阅读说明：本技术 一种麦克风 (Microphone ) 是由 林圆绍 周宗磷 卓彦萱 邱冠勋 于 2021-08-27 设计创作，主要内容包括：本申请提供了一种麦克风,包括振膜和背极板,所述背极板包括同电位区域和第一开孔区域,所述第一开孔区域环绕所述同电位区域设置,所述第一开孔区域上均匀开设有多个第一声学孔,所述同电位区域被配置为与所述振膜同电位,所述同电位区域和所述第一开孔区域之间绝缘设置。本申请通过对麦克风进行改进,使背极板的同电位区域和振膜的同电位区域呈同电位设置,大大减小了寄生电容的形成,从而实现提高麦克风声学性能的效果。(The application provides a microphone, including vibrating diaphragm and backplate, the backplate includes with electric potential region and first trompil region, first trompil regional encircleing with electric potential region setting, a plurality of first acoustics holes have evenly been seted up in the first trompil region, with electric potential region configuration with the vibrating diaphragm with the electric potential, with electric potential region with insulating setting between the first trompil region. This application is through improving the microphone, makes the regional with the electric potential of the same electric potential of back plate and vibrating diaphragm be with the electric potential setting, has reduced parasitic capacitance's formation greatly to the realization improves the effect of microphone acoustic performance.)

1. The microphone is characterized by comprising a vibrating diaphragm and a back plate, wherein the back plate comprises a same-potential area and a first opening area, the first opening area is arranged around the same-potential area, a plurality of first acoustic holes are uniformly formed in the first opening area, the same-potential area is configured to be at the same potential with the vibrating diaphragm, and the same-potential area and the first opening area are arranged in an insulating mode.

2. The microphone of claim 1, wherein a first PAD and a second PAD are disposed on the microphone, the diaphragm and the common potential region are electrically connected to the first PAD, the first opening region and the second PAD are electrically connected, and the first PAD and the second PAD have different potentials.

3. The microphone of claim 2, wherein the backplate is further provided with a first conductive layer and a second conductive layer, the first PAD and the common potential region are electrically connected through the first conductive layer, the first conductive layer extends from the common potential region to the edge of the backplate until being connected with the first PAD, the second PAD and the first opening region are electrically connected through the second conductive layer, and the second conductive layer extends from the first opening region to the second PAD.

4. The microphone of claim 3, wherein the first conductive layer and the second conductive layer have an included angle therebetween, and the first conductive layer and the first opening region are disposed in an insulating manner.

5. The microphone of claim 1, wherein the backplate and the diaphragm are disposed parallel and coaxially, and the equipotential region is disposed on an axis of the backplate.

6. The microphone of claim 1, wherein an edge of the back plate is a second opening region, the second opening region is insulated from the first opening region, the second opening region is disposed on an outer peripheral side of the first opening region, and the second opening region is uniformly provided with a plurality of second acoustic holes.

7. The microphone of claim 1, wherein the first acoustic holes are all the same in shape and size.

8. The microphone of claim 1, wherein the backplate is in a centrosymmetric pattern.

9. The microphone of claim 1, wherein the equipotential region has at least one third acoustic hole formed therein.

10. The microphone of claim 1, further comprising a housing, an ASIC chip, and a microphone chip, wherein the housing has a through hole, the ASIC chip and the microphone chip are disposed in the housing, and the diaphragm and the backplate are disposed in the microphone chip.

Technical Field

The application belongs to the technical field of microphones, and particularly relates to a microphone.

Background

A microphone is an important component of electronic equipment, and the microphone is a transducer for converting an acoustic signal into an electrical signal, and is widely applied to electronic products such as mobile phones and notebook computers. With the continuous development of electronic devices, the functions are enriched, and the sound receiving effect of the microphone on the electronic device is higher and higher for users.

