阅读说明：本技术 一种耦合器及其制备方法 (Coupler and preparation method thereof ) 是由 周进群 林继生 陈媛 罗善文 于 2020-06-04 设计创作，主要内容包括：本申请公开了一种耦合器及其制备方法,属于微波通信技术领域。本申请公开的耦合器包括：依次层叠设置的第一芯板、第一绝缘粘结层、接地金属层、第二绝缘粘结层和第二芯板；其中,所述第一芯板和所述第二芯板分别包括依次层叠设置的图案化的第一金属线路层、芯层和图案化的所述第一金属线路层。本申请采用芯板和绝缘粘结层替代现有技术中的导电银浆和生瓷片,能够提高耦合器的抗震性能；而且芯板是PCB板材中最常用的基材,本申请提供的耦合器与需要焊接的PCB板材的膨胀系数基本一致,降低了因发热导致耦合器与PCB板材焊接不良的几率,提高了耦合器的可靠性。(The application discloses a coupler and a preparation method thereof, and belongs to the technical field of microwave communication. The coupler disclosed in the present application includes: the core board comprises a first core board, a first insulating bonding layer, a grounding metal layer, a second insulating bonding layer and a second core board which are sequentially stacked; the first core board and the second core board respectively comprise a patterned first metal circuit layer, a core layer and a patterned first metal circuit layer which are sequentially stacked. The core plate and the insulating bonding layer are adopted to replace conductive silver paste and green ceramic chips in the prior art, so that the anti-seismic performance of the coupler can be improved; and the core plate is the most common base material in the PCB board, and the expansion coefficient of the coupler provided by the application is basically consistent with that of the PCB board to be welded, so that the probability of poor welding between the coupler and the PCB board caused by heating is reduced, and the reliability of the coupler is improved.)

1. A coupler, characterized in that the coupler comprises:

the core board comprises a first core board, a first insulating bonding layer, a grounding metal layer, a second insulating bonding layer and a second core board which are sequentially stacked;

the first core board and the second core board respectively comprise a patterned first metal circuit layer, a core layer and a patterned first metal circuit layer which are sequentially stacked.

2. The coupler of claim 1,

the first core plate is kept away from second core plate one side and the second core plate is kept away from first core plate one side still is provided with: and the third insulating bonding layer and the patterned second metal circuit layer are sequentially stacked, and the second metal circuit layer is electrically connected with the first metal circuit layer.

3. The coupler of claim 2, further comprising:

and a first conductive via which is continuously penetrated from one of the second metal wiring layers to the other of the second metal wiring layers, and the first metal wiring layer, the first conductive via and the second metal wiring layer are electrically connected.

4. The coupler of claim 3,

the first conductive hole is columnar.

5. The coupler of claim 2,

two still be provided with respectively on the second metal line layer: and the third metal circuit layer is electrically connected with the adjacent second metal circuit layer.

6. The coupler of claim 5, further comprising: and the second conductive hole is continuously penetrated from the third metal circuit layer to the adjacent second metal circuit layer, and the third metal circuit layer, the second conductive hole and the second metal circuit layer are electrically connected.

7. The coupler of claim 6,

and in the direction from the second metal circuit layer to the adjacent third metal circuit layer, the second conductive hole is in an inverted trapezoid shape.

8. A method of making a coupler, the method comprising:

providing a first core board and a second core board, wherein the first core board and the second core board respectively comprise a first metal layer, a core layer and the first metal layer which are sequentially stacked;

patterning the first metal layers on two sides of the first core board and the second core board to form a patterned first metal circuit layer;

and carrying out press-fitting treatment on the first core board, the first insulating bonding layer, the grounding metal layer, the second insulating bonding layer and the second core board which are sequentially stacked.

