阅读说明：本技术 用于x射线管的阳极靶盘及其制造方法、x射线管 (Anode target disk for X-ray tube, manufacturing method thereof and X-ray tube ) 是由 盛清清 马新星 彭山东 于 2021-08-20 设计创作，主要内容包括：本申请实施例公开了一种用于X射线管的阳极靶盘及其制造方法、X射线管,所述阳极靶盘包括基体和底座；所述底座上或所述基体上具有连接增强面；所述连接增强面包括第一刻槽区和焊料摆放区；所述焊料摆放区用于摆放固态焊料,且所述第一刻槽区上设有若干第一刻槽；所述若干第一刻槽中至少一个第一刻槽沿着所述阳极靶盘的径向延伸；所述第一刻槽区环绕所述焊料摆放区,或者所述焊料摆放区环绕所述第一刻槽区；所述基体和所述底座通过所述固态焊料连接。(The embodiment of the application discloses an anode target disc for an X-ray tube, a manufacturing method of the anode target disc and the X-ray tube, wherein the anode target disc comprises a base body and a base; the base or the substrate is provided with a connection reinforcing surface; the connection enhancing surface comprises a first notching area and a solder placing area; the solder placing area is used for placing solid solder, and a plurality of first notches are arranged on the first notch area; at least one first notch groove of the plurality of first notch grooves extends along the radial direction of the anode target disc; the first grooving area surrounds the solder placing area, or the solder placing area surrounds the first grooving area; the base and the submount are connected by the solid state solder.)

1. An anode target disk for an X-ray tube, comprising a base body (2100) and a foot (2200); the base (2200) or the substrate (2100) has a connection enhancing surface (2300);

the connection enhancing surface (2300) comprises a first notching area (2310) and a solder placing area (2320); the solder placing area (2320) is used for placing solid solder (3000); a plurality of first notches (2311) are formed in the first notch area (2310); at least one first groove (2311) of the plurality of first grooves (2311) extends in a radial direction of the anode target disk (2000);

the first notching area (2310) surrounding the solder placement area (2320), or the solder placement area (2320) surrounding the first notching area (2310); the base (2100) and the mount (2200) are connected by the solid state solder (3000).

2. The anode target disk according to claim 1, wherein a through hole (2400) is provided on the base (2200) and/or the substrate (2100), and an opening (2410) of the through hole (2400) is located on the connection enhancing surface (2300).

3. The anode target disk of claim 2, wherein the solder landing zone (2320) is annular; the solder placement area (2320) is arranged around the opening (2410), and the first notch area (2310) is arranged around the solder placement area (2320);

one end of each first notch (2311) in the first notches (2311) is located at the outer edge of the solder placing area (2320), and the other end of each first notch (2311) in the first notches (2311) is located at the outer edge of the connection reinforcing surface (2300).

4. The anode target disk of claim 2, wherein the solder landing area (2320) is annular, the first slotted area (2310) is disposed around the opening (2410), and the solder landing area (2320) is disposed around the first slotted area (2310);

one end of each first notch (2311) in the plurality of first notches (2311) is located at the edge of the opening (2410), and the other end of each first notch (2311) in the plurality of first notches (2311) is located at the inner side edge of the solder placing area (2320).

5. The anode target disk according to claim 3 or 4, wherein a dam structure is provided on the connection enhancing surface (2300), and the dam structure is provided along one side edge of the solder placement area (2320) away from the first notch area (2310).

6. The anode target disk according to claim 4, wherein the connection enhancing surface (2300) further comprises a second notch zone (2330), the second notch zone (2330) is ring-shaped, and a plurality of second notches (2331) are formed on the second notch zone (2330); at least one second notch (2331) of the plurality of second notches (2331) extends in a radial direction of the anode target disk (2000);

the second notching area (2330) is arranged around the solder placing area (2320);

one end of each second notch (2331) in the second notches (2331) is positioned at the outer edge of the solder placing area (2320), and the other end of each second notch (2331) in the first notches (2311)) is positioned at the outer edge of the connection enhancing surface (2300).

7. The anode target disk of claim 1, wherein the solder landing area (2320) is circular, the first notch area (2310) is disposed around the solder landing area (2320), one end of each first notch (2311) of the plurality of first notches (2311) is located at an outer edge of the solder landing area (2320), and another end of each first notch (2311) of the plurality of first notches (2311) is located at an outer edge of the connection enhancing surface (2300).

8. An X-ray tube, characterized in that it comprises an anode target disk (2000) according to any one of claims 1 to 7.

9. The X-ray tube according to claim 8, characterized in that the X-ray tube comprises an anode rotor (4000), the anode rotor (4000) being insertable into the through hole (2400).

10. A method for manufacturing an anode target disc, characterized in that it is used for manufacturing an anode target disc (2000) according to any of claims 1-7;

the manufacturing method comprises the following steps:

placing solid state solder (3000) on the solder placement area (2320) of the anode target disk (2000);

heating the solid solder (3000), the substrate (2100) and the mount (2200) to melt the solid solder (3000); wherein the melted solid solder (3000) flows to the first scored region (2310) and along the first plurality of scores (2311) to join the substrate (2100) to the submount (2200).

Technical Field

The specification relates to the field of X-ray equipment, in particular to an anode target disk for an X-ray tube, a manufacturing method of the anode target disk and the X-ray tube.

