阅读说明：本技术 一种基于焊锡热导率测试的微波产品热仿真方法 (Microwave product thermal simulation method based on soldering tin thermal conductivity test ) 是由 王丽菊 刘德喜 史磊 贾建鹏 高倩 唐统帅 管浩东 于 2021-08-30 设计创作，主要内容包括：本发明提供一种基于焊锡热导率测试的微波产品热仿真方法,首先测试焊锡的热导率,将温度传感器固定在待测产品的芯片上表面和盒体内表面,将待测产品放置在液冷测试架并使待测产品分别与功率计和电源连接；当待测产品到达热稳态后,根据温度传感器的温度值和功率,计算得到焊锡层的热导率,然后进行热仿真。本方法使基于焊锡的热导率进行产品热仿真的仿真结果更可靠,通过测试精确计算出不同种类焊锡热导率,有效提高微波产品组件热仿真结果准确性,特别是微波产品微组装过程中使用不同种类焊料片的情况下,对微波产品工作过程中温升进行可靠预判,并最终有效保证微波产品中元器件使用寿命,进一步提高产品热仿真对产品使用可靠性的现实指导意义。(The invention provides a microwave product thermal simulation method based on soldering tin thermal conductivity test, which comprises the steps of firstly testing the thermal conductivity of soldering tin, fixing a temperature sensor on the upper surface of a chip of a product to be tested and the inner surface of a box body, placing the product to be tested on a liquid cooling test frame and connecting the product to be tested with a power meter and a power supply respectively; and when the product to be tested reaches a thermal stable state, calculating the thermal conductivity of the soldering tin layer according to the temperature value and the power of the temperature sensor, and then carrying out thermal simulation. The method ensures that the simulation result of the thermal simulation of the product based on the thermal conductivity of the soldering tin is more reliable, the thermal conductivity of different types of soldering tin is accurately calculated through testing, the accuracy of the thermal simulation result of the microwave product assembly is effectively improved, particularly, under the condition that different types of soldering tin pieces are used in the micro-assembly process of the microwave product, the reliable prejudgment is carried out on the temperature rise of the microwave product in the working process, the service life of components in the microwave product is finally effectively ensured, and the practical guiding significance of the thermal simulation of the product on the use reliability of the product is further improved.)

1. A microwave product thermal simulation method based on soldering tin thermal conductivity test is characterized in that: the method comprises the following steps:

s1, testing the solder thermal conductivity: connecting a microwave product (1) to be tested with a soldering tin heat conductivity testing device, obtaining a testing result after the microwave product (1) to be tested enters a stable state, and calculating the heat conductivity lambda of soldering tin;

s2, thermal simulation: adding the thermal conductivity lambda into the solder material parameter setting of the simulation software, newly building a solder material, setting simulation boundary conditions, finally obtaining a thermal simulation result of the microwave product (1) to be tested, and evaluating and optimizing the thermal performance of the microwave product (1) to be tested according to the thermal simulation result.

2. The microwave product thermal simulation method based on the solder thermal conductivity test according to claim 1, characterized in that: step S1 includes:

s11, connecting the devices: fixing a first temperature sensor (2) on the upper surface of a chip (11), fixing a second temperature sensor (3) on the inner surface of a box body (12), connecting the first temperature sensor (2) and the second temperature sensor (3) with a multifunctional switch controller (4), placing the microwave product (1) to be tested on a liquid cooling test frame (5) and connecting the microwave product (1) to be tested with a power meter (6) and a power supply (7) respectively;

s12, electrifying: electrifying each component to enable the microwave product (1) to be tested to be in a working state;

s13, reading and calculating the solder thermal conductivity: when the numerical value displayed by the power meter (6) is stable, namely the microwave product (1) to be tested reaches a thermal stable state, the temperature value T of the first temperature sensor (2) displayed by the multifunctional switch controller (4) is recorded at the same time₁A temperature value T of the second temperature sensor (3)₂And the power P displayed by the power meter (6), calculating the thickness L and the sectional area A of the soldering tin layer (13), and calculating the heat conductivity lambda of the soldering tin layer (13) according to the following formula:

3. the microwave product thermal simulation method based on the solder thermal conductivity test according to claim 1, characterized in that: in the step S1, the microwave product (1) to be tested includes a box body (12), a chip (11) disposed at the bottom of the inner surface of the box body (12), and a solder layer (13) for fixing the chip (11) in the box body (12), and the second temperature sensor (3) is located on one side of the solder layer (13).

