阅读说明：本技术 一种器件耦合热阻测量方法、装置及存储介质 (Device coupling thermal resistance measuring method and device and storage medium ) 是由 王咏 朱贤龙 闫鹏修 周晓阳 刘军 于 2021-07-27 设计创作，主要内容包括：本发明公开了一种器件耦合热阻测量方法、装置及存储介质,本发明通过对第一器件施加第一功率,在第一器件的温度稳定后停止第一功率的施加并获取第二器件当前的第一温度,在第二器件降温的过程中获取各个时刻的第一瞬时温度,且当第二器件的温度稳定后获取第二器件当前的第二温度,根据第一温度与第二温度确定第一器件发热引起的第二器件的耦合温升并结合第一功率确定第一稳态耦合热阻；根据第一温度与各个时刻的第一瞬时温度的差值确定目标降温曲线并结合第一功率确定第一瞬态耦合热阻；有效测量第一器件对第二器件的第一稳态耦合热阻以及第一瞬态耦合热阻,达到测量电子器件之间的热耦合影响的效果,本发明可广泛应用于电子器件领域。(The invention discloses a device coupling thermal resistance measuring method, a device and a storage medium, wherein first power is applied to a first device, the application of the first power is stopped after the temperature of the first device is stabilized, the current first temperature of a second device is obtained, the first instantaneous temperature of each moment is obtained in the process of cooling the second device, the current second temperature of the second device is obtained after the temperature of the second device is stabilized, the coupling temperature rise of the second device caused by the heating of the first device is determined according to the first temperature and the second temperature, and the first stable coupling thermal resistance is determined by combining the first power; determining a target cooling curve according to the difference value of the first temperature and the first instantaneous temperature at each moment, and determining a first instantaneous coupling thermal resistance by combining the first power; the method can effectively measure the first steady-state coupling thermal resistance and the first transient-state coupling thermal resistance of the first device to the second device, achieves the effect of measuring the thermal coupling influence between the electronic devices, and can be widely applied to the field of electronic devices.)

1. A device coupling thermal resistance measurement method, comprising:

applying a first power to the first device;

stopping the application of the first power after the temperature of the first device is stabilized and acquiring the current first temperature of the second device; the first device and the second device are arranged in the same environment;

acquiring a first instant temperature of each moment in the process of cooling the second device, and acquiring a current second temperature of the second device after the temperature of the second device is stable;

determining the coupling temperature rise of the second device caused by the heating of the first device according to the first temperature and the second temperature, determining the first steady-state coupling thermal resistance of the first device to the second device according to the ratio of the coupling temperature rise to the first power, determining a target cooling curve according to the difference value of the first temperature and the first instantaneous temperature at each moment, and determining the first transient-state coupling thermal resistance of the first device to the second device according to the ratio of the target cooling curve to the first power.

2. The device-coupled thermal resistance measurement method of claim 1, wherein: the device coupling thermal resistance measuring method further comprises the following steps:

acquiring a third temperature of the second device;

applying a second power to the first device;

acquiring a second instantaneous temperature at each moment in the process of heating the second device;

and determining a target temperature-raising curve according to the difference value between the second instantaneous temperature and the third temperature at each moment, and determining a second transient coupling thermal resistance of the first device to the second device according to the ratio of the target temperature-raising curve to the second power.

3. The device-coupled thermal resistance measurement method of claim 1, wherein: the second device comprises a shell, and the device coupling thermal resistance measurement method further comprises the following steps:

obtaining an initial temperature of the housing prior to the applying the first power to the first device;

obtaining the final temperature of the shell after the temperature of the second device is stable, and determining the temperature rise of the shell according to the difference value between the final temperature and the initial temperature; the housing temperature rise represents a stable temperature rise of the housing caused by the heating of the first device;

determining a temperature difference parameter according to the difference value of the coupling temperature rise and the shell temperature rise, and determining a second steady-state coupling thermal resistance from the first device to the shell from the second device according to the ratio of the temperature difference parameter to the first power; the second steady state coupling thermal resistance is indicative of a steady state thermal resistance of the second device relative to the case caused by heating of the first device.

