阅读说明：本技术 一种一次性高温烧结制备陶瓷雾化芯的方法 (Method for preparing ceramic atomizing core through one-time high-temperature sintering ) 是由 李彪 夏友银 于 2021-09-03 设计创作，主要内容包括：本发明涉及雾化芯制备技术领域,公开了一种一次性高温烧结制备陶瓷雾化芯的方法,包括：将带有印刷电阻的载体放入陶瓷注浆成型模具内；向所述陶瓷注浆成型模具内注入陶瓷浆料进行定型,得到陶瓷雾化芯胚；对所述陶瓷雾化芯胚进行预设温度的烧结,得到陶瓷雾化芯。采用本方法不仅能够有效改善陶瓷雾化芯的质量而且能够提高生产效率。(The invention relates to the technical field of atomization core preparation, and discloses a method for preparing a ceramic atomization core by one-time high-temperature sintering, which comprises the following steps: putting the carrier with the printed resistor into a ceramic slip casting mold; injecting ceramic slurry into the ceramic slip casting mold for shaping to obtain a ceramic atomized core blank; and sintering the ceramic atomization core blank at a preset temperature to obtain the ceramic atomization core. By adopting the method, the quality of the ceramic atomizing core can be effectively improved, and the production efficiency can be improved.)

1. A method for preparing a ceramic atomizing core by one-time high-temperature sintering is characterized by comprising the following steps:

putting the carrier with the printed resistor into a ceramic slip casting mold;

injecting ceramic slurry into the ceramic slip casting mold for shaping to obtain a ceramic atomized core blank;

and sintering the ceramic atomization core blank at a preset temperature to obtain the ceramic atomization core.

2. The method for preparing the ceramic atomizing core through one-time high-temperature sintering according to claim 1, is characterized in that the prefabricated resistor paste is printed on a carrier to form the carrier with the printed resistor.

3. The method for preparing the ceramic atomizing core by one-time high-temperature sintering according to claim 1 or 2, wherein the thickness of the printing resistor is 0.01-0.6 mm.

4. The method for preparing the ceramic atomizing core through one-time high-temperature sintering according to claim 1 or 2, characterized in that the carrier is one of a plastic carrier, a paper carrier, a wood carrier or a textile carrier.

5. The method for preparing the ceramic atomizing core through one-time high-temperature sintering according to claim 1, characterized in that the ceramic atomizing core blank is sintered for a preset time through a high-temperature furnace.

6. The method for preparing the ceramic atomizing core by one-time high-temperature sintering according to claim 1 or 5, characterized in that the sintering temperature of the ceramic atomizing core blank is greater than or equal to 1200 ℃.

7. The method for preparing the ceramic atomizing core by one-time high-temperature sintering according to claim 1, 2 or 4, characterized in that the carrier is arranged in a regular geometric shape.

8. The method for preparing the ceramic atomizing core through one-time high-temperature sintering according to claim 7, wherein the carrier is arranged in a polygonal shape.

9. The method for preparing a ceramic atomizing core through one-time high-temperature sintering according to claim 2, wherein the resistor paste is printed on a carrier module, the carrier module is dried and shaped, and the dried carrier module is divided to obtain at least two carriers with printed resistors.

10. The method for preparing the ceramic atomizing core through one-time high-temperature sintering according to claim 2, wherein the prefabricated resistor paste is printed on the carrier by using a printing machine, wherein the printing machine is one of a screen printing machine, a transfer printing machine or a pad printing machine.

Technical Field

The invention relates to the technical field of atomization core preparation, in particular to a method for preparing a ceramic atomization core through one-time high-temperature sintering.

Background

The ceramic atomization core is the core component of the electronic cigarette atomizer, generates heat by electrifying the ceramic atomization core, and can atomize liquid tobacco tar into smoke at high temperature. There are two main common methods for preparing ceramic atomizing cores in the industry. The first is to adopt low-temperature ceramic, however, the strength of the low-temperature ceramic is not high enough, and the phenomenon of ceramic powder falling is generated in the process of using the ceramic atomizing core, so that the consumers have the risk of eating by mistake. The second method is to use high temperature ceramics, however, this method needs two times of sintering, and the production efficiency is low.

Therefore, how to provide a method for preparing a ceramic atomizing core to effectively improve the quality of the ceramic atomizing core and improve the production efficiency is a technical problem to be solved urgently.

Disclosure of Invention

The invention provides a method for preparing a ceramic atomizing core by one-time high-temperature sintering, which comprises the following steps: putting the carrier with the printed resistor into a ceramic slip casting mold; injecting ceramic slurry into the ceramic slip casting mold for shaping to obtain a ceramic atomized core blank; and sintering the ceramic atomization core blank at a preset temperature to obtain the ceramic atomization core.

