阅读说明：本技术 可弯折电路板及其制作方法 (Bendable circuit board and manufacturing method thereof ) 是由 何明展 钟浩文 李彪 彭满芝 于 2020-05-11 设计创作，主要内容包括：本发明提供一种可弯折电路板,包括依次层叠设置的第三刚性线路板、第二挠性膜层、第二刚性线路板、电路基板、第一挠性膜层和第一刚性线路板,所述电路基板为刚性双面线路板,所述第一刚性线路板对应所述第一挠性膜层开设有第一开窗区,所述第一挠性膜层从所述第一开窗区露出,所述第三刚性线路板对应所述第二挠性膜层开设有第二开窗区,所述第二挠性膜层从所述第二开窗区露出。本发明还提供上述可弯折电路板的制作方法。(The invention provides a bendable circuit board which comprises a third rigid circuit board, a second flexible film layer, a second rigid circuit board, a circuit substrate, a first flexible film layer and a first rigid circuit board, wherein the third rigid circuit board, the second flexible film layer, the second rigid circuit board, the circuit substrate, the first flexible film layer and the first rigid circuit board are sequentially stacked, the circuit substrate is a rigid double-sided circuit board, the first rigid circuit board is provided with a first windowing area corresponding to the first flexible film layer, the first flexible film layer is exposed out of the first windowing area, the third rigid circuit board is provided with a second windowing area corresponding to the second flexible film layer, and the second flexible film layer is exposed out of the second windowing area. The invention also provides a manufacturing method of the bendable circuit board.)

1. The utility model provides a bendable circuit board, its characterized in that includes the third rigid line way board, the flexible rete of second, second rigid line way board, circuit substrate, first flexible rete and the first rigid line way board that stacks gradually the setting, circuit substrate is the rigidity double-sided circuit board, first rigid line way board corresponds first flexible rete has seted up first windowing area, first flexible rete is followed first windowing area exposes, the third rigid line way board corresponds second flexible rete has seted up the second windowing area, the flexible rete of second is followed the second windowing area exposes.

2. The bendable circuit board of claim 1, wherein a surface of the first flexible film layer is covered with a first flash and a surface of the second flexible film layer is covered with a second flash.

3. The flexible circuit board of claim 1, wherein the circuit substrate comprises a circuit core and a first circuit board and a second circuit board formed on opposite sides of the circuit core.

4. The bendable circuit board of claim 1, further comprising a fourth rigid wiring board laminated to a side of the first rigid wiring board facing away from the first flexible film layer.

5. A manufacturing method of a bendable circuit board comprises the following steps:

providing a circuit substrate, wherein the circuit substrate is a rigid double-sided circuit board;

sequentially pressing a first flexible film layer and a first release film on the surface of one side of the circuit substrate, wherein the first release film covers the first flexible film layer;

providing a first rigid circuit board and a second rigid circuit board, and respectively pressing the first rigid circuit board and the second rigid circuit board to two opposite sides of the structure obtained in the last step, wherein the first rigid circuit board covers the first release film;

pressing a second flexible film layer and a second release film on one side of the second rigid circuit board, which is far away from the first rigid circuit board, wherein the second flexible film layer corresponds to the first flexible film layer, and the second release film covers the second flexible film layer;

providing a third rigid circuit board, and pressing the third rigid circuit board to one side of the second release film;

and removing the first release film and partial areas of the first rigid circuit board corresponding to the first flexible film layer to form a first windowing area so as to expose the first flexible film layer, and removing the second release film and partial areas of the third rigid circuit board corresponding to the second flexible film layer to form a second windowing area so as to expose the second flexible film layer, so that the bendable circuit board is manufactured.

6. The method for manufacturing a bendable circuit board according to claim 5, wherein when the first rigid circuit board and the partial region of the first release film corresponding to the first flexible film layer are removed, the epoxy resin in the first rigid circuit board overflows to the surface of the first flexible film layer to form a first overflow glue; and when the second release film and the partial region of the third rigid circuit board corresponding to the second flexible film layer are removed, the epoxy resin in the third rigid circuit board overflows to the surface of the second flexible film layer to form second overflow glue.

7. The method of claim 5 wherein the circuit substrate comprises a circuit core and a first circuit board and a second circuit board respectively formed on opposite sides of the circuit core.

