阅读说明：本技术 一种基于5g信号传输用半导体材料 (Semiconductor material for 5G signal transmission ) 是由 赵一静 魏淑玲 刘乐华 赵宁 于 2021-09-01 设计创作，主要内容包括：本发明公开了一种基于5G信号传输用半导体材料,涉及半导体技术领域。本发明以重量份计,该半导体材料包括：聚合物基底100份、散热复合材料5-15份、耐穿抗静电复合材料2-6份、导电材料1-20份、第一附加剂8-15份、填料2-15份、交联剂1-5份、有机溶剂250-400份；聚合物基底为聚二甲基硅氧烷、聚偏氟乙烯、聚甲基丙烯酸甲酯或聚氯乙烯的一种。本发明通过散热材料、耐穿刺抗静电材料及导电材料在半导体性上的复合,能够有效提高该半导体的散热、耐穿刺和抗静电性能,通过上述性能的提高,继而能够使之与5G信号的使用环境进行高匹配。(The invention discloses a semiconductor material for 5G signal transmission, and relates to the technical field of semiconductors. The semiconductor material comprises the following components in parts by weight: 100 parts of polymer substrate, 5-15 parts of heat dissipation composite material, 2-6 parts of wear-resistant antistatic composite material, 1-20 parts of conductive material, 8-15 parts of first additive, 2-15 parts of filler, 1-5 parts of cross-linking agent and 400 parts of organic solvent 250-; the polymer substrate is one of polydimethylsiloxane, polyvinylidene fluoride, polymethyl methacrylate or polyvinyl chloride. According to the invention, through the compounding of the heat dissipation material, the puncture-resistant antistatic material and the conductive material on the semiconductor, the heat dissipation, puncture resistance and antistatic performance of the semiconductor can be effectively improved, and through the improvement of the performance, the semiconductor can be highly matched with the use environment of a 5G signal.)

1. A semiconductor material for 5G signal transmission comprises the following components in parts by weight:

100 parts of polymer substrate, 5-15 parts of heat dissipation composite material, 2-6 parts of wear-resistant antistatic composite material, 1-20 parts of conductive material, 8-15 parts of first additive, 2-15 parts of filler, 1-5 parts of cross-linking agent and 400 parts of organic solvent 250-one.

2. The semiconductor material for 5G signal transmission according to claim 1, wherein the polymer substrate is one of polydimethylsiloxane, polyvinylidene fluoride, polymethyl methacrylate or polyvinyl chloride.

3. The semiconductor material for 5G signal transmission according to claim 1, wherein the heat dissipation composite material comprises 20 parts of black phosphorus alkene-polyaniline composite, 1-8 parts of composite nano ceramic particles, 8-10 parts of a second additive, 30-40 parts of a high molecular polymer and 80-120 parts of a mixed solvent.

4. The semiconductor material for 5G signal transmission according to claim 1, wherein the black phosphene-polyaniline composite comprises 3-6 parts of black phosphene, 40-80 parts of water, 6-20 parts of oxidant, 3-15 parts of aniline, 2.2-3 parts of hydrochloric acid and 0.8-1 part of surfactant.

5. The semiconductor material for 5G signal transmission according to claim 3, wherein the composite nano-ceramic particles comprise aluminum oxide nano-ceramic particles and aluminum nitride nano-ceramic particles; the weight of the alumina nano ceramic particles is 60 percent of the total weight of the composite nano ceramic particles; the weight of the aluminum nitride nano ceramic particles is 40 percent of the total weight of the composite nano ceramic particles; the particle size ranges of the alumina nano ceramic particles and the composite nano ceramic particles are both 5um-15 um.

6. The semiconductor material for 5G signal transmission according to claim 3, wherein the mixed solvent is N-N-dimethylformamide, N-methylpyrrolidone, xylene or acetone; the high molecular polymer is low-density polyethylene, polyethylene terephthalate, ethylene-vinyl acetate copolymer, high-density polyethylene or polyformaldehyde; the second additive can be one or more of an initiator, a dispersing agent, an emulsifier, a filter aid and the like.

7. The semiconductor material for 5G-based signal transmission according to claim 1, wherein the conductive material is a conductive rubber; the conductive rubber is a mixture of silver-plated glass or aluminum particles and silicone rubber.

