阅读说明：本技术 电容感应组件、电子设备 (Capacitance sensing assembly and electronic equipment ) 是由 郑昊 李文飞 张彩文 于 2021-08-17 设计创作，主要内容包括：本申请提供了电容感应组件、电子设备。其中电容感应组件包括基板、电容感应件、以及屏蔽件,电容感应件与屏蔽件装设于基板,屏蔽件在基板上的正投影围设形成屏蔽区,电容感应件在基板上的正投影至少部分设于屏蔽区内。通过在基板上增设屏蔽件,且正投影围设形成屏蔽区,从而使电容感应件在正常工作的基础上,利用屏蔽区来遮挡电容感应件,减小电容感应件与外界结构件的正对面积,进而减小电容。并且随着外界结构件与电容感应件之间距离的减小,其屏蔽区的占比不断增加,其电容减小的幅度增加。因此在同等距离下,本申请相较于现有技术的电容更小,降低了误触发检测的概率。(The application provides a capacitance sensing assembly and an electronic device. The capacitance sensing assembly comprises a substrate, a capacitance sensing piece and a shielding piece, the capacitance sensing piece and the shielding piece are arranged on the substrate, the orthographic projection of the shielding piece on the substrate is surrounded to form a shielding area, and at least part of the orthographic projection of the capacitance sensing piece on the substrate is arranged in the shielding area. Through add the shielding part on the base plate, and orthographic projection encloses and establishes and form the shielded area to make the electric capacity response piece on the basis of normal work, utilize the shielded area to shelter from the electric capacity response piece, reduce the just right area of electric capacity response piece and external structure, and then reduce electric capacity. And along with the reduction of distance between external structure spare and the electric capacity response piece, the proportion of its shielded area is continuous to increase, and the range that its electric capacity reduces increases. Therefore, compared with the prior art, the capacitor is smaller at the same distance, and the probability of false trigger detection is reduced.)

1. The utility model provides a capacitance sensing subassembly, its characterized in that includes base plate, capacitance sensing spare and shield, capacitance sensing spare with the shield install in the base plate, the shield is in orthographic projection on the base plate encloses and establishes and form the shielding region, capacitance sensing spare is in orthographic projection on the base plate is at least partly located in the shielding region.

2. The capacitive sensing assembly of claim 1, wherein the shielded region comprises a projected region and a non-projected region, an orthographic projection of the shield on the substrate is located within the projected region, and when the orthographic projection of the capacitive sensing element on the substrate is located within the shielded region, the orthographic projection of the capacitive sensing element on the substrate is at least partially located within the non-projected region.

3. The capacitive sensing assembly of claim 2 wherein said shield is provided with a plurality of through holes, said through holes being located within said non-projected area.

4. The capacitive sensing assembly of claim 2, wherein the shield is an annular shield, the annular shield being enclosed to form a receiving space, the receiving space being located within the non-projected area.

5. The capacitive sensing assembly of claim 1, wherein the capacitive sensing element and the shield are disposed on opposite sides of the substrate, or wherein the capacitive sensing element and the shield are disposed on a same side of the substrate.

6. The capacitance sensing assembly of claim 5, wherein the shield and the capacitance sensing element are stacked when the capacitance sensing element and the shield are disposed on a same side of the substrate, and the shield is closer to the substrate than the capacitance sensing element.

7. The capacitive sensing assembly of claim 5, wherein when the capacitive sensing element and the shielding element are disposed on a same side of the substrate, the shielding element is disposed on a same layer as the capacitive sensing element, and the shielding element is disposed corresponding to at least a portion of a periphery of the capacitive sensing element.

8. The capacitive sensing assembly of claim 7, wherein the shield is an annular shield, the annular shield enclosing a receiving space, and the capacitive sensing element is disposed in the receiving space.

9. The capacitive sensing assembly of claim 1 further comprising a capacitive sensor, a microcontroller, and a processor, the capacitive sensor and the microcontroller electrically connecting the capacitive sensing element and the processor.

