阅读说明：本技术 光纤侧面对激光整形的发光装置 (Light-emitting device with optical fiber side face for laser shaping ) 是由 杨毅 于 2020-05-29 设计创作，主要内容包括：本发明光纤侧面对激光整形的发光装置,包括激光芯片以及发光区,发光区平行结平面方向为慢轴,垂直结平面方向为快轴,快轴的发光角度大于慢轴的发光角度,还包括第一光纤,所述第一光纤设置在激光芯片设置有发光区的一侧,发光区快轴所在的平面与第一光纤的轴向垂直,所述发光区朝向第一光纤的侧面发射激光,激光从侧面穿过第一光纤；还包括定位装置,定位装置用于定位第一光纤的位置,利用定位装置对第一光纤进行定位,提高了装配精度,缩短了装配时间,节约了人力,该光纤侧面对激光整形的发光装置利用激光芯片底座和线路板底座散热,光纤侧面对激光整形的发光装置的组成部件散热,节省了散热部件或装置,缩小了体积,降低了成本。(The invention relates to a light-emitting device for shaping laser by an optical fiber side surface, which comprises a laser chip, a light-emitting area, a first optical fiber and a second optical fiber, wherein the light-emitting area is parallel to a junction plane and is a slow axis, the light-emitting area is vertical to the junction plane and is a fast axis, the light-emitting angle of the fast axis is greater than that of the slow axis, the first optical fiber is arranged on one side of the light-emitting area of the laser chip, the plane of the fast axis of the light-emitting area is vertical to the axial direction of the first optical fiber, the light-emitting area emits laser towards the side surface of the first optical fiber, and the laser penetrates through the first optical fiber from the side surface; still include positioner, positioner is used for fixing a position the position of first optic fibre, utilizes positioner to fix a position first optic fibre, has improved the assembly precision, has shortened the assemble duration, has practiced thrift the manpower, and this optic fibre side utilizes laser chip base and circuit board base heat dissipation to the illuminator of laser plastic, and the optic fibre side is to the component part heat dissipation of the illuminator of laser plastic, has saved heat dissipation part or device, has reduced the volume, the cost is reduced.)

1. The optical fiber side is to the illuminator of laser plastic, including laser chip, laser chip is including sending out light area, and the parallel knot plane direction of sending out light area is the slow axis, and perpendicular knot plane direction is fast axis, and the luminous angle of fast axis is greater than the luminous angle of slow axis, its characterized in that: the laser chip is provided with a light emitting area, the plane of the fast axis of the light emitting area is vertical to the axial direction of the first optical fiber, the light emitting area emits laser towards the side surface of the first optical fiber, and the laser penetrates through the first optical fiber from the side surface; the optical fiber positioning device further comprises a positioning device used for positioning the position of the first optical fiber.

2. The fiber-optic side-laser shaping light emitting device of claim 1, wherein: the laser chip comprises a laser chip base and a circuit board base, wherein the laser chip base comprises a laser chip base plane, the circuit board base comprises a circuit board base plane, and one end, facing the first optical fiber, of the laser chip base comprises a laser chip base positioning surface; the laser chip is fixedly arranged on the plane of the laser chip base, the laser chip base is fixedly arranged on the plane of the circuit board base, the positioning device is fixedly arranged on the plane of the laser chip base by taking the positioning surface of the laser chip base as a reference, and the first optical fiber is fixedly arranged on the plane of the circuit board base by taking the positioning device as a reference.

3. The fiber-optic side-laser shaping light emitting device of claim 2, wherein: the radius of first optic fibre is R, it is K to send out the distance of district to circuit board base plane, and the laser chip sends out the location tolerance of the distance of district to first optic fibre axle center and is M, the value range of the radius R of first optic fibre: r is more than 6.6M and less than 1.5K.

4. The fiber-optic side-laser shaping light emitting device of claim 1, wherein: the positioning device is a positioning block, an optical fiber positioning groove is formed in the positioning block, and the first optical fiber is fixedly arranged in the optical fiber positioning groove; the positioning block is fixedly arranged close to the positioning surface of the laser chip base.

5. The fiber-side laser-shaped light emitting device of claim 4, wherein: the light-transmitting groove is a channel of laser emitted by the light-emitting area and enables the laser penetrating through the first optical fiber to be emitted.