8. The semiconductor material for 5G signal transmission as claimed in claim 1, wherein the wear-resistant antistatic composite material comprises 100-170 parts of composite rubber raw material, 1-10 parts of graphene, 4-6 parts of silane coupling agent, 10-20 parts of high wear-resistant carbon black, 0-6 parts of environment-friendly rubber oil, 2-3 parts of activator, 1-3 parts of sulfur, 1-8 parts of accelerator, 1-2 parts of paraffin oil and 5-10 parts of reinforcing agent.

9. The semiconductor material for 5G signal transmission according to claim 3, wherein the composite rubber raw material comprises 0-10 parts of epoxidized natural rubber, 10-20 parts of solution polymerized styrene-butadiene rubber, 5-25 parts of butadiene rubber and 50-100 parts of ethylene propylene diene monomer; the active agent is a mixture of zinc oxide and zinc stearate; the reinforcing agent is a mixture of high wear-resistant furnace black, calcium carbonate and white carbon black; the reinforcing agent comprises 3 parts of high wear-resistant furnace black, calcium carbonate and white carbon black: 20: 10.

10. the semiconductor material for 5G signal transmission according to claim 1, wherein the crosslinking agent is one of tert-butyl peroxycarbonate, dicumyl peroxide, benzoyl peroxide, methylene bisacrylamide, 1-4-di-tert-butylperoxyisopropyl benzene, and dicumyl peroxide.

Technical Field

The invention belongs to the technical field of semiconductors, and particularly relates to a semiconductor material for 5G signal transmission.

Background

Semiconductor materials are a class of electronic materials that have semiconductor properties and can be used to make semiconductor devices and integrated circuits; the semiconductor material can be divided according to chemical composition, and then amorphous state and liquid semiconductor with special structure and performance are separately listed as a type; semiconductor materials can be classified into elemental semiconductors, inorganic compound semiconductors, organic compound semiconductors, and amorphous and liquid semiconductors according to such classification methods.

Semiconductor materials are generally required to have properties such as doping, heat sensitivity, photosensitivity, and rectification; for 5G signal transmission, because the power is high during signal transmission and a large amount of static electricity is generated during operation of 5G equipment, the semiconductor for 5G signal transmission is required to have good heat dissipation performance and antistatic puncture performance; with the development of the semiconductor industry, more and more new materials are beginning to be suitable for the production of semiconductors;

compared with graphene, the most unique property of black phosphorus is strong anisotropy in a plane, in an orthorhombic system point group, the effective carriers of a sawtooth type along the longitudinal direction are ten times of those along the transverse structure, the property enables the black phosphorus to be used for designing novel electronics and photonics devices, and compared with graphene, the heat dissipation performance of the black phosphorus is more excellent, and meanwhile, in the prior art, the improvement of the puncture resistance and the antistatic property of a rubber product for a semiconductor becomes a widely adopted means.

There is thus a continuing need in the market for new semiconductor composites that can be adapted for 5G type transmission.

Disclosure of Invention

The invention aims to provide a semiconductor material for 5G signal transmission, which solves the problems of poor heat dissipation performance, static resistance and puncture resistance of the conventional semiconductor material for 5G signal transmission through the optimization of the semiconductor material.

In order to solve the technical problems, the invention is realized by the following technical scheme:

the invention relates to a semiconductor material for transmitting signals based on 5G, which comprises the following components in parts by weight:

100 parts of polymer substrate, 5-15 parts of heat dissipation composite material, 2-6 parts of wear-resistant antistatic composite material, 1-20 parts of conductive material, 8-15 parts of first additive, 2-15 parts of filler, 1-5 parts of cross-linking agent and 400 parts of organic solvent 250-one.

Preferably, the polymer substrate is one of polydimethylsiloxane, polyvinylidene fluoride, polymethyl methacrylate or polyvinyl chloride.

Preferably, the heat dissipation composite material comprises 20 parts of black phosphorus alkene-polyaniline compound, 1-8 parts of composite nano ceramic particles, 8-10 parts of second additive, 30-40 parts of high molecular polymer and 80-120 parts of mixed solvent.

Preferably, the black phosphorus alkene-polyaniline compound comprises 3-6 parts of black phosphorus alkene, 40-80 parts of water, 6-20 parts of an oxidant, 3-15 parts of aniline, 2.2-3 parts of hydrochloric acid and 0.8-1 part of a surfactant.