10. An electronic device comprising a housing and the capacitive sensing assembly of any one of claims 1-9, the housing having a mounting space, the capacitive sensing assembly being disposed within the mounting space.

Technical Field

The application belongs to the technical field of capacitance induction, and particularly relates to a capacitance induction assembly and electronic equipment.

Background

In electronic devices, a capacitance sensor is generally used to form a capacitance with another structural member or object, and a corresponding sensor is used to detect a capacitance value. The capacitance values are then processed by various processors to achieve different functions. However, since the electronic device is usually used in cooperation with other structural members at present, false trigger detection is easily caused, and the use performance of the electronic device is reduced.

Disclosure of Invention

In view of this, the first aspect of the present application provides a capacitance sensing assembly, which includes a substrate, a capacitance sensing element, and a shielding element, where the capacitance sensing element and the shielding element are mounted on the substrate, an orthographic projection of the shielding element on the substrate is defined to form a shielding region, and an orthographic projection of the capacitance sensing element on the substrate is at least partially disposed in the shielding region.

The electric capacity response subassembly that this application first aspect provided, through add the shield on the base plate, this shield encloses to establish on the base plate orthographic projection and forms the shielding district, and this application can make electric capacity response spare be in orthographic projection at least part on the base plate is located in the shielding district to make electric capacity response spare on the basis of normal work, utilize the shielding district to shelter from electric capacity response spare, reduce electric capacity response spare and external structure just to the area, and then reduce electric capacity. And along with the reduction of distance between external structure spare and the electric capacity response piece, the proportion of its shielded area is continuous to increase, and its electric capacity reduces the range bigger. Therefore, compared with the prior art, the capacitor is smaller at the same distance, and the probability of false trigger detection is reduced.

A second aspect of the present application provides an electronic device, comprising a housing and a capacitive sensing assembly as provided in the first aspect of the present application, wherein the housing has an installation space, and the capacitive sensing assembly is disposed in the installation space.

The electronic equipment that this application second aspect provided, through adopting the electric capacity response subassembly that this application first aspect provided, under equal distance, this application is less than the electric capacity in prior art, has reduced the probability that the spurious triggering detected, has improved electronic equipment's performance.

Drawings

In order to more clearly explain the technical solution in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be described below.

Fig. 1 is a top view of a capacitive sensing assembly according to an embodiment of the present disclosure.

Fig. 2 is a schematic sectional view taken along a-a in fig. 1.

Fig. 3 is a graph illustrating capacitance variation with distance in a capacitance sensing assembly according to the related art and the present application.

FIG. 4 is a schematic cross-sectional view taken along the line A-A of FIG. 1 according to another embodiment of the present application.

FIG. 5 is a schematic cross-sectional view taken along the line A-A of FIG. 1 according to yet another embodiment of the present application.

FIG. 6 is a schematic cross-sectional view taken along the line A-A of FIG. 1 according to yet another embodiment of the present application.

Fig. 7 is a top view of a capacitive sensing assembly according to another embodiment of the present application.

Fig. 8 is a schematic cross-sectional view taken along the direction B-B in fig. 7.

Fig. 9 is an electrical schematic diagram of a capacitive sensing element according to an embodiment of the present disclosure.

Fig. 10 is a schematic cross-sectional view of an electronic device according to an embodiment of the present application.

Description of reference numerals:

the capacitive touch screen comprises a capacitive sensing assembly-1, an electronic device-2, a substrate-10, a capacitive sensing element-20, a shielding element-30, a shielding area-31, a projection area-32, a non-projection area-33, a through hole-34, a containing space-35, a capacitive sensor-40, a microcontroller-50, a processor-60, a rear shell-70, a bottom wall-71, an extension part-72 and a display screen-80.

Detailed Description

The following is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.

Before the technical solutions of the present application are introduced, the technical problems in the related art will be described in detail.