4. The device-coupled thermal resistance measurement method of claim 1, wherein: the second device comprises a housing having a first end and a second end,

the device coupling thermal resistance measuring method further comprises the following steps:

packaging the first device and the second device to form a device module;

applying a first current to the first device, and measuring a first transient thermal resistance curve;

coating a thermal interface material on the contact surface of the device module, applying a first current to the first device, and measuring a second transient thermal resistance curve; the contact surface is used for contacting the radiator;

determining a third transient coupling thermal resistance from the first device to the second device to the shell according to the first transient thermal resistance curve and the second transient thermal resistance curve; the third transient coupling thermal resistance characterizes a transient thermal resistance of the second device relative to the housing caused by heating of the first device.

5. The device-coupled thermal resistance measurement method of claim 4, wherein: the applying a first current to the first device and measuring a first transient thermal resistance curve includes:

applying a first current to the first device, acquiring a first initial temperature of the second device before applying the first current, acquiring a third instantaneous temperature of the second device at each moment in the temperature rise process of the second device, recording a first voltage, determining a first initial power according to the first voltage and the first current, switching the first current to a second current or cutting off the first current, acquiring a first current power, and calculating a first power difference between the first initial power and the first current power;

and determining a first temperature parameter according to the difference value between the third instantaneous temperature and the first initial temperature at each moment, and determining the first transient thermal resistance curve according to the ratio of the first temperature parameter to the first power difference.

6. The device-coupled thermal resistance measurement method of claim 4, wherein: the applying a thermal interface material to a contact surface of the device module, applying a first current to the first device, and measuring a second transient thermal resistance curve, comprising:

after a thermal interface material is coated on a contact surface of the device module, applying a first current to the first device, acquiring a second initial temperature of the second device before the first current is applied, acquiring a fourth instantaneous temperature of the second device at each moment in the temperature rising process of the second device, recording a second voltage, determining a second initial power according to the second voltage and the first current, switching the first current to the second current or cutting off the first current, acquiring a second current power, and calculating a second power difference between the second initial power and the second current power;

and determining a second temperature parameter according to a difference value between a fourth instantaneous temperature at each moment and the second starting temperature, and determining the second transient thermal resistance curve according to a ratio of the second temperature parameter to the second power difference.

7. The device-coupled thermal resistance measurement method of claim 4, wherein: determining a third transient coupling thermal resistance of the first device to the second device to the housing according to the first transient thermal resistance curve and the second transient thermal resistance curve, including:

calculating a third transient coupling thermal resistance of the first device to the second device to the shell according to the separation points of the first transient thermal resistance curve and the second transient thermal resistance curve;

alternatively, the first and second electrodes may be,

and calculating a third transient coupling thermal resistance of the first device to the second device to the shell by a preset structure function method according to the first transient thermal resistance curve and the second transient thermal resistance curve.

8. A device-coupled thermal resistance measurement apparatus, comprising:

an applying module for applying a first power to a first device;

the execution module is used for stopping the application of the first power after the temperature of the first device is stable and acquiring the current first temperature of the second device; the first device and the second device are arranged in the same environment;

the acquisition module is used for acquiring a first instantaneous temperature at each moment in the process of cooling the second device and acquiring a current second temperature of the second device after the temperature of the second device is stable;

the determining module is used for determining a coupling temperature rise of the second device caused by the heating of the first device according to the first temperature and the second temperature, determining a first steady-state coupling thermal resistance of the first device to the second device according to a ratio of the coupling temperature rise to the first power, determining a target cooling curve according to a difference value of the first temperature and the first instantaneous temperature at each moment, and determining a first transient-state coupling thermal resistance of the first device to the second device according to a ratio of the target cooling curve to the first power.

9. The device coupling thermal resistance measuring device is characterized by comprising a processor and a memory;

the memory stores a program;

the processor executes the program to implement the method of any one of claims 1-7.