Preferably, the composite nano-ceramic particles comprise alumina nano-ceramic particles and aluminum nitride nano-ceramic particles; the weight of the alumina nano ceramic particles is 60 percent of the total weight of the composite nano ceramic particles; the weight of the aluminum nitride nano ceramic particles is 40 percent of the total weight of the composite nano ceramic particles; the particle size ranges of the alumina nano ceramic particles and the composite nano ceramic particles are both 5um-15 um.

Preferably, the mixed solvent is N-N-dimethylformamide, N-methylpyrrolidone, xylene or acetone; the high molecular polymer is low-density polyethylene, polyethylene terephthalate, ethylene-vinyl acetate copolymer, high-density polyethylene or polyformaldehyde; the second additive can be one or more of an initiator, a dispersing agent, an emulsifier, a filter aid and the like.

Preferably, the conductive material is conductive rubber; the conductive rubber is a mixture of silver-plated glass or aluminum particles and silicone rubber.

Preferably, the wear-resistant antistatic composite material comprises 170 parts of composite rubber raw material, 1-10 parts of graphene, 4-6 parts of silane coupling agent, 10-20 parts of high-wear-resistance carbon black, 0-6 parts of environment-friendly rubber oil, 2-3 parts of activator, 1-3 parts of sulfur, 1-8 parts of accelerator, 1-2 parts of paraffin oil and 5-10 parts of reinforcing agent.

Preferably, the composite rubber raw material comprises 0-10 parts of epoxidized natural rubber, 10-20 parts of solution polymerized styrene-butadiene rubber, 5-25 parts of butadiene rubber and 50-100 parts of ethylene propylene diene monomer; the active agent is a mixture of zinc oxide and zinc stearate; the reinforcing agent is a mixture of high wear-resistant furnace black, calcium carbonate and white carbon black; the reinforcing agent comprises 3 parts of high wear-resistant furnace black, calcium carbonate and white carbon black: 20: 10.

Preferably, the cross-linking agent is one of tert-butyl peroxycarbonate, dicumyl peroxide, benzoyl peroxide, methylene bisacrylamide, 1-4-di-tert-butylperoxyisopropyl benzene and dicumyl peroxide.

The invention has the following beneficial effects:

1. according to the invention, through the compounding of the heat dissipation material, the puncture-resistant antistatic material and the conductive material on the semiconductor, the heat dissipation, puncture resistance and antistatic performance of the semiconductor can be effectively improved, through the improvement of the performance, the semiconductor can be highly matched with the use environment of a 5G signal, and through the improvement of the high matching effect, the stability of the semiconductor in the 5G signal transmission process is effectively improved.

2. According to the invention, through the application of the black phosphorus polyaniline compound in the heat dissipation material, on one hand, the stability of the semiconductor material is improved, and the probability of agglomeration of the semiconductor material is reduced, on the other hand, the surface conductivity of the semiconductor material can be effectively improved through the increase of the compound while the heat dissipation performance is improved, and then the antistatic performance of the device is assisted to be enhanced.

3. According to the invention, through the application of various rubbers in the wear-resistant antistatic composite material, on one hand, the production cost of the semiconductor is reduced, and on the other hand, through the application of the rubber material, the surface conductivity of the rubber can be effectively improved on the basis of increasing the electric breakdown resistance of the semiconductor, so that the electric conduction and antistatic effect of the semiconductor are assisted to be improved.

Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example one

The invention relates to a semiconductor material for transmitting signals based on 5G, which comprises the following components in parts by weight:

100 parts of polymer substrate, 5 parts of heat dissipation composite material, 2 parts of wear-resistant antistatic composite material, 1 part of conductive material, 8 parts of first additive, 2 parts of filler, 1 part of cross-linking agent and 250 parts of organic solvent, wherein the specific organic solvent can be petroleum ether.