In electronic devices, capacitance sensing schemes are commonly used to sense capacitance. Specifically, a capacitance sensor is disposed in the electronic device, and the capacitance sensor can serve as a plate of the capacitor. Other structural members (e.g., stationary brackets, protective cases, etc.) or objects (e.g., the user's body) serve as the other plate of the capacitor. Therefore, capacitance can be formed between the capacitance sensing element and other structural elements or objects, and the capacitance value can be detected by using corresponding sensors. The capacitance values are then processed by various processors to achieve different functions. For example, when the capacitance value exceeds a preset value, the processor may reduce the maximum transmission power of the electronic device, so as to reduce the radiation amount of the electronic device, thereby protecting the body of the user.

However, electronic devices are often used with other structural members, such as a fixing bracket for fixing the electronic device, or a protective shell for covering the electronic device. At this moment, the sensor can identify the fixed support or the protective shell as the body of the user, although the body of the user is not close to the electronic equipment, the emission power does not need to be reduced, but the capacitance value of the capacitor formed between the capacitance sensing piece and the fixed support and the protective shell is larger than the preset value, the emission power can be reduced by the processor, the false triggering detection is caused, and the use performance of the electronic equipment is reduced.

In view of the above, in order to solve the above problems, the present application provides a capacitive sensing assembly. Please refer to fig. 1-3 together. Fig. 1 is a top view of a capacitive sensing assembly according to an embodiment of the present disclosure. Fig. 2 is a schematic sectional view taken along a-a in fig. 1. Fig. 3 is a graph illustrating capacitance variation with distance in a capacitance sensing assembly according to the related art and the present application. The embodiment provides a capacitance sensing assembly 1, which specifically comprises a substrate 10, a capacitance sensing element 20 and a shielding element 30, wherein the capacitance sensing element 20 and the shielding element 30 are mounted on the substrate 10, an orthographic projection of the shielding element 30 on the substrate 10 is defined to form a shielding area 31, and at least part of the orthographic projection of the capacitance sensing element 20 on the substrate 10 is arranged in the shielding area 31.

The capacitance sensing component 1 provided in the present embodiment can be applied to various electronic devices 2. The electronic device 2 provided in the present embodiment includes, but is not limited to, a mobile terminal such as a mobile phone, a tablet Computer, a notebook Computer, a palmtop Computer, a Personal Computer (PC), a Personal Digital Assistant (PDA), a Portable Media Player (PMP), a navigation device, a wearable device, a smart band, and a pedometer, and a fixed terminal such as a Digital TV and a desktop Computer. The present embodiment is only illustrated with the electronic device 2 as a mobile phone.

The capacitive sensing assembly 1 of the present embodiment includes a substrate 10, and the substrate 10 is a structural member existing in the electronic device 2. Substrate 10 includes, but is not limited to, a bracket, although substrate 10 may be other structural members within electronic device 2. Alternatively, the material of the substrate 10 includes, but is not limited to, plastic. The substrate 10 may serve to mount and support other components.

The capacitance sensing assembly 1 provided by this embodiment further includes a capacitance sensing element 20, and the capacitance sensing element 20 is used as one plate of a capacitor. In addition, the capacitive sensing element 20 itself may also be an antenna, such as an LDS antenna. Under normal state, the antenna can be used for receiving and transmitting electromagnetic wave signals, and when an object approaches, a capacitor can be formed.

Alternatively, the capacitive sensing element 20 may be an existing structural element within the electronic device 2, for example, the capacitive sensing element 20 may be a part of a bezel. Alternatively, the capacitance sensor 20 may be a component added to the bracket, for example, the capacitance sensor 20 may be formed on the surface of the bracket by spraying or the like. Optionally, the material of the capacitance sensor 20 includes, but is not limited to, metal. Further alternatively, the material of the capacitance sensor 20 includes silver, copper, aluminum, and the like.