10. A computer-readable storage medium, characterized in that the storage medium stores a program which, when executed by a processor, implements the method according to any one of claims 1-7.

Technical Field

The invention relates to the field of electronic devices, in particular to a device coupling thermal resistance measuring method and device and a storage medium.

Background

With the rapid development of power electronic technology, the types of electronic devices are increasing, and the functions of electronic devices are also increasing. Along with the abundance of functions of electronic devices, the complexity of the electronic devices is increased, and it is shown that the number of electronic devices integrated in a module is increased, for example, an electronic device which may have a chip or a plurality of power switches such as IGBTs and MOS in a module, and the like, and when the module operates in a certain power range, each electronic device generates heat, and the heat generated by one electronic device may actually affect other electronic devices besides affecting itself, so that it is important for the thermal management, the life prediction and the reliability evaluation of the module to study the thermal coupling effect of one electronic device on another electronic device. However, the existing thermal resistance measurement method only measures the heat generated by the electronic device alone, but the thermal resistance of the electronic device alone cannot effectively measure the thermal coupling influence between the electronic devices, and a solution needs to be found.

Disclosure of Invention

In view of the above, in order to solve the above technical problems, an object of the present invention is to provide a device coupling thermal resistance measurement method, device and storage medium.

The technical scheme adopted by the invention is as follows:

a device coupling thermal resistance measurement method, comprising:

applying a first power to the first device;

stopping the application of the first power after the temperature of the first device is stabilized and acquiring the current first temperature of the second device; the first device and the second device are arranged in the same environment;

acquiring a first instant temperature of each moment in the process of cooling the second device, and acquiring a current second temperature of the second device after the temperature of the second device is stable;

determining the coupling temperature rise of the second device caused by the heating of the first device according to the first temperature and the second temperature, determining the first steady-state coupling thermal resistance of the first device to the second device according to the ratio of the coupling temperature rise to the first power, determining a target cooling curve according to the difference value of the first temperature and the first instantaneous temperature at each moment, and determining the first transient-state coupling thermal resistance of the first device to the second device according to the ratio of the target cooling curve to the first power.

Further, the device coupling thermal resistance measuring method further comprises the following steps:

acquiring a third temperature of the second device;

applying a second power to the first device;

acquiring a second instantaneous temperature at each moment in the process of heating the second device;

and determining a target temperature-raising curve according to the difference value between the second instantaneous temperature and the third temperature at each moment, and determining a second transient coupling thermal resistance of the first device to the second device according to the ratio of the target temperature-raising curve to the second power.

Further, the second device comprises a housing, and the device-coupled thermal resistance measurement method further comprises:

obtaining an initial temperature of the housing prior to the applying the first power to the first device;

obtaining the final temperature of the shell after the temperature of the second device is stable, and determining the temperature rise of the shell according to the difference value between the final temperature and the initial temperature; the housing temperature rise represents a stable temperature rise of the housing caused by the heating of the first device;

determining a temperature difference parameter according to the difference value of the coupling temperature rise and the shell temperature rise, and determining a second steady-state coupling thermal resistance from the first device to the shell from the second device according to the ratio of the temperature difference parameter to the first power; the second steady state coupling thermal resistance is indicative of a steady state thermal resistance of the second device relative to the case caused by heating of the first device.

Further, the second device comprises a housing, and the device is coupled with the thermal resistance measuring method, and further comprises:

packaging the first device and the second device to form a device module;

applying a first current to the first device, and measuring a first transient thermal resistance curve;

coating a thermal interface material on the contact surface of the device module, applying a first current to the first device, and measuring a second transient thermal resistance curve; the contact surface is used for contacting the radiator;

determining a third transient coupling thermal resistance from the first device to the second device to the shell according to the first transient thermal resistance curve and the second transient thermal resistance curve; the third transient coupling thermal resistance characterizes a transient thermal resistance of the second device relative to the housing caused by heating of the first device.