8. The method for manufacturing a bendable circuit board according to claim 5, wherein the bendable circuit board further comprises a fourth rigid circuit board, and the fourth rigid circuit board is laminated on a side of the first rigid circuit board, which is away from the first flexible film layer.

9. The method for manufacturing a bendable circuit board according to claim 8, wherein the first rigid circuit board comprises a base layer, and the base layer of the first rigid circuit board covers the first release film; before the first rigid circuit board is pressed, cutting areas of the base layer of the first rigid circuit board, which correspond to two ends of the first release film, to form two openings; the step of exposing the first flexible film layer comprises: and cutting the fourth rigid circuit board and the first rigid circuit board along the edges of two sides of the first release film by adopting a laser depth-setting cutting mode, wherein the preset cutting depth is not more than the first rigid circuit board.

10. The method of claim 5, wherein the bendable circuit board further comprises a solder mask layer, and the solder mask layer is located outside the bendable circuit board.

Technical Field

The invention relates to the field of circuit board manufacturing, in particular to a bendable circuit board and a manufacturing method thereof.

Background

The bendable circuit board is widely applied to three-dimensional assembly of electronic products. The flexible circuit board commonly used in the industry at present is a rigid-flex board, a flexible board or a semi-flexible folded board. The flexible combined board and the bending area of the flexible board are made of polyimide materials, so that the manufacturing process is complex and the cost is high; the bending area of the semi-flexible flap is generally a single layer or a double layer, and the wiring density is low.

Disclosure of Invention

Accordingly, there is a need for a flexible circuit board and a method for manufacturing the same that can solve the above-mentioned problems.

The invention provides a bendable circuit board which comprises a third rigid circuit board, a second flexible film layer, a second rigid circuit board, a circuit substrate, a first flexible film layer and a first rigid circuit board, wherein the third rigid circuit board, the second flexible film layer, the second rigid circuit board, the circuit substrate, the first flexible film layer and the first rigid circuit board are sequentially stacked, the circuit substrate is a rigid double-sided circuit board, the first rigid circuit board is provided with a first windowing area corresponding to the first flexible film layer, the first flexible film layer is exposed out of the first windowing area, the third rigid circuit board is provided with a second windowing area corresponding to the second flexible film layer, and the second flexible film layer is exposed out of the second windowing area.

The invention also provides a manufacturing method of the bendable circuit board, which comprises the following steps: providing a circuit substrate, wherein the circuit substrate is a rigid double-sided circuit board; sequentially pressing a first flexible film layer and a first release film on the surface of one side of the circuit substrate, wherein the first flexible film layer is covered by the first release film; providing a first rigid circuit board and a second rigid circuit board, and respectively pressing the first rigid circuit board and the second rigid circuit board to two opposite sides of the structure obtained in the last step, wherein the first rigid circuit board covers the first release film; pressing a second flexible film layer and a second release film on one side of the second rigid circuit board, which is far away from the first rigid circuit board, wherein the second flexible film layer corresponds to the first flexible film layer, and the second release film covers the second flexible film layer; providing a third rigid circuit board, and pressing the third rigid circuit board to one side of the second release film; and removing the first release film and partial areas of the first rigid circuit board corresponding to the first flexible film layer to form a first windowing area so as to expose the first flexible film layer, and removing the second release film and partial areas of the third rigid circuit board corresponding to the second flexible film layer to form a second windowing area so as to expose the second flexible film layer, so that the bendable circuit board is manufactured.

According to the bendable circuit board and the manufacturing method thereof, the bendable region is formed by pressing the flexible film layers on the two sides of the rigid laminated structure, so that the rigid circuit board realizes the bending function, and the product cost is reduced. In addition, the rigid laminated structure in the bendable region comprises a circuit substrate and a second rigid circuit board, and the circuit substrate is a double-sided circuit board, so that the bendable region comprises a plurality of layers of conducting circuit layers, and the wiring density and the integration level of the bendable circuit board can be obviously improved.

Drawings

Fig. 1 is a schematic structural diagram of a circuit substrate according to an embodiment of the present invention.

Fig. 2 is a schematic structural view of the circuit substrate shown in fig. 1 after the first flexible film layer is laminated thereon.

Fig. 3 is a schematic structural view of the structure shown in fig. 2 after the first rigid circuit board and the second rigid circuit board are respectively pressed on two sides of the structure.

FIG. 4 is a schematic view of the structure of FIG. 3 after a second flexible film layer is laminated on one side of the structure.