As can be understood from the above, in the related art, a sensor may be used to detect a capacitance value of a capacitance formed between the capacitance sensing member 20 and an external object. The sensors include, but are not limited to, electromagnetic Absorption Rate (SAR) sensors. The sensor may send the resulting capacitance value to the processor 60, and the processor 60 operates accordingly based on the capacitance value. The electronic device 2 may be controlled, for example, in dependence on the magnitude of the capacitance value. Specifically, according to the regulatory requirements, the sensor needs to detect that the body of the user is triggered when the body is close to the collection area by 5mm, detect the capacitance, and judge the contact state of the user and the mobile phone. If the capacitance is too large, the processor 60 will reduce the maximum transmit power to keep the radiation level of the handset within a safe range, thereby protecting the user if the user's head/body is detected to be close to the handset (e.g., placing a call against the ear, or directly on the leg to chase the phone).

But can establish a cell-phone shell for the cell phone case usually in daily life, perhaps utilize the cell-phone fixed bolster to fix the cell-phone, the sensor can be wrong regard cell-phone shell or cell-phone fixed bolster into user's health this moment, causes the false trigger to detect. Because the distance between the mobile phone and the mobile phone fixing support is very short, less than 5mm, the sensor can detect the capacitance value of the capacitor formed by the capacitor sensor 20 and the mobile phone shell or the mobile phone fixing support, and if the capacitance value exceeds a preset value, the processor 60 can reduce the transmission power of the electronic device 2. However, at this time, the body of the user is not close to the electronic device, and the use performance of the electronic device 2 is reduced due to the reduction of the transmission power without reducing the transmission power, which reduces the user experience.

The capacitance sensing assembly 1 provided by the embodiment is characterized in that the shielding member 30 is additionally arranged on the substrate 10, the orthographic projection of the shielding member 30 on the substrate 10 is surrounded to form the shielding region 31, the capacitance sensing member 20 can be arranged in the shielding region 31 by at least partially arranging the orthographic projection on the substrate 10, so that the capacitance sensing member 20 is shielded by the shielding region 31 on the basis of normal work, the area of the capacitance sensing member 20 opposite to the external structural member is reduced, and the capacitance is further reduced. As can be seen from fig. 3, the capacitance of the capacitive sensing assembly 1 provided by the present application is smaller than that of the prior art within a range of less than 5mm at the same distance. Therefore, the probability of false trigger detection caused by the fact that the capacitance value formed by wearing the mobile phone shell or the mobile phone fixing support is larger than the preset value can be reduced.

In addition, as the distance between the external structural component and the capacitance sensing component 20 decreases, the occupation ratio of the shielding region 31 increases, and the capacitance decreases to a greater extent. As can be seen from fig. 3, the abscissa represents the distance between the capacitive sensing element 20 and the external object, and the ordinate represents the capacitance value of the capacitance formed between the capacitive sensing element and the external object. The triangular mark line represents the curve of the capacitance value of the capacitance formed by the capacitance sensing element 20 and the external object according to the distance change in the prior art. The circular marked lines represent the variation curve of the capacitance value of the capacitance formed by the capacitance sensing member 20 and the external object according to the variation of the distance. Between 1-2mm, the magnitude of the decrease in capacitance increases with decreasing distance.

In summary, the capacitance sensing component 1 provided in this embodiment reduces the probability of capacitance and false trigger detection, improves the usability of the electronic device 2, and improves user experience.

Optionally, the material of the shield 30 includes, but is not limited to, metal. In addition, the present embodiment is only illustrated in a case where the entire orthographic projection of the capacitive sensor 20 on the substrate 10 is provided in the shielding region 31. Of course, in other embodiments, the orthographic projection of the capacitive sensing element 20 on the substrate 10 may also be partially disposed in the shielding region 31. The capacitive sensing element 20 and the shielding element 30 are misaligned.

Referring to fig. 4, fig. 4 is a schematic cross-sectional view taken along a direction a-a of fig. 1 according to another embodiment of the present disclosure. In this embodiment, the shielding region 31 includes a projection region 32 and a non-projection region 33, an orthographic projection of the shielding element 30 on the substrate 10 is located in the projection region 32, and when the orthographic projection of the capacitive sensing element 20 on the substrate 10 is located in the shielding region 31, the orthographic projection of the capacitive sensing element 20 on the substrate 10 is at least partially located in the non-projection region 33.