Further, the applying a first current to the first device and measuring a first transient thermal resistance curve includes:

applying a first current to the first device, acquiring a first initial temperature of the second device before applying the first current, acquiring a third instantaneous temperature of the second device at each moment in the temperature rise process of the second device, recording a first voltage, determining a first initial power according to the first voltage and the first current, switching the first current to a second current or cutting off the first current, acquiring a first current power, and calculating a first power difference between the first initial power and the first current power;

and determining a first temperature parameter according to the difference value between the third instantaneous temperature and the first initial temperature at each moment, and determining the first transient thermal resistance curve according to the ratio of the first temperature parameter to the first power difference.

Further, the applying a thermal interface material to the contact surface of the device module, applying a first current to the first device, and measuring a second transient thermal resistance curve includes:

after a thermal interface material is coated on a contact surface of the device module, applying a first current to the first device, acquiring a second initial temperature of the second device before the first current is applied, acquiring a fourth instantaneous temperature of the second device at each moment in the temperature rising process of the second device, recording a second voltage, determining a second initial power according to the second voltage and the first current, switching the first current to the second current or cutting off the first current, acquiring a second current power, and calculating a second power difference between the second initial power and the second current power;

and determining a second temperature parameter according to a difference value between a fourth instantaneous temperature at each moment and the second starting temperature, and determining the second transient thermal resistance curve according to a ratio of the second temperature parameter to the second power difference.

Further, the determining a third transient coupling thermal resistance of the first device to the second device to the housing according to the first transient thermal resistance curve and the second transient thermal resistance curve includes:

calculating a third transient coupling thermal resistance of the first device to the second device to the shell according to the separation points of the first transient thermal resistance curve and the second transient thermal resistance curve;

alternatively, the first and second electrodes may be,

and calculating a third transient coupling thermal resistance of the first device to the second device to the shell by a preset structure function method according to the first transient thermal resistance curve and the second transient thermal resistance curve.

The invention also provides a device coupling thermal resistance measuring device, comprising:

an applying module for applying a first power to a first device;

the execution module is used for stopping the application of the first power after the temperature of the first device is stable and acquiring the current first temperature of the second device; the first device and the second device are arranged in the same environment;

the acquisition module is used for acquiring a first instantaneous temperature at each moment in the process of cooling the second device and acquiring a current second temperature of the second device after the temperature of the second device is stable;

the determining module is used for determining a coupling temperature rise of the second device caused by the heating of the first device according to the first temperature and the second temperature, determining a first steady-state coupling thermal resistance of the first device to the second device according to a ratio of the coupling temperature rise to the first power, determining a target cooling curve according to a difference value of the first temperature and the first instantaneous temperature at each moment, and determining a first transient-state coupling thermal resistance of the first device to the second device according to a ratio of the target cooling curve to the first power.

The invention also provides a device coupling thermal resistance measuring device, which comprises a processor and a memory;

the memory stores a program;

the processor executes the program to implement the method.

The present invention also provides a computer-readable storage medium storing a program which, when executed by a processor, implements the method.

The invention has the beneficial effects that: applying first power to a first device, stopping the application of the first power after the temperature of the first device is stable, and acquiring the current first temperature of a second device, wherein the first device and the second device are arranged in the same environment; the method comprises the steps of obtaining first instantaneous temperature of each moment in the process of cooling a second device, obtaining current second temperature of the second device after the temperature of the second device is stable, determining coupling temperature rise of the second device caused by heating of the first device according to the first temperature and the second temperature, and determining first steady-state coupling thermal resistance of the second device to the first device according to the ratio of the coupling temperature rise to first power; determining a target cooling curve according to the difference value of the first temperature and the first instantaneous temperature at each moment, and determining a first transient coupling thermal resistance of the first device to the second device according to the ratio of the target cooling curve to the first power; the first steady-state coupling thermal resistance and the first transient-state coupling thermal resistance of the first device to the second device can be effectively measured, and the effect of measuring the thermal coupling influence between electronic devices is achieved.