Taking a Micro Electro Mechanical System (MEMS) microphone as an example, the MEMS microphone is a capacitor structure formed between a diaphragm and a back plate. After the diaphragm senses an external audio sound pressure signal, the distance between the diaphragm and the back plate is changed, the capacitance capacity and the voltage are changed, and the capacitance change is converted into the change of a voltage signal through a subsequent ASIC chip and is output.

However, in the microphone of the prior art, a parasitic capacitance is formed between the diaphragm and the back plate in the vibration process of the diaphragm, and the parasitic capacitance greatly reduces the signal-to-noise ratio of a chip in the microphone, thereby affecting the acoustic performance of the microphone.

Therefore, there is a need for an improved microphone structure to solve the problem of the prior art that the formation of parasitic capacitance between the diaphragm and the backplate affects the acoustic performance of the microphone.

Disclosure of Invention

The application aims to provide a microphone to solve the problem that the acoustic performance of the microphone is affected by a parasitic capacitor formed between a vibrating diaphragm and a back plate in the prior art.

The application provides a microphone, including vibrating diaphragm and backplate, the backplate includes with electric potential region and first trompil region, first trompil regional encircleing with electric potential region setting, a plurality of first acoustics holes have evenly been seted up in the first trompil region, with electric potential region configuration with the vibrating diaphragm with the electric potential, with electric potential region with insulating setting between the first trompil region.

Optionally, a first PAD and a second PAD are further disposed on the microphone, the diaphragm and the same-potential area are electrically connected to the first PAD, the first opening area is electrically connected to the second PAD, and potentials of the first PAD and the second PAD are different.

Optionally, a first conducting layer and a second conducting layer are further disposed on the back plate, the first PAD and the same potential region are electrically connected through the first conducting layer, the first conducting layer extends from the same potential region to the edge of the back plate until being connected with the first PAD, the second PAD and the first opening region are electrically connected through the second conducting layer, and the second conducting layer extends from the first opening region to the second PAD.

Optionally, an included angle is formed between the first conductive layer and the second conductive layer, and the first conductive layer and the first opening region are arranged in an insulating manner.

Optionally, the back plate and the diaphragm are arranged in parallel and coaxially, and the same-potential area is arranged on an axis of the back plate.

Optionally, an edge of the back plate is a second opening region, the second opening region and the first opening region are arranged in an insulating manner, the second opening region is arranged on the outer peripheral side of the first opening region, and a plurality of second acoustic holes are uniformly formed in the second opening region.

Optionally, the first acoustic holes are all the same in shape and size.

Optionally, the back plate is in a centrosymmetric pattern.

Optionally, at least one third acoustic hole is formed in the equipotential region.

Optionally, the microphone further includes a casing, an ASIC chip and a microphone chip, the casing is provided with a through hole, the ASIC chip and the microphone chip are disposed in the casing, and the diaphragm and the back plate are disposed in the microphone chip.

This application is through improving the microphone, makes the regional with the electric potential of the same electric potential of back plate and vibrating diaphragm be with the electric potential setting, has reduced parasitic capacitance's formation greatly to the realization improves the effect of microphone acoustic performance.

Further features of the present application and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which is to be read in connection with the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.

Fig. 1 is a schematic structural diagram of a microphone according to an embodiment of the present disclosure;

FIG. 2 is a schematic structural diagram of a back plate according to an embodiment of the present disclosure;

fig. 3 is a second schematic structural diagram of a back plate according to the present embodiment;

fig. 4 is a third schematic structural diagram of a back plate according to the present embodiment;

fig. 5 is a fourth schematic structural diagram of a back plate according to the present embodiment.

Reference numerals:

1. vibrating diaphragm; 2. a back plate; 21. a region of the same potential; 211. a third acoustic aperture; 22. a first opening region; 221. a first acoustic aperture; 23. a second open pore area; 231. a second acoustic aperture; 24. a first conductive layer; 25. a second conductive layer; 3. a first PAD; 4. a second PAD.