9. The method according to claim 8,

the first core board, the first insulating bonding layer, the grounding metal layer, the second insulating bonding layer and the second core board are subjected to press-fitting treatment, and the press-fitting treatment comprises the following steps:

carrying out press-fitting treatment on a second metal layer, a third insulating bonding layer, the first core plate, the first insulating bonding layer, the grounding metal layer, the second insulating bonding layer, the second core plate, the third insulating bonding layer and the second metal layer which are sequentially stacked;

the step of carrying out press-fit treatment on the first core board, the first insulating bonding layer, the grounding metal layer, the second insulating bonding layer and the second core board further comprises the following steps:

forming a first conductive via that continuously penetrates from one of the second metal layers to the other of the second metal layers;

and patterning the two second metal layers to form a second metal circuit layer, wherein the second metal circuit layer, the first conductive hole and the first metal circuit layer are electrically connected.

10. The method of manufacturing according to claim 9, further comprising:

respectively arranging a fourth insulating layer and a third metal layer on the two second metal circuit layers, and performing press-fitting treatment;

forming a second conductive hole which continuously penetrates from the third metal layer to the adjacent second metal circuit layer;

and patterning the two third metal layers to form a third metal circuit layer, wherein the third metal circuit layer, the second conductive hole and the second metal circuit layer are electrically connected.

Technical Field

The application relates to the technical field of microwave communication, in particular to a coupler and a preparation method thereof.

Background

With the requirements of miniaturization and light weight of the existing microwave communication circuit and system, the size of the coupler widely used in the technical field of microwave communication needs to be smaller and smaller, the same or even higher electrical index needs to be achieved in small size, and higher requirements are provided for the structure of the coupler. The circuit patterns of the existing coupler are printed on the green ceramic sheets, the circuit patterns on a plurality of green ceramic sheets are connected by conductive silver paste, and the shock resistance of the coupler during working is poor due to the fact that the green ceramic sheets are large in brittleness. Furthermore, the expansion coefficient of the green ceramic chip is not consistent with that of the PCB to be welded, so that the probability of poor welding between the coupler and the PCB caused by heating is increased and the reliability of the coupler is reduced when the coupler works at high power.

Disclosure of Invention

The coupler and the manufacturing method thereof are mainly used for solving the technical problem that the shock resistance and the reliability of the coupler during working can be improved.

In order to solve the technical problem, the application adopts a technical scheme that:

provided is a coupler including: the core board comprises a first core board, a first insulating bonding layer, a grounding metal layer, a second insulating bonding layer and a second core board which are sequentially stacked; the first core board and the second core board respectively comprise a patterned first metal circuit layer, a core layer and a patterned first metal circuit layer which are sequentially stacked.

Wherein, first core plate is kept away from second core plate one side and the second core plate is kept away from first core plate one side still is provided with: and the third insulating bonding layer and the patterned second metal circuit layer are sequentially stacked, and the second metal circuit layer is electrically connected with the first metal circuit layer.

Wherein the coupler further comprises: and a first conductive via which is continuously penetrated from one of the second metal wiring layers to the other of the second metal wiring layers, and the first metal wiring layer, the first conductive via and the second metal wiring layer are electrically connected.

Wherein the first conductive hole is columnar.

Wherein, two still be provided with respectively on the second metal line layer: and the third metal circuit layer is electrically connected with the adjacent second metal circuit layer.

Wherein the coupler further comprises: and the second conductive hole is continuously penetrated from the third metal circuit layer to the adjacent second metal circuit layer, and the third metal circuit layer, the second conductive hole and the second metal circuit layer are electrically connected.

The second conductive hole is in an inverted trapezoid shape in the direction from the second metal circuit layer to the adjacent third metal circuit layer.

In order to solve the above technical problem, another technical solution adopted by the present application is:

provided is a method for manufacturing a coupler, including: providing a first core board and a second core board, wherein the first core board and the second core board respectively comprise a first metal layer, a core layer and the first metal layer which are sequentially stacked; patterning the first metal layers on two sides of the first core board and the second core board to form a patterned first metal circuit layer; and carrying out press-fitting treatment on the first core board, the first insulating bonding layer, the grounding metal layer, the second insulating bonding layer and the second core board which are sequentially stacked.