6. The fiber-optic side-laser shaping light emitting device of claim 1, wherein: the positioning device comprises an isolation component, the isolation component is cylindrical, and one side of the isolation component, which is close to the positioning surface of the laser chip base, is tightly attached to the positioning surface of the laser chip base; the isolation component is fixedly arranged on the plane of the circuit board base.

7. The fiber-side laser-shaped light emitting device of claim 6, wherein: the first optical fiber and one side, far away from the positioning surface of the laser chip base, of the isolation component are tightly attached together.

8. The fiber-side laser-shaped light emitting device of claim 6, wherein: the cross section of the isolation component is circular or rectangular.

9. The fiber-optic side-shaping laser light emitting device of any one of claims 6-8, wherein: the isolation component is a second optical fiber.

10. A light source, characterized by: the light-emitting device with the laser-shaped side surface comprising any one of claims 1 to 9, wherein the light-emitting device with the laser-shaped side surface is provided with a fluorescent sheet in a matching way, and the light-emitting device with the laser-shaped side surface excites the fluorescent sheet to emit exciting light.

Technical Field

The invention relates to the technical field of illumination, in particular to a light-emitting device for shaping laser by means of an optical fiber side face shaped by an optical fiber, wherein the laser emitted by a laser chip.

Background

With the development of laser lighting technology, the demand and application of laser devices are becoming more and more extensive. The laser that laser chip sent is the slow axis direction at the horizontal direction and is on a parallel with the rectangular direction of luminous zone, and the vertical direction perpendicular to luminous zone rectangular direction is the fast axis direction, and the luminous angle of the laser that laser chip sent is different with the luminous angle of slow axis direction in the luminous angle of fast axis direction, and the luminous angle of fast axis direction is greater than the luminous angle of slow axis direction usually. The difference of the light emitting angles of the fast axis and the slow axis causes the laser beam emitted by the laser chip to be a divergent strip-shaped beam, which makes the application rate of the laser chip low, and especially when the laser device is used as a light source in the illumination field, the angular distribution of the fast axis and the slow axis must be adjusted.

The existing laser device adopts the technology for adjusting the angular distribution, and has the defects of complex structure, large volume, low yield and difficult popularization and application. For example, patent publication No. CN104991347A discloses a laser shaping illuminator based on a microlens array, which includes a collimating system, a microlens array set and a beam expanding system, the patent requires the matching of the collimating system, the microlens array set and the beam expanding system, and the patent has a complex structure, is difficult to calibrate in the assembling process, and has a large volume and high difficulty in popularization and application.

Disclosure of Invention

The invention aims to overcome the defects of the traditional technology, and provides a light-emitting device with a function of adjusting the angular distribution of laser emitted by a laser chip, wherein the side surface of an optical fiber is used for shaping the laser.

In order to solve the problems, the technical scheme adopted by the invention is as follows: the optical fiber side is to the illuminator of laser plastic, including laser chip, laser chip is including sending out light area, and the parallel knot plane direction of sending out light area is the slow axis, and perpendicular knot plane direction is fast axis, and the luminous angle of fast axis is greater than the luminous angle of slow axis, its characterized in that: the laser chip is provided with a light emitting area, the plane of the fast axis of the light emitting area is vertical to the axial direction of the first optical fiber, the light emitting area emits laser towards the side surface of the first optical fiber, and the laser penetrates through the first optical fiber from the side surface; the optical fiber positioning device further comprises a positioning device used for positioning the position of the first optical fiber.

As an improvement of the technical scheme: the laser chip comprises a laser chip base and a circuit board base, wherein the laser chip base comprises a laser chip base plane, the circuit board base comprises a circuit board base plane, and one end, facing the first optical fiber, of the laser chip base comprises a laser chip base positioning surface; the laser chip is fixedly arranged on the plane of the laser chip base, the laser chip base is fixedly arranged on the plane of the circuit board base, the positioning device is fixedly arranged on the plane of the laser chip base by taking the positioning surface of the laser chip base as a reference, and the first optical fiber is fixedly arranged on the plane of the circuit board base by taking the positioning device as a reference.

As an improvement of the technical scheme: the radius of first optic fibre is R, it is K to send out the distance of district to circuit board base plane, and the laser chip sends out the location tolerance of the distance of district to the optic fibre axle center and is M, the value range of radius R of first optic fibre: r is more than 6.6M and less than 1.5K.