The invention is further arranged to print a pre-manufactured resistor paste onto a carrier to form a carrier with printed resistors.

The invention is further provided that the thickness of the printed resistor is 0.01-0.6 mm.

The invention is further configured that the carrier is one of a plastic carrier, a paper carrier, a wood carrier or a textile carrier.

The invention is further set up in that the ceramic atomizing core blank is sintered for a preset time through a high-temperature furnace.

The invention is further set that the sintering temperature of the ceramic atomization core blank is greater than or equal to 1200 ℃.

The invention further provides that the carrier is arranged in a regular geometric shape.

The invention is further provided that the carrier is arranged in a polygon.

The invention is further arranged to print the resistor paste onto a carrier module, dry and shape the carrier module, and divide the dried carrier module to obtain at least two carriers with printed resistors.

The invention is further arranged to print the pre-fabricated resistor paste onto a carrier using a printing machine, which is one of a screen printing machine, a transfer printing machine or a pad printing machine.

The invention has the following beneficial effects: because the carrier of the printed resistor is adopted in the ceramic atomizing core blank, the problems of deformation, failure and the like can not occur in the high-temperature sintering process, the precision of the ceramic atomizing core after the high-temperature sintering is ensured, and the stability of the ceramic atomizing core is improved. The problem that the porcelain powder falls off can be overcome by sintering at the preset temperature, so that the quality of the ceramic atomizing core is effectively improved, and the yield of products is improved. And the ceramic atomizing core blank before sintering contains the resistor, when the ceramic atomizing core blank is sintered at the preset temperature, the resistor does not need to be printed on the surface of the high-temperature sintered ceramic again to form the resistor for secondary high-temperature sintering, the high-quality ceramic atomizing core can be obtained only by one-time high-temperature sintering, and the production efficiency is effectively improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a flow chart of a method of making a ceramic atomizing core in one embodiment.

Fig. 2 is a schematic illustration of the preparation of a ceramic atomizing core by printing multiple sets of carriers with printed resistors in one carrier module in one embodiment.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

In one embodiment, a method for preparing a ceramic atomizing core by one-time high-temperature sintering is provided, as shown in fig. 1, and comprises the following steps:

and S101, placing the carrier with the printed resistor into a ceramic slip casting mold.

And printing the resistor paste on the carrier to form the carrier with the printed resistor. Or printing the resistance paste on a carrier module, drying and shaping the carrier module, and dividing the dried carrier module to obtain at least two carriers with printed resistors. Through the mode of carrier module, can obtain the carrier of a plurality of printing resistance fast, be favorable to improving production efficiency.

The high-temperature ceramic refers to a ceramic body sintered by high-temperature kiln fire above 1200 ℃; the low-temperature ceramic refers to a ceramic body sintered by kiln fire at about 1000 ℃ or below, and the higher the temperature is, the higher the crystallization density of the glaze is, the higher the strength of the ceramic surface is, the ceramic is not easy to fall off, and the scratches are not easy to generate. Compared with low-temperature ceramics, the high-temperature ceramics have more strict manufacturing process requirements, and the hardness of the high-temperature ceramics is firmer; the low-temperature ceramic is more fragile and is easy to have the phenomenon of powder falling; the high-temperature ceramic is smoother and more exquisite; whereas low temperature ceramics are somewhat rough. The sufficient high temperature can lead the raw materials to be completely vitrified, so the high-temperature ceramic has better performance in the aspects of strength, wear resistance and density of glaze.

In the conventional manner, the heat generating function of the ceramic atomizing core is realized by energizing the metal sheet. The metal sheet is usually sintered together with the ceramic, but the metal sheet is easily deformed and fails in high-temperature sintering. In the embodiment, because the resistor part is carried by the carrier, the carrier with the printed resistor is used for replacing the metal sheet, and the deformation and the failure can not occur in the high-temperature heating process, so that the precision of the ceramic atomizing core after high-temperature sintering is ensured, and the stability of the ceramic atomizing core is improved.

And S102, injecting ceramic slurry into the ceramic slip casting mold for shaping to obtain a ceramic atomized core blank.

And S103, sintering the ceramic atomizing core blank at a preset temperature to obtain the ceramic atomizing core.

In this embodiment, ceramic slurry is injected into a forming mold in which a carrier with a printed resistor is placed for filling and shaping, so that the carrier with the printed resistor and the ceramic slurry to be sintered are effectively combined to form a high-quality ceramic atomized core blank. The preset temperature is a temperature suitable for sintering the ceramic atomizing core blank at one time. In the traditional low-temperature ceramic sintering method, the sintering temperature is 700-900 ℃, and the ceramic atomization core sintered at the temperature is easy to have the phenomenon of ceramic powder falling. The preset temperature in the embodiment is higher than the sintering temperature in the traditional low-temperature ceramic sintering method, so that the problem of ceramic powder falling is solved. For example, the preset temperature may be a high temperature of 1200 ℃ or more.

