阅读说明：本技术 线束的生产方法及线束 (Wire harness production method and wire harness ) 是由 王超 苗云 于 2021-07-30 设计创作，主要内容包括：本发明提供了一种线束的生产方法及线束,该线束的生产方法包括：步骤S10,制备印刷版；步骤S20,制备基板；步骤S30,通过所述印刷版将导电油墨印刷至所述基板上；步骤S40,所述导电油墨凝结,形成导电回路；步骤S50,在所述导电回路的周围及表面形成绝缘保护层。通过本发明,缓解了对电器件进行电气连接的线束,生产工艺比较复杂、加工成本较高的技术问题。(The invention provides a production method of a wire harness and the wire harness, wherein the production method of the wire harness comprises the following steps: step S10, preparing a printing plate; step S20, preparing a substrate; a step S30 of printing conductive ink onto the substrate by the printing plate; step S40, the conductive ink is condensed to form a conductive loop; step S50, forming an insulating protection layer around and on the surface of the conductive loop. The invention relieves the technical problems of complicated production process and high processing cost of the wire harness for electrically connecting the electric devices.)

1. A method of producing a wire harness, characterized by comprising:

step S10, preparing a printing plate;

step S20, preparing a substrate;

a step S30 of printing conductive ink onto the substrate by the printing plate;

step S40, the conductive ink is condensed to form a conductive loop;

step S50, forming an insulating protection layer around and on the surface of the conductive loop.

2. The production method of a wire harness as set forth in claim 1, characterized in that the production method of a wire harness includes step S60 carried out after the step S50, the step S60: printing conductive ink onto the insulating protective layer by the printing plate;

and, the step S60, the step S40, and the step S50 are alternately performed one or more times in sequence.

3. The production method of a wire harness according to claim 2, characterized by comprising:

and step S70, punching the insulating protective layer and/or the conductive loop, and pouring a conductive material to form a communication loop for electrically connecting at least two layers of the conductive loops.

4. The production method of a wire harness according to claim 2, characterized by comprising:

step S25, printing a lower shield layer on the substrate;

step S80, printing an upper shielding layer on the periphery of the insulating protection layer, wherein the upper shielding layer is electrically connected with the lower shielding layer and seals the conductive loop;

the step S25 is performed before the step S30, and the step S80 is performed before the step S50.

5. The method of producing a wire harness according to claim 1, wherein the step S30 employs a plurality of printing.

6. The method of producing a wire harness according to claim 1, wherein the step S30 is performed by screen printing, letterpress printing, flexographic printing, gravure printing, or lithography.

7. The method for producing a wire harness according to claim 6, wherein the wire harness is a space wire harness, and the step S30 is performed by letterpress printing, flexographic printing or gravure printing.

8. The production method of a wire harness as set forth in claim 1, further comprising a step S90 carried out after step S50, the step S90: and crimping or welding a connecting terminal at the terminal of the conductive loop.

9. The production method of a wire harness according to claim 8, further comprising a step S100 carried out after step S90, the step S100: a sheath is provided at a terminal of the conductive loop, and the connection terminal is accommodated in the sheath.

10. The production method of a wire harness according to claim 1 or 2, characterized by further comprising a step S110 performed after step S50, the step S110: and arranging a heat sink on the insulating protective layer.

11. The method for producing a wire harness according to claim 1, wherein the step S40 is to dry and coagulate the conductive ink by one or more of natural drying, hot and cold air drying, infrared irradiation drying, and ultraviolet curing.

12. The method for producing a wire harness as claimed in claim 1, wherein the one conductive layer formed in the steps S30 and S40 includes a plurality of the conductive loops; in the conducting layer of the same layer, a plurality of conducting loops are disconnected or electrically connected.

13. The method for producing a wire harness according to claim 1, wherein the step S10 is a method of machining or 3D printing to prepare the printing plate.

14. The method for producing a wire harness as claimed in claim 1, further comprising a step S15 carried out after the step S10, wherein an insulating layer is provided on a surface of the substrate.

15. The method for producing a wire harness according to claim 1, wherein the step S50 forms the insulating protective layer by one or more of coating, printing, spraying, immersion plating, and injection molding.

16. A wire harness produced by the method for producing a wire harness according to any one of claims 1 to 15, comprising: the conductive circuit comprises a substrate, at least one conductive circuit layer and at least one insulating protective layer, wherein each conductive circuit layer is located between the substrate and the outermost insulating protective layer, and the conductive circuit layers and the insulating protective layers are alternately distributed.

17. The wire harness as claimed in claim 16, wherein the cross-sectional width of the conductive loop is 0.1mm to 68 mm.

18. The wire harness as claimed in claim 16, wherein the cross-sectional width of the conductive loop is 0.5mm to 58 mm.

19. The wire harness as claimed in claim 16, wherein the conductive loop material is conductive ink.

20. The wire harness of claim 19, wherein the conductive ink includes conductive fillers, binders, solvents, and additives, the conductive fillers including combinations of one or more of metal powders, conductive ceramics, carbonaceous conductors, solid electrolytes, mixed conductors, conductive polymeric materials.