Due to the adoption of the technical scheme, compared with the prior art, the technical scheme has the advantages that the first optical fiber is positioned by the positioning device, the assembly precision is improved, the assembly time is shortened, and the labor is saved. Secondly, the side face of the optical fiber dissipates heat of the laser-shaped light-emitting device by utilizing the laser chip base and the circuit board base, and the side face of the optical fiber dissipates heat of the components of the laser-shaped light-emitting device, so that heat dissipation components or devices are saved, the size is reduced, and the cost is reduced.

The invention is further described with reference to the following figures and detailed description.

Drawings

FIG. 1 is a front view of a light emitting device with optical fibers side-to-side shaping the laser.

Fig. 2 is a top view of fig. 1.

Fig. 3 is a partial structural schematic view of fig. 1.

FIG. 4 is a front view of another embodiment of a light emitting device with fiber side shaping laser light.

Fig. 5 is a top view of fig. 4.

Fig. 6 is a partial structural schematic view of fig. 4.

FIG. 7 is a front view of another embodiment of a light emitting device with fiber side shaping laser light.

FIG. 8 is a front view of another embodiment of a light emitting device with fiber side shaping laser light.

FIG. 9 is a right side view of the alignment block and first fiber of FIG. 8.

Detailed Description

Example 1:

as shown in fig. 1-3, the light emitting device with the fiber side for shaping laser includes a laser chip 101, the laser chip 101 includes a light emitting region, the light emitting region emits laser 121, and the laser 121 emitted by the light emitting region is in a slow axis direction parallel to the long strip direction of the laser chip 101 and in a fast axis direction perpendicular to the long strip direction of the laser chip 101. The light emission angle of the laser light 121 emitted from the laser chip 101 in the fast axis direction is different from the light emission angle in the slow axis direction, and the light emission angle in the fast axis direction is generally larger than the light emission angle in the slow axis direction. The difference between the light emitting angles in the fast axis direction and the slow axis direction causes the laser 121 emitted from the laser chip 101 to be a divergent elongated beam. For the above reasons, when the laser chip 101 is used as a light source in the illumination or display field, the angular distribution of the laser chip 101 in the fast axis direction or the slow axis direction needs to be adjusted.

According to the scheme, the first optical fiber 102 is arranged on one side, provided with the light emitting area, of the laser chip 101, the light emitting area faces the side face of the first optical fiber 102, the plane where the fast axis of the light emitting area is located is perpendicular to the axial direction of the first optical fiber 102, laser 121 emitted by the light emitting area enters from one side of the first optical fiber 102, and the laser 121 is emitted from the other side of the first optical fiber 102. According to the technical scheme, the first optical fiber 102 is used for adjusting the light emitting angles in the fast axis direction and the slow axis direction. As shown in fig. 3, in the cross-sectional direction of the first optical fiber 102, two curved surfaces of the first optical fiber 102 in the vertical direction are equivalent to a lens, the laser 121 emitted from the light emitting region is bent in the fast axis direction and the light emitting angle of the laser 121 is reduced, and the first optical fiber 102 does not change in the horizontal direction, that is, the light emitting angle of the laser 121 in the slow axis direction does not change. The laser light 121 emitted from the light emitting region is first laser light 121a before entering the first optical fiber 102, and is emitted from the first optical fiber 102 as second laser light 121b, where the first laser light 121a passes through a convex lens.

In this embodiment, the first optical fiber 102 does not change the light emitting angle of the laser 121 emitted by the light emitting region in the slow axis direction; the first fiber 102 collimates the laser light 121 emitted by the light emitting region in the fast axis direction. The technical scheme is that the angle in the fast axis direction is independently compressed, and the angle in the slow axis direction is unchanged.

In practice, for the sake of easy operation, the first optical fiber 102 with a sufficiently large radius is usually selected, wherein the distance between the first optical fiber 102 and the laser chip 101 is usually large. In this embodiment, in order to form the circular ideal spot by the second laser 121b, the radius of the first optical fiber 102 and the distance from the first optical fiber 102 to the laser chip 101 need to be strictly controlled. The relationship between the radius of the first optical fiber 102 and the distance between the first optical fiber 102 and the laser chip 101 is that whether the second laser 121b emitted from the first optical fiber 102 is collimated or focused, which affects the ratio of the angle of the second laser 121b in the fast axis direction to the angle of the second laser 121b in the slow axis direction, in this technical scheme, the first laser 121a ideally passes through the first optical fiber 102 to form the second laser 121b, which is then collimated and emitted, and it is required to ensure that the ratio of the angle of the second laser 121b in the fast axis direction to the angle of the second laser 121b in the slow axis direction is approximately equal to 1.