Detailed Description

Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the application, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

As shown in fig. 1 to 5, the present application provides a microphone, including a diaphragm 1 and a backplate 2, the backplate 2 includes a common potential region 21 and a first opening region 22, the first opening region 22 is disposed around the common potential region 21, a plurality of first acoustic holes 221 are uniformly formed on the first opening region 22, the common potential region 21 is configured to have the same potential as the diaphragm 1, and the common potential region 21 and the first opening region 22 are disposed in an insulating manner. The back plate 2 of the microphone is fixedly arranged, the first acoustic hole 221 in the back plate 2 can be used for air circulation, the back plate 2 and the vibrating diaphragm 1 are respectively electrified, and a capacitor structure is formed between the back plate 2 and the vibrating diaphragm 1. Following microphone of radio mode is for example, when the user speaks and produces the air current, the air current produces the impact to vibrating diaphragm 1, makes vibrating diaphragm 1 produce the vibration, and then makes the distance between vibrating diaphragm 1 and the back plate 2 produce the change to change the electric capacity and the voltage in the capacitor structure, change the voltage signal output with the change of electric capacity through subsequent ASIC chip again, thereby realize the conversion of the signal of telecommunication of sound signal, wherein vibrating diaphragm 1 and back plate 2 all can adopt the silicon material to make. Wherein, because vibrating diaphragm 1 can produce the change of atmospheric pressure at the vibration in-process, the air between backplate 2 and vibrating diaphragm 1 passes through the discharge that first trompil region 22 can be smooth and easy, reduces the influence of air resistance to vibrating diaphragm 1, improves the acoustic performance of microphone.

Specifically, in the embodiment of the present application, the same potential region 21 and the same potential of the diaphragm 1 are set, so that the generation of the parasitic capacitance between the back plate 2 and the diaphragm 1 can be effectively reduced, and the influence of the parasitic capacitance on other chip structures in the microphone can be further reduced, thereby improving the acoustic performance of the microphone. In order to avoid that the whole structure of the back plate 2 is disposed at the same potential as the diaphragm 1, an insulation process is required between the same potential region 21 and the first opening region 22, for example, an insulation layer is disposed between the same potential region 21 and the first opening region 22.

Optionally, a first PAD3 and a second PAD4 are further disposed on the microphone, the diaphragm 1 and the same potential region 21 are electrically connected to the first PAD3, the first open-hole region 22 is electrically connected to the second PAD4, and the first PAD3 and the second PAD4 have different potentials. The diaphragm 1 and the same potential area 21 are powered through the first PAD3 to ensure that the diaphragm 1 and the same potential area 21 are set at the same potential, the first open hole area 22 and the second PAD4 are electrically connected, and since the potentials of the first PAD3 and the second PAD4 are different, the potentials between the corresponding diaphragm 1 and the first open hole area 22 are also different, so that a capacitor structure is formed between the diaphragm 1 and the back plate 2. After the vibrating diaphragm 1 is affected by external airflow to generate vibration, the distance between the vibrating diaphragm 1 and the back plate 2 changes, so that the current and the voltage in the capacitor structure change, and the change of the capacitor is converted into a voltage signal through the ASIC chip and is output. When the diaphragm 1 generates nonlinear vibration, a parasitic capacitance is easily generated between the diaphragm 1 and the back plate 2, and the parasitic capacitance affects the signal-to-noise ratio of, for example, an ASIC chip or other chips, thereby causing an error in the electrical signal output by the microphone and reducing the acoustic performance of the microphone. By connecting both the equipotential region 21 and the diaphragm 1 to the first PAD3, the problem is solved, and the generation of parasitic capacitance is reduced greatly, thereby improving the acoustic performance of the microphone.