Background

The X-ray tube comprises a vacuum tube, and a cathode filament and an anode target disk arranged in the vacuum tube. The cathode filament is used for generating an electron beam directed to the anode target disk, and the surface of the anode target disk converts the kinetic energy of the electron beam on the anode target disk into high-frequency electromagnetic waves, namely X rays. The anode target disk may generally include a substrate (e.g., a metal substrate) and a backing plate. The metal base body generates X-rays when being bombarded by electrons from the cathode filament, and the base is used for dissipating heat. The anode target disk is an important part of the X-ray tube, and the anode target disk needs to be rotated in a high temperature environment when the X-ray tube is operated.

Therefore, how to improve the connection stability between the base and the base of the anode target disk in order to ensure the working stability of the X-ray tube is a technical problem to be solved in the field.

Disclosure of Invention

One of the embodiments of the present application provides an anode target disk for an X-ray tube, comprising a base and a pedestal; the base or the substrate is provided with a connection reinforcing surface; the connection enhancing surface comprises a first notching area and a solder placing area; the solder placing area is used for placing solid solder; a plurality of first notches are arranged on the first notch area; the first grooving area surrounds the solder placing area, or the solder placing area surrounds the first grooving area; the base and the submount are connected by the solid state solder.

Another embodiment of the present application provides an X-ray tube comprising an anode target disk according to any of the claims of the present application.

Another embodiment of the present application provides a method for manufacturing an anode target disk, which is used for manufacturing the anode target disk according to any one of the embodiments of the present specification; the manufacturing method comprises the following steps: placing solid solder on the solder placement area of the anode target disk; heating the base, the base and the base provided with the solid solder to melt the solid solder; and the melted solid solder flows to the first notch area and flows along the plurality of first notches to connect the base body and the base.

Yet another embodiment of the present application provides a brazed structure including a first portion having a connection enhancing surface for connecting the first portion to a second portion; the connection enhancing surface comprises a first notching area and a solder placing area; the solder placing area is used for placing solid solder; a plurality of first notches are arranged on the first notch area; at least one first notch groove of the plurality of first notch grooves extends along the radial direction of the anode target disc; the first grooving area surrounds the solder placing area, or the solder placing area surrounds the first grooving area; the first portion and the second portion are connected by the solid state solder.

Drawings

The present description will be further explained by way of exemplary embodiments, which will be described in detail by way of the accompanying drawings. These embodiments are not intended to be limiting, and in these embodiments like numerals are used to indicate like structures, wherein:

FIG. 1 is a schematic structural view of an exemplary brazed structure shown in accordance with some embodiments herein;

FIG. 2 is a schematic diagram of the structure of an exemplary anode target disk, shown in accordance with some embodiments herein;

FIG. 3 is a schematic illustration of a structure of a connection enhancement surface according to some embodiments herein;

FIG. 4 is a schematic illustration of a structure of a connection enhancement surface according to some embodiments herein;

FIG. 5 is a schematic illustration of a structure of a connection enhancement surface according to some embodiments described herein;

FIG. 6 is a schematic illustration of a structure of a connection enhancement surface according to some embodiments herein;

FIG. 7 is a schematic cross-sectional view of a first score groove shown in accordance with some embodiments of the present disclosure;

fig. 8 is a flow chart of a method of manufacturing an anode target disk according to some embodiments of the present description.

Description of reference numerals: 1000. a brazing structure; 1100. a first portion; 1200. a second portion; 2000. an anode target disk; 2100. a substrate; 2200. a base; 2300. a connection enhancing surface; 2310. a first notching region; 2320. a solder placement area; 2311. first grooving; 2330. a second notching region; 2331. second grooving; 2400. a through hole; 2410. an opening; 2500. a boss; 3000. solid state solder; 4000. an anode rotor.

Detailed Description

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only examples or embodiments of the present description, and that for a person skilled in the art, the present description can also be applied to other similar scenarios on the basis of these drawings without inventive effort. Unless otherwise apparent from the context, or otherwise indicated, like reference numbers in the figures refer to the same structure or operation.

As used in this specification and the appended claims, the terms "a," "an," "the," and/or "the" are not intended to be inclusive in the singular, but rather are intended to be inclusive in the plural, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements.

Flow charts are used in this description to illustrate operations performed by a system according to embodiments of the present description. It should be understood that the preceding or following operations are not necessarily performed in the exact order in which they are performed. Rather, the various steps may be processed in reverse order or simultaneously. Meanwhile, other operations may be added to the processes, or a certain step or several steps of operations may be removed from the processes.

Brazing is a common welding method used in modern industry. In the brazing, solid solder (brazing filler metal) lower than the melting point of the welded part and the welded part are simultaneously heated to the melting temperature of the solid solder, so that the solid solder is melted into liquid solder, and the liquid solder can fill the gap of the welded workpiece, so that the welded workpiece is connected. Vacuum brazing is an operation in brazing technology, and can place solder between parts to be brazed (such as two parts), and then place the solder and the parts to be brazed in a vacuum heating chamber for heating, and by heating in the vacuum heating chamber, the heated solder and the parts to be brazed can be prevented from being oxidized by air or being burnt. In some embodiments, in order to make the connection between the welding parts more stable, notches may be provided on the connection enhancing surface of one or more of the welding parts, and the solid solder may be provided on the surface of the notches during the brazing operation, so that the melted liquid notches may flow into the notches, which facilitates the liquid solder to be drawn into and fill the gap between the welding parts by capillary action, thereby ensuring effective connection between the welding parts. However, since the solid solder is placed on the notch groove, air in the notch groove may not be discharged after the solid solder is melted and air holes may occur at the weld, which may result in an undesirable effect of improving the reliability of the connection between the soldered parts.