In the present embodiment, the first optical fiber 102 is made of silica, for example, wherein the refractive index of the silica fiber is 1.46. In this embodiment, the radius of the first optical fiber 102 is R, the distance from the light emitting region to the circuit board base plane 104a is K, and when the distance from the light emitting region to the circuit board base plane 104a is R, the first optical fiber 102 is directly fixed on the circuit board base plane 104a, and the first optical fiber 102 is naturally positioned in the vertical direction, that is, the optical axis of the laser 121 emitted by the light emitting region of the laser chip 101 passes through the axis of the first optical fiber 102. In fact, the light emitting region of the laser chip 101 is allowed to deviate from the axial position of the first optical fiber 102 in the height direction, and slight decentration does not affect the divergence angle of the second laser light 121b, and only affects the emission direction of the second laser light 121 b. For example, if the first fiber 102 is high in the center and the light emitting region is low, the emitting direction of the second laser beam 121b will be biased upward. Therefore, this embodiment is a preferred embodiment, and the radius of the first optical fiber 102 is equal to the distance from the light emitting area to the plane 104a of the circuit board.

In summary, the radius of the first optical fiber 102 is related to the material of the first optical fiber 102 and the distance from the light emitting region to the substrate plane 104a of the circuit board, in this embodiment, the first optical fiber 102 is made of a quartz optical fiber, and the radius of the first optical fiber 102 is less than 1.5 times the distance from the light emitting region to the substrate plane 104a, which satisfies the above-mentioned limitation.

The distance from the first optical fiber 102 to the plane of the light emitting region of the laser chip 101 is L. This distance is related to the radius of the cross-section of the first optical fiber 102 and the refractive index of the material selected for the first optical fiber 102. The larger the radius of the first optical fiber 102 is, the smaller the bending capability of the laser 121 is, and the larger the value of L is; the larger the refractive index of the material of the first optical fiber 102 is, the stronger the bending capability of the laser 121 is, and the smaller the value of L is. L actually corresponds to the focal length of the first optical fiber 102, which is equivalent to a lens. The second laser light 121b emitted by the first fiber 102 is collimated while the light emitting region is in focus; when the light emitting region deviates out of focus, the second laser light 121b emitted by the first optical fiber 102 is converged; when the light emitting region is offset within focus, the second laser light 121b emitted by the first optical fiber 102 is divergent.

In summary, the distance L from the first optical fiber 102 to the plane of the light emitting region of the laser chip 101 determines the spot size of the laser beam 121 after passing through the first optical fiber 102. The distance L of the first fiber 102 from the emitting region is a sensitive factor and affects the spot size of the second laser light 121 b. The light spot of the second laser 121b emitted by the first optical fiber 102 is too small, which causes the energy of the second laser 121b to be converged, the energy in unit area is high, and components are easily burnt or safety accidents are easily caused in the utilization process; if the spot size of the second laser 121b is too large, the intensity of the second laser is insufficient, and the second laser cannot meet the requirement.

The cross-sectional diameter of the first optical fiber can be theoretically small, and the cross-sectional diameter of the first optical fiber is larger than the width of the light emitting region in the fast axis direction, and the width of the light emitting region in the fast axis direction is only about 1 micrometer. However, we have found through experimentation that the cross-sectional diameter of the first optical fiber 102 cannot be too small, with a lower size limit. The first optical fiber 102 is made of quartz fiber, and the following conclusion is obtained through repeated experiments: the diameter 2R of the first optical fiber 102 is 4.4 times the planar distance L from the first optical fiber 102 to the light emitting region, i.e., R is 2.2L. Since the diameter 2R of the first optical fiber 102 affects the distance L from the first optical fiber 102 to the plane where the light emitting region of the laser chip 101 is located, the diameter 2R of the first optical fiber 102 cannot be too small, otherwise the distance L from the first optical fiber 102 to the plane where the light emitting region is located is not easy to control, and the assembly difficulty is high. The positioning tolerance of the distance from the light emitting region of the laser chip 101 to the axis of the first optical fiber 102 is M, and repeated experimental verification proves that the distance L from the first optical fiber 102 to the plane where the light emitting region is located is not less than 3 times of the positioning tolerance M, i.e., L is greater than 3M, and R is greater than 6.6M because R is 2.2L. The upper limit of the radius R of the first optical fiber 102 using a silica optical fiber is 1.5 times the distance K from the light emitting region to the board base plane 104 a. Thus, the first optical fiber 102 has a radius R range. Radius R of the first optical fiber 102 ranges: r is more than 6.6M and less than 1.5K.

