阅读说明：本技术 高温超导带材连接环形电极装置 (High-temperature superconducting strip connection annular electrode device ) 是由 陈腾彪 于 2021-08-27 设计创作，主要内容包括：本发明涉及一种高温超导带材连接环形电极装置,包括：电极内环,电极内环的外表面设置有第一导流槽,电极内环的一端沿周向设置有第一凸起,第一凸起上设置有第一焊锡注入孔,第一焊锡注入孔与第一导流槽连通；电极外环,电极外环套设在电极内环上。本申请提供的上述方案,将电极内环套设在超导电缆内芯上,然后将电极外环套设到高温超导带材上,此时将电极外环在套设到电极外环上,随后采用焊接机对电极内环和电极外环进行加热到预定温度后,往第一焊锡注入孔和第二焊锡注入孔内充分注入焊锡,移去焊接机使焊锡冷却固化,此时,高温超导带材与电极内环、电极外环形成一体结构,从而可以使得电极整体能够与高温超导带材有效的焊接在一起。(The invention relates to a high-temperature superconducting tape connection ring electrode device, which comprises: the electrode comprises an electrode inner ring, wherein a first guide groove is formed in the outer surface of the electrode inner ring, a first bulge is formed in one end of the electrode inner ring along the circumferential direction, a first soldering tin injection hole is formed in the first bulge, and the first soldering tin injection hole is communicated with the first guide groove; and the electrode outer ring is sleeved on the electrode inner ring. The above-mentioned scheme that this application provided, establish the electrode inner ring cover on the superconducting cable inner core, then establish the high temperature superconducting strip with the electrode outer loop cover on, establish the electrode outer loop with the electrode outer loop on the cover this moment, adopt the welding machine to heat electrode inner ring and electrode outer loop after the predetermined temperature afterwards, toward the downthehole fully injection soldering tin of first soldering tin filling hole and second soldering tin filling hole, it makes soldering tin cooling solidification to remove the welding machine, at this moment, high temperature superconducting strip and electrode inner ring, the electrode outer loop forms an organic whole structure, thereby can make the electrode whole can be in the same place with the effectual welding of high temperature superconducting strip.)

1. A high temperature superconducting tape joint ring electrode assembly, comprising:

the electrode structure comprises an inner electrode ring (10), wherein two ends of the inner electrode ring (10) in the axial direction are of an open structure, a first guide groove is formed in the outer surface of the inner electrode ring (10), a first protrusion (101) is formed in one end of the inner electrode ring (10) in the circumferential direction, a first soldering tin injection hole (1011) is formed in the first protrusion (101), and the first soldering tin injection hole (1011) is communicated with the first guide groove;

the electrode outer ring (20), the axial both ends are opening structure along electrode outer ring (20), electrode outer ring (20) cover is established on electrode inner ring (10), radially be provided with second soldering tin filling hole (201) on electrode outer ring (20), the internal surface of electrode outer ring (20) is provided with the second guiding gutter, second soldering tin filling hole (201) with the second guiding gutter intercommunication.

2. The HTS tape connection ring electrode assembly as claimed in claim 1, wherein said first guiding groove comprises a first solder injection runner (102) and a first ring runner (103), said first solder injection runner (102) is disposed on an outer surface of said electrode inner ring (10) in a direction parallel to an axial direction, said first ring runner (103) is disposed on an outer surface of said electrode inner ring (10) in a circumferential direction, said first solder injection hole (1011) is in communication with said first solder injection runner (102), and said first solder injection runner (102) is in communication with said first ring runner (103).

3. The HTS tape joint ring electrode assembly as claimed in claim 2, wherein said first protrusion (101) has a circumferential limiting groove (104) at an end facing said electrode outer ring (20), and said limiting groove (104) is in communication with said first solder injection runner (102).

4. The HTS tape joint ring electrode assembly as claimed in claim 1, further comprising an inner ring retainer (30), wherein said inner ring retainer (30) is disposed at an end of said electrode inner ring (10) facing said electrode outer ring (20).