Fig. 5 is a schematic structural view of the structure shown in fig. 4 after the third rigid circuit board and the fourth rigid circuit board are respectively pressed on two sides of the structure.

Fig. 6 is a schematic structural view of the structure shown in fig. 5 after the fifth rigid wiring board and the sixth rigid wiring board are respectively pressed on both sides of the structure.

Fig. 7 is a schematic illustration of a cut-out of the knot structure shown in fig. 6.

Fig. 8 is a schematic structural diagram of a bendable circuit board according to an embodiment of the invention.

Description of the main elements

Circuit board 10

Circuit core board 11

First circuit board 13

Second wiring board 15

Insulating layer 111

Conductive line layers 113, 133, 153, 33, 43,

63、73、813、833

Base layers 131, 151, 31, 41, 61, 71,

811、831

The first flexible film layer 21

First adhesive layer 23

First release film 25

First rigid wiring board 30

Second rigid wiring board 40

Openings 311, 611

First portion 312, 612

Second portions 313, 613

Third portions 314, 614

Second Flexible film layer 51

Second adhesive layer 53

Second release film 55

Third rigid wiring board 60

Fourth rigid wiring board 70

Fifth rigid wiring board 81

Sixth rigid wiring board 83

First slit 93

Second slit 94

First windowed area 86

Second windowed area 87

Conductive via 97

First flash 95

Second flash 96

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.

An embodiment of the present invention provides a method for manufacturing a bendable circuit board, which includes the following steps:

s1, providing a circuit substrate which is a double-sided circuit board;

s2, sequentially pressing a first flexible film layer and a first release film on the surface of one side of the circuit substrate, wherein the first release film covers the first flexible film layer;

s3, providing a first rigid circuit board and a second rigid circuit board, and respectively pressing the first rigid circuit board and the second rigid circuit board to the two opposite sides of the structure obtained in the step S2, wherein the first rigid circuit board covers the first release film;

s4, sequentially pressing a second flexible film layer and a second release film on one side of the second rigid circuit board, which is far away from the first rigid circuit board, wherein the second flexible film layer corresponds to the first flexible film layer, and the second release film covers the second flexible film layer;

s5, providing a third rigid circuit board and a fourth rigid circuit board, and respectively pressing the third rigid circuit board and the fourth rigid circuit board to two sides of the structure obtained in the step S4, wherein the third rigid circuit board covers the second release film;

and S6, providing a fifth rigid circuit board and a sixth rigid circuit board, and respectively laminating the fifth rigid circuit board and the sixth rigid circuit board to the two sides of the structure obtained in the step S5, wherein the fifth rigid circuit board is attached to the third rigid circuit board, and the sixth rigid circuit board is attached to the fourth rigid circuit board.

S7, removing partial areas of the first release film, the first rigid circuit board, the fourth rigid circuit board and the sixth rigid circuit board corresponding to the first flexible film layer to expose the first flexible film layer, and removing partial areas of the second release film, the third rigid circuit board and the fifth rigid circuit board corresponding to the second flexible film layer to expose the second flexible film layer, so that the bendable circuit board is manufactured.

Fig. 1 to 7 illustrate a manufacturing process of a bendable circuit board 100 according to an embodiment of the invention.

Referring to fig. 1, in step S1, a circuit substrate 10 is provided, where the circuit substrate 10 is a double-sided circuit board. The circuit substrate 10 is a rigid circuit board, which includes at least two circuit layers. In the present embodiment, the circuit board 10 includes four circuit layers. It is understood that the circuit substrate 10 may have two, three or more layers.

Specifically, the circuit substrate 10 includes a circuit core board 11, and a first circuit board 13 and a second circuit board 15 respectively formed on two opposite sides of the circuit core board 11. The circuit core board 11 includes an insulating layer 111 and conductive trace layers 113 formed on two opposite surfaces of the insulating layer 111. The first circuit board 13 is a single-sided circuit board, and includes a base layer 131 and a conductive trace layer 133 formed on one side of the base layer 131. The base layer 131 is attached to the conductive circuit layer 113 on one side of the circuit core board 11. The second circuit board 15 is a single-sided circuit board, and includes a base layer 151 and a conductive trace layer 153. The base layer 151 is attached to the conductive circuit layer 133 on the other side of the circuit core board 11.

