阅读说明：本技术 透明电路板、透明电路板中间体及透明电路板制造方法 (Transparent circuit board, transparent circuit board intermediate and transparent circuit board manufacturing method ) 是由 何明展 沈芾云 徐筱婷 于 2020-05-13 设计创作，主要内容包括：一种透明电路板,包括：一导电线路层,所述导电线路层包括依次叠设的一铜层、一金属涂层以及一黑化层；及一覆盖层,所述覆盖层设置于所述黑化层远离所述铜层的表面,所述覆盖层为透明材质；其中,所述金属涂层包括金属,所述黑化层包括所述金属涂层中所述金属的氧化物。另,本发明还提供一种透明电路板中间体及透明电路板的制造方法。(A transparent circuit board comprising: the conductive circuit layer comprises a copper layer, a metal coating and a blackening layer which are sequentially stacked; the covering layer is arranged on the surface, far away from the copper layer, of the blackening layer and is made of a transparent material; wherein the metal coating comprises a metal and the blackened layer comprises an oxide of the metal in the metal coating. In addition, the invention also provides a transparent circuit board intermediate and a manufacturing method of the transparent circuit board.)

1. A method of manufacturing a transparent circuit board intermediate, comprising the steps of:

providing a carrier copper foil, wherein the carrier copper foil comprises a carrier plate and a copper foil layer arranged on the carrier;

arranging a metal coating on the copper foil layer, wherein the metal coating comprises reducing metal;

oxidizing the reducing metal on the side of the metal coating layer far away from the copper foil layer to obtain a blackening layer;

coating a covering layer on the outer side of the blackening layer, wherein the covering layer is made of transparent materials;

and removing the carrier plate, and exposing the copper foil layer to obtain the intermediate of the transparent circuit board.

2. A method of manufacturing a transparent circuit board intermediate, comprising the steps of:

providing a copper plate;

arranging a metal coating on one side surface of the copper plate, wherein the metal coating comprises metal elementary powder;

oxidizing the metal elementary powder on the side, far away from the copper plate, of the metal coating to obtain a blackening layer;

coating a covering layer on the outer side of the blackening layer, wherein the covering layer is made of transparent materials;

and etching the copper plate into a copper foil layer, wherein the thickness of the copper foil layer is smaller than that of the copper foil, and obtaining the intermediate of the transparent circuit board.

3. The method of claim 2, wherein the copper foil layer has a thickness of 12 to 18 microns and the copper foil layer has a thickness of 5 to 8 microns.

4. The manufacturing method according to claim 1 or 2, wherein providing a metal coating specifically comprises:

providing a coating, wherein the coating contains metal ions, a reducing agent and a binder;

coating the coating on the copper foil layer or the copper plate, and baking to enable the metal ions to react with the reducing agent, so that the metal ions are reduced into the elemental metal powder.

5. The manufacturing method according to claim 1 or 2, wherein oxidizing the elemental metal powder on the side of the metal coating layer away from the copper foil layer or the copper plate comprises the steps of:

and spraying an oxidizing agent on one side of the metal coating layer, which is far away from the copper foil layer or the copper plate, so that elemental metal powder in the metal coating layer, which is in contact with the oxidizing agent, is oxidized into metal oxide, and the blackening layer is formed on the outer surface of the metal coating layer.

6. The method of claim 5, wherein the oxidizing agent comprises at least one of a nitric acid solution, a potassium sulfide solution, a potassium polysulfide solution, and a potassium thiosulfate solution.

7. The method of claim 1 or 2, wherein the step of applying a coating layer on the outer side of the blackened layer comprises the steps of:

providing a component A containing diamine monomers and a component B containing diacid monomers, mixing the component A and the component B, and then adding N, N-dimethylacetamide to dilute so as to obtain a coating liquid;

and coating the coating liquid on the blackening layer, and baking until the N, N-dimethylacetamide is completely volatilized, so that the covering layer is obtained.

8. A method for manufacturing a transparent circuit board, comprising the steps of:

providing a transparent circuit board intermediate as claimed in claim 1 or 2, and

and etching the copper foil layer, the metal coating and the blackening layer to obtain a conductive circuit layer, so as to obtain the transparent circuit board.

9. The method of manufacturing of claim 8, wherein etching the copper foil layer, the metal coating, and the blackened layer further comprises:

arranging a dry film layer on the intermediate body, exposing and developing the dry film layer to form a window, and exposing a part of the copper foil layer from the window;

filling copper in the window in an electroplating mode to obtain a copper plating layer, removing the dry film layer, etching the copper foil layer, the metal coating and the blackening layer which are not covered by the copper plating layer to obtain the conductive circuit layer, and

and obtaining the transparent circuit board.