Optionally, a first conductive layer 24 and a second PAD4 conductive layer 25 are further disposed on the back plate 2, the first PAD3 and the common potential region 21 are electrically connected through the first conductive layer 24, the first conductive layer 24 extends from the common potential region 21 to the edge of the back plate 2 until being connected to the first PAD3, the second PAD4 and the first opening region 22 are electrically connected through the second PAD4 conductive layer 25, and the second PAD4 conductive layer 25 extends from the first opening region 22 to the second PAD 4. In order to avoid affecting the stability of the capacitance between the diaphragm 1 and the back plate 2 and the accuracy of the capacitance when the capacitance changes, the first conducting layer 24 and the second PAD4 conducting layer 25 are arranged as a part of the electrode plate, so that the first conducting layer 24 and the second PAD4 conducting layer 25 are prevented from passing between the back plate 2 and the diaphragm 1, and the possibility of generating parasitic capacitance is reduced. While the first 24 and second PAD4 conductive layers 25 are also well able to provide power to the equipotential region 21 and the first open area 22.

Optionally, the first conductive layer 24 and the second PAD4 conductive layer 25 have an angle therebetween, and the first conductive layer 24 and the first open area 22 are disposed in an insulated manner. In order to avoid the entanglement of the first conductive layer 24 and the second PAD4 conductive layer 25 in the region outside the back plate 2, which results in the microphone structure being damaged and unusable, the first PAD3 and the second PAD4 are disposed at different positions inside the microphone, and a certain angle is formed between the first conductive layer 24 and the second PAD4 conductive layer 25. Meanwhile, in order to avoid dangerous situations such as disconnection, insulation is set between the first conductive layer 24 and the first opening region 22, and different potential settings between the first opening region 22 and the diaphragm 1 can be well ensured.

Optionally, the back plate 2 and the diaphragm 1 are disposed in parallel and coaxially, and the homopotential region 21 is disposed on an axis of the back plate 2. The back plate 2 and the vibrating diaphragm 1 which are arranged in parallel can enable the air circulation between the back plate 2 and the vibrating diaphragm 1 to be more stable in the vibration process, the air resistance is reduced, the signal to noise ratio is improved, and the acoustic performance of the microphone is further improved. Meanwhile, the homopotential region 21 and the back plate 2 are coaxially arranged, that is, the homopotential region 21 corresponds to the central region of the diaphragm 1. In the vibrating process of the vibrating diaphragm 1, parasitic capacitance is most easily generated on the axial line positions of the vibrating diaphragm 1 and the back plate 2, and the same potential area 21 is correspondingly arranged on the axial line position of the back plate 2, so that the generation of the parasitic capacitance is further reduced, and the signal-to-noise ratio of the microphone is improved.

Optionally, a second opening region 23 is disposed at an edge of the back plate 2, the second opening region 23 is disposed in an insulating manner with the first opening region 22, the second opening region 23 is disposed on an outer peripheral side of the first opening region 22, and a plurality of second acoustic holes 231 are uniformly formed in the second opening region 23. When vibrating diaphragm 1 produced the vibration, can produce the change of atmospheric pressure, in order to guarantee the smooth and easy nature of vibrating diaphragm 1 vibration, so set up second trompil region 23 at the edge of backplate 2 to set up a plurality of second acoustics holes 231 on second trompil region 23, make vibrating diaphragm 1 can be more smooth and easy at the vibration in-process. The first conductive layer 24 sequentially passes through the first opening region 22 and the second opening region 23 from the same potential region 21 to extend to the outside of the body of the back plate 2, and is electrically connected to the first PAD3, and the first conductive layer 24 and the first opening region 22 and the second opening region 23 are insulated. The second PAD4 conductive layer 25 extends out of the body of the back plate 2 through the second opening region 23 and is electrically connected with the second PAD4, and the second PAD4 conductive layer 25 and the second opening region 23 are insulated.

Alternatively, the first acoustic holes 221 may have the same shape and size. In order to ensure that the vibration of the airflow driven by the sound can be more stably and uniformly received by the diaphragm 1 during the speaking or recording process of the user, the shapes and the sizes of the plurality of first acoustic holes 221 are set to be the same, so as to further improve the acoustic performance of the microphone.