The value range data is a value range of the radius R of the first optical fiber 102 when the first optical fiber 102 is a silica optical fiber. If other materials are used for the first optical fiber 102, the radius R of the first optical fiber 102 varies with the refractive index.

As can be seen from the above, the radius R of the first optical fiber 102 and the distance L from the first optical fiber 102 to the plane where the light emitting region of the laser chip 101 is located all require strict precision requirements. The difficulty in the manufacturing process is increased due to the improved precision. As shown in fig. 1 and 3, in order to meet the requirement of precision, reduce the cost of production and manufacture, and improve the efficiency of production and assembly, a laser chip base 103 for positioning and fixing the laser chip 101 and a positioning device for positioning the first optical fiber 102 are added in the present technical solution. The positioning device, which controls the distance L between the first optical fiber 102 and the laser chip 101, fixes the first optical fiber 102 as a reference. The positioning device improves the precision, reduces the assembly difficulty, reduces the production cost, and avoids the situation that the first optical fiber 102 or the laser chip 101 is not firmly fixed in the use process and cannot achieve the expected purpose.

In this embodiment, the positioning device is a positioning block 105, and one surface of the positioning block 105 close to the laser chip mount 103 is set close to the laser chip mount positioning surface 103a with reference to the laser chip mount positioning surface 103 a. The positioning block 105 is fixedly disposed on the circuit board base plane 104a, the distance L from the first optical fiber 102 to the plane of the light emitting region is determined according to the material of the selected first optical fiber 102 and the radius R of the first optical fiber 102, and the position of the optical fiber positioning groove 106 is selected on the positioning block 105. The depth of the fiber positioning groove 106 is selected based on the radius R of the first optical fiber 102 and the distance K from the light emitting region to the circuit mount plane 104 a. After the position and the depth of the optical fiber positioning groove 106 are determined, the first optical fiber 102 is fixed in the optical fiber positioning groove 106 by using an adhesive method in this embodiment, so that the situation that the position of the first optical fiber 106 is moved to affect the emitting effect of the second laser 121b is avoided.

In a preferred embodiment, the optical axis of the laser light 121 emitted by the light emitting region passes through the axis of the first optical fiber 102. When the optical axis of the laser light 121 emitted by the light emitting region is perpendicular to the axis of the first optical fiber 102, the laser light 121 is not refracted inside the first optical fiber 102, and the loss of the laser light 121 when passing through the first optical fiber 102 is minimal.

The positioning device has the advantages that by using the positioning block 105, the position of the optical fiber positioning groove 106 on the positioning block 105 is uniquely determined according to the material, the radius and other factors of the first optical fiber 102, repeated calibration or measurement is not needed in the assembly process, and the assembly speed is greatly improved. The positioning block 105 is used for improving the mounting position accuracy of the first optical fiber 102, shortening the mounting time and meeting the requirement of mass production.

One side of the laser chip base 103, which is far away from the circuit board base 104, is a laser chip base plane 103b, the laser chip 101 is attached to the laser chip base plane 103b, and one end of the laser chip base 103, which faces the first optical fiber 102, includes a laser chip base positioning plane 103 a. The surface of the circuit board base 104 is provided with a circuit board base plane 104a, and the laser chip base 103 is fixedly arranged on the circuit board base plane 104 a. One side of the positioning device is tightly attached to the positioning surface 103a of the laser chip base, the bottom of the positioning device is fixedly arranged on the plane 104a of the circuit board base, the other side of the positioning device is tightly attached to the first optical fiber 102, and the first optical fiber 102 is also fixedly arranged on the plane 104a of the circuit board base.