21. The wire harness of claim 20, wherein the carbon-containing conductor is one or a combination of graphite powder, carbon nanotube material, and graphene material.

22. The wire harness as claimed in claim 20, wherein the metal powder employs one or more of nickel or an alloy thereof, cadmium or an alloy thereof, zirconium or an alloy thereof, chromium or an alloy thereof, cobalt or an alloy thereof, manganese or an alloy thereof, aluminum or an alloy thereof, tin or an alloy thereof, titanium or an alloy thereof, zinc or an alloy thereof, copper or an alloy thereof, silver or an alloy thereof, and gold or an alloy thereof.

23. The wire harness of claim 16, wherein the insulating protective layer is formed from one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene.

24. The wire harness according to claim 16, wherein the breakdown strength of the insulating protective layer is 0.3KV/mm to 35 KV/mm.

25. The wire harness according to claim 16, wherein the insulating protective layer has a thickness of 0.03mm to 5 mm.

Technical Field

The invention relates to the technical field of electronic components, in particular to a production method of a wire harness and the wire harness.

Background

Electrical connections for vehicles, household appliances, and the like are implemented using wiring harnesses. The existing wire harness mainly comprises parts such as wires, terminals, sheaths, positioning pieces, brackets and the like, and has the defects of multiple parts, more complex structure, more complex processing technology and lower automation degree.

A PCB (Printed Circuit Board) can quickly realize dense electrical Circuit molding, but the PCB is suitable for an integrated Circuit, is difficult to be suitable for electrical connection of electrical equipment, and is not suitable for electrical connection of large-sized equipment. The production equipment cost of the PCB is high, the production process is complex, the production process of the PCB comprises etching, and the environment is greatly polluted in the etching process.

Disclosure of Invention

The invention aims to provide a production method of a wire harness and the wire harness, which are used for relieving the technical problems of complicated production process and high processing cost of the wire harness for electrically connecting electric devices.

The above object of the present invention can be achieved by the following technical solutions:

the invention provides a production method of a wire harness, comprising the following steps:

step S10, preparing a printing plate;

step S20, preparing a substrate;

a step S30 of printing conductive ink onto the substrate by the printing plate;

step S40, the conductive ink is condensed to form a conductive loop;

step S50, forming an insulating protection layer around and on the surface of the conductive loop.

In a preferred embodiment, the method of producing a wire harness includes step S60 performed after the step S50, the step S60: printing conductive ink onto the insulating protective layer by the printing plate; and, the step S60, the step S40, and the step S50 are alternately performed one or more times in sequence.

In a preferred embodiment, the method of producing the wire harness includes: and step S70, punching the insulating protective layer and/or the conductive loop, and pouring a conductive material to form a communication loop for electrically connecting at least two layers of the conductive loops.

In a preferred embodiment, the method of producing the wire harness includes: step S25, printing a lower shield layer on the substrate; step S80, printing an upper shielding layer on the periphery of the insulating protection layer, wherein the upper shielding layer is electrically connected with the lower shielding layer and seals the conductive loop; the step S25 is performed before the step S30, and the step S80 is performed before the step S50.

In a preferred embodiment, the step S30 employs multiple printing.

In a preferred embodiment, the step S30 is performed by screen printing, letterpress printing, flexographic printing, gravure printing or lithography.

In a preferred embodiment, the line beam is a space line beam, and the step S30 is performed by letterpress printing, flexographic printing or gravure printing.

In a preferred embodiment, the method of producing a wire harness further includes step S90 performed after step S50, the step S90: and crimping or welding a connecting terminal at the terminal of the conductive loop.

In a preferred embodiment, the method of producing a wire harness further includes step S100 performed after step S90, the step S100: a sheath is provided at a terminal of the conductive loop, and the connection terminal is accommodated in the sheath.

In a preferred embodiment, the method of producing a wire harness further includes step S110 performed after step S50, the step S110: and arranging a heat sink on the insulating protective layer.

In a preferred embodiment, in step S40, the conductive ink is dried and coagulated by one or more of natural drying, hot air drying, infrared radiation drying, and ultraviolet curing.

In a preferred embodiment, the conductive layer formed in steps S30 and S40 includes a plurality of conductive loops; in the conducting layer of the same layer, a plurality of conducting loops are disconnected or electrically connected.

In a preferred embodiment, the step S10 is processed to prepare the printing plate using machining or 3D printing.

In a preferred embodiment, the method of producing a wire harness further includes a step S15, performed after the step S10, of providing an insulating layer on the surface of the substrate.

In a preferred embodiment, the step S50 is to form the insulating protection layer by one or more of coating, printing, spraying, dipping and injection molding.