It is understood that, when the circuit substrate 10 is provided, conductive holes 97 may be further formed on the insulating layer 111, the base layer 131 and the base layer 151, respectively, for electrically connecting the conductive trace layers. Specifically, through holes may be formed in the insulating layer 111, the base layer 131, and the base layer 151, respectively, and the conductive holes 97 may be formed by filling a conductive material in the through holes or by electroplating.

Referring to fig. 2, in step S2, a first flexible film layer 21 and a first release film 25 are sequentially laminated on one side of the circuit substrate 10. The first flexible film layer 21 is attached to the conductive trace layer 153 of the first circuit board 13. The first flexible film layer 21 is laminated to the first circuit board 13 through a first adhesive layer 23. In the present embodiment, the first flexible film layer 21 is located at approximately the middle of the circuit board 10. The first release film 25 is attached to a side of the first flexible film layer 21 away from the circuit substrate 10. The first release film 25 may completely or partially cover the first flexible film layer 21. In this embodiment, the first release film 25 completely covers the first flexible film layer 21.

Referring to fig. 3, in step S3, a first rigid wiring board 30 and a second rigid wiring board 40 are provided and are respectively pressed on two opposite sides of the structure obtained in step S2, wherein the first rigid wiring board 30 covers the first release film 25 and the conductive trace layer 153 of the first wiring board 13.

The first rigid wiring board 30 is a single-sided wiring board, and includes a base layer 31 and a conductive wiring layer 33 formed on one side of the base layer 31. The base layer 31 covers the first flexible film layer 21.

Before the first rigid circuit board 30 is pressed, two openings 311 are formed by cutting the corresponding areas at the two ends of the base layer 31 and the first release film 25, so that the base layer 31 is divided into a first part 312, a second part 313 and a third part 314 which are arranged at intervals. The first portion 312 and the third portion 314 are located at the edges of two opposite sides of the first flexible film layer 21, and the second portion 313 covers the first release film 25, so as to reserve a cutting margin for subsequent fixed-depth cutting and avoid damaging the first flexible film layer 21 during the fixed-depth cutting.

The second rigid wiring board 40 is a single-sided wiring board, and includes a base layer 41 and a conductive wiring layer 43 formed on one side of the base layer 41. The base layer 41 is attached to the circuit board 10. Referring to fig. 4, in step S4, a second flexible film layer 51 and a second release film 55 are sequentially laminated on a side of the second rigid circuit board 40 away from the circuit substrate 10, wherein the second flexible film layer 51 corresponds to the first flexible film layer 21. The second flexible film layer 51 is laminated to the second rigid wiring board 40 by a second adhesive layer 53. The second release film 55 is attached to a side of the second flexible film layer 51 away from the second rigid wiring board 40. The second release film 55 may completely or partially cover the second flexible film layer 51. In this embodiment, the second release film 55 completely covers the second flexible film layer 51.

In the bendable circuit board 100, a region corresponding to a region between the first flexible film layer 21 and the second flexible film layer 51 constitutes a bendable region. The distance between the first flexible film layer 21 and the second flexible film layer 51 is approximately 1-5 mm, that is, the thickness of the bendable region is approximately 1-5 mm.

Each of the first and second adhesive layers 23 and 53 includes a resin having adhesiveness, which may be selected from at least one of polypropylene, epoxy resin, polyurethane, phenol resin, urea resin, melamine-formaldehyde resin, polyimide, and the like.

The first flexible film layer 21 and the second flexible film layer 51 may be made of flexible insulating materials such as polyimide, polyethylene, and polycarbonate.

It is to be understood that, when the first rigid wiring board 30 and the second rigid wiring board 40 are provided in step S3, conductive holes 97 may be further formed in the base layer 31 and the base layer 41, respectively, for electrically connecting the conductive trace layers.

Referring to fig. 5, in step S5, a third rigid wiring board 60 and a fourth rigid wiring board 70 are provided and respectively bonded to two sides of the structure obtained in step S4, wherein the third rigid wiring board 60 covers the second flexible film layer 51.

The third rigid wiring board 60 is a single-sided wiring board, the base layer 61, and a conductive wiring layer 63 formed on one side of the base layer 61. The base layer 61 covers the second release film 55 and the conductive circuit layer 43 of the second rigid wiring board 40.