Optionally, the first acoustic hole 221 is a regular polygon. The regular polygon-shaped acoustic holes can reduce the distance between the first acoustic holes 221, so that the reciprocating motion of air outlet and air inlet between the diaphragm 1 and the back plate 2 can be better weakened, and the noise is further reduced. Meanwhile, the specific shape of the first acoustic hole 221 may also be a circular first acoustic hole 221 or other shapes of the first acoustic hole 221.

Optionally, the back plate 2 is a centrosymmetric pattern. The centrosymmetric pattern is convenient to install, the structure is more stable, and the stability of the back plate 2 can be ensured when the microphone falls or collides.

Optionally, the back plate 2 and the equipotential region 21 are both circular. The diaphragm 1 is generally designed to be circular, while the circular back plate 2 and the same-potential region 21 can better correspond to the diaphragm 1, and the circular same-potential region 21 can better suppress the generation of parasitic capacitance.

Optionally, as shown in fig. 4 and 5, at least one third acoustic hole 211 is opened on the equipotential region 21. The third acoustic hole 211 formed in the same potential area 21 is respectively matched with the first acoustic hole 221 and the second acoustic hole 231, so that air is rapidly discharged from between the diaphragm 1 and the back plate 2 in the vibration process of the diaphragm 1, the resistance of the air to the diaphragm 1 is reduced, the fluency of the vibration process of the diaphragm 1 is ensured, meanwhile, the generation of parasitic capacitance can be inhibited in an auxiliary manner, and the acoustic performance of the microphone is further improved.

Specifically, the specific shapes of the first acoustic hole 221, the second acoustic hole 231, and the third acoustic hole 211 in the embodiment of the present application are only an implementation, for example, the shapes of the first acoustic hole 221, the second acoustic hole 231, and the third acoustic hole 211 are all regular pentagons, and the sizes of the first acoustic hole 221, the second acoustic hole 231, and the third acoustic hole 211 are the same. However, in the practical application process, according to different specific structures of the microphone, the shapes of the first acoustic hole 221, the second acoustic hole 231, and the third acoustic hole 211 may also be changed, for example, a circle, a triangle, etc. may achieve the effect of rapidly discharging the air between the diaphragm 1 and the back plate 2. And the plurality of first acoustic holes 221, the plurality of second acoustic holes 231, and the plurality of third acoustic holes 211 may be designed with different shapes and sizes therebetween. Meanwhile, the specific shape of the equipotential region 21 is only a circle in the present application as the most preferable embodiment, but the shape and size of the equipotential region 21 can be adjusted according to microphones with different structures, and those skilled in the art can make appropriate adjustments.

Optionally, as shown in fig. 1, the microphone further includes a casing, an ASIC chip, and a microphone chip, a through hole is formed in the casing, the ASIC chip and the microphone chip are disposed in the casing, and the diaphragm 1 and the back plate 2 are disposed in the microphone chip. ASIC chip and microphone chip all set up in the casing, and the casing can avoid ASIC chip and microphone chip to receive destruction as outer protective structure. For a microphone with a sound receiving mode, the positions of the diaphragm 1 and the back plate 2 correspond to the through hole, and the distance between the back plate 2 and the through hole is greater than the distance between the diaphragm 1 and the through hole. The through-hole gets into the passageway in the casing as outside air current, and the air current produces the impact to vibrating diaphragm 1 behind the through-hole, makes vibrating diaphragm 1 take place deformation to make electric capacity, the voltage between vibrating diaphragm 1 and the back plate 2 produce the change, and collect the change of capacitance voltage through the ASIC chip, and then the realization is the signal of telecommunication with acoustic signal conversion. Because the parasitic capacitance between the back plate 2 and the diaphragm 1 is greatly reduced, the overall acoustic performance of the microphone is significantly improved.

Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present application. The scope of the application is defined by the appended claims.