The invention provides a wire harness produced by the production method of the wire harness, and the wire harness comprises: the conductive circuit comprises a substrate, at least one conductive circuit layer and at least one insulating protective layer, wherein each conductive circuit layer is located between the substrate and the outermost insulating protective layer, and the conductive circuit layers and the insulating protective layers are alternately distributed.

In a preferred embodiment, the cross-sectional width of the conductive loop is 0.1mm to 68 mm.

In a preferred embodiment, the cross-sectional width of the conductive loop is 0.5mm to 58 mm.

In a preferred embodiment, the conductive circuit material is conductive ink.

In a preferred embodiment, the conductive ink includes conductive fillers including a combination of one or more of metal powders, conductive ceramics, carbonaceous conductors, solid electrolytes, mixed conductors, conductive polymeric materials, binders, solvents, and additives.

In a preferred embodiment, the carbon-containing conductor is one or a combination of graphite powder, carbon nanotube material and graphene material.

In a preferred embodiment, the metal powder employs one or more of nickel or an alloy thereof, cadmium or an alloy thereof, zirconium or an alloy thereof, chromium or an alloy thereof, cobalt or an alloy thereof, manganese or an alloy thereof, aluminum or an alloy thereof, tin or an alloy thereof, titanium or an alloy thereof, zinc or an alloy thereof, copper or an alloy thereof, silver or an alloy thereof, and gold or an alloy thereof.

In a preferred embodiment, the material forming the insulating protective layer is one or a combination of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene and polyethylene.

In a preferred embodiment, the breakdown strength of the insulating and protecting layer is 0.3KV/mm to 35 KV/mm.

In a preferred embodiment, the thickness of the insulating protective layer is 0.03mm to 5 mm.

The invention has the characteristics and advantages that:

the production method of the wire harness adopts a conductive ink printing mode to form a conductive loop on the substrate, and the conductive loop can be connected with an external electric device to realize the electric connection function of the wire harness; and insulation protection is carried out through the insulation protection layer, so that the rapid forming of the wire harness loop is realized. The production method of the wire harness has the following advantages:

(1) the conductive loop has high forming efficiency, can be formed at one time, can realize automatic and large-batch rapid production, and has higher production automation degree;

(2) preparing a printing plate in advance, and forming a multi-loop and complex electric loop by adopting a printing mode;

(3) the wire harness consisting of parts such as wires, terminals, sheaths and the like is difficult to install and assemble in a use environment, and is a more time-consuming step in the whole product installation and assembly process; the wire harness produced by the production method is convenient to mount and dismount;

(4) the multi-layer printing can be adopted, more conductive loops can be prepared under the condition of smaller area of the substrate, and the requirement of more electrical loops is met;

(5) the modes of punching and pouring conductive materials can be adopted, so that the conductive loops of different layers can be electrically connected, the design scheme of a more complex electrical loop is realized, and the method can be suitable for more complex wire harnesses;

(6) the insulating protective layer is made of various materials, and can realize insulating protection by adopting various process modes, so that the insulating protection effect is guaranteed;

(7) the substrate can be a component of an electric device, the component and the wiring harness can be integrally produced, and the wiring harness can be rapidly mounted and dismounted;

(8) a copying printing plate can be adopted, printing can be carried out on a substrate which is not a plane, and the application environment of the wiring harness is increased;

(9) the flexible substrate can be used, so that the wiring harness can be suitable for various installation conditions; the produced wiring harness can be applied to electrical appliances with complex installation environments and can also be used in environments with higher vibration requirements, so that the interference of vibration factors is reduced;

(10) when the wiring harness is damaged, the damaged substrate can be directly replaced without dismounting and replacing the whole wiring harness, so that the maintenance time is saved, and the maintenance cost is reduced;

(11) the conductive ink is prepared from metal powder or other conductive powder, so that the conductive ink is good in conductivity, simple and convenient to prepare and less in pollution;

(12) the shielding layer is arranged outside the wire harness, so that signals in the wire harness can shield electromagnetic interference at a position with stronger electromagnetic interference, and the stability of the signals is ensured;

(13) the radiating fins are arranged on the insulating protective layer, so that heat generated by the current of the wire harness can be quickly radiated to the air, the temperature of the wire harness is favorably reduced, and the risk of fusing of the conductive circuit is reduced;

(14) the equipment cost is lower, has reduced the cost of pencil.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic view of a production method of a wire harness provided by the present invention;

fig. 2 to 3 are partial schematic views of a wire harness produced by the method for producing a wire harness according to the present invention;

FIG. 4 is a plan view of one embodiment of a wiring harness produced by the method for producing a wiring harness provided by the present invention;

FIG. 5 is a side cross-sectional view of one embodiment of a wire harness produced by the method for producing a wire harness provided by the present invention;

fig. 6 is a plan view of another embodiment of the wiring harness produced by the method for producing a wiring harness provided by the present invention;

fig. 7 is a side sectional view of another embodiment of the wire harness produced by the method for producing a wire harness provided by the present invention.