10. A transparent circuit board, comprising:

the conductive circuit layer comprises a copper layer, a metal coating and a blackening layer which are sequentially stacked; and

the covering layer is arranged on the surface, far away from the copper layer, of the blackening layer and is made of a transparent material;

wherein the metal coating comprises a metal and the blackened layer comprises an oxide of the metal in the metal coating.

Technical Field

The invention relates to a transparent circuit board, a transparent circuit board intermediate and a transparent circuit board manufacturing method.

Background

As electronic products are developed to be personalized, requirements for printed circuit boards applied to the electronic products are more and more diversified, and a transparent printed circuit board is one of the printed circuit boards.

In the existing transparent printed circuit board, an insulating substrate, a solder mask layer and the like for bearing and protecting a conductive circuit pattern are made of transparent materials, and can be applied to a transparent vehicle-mounted antenna and amplification of an antenna signal. In the prior art, a wiring mode of a single-layer silver circuit is adopted when a transparent circuit board is manufactured, and a blackened silver layer formed after the silver circuit is blackened influences the conductivity and the uniformity of the whole circuit board.

Disclosure of Invention

Accordingly, there is a need for a transparent circuit board whose blackened layer does not affect the conductivity of the circuit board.

In addition, a manufacturing method of the transparent circuit board intermediate is also needed to be provided.

In addition, it is also necessary to provide a method for manufacturing a transparent circuit board.

A method of manufacturing a transparent circuit board intermediate, comprising the steps of: providing a carrier copper foil, wherein the carrier copper foil comprises a carrier plate and a copper foil layer arranged on the carrier. And arranging a metal coating on the copper foil layer, wherein the metal coating comprises reducing metal. And oxidizing the reducing metal on the side of the metal coating layer far away from the copper foil layer to obtain a blackening layer. And coating a covering layer on the outer side of the blackening layer, wherein the covering layer is made of transparent materials. And removing the carrier plate, and exposing the copper foil layer to obtain the intermediate of the transparent circuit board.

A method of manufacturing a transparent circuit board intermediate, comprising the steps of: a copper plate is provided. And arranging a metal coating on one side surface of the copper plate, wherein the metal coating comprises metal elementary powder. And oxidizing the metal elementary powder on the side of the metal coating far away from the copper plate to obtain a blackening layer. And coating a covering layer on the outer side of the blackening layer, wherein the covering layer is made of transparent materials. And etching the copper plate into a copper foil layer, wherein the thickness of the copper foil layer is smaller than that of the copper foil, and obtaining the intermediate of the transparent circuit board.

Further, the thickness of the copper foil layer is 12-18 microns, and the thickness of the copper foil layer is 7-11 microns.

Further, providing a metal coating specifically includes providing a coating that includes metal ions, a reducing agent, and a binder. Coating the coating on the copper foil layer or the copper plate, and baking to enable the metal ions to react with the reducing agent, so that the metal ions are reduced into the elemental metal powder.

Further, the step of oxidizing the elemental metal powder on the side of the metal coating layer away from the copper foil layer or the copper plate specifically comprises the steps of: and spraying an oxidizing agent on one side of the metal coating layer, which is far away from the copper foil layer or the copper plate, so that elemental metal powder in the metal coating layer, which is in contact with the oxidizing agent, is oxidized into metal oxide, and the blackening layer is formed on the outer surface of the metal coating layer.

Further, the oxidizing agent comprises at least one of a nitric acid solution, a potassium sulfide solution, a potassium polysulfide solution, and a potassium thiosulfate solution.

Further, coating a covering layer on the outer side of the blackening layer specifically comprises the steps of: providing a component A containing diamine monomers and a component B containing diacid monomers, mixing the component A and the component B, and then adding N, N-dimethylacetamide to dilute so as to obtain the coating liquid. And coating the coating liquid on the blackening layer, and baking until the N, N-dimethylacetamide is completely volatilized, so that the covering layer is obtained.

A method of manufacturing a transparent circuit board, comprising the steps of: providing the transparent circuit board intermediate, and etching the copper foil layer, the metal coating and the blackening layer to obtain a conductive circuit layer, thereby obtaining the transparent circuit board.

Further, before etching the copper foil layer, the metal coating and the blackening layer, the step of etching further comprises: and arranging a dry film layer on the intermediate, exposing and developing the dry film layer to form a window, and exposing a part of the copper foil layer from the window. And filling copper in the windowing in an electroplating mode to obtain a copper plating layer, removing the dry film layer, etching the copper foil layer, the metal coating and the blackening layer which are not covered by the copper plating layer to obtain the conductive circuit layer, and obtaining the transparent circuit board.