Wherein, carry out pressfitting treatment with first core board, first insulating bonding layer, ground metal layer, second insulating bonding layer and second core board and include: carrying out press-fitting treatment on a second metal layer, a third insulating bonding layer, the first core plate, the first insulating bonding layer, the grounding metal layer, the second insulating bonding layer, the second core plate, the third insulating bonding layer and the second metal layer which are sequentially stacked; the step of carrying out press-fit treatment on the first core board, the first insulating bonding layer, the grounding metal layer, the second insulating bonding layer and the second core board further comprises the following steps: forming a first conductive via that continuously penetrates from one of the second metal layers to the other of the second metal layers; and patterning the two second metal layers to form a second metal circuit layer, wherein the second metal circuit layer, the first conductive hole and the first metal circuit layer are electrically connected.

The preparation method of the coupler further comprises the following steps: respectively arranging a fourth insulating layer and a third metal layer on the two second metal circuit layers, and performing press-fitting treatment; forming a second conductive hole which continuously penetrates from the third metal layer to the adjacent second metal circuit layer; and patterning the two third metal layers to form a third metal circuit layer, wherein the third metal circuit layer, the second conductive hole and the second metal circuit layer are electrically connected.

The beneficial effect of this application is: different from the situation in the prior art, the coupler provided by the application comprises a first core board, a first insulating bonding layer, a ground metal layer, a second insulating bonding layer and a second core board which are sequentially stacked, wherein the first core board and the second core board respectively comprise a patterned first metal circuit layer, a core layer and a patterned first metal circuit layer which are sequentially stacked. According to the application, the core plate and the insulating bonding layer are adopted to replace conductive silver paste and green ceramic chips, so that the anti-seismic performance of the coupler can be improved; and the core plate is the most common base material in the PCB board, and the expansion coefficient of the coupler provided by the application is basically consistent with that of the PCB board to be welded, so that the probability of poor welding between the coupler and the PCB board caused by heating is reduced, and the reliability of the coupler is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:

FIG. 1 is a schematic structural diagram of an embodiment of a coupler according to the present application;

FIG. 2 is a schematic structural diagram of another embodiment of a coupler according to the present application;

FIG. 3 is a schematic flow chart illustrating one embodiment of a method for fabricating a coupler according to the present invention;

FIG. 4a is a schematic structural diagram of an embodiment corresponding to step S101 in FIG. 3;

FIG. 4b is a schematic structural diagram of an embodiment corresponding to step S102 in FIG. 3;

FIG. 4c is a schematic structural diagram of an embodiment corresponding to step S103 in FIG. 3;

FIG. 5 is a schematic flow chart illustrating an embodiment of steps included after step S103 in FIG. 3;

FIG. 6 is a schematic structural diagram of an embodiment corresponding to step S201 in FIG. 5;

FIG. 7 is a flowchart illustrating an embodiment of steps included after step S202 in FIG. 5;

FIG. 8a is a schematic structural diagram of an embodiment corresponding to step S301 in FIG. 7;

fig. 8b is a schematic structural diagram of an embodiment corresponding to step S302 in fig. 7.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments that can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application belong to the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a coupler 100 according to the present application, in which the coupler 100 includes a first core board 11, a first insulating adhesive layer 21, a ground metal layer 10, a second insulating adhesive layer 22, and a second core board 12, which are sequentially stacked; the first core board 11 and the second core board 12 respectively include a patterned first metal circuit layer 111, a core layer 110, and a patterned first metal circuit layer 111, which are sequentially stacked. The grounding metal layer 10 can be grounded when the coupler works, and plays a role in shielding and resisting disturbance. The first insulating adhesive layer 21 is a thermosetting adhesive sheet for adhering the ground metal layer 10 to the first core plate 11 while serving as an edge between the ground metal layer 10 and the first core plate 11. The second insulating adhesive layer 22 is a thermosetting adhesive sheet for adhering the ground metal layer 10 to the second core board 12 while serving as a flange between the ground metal layer 10 and the second core board 12. The plurality of first metal wiring layers 111 on the first core board 11 and the second core board 12 constitute a key wiring of the coupler, i.e., a coupling line.

