阅读说明：本技术 一种导电胶带接触电阻测试系统及测试方法 (Conductive adhesive tape contact resistance test system and test method ) 是由 李维佳 余艳萍 艾之深 谢海岩 张宏亮 陈良 于 2021-11-05 设计创作，主要内容包括：本发明涉及一种导电胶带接触电阻测试系统及测试方法,导电胶带接触电阻测试系统包括测试仪表、测试校准件、测试模块和挂件模块。测试校准件包括微带传输模块、标准校准件。测试模块外形及结构尺寸与测试校准件中微带传输模块尺寸相同,具有双端口。在测试模块微带传输线中的微带线导体上,开矩形槽隙,槽隙数量为1至10个,矩形槽隙边缘,具有梳状结构。挂件模块为单端口短路模块,短路模块形成高频电感。将待测导电胶带剪切为测试模块矩形槽隙尺寸,或略大于槽隙尺寸,并贴敷至测试模块当中的槽隙中。读取数据进行记录,即可测试导电胶带的高频接触电阻。(The invention relates to a conductive adhesive tape contact resistance test system and a test method. The test calibration piece comprises a microstrip transmission module and a standard calibration piece. The shape and the structure size of the test module are the same as those of the microstrip transmission module in the test calibration piece, and the test module has two ports. Rectangular slots are formed in microstrip line conductors in the test module microstrip transmission line, the number of the slots is 1-10, and the edges of the rectangular slots are of a comb-shaped structure. The pendant module is a single-port short-circuit module, and the short-circuit module forms a high-frequency inductor. And shearing the conductive adhesive tape to be tested into the rectangular slot size of the test module or slightly larger than the slot size, and pasting the conductive adhesive tape to be tested into the slot in the test module. And reading and recording the data, and testing the high-frequency contact resistance of the conductive adhesive tape.)

1. A conductive adhesive tape contact resistance test system is characterized by comprising a test instrument, a test calibration piece, a test module and a hanging piece module;

the test calibration piece comprises a microstrip transmission module and a standard calibration piece, wherein the microstrip transmission module is provided with a first port coupled with a test instrument port and a second port used for carrying out single-port calibration on a system, and the second port can be coupled with the pendant module;

the test module has a third port coupled to a test meter and a fourth port capable of being coupled to the pendant module.

2. The conductive tape contact resistance testing system of claim 1, wherein the test instrument is a standard vector network analyzer, has a single-port testing function, and can dynamically analyze S-parameters and impedance parameters of a port.

3. The conductive tape contact resistance testing system of claim 1, wherein the microstrip transmission module is a standard microstrip transmission line having a length of 5cm to 30 cm; the microstrip transmission module is provided with two reciprocal ports, one port is connected with the test instrument, and the other port is connected with the standard calibration piece; the standard calibration piece is a vector network analyzer standard mechanical calibration piece and comprises at least one of an open circuit calibration piece, a short circuit calibration piece and a 50 ohm load calibration piece.

4. The conductive tape contact resistance test system of claim 1, wherein the test module has the same shape and structure size as the microstrip transmission module in the test calibration piece, and has two ports; the microstrip transmission line of the test module is provided with a plurality of conductors, gaps are arranged between adjacent conductors, the number of the gaps is 1-10, and the edges of the gaps are of a comb-shaped structure.

5. The conductive tape contact resistance testing system of claim 1, wherein the pendant module is a single-port short circuit module capable of forming a high frequency inductance; the impedance range of the pendant module is below the resonance point.

6. A method for testing contact resistance of a conductive adhesive tape is characterized by comprising the following steps:

s1, system calibration: debugging a test instrument into a frequency band to be tested; coupling a first port of a microstrip transmission module in a test calibration piece to a port of a test instrument; performing single-port calibration on the system at a second port of the microstrip transmission module in the test calibration piece; after calibration is finished, coupling a second port of the microstrip transmission module of the test calibration piece to the pendant module, calling out a Smith chart curve, and recording impedance parameter data of the pendant module;

s2, applying the test sample: applying a conductive adhesive tape to be tested to the gap of the test module; the close connection of the applying surface and the comb-shaped structure at the edge of the gap is ensured; coupling one port of the test module to a test instrument, and coupling the other port of the test module to a pendant module selected during calibration;

s3, parameter testing: and reading the high-frequency contact resistance parameter data of the conductive adhesive tape.

7. The method for testing the contact resistance of the conductive adhesive tape according to claim 6, wherein the test frequency covers a frequency band of 10KHz to 60 GHz.

8. The method of claim 6, wherein the smith chart has a radian less than or equal to pi and is located in the upper half of the smith chart.

9. The method for testing the contact resistance of the conductive tape according to claim 6, wherein the dimension of the conductive tape to be tested is greater than or equal to the dimension of the gap of the test module.

10. The method for testing the contact resistance of the conductive adhesive tape according to claim 6, wherein the high-frequency contact resistance parameter data of the conductive adhesive tape is the impedance parameter data of the pendant module, or the impedance parameter data of the pendant module minus the impedance parameter data of the pendant module recorded during calibration.