A transparent circuit board comprising: and the conductive circuit layer comprises a copper layer, a metal coating and a blackening layer which are sequentially stacked. And the covering layer is arranged on the surface of the blackening layer, which is far away from the copper layer, and is made of a transparent material. Wherein the metal coating comprises a metal and the blackened layer comprises an oxide of the metal in the metal coating.

Compared with the method for directly oxidizing the conductive circuit layer and blackening the surface of the conductive circuit layer, the method for manufacturing the transparent circuit board has the advantage of not influencing the conductivity of the conductive circuit layer.

Drawings

Fig. 1A to fig. 1J are schematic views illustrating a manufacturing process of a transparent circuit board according to an embodiment of the invention.

Fig. 2A-2E are schematic views of a manufacturing process of an intermediate according to another embodiment of the present invention.

Description of the main elements

Transparent circuit board 100

Carrier copper foil 10

Copper foil layer 11

First surface 111

Second surface 112

Metal coating 12

Blackened layer 13

Cover layer 14

Conductive line layer 15

Carrier plate 21

Intermediate 203

Copper plating layer 204

Dry film layer 201

Window 202

Copper plate 30

Thickness D1, D2

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

An embodiment of the present invention provides a method for manufacturing a transparent circuit board 100, including the steps of:

s1 referring to fig. 1A, a carrier copper foil 10 is provided, the carrier copper foil 10 includes a carrier 21 and at least one copper foil layer 11 disposed on the carrier 21, the copper foil layer 11 includes a first surface 111 disposed outward and a second surface 112 contacting the carrier 21.

S2, referring to fig. 1B, a metal coating 12 is disposed on the first surface 111, wherein the metal coating 12 includes elemental metal powder;

s3, please refer to FIG. 1C, oxidizing the elemental metal powder on the side of the metal coating 12 away from the first surface 111 to obtain a blackened layer 13;

s4, referring to fig. 1D, coating a covering layer 14 on the outer side of the blackening layer 13, wherein the covering layer 14 is made of a transparent material;

s5: referring to fig. 1D and fig. 1E, the carrier 21 is removed, and the copper foil layer 11 is exposed, so as to obtain an intermediate 203;

s6, please refer to fig. 1E and 1J, the copper foil layer 11 is etched to obtain a conductive trace layer 15, and the metal coating 12 and the blackening layer 13 uncovered by the conductive trace layer 15 are removed, so as to obtain the transparent circuit board 100.

In this embodiment, in step S2, the step of disposing a metal coating 12 on the first surface 111 includes the steps of:

s21, providing a coating, wherein the coating contains metal ions, a reducing agent and a binder, the metal ions comprise at least one of silver ions, copper ions and iron ions, and the binder comprises at least one of epoxy resin.

S22, coating the coating material in the S21 on the first surface 111, baking to enable the metal ions to react with a reducing agent, and enabling the metal ions to be reduced into elemental metal powder. Specifically, the coating coated on the first surface 111 is baked at 150 ℃ for 10min, and then the metal coating 12 with the thickness of 50-250 nm is obtained, wherein the surface roughness Rz of the metal coating 12 is 0.06-1.0 micron.

In this embodiment, in step S3, the oxidation process specifically includes:

s31, providing an oxidant, wherein the oxidant comprises at least one of a nitric acid solution, a potassium sulfide solution, a potassium polysulfide solution and a potassium thiosulfate solution;

and S32, spraying the oxidant on the side of the metal coating 12 far away from the first surface 111, and after reacting for a while, oxidizing the metal oxide by the elemental metal powder in the metal coating 12, which is in contact with the oxidant, so as to form the blackening layer 13 on the outer surface of the metal coating 12. Compared with the method of directly oxidizing the first surface 111 to perform blackening, the method of arranging the metal coating 12 on the first surface 111 and oxidizing the metal coating 12 to obtain the blackening layer 13 is beneficial to avoiding the influence on the conductivity of the subsequent conductive circuit layer 15, and the blackening layer 13 formed in an oxidizing manner is uniform and compact, so that the conductivity of the subsequent conductive circuit layer 15 can be improved to a certain degree.

In this embodiment, the step S4 of coating a covering layer 14 on the outer side includes:

s41, providing a component A containing diamine monomers and a component B containing diacid monomers, wherein the mass of the diamine monomers accounts for 6.20-9.55% of the total mass of the component A, the mass of the diacid monomers accounts for 6.80-10.45% of the total mass of the component B, mixing the component A and the component B, reacting for 8 hours at normal temperature, and then adding N, N-Dimethylacetamide (DMAC) to dilute to obtain a coating liquid, wherein the mass of the DMAC accounts for 80-87% of the total mass of the coating liquid.