The laser chip 101 is attached to the laser chip mount plane 103b, and the laser chip mount 103 is attached to the wiring board mount plane 104 a. The laser chip 101 is electrically connected with the circuit board base 104 through a bonding pad and/or a gold wire, and the circuit board base 104 supplies power to the laser chip 101 through the bonding pad and/or the gold wire. The laser chip 101 generates heat in the working process, the laser chip 101 needs to dissipate heat, the heat generated in the working process of the laser chip 101 is transferred to the laser chip base 103, the laser chip base 103 emits a part of heat, the laser chip base 103 is attached to the plane 104a of the circuit board base, the other part of heat is transferred to the circuit board base 104, and the part of heat is emitted through the circuit board base 104.

The laser chip 101 is in a cuboid shape, a light emitting area is arranged on one end face of the laser chip 101 in the length direction, the light emitting area of the laser chip 101 is in a long strip shape, the long edge of the laser chip 101 is parallel to a plane on the laser chip base 103 and a plane of the circuit board base 104, and the heat dissipation surface of the laser chip 101 is tightly attached to the plane of the laser chip base 103. The design has the advantages that the path of heat of the laser chip 101 transferred to the circuit board base 104 is shortest, and the heat dissipation effect is better.

The design can fix and position the laser chip 101, and heat generated in the working process of the laser chip 101 can be transferred and dissipated through the fixed part, so that the heat dissipation device is saved, the product cost is reduced, the product volume is reduced, the manufacturing cost is reduced, and the installation efficiency is improved. .

The circuit board base 104 is preferably made of a material having a high thermal conductivity, such as a copper base material, an aluminum base material, or an aluminum nitride base material, and the laser chip base 103 is preferably made of a material having a high thermal conductivity, such as aluminum nitride, aluminum oxide, or silicon carbide.

The positioning device in this embodiment has the disadvantages that the requirements on the shape and the position of the optical fiber positioning groove 106 during the processing are high, and once an error occurs during the processing, the detection and calibration are complicated, and the difficulty in repairing the optical fiber positioning groove 106 is high.

Example 2:

as shown in fig. 4 to 6, the light emitting device with the side surface of the optical fiber shaping the laser light, the present embodiment is different from the embodiment 1 in that the positioning device adopted in the present embodiment includes an isolation component, which is an isolation column 205. In order to facilitate material selection and avoid the influence of the isolation pillar 205 on the refraction or reflection of the laser light passing through the first optical fiber 202, the isolation pillar 205 with a circular cross section is adopted in the present embodiment, and a preferred isolation pillar 205 is a second optical fiber. The second optical fiber has the advantages that the size precision of the first diameter is high, the second optical fiber belongs to common products on the market, the acquisition is convenient, the price is low, and the third cutting and processing are convenient.

In this embodiment, the second optical fiber is fixedly disposed on the circuit board base plane 204a with the laser chip base positioning surface 203a as a reference, and a side surface of the second optical fiber close to the laser chip base positioning surface 203a is closely attached to the laser chip base positioning surface 203 a. The second optical fiber is used as a positioning reference of the first optical fiber 202, one side of the second optical fiber, which is far away from the positioning surface 203a of the laser chip base, is tightly attached to the first optical fiber 202, and the first optical fiber 202 is fixedly arranged on the circuit board base plane 204 a.

In this embodiment, the distance K from the light emitting region to the base plane 204a of the circuit board is controlled by controlling the height of the laser chip base 203, the half R of the first optical fiber 202 is determined according to the material of the first optical fiber 202, the radius R of the first optical fiber 202 determines the distance L from the first optical fiber 202 to the plane where the light emitting region is located, and the distance L from the first optical fiber 202 to the plane where the light emitting region is located is implemented by using second optical fibers with different radii.

In this embodiment, the second optical fiber is adopted as the positioning device for fixing the first optical fiber 202 on the circuit board base plane 204a, the positioning device not only can play a role of the positioning device in embodiment 1, and an optical fiber positioning groove is not needed to be arranged, but only the diameter of the second optical fiber needs to be calculated as required, then the first optical fiber 202 is directly fixed and arranged on the circuit board base plane 204a, and then the fixing is carried out as required. Greatly reducing the production cost.

In this embodiment, the second optical fiber is used as the positioning device, the cross section of the second optical fiber is circular, the contact between the second optical fiber and the positioning surface 203a of the laser chip base, the plane 204a of the circuit board base, and the first optical fiber 202 is a straight line, and the contact surface is too small to fix firmly.