4. The microwave product thermal simulation method based on the solder thermal conductivity test according to claim 1, characterized in that: in step S2, the simulation boundary conditions include the material, the heat dissipation form, the heat source position and size, and the thermal simulation form of the microwave product (1) to be tested.

5. The microwave product thermal simulation method based on the solder thermal conductivity test according to claim 2, characterized in that: the first temperature sensor (2) is a thermocouple wire.

6. The microwave product thermal simulation method based on the solder thermal conductivity test according to claim 2, characterized in that: the second temperature sensor (3) is a thermocouple wire.

7. The microwave product thermal simulation method based on the solder thermal conductivity test according to claim 2, characterized in that: in the step S11, the microwave product (1) to be tested is connected with the power meter (6) through a wire, and the microwave product (1) to be tested is connected with the power supply (7) through a wire.

8. The microwave product thermal simulation method based on the solder thermal conductivity test according to claim 2, characterized in that: in step S11, the microwave product (1) to be tested is fixed to the liquid cooling test rack (5) by screws.

9. The microwave product thermal simulation method based on the solder thermal conductivity test according to claim 2, characterized in that: in step S11, the liquid cooling test rack (5) is a cold plate that keeps the temperature of the mounting surface of the microwave product (1) to be tested constant.

10. The microwave product thermal simulation method based on the solder thermal conductivity test according to claim 2, characterized in that: in step S13, the cross-sectional area a is calculated from the length and width of the chip (11).

Technical Field

The invention relates to the technical field of measurement and testing, in particular to a microwave product thermal simulation method based on soldering tin thermal conductivity testing.

Background

With the technical development of microwave assembly products, various indexes of the microwave assembly are required to be improved continuously, and components inside the assembly are developed towards the direction of miniaturization and high power consumption continuously. The improvement of the system integration level inevitably brings the sharp increase of the heat flux density in the product, and the temperature rise generated in the use process of the product can influence the service life of devices such as a bare chip and the like, so that the reliability of the product in the use process can be improved to a great extent by pre-judging and analyzing the thermal performance of the product by means of a thermal simulation technology.

The solder thermal conductivity is used as an important parameter influencing a simulation result in the thermal simulation process, and is particularly important for the accuracy of the simulation result. Therefore, a method which is simple to operate and can accurately calculate the soldering tin thermal conductivity is found, and the method has important significance for improving the accuracy of the product thermal simulation result and finally prolonging the service life of the product.

Disclosure of Invention

The invention aims to solve the problem of accuracy of a thermal simulation result, and provides a microwave product thermal simulation method based on soldering tin thermal conductivity test.

The invention provides a microwave product thermal simulation method based on soldering tin thermal conductivity test, which comprises the following steps:

s1, testing the solder thermal conductivity: connecting the microwave product to be tested with a soldering tin heat conductivity testing device, obtaining a testing result after the microwave product to be tested enters a stable state, and calculating the heat conductivity lambda of soldering tin;

s2, thermal simulation: adding the thermal conductivity lambda into the solder material parameter setting of the simulation software, newly building a solder material, setting simulation boundary conditions, finally obtaining a thermal simulation result of the microwave product to be tested, and evaluating and optimizing the thermal performance of the microwave product to be tested according to the thermal simulation result.