5. The HTS tape connection ring electrode assembly as claimed in claim 4, wherein said inner ring retainer (30) comprises a circular ring (301) and a second protrusion (302), said second protrusion (302) is circumferentially disposed on an outer surface of said circular ring (301), a first mounting groove (105) is disposed on an end of said inner electrode ring (10) facing said outer electrode ring (20), said circular ring (301) is fitted into said first mounting groove (105), and an outer diameter of a circular ring formed by said second protrusion (302) is larger than an outer diameter of said inner electrode ring (10).

6. The HTS tape joint ring electrode assembly as claimed in claim 1, wherein said second guiding groove comprises a second solder injection runner (202) and a second ring runner (203), said second solder injection runner (202) is disposed on an inner surface of said electrode outer ring (20) in a direction parallel to an axial direction, said second ring runner (203) is disposed on an inner surface of said electrode outer ring (20) in a circumferential direction, said second solder injection hole (201) is in communication with said second solder injection runner (202), and said second solder injection runner (202) is in communication with said second ring runner (203).

7. The HTS tape connection ring electrode assembly as claimed in claim 1, wherein said electrode outer ring (20) has a connection ring (204) circumferentially disposed at an end thereof facing said electrode inner ring (10), and said first protrusion (101) has a second mounting groove (1012) circumferentially disposed at an end thereof facing said electrode outer ring (20), said connection ring (204) being disposed in said second mounting groove (1012) when said electrode outer ring (20) is mounted on said electrode inner ring (10).

8. A high temperature superconducting tape joint ring electrode assembly as claimed in claim 1, further comprising a first dust cap detachably mounted on the first solder injection hole (1011).

9. The HTS ring electrode assembly as claimed in claim 1, further comprising a second dust cap detachably mounted on said second solder injection hole (201).

10. The HTS ring electrode assembly as claimed in claim 1, wherein said first solder injection hole (1011) and said second solder injection hole (201) are funnel-shaped.

Technical Field

The invention relates to the technical field of equipment for superconducting cables, in particular to a high-temperature superconducting strip connection annular electrode device.

Background

The superconducting cable line produced by adopting the high-temperature superconducting tape needs electrodes connected with the high-temperature superconducting tape of the superconducting cable at two ends of the superconducting cable, and the high-temperature superconducting tape cannot be connected with an electric level by adopting a compression joint process because the high-temperature superconducting tape is not resistant to pressure.

At present, the superconducting tapes and the electrodes can be connected together by utilizing a welding process, and the existing electrode structure cannot ensure the effective welding of the superconducting tapes and the electrodes because the tapes of the superconducting cable are of a double-layer structure.

Disclosure of Invention

In view of the above, there is a need for a high temperature superconducting tape joint ring electrode device, which can solve the problem that the existing electrode structure can not ensure the effective welding between the superconducting tape and the electrode.

The invention provides a high-temperature superconducting tape connection annular electrode device, which comprises:

the electrode comprises an electrode inner ring, a first welding tin injection hole and a second welding tin injection hole, wherein two ends of the electrode inner ring along the axial direction are of an opening structure, a first guide groove is formed in the outer surface of the electrode inner ring, a first bulge is formed in one end of the electrode inner ring along the circumferential direction, and the first welding tin injection hole is communicated with the first guide groove;

the electrode outer ring is provided with opening structures at two ends along the axial direction, the electrode outer ring is sleeved on the electrode inner ring, a second soldering tin injection hole is arranged on the electrode outer ring along the radial direction, a second flow guide groove is arranged on the inner surface of the electrode outer ring, and the second soldering tin injection hole is communicated with the second flow guide groove.