Drawings

FIG. 1 is a schematic flow chart illustrating steps of a device coupling thermal resistance measurement method according to the present invention.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first," "second," "third," and "fourth," etc. in the description and claims of this application and in the accompanying drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As shown in fig. 1, an embodiment of the present invention provides a device coupling thermal resistance measurement method, including steps S100 to S400:

s100, applying first power to the first device.

In the embodiment of the invention, the first deviceThe member and the second member are disposed in the same environment. The first device and the second device include, but are not limited to, a chip, a MOS transistor, an igbt (insulated Gate Bipolar transistor), and an insulated Gate Bipolar transistor. It should be noted that the first device and the second device may each have a housing, for example, the second device has a housing, for example, the housing is an enclosing structure located at an outer layer of the second device. The same environment includes, but is not limited to, an environment in which the first device and the second device are disposed in the same environment, for example, in a circuit, in the same indoor environment, or the like, and the temperature change of the second device is directly caused by heat generated by the first device. Optionally, the first power P₁The concentration may be set as required, and is not particularly limited.

And S200, stopping the application of the first power after the temperature of the first device is stabilized, and acquiring the current first temperature of the second device.

In the embodiment of the present invention, the temperature measurement may be obtained by measuring with a temperature sensor or other temperature measuring instrument. It should be noted that the temperature stabilization may be a setting time threshold and a variation range, and when the measured temperature is within an allowable variation range after the time threshold, the temperature is considered to be stable. Specifically, after the temperature of the first device is stabilized, the current first temperature of the second device is measured, and the application of the first power is stopped.

S300, acquiring a first instantaneous temperature of each moment in the process of cooling the second device, and acquiring a current second temperature of the second device after the temperature of the second device is stable.

In the embodiment of the invention, after the application of the first power is stopped, the second device can be gradually cooled because the heat provided by the first device to the second device is reduced, and the first instantaneous temperature of the second device at each moment is obtained in the process of cooling the second device. In the embodiment of the invention, the current second temperature of the second device is acquired after the temperature of the second device is stabilized. Similarly, the temperature stabilization may be setting a time threshold and a variation range, and when the measured temperature is within the allowable variation range after the time threshold, the temperature is considered to be stable, and the second temperature is measured.

S400, determining the coupling temperature rise of the second device caused by the heating of the first device according to the first temperature and the second temperature, determining a first steady-state coupling thermal resistance of the first device to the second device according to the ratio of the coupling temperature rise to the first power, determining a target cooling curve according to the difference value of the first temperature and the first instantaneous temperature at each moment, and determining a first instantaneous-state coupling thermal resistance of the first device to the second device according to the ratio of the target cooling curve to the first power.

Specifically, a first steady state coupling thermal resistance R₂₁The calculation formula of (2) is as follows:

wherein, P₁Is a first power, Δ T₂₁Coupled temperature rise, T, of a second device caused by heat generation of a first device₂₁(T ═ 0) is a first temperature, T₂₁And (t) t1 is the second temperature. It is assumed that the first power P is stopped₁The application time t of (2) is 0 as a starting point, and it is assumed that the temperature of the second device has stabilized after the time t1 has elapsed.

In particular, a first transient coupling thermal resistance Z₂₁The formula for calculation of (t) is:

wherein, P₁Is a first power, T₂₁(T ═ 0) is a first temperature, T₂₁(t) is the first instantaneous temperature at each time t, and a first initial cooling curve can be formed. It should be noted that, the numerator of the formula determines the target cooling curve; suppose to stop the first power P₁The application time t of (a) is 0 as a starting point, and assuming that the temperature of the second device becomes stable after the time t1 elapses, the value of t at this time ranges from 0 to t 1.

The device coupling thermal resistance measuring method of the embodiment of the invention further comprises a step S500, and specifically comprises the following steps: S501-S504:

s501, acquiring a third temperature of the second device.