The production method of the semiconductor material comprises the steps of firstly dissolving a polymer in an organic solvent, then sequentially adding a wear-resistant antistatic composite material, a conductive material, a first additive, a filler and a cross-linking agent into the organic solvent, adding the materials, carrying out ultrasonic dispersion on the mixed solution, wherein the ultrasonic time is 5 hours, the ultrasonic power is 500W, namely, preparing a premixed mixture, injecting the prepared mixture into a high-pressure reaction kettle for reaction for 1 hour, putting the reacted mixture into an internal mixer, adding organic adhesive and reducing agent during banburying, wherein the reaction temperature during mixing is 1000 ℃, the mixing is carried out in reducing gas during mixing for 2h, after the mixing is finished, and cooling the mixed mixture to 200 ℃, performing suction filtration in a suction filter, putting the suction-filtered liquid into a screw extruder for melting, extruding and shaping to obtain a finished product of the semiconductor material.

Through the increase of heat dissipation combined material, resistant antistatic combined material and conducting material, can effectively increase the heat-sinking capability of the device on the one hand, on the other hand can also increase this full-time anti-puncture, antistatic ability, through the reinforcing of above-mentioned ability, effectively improve the comprehensive properties of the device then, through the increase of conducting material, make the device can increase the electrically conductive and antistatic ability of the device through the method that reduces the device resistance.

Further, the polymer substrate is polydimethylsiloxane.

Further, the heat dissipation composite material comprises 20 parts of a black phosphorus alkene-polyaniline compound, 1 part of composite nano ceramic particles, 8 parts of a second additive, 30 parts of a high molecular polymer and 80 parts of a mixed solvent; specifically, the processing method of the heat dissipation composite material comprises the steps of sequentially adding the black phosphorus alkene-polyaniline compound, the composite nano ceramic particles, the second additive and the high molecular polymer into a mixed solvent, uniformly mixing the mixture through ultrasonic dispersion, after uniform mixing, centrifugally separating the mixed material, and after interest separation, coating and drying the obtained solution to obtain the heat dissipation composite material;

the black phosphorus alkene-polyaniline compound comprises 3 parts of black phosphorus alkene, 40 parts of water, 6 parts of an oxidant, 3 parts of aniline, 2.2 parts of hydrochloric acid and 0.8 part of a surfactant; when the black phosphorus alkene-polyaniline compound is prepared, 3 parts of black phosphorus alkene, 40 parts of water, 6 parts of oxidant, 3 parts of aniline and 2.2 parts of hydrochloric acid are placed into a reactor, high-speed stirring is carried out to enable the black phosphorus alkene, the water, the oxidant, the aniline and the hydrochloric acid to be uniformly dispersed, the oxidant is added into the mixture to continue to react for 12 hours at the temperature of minus 2 ℃, and after the reaction is finished, the reaction is dried, so that the black phosphorus alkene-polyaniline compound is prepared, wherein the materials are stirred at high speed under the condition of introducing nitrogen, and the stirring temperature is controlled to be minus 2 ℃.

Further, the composite nano-ceramic particles comprise alumina nano-ceramic particles and aluminum nitride nano-ceramic particles; the weight of the alumina nano ceramic particles is 60 percent of the total weight of the composite nano ceramic particles; the weight of the aluminum nitride nano ceramic particles is 40 percent of the total weight of the composite nano ceramic particles; the particle sizes of the alumina nano ceramic particles and the composite nano ceramic particles are both 5 um.

Further, the mixed solvent is N-N-dimethylformamide; the high molecular polymer is low-density polyethylene; the second additive may be an initiator; the conductive material is conductive rubber; the conductive rubber is a mixture of silver-plated glass or aluminum particles and silicone rubber.

Further, the wear-resistant antistatic composite material comprises 100 parts of composite rubber raw materials, 1 part of graphene, 4 parts of silane coupling agent, 10 parts of high-wear-resistance carbon black, 2 parts of active agent, 1 part of sulfur, 1 part of accelerator, 1 part of paraffin oil and 5 parts of reinforcing agent.

Further, the composite rubber raw materials comprise 10 parts of solution polymerized styrene-butadiene rubber, 5 parts of butadiene rubber and 50 parts of ethylene propylene diene monomer; the active agent is a mixture of zinc oxide and zinc stearate; the reinforcing agent is a mixture of high wear-resistant furnace black, calcium carbonate and white carbon black; the reinforcing agent comprises 3 parts of high wear-resistant furnace black, calcium carbonate and white carbon black: 20: 10; further, the cross-linking agent is tert-butyl peroxycarbonate;

the preparation method of the wear-resistant antistatic composite material comprises the steps of putting a composite rubber raw material, graphene, silane coupling agent, high-wear-resistance carbon black, active agent, accelerator and reinforcing agent into an internal mixer, mixing at the temperature of below 100 ℃ for 6 minutes, discharging rubber at the temperature of below 165 ℃ and transferring to an open mill for cooling, cooling to room temperature, putting the prepared material into the internal mixer, adding sulfur paraffin oil, mixing for 2 minutes, discharging to the open mill at the temperature of below 100 ℃ and discharging to cool, so that the wear-resistant antistatic composite material is prepared, wherein the particle size of the wear-resistant antistatic composite material is ensured to be lower than 10 mu m when the wear-resistant antistatic composite material is prepared.

