阅读说明：本技术 一种基于H面微带探针的3mm组件气密结构 (3mm subassembly airtight structure based on H face microstrip probe ) 是由 丁浩 王欢 曾斌 罗亮平 罗洋 赵鸣霄 于 2021-07-16 设计创作，主要内容包括：本发明提供了一种基于H面微带探针的3mm组件气密结构,包括3mm组件盒体、波导密封窗、H面波导微带探针过渡结构、上腔体、盖板,所述H面波导微带探针过渡结构设置在3mm组件盒体内部,用于将从波导密封窗接收到的信号耦合到盒体内部的平面微带电路上；3mm组件盒体底部开口形成波导端口对外接口,并通过波导密封窗焊接密封；3mm组件盒体顶部通过盖板焊接密封。本发明利用密封窗自身玻璃的气密特性以及与盒体的配合焊接工艺阻断了空气进入组件内部的传输路径,实现气密性。(The invention provides a 3mm component airtight structure based on an H-surface microstrip probe, which comprises a 3mm component box body, a waveguide sealing window, an H-surface waveguide microstrip probe transition structure, an upper cavity and a cover plate, wherein the H-surface waveguide microstrip probe transition structure is arranged inside the 3mm component box body and is used for coupling a signal received from the waveguide sealing window to a planar microstrip circuit inside the box body; an opening at the bottom of the 3mm component box body forms a waveguide port external interface, and the waveguide port external interface is welded and sealed through a waveguide sealing window; the top of the 3mm component box body is welded and sealed through a cover plate. The invention utilizes the air tightness characteristic of the glass of the sealing window and the matching welding process of the sealing window and the box body to block the transmission path of air entering the assembly, thereby realizing the air tightness.)

1. A3 mm component airtight structure based on an H-surface microstrip probe is characterized by comprising a 3mm component box body, a waveguide sealing window, an H-surface waveguide microstrip probe transition structure, an upper cavity and a cover plate, wherein the H-surface waveguide microstrip probe transition structure is arranged inside the 3mm component box body and is used for coupling a signal received from the waveguide sealing window to a planar microstrip circuit inside the box body; an opening at the bottom of the 3mm component box body forms a waveguide port external interface, and the waveguide port external interface is welded and sealed through a waveguide sealing window; the top of the 3mm component box body is welded and sealed through a cover plate.

2. The H-plane microstrip probe-based 3mm component airtight structure according to claim 1, wherein the waveguide sealing window comprises a shell and filling glass, a through hole is formed in the middle of the shell, and the filling glass is filled in the through hole.

3. The H-plane microstrip probe-based 3mm assembly hermetic structure according to claim 1, wherein said housing is made of Kovar 4J29 and is surface-plated with gold.

4. The H-plane microstrip probe-based 3mm component airtight structure according to claim 1, wherein an installation groove with the same size as the waveguide sealing window is milled at the bottom opening of the 3mm component box body and used for installing the waveguide sealing window.

5. The H-plane microstrip probe-based 3mm component hermetic structure according to claim 1, wherein an overflow groove is provided around the mounting groove for soldering.

6. The H-plane microstrip probe-based 3mm component airtight structure according to claim 1, wherein the H-plane waveguide microstrip probe transition structure is bonded to the inner surface of the 3mm component box body by using conductive glue.

7. The H-plane microstrip probe-based 3mm component hermetic structure according to claim 1, wherein the cover plate is welded on the 3mm component box body by adopting a laser seal welding process.

Technical Field

The invention relates to the field of millimeter wave circuits, in particular to a 3mm component airtight structure based on an H-plane microstrip probe.

Background

An external universal interface of the 3mm component is a standard waveguide port, an internal circuit is a microstrip circuit convenient for chip integration, a waveguide microstrip probe transition structure is usually used for coupling signals from the waveguide port to a planar microstrip circuit, and the structure has an air channel and cannot prevent dust, water vapor and the like in the external environment from entering the component to pollute a bare chip in the component, so that the function of the bare chip is invalid. At present, the sealing of the component is mainly realized by the following two methods, but the real gas sealing of the component cannot be realized:

1. bonding and sealing the dielectric sheets

A dielectric sheet is usually selected to be bonded to a standard waveguide input/output port of a 3mm component, organic polytetrafluoroethylene, silica gel or inorganic ceramic dielectric sheet is selected as the dielectric sheet, the shape of the dielectric sheet is cut into the size of a standard waveguide port of 3mm, and the dielectric sheet is bonded to the waveguide port by glue. The material has poor air tightness, and the environment adaptability (high and low temperature, vibration and the like) of the component is poor due to gluing, so that the component can not really meet the air tightness requirement of the national military standard level.

2. External sealed window structure

The industry has had the circumscribed waveguide sealed window structure of 3mm frequency channel, can directly pass through the outside of fix with screw at 3mm subassembly. The structure can only realize sealing to a certain degree, and can achieve the waterproof function by adding a circle of waterproof gasket, but actually does not realize the air tightness requirement of the national military standard level, and cannot meet the engineering application of a 3mm component.

Disclosure of Invention

To the unable inside airtight problem of realizing the subassembly of 3mm subassembly, this paper provides one kind and can realize the airtight structure of 3mm subassembly, avoids the chip to receive the influence of adverse factors such as dust in the air, steam in the subassembly, improves the life of subassembly.

