阅读说明：本技术 导线集合体及其应用传导装置及制备方法 (Lead assembly, application conduction device thereof and preparation method ) 是由 王永光 于 2021-08-26 设计创作，主要内容包括：本发明提供导线集合体及其应用传导装置及制备方法,本发明其一方面提供导线集合体通过利用N条导线,导线与导线之间并联连接,利用不同导线的电阻值特性解决高频率信号和低频率信号在传导过程中产生的失真问题,经过实验证明通过不同频率信号在通过不同电阻值导线的条数越多,其信号还原越好；另一方面还提供一种带导线集合体的传导装置,包括至少三个相同的所述导线集合体；其中,三个所述导线集合体具有相同的结构,结构对应位置的线材电阻率一致；独立的导线集合体能够火线、地线以及零线中任意一线连接,实现线路分离,避免信号之间挤压干扰。最后,还提供该装置的生产方法,以便于生产操作。(The invention provides a wire assembly, an application conduction device and a preparation method thereof, wherein the wire assembly is characterized in that N wires are utilized, the wires are connected in parallel, the distortion problem generated in the conduction process of high-frequency signals and low-frequency signals is solved by utilizing the resistance value characteristics of different wires, and experiments prove that the more the number of the wires passing through different resistance values is, the better the signal recovery is; in another aspect, a conducting device with a lead assembly is provided, which comprises at least three same lead assemblies; the three lead assemblies have the same structure, and the resistivity of the wires at the corresponding positions of the structure is consistent; the independent wire aggregate can be connected with any line in a live wire, a ground wire and a zero line, so that the line separation is realized, and the extrusion interference between signals is avoided. Finally, a method of producing the device is also provided to facilitate the production operation.)

1. A wire assembly, comprising: the device comprises at least N conducting wires, wherein the conducting wires are connected in parallel; the conducting wires are made of conductor materials, N is not less than 2 and is a positive integer, the resistance value of each conducting wire is greater than 0 and is not equal, and the outer wall of each conducting wire is coated with an insulator.

2. The wire harness assembly of claim 1, wherein: the magnetic shielding material layer is arranged on the surface layer of the lead assembly, and the lead is connected to two ends of the lead assembly.

3. The wire harness assembly of claim 2, wherein: the shape of the conducting wire is selected from any one or two of regular-shaped conducting wires and irregular-shaped conducting wires.

4. The wire harness assembly of claim 2, wherein: in the wire assembly, the resistance values of the wires are distributed in an arithmetic progression with a constant as a tolerance.

5. The conduction device with the lead assembly is characterized in that: comprising at least three of the wire assemblies of claim 3; the three lead wire assemblies have the same structure, and the resistivity of the wire rods at the corresponding positions of the structure is consistent.

6. A conducting device with a lead aggregate as set forth in claim 5, wherein: the conductive device further comprises a shell, and the shell is used for integrally coating the lead assembly in the conductive device.

7. The conduction device with a lead assembly as claimed in claim 6, wherein: the two ends of the conduction device are connected with wires for being connected into an external device in series, the external device comprises a signal source device and an external discharge device, any group of connecting wires of the conduction device is connected with an external line for use, the external line is connected with a power supply, and the external wiring is selected from any one or combination of a live wire, a zero wire and a ground wire.

8. The preparation method of the conduction device with the lead assembly is characterized by comprising the following steps of: includes the following steps S1, preparing a lead wire assembly; the manufacturing method comprises the steps of preparing a wire assembly, selecting N wires with different resistance values and resistance values larger than 0, arranging the N wires in parallel to form a wire core, respectively connecting out connecting wires at two ends of the wire core, and finally covering a magnetic shielding material layer on the surface of the wire core.

9. The method of manufacturing a conduction device with a lead assembly as set forth in claim 8, wherein: further comprising a step S2 of synthesizing the conducting means; and synthesizing the conducting device, assembling at least three same lead assemblies as a whole, reserving two ends of each lead assembly to be connected with leads, and coating the leads by using a shell to obtain the conducting device.