The invention relates to a microwave product thermal simulation method based on soldering tin thermal conductivity test, and as a preferable mode, the step S1 comprises the following steps:

s11, connecting the devices: fixing a first temperature sensor on the upper surface of a chip, fixing a second temperature sensor on the inner surface of a box body, connecting the first temperature sensor and the second temperature sensor with a multifunctional switch controller, placing a microwave product to be tested on a liquid cooling test frame and connecting the microwave product to be tested with a power meter and a power supply respectively;

s12, electrifying: electrifying each component to enable the microwave product to be tested to be in a working state;

s13, reading and calculating the solder thermal conductivity: when the numerical value displayed by the power meter is stable, namely the microwave product to be measured reaches a thermal stable state, the temperature value T of the first temperature sensor displayed by the multifunctional switch controller is recorded at the same time₁Temperature value T of the second temperature sensor₂And calculating the thickness L and the sectional area A of the soldering tin layer according to the power P displayed by the power meter, and calculating the thermal conductivity lambda of the soldering tin layer according to the following formula:

according to the microwave product thermal simulation method based on the soldering tin thermal conductivity test, as a preferred mode, in step S1, a microwave product to be tested comprises a box body, a chip arranged at the bottom of the inner surface of the box body and a soldering tin layer for fixing the chip in the box body, and a second temperature sensor is located on one side of the soldering tin layer.

According to the microwave product thermal simulation method based on the soldering tin thermal conductivity test, as a preferred mode, in step S2, simulation boundary conditions comprise materials, heat dissipation forms, heat source positions and sizes and thermal simulation forms of microwave products to be tested.

According to the microwave product thermal simulation method based on the soldering tin thermal conductivity test, as a preferred mode, the first temperature sensor is a thermocouple wire.

According to the microwave product thermal simulation method based on the soldering tin thermal conductivity test, as a preferred mode, the second temperature sensor is a thermocouple wire.

According to the microwave product thermal simulation method based on the soldering tin thermal conductivity test, as a preferred mode, in step S11, a microwave product to be tested is connected with a power meter through an additional wire, and the microwave product to be tested is connected with a power supply through an additional wire.

According to the microwave product thermal simulation method based on the soldering tin thermal conductivity test, as a preferred mode, in step S11, a microwave product to be tested and a liquid cooling test frame are fixed through screws.

According to the microwave product thermal simulation method based on the soldering tin thermal conductivity test, as a preferred mode, in step S11, the liquid cooling test frame is a cold plate which enables the temperature of the mounting surface of the microwave product to be tested to be constant.

According to the microwave product thermal simulation method based on the solder thermal conductivity test, as a preferable mode, in step S13, the sectional area A is obtained by calculating the length and the width of a chip.

The technical solution of the invention is as follows: a microwave product thermal simulation method based on soldering tin thermal conductivity test comprises the following steps:

(1) preparing the following related test equipment and products to be tested: liquid cooling test jig, power, dynamometer, thermocouple wire, power line, multi-functional switch controller, the product that awaits measuring.

(2) And interconnecting related test equipment and a product to be tested, and loading two temperature test points, namely the upper surface of the chip and the inner surface of the product box body, in the product to be tested.

(3) And opening each testing device to enable the product to be tested to be in a working state. As the working time of the chip increases, the heat generated by the chip increases, and the display values on the power meter and the multifunctional switch controller change. And after the numerical value of the power meter is displayed stably, indicating that the product reaches a thermal stable state, and respectively reading the temperature values of two temperature test points in the product to be tested.

(4) According to the definition of the thermal conductivity of the material: two parallel planes with an area of 1 square meter and a distance of 1 meter are taken in the object perpendicular to the heat conducting direction, and if the temperature difference between the two planes is 1K, the heat conducted from one plane to the other plane in 1 second is defined as the thermal conductivity of the substance. The calculation formula of the thermal conductivity of the material can be obtained as follows:

and calculating the heat conductivity of the soldering tin in the microwave component product.

(5) And optimizing material parameters in thermal simulation through the tested soldering tin thermal conductivity, performing thermal simulation on the microwave product and obtaining a simulation result.

Compared with the prior art, the invention has the beneficial effects that:

(1) the testing method for the soldering tin thermal conductivity for the micro-assembly of the microwave product is convenient and easy to find testing equipment, simple and feasible, and capable of guaranteeing the accuracy of a testing value, enabling a simulation result of product thermal simulation based on the parameter to be more reliable, and further improving the practical guiding significance of the product thermal simulation on the use reliability of the product.