Technical Field

The invention relates to the field of high-frequency contact resistance testing, in particular to a conductive adhesive tape contact resistance testing system and a conductive adhesive tape contact resistance testing method.

Background

In recent years, with the progress of electronic technology, electronic devices have been gradually miniaturized, thinned, and modularized. Further, with the application of 5G communication technology, electronic devices are increasingly developed to the aspect of multi-band and wide-band integrated application. However, this development trend undoubtedly increases the design and manufacturing difficulty of electronic devices, and the problem of mutual interference and compatibility of multiple frequency bands also becomes a key difficulty in the integrated design of electronic devices.

Due to the integrated design of the versatility of electronic devices, the development of electronic devices is gradually becoming modular. In the modular design of the electronic equipment, the integration among modules is summarized from the subsystem to the main processor. For example, the video acquisition module, the power supply module and the display processing module are prepared in a modularized mode, and the interface is standardized, so that the system is convenient to design and open. The isolation between modules is often achieved by shielding the modules in their respective areas by means of shielding cages. However, with the increase in data processing speed, the bandwidth of 5G communication has become wider, the modules have become smaller, and the problem of electromagnetic leakage between the modules has become more and more prominent. Therefore, the top end of the module shielding case, the area around the main board and the antenna, etc. are often attached by using a conductive adhesive tape to reduce the interference electromagnetic waves of each frequency band leaked from each module gap.

This type of problem relies heavily on the adhesive layer conductivity of the conductive tape in the solution. If the conductivity of the adhesive layer of the conductive adhesive tape is not good enough, the radiation of the module exceeds the standard. However, the traditional test method of the conductive adhesive tape is to tightly clamp the material in a double-cavity test system to test the shielding performance of the material. The test method can compare the shielding performance of the tested conductive adhesive tape of the system, but the distance from the practical use is still different. In practical use, the conductive tape is adhered to the surface of an object by virtue of viscosity, is in a free state and is not influenced by external force, so that the conductivity is reduced, and the natural shielding performance is also reduced. The source of the decline is mainly generated by the bonding position of the conductive adhesive tape. Therefore, how to test the contact resistance of the conductive adhesive tape can be used for transversely distinguishing and comparing different materials, and no more methods exist at the present stage.

Disclosure of Invention

Aiming at the problems or the defects of the test, the invention provides a system and a method for testing the contact resistance of a conductive adhesive tape. The test system and the test method are simple and reliable, and can transversely compare the material characteristics, thereby greatly improving the test efficiency. Provides an effective method for material type selection and identification.

The invention relates to a conductive adhesive tape contact resistance testing system, which comprises a testing instrument, a testing calibration piece, a testing module and a hanging piece module, wherein the testing instrument is connected with the testing calibration piece through a cable; the test calibration piece comprises a microstrip transmission module and a standard calibration piece, wherein the microstrip transmission module is provided with a first port coupled with a test instrument port and a second port used for carrying out single-port calibration on a system, and the second port can be coupled with the pendant module; the test module has a third port coupled to a test meter and a fourth port capable of being coupled to the pendant module.

Preferably, the test instrument is a standard vector network analyzer, has a single-port test function, and can dynamically analyze the S parameter and the impedance parameter of the port.

Preferably, the microstrip transmission module is a standard microstrip transmission line with a length of 5cm to 30 cm; the microstrip transmission module is provided with two reciprocal ports, one port is connected with the test instrument, and the other port is connected with the standard calibration piece; the standard calibration piece is a vector network analyzer standard mechanical calibration piece and comprises at least one of an open circuit calibration piece, a short circuit calibration piece and a 50 ohm load calibration piece.

Preferably, the shape and the structural size of the test module are the same as those of the microstrip transmission module in the test calibration piece, and both the test module and the microstrip transmission module have double ports; the microstrip transmission line of the test module is provided with a plurality of conductors, gaps are arranged between adjacent conductors, the number of the gaps is 1-10, and the edges of the gaps are of a comb-shaped structure.

Preferably, the pendant module is a single-port short-circuit module, and the short-circuit module can form a high-frequency inductor; the impedance range of the pendant module is below the resonance point.

In addition, the application also relates to a method for testing the contact resistance of the conductive adhesive tape, which comprises the following steps:

s1, system calibration: debugging a test instrument into a frequency band to be tested; coupling a first port of a microstrip transmission module in a test calibration piece to a port of a test instrument; performing single-port calibration on the system at a second port of the microstrip transmission module in the test calibration piece; after calibration is finished, coupling a second port of the microstrip transmission module of the test calibration piece to the pendant module, calling out a Smith chart curve, and recording impedance parameter data of the pendant module;

s2, applying the test sample: applying a conductive adhesive tape to be tested to the gap of the test module; the close connection of the applying surface and the comb-shaped structure at the edge of the gap is ensured; coupling one port of the test module to a test instrument, and coupling the other port of the test module to a pendant module selected during calibration;

s3, parameter testing: and reading the high-frequency contact resistance parameter data of the conductive adhesive tape.