The reference numbers illustrate:

10. a substrate;

21. a conductive loop; 211. a connection terminal; 22. a communication loop; 23. a conductive bump;

30. a conductive layer; 31. an upper conductive layer; 32. a middle conductive layer; 33. a lower conductive layer; 34. an insulating sleeve;

40. and an insulating protective layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example one

The present invention provides a method of producing a wire harness, as shown in fig. 1, the method of producing the wire harness including: step S10, preparing a printing plate; step S20, preparing the substrate 10; step S30, printing the conductive ink onto the substrate 10 by the printing plate; step S40, the conductive ink is coagulated to form a conductive loop 21; in step S50, an insulating protection layer 40 is formed around and on the surface of the conductive loop 21.

The production method of the wire harness adopts a conductive ink printing mode, a conductive loop 21 is formed on the substrate 10, and the conductive loop 21 can be connected with an external electric device to realize the electric connection function of the wire harness; and is insulated and protected by the insulating protective layer 40, thereby realizing the rapid molding of the wire harness loop. By adopting the production method of the wire harness, the conductive circuit 21 is high in forming efficiency, can be formed at one time, can realize automatic and large-batch rapid production, and is high in production automation degree. The wire harness consisting of parts such as wires, terminals, sheaths and the like is difficult to install and assemble in a use environment, and is a more time-consuming step in the whole product installation and assembly process; the wire harness produced by the production method is convenient to mount and dismount, and the assembly efficiency is improved.

In an embodiment, the method of producing a wire harness includes step S60, step S60, which is performed after step S50: printing conductive ink onto the insulating protective layer 40 by a printing plate; step S60, step S40, and step S50 are alternately performed one or more times in sequence.

Step S30 and step S40 form a conductive layer 30 on the substrate 10; the steps S60 and S40 are performed once, and a conductive layer 30 may be formed on the formed conductive circuit 21 and the insulating protective layer 40. By alternately performing the steps S60, S40, and S50, a plurality of conductive layers 30 are formed on the substrate 10, forming a multilayer structure. By adopting multilayer printing to form a plurality of conductive layers 30, more conductive circuits 21 can be prepared under the condition that the area of the substrate 10 is smaller, and the requirement of more electric circuits can be met.

Fig. 2 and 3 are schematic views of a wiring harness produced by the method of producing a wiring harness, and the wiring harness shown in fig. 2 has a double-layer structure. As shown in fig. 3, one conductive layer 30 may include a plurality of conductive loops 21. In the wiring harness having a multilayer structure, the number and the structure of the conductive circuits 21 in the respective conductive layers 30 may be the same or different.

Further, the production method of the wire harness includes step S70, step S70: the insulating protective layer 40 and/or the conductive loops 21 are perforated and impregnated with a conductive material to form a communication loop 22 for electrically connecting at least two layers of the conductive loops 21. The mode of punching and pouring the conductive material is adopted, so that the conductive loops 21 on different layers can be electrically connected, the design scheme of a more complex electrical loop is realized, and the method can be suitable for more complex wire harnesses.

In one embodiment, the method for producing the wire harness includes perforating the insulating protective layer 40 between two adjacent conductive layers 30 and pouring a conductive material to form a communication loop 22, wherein the communication loop 22 communicates the conductive loops 21 of two adjacent conductive layers 30.

In one embodiment, the method of producing a wire harness produces a wire harness including at least three conductive layers 30, the at least three conductive layers 30 including an upper conductive layer 31, a middle conductive layer 32, and a lower conductive layer 33; a communication circuit 22 penetrating the middle conductive layer 32 is provided, and the communication circuit 22 communicates with the upper conductive layer 31 and the lower conductive layer 33, respectively. In some cases, the communication circuit 22 passes through the conductive circuit 21 of the middle conductive layer 32 and communicates with the conductive circuit 21, thereby communicating the upper conductive layer 31, the middle conductive layer 32, and the lower conductive layer 33 at the same time. In other cases, the communication circuit 22 passes through the middle conductive layer 32 through a region where the conductive circuit 21 is not disposed, and the communication circuit 22 communicates the upper conductive layer 31 and the lower conductive layer 33, and avoids the conductive circuit 21 of the middle conductive layer 32 from communicating therewith.

In some embodiments, one or more conductive layers 30 are located between two conductive layers 30 in communication with the communication circuit 22, and communication with the intermediate one or more conductive layers 30 is to be avoided. The conductive loop 21 in the intermediate conductive layer 30 may be modified, for example, by extending the conductive loop 21 along a curve or a broken line to avoid the position where the perforation is provided to connect the loops 22. The communication loop 22 may also be arranged to extend along a broken or curved line to avoid the intermediate conductive layer or layers 30.