Before the third rigid wiring board 60 is pressed, two openings 611 are formed by cutting the areas of the base layer 61 and the second release film 55 opposite to each other at two ends, so that the base layer 61 is divided into a first part 612, a second part 613 and a third part 614 which are arranged at intervals. The first portion 612 and the third portion 614 are located at the edges of two opposite sides of the second release film 55, and the second portion 613 covers the second flexible film layer 51, so as to reserve a cutting margin for subsequent depth cutting and avoid damaging the second flexible film layer 51 during the depth cutting.

The fourth rigid wiring board 70 is a single-sided wiring board, and includes a base layer 71 and a conductive wiring layer 73 formed on one side of the base layer 71. The base layer 71 is attached to the conductive trace layer 33 of the first rigid wiring board 30.

Referring to fig. 6, in step S6, a fifth rigid wiring board 81 and a sixth rigid wiring board 83 are provided and are bonded to both sides of the structure obtained in step S5, wherein the fifth rigid wiring board 81 is bonded to the third rigid wiring board 60, and the sixth rigid wiring board 83 is bonded to the fourth rigid wiring board 70.

The fifth rigid wiring board 81 is a single-sided wiring board, and includes a base layer 811 and a conductive wiring layer 813 formed on one side of the base layer 811. The base layer 811 is attached to the conductive trace layer 63 of the third rigid wiring board 60.

The sixth rigid wiring board 83 is a single-sided wiring board, and includes a base layer 831 and a conductive line layer 833 formed on one side of the base layer 831. The base 831 is attached to the conductive wiring layer 73 of the fourth rigid wiring board 70.

The material of the base layer 131 of the first circuit board 13, the material of the base layer 151 of the second circuit board 15, the material of the base layer 31 of the first rigid circuit board 30, the material of the base layer 41 of the second rigid circuit board 40, the material of the base layer 61 of the third rigid circuit board 60, the material of the base layer 71 of the fourth rigid circuit board 70, the material of the base layer 811 of the fifth rigid circuit board 81, and the material of the base layer 831 of the sixth rigid circuit board 83 are prepregs (preprags, PP) containing glass fibers and epoxy resin.

It is to be understood that, when the fifth rigid wiring board 81 and the sixth rigid wiring board 83 are provided in step S6, conductive holes may be formed in the base layer 811 and the base layer 831, respectively, for electrically connecting the conductive wiring layers.

It is understood that when it is desired to fabricate a bendable circuit board 100 with fewer layers, the fourth rigid wiring board 70 and/or the fifth rigid wiring board 81 and/or the sixth rigid wiring board 83 may be omitted; when a plurality of layers of the flexible circuit board 100 need to be manufactured, the rigid circuit board may be continuously pressed on the outer side of the fifth rigid circuit board 81 and/or the sixth rigid circuit board 83, so as to obtain a plurality of layers of the flexible circuit board 100.

It is understood that the bendable region can be located at any position of the bendable circuit board 100, such as a middle position, an upper middle position, a lower middle position, etc., by adjusting the number of rigid wiring board layers formed on the outer side of the first flexible film layer 21 and the number of rigid wiring board layers formed on the outer side of the second flexible film layer 51.

Referring to fig. 7 and 8, in step S7, partial regions of the first release film 25, the first rigid wiring board 30, the fourth rigid wiring board 70, and the sixth rigid wiring board 83 corresponding to the first flexible film layer 21 are removed to form a first windowing region 86 to expose the first flexible film layer 21; and removing partial areas of the second release film 55, the third rigid circuit board 60 and the fifth rigid circuit board 81 corresponding to the second flexible film layer 51 to form a second windowing area 87 so as to expose the second flexible film layer 51, thereby manufacturing the bendable circuit board.

Referring to fig. 6 again, before step S7, solder masks 90 may be formed on the outer sides of the fifth rigid wiring board 81 and the sixth rigid wiring board 83. The solder mask 90 covers the conductive trace layer 813 of the fifth rigid wiring board 81 and the conductive trace layer 833 of the sixth rigid wiring board 83. The solder mask 90 may be formed by printing, using an insulating ink.