Preferably, the test frequency covers the frequency band of 10KHz to 60 GHz.

Preferably, the smith chart curve has a radian less than or equal to pi and is in the upper half.

Preferably, the outline dimension of the conductive adhesive tape to be tested is greater than or equal to the gap dimension of the test module.

Preferably, the high-frequency contact resistance parameter data of the conductive adhesive tape is pendant module impedance parameter data, or the pendant module impedance parameter data subtracts the pendant module impedance parameter data recorded during calibration.

Compared with the prior art, the conductive adhesive tape contact resistance testing system and the testing method provided by the invention at least have the following beneficial effects: 1. the structure is simple, and the stable test is convenient; 2. the data is stable and reliable, and the contact resistance of the comb-shaped structure and the conductive adhesive tape is directly tested; 3. the process is simple, and the equipment module is convenient to process.

Drawings

The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:

FIG. 1 is a schematic structural diagram of a microstrip transmission module in a test calibration piece;

FIG. 2 shows a schematic diagram of a test module;

FIG. 3 shows a schematic view of a pendant module;

fig. 4 shows a schematic test sample application.

Reference numerals: 1-microstrip transmission module, 2-test module, 3-comb structure, 4-pendant module, and 5-test sample.

Detailed Description

The present invention will be described in further detail with reference to specific embodiments in order to provide a further understanding of the nature and technical means of the invention, as well as the specific objects and functions attained by the invention.

Embodiment 1

A test system for a contact resistance of a conductive adhesive tape is characterized in that the test frequency covers a frequency range from 500MHz to 2GHz, and an Agilent E5071 is selected as a test instrument. The test calibration piece comprises a microstrip transmission module 1 and a standard calibration piece. The microstrip transmission module 1 has a length of 20cm, a width of 6cm and a thickness of 1.6mm, the bottom of the microstrip transmission module is laid with copper, the width of the upper microstrip line is 6mm, and the dielectric plate is made of FR4 material, as shown in figure 1. The microstrip transmission module 1 is provided with two reciprocal ports which are connected by an SMA joint with the inner diameter of 3.5mm, one port is connected with a test instrument, and the other port is connected with a standard calibration piece. The standard calibration piece is a vector network analyzer standard mechanical calibration piece 85052D and comprises an open-circuit calibration piece, a short-circuit calibration piece and a 50-ohm load calibration piece.

The shape and the structural dimension of the test module 2 are the same as the dimension of the microstrip transmission module 1 in the test calibration piece, the test module 2 is 20cm in length, 6cm in width and 1.6mm in thickness, copper is paved at the bottom, the width of the upper microstrip line is 6mm, and the dielectric plate is made of FR4 material. The microstrip transmission module 1 is provided with two reciprocal ports and is connected by an SMA joint with the inner diameter of 3.5 mm. Two rectangular gaps with the distance of 60mm are arranged on the microstrip line conductor in the microstrip transmission line of the test module 2, the length of each rectangular gap is 5mm to 50mm, preferably, the length of each rectangular gap is 20mm, the number of the rectangular gaps is 2, and the rectangular gaps have comb-shaped structures 3 at the edges, as shown in fig. 2.

The pendant module 4 is a single-port short-circuit module, the length of which is 3cm, the width of which is 6cm, the thickness of which is 1.6mm, the bottom of which is paved with copper, the width of the upper microstrip line which is 6mm, the length of the microstrip line which is 1.5cm, the dielectric plate which is made of FR4 material, and the high-frequency inductor is formed by terminal short-circuit, as shown in figure 3.

Example II

A method for testing contact resistance of a conductive adhesive tape comprises the following steps: the method comprises three steps of system calibration, application of a test sample 5 and parameter test.

And (3) system calibration: debugging the test instrument to the frequency band to be tested, accessing the first port of the microstrip transmission module 1 in the test calibration piece into the port of the test instrument, and performing single-port calibration on the system at the end face of the second port. After the calibration is finished, the second port of the microstrip transmission module 1 in the calibration piece is connected into the pendant module 4, a Smith chart curve is called, the Smith chart curve is only provided with an arc line within a half circle, and in the upper half area, impedance parameter data of the pendant module 4 are recorded.

Application of test sample 5: the conductive adhesive tape to be tested is cut to be 20.4mm multiplied by 6mm in size and is pasted into two rectangular gaps in the test module 2, the pasting surface is ensured to be tightly connected with the comb-shaped structures 3 at the edges of the rectangular gaps, as shown in fig. 4, one port of the test module 2 is connected into a test instrument, and the other port is connected into the pendant module 4 selected during calibration.

And (3) parameter testing: and reading the high-frequency contact resistance parameter data of the conductive adhesive tape, wherein the high-frequency contact resistance parameter data of the conductive adhesive tape is the impedance parameter data of the pendant module 4, or the impedance parameter data of the pendant module 4 recorded in the calibration is subtracted from the impedance parameter data of the pendant module 4.

Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.