Optionally, a third temperature of the second device is measured before applying the second power to the first device. Likewise, the measurement of temperature may be measured by a temperature sensor or other temperature measuring instrument.

And S502, applying second power to the first device.

It should be noted that the second power P is applied to the first device₂Second power P₂May be equal to the first power P₁The same or different, and can be adjusted according to the needs.

And S503, acquiring second instantaneous temperature at each moment in the process of heating the second device.

In the embodiment of the invention, after the second power is applied to the first device, at the moment, the second device is gradually heated due to the increase of the heat provided by the first device to the second device, and the second instantaneous temperature of the second device at each moment is obtained in the heating process of the second device.

S504, determining a target temperature-raising curve according to the difference value between the second instantaneous temperature and the third temperature at each moment, and determining a second transient coupling thermal resistance of the first device to the second device according to the ratio of the target temperature-raising curve to the second power.

In particular, the second transient coupling thermal resistance Z₂₁(t') is calculated as:

wherein, P₂At a second power, T₂₁(T ') is a second instantaneous temperature at each time T', enabling a first initial temperature rise curve, T₂₁'(t' ═ 0) is the third temperature. It should be noted that the numerator of the formula determines the target temperature increase curve. Alternatively, assume to start the second power p₂The timing of application of (t ═ 0) is. It should be noted that it is also possible to measure one after the temperature of the second device has stabilized after the time t2 has elapsedA second instantaneous temperature, thereby determining that t' has a value ranging from 0 to t 2; in the measurement step S500, the transient coupling thermal resistance is measured by using a temperature rise process, and in the steps S100-S400, the transient coupling thermal resistance is measured by using a temperature drop process.

The device coupling thermal resistance measuring method of the embodiment of the invention further comprises a step S600, and specifically comprises the following steps: S601-S603:

s601, acquiring an initial temperature of the shell before applying first power to the first device.

Likewise, the measurement of temperature may be measured by a temperature sensor or other temperature measuring instrument. Wherein the initial temperature is

S602, obtaining the final temperature of the shell after the temperature of the second device is stable, and determining the temperature rise of the shell according to the difference value between the final temperature and the initial temperature.

In the embodiment of the invention, the shell temperature rise represents the stable temperature rise of the shell caused by the heating of the first device. Similarly, the temperature stabilization can be a setting time threshold and a variation range, when the time threshold is passed and the measured temperature is within the allowable variation range, the temperature is considered to be stable, the final temperature of the shell is obtained by measurement, and then the shell temperature rise T is determined according to the difference value of the final temperature and the initial temperature_c. It should be noted that in some embodiments, the housing may approximate an NTC resistance, where T is_cAnd characterizing the stable temperature rise of the NTC caused by the heat generation of the first device, namely, the difference between the NTC temperature before and after heating after the heating is stable, wherein the NTC temperature can be calculated by measuring the NTC resistance and then according to the comparison relationship between the resistance and the temperature.

S603, determining a temperature difference parameter according to the difference value of the coupling temperature rise and the shell body temperature rise, and determining a second steady-state coupling thermal resistance from the first device to the second device to the shell according to the ratio of the temperature difference parameter to the first power.

In embodiments of the present invention, the second steady state coupling thermal resistance is indicative of a steady state thermal resistance of the second device relative to the case caused by heating of the first device.

In particular, a second steady state coupling thermal resistance R_{2 to C-1}The calculation formula of (2) is as follows:

wherein, P₁For the first power, the temperature difference parameter is Delta T₂₁-T_c，ΔT₂₁For coupling temperature rise, T_cRaising the temperature of the shell.

The device coupling thermal resistance measuring method of the embodiment of the invention further comprises a step S700, and specifically comprises the following steps: S701-S704:

s701, packaging the first device and the second device to form a device module.

Specifically, packaging includes, but is not limited to, forming the first device and the second device into a module including the first device and the second device, or including the first device, the second device, and the connection circuit, thereby obtaining a device module. It should be noted that the device module has a contact surface for contacting the heat sink.