Step S7 specifically includes: firstly, cutting the sixth rigid circuit board 83, the fourth rigid circuit board 70 and the first rigid circuit board 30 along two side edges of the first release film 25 to form a first slit 93, and cutting the fifth rigid circuit board 81 and the third rigid circuit board 60 along two side edges of the second release film 55 to form a second slit 94 by means of laser depth-setting cutting; then, the first windowing region 86 is formed by tearing off the partial region of the first rigid wiring board 30, the fourth rigid wiring board 70, and the sixth rigid wiring board 83 corresponding to the first flexible film layer 21, and the second windowing region 87 is formed by tearing off the partial region of the third rigid wiring board 60 and the fifth rigid wiring board 81 corresponding to the second flexible film layer 51. The first flexible film layer 21 is exposed from the first open area 86 and the second flexible film layer 51 is exposed from the second open area 87.

When laser depth setting cutting is carried out, the preset cutting depth of cutting along the two side edges of the first release film 25 does not exceed the first rigid circuit board 30, so as to avoid damage to the first flexible film layer 21 due to the fact that the actual cutting depth exceeds the first flexible film layer 21 due to cutting depth tolerance; the cutting depth of the second release film 55 along the two side edges thereof does not exceed the third rigid wiring board 60, so as to avoid damage to the second flexible film layer 51 due to the actual cutting depth exceeding the second flexible film layer 51 caused by the cutting depth tolerance.

When cutting is performed, the epoxy resin in the first rigid wiring board 30, the fourth rigid wiring board 70, and the sixth rigid wiring board 83 may overflow and overflow along the side wall of the first slit 93. After removing the first release film 25, the first rigid wiring board 30, the fourth rigid wiring board 70, and the sixth rigid wiring board 83 from the corresponding partial areas of the first flexible film layer 21, the overflowing epoxy resin covers the surface of the first flexible film layer 21 to form a first overflowing glue 95 for protecting the first flexible film layer 21. The width of the first flash 95 is approximately 0-0.5 mm.

When the dicing is performed, the epoxy resin in the third rigid wiring board 60 and the fifth rigid wiring board 81 may overflow and overflow along the side wall of the second slit 94. After removing the second release film 55, the third rigid wiring board 60, and the fifth rigid wiring board 81 from the corresponding partial areas of the second flexible film layer 51, the overflowing epoxy resin covers the surface of the second flexible film layer 51 to form a second overflowing glue 96, so as to protect the second flexible film layer 51. The width of the second flash 96 is approximately 0-0.5 mm.

The present invention also provides a flexible printed circuit board 100, which includes a fifth rigid wiring board 81, a third rigid wiring board 60, a second flexible film layer 51, a second rigid wiring board 40, a circuit board 10, a first flexible film layer 21, a first rigid wiring board 30, a fourth rigid wiring board 70, and a sixth rigid wiring board 83, which are sequentially stacked. The first rigid circuit board 30, the fourth rigid circuit board 70 and the sixth rigid circuit board 83 are provided with a first window area 86 corresponding to the first flexible film layer 21, and the first flexible film layer 21 is exposed from the first window area 86. The third rigid circuit board 60 and the fifth rigid circuit board 81 have a second window area 87 corresponding to the second flexible film layer 51, and the second flexible film layer 51 is exposed from the second window area 87. The corresponding region between the first flexible film layer 21 and the second flexible film layer 51 constitutes a bendable region. The distance between the first flexible film layer 21 and the second flexible film layer 51 is approximately 1-5 mm, that is, the thickness of the bendable region is approximately 1-5 mm.

The circuit substrate 10 is a rigid double-sided circuit board, which includes at least two circuit layers. In the present embodiment, the circuit board 10 includes four circuit layers. It is understood that the circuit substrate 10 may have two, three or more layers.

Specifically, the circuit substrate 10 includes a circuit core board 11, and a first circuit board 13 and a second circuit board 15 respectively formed on two opposite sides of the circuit core board 11. The circuit core board 11 includes an insulating layer 111 and conductive trace layers 113 formed on two opposite surfaces of the insulating layer 111. The first circuit board 13 is a single-sided circuit board, and includes a base layer 131 and a conductive trace layer 133 formed on one side of the base layer 131. The base layer 131 is attached to the conductive circuit layer 113 on one side of the circuit core board 11. The second circuit board 15 is a single-sided circuit board, and includes a base layer 151 and a conductive trace layer 153. The base layer 151 is attached to the conductive circuit layer 133 on the other side of the circuit core board 11.

The first flexible film layer 21 is attached to the conductive trace layer 153 of the first circuit board 13. The first flexible film layer 21 is laminated to the first circuit board 13 through a first adhesive layer 23. In the present embodiment, the first flexible film layer 21 is located at approximately the middle of the circuit board 10.