After each conductive layer 30 is formed, punching and filling with a conductive material may be performed; it is also possible to form the conductive layer 30 and the insulating protective layer 40 while punching and pouring the conductive material, for example, after one conductive layer 30 or one insulating protective layer 40 is formed, the layer is punched and poured with the conductive material to form the connection loop 22, and then the next conductive layer 30 or the insulating protective layer 40 is formed. In some cases, the conductive loops 21 in the middle conductive layer 30 are relatively dense, and it is difficult to avoid the conductive loops 21 in the middle conductive layer 30 by improving the conductive loops 21. Therefore, the inventors have made further improvements to the production method of the wire harness and the wire harness produced thereby.

As shown in fig. 4 and 5, the wire harness includes an upper conductive layer 31, a middle conductive layer 32, and a lower conductive layer 33, the conductive loops 21 in the upper conductive layer 31 are respectively connected with the conductive protrusions 23, the conductive protrusions 23 are offset from the conductive loops 21 in the middle conductive layer 32, the communication loops 22 are respectively communicated with the conductive protrusions 23 in the upper conductive layer 31 and the conductive protrusions 23 in the lower conductive layer 33, and the conductive loops 21 in the middle conductive layer 32 are avoided, so that the upper conductive layer 31 is communicated with the lower conductive layer 33 and the communication with the middle conductive layer 32 is avoided.

As shown in fig. 6 and 7, the wire harness includes an upper conductive layer 31, a middle conductive layer 32, and a lower conductive layer 33, the punching position of step S50 is opposite to the conductive loop 21 of the upper conductive layer 31, the conductive loop 21 of the lower conductive layer 33, and the conductive loop 21 of the middle conductive layer 32, and the punched hole penetrates through the conductive loop 21 of the middle conductive layer 32; an insulating sleeve 34 is arranged in the hole, the insulating sleeve 34 is positioned on the middle conducting layer 32 and separates the conducting loops 21 of the middle conducting layer 32; by pouring a conductive material into the hole and the insulating sheath 34, the communication between the communication circuit 22 and the intermediate conductive layer 32 can be avoided.

Further, as shown in fig. 7, the hole punched in step S50 is a stepped hole, and the inner diameter of the portion of the stepped hole located in the lower conductive layer 33 is smaller to facilitate the arrangement of the insulating sleeve 34, and the stepped portion of the stepped hole can support the insulating sleeve 34.

In one embodiment, the conductive layer 30 formed in steps S30 and S40 includes a plurality of conductive loops 21 to prepare more conductive loops 21. In the conductive layer 30 of the same layer, the plurality of conductive circuits 21 are disconnected or electrically connected. For example: each conductive loop 21 in the conductive layer 30 of the same layer is disconnected; at least two conductive circuits 21 are electrically connected to each other in the conductive layer 30 of the same layer. The conductive circuit 21 in each conductive layer 30 is provided according to the electrical connection function to be realized.

The structure of the conductive loop 21 in one of the conductive layers 30 is determined by the printing plate. The production method of the wire harness adopts a transfer printing mode to print, a printing plate is designed according to a conductive loop 21 to be formed, conductive ink is firstly coated on the printing plate, and then printing of the conductive ink is carried out by utilizing printing equipment. The printing plate is prepared in advance, the conductive loop 21 in the conductive layer 30 is formed by printing, and a plurality of conductive loops 21 can form a multi-loop complex electric loop.

In one embodiment, step S10 is processed to prepare a printing plate using machining or 3D printing. According to the requirement of the electric circuit, a printing plate is prepared, an ink layer can be formed on the printing plate according to the path of the electric circuit, and the ink is printed on the substrate 10 or the insulating protective layer 40 by means of transfer printing. The wider the cross-sectional width of the conductive loop 21, the larger the on-current. The printing plate is designed according to the requirements of the on-current so as to control the cross-sectional width of the conductive loop 21.

The conductive loop 21 is convex and has a large cross-sectional area. In one embodiment, step S30 employs multiple printing, and the thickness of the conductive loop 21 is increased by multiple printing in the same conductive layer 30. The same printing plate may be used for multiple prints to successively increase the thickness of the conductive loop 21.

In one embodiment, step S30 is performed by screen printing, letterpress printing, flexographic printing, gravure printing or lithography. The gravure printing can control the thickness of printing ink through the gravure depth of a printing plate; by specifically designing the intaglio printing plate, conductive loops 21 of different thicknesses can be provided in the same conductive layer 30.

Specifically, in the case of screen printing, a screen is used as a plate base, and a screen printing plate with images and texts is manufactured by a photosensitive plate making method. The screen printing equipment comprises a screen printing plate, a scraper, ink, a printing table and a printing stock, wherein the printing stock can be a substrate 10 or an insulating protective layer 40 which is formed, and the basic principle that meshes of image-text parts of the screen printing plate are permeable to the ink and meshes of non-image-text parts of the screen printing plate are impermeable to the ink is utilized for printing. In the case of relief printing, the image portion of the printing plate is convex. In the case of flexographic printing, printing is performed using a molded rubber relief plate. In the case of gravure printing, the entire printing plate surface is coated with ink, then a specially-made ink wiping mechanism is used to remove the ink from the blank portion, so that the ink remains only in the cells of the image-text portion, and then the ink is transferred to the surface of a printing material under a relatively large pressure, wherein the printing material can be the substrate 10 or the formed insulating protective layer 40. In the case of a flat plate, the image-text part and the non-image-text part on the printing plate are approximately positioned on the same plane, and in order to enable ink to distinguish the image-text part from the non-image-text part during printing, water is firstly supplied to the non-image-text part of the printing plate by a water supply device of the printing plate part, so that the non-image-text part of the printing plate is protected from being soaked by the ink.