S702, applying a first current to the first device, and measuring a first transient thermal resistance curve.

Specifically, a first transient thermal resistance curve is measured by applying a first current directly to the first device without applying a thermal interface material to the contact surface of the device module.

Specifically, step S702 includes steps S7021-S7022:

s7021, applying a first current to the first device, obtaining a first starting temperature of the second device before applying the first current, obtaining a third instantaneous temperature of the second device at each time during a temperature rise of the second device, recording a first voltage, determining a first starting power according to the first voltage and the first current, switching the first current to a second current or cutting off the first current, obtaining a first current power, and calculating a first power difference between the first starting power and the first current power.

It should be noted that the recording of the first voltage may be at a certain time during the temperature raising process, including but not limited to, a time t3 (when the temperature of the second device is stable) after the first current is applied, the recording of the first voltage may determine the first initial power according to a product of the first voltage and the first current, and when the first current is switched to the second current or the first current is cut off, the power may also change due to the change of the current, and assuming that the power at this time is the first current power, the difference between the first initial power and the first current power is calculated to obtain the first power difference. It should be noted that voltage and power may refer to the first device voltage and power.

S7022, determining a first temperature parameter according to the difference value between the third instantaneous temperature and the first initial temperature at each moment, and determining a first instantaneous thermal resistance curve according to the ratio of the first temperature parameter to the first power difference.

Optionally, the first transient thermal resistance curve is determined by determining the first temperature parameter as a numerator and the first power difference as a denominator according to a difference between the third instantaneous temperature and the first initial temperature at each time.

S703, coating a thermal interface material on the contact surface of the device module, applying a first current to the first device, and measuring a second transient thermal resistance curve.

Specifically, unlike step S702, a thermal interface material is coated on the contact surface of the device module, and then a first current is applied to the first device, and a second transient thermal resistance curve is measured.

Specifically, step S703 includes steps S7031-S7032:

s7031, after a thermal interface material is coated on a contact surface of the device module, applying a first current to the first device, obtaining a second starting temperature of the second device before applying the first current, obtaining a fourth instantaneous temperature of the second device at each time during a temperature rise of the second device, recording a second voltage, determining a second starting power according to the second voltage and the first current, switching the first current to the second current or cutting off the first current, obtaining a second current power, and calculating a second power difference between the second starting power and the second current power.

It should be noted that the second voltage may be recorded at a certain time during the temperature raising process, including but not limited to a time t4 (when the temperature of the second device is stable) after the first current is applied, the second voltage is recorded at this time, the second starting power may be determined according to a product of the second voltage and the first current at this time, when the first current is switched to the second current or the first current is cut off, the power may also change due to the change of the current, and assuming that the power at this time is the second current power, the difference between the second starting power and the second current power is calculated to obtain the second power difference. It should be noted that voltage and power may refer to the first device voltage and power.

S7032, determining a second temperature parameter according to the difference value between the fourth instantaneous temperature and the second starting temperature at each moment, and determining a second transient thermal resistance curve according to the ratio of the second temperature parameter to the second power difference.

Optionally, the second temperature parameter is determined as a numerator and the second power difference is determined as a denominator according to a difference between the fourth instantaneous temperature and the second starting temperature at each time, so as to determine the second transient thermal resistance curve.

And S704, determining a third transient coupling thermal resistance from the first device to the second device to the shell according to the first transient thermal resistance curve and the second transient thermal resistance curve.

In an embodiment of the invention, the third transient coupling thermal resistance represents a transient thermal resistance of the second device relative to the housing caused by heat generation of the first device.

Optionally, step S704 includes step S7041 or S7042:

s7041, calculating a third transient coupling thermal resistance from the first device to the second device to the shell through a differential processing mode according to the first transient thermal resistance curve and the second transient thermal resistance curve.