In the traditional high-temperature ceramic sintering method, although the sintering temperature is higher than that in the low-temperature ceramic sintering method, the primary high-temperature sintering is carried out after slip casting is needed, resistance paste is printed on the surface of the ceramic after cooling, and the printed paste is sintered at high temperature for the second time after printing to form the resistor. The process of twice high-temperature sintering results in low production efficiency. In the embodiment, the carrier of the printed resistor is added in advance in the ceramic atomizing core blank, and the high-quality ceramic atomizing core can be quickly obtained only by one-time high-temperature sintering without two-time high-temperature sintering.

In this embodiment, the carrier with the printed resistor is placed in a ceramic slip casting mold, and ceramic slurry is injected into the ceramic slip casting mold for shaping, so as to obtain a ceramic atomized core blank. Because the carrier of the printed resistor is adopted in the ceramic atomizing core blank, the problems of deformation, failure and the like can not occur in the high-temperature sintering process, the precision of the ceramic atomizing core after the high-temperature sintering is ensured, and the stability of the ceramic atomizing core is improved. The problem that the porcelain powder falls off can be overcome by sintering at the preset temperature, so that the quality of the ceramic atomizing core is effectively improved, and the yield of products is improved. And the ceramic atomizing core blank before sintering contains the resistor, when the ceramic atomizing core blank is sintered at the preset temperature, the resistor does not need to be printed on the surface of the high-temperature sintered ceramic again to form the resistor for secondary high-temperature sintering, the high-quality ceramic atomizing core can be obtained only by one-time high-temperature sintering, and the production efficiency is effectively improved.

In an alternative embodiment, the prefabricated resistor paste is printed on a carrier to form the carrier with the printed resistor, the printed resistor can be used for replacing a metal sheet to realize heating and electric conduction of the atomizing core, the thickness of the printed resistor can be correspondingly controlled according to actual needs, circuit optimization of the heating core is realized, and heating uniformity and heating process stability are improved.

In an alternative embodiment, the printed resistor has a thickness of 0.01-0.6 mm. In the embodiment, the thickness of the printed resistor is 0.01-0.6mm, so that the resistor paste is conveniently printed on the carrier, and the distribution of the resistor can be optimized according to the actual heating requirement of the circuit, so that the optimization of the circuit is realized, and the stability is improved.

In alternative embodiments, the carrier is one of a plastic carrier, a paper carrier, a wood carrier, or a textile carrier. It should be noted that the carrier is one of a plastic carrier, a paper carrier, a wood carrier or a textile carrier, which is convenient for melting consumption in a one-time high-temperature sintering process, and the printed resistor is rapidly contacted with the ceramic slurry and sintered and molded, wherein the plastic carrier is more stable and has better combination effect with the printed resistor, and can be selected as the most preferable material.

In an alternative embodiment, the ceramic atomized core blank is sintered for a predetermined time by a high temperature furnace.

In an alternative embodiment, the sintering temperature of the ceramic atomizing core blank is greater than or equal to 1200 ℃. The sintering temperature of the ceramic atomizing core blank is greater than or equal to 1200 ℃, so that the ceramic atomizing core with high strength can be obtained.

In an alternative embodiment, the carriers are arranged in a regular geometric shape. It should be noted that the carrier is arranged in a regular geometric shape, so that the processing and manufacturing are convenient, and the production efficiency of the ceramic atomizing core can be improved.

In an alternative embodiment, the carrier is arranged in a polygon.

In an alternative embodiment, as shown in fig. 2, in order to improve the mass production, the improvement of the production efficiency is realized;

the printing process can print a plurality of groups of preset resistance areas on one carrier module at one time by the resistance paste, and dry and shape the carrier module;

a dividing procedure, namely dividing the dried carrier module to obtain at least two carriers with the printed resistors, so that a plurality of carriers with the printed resistors are obtained after one-time printing, and only subsequent division is needed to be carried out on the carriers, and a plurality of dividing modes, such as laser cutting, cutter cutting and the like, can be selected according to different carrier materials during division;

and an integral sintering step of performing integral sintering in the above embodiment using the divided carrier with the printed resistors to obtain a desired ceramic atomizing core.

In an alternative embodiment, the pre-fabricated resistor paste is printed onto the support using a printer, which is one of a screen printer, a transfer printer or a pad printer.

The invention also provides preparation equipment for the method for preparing the ceramic atomizing core by one-time high-temperature sintering, and the preparation equipment is used for preparing the ceramic atomizing core by one-time high-temperature sintering.

The preparation equipment provided by the invention prepares the ceramic atomizing core through one-time high-temperature sintering, forms a high-strength ceramic atomizing core finished product, improves the production efficiency and the product yield, and has a wide application prospect.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.