When the shield 30 is a complete component, its orthographic projection on the substrate 10 forms the shield region 31. However, if the shielding element 30 is not an integral component, such as a through hole 34 formed in the shielding element 30, the orthographic projection of the shielding element 30 on the substrate 10 can form the projected area 32 and the non-projected area 33. The shielding element 30 itself corresponds to the projection area 32, and the through hole 34 corresponds to the non-projection area 33, and the projection area 32 and the non-projection area 33 together form the shielding area 31.

As mentioned above, the capacitance sensor 20 needs to form a capacitance with an external structural component, and when the orthographic projection of the capacitance sensor 20 on the substrate 10 is disposed in the shielding region 31, the remaining capacitance sensor 20 is not disposed in the shielding region 31, and at this time, the capacitance sensor 20 can work normally. When the orthographic projection of the capacitive sensing element 20 on the substrate 10 is disposed in the shielding region 31, the embodiment may at least partially dispose the orthographic projection of the capacitive sensing element 20 on the substrate 10 in the non-projection region 33, that is, at least one portion of the capacitive sensing element 20 corresponds to the non-projection region 33, so as to ensure that a capacitor may be formed between the capacitive sensing element 20 and an external structural member. In particular, the present application provides two configurations of specifically the shield 30.

Referring to fig. 4 again, in the present embodiment, the shielding member 30 is provided with a plurality of through holes 34, and the through holes 34 are located in the non-projection area 33.

In one embodiment, a plurality of vias 34, such as a plurality of vias 34 arranged in an array, may be formed in the shield 30. The orthographic projection of the through holes 34 on the substrate 10 forms the non-projected area 33 and the shield 30 forms the projected area 32.

Referring to fig. 5, fig. 5 is a schematic cross-sectional view taken along a direction a-a of fig. 1 according to another embodiment of the present disclosure. In this embodiment, the shielding element 30 is an annular shielding element 30, the annular shielding element 30 encloses a receiving space 35, and the receiving space 35 is located in the non-projection area 33.

In another embodiment, the shield 30 may be a ring shield 30. Since the annular shield 30 is annular in shape, the annular shield 30 can be enclosed to form the housing space 35, i.e., the annular shield 30 is hollow in the middle. In this case, the hollow accommodating space 35 corresponds to the non-projection area 33. Therefore, the present embodiment can dispose the shield 30 corresponding to the housing space 35. At this time, the shielding member 30 is found to surround the outer periphery of the capacitive sensing element 20 from a top view. Therefore, the normal work of the capacitive shielding part 30 can not be influenced, the shielding effect can be achieved, the capacitance value is reduced, and the probability of false triggering detection is reduced.

Optionally, the orthographic projection of the capacitive sensing element 20 on the substrate 10 is disposed in the non-projection area 33, that is, the area of the non-projection area 33 is larger than the orthographic projection area of the capacitive sensing element 20, so as to facilitate positioning and assembling. Further optionally, in the projection view, the distance between the capacitive sensing element 20 and the shielding element 30 in the horizontal direction is greater than 1 mm.

The above details describe various shapes and structures of the shielding member 30, and the positional relationship of the capacitive sensing element 20, the substrate 10, and the shielding member 30 will be described in detail.

Referring to fig. 2 and fig. 6 together, fig. 6 is a schematic cross-sectional view taken along a direction a-a of fig. 1 according to still another embodiment of the present disclosure. In this embodiment, the capacitive sensing element 20 and the shielding element 30 are disposed on two opposite sides of the substrate 10, or the capacitive sensing element 20 and the shielding element 30 are disposed on the same side of the substrate 10. As shown in fig. 2, when the capacitive sensing element 20 and the shielding element 30 are disposed on two opposite sides of the substrate 10, the mounting and dismounting are facilitated. As shown in fig. 6, when the capacitive sensing element 20 and the shielding element 30 are disposed on the same side of the substrate 10, the positioning of the capacitive sensing element 20 and the shielding element 30 is facilitated. The present embodiment is only illustrated in the case that the capacitive sensing element 20 and the shielding element 30 are disposed on opposite sides of the substrate 10.