10. The method of manufacturing a conduction device with a lead assembly as set forth in claim 8, wherein: in step S1, the N wires are arranged and connected in parallel to form a wire core, that is, the length difference between the wires is shortened, the outer wall of the wire is covered with an insulator surface, and then all the wires are connected in parallel to form the wire core; the length difference between the conducting wires is shortened, namely when the circumference of the cross section of any one conducting wire is larger than the length of the conducting wire, the conducting wire is cut along a straight line in the length direction of the cross section of the conducting wire, and then the conducting wire is unfolded along the circumference of the cross section of the conducting wire, and the circumference of the cross section of the conducting wire is connected with other conducting wires in parallel.

Technical Field

The invention relates to a conduction technology, in particular to a wire assembly and an application conduction device and a preparation method thereof.

Background

Energy conversion exists in daily life and even in nature at any moment; some of these energy conversions can be explained using the prior art principles, and some cannot even be explained using the prior art principles.

The inventor who is a music fan finds that the sound which is a signal source is propagated through a wire with current in the process of continuously listening to music, and the following situations occur:

(1) the root cause of sound reproduction distortion after the high-frequency signal and the low-frequency signal are conducted for the same time is audio frequency phase difference, namely, the high-frequency signal is transmitted fast, the low-frequency signal is transmitted slow, and the phase difference that different frequency signals cannot arrive at the same time is also called sound imbalance.

(2) Signals with different frequencies are transmitted in the same thin wire, and the signals with different frequencies are mutually extruded and pulled, so that the phase difference is intensified.

(3) The live wire and the zero wire enter and exit one another to cause interference, and signal distortion of different degrees can be brought.

In order to obtain the signal frequency close to the signal source, the inventor obtains the lead assembly through continuous conception and experiments and uses the lead assembly as a conduction device in a device.

Disclosure of Invention

In order to solve the above technical problems, the present invention provides a wire assembly and a conduction device using the same, which can effectively solve the problem of frequency recovery of a signal source conducted in a wire by frequency division configuration of the wire, so that when receiving a high frequency signal and a low frequency signal after conduction and recovering a sound, the wire assembly has an optimized recovery effect.

The technical scheme of the invention on one hand is as follows:

a lead wire assembly comprises at least N lead wires, wherein the lead wires are connected in parallel; the conducting wires are made of conductor materials, N is not less than 2 and is a positive integer, the resistance value of each conducting wire is greater than 0 and is not equal, and the outer wall of each conducting wire is coated with an insulator.

Further, the wire assembly further includes a surface magnetic shielding material layer on the wire assembly and a connecting wire at both ends of the wire assembly.

Further, the shape of the conducting wire is selected from any one of regular-shaped conducting wires and irregular-shaped conducting wires or a combination of the two.

Preferably, in the lead wire assembly, the resistance values of the lead wires are distributed in an arithmetic progression with a constant as a tolerance.

The invention provides another technical scheme as follows:

a conducting device with lead aggregate comprises at least three lead aggregates; the three lead wire assemblies have the same structure, and the resistivity of the wire rods at the corresponding positions of the structure is consistent.

Further, the conduction device further includes a housing for integrally covering the lead assembly inside the conduction device.

Furthermore, the connecting wires at the two ends of the conduction device are used for being connected into an external device in series, the external device comprises a signal source device and an external amplifier, any group of connecting wires of the conduction device is connected with an external line for use, the external line is connected with a power supply, and the external wiring is selected from any one or combination of a live wire, a zero wire and a ground wire.

The invention also provides a technical scheme of the third aspect:

a method for preparing a conduction device with a lead assembly is characterized in that: includes the following steps S1, preparing a lead wire assembly; the manufacturing method comprises the steps of preparing a wire assembly, selecting N wires with different resistance values and resistance values larger than 0, arranging the N wires in parallel to form a wire core, respectively connecting out connecting wires at two ends of the wire core, and finally covering a magnetic shielding material layer on the surface of the wire core.

Further, the method for manufacturing a conduction device with a lead assembly further includes step S2 of synthesizing the conduction device; and synthesizing the conducting device, assembling at least three same lead assemblies as a whole, reserving two ends of each lead assembly to be connected with leads, and coating the leads by using a shell to obtain the conducting device.

Further, in step S1, the N wires are arranged and connected in parallel to form a wire core, that is, the length difference between the wires is shortened, the outer wall of the wire is coated with an insulator surface, and then all the wires are connected in parallel to form the wire core; the length difference between the conducting wires is shortened, namely when the perimeter length of the cross section of any one conducting wire is larger than the length of the conducting wire, the conducting wire is cut along a straight line in the length direction of the cross section of the conducting wire, and then the conducting wire is unfolded along the perimeter direction of the cross section of the conducting wire, and the perimeter length of the cross section of the conducting wire is connected with other conducting wires in parallel.