Example 3:

as shown in fig. 7, the light emitting device of the present embodiment, in which the laser beam is shaped by the fiber side, is different from embodiment 2 in that:

the included angle α between the laser chip mount plane 303b and the wiring board mount plane 304a is 45 °.

The laser chip 301 is attached to the laser chip base plane 303b, and an included angle between an optical axis of the laser 321 emitted by the light emitting region and the laser chip base plane 303b is also 45 °. The first laser beam 321a enters the first optical fiber 302 from the side surface thereof, passes through the center of the first optical fiber 302, and then exits from the other side of the first optical fiber 302 as a second laser beam 321 b.

In this embodiment, the positioning device includes an isolation component, which is an isolation column 305. In this embodiment, the isolation pillar 305 has a rectangular cross section, and in a preferred embodiment, the isolation pillar 305 is made of the same material as the first optical fiber 302.

One side surface of the isolation column 305 is attached to the first optical fiber 302, and the other side surface is attached to the laser chip base positioning surface 303 a. One surface of the isolation column 305 close to the circuit board base plane 304a is fixedly arranged on the circuit board base plane 404 a.

In this embodiment, when the included angle α between the laser chip mount plane 303b and the circuit board mount plane 304a is 45 °, the angle between the emission angle of the second laser beam 321b and the horizontal direction is 45 °, and the second laser beam 321b emitted at this angle may be used for the reflective wavelength conversion device.

The cross-sectional area of the isolation column 305 is rectangular, the contact surface of the isolation column 305 and the plane 304a of the circuit board base is a plane, the isolation column 305 is more stable on the plane 304a of the circuit board base and convenient to fix, the contact surface between the isolation column 305 and the positioning surface 203a of the laser chip base is also a plane, the attaching operation between the planes is simple and convenient, the difficulty in the assembling process is reduced, the error is reduced, and the precision is improved.

Example 4:

as shown in fig. 8 and 9, the light emitting device in which the laser beam is shaped by the fiber side surface differs from embodiment 1 in that:

in this embodiment, the included angle α between the laser chip mount plane 403b and the circuit board mount plane 404a is-45 °. The laser chip 401 is attached to the laser chip base plane 403b, and the included angle between the optical axis of the laser 421 emitted by the light emitting region and the circuit board base plane 404a is also-45 °. The first laser beam 421a enters the first optical fiber 402 from the side surface thereof, passes through the center of the first optical fiber 402, and is emitted as the second laser beam 421b from the other side of the first optical fiber 402.

In this embodiment, when the included angle α between the laser chip mount plane 403b and the circuit board mount plane 404a is-45 °, the angle between the second laser 421b and the circuit board mount plane 404a is-45 °, and the angle between the second laser 421b emitted by the technical solution is different from that in embodiment 1, and in this embodiment, the second laser 421b parallel to the circuit board mount plane 404a is changed to be emitted in a direction away from the circuit board mount plane 404 a. In this embodiment, the emission mode of the second laser 421 is changed, and the application range is greatly expanded.

In this embodiment, as shown in fig. 8, the positioning block 405 and the positioning surface 403a of the laser chip base are tightly attached together, since the laser 421 emitted by the laser chip 401 needs to be obliquely irradiated onto the first optical fiber 402, the positioning block 405 is provided with the optical fiber positioning groove 406, and the optical fiber positioning groove 406 fixes the first optical fiber 402, in this embodiment, the positioning block 405 further ensures that the first laser 421a emitted by the light emitting region enters from the side surface of the first optical fiber 402, passes through the center of the first optical fiber 402, and then forms the second laser 421b to be emitted from the other side of the first optical fiber 402.

As shown in fig. 9, a light-passing groove 407 is provided on one side surface of the positioning block 405 that is closely attached to the positioning surface 103a of the laser chip holder, the light-passing groove 407 extends into the positioning block 405, and one end of the light-passing groove 407 that extends into the positioning block 405 communicates with the fiber positioning groove 406.

This embodiment requires the second laser 421b to pass through the center of the first optical fiber 402, the light-passing groove 407 to be large enough, and the end of the laser chip 401 provided with the light-emitting region to protrude into the light-passing groove 407. The extension of the center of the light emitting region passes through the center of the first optical fiber 402.

The above detailed description of the specific embodiments of the present invention is the best mode for carrying out the present invention and should not be taken as limiting the scope of the present invention. It will be appreciated by those skilled in the art that any equivalent modifications or alterations to the present invention are also within the scope of the present invention.