Referring to fig. 6 again, in the present embodiment, when the capacitive sensing element 20 and the shielding element 30 are disposed on the same side of the substrate 10, the shielding element 30 and the capacitive sensing element 20 are stacked, and the shielding element 30 is closer to the substrate 10 than the capacitive sensing element 20.

When the capacitive sensing element 20 and the shielding element 30 are disposed on the same side of the substrate 10, two specific configurations are provided. In one embodiment, since the size of the shielding element 30 is generally larger than that of the capacitive sensing element 20, the stacking of the shielding elements 30 closer to the substrate 10 further facilitates the positioning of the capacitive sensing element 20 and the shielding element 30, and also allows the capacitive sensing element 20 to operate normally.

Referring to fig. 7-8 together, fig. 7 is a top view of a capacitive sensing element according to another embodiment of the present disclosure. Fig. 8 is a schematic cross-sectional view taken along the direction B-B in fig. 7. In another embodiment, when the capacitive sensing element 20 and the shielding element 30 are disposed on the same side of the substrate 10, the shielding element 30 and the capacitive sensing element 20 are disposed on the same layer, and the shielding element 30 is disposed corresponding to at least a portion of the periphery of the capacitive sensing element 20. In this case, the thickness of the entire capacitive sensing element 1 can be reduced.

Optionally, the shielding element 30 is an annular shielding element 30, the annular shielding element 30 is enclosed to form an accommodating space 35, and the capacitance sensing element 20 is disposed in the accommodating space 35. In this case, the shielding member 30 may be a ring-shaped shielding member 30, and the capacitance sensor 20 is disposed in the receiving space 35 of the ring-shaped shielding member 30. Therefore, the positioning difficulty can be reduced, the normal work of the capacitance shielding piece 30 is not influenced, the shielding effect can be achieved, the capacitance value is reduced, and the probability of false triggering detection is reduced.

Referring to fig. 9, fig. 9 is an electrical schematic diagram of a capacitive sensing element according to an embodiment of the present disclosure. In this embodiment, the capacitance sensing assembly 1 further includes a capacitance sensor 40, a microcontroller 50, and a processor 60, wherein the capacitance sensor 40 and the microcontroller 50 are electrically connected to the capacitance sensing element 20 and the processor 60.

In this embodiment, the capacitance sensor 20 can also utilize the micro controller 50(MCU) to identify and process the capacitance value, and finally send the capacitance value to the processor 60(AP) for processing. In addition, the capacitive sensing element 20 may be a floating metal and may not be connected to ground through an inductor. The microcontroller 50 includes a capacitance identification module and a digital processing module. Because of the influence of noise, the capacitance identification module requires that the parasitic capacitance of the capacitive sensing element 20 and the floor generally should not exceed 200 PF. The digital processing module may report an interrupt to the processor 60 side, and the processor 60 may then issue a power down command.

Referring to fig. 10, fig. 10 is a schematic cross-sectional view of an electronic device according to an embodiment of the disclosure. The embodiment provides an electronic device 2, which includes a housing and a capacitive sensing component 1 as provided in the above embodiments of the present application, the housing has an installation space, and the capacitive sensing component 1 is disposed in the installation space.

The electronic equipment 2 that this embodiment provided, through the capacitance sensing subassembly 1 that adopts this embodiment to provide, under the same distance, this application is less than prior art's electric capacity, has reduced the probability that the false trigger detected, has improved electronic equipment 2's performance. Alternatively, the housing may be a rear housing 70, the rear housing 70 includes a bottom wall 71 and an extending portion 72 connected to a periphery of the bottom wall 71 in a bending manner, and the capacitance sensing element 20 is closer to the extending portion 72 than the substrate 10. In addition, the electronic device 2 may further include a display screen 80, and the display screen 80 may be mounted on the housing.

The foregoing detailed description has provided for the embodiments of the present application, and the principles and embodiments of the present application have been presented herein for purposes of illustration and description only and to facilitate understanding of the methods and their core concepts; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.