The wiring harness produced by the wiring harness production method can be a plane wiring harness which is two-dimensional and can also be a space wiring harness, and the conductive circuit 21 extends on the plane of the XY axis; the spatial beam is three-dimensional, and the conductive circuit 21 may extend in the Z-axis direction in addition to the XY-axis direction. In the case where the produced wiring harness is a planar wiring harness, step S30 is performed by screen printing, letterpress printing, flexographic printing, gravure printing, or lithography. In the case where the produced wiring harness is a spatial wiring harness, it is preferable that the step S30 is performed by letterpress printing, flexographic printing or gravure printing.

The step S60 may adopt the same printing process as the step S30, and will not be described herein.

In step S40, the conductive ink may be coagulated by drying. In one embodiment, in step S40, the conductive ink is dried and coagulated by one or more of natural drying, hot air drying, infrared irradiation drying, and ultraviolet curing.

In one embodiment, step S50 forms the insulating protection layer 40 by one or more of coating, printing, spraying, dipping, and injection molding, so as to ensure the insulating protection effect of the insulating protection layer 40 on the conductive layer 30.

Step S20 includes cleaning the surface of the substrate 10. The substrate 10 may be cleaned by one or more of solution rinsing, ultrasonic rinsing, and high pressure rinsing to remove oil, impurities, and dirt.

In one embodiment, the method of producing a wire harness further includes a step S15 performed after the step S10, the surface of the substrate 10 is provided with an insulating layer, and the conductive circuit 21 is formed on the surface of the insulating layer. When the substrate 10 may be made of a conductive material, the insulating layer is previously disposed on the substrate 10, so that the insulation between the conductive loops 21 can be ensured. The insulating layer can be formed by one or more of coating, printing, spraying, immersion plating and injection molding. In the case where the substrate 10 itself is an insulating material, the insulating layer may not be provided.

The substrate 10 can adopt a profiling structure, printing can be carried out on the non-planar substrate 10, and the application environment of the produced wiring harness is expanded, so that the produced wiring harness is adapted to the application environment; the substrate 10 can be a flexible substrate 10, so that the produced wiring harness can be suitable for various installation conditions, is convenient to apply to an electrical appliance with a complex installation environment, is beneficial to reducing the interference of vibration factors, and ensures the stability of use in an environment with higher vibration requirements. The substrate 10 may be a component of an electrical device, and may be used to implement integrated production of the component and the wiring harness, and to implement quick assembly and disassembly of the wiring harness. For example, the substrate 10 is a vehicle body component or a component of a vehicle-mounted electric appliance, the conductive circuit 21 and the substrate 10 are integrated, and the wiring harness can be replaced by replacing the substrate 10, so that the maintenance time is saved, and the maintenance cost is reduced. For example, the inner panel of the door may be used as the substrate 10 of the door harness, and the inner panel may be directly replaced during maintenance. The substrate 10 may be a body in white, a bumper, a roof, a door inner panel, a seat frame, or a component of various in-vehicle electric appliances.

According to the production method of the wire harness, the conductive circuit 21 is formed in a printing mode, the equipment cost is low, the cost of the wire harness is reduced, the processing is quick, the material increase processing is realized, and the pollution is small. The processing of the printing plate can be carried out by using a machining mode and a 3D printing mode; printing of the conductive ink is performed using a printing apparatus. By adopting the production method, the raw material of the electric wire and the complex processes of complex wire cutting, terminal pressing, sheath inserting, rubber coating and the like are not needed, the circuit can be printed at one time, and can also be directly printed on the shell of a corresponding product, so that the processing time is saved, and the mass automatic production is realized.

In one embodiment, the method of producing a wire harness includes steps S25 and S80, step S25 being performed before step S30, step S80 being performed after step S50; step S25, printing a lower shield layer on the substrate; step S80, printing an upper shielding layer on the periphery of the insulating protection layer, wherein the upper shielding layer is electrically connected to the lower shielding layer and closes the conductive loop. The upper shielding layer is connected with the lower shielding layer through the shielding layer positioned on the side wall of the wire harness, and the upper shielding layer, the lower shielding layer and the shielding layer positioned on the side wall of the wire harness form a box structure to surround the conductive loop. The shielding structure is arranged outside the wire harness, so that the electromagnetic interference can be shielded by signals in the wire harness at a position where the electromagnetic interference is strong, and the stability of the signals is ensured.