Example two

The invention relates to a semiconductor material for transmitting signals based on 5G, which comprises the following components in parts by weight:

compared with the scheme of the first embodiment, the technical scheme can further enhance the antistatic property, puncture resistance and heat dissipation performance of the semiconductor material on the basis of the first embodiment by adding the heat dissipation composite material, the puncture resistance antistatic composite material and the conductive material.

The production method of the semiconductor material comprises the steps of firstly dissolving a polymer in an organic solvent, then sequentially adding a wear-resistant antistatic composite material, a conductive material, a first additive, a filler and a cross-linking agent into the organic solvent, adding the materials, carrying out ultrasonic dispersion on the mixed solution, wherein the ultrasonic time is 5 hours, the ultrasonic power is 500W, namely, preparing a premixed mixture, injecting the prepared mixture into a high-pressure reaction kettle for reaction for 1 hour, putting the reacted mixture into an internal mixer, adding organic adhesive and reducing agent during banburying, wherein the reaction temperature during mixing is 1000 ℃, the mixing is carried out in reducing gas during mixing for 2h, after the mixing is finished, and cooling the mixed mixture to 200 ℃, performing suction filtration in a suction filter, putting the suction-filtered liquid into a screw extruder for melting, extruding and shaping to obtain a finished product of the semiconductor material.

Further, the polymer substrate is polyvinylidene fluoride.

Furthermore, the heat dissipation composite material comprises 20 parts of black phosphorus alkene-polyaniline compound, 4 parts of composite nano ceramic particles, 9 parts of second additive, 35 parts of high molecular polymer and 90 parts of mixed solvent, and compared with the first embodiment, the production cost of the heat dissipation composite material can be effectively reduced by increasing the proportion of the composite nano ceramic particles, the second additive and the high molecular polymer;

specifically, the processing method of the heat dissipation composite material comprises the steps of sequentially adding the black phosphorus alkene-polyaniline compound, the composite nano ceramic particles, the second additive and the high molecular polymer into a mixed solvent, uniformly mixing the mixture through ultrasonic dispersion, after uniform mixing, centrifugally separating the mixed material, and after interest separation, coating and drying the obtained solution to obtain the heat dissipation composite material.

Further, the black phosphorus alkene-polyaniline compound comprises 5 parts of black phosphorus alkene, 50 parts of water, 10 parts of oxidant, 5 parts of aniline, 2.5 parts of hydrochloric acid and 0.8 part of surfactant, and compared with the first embodiment, the heat dissipation performance and the surface oxidation resistance of the heat dissipation material in unit area can be effectively improved by increasing the proportion of the black phosphorus alkene, the activator and the oxidant; when the black phosphorus alkene-polyaniline compound is prepared, 3 parts of black phosphorus alkene, 40 parts of water, 6 parts of oxidant, 3 parts of aniline and 2.2 parts of hydrochloric acid are placed into a reactor, high-speed stirring is carried out to enable the black phosphorus alkene, the water, the oxidant, the aniline and the hydrochloric acid to be uniformly dispersed, the oxidant is added into the mixture to continue to react for 12 hours at the temperature of minus 2 ℃, and after the reaction is finished, the reaction is dried, so that the black phosphorus alkene-polyaniline compound is prepared, wherein the materials are stirred at high speed under the condition of introducing nitrogen, and the stirring temperature is controlled to be minus 2 ℃.

Further, the composite nano-ceramic particles comprise alumina nano-ceramic particles and aluminum nitride nano-ceramic particles; the weight of the alumina nano ceramic particles is 60 percent of the total weight of the composite nano ceramic particles; the weight of the aluminum nitride nano ceramic particles is 40 percent of the total weight of the composite nano ceramic particles; the particle size of aluminium oxide nanometer ceramic particle and compound nanometer ceramic particle is 10um, compares with embodiment one, through the improvement of particle size, can effectively reduce the device's the production degree of difficulty and manufacturing cost.