(2) The testing method can realize real-time testing of the soldering tin heat conductivity in different microwave component products, guarantee the accuracy of the setting of the boundary condition soldering tin heat conductivity parameter in the thermal simulation process, and accurately evaluate the heat dissipation condition of the product and the reliability of the product in long-time work.

Drawings

FIG. 1 is a flow chart of a microwave product thermal simulation method based on a solder thermal conductivity test;

FIG. 2 is a flowchart of a microwave product thermal simulation method step S1 based on a solder thermal conductivity test;

FIG. 3 is a schematic diagram of the position of a temperature test point of a microwave product thermal simulation method based on a soldering tin thermal conductivity test;

FIG. 4 is a top view of a temperature test point of a microwave product thermal simulation method based on a soldering tin thermal conductivity test;

FIG. 5 is a schematic structural diagram of a microwave product to be tested based on a microwave product thermal simulation method for solder thermal conductivity testing;

FIG. 6 is a diagram of instrument and equipment types and connection relations of a microwave product thermal simulation method based on a soldering tin thermal conductivity test;

FIG. 7 is a schematic diagram of the establishment of soldering tin parameters in the thermal simulation process of a microwave product to be tested by a microwave product thermal simulation method based on soldering tin thermal conductivity test;

FIG. 8 is a schematic diagram of a product thermal simulation result obtained by adding a test to a microwave product thermal simulation method based on a soldering tin thermal conductivity test to obtain soldering tin thermal conductivity parameters.

Reference numerals:

1. a product to be tested; 11. a chip; 12. a box body; 13. a solder layer; 2. a first temperature sensor; 3. a second temperature sensor; 4. a multi-function switch controller; 5. liquid cooling test frame; 6. a power meter; 7. a power source.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Example 1

As shown in fig. 1, a microwave product thermal simulation method based on solder thermal conductivity test includes the following steps:

s1, testing the solder thermal conductivity: connecting the microwave product 1 to be tested with a soldering tin heat conductivity testing device, obtaining a testing result after the microwave product 1 to be tested enters a stable state, and calculating the heat conductivity lambda of soldering tin;

s2, thermal simulation: adding the heat conductivity lambda into the solder material parameter setting of the simulation software, newly building a solder material, setting simulation boundary conditions, finally obtaining a thermal simulation result of the microwave product 1 to be tested, and evaluating and optimizing the thermal performance of the microwave product 1 to be tested according to the thermal simulation result.

Example 2

As shown in fig. 1, a microwave product thermal simulation method based on solder thermal conductivity test includes the following steps:

s1, testing the solder thermal conductivity: connecting the microwave product 1 to be tested with a soldering tin heat conductivity testing device, obtaining a testing result after the microwave product 1 to be tested enters a stable state, and calculating the heat conductivity lambda of soldering tin;

as shown in fig. 2-6, S11, device connection: fixing a first temperature sensor 2 on the upper surface of a chip 11, fixing a second temperature sensor 3 on the inner surface of a box body 12, connecting the first temperature sensor 2 and the second temperature sensor 3 with a multifunctional switch controller 4, placing a microwave product 1 to be tested on a liquid cooling test rack 5, and respectively connecting the microwave product 1 to be tested with a power meter 6 and a power supply 7;

the microwave product 1 to be tested comprises a box body 12, a chip 11 arranged at the bottom of the inner surface of the box body 12 and a soldering tin layer 13 for fixing the chip 11 in the box body 12, wherein the second temperature sensor 3 is positioned at one side of the soldering tin layer 13;

the first temperature sensor 2 is a thermocouple wire; the second temperature sensor 3 is a thermocouple wire; the microwave product 1 to be tested is connected with the power meter 6 through a wire; the microwave product 1 to be tested is connected with the power supply 7 through an additional wire; the microwave product 1 to be tested is fixed with the liquid cooling test rack 5 through screws; the liquid cooling test frame 5 is a cold plate which enables the temperature of the mounting surface of the microwave product 1 to be tested to be constant;

s12, electrifying: electrifying each component to enable the microwave product 1 to be tested to be in a working state;