The technical scheme has the following technical effects:

1. the invention provides a lead assembly, which connects a lead and a lead in the lead assembly in parallel by utilizing the relation between current work and resistance under the condition of the same voltage in unit time; a plurality of current loops are formed to play a shunting role on signals so as to solve the problem that the signals with different frequencies are transmitted in the same tiny wire, the signals with different frequencies are mutually extruded and pulled, and the phase difference is aggravated.

2. The invention provides a lead assembly, which is provided with at least N leads, wherein the resistances of the leads in the same lead assembly are different, and different currents are generated to apply different work to signals; to achieve "i.e. sound imbalance caused by high and low frequency signals".

3. According to the invention, through the conduction device with the wire assembly, the external lines can be optionally connected in series into one wire assembly, so that the problems that interference is caused when a live wire and a zero wire are provided to be in and out of each other and signal distortion is brought to different degrees are solved, the independent wire assembly can be connected with any one of the live wire, the ground wire and the zero wire, the line separation is realized, and the extrusion interference among signals is avoided.

4. The invention provides a method for preparing a conducting device with a lead assembly, which utilizes the structural characteristics of the lead assembly and adopts corresponding process steps to realize operation and application.

Drawings

FIG. 1: the invention discloses a structure schematic diagram of a conduction device with a lead assembly and a use schematic diagram thereof;

FIG. 2: a schematic cross-sectional view of one structure of the lead wire aggregate of the present invention;

FIG. 3: the preparation method of the invention is a schematic diagram for arranging shorter wires in the wire assembly.

Reference numerals:

a conduction device-1 with a lead assembly; a wire assembly-2; a wire assembly-3; a lead assembly-4; a housing-5; signal source device-6; a placing device-7; external wiring-8; external wiring-9; external wiring-10; a lead-21; a layer-22 of magnetic shielding material; a connecting wire-23; a connecting wire-24; cross-sectional perimeter-C; the wire itself has a length-L.

Detailed Description

To further explain the technical aspects of the present invention, the following description is made with reference to the accompanying drawings and the detailed description. Meanwhile, it should be noted that the technical contents and technical features of the present invention can be used in combination without conflict. After long-term experiments on conductor materials and conductor structures, the inventor obtains the following technical scheme.

The "conduction device" referred to in the present invention refers to the "conduction device with a lead aggregate" of the present invention.

One aspect of the present invention is a wire assembly manufactured by the present invention, including:

in an embodiment of the present invention, a wire assembly (2) as shown in fig. 2 includes at least N wires (21), wherein the wires (21) are connected in parallel with the wires (21); wherein the conducting wires (21) are made of conductor materials, N is not less than 2 and is a positive integer, and the resistance value of each conducting wire (21)>0 and unequal, and the outer wall of each conducting wire (21) is coated with an insulator. In the embodiment, the adoption of the at least N wires mainly plays a role in shunting signals so as to solve the problem that signals with different frequencies are transmitted in the same tiny wire,the signals with different frequencies are mutually extruded and pulled, so that the problem of phase difference is aggravated. Second, "resistance value of each of the conductive lines>0 and unequal' is that the distortion problem generated in the transmission process of high-frequency signals and low-frequency signals is solved by using the resistance value characteristics of different wires, and experiments prove that the more the number of the wires passing through different resistance values of the different frequency signals is, the better the signal recovery is. In this embodiment, the signal passes through the wire under the action of electric energy, so that the following physical quantity calculation relationship is obtained according to the fact that in the parallel circuit, work is done in unit time by current: w is U²T/R, it can be seen that the energy allocated to a signal by electrical energy is inversely proportional to the resistance, and as the resistance is larger, the energy imparted to the signal is smaller so that it is less conductive and less resilient. After multiple tests are carried out by using the technical scheme, the thinner and longer wire diameter of the obtained wire is beneficial to the reduction of the high-frequency signal after conduction, and the thicker and shorter wire diameter of the wire is beneficial to the reduction of the low-frequency signal. Finally, the step of coating the insulator on the outer wall of each wire is to coat the insulator on the outer wall of each wire so as to ensure that each wire forms a single loop with a power supply.