The technical scheme adopted by the invention is as follows: a3 mm component airtight structure based on an H-surface microstrip probe comprises a 3mm component box body, a waveguide sealing window, an H-surface waveguide microstrip probe transition structure, an upper cavity and a cover plate, wherein the H-surface waveguide microstrip probe transition structure is arranged inside the 3mm component box body and is used for coupling a signal received from the waveguide sealing window to a planar microstrip circuit inside the box body; an opening at the bottom of the 3mm component box body forms a waveguide port external interface, and the waveguide port external interface is welded and sealed through a waveguide sealing window; the top of the 3mm component box body is welded and sealed through a cover plate.

Furthermore, the waveguide sealing window comprises a shell and filling glass, wherein a through hole is formed in the middle of the shell, and the filling glass is filled in the through hole.

Further, the outer shell adopts kovar alloy 4J29, and is plated with gold on the surface.

Furthermore, an opening at the bottom of the 3mm component box body is milled with an installation groove with the same size as the waveguide sealing window, and the installation groove is used for installing the waveguide sealing window.

Furthermore, an overflow groove is arranged around the mounting groove and used for soldering tin.

Furthermore, the H-plane waveguide microstrip probe transition structure is bonded on the inner surface of the 3mm component box body by adopting conductive glue.

Furthermore, the cover plate is welded on the 3mm component box body by adopting a laser seal welding process.

Compared with the prior art, the beneficial effects of adopting the technical scheme are as follows: the invention utilizes the air tightness characteristic of the glass of the sealing window and the matching welding process of the sealing window and the box body to block the transmission path of air entering the assembly, thereby achieving the air tightness.

Drawings

FIG. 1 is a schematic view of an airtight structure according to the present invention

Fig. 2 is a schematic view of a waveguide seal window and its installation according to the present invention.

FIG. 3 is a graph of simulation results of insertion loss of a three-dimensional electromagnetic field according to the present invention.

FIG. 4 is a diagram of a simulation result of return loss of a three-dimensional electromagnetic field according to the present invention.

FIG. 5 is a graph showing the test results of the present invention.

Reference numerals: the device comprises a 1-3mm component box body, a 2-waveguide sealed window, a 3-H-plane waveguide microstrip probe transition structure, a 4-upper cavity, a 5-cover plate, a 6-mounting groove, a 7-overflow groove, an 8-shell and 9-filling glass.

Detailed Description

The invention is further described below with reference to the accompanying drawings.

Example 1

As shown in fig. 1, the invention provides a 3mm component airtight structure based on an H-plane microstrip probe, which comprises a 3mm component box body 1, a waveguide sealing window, an H-plane waveguide microstrip probe transition structure, an upper cavity and a cover plate, wherein the H-plane waveguide microstrip probe transition structure is arranged inside the 3mm component box body and is used for coupling a signal received from the waveguide sealing window to a planar microstrip circuit inside the box body; an opening at the bottom of the 3mm component box body forms a waveguide port external interface, and the waveguide port external interface is welded and sealed through a waveguide sealing window; the top of the 3mm component box body is sealed by welding through a cover plate, and the upper cavity is used for restraining signals.

Example 2

As shown in fig. 2, based on embodiment 1, the waveguide sealed window includes a housing and a filling glass, a through hole is formed in the middle of the housing, and the filling glass is filled in the through hole.

Example 3

On the basis of the embodiment 2, the outer shell adopts kovar alloy 4J29 and is plated with gold on the surface.

Example 4

On the basis of embodiment 3, an installation groove with the same size as the waveguide sealing window is milled at the opening at the bottom of the 3mm component box body and used for installing the waveguide sealing window. Compared with the traditional 3mm waveguide port, the installation groove (6) capable of installing the sealing window is milled on the outer side of the waveguide port during the box body machining process, the size of the installation groove is the same as that of the sealing window, so that the installation groove is convenient to tightly fit, and the assembly precision is guaranteed.

Example 5

On the basis of the embodiment 4, the periphery of the mounting groove is provided with the overflow groove, so that the welding is facilitated by the arrangement of the overflow groove, and the soldering tin is prevented from overflowing the surface of the component box body with the thickness of 3 mm.

Example 6

On the basis of embodiment 5, the transition structure of the H-plane waveguide microstrip probe is bonded to the inner surface of the 3mm component box body by conductive adhesive.

Example 7

On the basis of embodiment 6, the cover plate is welded on the 3mm component box body by adopting a laser seal welding process.

FIG. 3 and FIG. 4 are the simulation result diagram of the insertion loss of the three-dimensional electromagnetic field and the simulation result diagram of the return loss of the three-dimensional electromagnetic field respectively, which are established by the present invention, and it can be seen from the simulation results that the airtight structure can be in the bandwidth range of 85-102GHz, the present invention can realize the transmission characteristics of the insertion loss less than or equal to 0.5dB and the return superior to-18 dB. FIG. 5 is a schematic diagram of the test results, in the bandwidth range of 82-98GHz, the back-to-back insertion loss is less than or equal to 2.5dB, the single-side insertion loss is less than or equal to 1.25dB, and the air leakage rate is less than or equal to 1 x 10-9 Pa.m 3/s through the test, thereby achieving the national military standard.

The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed. Those skilled in the art to which the invention pertains will appreciate that insubstantial changes or modifications can be made without departing from the spirit of the invention as defined by the appended claims.

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.