Embodiments of the present application provide a brazed structure that includes at least two portions, e.g., a first portion and a second portion. A first notch area and a solder placing area are arranged on the connection enhancing surface of one of the at least two parts. The solder placing area is used for placing solid solder. The first grooved region is used for generating capillary action on liquid solder. The first notch area is provided with a plurality of first notches which extend along the radial direction of the anode target disc. By placing one of the first scored region and the solder placement region around the other (e.g., the first scored region surrounds the solder placement region, or the solder placement region surrounds the first scored region), the first portion and the second portion may be joined by solid state solder. The molten solid solder in the solder placement area (i.e., the solder in the molten state of the solid solder) can flow into and along the first notch area. The liquid solder can gradually discharge the gas in the first notch groove in the flowing process of the liquid solder in the first notch groove, thereby reducing the generation of pores at the welding seam. And because the solder placing area is specially arranged, the solid solder can not obstruct the gas discharge. Therefore, the brazing structure provided by the application is beneficial to discharging gas in the first notch groove, so that air holes in the welding seam are reduced, and the connection reliability of each part of the brazing structure is effectively improved. The first notches of the first notch area can also increase the welding area, so that the stability of the brazing structure is further improved. In some embodiments, the brazed structure may be an anode target disk of an X-ray tube. In other embodiments, the brazed structure may be a cemented carbide tip, a drill bit, a heat exchanger, a microwave waveguide component, an electronic vacuum device, or the like. In some embodiments, the brazed structure may be fabricated by vacuum brazing.

FIG. 1 is a schematic structural view of an exemplary brazed structure 1000 in accordance with some embodiments herein. As shown in fig. 1, the brazed structure 1000 may include a first portion 1100 and a second portion 1200. The first portion 1100 may have an attachment enhancing surface 2300 thereon for attaching the first portion 1100 to the second portion 1200. As shown elsewhere in this specification (e.g., fig. 2-6 and the description thereof), the connection enhancement surface 2300 may include a first scored region 2310 and a solder landing region 2320. The solder placement area 2320 may be used for placing the solid solder 3000. The first scribing region 2310 may be provided with a plurality of first scribing grooves 2311. In some embodiments, at least one first notch 2311 of the plurality of first notches 2311 may extend in a radial direction of the brazing structure (e.g., an anode target disk described below), i.e., from an inner edge of the first notch area 2310 to an outer edge of the first notch area 2310. The first engraved area 2310 may surround the solder placement area 2320, or the solder placement area 2320 may surround the first engraved area 2310. Molten solid solder (i.e., solder that is substantially liquid after the solid solder has been melted) can flow from the solder landing area 2320 into the first notch area 2310 to form a connection between the first portion 1100 and the second portion 1200. The molten solid solder is in a liquid state. The liquid solder may flow in the first notch 2311 so that the gas in the first notch 2311 may be discharged. The first portion 1100 and the second portion 1200 may be connected by a solid solder 3000. It will be appreciated that first portion 1100 and second portion 1200 may be joined by solid solder 3000 (e.g., melted and re-solidified solid solder) after the melted and re-solidified solder has solidified.

In some embodiments, at least a portion of solid solder 3000 may also be placed on first scored region 2310, depending on the particular shape of solid solder 3000. For example only, when solid solder 3000 is placed on solder placement area 2320, a portion of solid solder 3000 may be placed on first notch area 2310 across an edge of solder placement area 2320.

The first part 1100 and the second part 1200 are both provided with connecting surfaces for connection, wherein the connecting surfaces on the first part are used as connection enhancing surfaces 2300 for enhancing the connection strength, and the first engraved regions 2310 arranged on the connection enhancing surfaces 2300 can enhance the connection strength between the first part 1100 and the second part 1200, so that the connection between the first part 1100 and the second part 1200 is more stable. The connection enhancing surface 2300 may be understood to be the surface of the first portion 1100 opposite the second portion 1200 when the first portion 1100 and the second portion 1200 are connected. After the molten solid solder flows from the solder receiving area 2320 into the first notch 2311 of the first notch area 2310, the molten solid solder, the first portion 1100 and the second portion 1200 may be cooled so that the liquid solder solidifies to form a connection between the first portion 1100 and the second portion 1200. For further explanation of the first engraved area 2310 and the solder placement area 2320, please refer to the relevant contents of fig. 2-6.

In some embodiments, the brazed structure may be an anode target disk 2000 (see fig. 2) for an X-ray tube. Since the temperature of the working environment in which the anode target disk 2000 is manufactured is high and high-speed rotation is required during use, connection between the parts (such as the base 2100 and the base 2200) of the anode target disk 2000 is achieved by brazing, so that reliable connection of the parts of the anode target disk 2000 can be ensured, and the anode target disk 2000 has stable operation and long service life. For a detailed description of the anode target disk 2000, please refer to fig. 2.

In some embodiments, the first portion 1100 may include one of the base 2200 and the base 2100, and the second portion 1200 may include the other of the base 2200 and the base 2100. In some embodiments, the first portion 1100 may include a base 2200, that is, the connection enhancing surface 2300 is provided on the base 2200. The base 2200 may be conveniently formed with grooves (e.g., the first grooves 2311) to improve the processing efficiency of the anode target disk 2000. In other embodiments, the first portion 1100 may include the substrate 2100, that is, the connection enhancement surface 2300 may be provided only on the substrate 2100. The specific materials of the base 2100 and the base 2200 are as follows.

In some embodiments, the base 2100 and the base 2200 may both be cylindrical, such as cylindrical, elliptical cylindrical, and the like. At this time, the connection enhancing surface 2300 may be circular or elliptical, or a portion thereof. The axes of the base 2100 and the base 2200 may (substantially) coincide, and the base 2100 and the base 2200 may rotate around the axes of the base 2100 and the base 2200 during operation of the X-ray tube. In this context, "substantially" is used to describe a feature (e.g., substantially coincident) means that the deviation from the feature is less than a threshold. The threshold may be an absolute value (e.g., 1 cm, 5 mm), or a relative value (e.g., 10%, 5% of its radius when the substrate is a circle).

Fig. 2 is a schematic diagram of an exemplary anode target disk according to some embodiments herein. As shown in fig. 2, the anode target disk 2000 may include a base 2100 and a seat 2200. The base 2200 or the base 2100 has an attachment enhancing surface 2300 thereon. When the attachment-enhancing surface 2300 is positioned on the base 2200, the attachment-enhancing surface 2300 may be understood to be the surface of the base 2200 that is intended to be attached to the substrate 2100. When the attachment-enhancing surface 2300 is positioned on the substrate 2100, the attachment-enhancing surface 2300 may be understood to be the surface of the substrate 2100 that is intended to be attached to the base 2200.

In some embodiments, when the connection enhancing surface 2300 is disposed on the base 2200, the base 2200 may be provided with a through hole 2400, and the opening 2410 of the through hole 2400 may be located on the connection enhancing surface 2300. The through hole 2400 may be penetrated by an anode rotor 4000 of the X-ray tube to enable the anode target disk 2000 to be mounted to the X-ray tube and to enable the anode target disk 2000 to rotate with the anode rotor 4000.

As shown elsewhere in the specification (e.g., fig. 3-6 and description thereof), the connection enhancement face 2300 of the anode target disk 2000 can include a first scored region 2310 and a solder landing region 2320. The solder placement area 2320 may be used for placing the solid solder 3000. First scored region 2310 may be used for molten solid solder flow. The first engraved area 2310 may be provided with a plurality of first engraved grooves 2311 to increase a welding area and facilitate air exhaust, thereby improving welding stability of the base 2200 and the base 2100. For a detailed description of the relative position between the first engraved area 2310 and the solder placing area 2320 and the arrangement manner of the first engraved area 2311 on the corresponding first engraved area 2310, please refer to the related contents of fig. 3-6.

In some embodiments, first engraved area 2310 may be annular. At least one first groove 2311 of the plurality of first grooves 2311 may extend in a radial direction (e.g., a direction indicated by an arrow a in fig. 3-6) of the anode target disk 2000, i.e., from an inner edge 2312 (shown in fig. 3) of the first groove area 2310 to an outer edge 2313 (shown in fig. 3) of the first groove area 2310. In some embodiments, an end of at least one first notch 2311 of the plurality of first notches 2311 is located at an edge of the solder placement area 2320, so that the end of the first notch 2311 receives the melted solid solder.

It is understood that the ring shape may include a circular ring shape, a triangular ring shape, a rectangular ring shape, a hexagonal ring shape, an irregular ring shape, and the like. In this application, the ring may include an inner edge and an outer edge that wraps around the inner edge. The shape of the inner and outer edges of the ring may be the same. For example, the inner edge and the outer edge of the ring shape may be both circular, and the ring shape is a circular ring shape; for another example, the inner edge and the outer edge of the ring may be both hexagonal, in which case the ring is a hexagonal ring. The shape of the inner and outer edges of the ring may be different. For example, the inner edge of the ring may be circular and the outer edge of the ring may be rectangular.

In some embodiments, the first notches 2311 may be spaced along a circumferential direction (e.g., a direction indicated by an arrow B in fig. 3-6) of the anode target disk 2000. That is, the first engraved grooves 2311 may be spaced apart in the circumferential direction of the anode target disk 2000. The circumference of the anode target disk 2000 may also be the circumference of the annular first engraved area 2310. For example, when the first engraved region 2310 is circular ring-shaped, a plurality of first engraved regions 2311 may be arranged at intervals along the circumferential direction of the circular ring. In addition, the first notches 2311 may each extend in a radial direction of the circular ring.

In some embodiments, the first engraved area 2310 may be disposed around the solder placement area 2320. For example, please see fig. 3 or fig. 6 and their description. At this time, the solder laying area 2320 may be in various shapes (circular, annular, rectangular or other irregular shapes, etc.), and the annular solder laying area 2320 and the circular solder laying area 2320 are respectively shown in fig. 3 and fig. 6. The first engraved region 2310 may have a ring shape. The shape of the inner edge of the first notch area 2310 may match the shape of the solder placement area 2320. One end of at least one first notch 2311 of the plurality of first notches 2311 may be located at an outer edge of the solder placement area 2320. In some embodiments, it may be that the solder landing area 2320 surrounds the outside of the first engraved area 2310. See, for example, fig. 4 and its description. At this time, the first engraved region 2310 may have various shapes (circular, annular or other irregular shapes, etc.), and fig. 4 shows the annular first engraved region 2310. The solder placement area 2320 may be annular, and the shape of the inner side edge of the solder placement area 2320 may match the shape of the outer side edge of the first notch area 2310. One end of at least one first notch 2311 of the plurality of first notches 2311 may be located at an inner edge of the solder placement area 2320. In some embodiments, there may be more than one grooved area or more than one solder landing area 2320. For example, referring to fig. 5 and the description thereof, the engraved region may include a first engraved region 2310 and a second engraved region 2330. In some embodiments, the total area of the regions provided with the notches may be greater than or equal to 40% of the area of the connection reinforcing surface 2300.

In some embodiments, to prevent the loss of the liquid solder at the edge of the joint enhancing surface 2300 (e.g., at the opening 2410 or at the outer edge of the joint enhancing surface 2300), a dam structure is disposed on the joint enhancing surface 2300. In some embodiments, as shown in fig. 3 or 4, the dam structure may be a protrusion 2500 fixed to the joint enhancing surface 2300, and the protrusion 2500 may be located along an edge of the opening 2410 (as shown in fig. 3) and/or along an outer edge of the joint enhancing surface 2300 (as shown in fig. 4). In other embodiments, the dam structure may be a baffle removably attached to the connection enhancing surface 2300, and the baffle may be disposed along an edge of the opening 2410 and/or along an outer edge of the connection enhancing surface 2300. After the brazing operation is completed, the baffle plate can be removed. The dam structure may prevent liquid solder from flowing out of the opening 2410 or the outer edge of the connection enhancing surface 2300, thereby ensuring that sufficient solder is available to connect the substrate 2100 and the base 2200.

In some embodiments, the base 2200 may comprise graphite. The first notch 2311 is conveniently machined on the base 2200 made of graphite material, so that the production efficiency of the anode target disc 2000 can be effectively improved. In other embodiments, the base 2200 may also comprise oxygen-free copper. In some embodiments, substrate 2100 may be a metal substrate. In some embodiments, substrate 2100 may comprise a refractory metal. Refractory metals generally refer to rare metal monomers or metal alloys having relatively high melting points (e.g., melting points greater than 1650 ℃). The refractory metals may include tungsten, molybdenum, niobium, tantalum, vanadium, zirconium, rhenium, hafnium, tantalum-tungsten alloys, molybdenum-titanium-zirconium alloys, and the like.

Fig. 3 is a schematic diagram of a structure of an attachment enhancing surface 2300, according to some embodiments herein. When the connection enhancing surface 2300 has an opening 2410, as shown in fig. 3, the solder landing area 2320 may be annular and disposed around the opening 2410. The first engraved area 2310 may be disposed around the solder placement area 2320. One end of at least one first notch 2311 of the plurality of first notches 2311 (e.g., each first notch 2311 of the plurality of first notches 2311) may be located at an outer edge of the solder placement area 2320, and the other end of at least one first notch 2311 of the plurality of first notches 2311 may be located at an outer edge of the connection enhancing surface 2300. After being melted, the solid solder 3000 on the solder placement area 2320 can flow into the first notch 2311 from the outer edge of the solder placement area 2320 through one end of the first notch 2311. During the flow of the liquid solder along the first notch 2311, the gas in the first notch 2311 may be discharged from the outer edge of the connection enhancing surface 2300 through the other end of the first notch 2311.

FIG. 4 is a schematic diagram of a joint enhancement surface 2300 according to further embodiments of the present disclosure. As shown in fig. 4, when the connection enhancing surface 2300 has an opening 2410, the solder placement area 2320 is annular, the first engraved area 2310 is disposed around the opening 2410, and the solder placement area 2320 is disposed around the first engraved area 2310. One end of at least one first notch 2311 of the first notches 2311 (for example, each first notch 2311 of the first notches 2311) is located at the edge of the opening 2410, and the other end of at least one first notch 2311 of the first notches 2311 is located at the inner side edge of the solder placing area 2320. After being melted, the solid solder 3000 on the solder placement area 2320 can flow into the first notch 2311 from the inner side edge of the solder placement area 2320 through the other end of the first notch 2311. During the flow of the liquid solder along the first notch 2311, the gas in the first notch 2311 may be discharged from the edge of the opening 2410 through one end of the first notch 2311.

In some embodiments, in order to effectively prevent the liquid solder from flowing away from one side edge of the solder placement area 2320 far away from the first notch area 2310, the dam structure is disposed along one side edge of the solder placement area 2320 far away from the first notch area 2310. For example, as shown in fig. 3, when the first notch area 2310 is circumferentially disposed outside the solder placement area 2320, the dam structures (e.g., the bosses 2500) may be disposed along the edge of the opening 2400. For another example, as shown in fig. 4, when the solder placement area 2320 is circumferentially disposed outside the first notch area 2310, the dam structures (e.g., the bumps 2500) may be disposed along the outer edge of the connection enhancing surface 2300.

FIG. 5 is a schematic diagram illustrating a construction of an attachment enhancing surface 2300, according to further embodiments of the present disclosure. As shown in fig. 5, when the connection enhancing surface 2300 has an opening 2410, the connection enhancing surface 2300 further includes a second engraved zone 2330, the second engraved zone 2330 is annular, and a plurality of second engraved slots 2321 are formed on the second engraved zone 2330. At least one second notch 2321 of the plurality of second notches 2321 (e.g., each first notch 2321 of the plurality of second notches 2321) extends in a radial direction of the anode target disk (e.g., a direction indicated by an arrow a in fig. 3-6). In some embodiments, second notch 2321 can extend from an inside edge of second notch zone 2330 to an outside edge of second notch zone 2330. The first engraved area 2310 is arranged around the opening 2410, and the solder placing area 2320 is arranged around the first engraved area 2310; a second notch 2330 is disposed around the solder rest area 2320.

One end of each of the first grooves 2311 is located at the edge of the opening 2410, and the other end of each of the first grooves 2311 is located at the inner edge of the solder placement area 2320. One end of each of the plurality of second notches 2331 is located at the outer edge of the solder receiving area 2320, and the other end of each of the plurality of second notches 2331 is located at the outer edge of the connection enhancing surface 2300. After the solid solder 3000 on the solder placing area 2320 is melted, the solid solder can flow into the first notch 2311 from the inner side edge of the solder placing area 2320 through the other end of the first notch 2311, and flow into the second notch 2331 from the outer side edge of the solder placing area 2320 through one end of the second notch 2331, during the process that the liquid solder flows along the notch 2311 and the second notch 2331, the gas in the first notch 2311 can be discharged from the edge of the opening 2410 through one end of the notch 2311, and the gas in the second notch 2331 can be discharged from the outer side edge of the connection enhancing surface 2300 through the other end of the second notch 2331.

It is understood that the cross-sectional shape and size of second notch 2331 may be similar to the cross-sectional shape and size of first notch 2311, and for the related content of the cross-sectional shape and size of second notch 2331, see the related description of first notch 2311 below. By providing the first engraved area 2310 and the second engraved area 2330, the flow of the liquid solder can be optimized, which not only effectively increases the area of the area provided with the engraved grooves (including the first engraved area 2311 and the second engraved area 2331), but also enables the liquid solder to be more uniformly distributed on the connection enhancing surface 2300, thereby effectively improving the connection strength between the base 2200 and the substrate 2100.

In some embodiments, second engraved zone 2330 may have a circular ring shape. That is, the inner and outer edges of the second engraved zone 2330 are rounded. The plurality of second notches 2331 are equally spaced along the circumference of the second notch zone 2330 (e.g., in the direction of arrow B in fig. 3-6), i.e., any two adjacent second notches 2331 are equally spaced. Each of the plurality of second notches 2331 extends radially of the second notch zone 2330. In other embodiments, second engraved zone 2330 may also have a square ring shape, a hexagonal ring shape, or the like.

In some embodiments, the center of the circular second scored region 2330 may be substantially or completely coincident with the center of the connection enhancement surface 2300. In some embodiments, the center of the circular second scored region 2330 may be substantially or completely coincident with the center of the opening 2410. In some embodiments, the center of circular second scored region 2330 may be substantially or completely coincident with the center of first scored region 2310. In some embodiments, the center of the circular second notch zone 2330 may be substantially or completely coincident with the center of the solder placement zone 2320.

In some embodiments, when only the first engraved area 2310 is provided on the connection enhancing surface 2300, the area of the first engraved area 2310 may be greater than or equal to 40% of the area of the connection enhancing surface 2300. In some embodiments, when the connection enhancing surface 2300 is provided with the first engraved region 2310 and the second engraved region 2330, the sum of the areas of the first engraved region 2310 and the second engraved region 2330 is greater than or equal to 40% of the area of the connection enhancing surface 2300. By providing the regions (e.g., the first engraved regions 2310 and/or the second engraved regions 2330) with engraved grooves (e.g., the first engraved regions 2311 and/or the second engraved regions 2331), the soldering area can be increased, capillary action is generated to promote the liquid solder to flow from the solder placing region 2320 to the regions with engraved grooves (e.g., the first engraved regions 2310 and/or the second engraved regions 2330), and degassing is facilitated, which can effectively increase the connection stability of the base 2200 and the substrate 2100.

FIG. 6 is a schematic illustration of a connection enhancement surface according to further embodiments of the present disclosure. As shown in fig. 6, the solder placement area 2320 is circular, and the first notch area 2310 is disposed around the solder placement area 2320, at this time, an inner edge of the first notch area 2310 may be circular to be attached to an outer edge of the solder placement area 2320. One end of each of the first notches 2311 in the plurality of first notches 2311 is located at the outer edge of the solder placing area 2320, and the other end of each of the first notches 2311 in the plurality of first notches 2311 is located at the outer edge of the connection enhancing surface 2300. After the solid solder 3000 on the solder placing area 2320 is melted, the molten solid solder can flow into the first notch 2311 from the outer edge of the solder placing area 2320 through the other end of the first notch 2311, and in the process that the liquid solder flows along the first notch 2311, the gas in the first notch 2311 can be exhausted from the outer edge of the connection enhancing surface 2300 through one end of the first notch 2311.

In some embodiments, the center of the circular solder landing area 2320 may substantially or completely coincide with the center of the connection enhancement surface 2300. In some embodiments, the center of circular solder placement area 2320 may substantially or completely coincide with the center of first scored region 2310.

In some embodiments, the connection enhancing surface 2300 is circular, the first engraved area 2310 is circular, and the center of the first engraved area 2310 substantially or completely coincides with the center of the connection enhancing surface 2300; each of the plurality of first engraved grooves 2311 extends in a radial direction of the first engraved region 2310 (the same as the proceeding of the anode target disk). In addition, a plurality of first engraved regions 2310 may be arranged at intervals along the circumferential direction (e.g., the direction indicated by arrow B in fig. 3 to 6) of the first engraved regions 2310. In some embodiments, when the solder placement area 2320 is circular or circular in shape, the center of the solder placement area 2320, the center of the connection enhancement surface 2300, and the center of the first scored area 2310 may substantially or completely coincide.

In some embodiments, each of the plurality of first notches 2311 as shown in fig. 3-6 has a width such that the distance between any adjacent two first notches 2311 in the circumferential direction (e.g., the direction indicated by the arrow B in fig. 3-6) of the anode target disk is equal. It is understood that the width of each first engraved groove 2311 may gradually increase from inside to outside in a radial direction (e.g., a direction indicated by an arrow a in fig. 3 to 6) of the first engraved region 2310, so that a spacing distance between any adjacent two first engraved grooves in the circumferential direction of the anode target disk is equal. Similarly, each of the plurality of second notches 2331 has a width such that any two adjacent second notches 2331 are spaced apart by an equal distance in the circumferential direction of the anode target disk. By such an arrangement, the distribution of the first notch 2311 and/or the second notch 2331 on the connection enhancing surface 2300 can be made more uniform, thereby making the distribution of the solder on the connection enhancing surface 2300 more uniform.

Fig. 7 is a schematic cross-sectional view of a first score groove shown in accordance with some embodiments of the present disclosure. As shown in fig. 7, in some embodiments, in order to improve processing efficiency, at least one first engraved groove 2311 of the plurality of first engraved grooves 2311 may be a V-shaped groove. The V-shaped groove may be understood as a groove 2311 having a V-shaped cross section (a cross section along a direction perpendicular to the length direction of the groove 2311). In some embodiments, a cross section (a cross section along a direction perpendicular to a length direction of the first engraved groove 2311) of at least one first engraved groove 2311 among the plurality of first engraved grooves 2311 may be a U-shaped groove, a trapezoid, an inverted trapezoid, or the like. The above description about the cross-sectional configuration of at least one first notch 2311 of the plurality of first notches 2311 also applies to the cross-sectional configuration of at least one second notch 2331 of the plurality of second notches 2331, and is not repeated herein.

In some embodiments, as shown in fig. 7, each of the plurality of first grooves 2311 has a depth of 0.1mm to 0.5 mm. In this specification, the depth of the first notch 2311 may refer to the maximum distance (distance c shown in fig. 7) from the upper end opening of the first notch 2311 to the bottom of the first notch 2311. If the depth of the first engraved grooves 2311 is too shallow, the capillary action may not be significant enough to be disadvantageous to the stable connection of the base 2200 and the substrate 2100, and if the depth of the first engraved grooves 2311 is too deep, the flow of the liquid solder may be affected, and by setting the depth of each first engraved groove 2311 to the above range, it is possible to ensure both the strong capillary action and the smooth flow of the liquid solder in the first engraved grooves 2311. The above description about the depth setting of each first notch 2311 in the plurality of first notches 2311 also applies to the depth setting of each second notch 2331 in the plurality of second notches 2331, and is not repeated.

In some embodiments, each of the first grooves 2311 has a width of 0.1mm to 0.5 mm. In this specification, the width of one first notch 2311 refers to the distance (distance d shown in fig. 7) between both side edges at the upper end opening of the first notch 2311. If the width of the first engraved grooves 2311 is too large, the capillary action may be reduced, which is disadvantageous for stable connection of the base 2200 to the base 2100, and if the width of the first engraved grooves 2311 is too small, which may affect the flow of the liquid solder, by setting the width of each first engraved groove 2311 to the above range, it is possible to ensure both strong capillary action and smooth flow of the liquid solder in the first engraved grooves 2311. The above description about the width setting of each first notch 2311 in the plurality of first notches 2311 also applies to the width setting of each second notch 2331 in the plurality of second notches 2331, and is not repeated.

In some embodiments, the surface roughness Ra of the solder landing area 2320 may be less than or equal to 6.3. In some embodiments, the surface roughness Ra of the solder landing area 2320 is less than or equal to 3.2. In some embodiments, the surface roughness criteria described above may be achieved by setting the manner of machining. Through the surface roughness Ra of setting up solder and putting the district 2320, can make solder put the district 2320 comparatively smooth to make solder put district 2320 and solder piece surface and can laminate as far as possible, can avoid brazing in-process solder piece surface and solder to put and form the gas pocket because of having more holes between the district 2320.

The embodiment of the application also provides an X-ray tube, which comprises the anode target disk 2000 in any technical scheme, and by using the anode target disk 2000, the X-ray tube has stable work and longer service life.

In some embodiments, the X-ray tube includes an anode rotor 4000, and the anode rotor 4000 can be inserted into the through hole 2400. The anode rotor 4000 is capable of rotating the anode target disk 2000 (including the base 2100 and the base 2200). In order to smoothly discharge the gas in the first notch 2311, a gap is formed between the outer wall of the anode rotor 4000 and the inner wall of the through hole 2400. For example, FIG. 2 and its description illustrate. Air in the first notch 2311 may be discharged through the gap. In some embodiments, the anode rotor can be coupled to a drive device (e.g., a motor, etc.) that allows the anode rotor 4000 to rotate. The anode rotor 4000 may be a rotating shaft capable of rotating the anode target disk.

The embodiment of the present application further provides a method 8000 for manufacturing an anode target disk, which can be used to manufacture the anode target disk 2000 in any of the above-mentioned technical solutions. As shown in fig. 8, the manufacturing method 8000 may include the steps of:

8100, the solid solder 3000 is placed in the solder placing area 2320 of the anode target disk 2000.

In some embodiments, the solder landing area 2320 is covered by solid solder 3000. That is, the solid solder 3000 may fill the solder placement area 2320. In some embodiments, the shape of the solid solder 3000 conforms to the shape of the solder landing area 2320. In some embodiments, the area of the solid solder 3000 is the same as the area of the solder landing area 2320.

It is understood that the shape of the solid solder 3000 and the shape of the solder placement area 2320 may coincide with each other, and that the shape of the solid solder 3000 and the shape of the solder placement area 2320 may be the same or substantially the same. The area of the solid solder 3000 coinciding with the area of the solder placement area 2320 may be the same or substantially the same as the area of the solder placement area 2320.

In step 8200, solid solder 3000, substrate 2100 and submount 2200 are heated to melt solid solder 3000. Wherein the melted solid solder flows to the first engraved area 2310 and along the first engraved areas 2311 to connect the substrate 2100 with the base 2200.

In some embodiments, the solid solder 3000, the substrate 2100 and the submount 2200 may all be heated together. In other embodiments, solid solder 3000 may be heated directly to cause solid solder 3000 to melt. In some embodiments, substrate 2100 and/or base 2200 may be heated, and heated substrate 2100 and/or base 2200 may be capable of transferring heat to solid solder 3000 to cause solid solder 3000 to melt. In some embodiments, solid solder 3000, substrate 2100, and submount 2200 may be heated together to melt solid solder 3000. In some embodiments, the temperature of heating may be determined based on the selection of the particular solder. For example, when the solder is a manganese-based solder or a nickel-based solder, the heating temperature may be greater than 450 ℃ (e.g., 500 ℃, 600 ℃, etc.).

In some embodiments, after heating solid solder 3000, substrate 2100, and mount 2200, the melted solid solder 3000, substrate 2100, and mount 2200 may be incubated to enhance wicking. The holding time may be determined according to the size of the brazed parts, for example, when the brazed parts are larger, a longer holding time may be used. In some embodiments, the incubation time may be 35min to 70 min.

At step 8300, the melted solid solder, substrate 2100, and base 2200 are cooled.

In the heating process of step 8200, mutual diffusion of elements occurs between the melted solid solder 3000 and the substrate 2100 and between the melted solid solder 3000 and the base 2200, and in the cooling process of step 8300, the melted solid solder 3000 gradually solidifies again to stably connect the substrate 2100 and the base 2200.

In some embodiments, cooling the molten solid solder, substrate 2100, and base 2200 may be achieved by air cooling the three.

Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing detailed disclosure is to be regarded as illustrative only and not as limiting the present specification. Various modifications, improvements and adaptations to the present description may occur to those skilled in the art, although not explicitly described herein. Such modifications, improvements and adaptations are proposed in the present specification and thus fall within the spirit and scope of the exemplary embodiments of the present specification. Also, the description uses specific words to describe embodiments of the description. Reference throughout this specification to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the specification is included. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the specification may be combined as appropriate.

Similarly, it should be noted that in the preceding description of embodiments of the present specification, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to imply that more features than are expressly recited in a claim. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.

Numerals describing the number of components, attributes, etc. are used in some embodiments, it being understood that such numerals used in the description of the embodiments are modified in some instances by the use of the modifier "about", "approximately" or "substantially". Unless otherwise indicated, "about", "approximately" or "substantially" indicates that the number allows a variation of ± 20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximations that may vary depending upon the desired properties of the individual embodiments. In some embodiments, the numerical parameter should take into account the specified significant digits and employ a general digit preserving approach. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the range are approximations, in the specific examples, such numerical values are set forth as precisely as possible within the scope of the application.

For each patent, patent application publication, and other material, such as articles, books, specifications, publications, documents, etc., cited in this specification, the entire contents of each are hereby incorporated by reference into this specification. Except where the application history document does not conform to or conflict with the contents of the present specification, it is to be understood that the application history document, as used herein in the present specification or appended claims, is intended to define the broadest scope of the present specification (whether presently or later in the specification) rather than the broadest scope of the present specification. It is to be understood that the descriptions, definitions and/or uses of terms in the accompanying materials of this specification shall control if they are inconsistent or contrary to the descriptions and/or uses of terms in this specification.

Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present disclosure. Other variations are also possible within the scope of the present description. Thus, by way of example, and not limitation, alternative configurations of the embodiments of the specification can be considered consistent with the teachings of the specification. Accordingly, the embodiments of the present description are not limited to only those embodiments explicitly described and depicted herein.