Further, the mixed solvent is xylene; the high molecular polymer is an ethylene-vinyl acetate copolymer; the second additive may be an emulsifier; the conductive material is conductive rubber; the conductive rubber is a mixture of silver-plated glass or aluminum particles and silicone rubber.

Furthermore, the wear-resistant antistatic composite material comprises 125 parts of composite rubber raw material, 5 parts of graphene, 5 parts of silane coupling agent, 15 parts of high-wear-resistance carbon black, 3 parts of environment-friendly rubber oil, 2.5 parts of active agent, 2.5 parts of sulfur, 2 parts of accelerator, 2 parts of paraffin oil and 8 parts of reinforcing agent, and compared with the first embodiment, the comprehensive performance of the wear-resistant antistatic composite material can be improved by increasing the proportion of the active agent to the reinforcing agent.

Further, the composite rubber raw materials comprise 5 parts of epoxidized natural rubber, 15 parts of solution polymerized styrene-butadiene rubber, 10 parts of butadiene rubber and 75 parts of ethylene propylene diene monomer; the active agent is a mixture of zinc oxide and zinc stearate; the reinforcing agent is a mixture of high wear-resistant furnace black, calcium carbonate and white carbon black; the reinforcing agent comprises 3 parts of high wear-resistant furnace black, calcium carbonate and white carbon black: 20: 10.

further, the cross-linking agent is benzoyl peroxide.

The preparation method of the wear-resistant antistatic composite material comprises the steps of putting a composite rubber raw material, graphene, silane coupling agent, high-wear-resistance carbon black, active agent, accelerator and reinforcing agent into an internal mixer, mixing at the temperature of below 100 ℃ for 6 minutes, discharging rubber at the temperature of below 165 ℃ and transferring to an open mill for cooling, cooling to room temperature, putting the prepared material into the internal mixer, adding sulfur paraffin oil, mixing for 2 minutes, discharging to the open mill at the temperature of below 100 ℃ and discharging to cool, so that the wear-resistant antistatic composite material is prepared, wherein the particle size of the wear-resistant antistatic composite material is ensured to be lower than 10 mu m when the wear-resistant antistatic composite material is prepared.

EXAMPLE III

The invention relates to a semiconductor material for transmitting signals based on 5G, which comprises the following components in parts by weight:

100 parts of a polymer substrate, 15 parts of a heat dissipation composite material, 6 parts of a wear-resistant antistatic composite material, 20 parts of a conductive material, 15 parts of a first additive, 15 parts of a filler, 5 parts of a cross-linking agent and 260 parts of an organic solvent, wherein compared with the scheme of the first embodiment, the antistatic, puncture-resistant and heat dissipation performance of the semiconductor material can be further enhanced on the basis of the first embodiment by adding the heat dissipation composite material, the wear-resistant antistatic composite material and the conductive material;

the production method of the semiconductor material comprises the steps of firstly dissolving a polymer in an organic solvent, then sequentially adding a wear-resistant antistatic composite material, a conductive material, a first additive, a filler and a crosslinking agent into the organic solvent, then carrying out ultrasonic dispersion on the mixed solution for 5 hours with the ultrasonic power of 500W to obtain a premixed mixture, injecting the prepared mixture into a high-pressure reaction kettle for reaction for 1 hour, then placing the reacted mixture into an internal mixer, adding an organic binder and a reducing agent during internal mixing, carrying out mixing at the reaction temperature of 1000 ℃, ensuring that the mixing is carried out in a reducing gas during mixing for 3 hours, compared with the two phases in the embodiment, effectively improving the mixing effect of the device by prolonging the mixing time, cooling the mixed mixture to 200 ℃ after the mixing is finished, and carrying out suction filtration in a suction filter, and putting the filtered liquid into a screw extruder for melting, extruding and shaping to obtain a finished product of the semiconductor material.

Further, the polymer substrate is polyvinyl chloride.