In the case where the wire harness includes a plurality of conductive layers, the upper shield layer is provided above the uppermost conductive layer, i.e., step S80 is performed before step S50 which is performed the last time. In the case where the insulating layer is provided on the surface of the substrate, the lower shield layer is provided above the insulating layer. The shielding layer on the side wall of the wire harness can be formed by spraying or printing, and can also be made of aluminum foil.

In an embodiment, the method of producing a wire harness further includes step S90, step S90, which is performed after step S50: the connection terminal 211 is crimped or soldered at the terminal end of the conductive loop. Through the mutual insertion of the connection terminals 211, the electrical connection between different wire harnesses or between the wire harness and the electrical appliance is realized.

As shown in fig. 2 and 3, the terminal of the conductive loop 21 is provided with a connection terminal 211, and the connection terminal 211 can be a gold finger, a pin terminal or a soldered wire to connect with other electrical loops.

Further, the method of producing a wire harness further includes step S100 performed after step S90, step S100: a sheath is provided at the terminal of the conductive loop, and the connection terminal 211 is accommodated in the sheath. The contact connection of the connection terminal 211 inside the sheath is achieved by the opposite insertion of the sheath. Under some circumstances, set up a plurality of connecting terminal 211 in a sheath, two matched with sheaths are connected, and the fastness of guarantee connection can make connecting terminal 211's electric connection more reliable stable.

In an embodiment, the method of producing a wire harness further includes step S110 performed after step S50, step S110: set up the fin on insulating protective layer, through the fin, give off the heat that pencil electric current produced to the air fast, be favorable to reducing the temperature of pencil, reduce the risk of conductive circuit fusing.

Example two

The invention provides a wire harness produced by the production method of the wire harness, which comprises the following steps: the conductive circuit comprises a substrate 10, at least one conductive circuit 21 and at least one insulating protective layer 40, wherein each conductive circuit 21 is located between the substrate 10 and the outermost insulating protective layer 40, and the conductive circuits 21 and the insulating protective layers 40 are alternately distributed. The wire harness is suitable for automatic and large-batch rapid production, the conductive loop 21 can be formed at one time, the production automation degree is high, the efficiency is high, and the production cost is reduced; the installation and the disassembly are convenient, and the assembly efficiency is improved.

In one embodiment, the conductive loop has a cross-sectional width of 0.1mm to 68 mm. In the wire harness, the sectional area of the conductor determines the current which can be conducted by the conductor, and generally, the conductor for realizing signal conduction has smaller current and smaller conductor sectional area, for example, the minimum sectional area of a signal wire of the automobile wire harness can reach 0.1mm²The conductor for realizing the power supply conduction has larger current and larger conductor sectional area, for example, the maximum sectional area of a wire harness of an automobile storage battery reaches 260mm²。

When the width of the conductive loop 21 is less than 0.1mm, it is desirable to obtain a cross-sectional area of 0.1mm²The conductor of (2) is to print the conductive circuit 21 having a thickness of at least 1mm, and the smaller the width, the larger the thickness, and in order to obtain a thicker thickness, it is necessary to perform printing many times, which wastes man-hours and lowers the processing efficiency, and further, the conductive circuit 21 is too narrow, so that the strength is not satisfactory, and the layout of the wire harness is restricted, and the height of the wire harness cannot be reduced.

When conducting electricity backWhen the width of the road 21 is larger than 68mm, the cross-sectional area is 260mm²The conductor of (2) is printed to have a thickness of at least 3.82mm, and the larger the width, the smaller the thickness, but the smaller the thickness, the larger the area of the printed conductive circuit 21, and the area occupied by the wire harness cannot be reduced.

Therefore, the inventors have selected the cross-sectional width of the conductive loop to be 0.1mm to 68mm, and obtained conductors of different cross-sectional areas by printing the conductive loop 21 of different thicknesses.

Through a plurality of experiments, the inventor obtains that when the cross-sectional width of the conductive loop is 0.5mm-58mm, the aspect ratio of the printed conductive loop 21 is in a reasonable range, the thickness range is suitable for printing processing, and the occupied area is not wasted, so the inventor prefers that the cross-sectional width of the conductive loop is 0.5mm-58 mm.

In one embodiment, the conductive circuit is made of conductive ink. The conductive ink can realize conductive performance, has viscosity, can be firmly attached to a base material, has fluidity, can be used for manufacturing a conductive loop by using a printing process, has higher production automation degree and higher efficiency, and reduces the production cost.

In one embodiment, the conductive ink includes a conductive filler including a combination of one or more of metal powder, conductive ceramic, carbon-containing conductor, solid electrolyte, mixed conductor, conductive polymer material, binder, solvent, and additive.

In one embodiment, the carbon-containing conductor is one or a combination of graphite powder, carbon nanotube material and graphene material.

The conductive ink can be prepared from metal powder or other conductive powder, so that the formed conductive loop 21 has good conductivity, and is simple and convenient to prepare and low in pollution.