s13, reading and calculating the solder thermal conductivity: when the value displayed by the power meter 6 is stableAfter the microwave product 1 reaches the thermal steady state, the temperature value T of the first temperature sensor 2 displayed by the multifunctional switch controller 4 is recorded at the same time₁Temperature value T of second temperature sensor 3₂And the power P displayed by the power meter 6, calculating the thickness L and the sectional area A of the soldering tin layer 13, and calculating the heat conductivity lambda of the soldering tin layer 13 according to the following formula:

the sectional area A is calculated by the length and width of the chip 11;

s2, thermal simulation: as shown in fig. 7, adding the thermal conductivity λ to the simulation software soldering material parameter setting, newly building a soldering material, setting a simulation boundary condition, finally obtaining a thermal simulation result of the microwave product 1 to be tested, and evaluating and optimizing the thermal performance of the microwave product 1 to be tested according to the thermal simulation result;

the simulation boundary conditions comprise the material, the heat dissipation form, the heat source position and size and the thermal simulation form of the microwave product 1 to be tested.

Example 3

As shown in fig. 1-2, a microwave product thermal simulation method based on solder thermal conductivity test,

(1) preparing the following related test equipment and products to be tested: the device comprises a liquid cooling test frame (providing a cold plate with constant temperature for a mounting surface of a product to be tested), a power supply (supplying power to the product to be tested), a power meter (monitoring the working stability of the product), a thermocouple wire (temperature sensor), a power supply wire (connecting the power supply and the product to be tested), a multifunctional switch controller (reading the temperature) and the product to be tested.

(2) The test equipment and the product to be tested are interconnected according to the connection relationship shown in fig. 6. Fig. 5 shows an internal structure of a product to be tested, which includes three parts, namely a product box, a solder layer and a chip. According to the method shown in the figures 3-4, two temperature test points are loaded in a product to be tested through thermocouple wires, and the loading positions are the upper surface of a chip and the inner surface of a product box body respectively.

(3) And opening each testing device to enable the product to be tested to be in a working state. Following the chip manufacturing processWhen the time is increased, the heat generated by the chip is increased, and the display values on the power meter and the multifunctional switch controller are changed. And after the numerical value of the power meter is stable, indicating that the product reaches a thermal steady state. At this moment, the temperature values of two temperature zone measuring points are respectively recorded through a multifunctional switch controller: temperature T of inner surface of box body of product₁Upper surface temperature T of the chip₂. Meanwhile, the thickness L and the sectional area A of the solder layer under the chip are measured.

(4) According to the definition of the thermal conductivity of the material: two parallel planes with an area of 1 square meter and a distance of 1 meter are taken in the object perpendicular to the heat conducting direction, and if the temperature difference between the two planes is 1K, the heat conducted from one plane to the other plane in 1 second is defined as the thermal conductivity of the substance. The calculation formula of the thermal conductivity of the material can be obtained as follows:

in the formula, lambda is the material thermal conductivity, P is the loss power of a chip in a product to be tested, L is the thickness of a soldering tin layer, A is the cross-sectional area of the soldering tin layer, and T is₁Is the internal surface temperature, T, of the box body₂Is the chip top surface temperature. And (4) substituting the correlation value measured in the step (3) into a formula to obtain the thermal conductivity of the soldering tin.

Taking a certain product as an example, knowing that the total power consumption of a chip in the product is 110W, the thickness of the soldering tin layer is measured to be 0.1mm, and the area of the printed board, namely the cross-sectional area of the soldering tin layer, is measured and calculated to be 9mm²The temperature of the inner surface of the box body of the product is measured to be 28 ℃, the temperature of the upper surface of the chip is measured to be 87 ℃, and the heat conductivity of the soldering tin can be obtained by substituting the following formula:

(5) performing thermal simulation on related microwave products: and adding the tested soldering tin thermal conductivity parameter into the soldering tin material parameter setting, and creating the soldering tin material in simulation software. As shown in fig. 7. Setting simulation boundary conditions including the material, heat dissipation form, heat source position and size, thermal simulation form and the like of the product assembly, finally obtaining a thermal simulation result of the product, as shown in fig. 8, and evaluating and optimizing the thermal performance of the product according to the simulation result.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.