Above-mentioned ring electrode device is connected to high temperature superconducting tape, establish the electrode inner ring cover on the superconducting cable inner core, then establish the high temperature superconducting tape with the electrode outer loop cover, establish the electrode outer loop with the electrode outer loop on the cover this moment, adopt the welding machine to heat electrode inner ring and electrode outer loop after the predetermined temperature afterwards, fully pour into soldering tin into in first soldering tin filling hole and the second soldering tin filling hole, remove the welding machine and make soldering tin cooling solidification, can accomplish welded connection, at this moment, high temperature superconducting tape and electrode inner ring, electrode outer loop form an organic whole structure, thereby can make the whole welding that can be in the same place with the effectual welding of high temperature superconducting tape of electrode.

In one embodiment, the first guide groove includes a first solder injection runner and a first annular runner, the first solder injection runner is disposed on an outer surface of the electrode inner ring in a direction parallel to an axial direction, the first annular runner is disposed on an outer surface of the electrode inner ring in a circumferential direction, the first solder injection hole is communicated with the first solder injection runner, and the first solder injection runner is communicated with the first annular runner.

In one embodiment, a limiting groove is circumferentially formed at one end of the first protrusion facing the electrode outer ring, and the limiting groove is communicated with the first solder injection runner.

In one embodiment, the electrode assembly further comprises an inner ring retainer ring, and the inner ring retainer ring is arranged at one end, facing the electrode outer ring, of the electrode inner ring.

In one embodiment, the inner ring retainer ring comprises a circular ring and a second protrusion, the second protrusion is arranged on the outer surface of the circular ring along the circumferential direction, a first mounting groove is formed in one end, facing the electrode outer ring, of the electrode inner ring, the circular ring is matched with the first mounting groove, and the outer diameter of the circular ring formed by the second protrusion is larger than that of the electrode inner ring.

In one embodiment, the second guiding groove includes a second solder injection runner and a second annular runner, the second solder injection runner is disposed on the inner surface of the electrode outer ring along a direction parallel to the axial direction, the second annular runner is disposed on the inner surface of the electrode outer ring along the circumferential direction, the second solder injection hole is communicated with the second solder injection runner, and the second solder injection runner is communicated with the second annular runner.

In one embodiment, a connection ring is circumferentially arranged at one end of the electrode outer ring facing the electrode inner ring, a second installation groove is circumferentially arranged at one end of the first protrusion facing the electrode outer ring, and the connection ring is located in the second installation groove when the electrode outer ring is sleeved on the electrode inner ring.

In one embodiment, the soldering tin injection hole further comprises a first dustproof cover, and the first dustproof cover is detachably mounted on the first soldering tin injection hole.

In one embodiment, the soldering tin injection hole further comprises a second dust cover, and the second dust cover is detachably mounted on the second soldering tin injection hole.

In one embodiment, the first and second solder injection holes are funnel shaped.

Drawings

FIG. 1 is a schematic structural view of a high temperature superconducting tape joint ring electrode assembly according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of FIG. 1;

FIG. 3 is an exploded view of FIG. 1;

FIG. 4 is a schematic cross-sectional view of FIG. 3;

FIG. 5 is a further cross-sectional view of FIG. 3;

FIG. 6 is a partial schematic view of FIG. 1;

FIG. 7 is a schematic view of the inner race retainer of FIG. 6 after installation;

fig. 8 is a schematic view of a high temperature superconducting cable according to an embodiment of the present invention;

FIG. 9 is a schematic view of the electrode outer ring mounted on FIG. 8;

FIG. 10 is a schematic view of the electrode inner ring mounted on FIG. 8;

FIG. 11 is a schematic view showing the high temperature superconducting tape inserted into the inner ring of the electrode;

FIG. 12 is a schematic cross-sectional view of FIG. 11;

FIG. 13 is a schematic view of the outer electrode ring of FIG. 11 mounted to a corresponding inner electrode ring;

fig. 14 is a schematic view of the electrode in fig. 13 after an adhesive tape is disposed on the outer ring.

The figures are labeled as follows:

10. an inner ring of the electrode; 101. a first protrusion; 1011. a first solder injection hole; 1012. a second mounting groove; 102. a first solder injection runner; 103. a first annular flow passage; 104. a limiting groove; 105. a first mounting groove; 20. an electrode outer ring; 201. a second solder injection hole; 202. a second solder injection runner; 203. a second annular flow passage; 204. a connecting ring; 30. an inner ring retainer ring; 301. a circular ring; 302. a second protrusion; 401. an inner core of a superconducting cable; 402. a high temperature superconducting tape; 50. a fluoroplastic adhesive tape.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The superconducting cable line produced by adopting the high-temperature superconducting tape needs electrodes connected with the high-temperature superconducting tape of the superconducting cable at two ends of the superconducting cable, and the high-temperature superconducting tape cannot be connected with an electric level by adopting a compression joint process because the high-temperature superconducting tape is not resistant to pressure.

At present, the superconducting tapes and the electrodes can be connected together by utilizing a welding process, and the existing electrode structure cannot ensure the effective welding of the superconducting tapes and the electrodes because the tapes of the superconducting cable are of a double-layer structure.

In order to solve the above problem, as shown in fig. 1 in combination with fig. 2, in an embodiment of the present invention, there is provided a high temperature superconducting tape joint ring electrode assembly, including: the electrode inner ring 10, wherein, the both ends of electrode inner ring 10 along the axial are open structure, the surface of electrode inner ring 10 is provided with first guiding gutter, the one end of electrode inner ring 10 is provided with first arch 101 along circumference, be provided with first soldering tin filling hole 1011 on the first arch 101, first soldering tin filling hole 1011 and first guiding gutter intercommunication, electrode outer ring 20 is open structure along the axial both ends, electrode outer ring 20 cover is established on electrode inner ring 10, radially be provided with second soldering tin filling hole 201 on the electrode outer ring 20, the internal surface of electrode outer ring 20 is provided with the second guiding gutter, second soldering tin filling hole 201 and second guiding gutter intercommunication.

When the electrode is used, the inner ring of the electrode is sleeved on the inner core of the superconducting cable, then the outer ring of the electrode is sleeved on the high-temperature superconducting strip, the outer ring of the electrode is sleeved on the outer ring of the electrode, then the inner ring of the electrode and the outer ring of the electrode are heated to a preset temperature by adopting a welding machine, soldering tin is fully injected into the first soldering tin injection hole and the second soldering tin injection hole, the welding machine is removed to enable the soldering tin to be cooled and solidified, welding connection can be completed, at the moment, the high-temperature superconducting strip, the inner ring of the electrode and the outer ring of the electrode form an integrated structure, and therefore the whole electrode can be effectively welded together with the high-temperature superconducting strip.

In some embodiments, as shown in fig. 3 in combination with fig. 4, the first guide groove in the present application includes a first solder injection runner 102 and a first annular runner 103, wherein the first solder injection runner 102 is disposed on an outer surface of the electrode inner ring 10 in a direction parallel to the axial direction, the plurality of first annular runners 103 is disposed on the outer surface of the electrode inner ring 10 in a circumferential direction, the first solder injection hole 1011 is in communication with the first solder injection runner 102, and the first solder injection runner 102 is in communication with the first annular runner 103.

Specifically, in the present embodiment, a plurality of first annular runners 103 are circumferentially disposed on an outer surface of the electrode inner ring 10, the plurality of first annular runners 103 are all the same in size, and the intervals between adjacent first annular runners 103 are also the same, the first solder injection runner 102 is communicated with each first annular runner 103, and when in use, solder is injected through the first solder injection hole 1011, and the solder flows into each first annular runner 103 through the first solder injection runner 102.

In some embodiments, in order to make the connection of the high temperature superconducting tape to the electrode inner ring more secure, as shown in fig. 4, the first protrusion 101 of the present application is provided with a limiting groove 104 along the circumferential direction toward one end of the electrode outer ring 20, and the limiting groove 104 is communicated with the first solder injection runner 102. In use, as shown in fig. 12, the high-temperature superconducting tape 402 is inserted into the stopper groove 104 at the end facing the electrode inner ring 10, and then solder is poured.

In some embodiments, as shown in fig. 6 in combination with fig. 7, the high temperature superconducting tape joint ring electrode assembly of the present application further includes an inner ring retainer 30, and the inner ring retainer 30 is disposed at an end of the electrode inner ring 10 facing the electrode outer ring 20.

Specifically, as shown in fig. 4, the inner ring retainer 30 includes a circular ring 301 and a second protrusion 302, wherein the second protrusion 302 is disposed on an outer surface of the circular ring 301 along a circumferential direction, a first mounting groove 105 is disposed at an end of the electrode inner ring 10 facing the electrode outer ring 20, the circular ring 301 is fitted into the first mounting groove 105, and an outer diameter of the circular ring formed by the second protrusion 302 is larger than an outer diameter of the electrode inner ring 10. Since the outer diameter of the ring formed by the second protrusion 302 is larger than the outer diameter of the electrode inner ring 10, after the solder is injected from the first solder injection hole 1011, the solder can be prevented from flowing away from the electrode inner ring 10 toward the end of the electrode outer ring 20 by the blocking action of the inner ring stopper 30.

It should be noted that, the structure of the inner ring retainer ring and the connection structure of the inner ring retainer ring and the electrode inner ring in the embodiment of the present application are merely examples, and in other alternative schemes, other structures may also be adopted, for example, a clamping groove is circumferentially arranged at one end of the inner ring retainer ring facing the electrode inner ring, and the inner ring retainer ring is clamped on the electrode inner ring. The structure of the inner ring retainer ring and the specific structure of the inner ring retainer ring and the electrode inner ring are not particularly limited by the application, and the purpose of the application can be realized by the structure.

In some embodiments, as shown in fig. 5, the second guide groove in the present application includes a second solder injection runner 202 and a second annular runner 203, the second solder injection runner 202 is disposed on the inner surface of the electrode outer ring 20 in a direction parallel to the axial direction, a plurality of second annular runners 203 is disposed on the inner surface of the electrode outer ring 20 in a circumferential direction, the second solder injection hole 201 is communicated with the second solder injection runner 202, and the second solder injection runner 202 is communicated with the second annular runners 203.

Specifically, in the present embodiment, a plurality of second annular runners 203 are circumferentially disposed on the inner surface of the electrode outer ring 20, the plurality of second annular runners 203 have the same size, and the intervals between adjacent second annular runners 203 are also equal, the second solder injection runner 202 is communicated with each second annular runner 203, and when in use, solder is injected through the second solder injection hole 201, and the solder flows into the second annular runner 203 through the second solder injection runner 202.

In some embodiments, as shown in fig. 4, the electrode outer ring 20 of the present application is provided with a connection ring 204 at an end facing the electrode inner ring 10 along a circumferential direction, the first protrusion 101 is provided with a second installation groove 1012 at an end facing the electrode outer ring 20 along a circumferential direction, and when the electrode outer ring 20 is sleeved on the electrode inner ring 10, the connection ring 204 is located in the second installation groove 1012.

It should be noted that, the connection structure of the electrode outer ring and the electrode inner ring in the embodiment of the present application is only an example, and in other alternative schemes, other structures may also be adopted, for example, a clamping groove is provided on the electrode inner ring, and a clamping block is provided on the electrode outer ring, and the clamping block is matched with the clamping groove. The specific structure of the electrode outer ring and the electrode inner ring is not particularly limited as long as the above structure can achieve the purpose of the present application.

In some embodiments, in order to prevent the integrated device from falling into the first solder injection hole when not in use, the high temperature superconducting tape joint ring electrode device of the present application further includes a first dust cap detachably mounted on the first solder injection hole 1011.

In some embodiments, in order to prevent the entire device from falling into the second solder injection hole when not in use, the high temperature superconducting tape joint ring electrode device of the present application further includes a second dust cap detachably mounted on the second solder injection hole 201.

In some embodiments, the first and second solder injection holes 1011, 201 are funnel shaped to facilitate solder pouring.

In the present embodiment, the first solder injection hole and the second solder injection hole are both formed in a funnel shape, which is merely an example, and in other alternative embodiments, other structures may be adopted, for example, a guide groove may be formed in each of the first solder injection hole and the second solder injection hole.

In summary, the high temperature superconducting tape joint ring electrode apparatus of the present invention includes: the electrode structure comprises an electrode inner ring 10, wherein two ends of the electrode inner ring 10 in the axial direction are of opening structures, a first guide groove is formed in the outer surface of the electrode inner ring 10, a first protrusion 101 is formed in one end of the electrode inner ring 10 in the circumferential direction, a first soldering tin injection hole 1011 is formed in the first protrusion 101, the first soldering tin injection hole 1011 is communicated with the first guide groove, two ends of an electrode outer ring 20 in the axial direction are of opening structures, the electrode outer ring 20 is sleeved on the electrode inner ring 10, a second soldering tin injection hole 201 is formed in the electrode outer ring 20 in the radial direction, a second guide groove is formed in the inner surface of the electrode outer ring 20, and the second soldering tin injection hole 201 is communicated with the second guide groove; the outer surface of the electrode inner ring 10 is provided with a plurality of first annular flow channels 103 along the circumferential direction, the sizes of the plurality of first annular flow channels 103 are the same, the distances between the adjacent first annular flow channels 103 are also equal, the first soldering tin injection flow channel 102 is communicated with each first annular flow channel 103, when the electrode inner ring is used, soldering tin is injected through the first soldering tin injection hole 1011, and the soldering tin flows into each first annular flow channel 103 through the first soldering tin injection flow channel 102. The inner ring retainer ring 30 comprises a circular ring 301 and a second protrusion 302, wherein the second protrusion 302 is arranged on the outer surface of the circular ring 301 along the circumferential direction, a first mounting groove 105 is arranged at one end, facing the electrode outer ring 20, of the electrode inner ring 10, the circular ring 301 is matched with the first mounting groove 105, and the outer diameter of the circular ring formed by the second protrusion 302 is larger than that of the electrode inner ring 10. Since the outer diameter of the ring formed by the second protrusion 302 is larger than the outer diameter of the electrode inner ring 10, after the solder is injected from the first solder injection hole 1011, the solder can be prevented from flowing away from the electrode inner ring 10 toward the end of the electrode outer ring 20 by the blocking action of the inner ring stopper 30. The inner surface of the electrode outer ring 20 is circumferentially provided with a plurality of second annular runners 203, the sizes of the plurality of second annular runners 203 are the same, the distances between the adjacent second annular runners 203 are also equal, the second solder injection runner 202 is communicated with each second annular runner 203, when the electrode outer ring is used, solder is injected through the second solder injection hole 201, and the solder flows into the second annular runners 203 through the second solder injection runner 202.

In use, as shown in fig. 9 and fig. 8, firstly, the electrode outer ring 20 is sleeved on the high-temperature superconducting tape 402, then as shown in fig. 10, the electrode inner ring 10 is sleeved on the superconducting cable inner core 401, at this time, the electrode inner ring 10 is moved in the axial direction, as shown in fig. 11 and fig. 12, so that the high-temperature superconducting tape 402 is clamped into the limiting groove 104 on the electrode inner ring 10, at this time, as shown in fig. 13, the electrode outer ring 20 is moved, so that the electrode outer ring 20 is sleeved on the electrode inner ring 10, finally, as shown in fig. 14, the fluoroplastic tape 50 is wound on one end of the electrode outer ring 20 away from the electrode inner ring 10, at this time, after the electrode inner ring 10 and the electrode outer ring 20 are heated to a predetermined temperature by using a welding machine, solder is injected into the first solder injection hole 1011 and the second solder injection hole 201, the solder is cooled and solidified, and the welding machine is removed, so that the welding connection can be completed, at the moment, the high-temperature superconducting strip, the electrode inner ring and the electrode outer ring form an integrated structure, so that the whole electrode can be effectively welded with the high-temperature superconducting strip.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.