In one embodiment, the metal powder may be one or more of nickel or its alloy, cadmium or its alloy, zirconium or its alloy, chromium or its alloy, cobalt or its alloy, manganese or its alloy, aluminum or its alloy, tin or its alloy, titanium or its alloy, zinc or its alloy, copper or its alloy, silver or its alloy, and gold or its alloy. However, as copper prices have increased, the material cost of using copper as a conductor has become higher. For this reason, alternatives to metallic copper are being sought to reduce costs. The content of metal aluminum in the earth crust is about 7.73%, the price is relatively low after the refining technology is optimized, the weight of the aluminum is lighter than that of copper, the conductivity is only inferior to that of copper, and the aluminum or aluminum alloy can replace part of copper or copper alloy in the field of electrical connection.

In one embodiment, the binder includes at least one of an epoxy resin, a polyester resin, an acrylic resin, a polyamide resin, a modified phenolic resin, and a cellulose resin.

In one embodiment, the material forming the insulating protective layer is one or a combination of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene.

In one embodiment, the breakdown strength of the insulating protective layer is from 0.3KV/mm to 35 KV/mm. The breakdown strength is also called dielectric breakdown strength. Indicating that the material can bear the highest electric field strength without being damaged (broken down) under the action of the electric field. When the breakdown strength of the insulating protective layer is lower than 0.3KV/mm, a part of the thinner insulating protective layer is likely to be broken down under normal voltage, thereby causing the insulation to be ineffective. When the breakdown strength of the insulating protective layer is higher than 35KV/mm, the high voltage higher than 35KV cannot occur in a general vehicle-mounted environment, and the cost of the integrated wiring harness assembly can be increased by selecting a material with excessively high breakdown strength, so that design waste is caused.

In one embodiment, the thickness of the insulating protective layer is 0.03mm to 5 mm. The thickness of insulating protective layer is less than 0.03mm, and the breakdown voltage that not only can not guarantee insulating protective layer is higher than operating voltage, also can not guarantee insulating protective layer's wear resistance, scrapes the mill back many times, can make insulating protective layer damaged, exposes the conductor, can lead to the condition of electric leakage or short circuit, causes the circuit to damage, functional failure. When the thickness of the insulating protective layer is equal to 5mm, the breakdown voltage, the insulation resistance and the wear resistance of the insulating protective layer can meet the requirements, but when the thickness is larger than 5mm, the thickness of the insulating protective layer is larger, air holes, collapse and other problems occur in the processing process, the performance of the insulating protective layer is reduced, in addition, the material of the insulating protective layer is wasted, and the processing procedures and time are increased, so that the thickness of the insulating protective layer selected by an inventor is 0.03mm-5 mm.

The substrate 10 can adopt a profiling structure, printing can be carried out on the non-planar substrate 10, and the application environment of the produced wiring harness is expanded, so that the produced wiring harness is adapted to the application environment; the substrate 10 can be a flexible substrate 10, so that the produced wiring harness can be suitable for various installation conditions, is convenient to apply to an electrical appliance with a complex installation environment, is beneficial to reducing the interference of vibration factors, and ensures the stability of use in an environment with higher vibration requirements. The substrate 10 may be a component of an electrical device, and may be used to implement integrated production of the component and the wiring harness, and to implement quick assembly and disassembly of the wiring harness. For example, the substrate 10 is a vehicle body component or a component of a vehicle-mounted electric appliance, the conductive circuit 21 and the substrate 10 are integrated, and the wiring harness can be replaced by replacing the substrate 10, so that the maintenance time is saved, and the maintenance cost is reduced. For example, the inner panel of the door may be used as the substrate 10 of the door harness, and the inner panel may be directly replaced during maintenance. The substrate 10 may be a body in white, a bumper, a roof, a door inner panel, a seat frame, or a component of various in-vehicle electric appliances.

A typical printed circuit board functions primarily as a circuit board for mounting electrical components to perform a specific electrical function. Unlike a typical printed circuit board, the wire harness plays a role of conducting current and transmitting signals, the terminal of the conductive circuit 21 is provided with a connection terminal 211, the connection terminal 211 may be a gold finger, a pin terminal, or a soldered wire, and the connection terminal 211 electrically connects the conductive circuit 21 with a power source or a power-using device.

At present, an automobile wire harness is usually produced independently for a wire harness factory, wires, terminals, sheaths, positioning pieces, sealing pieces, brackets and the like are processed and assembled together to form a complete wire harness, the complete wire harness is delivered to the automobile factory, and the wire harness is assembled on an automobile body at a station during automobile final assembly, so that the installation is difficult and labor is wasted.

This pencil can directly set up on the automobile body panel beating, on the panel board or on the power consumption device, need not set up the pencil alone, and the auto parts installation is accomplished, and the pencil is just also installed and is accomplished, when saving car assembly, reduces 60% at least manual operation.

The above description is only a few embodiments of the present invention, and those skilled in the art can make various changes or modifications to the embodiments of the present invention according to the disclosure of the application document without departing from the spirit and scope of the present invention.