In one embodiment of this embodiment, as shown in fig. 2, the lead assembly (2) further includes a magnetic shielding material layer (22) on a surface layer of the lead assembly (2) and connecting leads (23,24) at both ends of the lead assembly. In the embodiment, the magnetic shielding treatment is carried out on the whole surface of the lead, so that the phenomenon of electromagnetic wave interference when a plurality of aggregates are used together is avoided; the two ends of the lead assembly are connected with the leads, so that the lead assembly can be conveniently installed and used.

In one embodiment of this embodiment, as shown in fig. 2, the shape of the conductive wire (21) is selected from one or two of a regular-shaped conductive wire and an irregular-shaped conductive wire. In the present embodiment, the regular-shaped wire may be a wire having a regular three-dimensional shape, such as a cylindrical wire, a square wire, a spiral wire, a wave-shaped wire, or a sheet-shaped wire. The irregular conducting wire can be a conducting wire with an irregular solid shape, such as a strip-shaped conducting wire with an irregular edge. The internal conductors in the same conductor assembly may be all regular-shaped conductors, or all irregular-shaped conductors, or a combination of regular-shaped conductors and irregular-shaped conductors, such as: the lead wire inside the lead wire assembly may be a lead wire assembly further synthesized by all cylindrical lead wires; or all the irregular strip-shaped leads are further combined into a lead assembly; or a cylindrical lead is used as a part of one part of the lead assembly and is matched with the sheet-shaped lead to synthesize the lead assembly; or a conductor assembly in which a portion of the square conductors are further combined with a portion of the irregular strip conductors.

As a preferred embodiment of this aspect, in the wire assembly, the resistance values of the wires are distributed in an arithmetic progression with a constant as a tolerance. In the embodiment, the characteristic that an arithmetic progression can be formed by using the resistance value of each wire is utilized, so that the current values of the circuit loop in which the wires are positioned are uniformly distributed, energy can be distributed in an arithmetic progression manner, and signals of different frequency bands can be better restored; and the inventor also finds out through experiments that, for example, the more the sound signals are in the same lead assembly, the smaller the resistance value difference between leads is, and the more the density, the smoother and the truer the sound signals conducted through the leads are.

In the two-layer aspect of the present invention, there is provided a conductor assembly as described in the one-layer aspect of the present invention. The specific embodiment of the technical scheme of the layer is as follows:

in one embodiment of this solution, as shown in fig. 1, it relates to a conducting device (1) with a lead assembly, comprising at least three lead assemblies (2,3, 4); the three lead assemblies (2,3,4) have the same structure, and the resistivity of the wires at the corresponding positions of the structure is consistent. In the embodiment, at least three lead assemblies are adopted and used together, so that the problems that interference is caused when a live wire and a zero wire enter and exit one by one, and signal distortion of different degrees is caused are solved; under the structure, in the conducting device connected under the same circuit, each wire assembly in each wire assembly has the same structure, and the resistivity of the wires at the corresponding positions of the structures is consistent, so that the zero line, the live line and the ground line in the same circuit have the same physical quantity, and different interference effects on signals in the conducting process are avoided.

In an embodiment of this embodiment, as shown in fig. 1, the conducting device (1) further includes a casing (5) for integrally covering the lead assembly (2) inside the conducting device (1). In this embodiment, the housing can integrate all the wire assemblies inside the device, facilitating the carrying, use and installation of the conduction device.

In an embodiment of the technical solution, as shown in fig. 1, two ends of the conducting device (1) are connected with wires for connecting to an external device in series, the external device includes a signal source device (6) and an external discharge device (7), any group of connecting wires of the conducting device is connected with an external line for use, wherein the external connection is selected from any one or a combination of a live wire, a zero wire and a ground wire. In the present embodiment, the "one group of connecting wires" refers to two connecting wires at both ends of the same wire assembly, and therefore, each group of connecting wires in the conducting device is connected to the external wiring of the external device in a one-to-one correspondence, and is not limited to various phases or lines of alternating current. In fig. 1, the conduction device (1) shown only leads out three groups of connecting wires to be respectively connected in series to an external connection (8), an external connection (9) and an external connection (10), and meanwhile, other connector posts are also left in a signal source device (6), which does not mean that the conduction device of the invention can only be connected to three external connections, but fig. 2 is only a combination structure of the conduction device of the invention and cannot limit the protection range of the invention.