Furthermore, the heat dissipation composite material comprises 20 parts of black phosphorus alkene-polyaniline compound, 8 parts of composite nano ceramic particles, 10 parts of second additive, 40 parts of high molecular polymer and 120 parts of mixed solvent, and compared with the first embodiment, the production cost of the heat dissipation composite material can be effectively reduced by increasing the proportion of the composite nano ceramic particles, the second additive and the high molecular polymer;

specifically, the processing method of the heat dissipation composite material comprises the steps of sequentially adding the black phosphorus alkene-polyaniline compound, the composite nano ceramic particles, the second additive and the high molecular polymer into a mixed solvent, uniformly mixing the mixture through ultrasonic dispersion, after uniform mixing, centrifugally separating the mixed material, and after interest separation, coating and drying the obtained solution to obtain the heat dissipation composite material.

Further, the black phosphorus alkene-polyaniline compound comprises 6 parts of black phosphorus alkene, 50 parts of water, 20 parts of oxidant, 10 parts of aniline, 3 parts of hydrochloric acid and 1 part of surfactant, and compared with the first embodiment, the heat dissipation performance and the surface oxidation resistance of the heat dissipation material in unit area can be effectively improved by increasing the proportion of the black phosphorus alkene, the activator and the oxidant; when the black phosphorus alkene-polyaniline compound is prepared, the black phosphorus alkene, water, an oxidant, aniline and hydrochloric acid are placed into a reactor, the mixture is stirred at a high speed and is uniformly dispersed, the oxidant is added into the mixture after the mixture is stirred uniformly, the mixture is continuously reacted for 12 hours at the temperature of minus 2 ℃, and after the reaction is finished, the reaction is dried, so that the black phosphorus alkene-polyaniline compound is prepared, wherein the materials are stirred at the high speed under the condition of introducing nitrogen, and the stirring temperature is controlled to be minus 2 ℃.

Further, the composite nano-ceramic particles comprise alumina nano-ceramic particles and aluminum nitride nano-ceramic particles; the weight of the alumina nano ceramic particles is 60 percent of the total weight of the composite nano ceramic particles; the weight of the aluminum nitride nano ceramic particles is 40 percent of the total weight of the composite nano ceramic particles; the particle size of aluminium oxide nanometer ceramic particle and compound nanometer ceramic particle is 10um, compares with embodiment one, through the improvement of particle size, can effectively reduce the device's the production degree of difficulty and manufacturing cost.

Further, the mixed solvent is xylene; the high molecular polymer is an ethylene-vinyl acetate copolymer; the second additive may be an emulsifier; the conductive material is conductive rubber; the conductive rubber is a mixture of silver-plated glass or aluminum particles and silicone rubber.

Further, the wear-resistant antistatic composite material comprises 170 parts of composite rubber raw material, 10 parts of graphene, 6 parts of silane coupling agent, 20 parts of high-wear-resistance carbon black, 6 parts of environment-friendly rubber oil, 3 parts of active agent, 3 parts of sulfur, 3 parts of accelerator, 2 parts of paraffin oil and 10 parts of reinforcing agent.

Further, the composite rubber raw materials comprise 10 parts of epoxidized natural rubber, 10 parts of solution polymerized styrene-butadiene rubber, 5 parts of butadiene rubber and 100 parts of ethylene propylene diene monomer; the active agent is a mixture of zinc oxide and zinc stearate; the reinforcing agent is a mixture of high wear-resistant furnace black, calcium carbonate and white carbon black; the reinforcing agent comprises 3 parts of high wear-resistant furnace black, calcium carbonate and white carbon black: 20: 10.

further, the cross-linking agent is dicumyl peroxide.

The preparation method of the wear-resistant antistatic composite material comprises the steps of putting a composite rubber raw material, graphene, silane coupling agent, high-wear-resistance carbon black, active agent, accelerator and reinforcing agent into an internal mixer, mixing at the temperature of below 100 ℃ for 6 minutes, discharging rubber at the temperature of below 165 ℃ and transferring to an open mill for cooling, cooling to room temperature, putting the prepared material into the internal mixer, adding sulfur paraffin oil, mixing for 2 minutes, discharging to the open mill at the temperature of below 100 ℃ and discharging to cool, so that the wear-resistant antistatic composite material is prepared, wherein the particle size of the wear-resistant antistatic composite material is ensured to be lower than 10 mu m when the wear-resistant antistatic composite material is prepared.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.