In the embodiment, the first core board 11, the second core board 12, the first insulating bonding layer 21 and the second insulating bonding layer 22 are adopted to replace conductive silver paste and green ceramic chips in the prior art, so that the anti-seismic performance of the coupler 100 can be improved; and the core board is the most common base material in the PCB board, and the expansion coefficient of the coupler 100 of the embodiment is basically consistent with that of the PCB board to be welded, so that the probability of poor welding between the coupler 100 and the PCB board due to heating is reduced, and the reliability of the coupler 100 is improved. In the present embodiment, the coupler 100 further includes the ground metal layer 10 that serves as a shield, and the reliability of the coupler 100 during operation can be further improved.

Further, with reference to fig. 1, in the present embodiment, a side of the first core plate 11 away from the second core plate 12 and a side of the second core plate 12 away from the first core plate 11 are further provided with: the third insulating adhesive layer 23 and the patterned second metal wiring layer 112 are sequentially stacked, and the second metal wiring layer 112 is electrically connected to the first metal wiring layer 111. Specifically, the second metal wiring layer 112 is electrically connected to the first metal wiring layer 111 through the first conductive via 31. That is, the coupler 100 of the present embodiment further includes the first conductive via 31, and the first conductive via 31 penetrates continuously from one of the second metal wiring layers 112 to the other second metal wiring layer 112. Preferably, the first conductive via 21 is cylindrical. Preferably, the aperture of the first conductive via 21 is smaller than 0.1 mm, so that the interconnection between the first metal line layer 111 and the second metal line layer 112 is realized with a smaller aperture, and the structural requirement of the small-sized coupler is met.

In the present embodiment, the third insulating adhesive layer 23 is a thermosetting adhesive sheet for adhering the second metal wiring layer 112 to the first metal wiring layer 111 on the side of the first core board 11 or the second core board 12 away from the ground metal layer 10, and for insulating the second metal wiring layer 112 from the first metal wiring layer 111. The second metal circuit layer 112 is used for conducting the first metal circuit layer 111 to the outer layer of the coupler 100 through the first conductive hole 31, so as to facilitate the subsequent welding assembly with an external component (e.g. a PCB board) during operation.

In another embodiment, please refer to fig. 2, wherein fig. 2 is a schematic structural diagram of another embodiment of the coupler of the present application. In addition to the coupler structure shown in fig. 1, the coupler 200 of the present embodiment further includes: the fourth insulating adhesive layer 24 and the patterned third metal wiring layer 113 are sequentially stacked, and the third metal wiring layer 113 is electrically connected to the adjacent second metal wiring layer 112. Specifically, the third metal wiring layer 113 is electrically connected to the adjacent second metal wiring layer 112 through the second conductive via 32. That is, the coupler 100 of the present embodiment further includes the second conductive via 32, and the second conductive via 32 continuously penetrates from the third metal wiring layer 113 to the adjacent second metal wiring layer 112. Preferably, the second conductive via 21 has an inverted trapezoid shape in a direction from the second metal line layer 112 to the adjacent third metal line layer 113. Preferably, the coupler 200 includes only one second conductive via 32 penetrating from the third metal wiring layer 113 to the adjacent second metal wiring layer 112 in the upper portion of the coupler shown in fig. 2.

In the present embodiment, the fourth insulating adhesive layer 24 is a thermosetting adhesive sheet for adhering the second metal wiring layer 112 and the adjacent third metal wiring layer 113, and at the same time, plays an insulating role between the second metal wiring layer 112 and the adjacent third metal wiring layer 113. In order to meet the trend of miniaturization and light weight of microwave communication circuits and systems, the size of the coupler widely used in the field of microwave communication technology is getting smaller, the small size of the coupler 200 causes the space of the second metal circuit layer 112 to be insufficient, and the third metal circuit layer 113 needs to be introduced, so that the second metal circuit layer 112 and the third metal circuit layer 113 together conduct the first metal circuit layer 111 to the outer layer of the coupler 200 through the second conductive hole 32, and are convenient for being welded and assembled with an external component (such as a PCB plate) during subsequent work.