The technical scheme of the three layers of the invention provides a preparation method of a conduction device with a lead assembly, which comprises the following specific operations:

in an embodiment of the present invention, a method for manufacturing a conductive device with a lead assembly includes the steps of preparing a lead assembly in step S1; the manufacturing method comprises the steps of preparing a wire assembly, selecting N wires with different resistance values and resistance values larger than 0, arranging the N wires in parallel to form a wire core, respectively connecting out connecting wires at two ends of the wire core, and finally covering a magnetic shielding material layer on the surface of the wire core. In this embodiment, the structural characteristics of the wire assembly are utilized, and corresponding process steps are adopted, so that the operation and application are realized.

In an embodiment of this embodiment, the method for manufacturing a conduction device with a lead assembly further includes step S2 of synthesizing the conduction device; and synthesizing the conducting device, assembling at least three same lead assemblies as a whole, reserving two ends of each lead assembly to be connected with leads, and coating the leads by using a shell to obtain the conducting device. In this embodiment, wire aggregate among the conduction device has the same structure, and the wire rod resistivity that the structure corresponds the position is unanimous, can realize through the cross cutting mode to wire aggregate's combination mode setting is favorable to the convenience in the installation use, makes the both ends connecting wire of outside access circuit and wire aggregate, and the pair is connected, in order to avoid causing the misconnection.

In an embodiment of the technical solution, as shown in fig. 3, the N wires are arranged and connected in parallel to form a wire core, that is, the length difference between the wires is shortened, the outer wall of the wire is coated with an insulator surface, and then all the wires are connected in parallel to form the wire core; when the length of the circumference (C) of the cross section of any one wire is greater than the length (L) of the wire, the wire is cut straight along the length (L) of the cross section (i.e., in a cylindrical state as shown in fig. 3), and then unfolded along the circumference (C) of the cross section (i.e., in a rectangular state as shown in fig. 3), so that the length of the circumference (C) of the cross section of the wire is connected in parallel with other wires. In the embodiment, the N leads of the lead assembly are arranged, so that the lengths of the leads in the same lead assembly can be relatively regular, and the leads are convenient to be connected in parallel; meanwhile, the space occupied by the finished wires is reduced, the overall volume of the product is reduced fundamentally, and the product is convenient to carry and use.

Example 1

The conducting device with the conducting wire aggregate is manufactured by taking a copper wire as a conducting wire material, and comprises three conducting wire aggregates, wherein the three conducting wire aggregates have the same structure, and the resistivity of wires at the corresponding positions of the structure is consistent.

The method comprises the following steps: preparing lead wire aggregates, wherein each lead wire of each lead wire aggregate has the following physical characteristics,

in the above table, the number of the conducting wires from No. 1 to No. 246 is 246 in total, and the conducting wires start from 1000mm in length and decrease with a tolerance of 1 mm; the diameter of the wire is increased by 1mm, and the wire is copper wire. Shortening the length difference between the wires, wherein the perimeter of the 5 wires is larger than the length of the 5 wires, so that the 5 wires are cut straight in the length direction and unfolded along the perimeter direction, the perimeter length of the wires is connected with other wires in parallel, the wires are arranged to form wire cores, the two ends of each wire core are respectively connected with connecting wires, and finally the surfaces of the wires are covered with magnetic shielding material layers.

According to the operation of the step, two wire assemblies with the same material selection and structure are manufactured.

Step two: synthesizing the conducting means. And (3) assembling the three wire assemblies prepared in the step one as a whole, keeping two ends of each wire assembly to be connected with wires, and coating the wire assemblies by using a shell to obtain the conduction device, wherein the total number of the wires is 5.

The device with the wire aggregate prepared by the method is connected in series between a signal source device and an external device, two ends of the three wire aggregates are connected with wires, and any one of a live wire, a zero wire and a ground wire of the external device is optionally connected with the same wire.

The signal with different frequencies is sent from the signal source device and is sent out through the conduction device, the frequency reduction performance of the signal sent out through the external device is high, and the signals with different frequencies can be reduced better.

The copper wires may be replaced with conductive materials such as gold, silver, aluminum, iron, etc., and the number of the wires is not limited to the number of the wires exemplified in the embodiment, and the number of the wires may be increased or decreased according to the implementation requirements.