S42, coating the coating liquid on the blackening layer 13, and baking at 150 ℃ until DMAC is completely volatilized to obtain the transparent covering layer 14 covering the blackening layer 13, wherein the transparency of the covering layer 14 can reach 92-88%.

Further, in step S41, the diamine monomer includes at least one of 2,2' -bis [4- (4-aminophenoxyphenyl) ], p-aminobenzoate, 1, 4-bis (4-aminophenoxy) benzene, and di-p-aminophenyl terephthalate; the diacid monomer comprises at least one of (hexafluoroisopropylidene) diphthalic anhydride, 3',4,4' -biphenyltetracarboxylic dianhydride, p-phenyl bis (trimellitate) dianhydride and cyclohexane-1, 4-diylbis (methylene) bis (ethyl 1, 3-dioxo-1, 3-dihydroisobenzofuran-5-carboxylate).

Further, the method also comprises the following steps of mixing the component A and the component B: adding a catalyst, wherein the catalyst is at least one selected from p-hydroxybenzoic acid, 4-hydroxypyridine, triethylamine, 2, 6-dimethylpiperidine and N, N-benzyldimethylamine. The catalyst added ensures that the reaction temperature of the a and B components does not exceed 200 c, thereby further reducing the risk of yellowing of the overlayer 14.

In this embodiment, referring to fig. 1F and fig. 1G together, before the step S6 of etching the copper foil layer 11 to obtain an electrically conductive circuit layer 15, the method further includes: a dry film 201 is disposed on the second surface 112 of the intermediate body 203, the dry film 201 is exposed and developed to form a window 202, and a portion of the second surface 112 is exposed from the window 202.

Further, referring to fig. 1H, fig. 1I and fig. 1J together, filling copper into the window 202 by electroplating to obtain a copper plating layer 204, removing the dry film layer 201, and rapidly etching the copper foil layer 11, the metal coating 12 and the blackening layer 13 which are not covered by the copper plating layer 204, so as to obtain the conductive circuit layer 15, and finally obtain the transparent circuit board 100, wherein the thickness D1 of the conductive circuit layer 15 is 5 to 8 micrometers, and the width is 9 to 11 micrometers.

In another embodiment of the present invention, the method for manufacturing the intermediate body 203 comprises the steps of:

s1 please refer to FIG. 2A, a copper plate 30 is provided, the thickness D2 of the copper plate 30 is 12-18 μm.

S2, referring to fig. 2B, a metal coating 12 is disposed on one side of the copper plate 30, wherein the metal coating 12 includes elemental metal powder;

s3, please refer to FIG. 2C, the elemental metal powder on the side of the metal coating 12 away from the first surface 111 is oxidized to obtain a blackened layer 13;

s4, referring to fig. 2D, coating a covering layer 14 on the outer side of the blackening layer 13, wherein the covering layer 14 is made of a transparent material;

and S5, referring to FIG. 2E, etching and thinning the copper plate 30 into the copper foil layer 11, wherein the thickness D1 of the copper foil layer 11 is 5-8 microns, and obtaining the intermediate 203.

The present invention provides a transparent circuit board 100, comprising: the conductive circuit comprises a conductive circuit layer 15, a metal coating layer 12 arranged below the conductive circuit layer 15, a blackening layer 13 arranged below the metal coating layer and a covering layer 14 arranged below the blackening layer, wherein the covering layer 14 is transparent, the metal coating layer 12 comprises metal powder, and the blackening layer 13 comprises oxides of the metal powder in the metal coating layer 12.

The manufacturing method of the transparent circuit board provided by the invention has the following advantages:

compared with the method of directly oxidizing the conductive circuit layer and blackening the surface of the conductive circuit layer, the method has the advantage of not influencing the conductivity of the conductive circuit layer.

And (II) the blackened layer is suitable for manufacturing an ultrafine conductive circuit layer, the thickness of the conductive circuit layer is 5-8 micrometers, and the width of the conductive circuit layer is 9-11 micrometers.

The part of the metal coating is oxidized into a blackened layer, and the blackened layer manufactured by the oxidation process has the advantages of good compactness and low surface roughness

And (IV) the coating layer obtained by the coating and drying mode has high transparency.

In addition, it is obvious to those skilled in the art that other various corresponding changes and modifications can be made according to the technical idea of the present invention, and all such changes and modifications should fall within the protection scope of the present invention.