The first rigid wiring board 30 is a single-sided wiring board, and includes a base layer 31 and a conductive wiring layer 33 formed on one side of the base layer 31. The base layer 31 covers the first flexible film layer 21.

The second rigid wiring board 40 is a single-sided wiring board, and includes a base layer 41 and a conductive wiring layer 43 formed on one side of the base layer 41. The base layer 41 is attached to the circuit board 10.

The second flexible film layer 51 is disposed on a side of the second rigid circuit board 40 away from the circuit substrate 10, and is pressed to the second rigid circuit board 40 through a second adhesive layer 53.

Each of the first and second adhesive layers 23 and 53 includes a resin having adhesiveness, which may be selected from at least one of polypropylene, epoxy resin, polyurethane, phenol resin, urea resin, melamine-formaldehyde resin, polyimide, and the like.

The first flexible film layer 21 and the second flexible film layer 51 may be made of flexible insulating materials such as polyimide, polyethylene, and polycarbonate.

The third rigid wiring board 60 is a single-sided wiring board, the base layer 61, and a conductive wiring layer 63 formed on one side of the base layer 61. The base layer 61 covers the second flexible film layer 51.

The fourth rigid wiring board 70 is a single-sided wiring board, and includes a base layer 71 and a conductive wiring layer 73 formed on one side of the base layer 71. The base layer 71 is attached to the conductive trace layer 33 of the first rigid wiring board 30.

The fifth rigid wiring board 81 is a single-sided wiring board, and includes a base layer 811 and a conductive wiring layer 813 formed on one side of the base layer 811. The base layer 811 is attached to the conductive trace layer 63 of the third rigid wiring board 60.

The sixth rigid wiring board 83 is a single-sided wiring board, and includes a base layer 831 and a conductive line layer 833 formed on one side of the base layer 831. The base 831 is attached to the conductive wiring layer 73 of the fourth rigid wiring board 70.

The material of the base layer 131 of the first circuit board 13, the material of the base layer 151 of the second circuit board 15, the material of the base layer 31 of the first rigid circuit board 30, the material of the base layer 41 of the second rigid circuit board 40, the material of the base layer 61 of the third rigid circuit board 60, the material of the base layer 71 of the fourth rigid circuit board 70, the material of the base layer 811 of the fifth rigid circuit board 81, and the material of the base layer 831 of the sixth rigid circuit board 83 are prepregs (preprags, PP) containing glass fibers and epoxy resin.

It is understood that when it is desired to fabricate a bendable circuit board 100 with fewer layers, the fourth rigid wiring board 70 and/or the fifth rigid wiring board 81 and/or the sixth rigid wiring board 83 may be omitted; when a plurality of layers of the flexible circuit board 100 need to be manufactured, the rigid circuit board may be continuously pressed on the outer side of the fifth rigid circuit board 81 and/or the sixth rigid circuit board 83, so as to obtain a plurality of layers of the flexible circuit board 100.

Optionally, the bendable circuit board 100 further includes a solder mask 90 formed on the outer sides of the fifth rigid wiring board 81 and the sixth rigid wiring board 83. The solder mask 90 covers the conductive trace layer 813 of the fifth rigid wiring board 81 and the conductive trace layer 833 of the sixth rigid wiring board 83. The solder mask 90 may be formed by printing, using an insulating ink.

Optionally, the bendable circuit board 100 further includes a first flash 95 and a second flash 96, the first flash 95 covers the surface of the first flexible film layer 21, and the second flash 96 covers the surface of the second flexible film layer 51. The widths of the first flash 95 and the second flash 96 are approximately 0-0.5 mm.

It is understood that the flexible circuit board 100 may further include conductive holes (not shown) for electrically connecting the conductive trace layers.

In the bendable circuit board 100 and the manufacturing method thereof provided by the embodiment of the invention, the bendable region is formed by laminating the flexible film layers on the two sides of the rigid laminated structure, so that the rigid circuit board realizes the bending function, and the product cost is reduced. In addition, the rigid stacking structure in the bendable region includes the circuit substrate 10 and the second rigid circuit board 40, and the circuit substrate 10 is a double-sided circuit board, so that the bendable region includes multiple layers of conductive circuit layers, which can significantly improve the wiring density and the integration level of the bendable circuit board 100.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention.