阅读说明：本技术 存储器温控调频方法及存储器温控调频系统 (Memory temperature control frequency modulation method and memory temperature control frequency modulation system ) 是由 汤仁君 王伟康 韩海 梁军 张彪 于 2021-09-01 设计创作，主要内容包括：本发明提供一种存储器温控调频方法及存储器温控调频系统。所述方法包括：通过检测设备对存储器存储装置执行多个测试模式,并获取存储器控制电路单元的内部温度、各存储器封装的工作负载以及各存储器封装的表面温度,以建立工作负载、内部温度与表面温度的线性关系式；通过检测设备将线性关系式存储至存储器存储装置；由存储器存储装置利用线性关系式基于存储器控制电路单元的当前内部温度与多个存储器封装中第一存储器封装的当前工作负载计算第一存储器封装的预测表面温度；以及由存储器存储装置基于预测表面温度来调整对第一存储器封装进行存取的工作频率。(The invention provides a memory temperature control frequency modulation method and a memory temperature control frequency modulation system. The method comprises the following steps: executing a plurality of test modes on the memory storage device through the detection equipment, and acquiring the internal temperature of the memory control circuit unit, the working load of each memory package and the surface temperature of each memory package to establish a linear relation of the working load, the internal temperature and the surface temperature; storing the linear relational expression into a memory storage device through the detection equipment; calculating, by the memory storage device, a predicted surface temperature of a first memory package of the plurality of memory packages based on a current internal temperature of the memory control circuit unit and a current workload of the first memory package using a linear relationship; and adjusting, by the memory storage device, an operating frequency of accessing the first memory package based on the predicted surface temperature.)

1. A memory temperature control frequency modulation method for a memory storage device, the memory storage device comprising a memory control circuit unit and a plurality of memory packages, the method comprising:

executing a plurality of test modes on the memory storage device through a detection device, and acquiring the internal temperature of the memory control circuit unit, the working load of each memory package and the surface temperature of each memory package to establish a linear relation among the working load, the internal temperature and the surface temperature;

storing, by the detection apparatus, the linear relationship to the memory storage device;

calculating, by the memory storage device, a predicted surface temperature of a first memory package of the plurality of memory packages based on a current internal temperature of the memory control circuit unit and a current workload of the first memory package using the linear relationship; and

adjusting, by the memory storage device, an operating frequency of accessing the first memory package based on the predicted surface temperature.

2. The memory temperature control frequency modulation method according to claim 1, wherein at least one instruction is transmitted by the detection device to the memory storage device and received and executed by the memory storage device while the plurality of test modes are executed.

3. The method according to claim 2, wherein the at least one command comprises at least one of a write command and a read command.

4. The memory temperature control frequency modulation method of claim 1, wherein the workload comprises a data write volume of the memory package.

5. The memory temperature control frequency modulation method of claim 1 wherein the step of adjusting, by the memory storage device, the operating frequency of accessing the first memory package based on the predicted surface temperature comprises:

determining whether to adjust the operating frequency of accessing the first memory package according to a predetermined temperature threshold.

6. The method of claim 5, wherein determining whether to adjust the operating frequency for accessing the first memory package according to the predetermined temperature threshold comprises:

reducing, by the memory storage device, the operating frequency of accessing the first memory package if the predicted surface temperature is determined to be greater than a first temperature threshold, and

if the predicted surface temperature is determined to be less than a second temperature threshold, increasing, by the memory storage device, the operating frequency of accessing the first memory package.

7. A memory temperature control frequency modulation system comprising:

a detection device; and

a memory storage device includes a memory control circuit unit and a plurality of memory packages, wherein,

the detection equipment executes a plurality of test modes on the memory storage device and acquires the internal temperature of the memory control circuit unit, the working load of each memory package and the surface temperature of each memory package so as to establish a linear relation among the working load, the internal temperature and the surface temperature;

the detection device stores the linear relationship to the memory storage;

the memory storage device calculating a predicted surface temperature of a first memory package of the plurality of memory packages based on a current internal temperature of the memory control circuit unit and a current workload of the first memory package using the linear relationship; and

the memory storage device adjusts an operating frequency of accessing the first memory package based on the predicted surface temperature.

8. The memory temperature control chirp system of claim 7, wherein said detection device transmits at least one instruction to said memory storage device and said memory storage device receives and executes said at least one instruction while executing said plurality of test modes.

9. The memory temperature control frequency modulation system of claim 8, wherein the at least one command comprises at least one of a write command and a read command.

10. The memory temperature controlled frequency modulation system of claim 7, wherein the memory control circuitry unit comprises a temperature sensor, and the temperature sensor is configured to measure the internal temperature of the memory control circuitry unit.

11. The memory temperature controlled frequency modulation system of claim 10 wherein the temperature sensor is a thermistor.

12. The memory temperature controlled frequency modulation system of claim 7, wherein the detection apparatus comprises a temperature sensor configured to measure the surface temperature of the memory package.

13. The memory temperature controlled frequency modulation system of claim 7, wherein the workload comprises a data write volume of the memory package.

14. The memory temperature controlled frequency modulation system of claim 7 wherein the operation of the memory storage device adjusting the operating frequency of access to the first memory package based on the predicted surface temperature comprises:

determining whether to adjust the operating frequency of accessing the first memory package according to a predetermined temperature threshold.

15. The memory temperature control chirp system of claim 14, wherein determining whether to adjust the operating frequency of accessing the first memory package based on the preset temperature threshold comprises:

if the predicted surface temperature is determined to be greater than a first temperature threshold, the memory storage device reduces the operating frequency of accessing the first memory package, and

if the predicted surface temperature is determined to be less than a second temperature threshold, the memory storage device increases the operating frequency of accessing the first memory package.

Technical Field

The present invention relates to a memory temperature control technology, and in particular, to a memory temperature control frequency modulation method and a memory temperature control frequency modulation system.

Background

Digital cameras, cell phones, and MP3 have grown rapidly over the years, resulting in a rapid increase in consumer demand for storage media. Since the rewritable non-volatile memory (rewritable non-volatile memory) has the characteristics of non-volatility, power saving, small volume, no mechanical structure, high read-write speed and the like, the rewritable non-volatile memory is most suitable for portable electronic products such as notebook computers. A solid state disk is a memory storage device using a flash memory module as a storage medium. Therefore, the flash memory industry has become a very popular part of the electronics industry in recent years.

Generally, a memory storage device generates a large amount of heat energy during operation. With the trend of small-sized products to configure rewritable nonvolatile memory modules with larger capacity and higher speed, the risk of overheating of the memory storage device is increasing. To avoid damage to the memory storage device due to overheating, the temperature of the memory storage device must be kept below a certain temperature. In the prior art, it is common to measure the surface temperature of the memory package closest to the memory controller using a temperature sensor (thermal sensor) provided in the memory storage device, and to determine whether or not a speed reduction is required using the measured temperature. However, the memory controller will not only access the memory package closest to the memory controller, and the temperature of a single memory wrapper cannot represent the temperature of all memory packages. It is not accurate to use only the temperature of a single memory package to determine whether a speed down is required. Therefore, how to design a memory storage device that combines the efficiency of temperature control and frequency modulation with the saving of circuit layout space of the PCB substrate is a concern for those skilled in the art.

Disclosure of Invention

The invention provides a memory temperature control frequency modulation method and a memory temperature control frequency modulation system, which can improve the temperature control frequency modulation efficiency and save the circuit layout space of a PCB substrate.

The embodiment of the invention provides a temperature control frequency modulation method for a memory, which is used for a memory storage device. The memory storage device comprises a memory control circuit unit and a plurality of memory packages. The method comprises the following steps: executing a plurality of test modes on the memory storage device through a detection device, and acquiring the internal temperature of the memory control circuit unit, the working load of each memory package and the surface temperature of each memory package to establish a linear relation among the working load, the internal temperature and the surface temperature; storing, by the detection apparatus, the linear relationship to the memory storage device; calculating, by the memory storage device, a predicted surface temperature of a first memory package of the plurality of memory packages based on a current internal temperature of the memory control circuit unit and a current workload of the first memory package using the linear relationship; and adjusting, by the memory storage device, an operating frequency of accessing the first memory package based on the predicted surface temperature.

In an embodiment of the invention, when the plurality of test modes are executed, the detection device transmits at least one instruction to the memory storage device, and the memory storage device receives and executes the at least one instruction.

In an embodiment of the invention, the at least one command includes at least one of a write command and a read command.

In an embodiment of the invention, the workload includes a data writing amount of the memory package.

In an embodiment of the invention, the adjusting, by the memory storage device, the operating frequency of accessing the first memory package based on the predicted surface temperature includes: determining whether to adjust the operating frequency of accessing the first memory package according to a predetermined temperature threshold.

In an embodiment of the invention, the step of determining whether to adjust the operating frequency for accessing the first memory package according to the preset temperature threshold includes: if the predicted surface temperature is determined to be greater than a first temperature threshold, the operating frequency of accessing the first memory package is reduced by the memory storage device. And if the predicted surface temperature is determined to be less than a second temperature threshold, increasing, by the memory storage device, the operating frequency of accessing the first memory package.

The embodiment of the invention provides a memory temperature control frequency modulation system, which comprises a detection device and a memory storage device. The memory storage device comprises a memory control circuit unit and a plurality of memory packages. The detection device executes a plurality of test modes on the memory storage device, and acquires the internal temperature of the memory control circuit unit, the workload of each memory package, and the surface temperature of each memory package to establish a linear relational expression of the workload, the internal temperature, and the surface temperature. The detection apparatus stores the linear relationship to the memory storage device. The memory storage device calculates a predicted surface temperature of a first memory package of the plurality of memory packages based on a current internal temperature of the memory control circuit unit and a current workload of the first memory package using the linear relationship. And the memory storage device adjusts an operating frequency of accessing the first memory package based on the predicted surface temperature.

In an embodiment of the invention, when the plurality of test modes are executed, the detection device transmits at least one instruction to the memory storage device, and the memory storage device receives and executes the at least one instruction.

In an embodiment of the invention, the at least one command includes at least one of a write command and a read command.

In an embodiment of the invention, the memory control circuit unit includes a temperature sensor, and the temperature sensor is configured to measure the internal temperature of the memory control circuit unit.

In an embodiment of the invention, the temperature sensor is a thermistor.

In an embodiment of the present invention, the above detection apparatus includes a temperature sensor configured to measure the surface temperature of the memory package.

In an embodiment of the invention, the workload includes a data writing amount of the memory package.

In an embodiment of the present invention, the operation of the memory storage device adjusting the operating frequency of accessing the first memory package based on the predicted surface temperature includes: determining whether to adjust the operating frequency of accessing the first memory package according to a predetermined temperature threshold.

In an embodiment of the invention, the operation of determining whether to adjust the operating frequency for accessing the first memory package according to the preset temperature threshold includes: if the predicted surface temperature is determined to be greater than a first temperature threshold, the memory storage device reduces the operating frequency of accessing the first memory package. And if the predicted surface temperature is determined to be less than a second temperature threshold, the memory storage device increases the operating frequency of accessing the first memory package.

Based on the above, the memory temperature control frequency modulation method and the memory temperature control frequency modulation system provided by the embodiments of the present invention can establish a relational expression between the internal temperature of the memory control circuit unit, the workload of the memory package, and the surface temperature of the memory package. With the established relation, the memory storage device predicts the current surface temperature of each memory package according to the current internal temperature of the memory control circuit unit and the workload of the memory package in the operation stage. Therefore, the memory storage device can predict the surface temperature of the memory package and adjust the working frequency of the memory package according to the predicted surface temperature, so that the temperature control and frequency modulation efficiency is improved.

Drawings

FIG. 1 is a diagram illustrating a host system, a memory storage device, and an input/output (I/O) device, according to an example embodiment;

FIG. 2 is a schematic diagram of a host system, a memory storage device, and an input/output (I/O) device according to another example embodiment;

FIG. 3 is a schematic diagram of a host system and a memory storage device according to another example embodiment;

FIG. 4 is a schematic block diagram of a memory storage device according to an exemplary embodiment of the present invention;

FIG. 5 is a schematic diagram of an inspection apparatus for a memory storage device according to an exemplary embodiment of the present invention;

FIG. 6 is a diagram illustrating the testing of a memory storage device according to an exemplary embodiment of the present invention;

FIG. 7 is a flowchart illustrating a method for memory temperature control frequency modulation according to an exemplary embodiment of the invention.

Detailed Description

Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.

Generally, a memory storage device (also referred to as a memory storage system) includes a rewritable nonvolatile memory module and a controller (also referred to as a control circuit unit). Typically, memory storage devices are used with a host system so that the host system can write data to or read data from the memory storage devices.

FIG. 1 is a diagram illustrating a host system, a memory storage device, and an input/output (I/O) device according to an example embodiment. And FIG. 2 is a schematic diagram of a host system, a memory storage device, and an input/output (I/O) device according to another example embodiment.

Referring to fig. 1 and 2, the host system 11 generally includes a processor 111, a Random Access Memory (RAM) 112, a Read Only Memory (ROM) 113, and a data transmission interface 114. The processor 111, the RAM 112, the ROM 113, and the data transmission interface 114 are all coupled to a system bus (system bus) 110.

In the present exemplary embodiment, the host system 11 is coupled to the memory storage device 10 through the data transmission interface 114. For example, host system 11 may write data to memory storage device 10 or read data from memory storage device 10 via data transfer interface 114. In addition, the host system 11 is coupled to the I/O devices 12 via a system bus 110. For example, the host system 11 may transmit output signals to the I/O device 12 or receive input signals from the I/O device 12 via the system bus 110.

In the present exemplary embodiment, the processor 111, the random access memory 112, the read only memory 113 and the data transmission interface 114 are disposed on the motherboard 20 of the host system 11. The number of data transfer interfaces 114 may be one or more. The motherboard 20 can be coupled to the memory storage device 10 via a wired or wireless manner through the data transmission interface 114. The memory storage device 10 may be, for example, a personal disk 201, a memory card 202, a Solid State Drive (SSD) 203, or a wireless memory storage device 204. The wireless memory Storage 204 can be a memory Storage based on various wireless Communication technologies, such as Near Field Communication (NFC) memory Storage, wireless facsimile (WiFi) memory Storage, Bluetooth (Bluetooth) memory Storage, or Bluetooth low energy (low) memory Storage (e.g., iBeacon). In addition, the motherboard 20 may also be coupled to various I/O devices such as a Global Positioning System (GPS) module 205, a network interface card 206, a wireless transmission device 207, a keyboard 208, a screen 209, and a speaker 210 via the System bus 110. For example, in an exemplary embodiment, the motherboard 20 may access the wireless memory storage device 204 via the wireless transmission device 207.

In an exemplary embodiment, the host system referred to is substantially any system that can cooperate with a memory storage device to store data. Although the host system is described as a computer system in the above exemplary embodiment, fig. 3 is a schematic diagram of a host system and a memory storage device according to another exemplary embodiment. Referring to fig. 3, in another exemplary embodiment, the host system 31 may also be a digital camera, a video camera, a communication device, an audio player, a video player, or a tablet computer, and the memory storage device 30 may be various non-volatile memory storage devices such as an SD card 32, a CF card 33, or an embedded storage device 34. The embedded memory device 34 includes embedded Multi-media cards (eMMC) 341 and/or embedded Multi-Chip Package memory devices (eMCP) 342, which directly couple the memory module to the embedded memory device on the substrate of the host system.

FIG. 4 is a schematic block diagram of a memory storage device according to an exemplary embodiment of the present invention.

Referring to fig. 4, the memory storage device 10 includes, but is not limited to, a connection interface unit 402, a memory control circuit unit 404, and a rewritable nonvolatile memory module 406.

In the present exemplary embodiment, connection interface unit 402 is compatible with the Serial Advanced Technology Attachment (SATA) standard. However, it should be understood that the present invention is not limited thereto, and the connection interface unit 402 may also conform to the Parallel Advanced Technology Attachment (PATA) standard, the Institute of Electrical and Electronic Engineers (IEEE) 1394 standard, the High-Speed Peripheral Component connection interface (PCI Express) standard, the Universal Serial Bus (USB) standard, the Secure Digital (SD) interface standard, the Ultra High Speed (UHS-I) interface standard, the Ultra High Speed (UHS-II) interface standard, the Memory Stick (Memory Stick, MS) interface standard, the Multi-Chip Package (Multi-Package) interface standard, the Multimedia Memory Card (Multi-Media, Multimedia Card (Multimedia Card, Multimedia Card (MMC) interface, eMMC) interface standard, Universal Flash Storage (UFS) interface standard, embedded Multi-Chip Package (eMCP) interface standard, Compact Flash (CF) interface standard, Integrated Device Electronics (IDE) standard, or other suitable standard. The connection interface unit 402 may be packaged with the memory control circuit unit 404 in one chip, or the connection interface unit 402 may be disposed outside a chip including the memory control circuit unit 404.

The memory control unit 404 is connected to the host system 11 through the connection interface unit 402, and connects and drive-controls the respective memory packages 4a to 4c through the bus 410. The memory control unit 404 is used for executing a plurality of logic gates or control commands implemented in hardware or firmware, and performing data writing, reading and erasing operations in each of the memory packages 4 a-4 c according to commands from the host system 11. In the present exemplary embodiment, the memory control unit 404 includes a temperature sensor 4041. The temperature sensor 4041 may include, for example, a thermistor built in the memory control circuit unit 404 to measure the temperature (e.g., the internal temperature T) of the memory control circuit unit 404_j). The thermistor may include a resistor, the resistance of which changes with temperature, and the volume of which changes with temperature more significantly than a typical constant resistance.

The rewritable nonvolatile memory module 406 includes a plurality of memory packages 4a to 4c mounted on a PCB substrate 408. However, the memory packages 4a to 4c in fig. 4 are one embodiment of the present invention, and the present invention does not limit the number of memory packages included in the memory storage device 10. The memory packages 4 a-4 c are built with one or more memory chips therein and are used for storing data written by the host system 11. The memory chip has an interface chip and a memory cell array, such as a NAND flash memory chip. The plurality of memory cells included in the memory Cell array may be Single Level cells (SLC, i.e., 1 bit may be stored in one memory Cell), Multi-Level cells (MLC, i.e., 2 bits may be stored in one memory Cell), multiple Level cells (TLC, i.e., 3 bits may be stored in one memory Cell), or other types of memory cells.

FIG. 5 is a diagram illustrating an apparatus for testing a memory storage device according to an exemplary embodiment of the invention. Referring to fig. 5, the detection apparatus 5 includes a host system 51, a stage 52, and a temperature sensor, which may include a plurality of temperature sensors 53a to 53n shown in fig. 5, for example. The carrier 52 is used to carry the memory storage device 10. The temperature sensors 53 a-53 n are, for example, J-type thermocouple probes, infrared detectors disposed above the memory package, or other devices capable of measuring the temperature (e.g., surface temperature T) of the memory package_c) The invention is not limited thereto.

FIG. 6 is a diagram illustrating a sense memory storage device according to an exemplary embodiment of the present invention. In the exemplary embodiment of FIG. 6, assume that a type J thermocouple probe is used to measure the surface temperature T of the memory package_cAnd assume that the memory storage device 10 includes memory packages 4 a-4 c. Referring to fig. 6, memory storage device 10 may be placed on a carrier 52. The host system 51 is coupled to the connection interface unit 402 for data transmission with the memory control circuit unit 404. The temperature sensors 53a to 53c may be respectively fixed on the surfaces of the memory packages 4a to 4c and used to sense the surface temperatures T of the memory packages 4a to 4c_c。

In the present exemplary embodiment, the host system 51 stores a plurality of test patterns. The test mode includes at least one command, which may include a write command or a read command. In the testing phase, memory storage device 10, which is initially written to firmware, is placed on stage 52. The host system 51 transmits at least one command to the memory storage device 10 when executing the test mode. The memory storage device 10 receives and executes instructions from the host system 51 and executes the instructions in a sequential read/write (sequential read/write) or random read/write (random read/write) manner. While the test mode is being executed, the host system 51 receives and records the work load (work loading) of each of the memory packages 4a to 4c, the surface temperature of each of the memory packages 4a to 4c measured by the temperature sensors 53a to 53c, and the internal temperature of the memory control circuit unit 404 measured by the temperature sensor 4041. This workload is recorded by the memory storage device 10 and transmitted to the host system 51, and includes, for example, the data write amount, the data read amount, the data write speed, and/or the data read speed of the memory control circuit unit 404 accessing the memory package, and the invention is not limited thereto. Table 1 below is an example of the test results recorded after the host system 51 executes the test mode.

TABLE 1

Referring to table 1 above, assuming that the workload is related to the data writing amount per unit time, for example, the memory storage device 10 may record the execution amount of a single memory package in a unit of 4KB access within 10 seconds to obtain the data writing amount of the memory package. When the host system 51 executes the test mode 1, the workload of the memory packages 4a to 4c received by the host system 51 is WL1 to WL3, respectively, and the surface temperature is T, respectively_c1～T_c3And the received internal temperature of the memory control circuit unit 404 is T_j1. Generally, the surface temperature of the memory package 4a closest to the memory control circuit unit 404 is affected by the memory control circuit unit 404, and thus the temperature is high. In addition, in the present exemplary embodiment, the data received when the host system 51 executes the test mode 2 can refer to the table 1 above, and is not described herein again.

FIG. 7 is a flowchart illustrating a method for memory temperature control frequency modulation according to an exemplary embodiment of the invention. Referring to fig. 6 and fig. 7, the method of the present embodiment is applied to the detection device 5 and the memory storage device 10, and the detailed steps of the memory temperature control frequency modulation method of the present embodiment will be described below with reference to various devices and elements of the detection device 5 and the memory storage device 10.

Herein, the testing stage S70 includes steps S701 and S702, and the operating stage S71 includes steps S711 and S712.

In step S701, a plurality of test patterns are executed on the memory storage device 10 by the detection apparatus 5, and the internal temperature of the memory control circuit unit 404, the workload of each memory package, and the surface temperature of each memory package are acquired to establish a linear relationship of the workload, the internal temperature, and the surface temperature. For example, the host system 51 may fit (fit) the obtained measurement data (workload, internal temperature, and surface temperature) using equation (1) to calculate the coefficient a and the constant b in the equation.

T_c[PK]＝(a×T_j+b)×WL[PK]............................(1)

Where PK denotes the number of the memory package, for example, 4a to 4c in fig. 6. T is_c[PK]Indicating the surface temperature of the memory package PK. a represents a coefficient, and b represents a constant. T is_jIndicating the internal temperature of the memory control circuit unit 404. WL [ PK]Representing the workload of the memory package PK.

Taking the above table 1 as an example, when the linear relation of the memory package 4a is to be established, the host system 51 may determine the surface temperature T based on the received workloads WL1 and WL4_c1And T_c4Internal temperature T_j1And T_j2A linear fit is made to establish a linear relationship of the workload, the internal temperature and the surface temperature of the memory package 4 a. In the present exemplary embodiment, the host system 51 establishes a linear relationship as shown in the following equation (2):

T_c[4a]＝(a×T_j+b)×WL[4a]............................(2)

wherein, T_c[4a]Representing the surface temperature of the memory package 4 a. a represents a coefficient, and b represents a constant. T is_jIndicating the internal temperature of the memory control circuit unit 404. WL [4a ]]Representing the workload of the memory package 4 a. The linear relations of the other memory packages 4b to 4c and the linear relation of the memory package 4a are obtained by fitting in the same manner, and are not described herein again.

In step S702, the linear relational expression is stored to the memory storage device 10 by the detection apparatus 5. After establishing the linear relationship of each memory package, the host system 51 stores the established linear relationship into the memory storage device 10.

