the out-of-plane motion of the annular vibrating structure 2. for example, in the out-of-plane 2 nd order bending mode of the annular vibrating structure 2, the displacement is in the axial direction of the annular vibrating structure 2, and the out-of-plane transducer 9 does not have to be disposed in the same plane as the annular vibrating structure 2. The out-of-plane transducer 9 may be arranged on the substrate 1 opposite to the side of the annular vibrating structure 2 facing the substrate 1. It may be arranged on the side of the circular ring shaped vibrating structure 2 away from the substrate 1 instead of on the substrate 1.

The number of the out-of-plane transducers 9 is not limited, and the out-of-plane 2 nd order bending mode can be matched with that of the annular vibration structure 2. In order to further improve the efficiency of the out-of-plane transducer 9, the micromechanical gyroscope 100 further includes 2N out-of-plane transducers disposed on the substrate 1, where the number of the out-of-plane transducers 9 is 2N, the 2N out-of-plane transducers 9 are uniformly distributed around the center O of the circular ring shaped vibration structure 2, and the orthographic projection of the 2N out-of-plane transducers 9 on the substrate 1 is located in the orthographic projection of the circular ring shaped vibration structure 2 on the substrate 1.

When N is 1, the number of out-of-plane transducers 9 is 2, and 2 in-plane transducers 8 may be evenly distributed around the center O at 180 ° intervals. When N is 2, the number of the in-plane transducers 8 is 4, and the 4 in-plane transducers 8 may be uniformly distributed around the center O at intervals of 90 °.

The out-of-plane transducer 9 needs to be able to accurately move each point on the circular ring shaped vibration structure 2 according to a preset motion state, or to accurately detect the displacement of the mass point in the detection mode. In order to make the motion of each mass point on the circular ring-shaped vibration structure 2 more adaptive to the out-of-plane 2 nd order bending mode, the out-of-plane transducer 9 can be made into an arc shape, and when the out-of-plane transducer 9 is in the arc shape, the distance between the out-of-plane transducer 9 and the mass point on the same circumference on the circular ring-shaped vibration structure 2 is equal. Each particle on the circumference can be driven by the out-of-plane transducer 9 or displacement in each particle detection mode can be detected by the out-of-plane transducer 9. The plurality of transducers may also be linearly spaced uniformly around the center O. Of course, the distance between two adjacent out-of-plane transducers 9 may be minimized to increase the accuracy of the driving or detection.

The anchor points 3 serve to connect the ring-shaped vibrating structure 2 to the substrate 1. The anchor point 3 can be located in the circular ring-shaped vibration structure 2, namely, the anchor point 3 is arranged at the center O of the circular ring-shaped vibration structure 2, and the anchor point 3 can also be arranged outside the circular ring-shaped vibration structure 2. When the annular vibration structure 2 is sleeved outside the anchor point 3, the annular vibration structure 2 can be fixedly connected with the anchor point 3 in an abutting mode and can also be arranged at intervals with the anchor point 3.

It should be noted that an insulating layer 6 is disposed on the substrate 1, and the anchor point 3, the in-plane transducer 8, and the out-of-plane transducer 9 are all connected to the substrate 1 through the insulating layer 6.

Referring to fig. 5 and fig. 6, fig. 5 is a schematic structural diagram of a second micro-mechanical gyroscope according to the present invention, and fig. 6 is a cross-sectional view of the micro-mechanical gyroscope in fig. 5 along a direction H-H. In order to avoid excessive constraint of the anchor points 3 on the toroidal vibration structure 2, excessive anchor point 3 loss is caused. Can set up a plurality of tie-beams 5 between anchor point 3 and ring shape vibration structure 2, the setting of tie-beam 5 can be connected ring shape vibration structure 2 on the one hand. On the other hand, the situation that the anchor point 3 excessively restricts the vibration structure to cause too small displacement in the driving mode or the detection mode of the annular vibration structure 2 to affect the sensitivity of the micromechanical gyroscope 100 can be avoided.

The number of the connecting beams 5 is not limited, but the in-plane 3 θ mode of the circular ring-shaped vibration structure 2 has certain symmetry, and if the structure has an asymmetric condition, the energy conversion efficiency or the actual motion mode may be affected to a certain extent. Therefore, depending on the number of in-plane transducers 8, the connecting beams 5 may also be provided in 3M number, again evenly distributed around the center O. Wherein, the connection beam may include a first support beam 51 and a second support beam 52, and the first support beam 51 and the second support beam 52 are symmetrically disposed.

When the number of the circular ring-shaped vibration structures 2 is 3, referring to fig. 7, three circular ring-shaped vibration structures 2 may be connected in series in sequence. Of course, a triangular connection, etc. is also possible, as shown in fig. 8. Accordingly, the micromechanical gyroscope 100 may comprise a plurality of coupling beams 7. It can be understood that the arrangement of the coupling beam 7 can transmit the vibration of the previous circular ring-shaped vibration structure 2 to the next circular ring-shaped vibration structure 2, so as to realize energy transmission, thereby reducing the driving voltage, avoiding nonlinearity, and also increasing the frequency difference with the orthogonal mode.

Referring to fig. 9, fig. 9 is a diagram illustrating a method for using a micromechanical gyroscope according to a first embodiment of the present invention.

The method of using the micromachined gyroscope 100 includes:

101. the annular vibration structure is vibrated by the in-plane 3 theta body to enter a driving mode.

102. A micromechanical gyroscope receives a signal to be measured;

103. the annular vibration structure enters a detection mode through the vibration of the out-of-plane 2 nd-order bending body.

It should be noted that the micromechanical gyroscope 100 may select different modes as the driving modes, and the different driving modes may excite different detection modes, and the matching degree between the driving mode and the detection mode may affect the detection accuracy. In the embodiment of the present application, the micromechanical gyroscope 100 may also select other vibration modes to enter the driving mode.

Referring to fig. 10, fig. 10 illustrates a method for using a second micro-mechanical gyroscope according to the present invention.

The using method comprises the following steps:

201. the annular vibration structure enters a driving mode in an out-of-plane 2 nd order bending mode;

202. a micromechanical gyroscope receives a signal to be measured;

203. the annular vibration structure enters a detection mode in an in-plane 3 theta vibration mode.

It should be noted that, compared with the first usage, the second usage exchanges the motion patterns of the detection mode and the driving mode. On the premise of not changing the structure of the micromechanical gyroscope 100, the vibration mode of the driving mode is changed, and detection operation with different accuracies can be realized.

While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.