Converting the time coordinates of the first transient thermal resistance curve and the second transient thermal resistance curve into a logarithmic time coordinate form, and respectively recording a maximum logarithmic time coordinate and a minimum logarithmic time coordinate; performing differential processing on the first transient thermal resistance curve and the second transient thermal resistance curve to obtain a first differential curve corresponding to the first transient thermal resistance curve and a second differential curve corresponding to the second transient thermal resistance curve; obtaining a target curve according to the abscissa calculated by the first differential curve and the second differential curve, fitting the target curve by using a preset exponential function, and determining a third transient coupling thermal resistance according to the intersection point of the fitting result and a preset finite element simulation curve; and carrying out finite element simulation on the preset finite element simulation curve according to the size of the first device to obtain the finite element simulation curve.

S7042, calculating a third transient coupling thermal resistance from the first device to the second device and from the first device to the shell through a preset structure function method according to the first transient thermal resistance curve and the second transient thermal resistance curve.

Converting the first transient thermal resistance curve into a first integral structure function and converting the second transient thermal resistance curve into a second integral structure function through a preset structure function; performing difference calculation on the first integral structure function and the second integral structure function in the same range, and determining a difference calculation difference; wherein the obvious rising point of the difference value calculation difference value is the third transient coupling thermal resistance.

Steps S500, S600, and S700 do not limit the execution order.

The embodiment of the present invention further provides a device coupling thermal resistance measuring apparatus, including:

an applying module for applying a first power to a first device;

the execution module is used for stopping the application of the first power after the temperature of the first device is stable and acquiring the current first temperature of the second device; the first device and the second device are arranged in the same environment;

the acquisition module is used for acquiring the first instantaneous temperature of each moment in the process of cooling the second device and acquiring the current second temperature of the second device after the temperature of the second device is stable;

the determining module is used for determining the coupling temperature rise of the second device caused by the heating of the first device according to the first temperature and the second temperature, determining a first steady-state coupling thermal resistance of the first device to the second device according to the ratio of the coupling temperature rise to the first power, determining a target cooling curve according to the difference value of the first temperature and the first instantaneous temperature at each moment, and determining the first instantaneous-state coupling thermal resistance of the first device to the second device according to the ratio of the target cooling curve to the first power.

The contents in the above method embodiments are all applicable to the present apparatus embodiment, the functions specifically implemented by the present apparatus embodiment are the same as those in the above method embodiments, and the advantageous effects achieved by the present apparatus embodiment are also the same as those achieved by the above method embodiments.

The embodiment of the invention also provides a device coupling thermal resistance measuring device, which comprises a processor and a memory;

the memory is used for storing programs;

the processor is used for executing programs to realize the device coupling thermal resistance measuring method of the embodiment of the invention. The device provided by the embodiment of the invention can realize the function of measuring the coupling thermal resistance of the device. The device can be any intelligent terminal including an industrial personal computer, a mobile phone, a tablet personal computer, a computer and the like.

The contents in the above method embodiments are all applicable to the present apparatus embodiment, the functions specifically implemented by the present apparatus embodiment are the same as those in the above method embodiments, and the advantageous effects achieved by the present apparatus embodiment are also the same as those achieved by the above method embodiments.

The embodiment of the present invention further provides a computer-readable storage medium, where a program is stored in the computer-readable storage medium, and the program is executed by a processor to implement the method for measuring device coupling thermal resistance according to the foregoing embodiment of the present invention.

Embodiments of the present invention also provide a computer program product including instructions, which when run on a computer, cause the computer to perform the device coupling thermal resistance measurement method of the foregoing embodiments of the invention.

The terms "first," "second," "third," "fourth," and the like in the description of the application and the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

It should be understood that in the present application, "at least one" means one or more, "a plurality" means two or more. "and/or" for describing an association relationship of associated objects, indicating that there may be three relationships, e.g., "a and/or B" may indicate: only A, only B and both A and B are present, wherein A and B may be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of single item(s) or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", wherein a, b, c may be single or plural.

In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of a unit is merely a logical division, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form. Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment. In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes multiple instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method of the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing programs, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.

The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.