In step S711, the memory storage device 10 calculates the predicted surface temperature of the first memory package of the plurality of memory packages based on the current internal temperature of the memory control circuit unit 404 and the current workload of the first memory package using the linear relational expression. Specifically, the memory storage device 10 can be used with a host system 11 (which can be different from the host system 51 of the detection apparatus 5) such as those shown in fig. 1 and 4. During operation of the memory storage device 10, the temperature sensor 4041 measures the current internal temperature of the memory control circuit unit 404, and the memory storage device 10 records the current workload of the memory packages 4 a-4 c. Wherein the current workload recorded by the memory storage device 10 is the same as the workload used when establishing the linear relation.

In the present exemplary embodiment, if the memory storage device 10 is to predict the predicted surface temperature of the first memory package (assumed to be the memory package 4a), the memory control circuit unit 404 calculates the predicted surface temperature of the memory package 4a by using the linear relation associated with the memory package 4a and based on the current internal temperature of the memory control circuit unit 404 and the workload of the memory package 4 a. In other words, the memory storage device 10 of the present exemplary embodiment does not include a temperature sensor that can measure the memory packages 4a to 4c, and therefore the surface temperature of each memory package 4a to 4c can be predicted according to the corresponding linear relationship, the current internal temperature, and the current workload. In this way, the surface temperature of each memory package can be predicted without providing a temperature sensor for measuring the memory package in the memory storage device 10, thereby saving the circuit layout space of the PCB substrate.

In step S712, the memory storage device 10 adjusts an operating frequency (i.e., operating speed) of accessing (i.e., reading and writing) the first memory package based on the predicted surface temperature. In this way, the memory storage device 10 may reduce the operating frequency of accessing the first memory package when the predicted surface temperature of the first memory package is too high. Furthermore, the memory storage device 10 may also increase the operating frequency of accessing the first memory package when this predicted surface temperature decreases to the target temperature. In other words, embodiments of the present invention may predict the surface temperature of a single memory package, and thus may adjust the operating frequency of accessing individual memory packages according to the surface temperature of each memory package, respectively.

In an exemplary embodiment, the memory control circuit unit 404 determines whether to adjust the operating frequency for accessing the first memory package according to a predetermined temperature threshold. Specifically, the memory control circuit unit 404 may determine whether the predicted surface temperature is greater than a first temperature threshold (e.g., 70 ℃). If the predicted surface temperature is greater than the first temperature threshold, the memory control circuit unit 404 decreases the operating frequency of accessing the first memory package. For example, the memory control circuit unit 404 may tune down a first operating frequency for accessing the first memory package to a second operating frequency, which is less than the first operating frequency. In addition, the memory control circuit unit 404 may determine whether the predicted surface temperature is less than a second temperature threshold (e.g., 30 ℃). If the predicted surface temperature is determined to be less than the second temperature threshold, the memory control circuit unit 404 increases the operating frequency of accessing the first memory package. For example, the memory control circuit unit 404 may restore the second operating frequency of accessing the first memory package to the first operating frequency. It should be noted that, the user may set more temperature thresholds and corresponding operating frequencies as conditions for determining and adjusting the operating frequency according to the requirement, and the invention is not limited thereto.

In summary, the memory temperature control frequency modulation method and the memory temperature control frequency modulation system according to the embodiments of the present invention can establish a relationship among the internal temperature of the memory control circuit unit, the workload of the memory package, and the surface temperature of the memory package. With the established relation, the memory storage device predicts the current surface temperature of each memory package according to the current internal temperature of the memory control circuit unit and the workload of the memory package in the operation stage. Therefore, the memory storage device can predict the surface temperature of a single memory package, and the working frequency of accessing each memory package can be respectively adjusted according to the surface temperature of each memory package, so that the temperature control and frequency modulation efficiency is improved. In addition, the memory storage device of the embodiment can predict the surface temperature of each memory package without arranging a temperature sensor for measuring the memory package, thereby saving the circuit layout space of the PCB substrate.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.