In the above embodiments of the present application, the coupler is preferably a 3db coupler, wherein the first metal circuit layer, the second metal circuit layer, the third metal circuit layer and the ground metal layer are preferably made of copper foil, and the circuit patterns of the first metal circuit layer, the second metal circuit layer and the third metal circuit layer may be the same or different.

Referring to fig. 3, fig. 3 is a schematic flow chart of an embodiment of a method for manufacturing a coupler according to the present application, in which the method for manufacturing a coupler includes the following steps:

s101, providing a first core board and a second core board, wherein the first core board and the second core board respectively comprise a first metal layer, a core layer and a first metal layer which are sequentially stacked.

Specifically, referring to fig. 4a, fig. 4a is a schematic structural diagram of an embodiment corresponding to step S101 in fig. 3. The first core board 11 and the second core board 12 are common base materials used in PCB boards, and include a first metal layer 1110, a core layer 110, and a first metal layer 1110 stacked in sequence, that is, the first metal layer 1110 is disposed on both sides of the core layer 110, and fig. 4a schematically illustrates a structure of the first core board 11.

S102, patterning the first metal layers on two sides of the first core board and the second core board to form a patterned first metal circuit layer.

Specifically, please refer to fig. 4b, wherein fig. 4b is a schematic structural diagram of an embodiment corresponding to step S102 in fig. 3. The first metal layer 1110 may be patterned by etching on both sides of the first core board 11 and the second core board 12 to form the patterned first metal circuit layer 111. For example, a patterned mask layer is formed on one of the first metal layers 1110, a via hole is formed in the mask layer, then the first metal layer 1110 is etched away in the via hole, and then the mask layer is removed, so as to obtain the patterned first metal line layer 111. Other first metal layers 1110 may be patterned in a similar manner to form the first metal line layer 111. In fig. 4b, the blank on the first metal line layer 111 indicates an etched-out region corresponding to the via hole of the mask layer.

And S103, performing press-fit treatment on the first core board, the first insulating bonding layer, the grounding metal layer, the second insulating bonding layer and the second core board which are sequentially stacked.

Specifically, referring to fig. 4c, fig. 4c is a schematic structural diagram of an embodiment corresponding to step S103 in fig. 3, in this embodiment, step S103 specifically performs a press-fitting process on the second metal layer 1120, the third insulating adhesive layer 23, the first core board 11, the first insulating adhesive layer 21, the ground metal layer 10, the second insulating adhesive layer 22, the second core board 12, the third insulating adhesive layer 23, and the second metal layer 1120, which are sequentially stacked.

Further, referring to fig. 5, fig. 5 is a flowchart illustrating an embodiment of steps included after step S103 in fig. 3, where after step S103 (pressing the first core board, the first insulating adhesive layer, the ground metal layer, the second insulating adhesive layer, and the second core board which are sequentially stacked up and disposed), the method further includes the following steps:

s201, forming a first conductive hole which penetrates from one second metal layer to the other second metal layer continuously.

Specifically, referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment corresponding to step S201 in fig. 5. The first conductive holes 31 penetrating from one of the second metal layers 1120 to the other second metal layer 1120 may be formed by mechanical drilling and then electroplating so that the first metal wiring layer 111 can communicate to the outer layer through the first conductive holes 31.

S202, patterning the two second metal layers to form a second metal circuit layer, wherein the second metal circuit layer, the first conductive hole and the first metal circuit layer are electrically connected.

Specifically, with reference to fig. 1, after the first conductive via 31 is formed, two second metal layers 1120 are patterned to form the second metal circuit layer 112, so as to obtain the coupler structure shown in fig. 1, wherein the first metal circuit layer 111 is connected to the second metal circuit layer 112 through the first conductive via 31. Similar to the manner of patterning the first metal layer 1110 to form the first metal line layer 111, a patterned mask layer is formed on one of the second metal layers 1120, the mask layer is provided with a via hole, the second metal layer 1120 is etched away in the via hole, and the mask layer is removed to obtain the patterned second metal line layer 112. In fig. 1, the blank on the second metal line layer 112 represents an etched-out region corresponding to the via hole of the mask layer.

Further, referring to fig. 7, fig. 7 is a flowchart illustrating an embodiment of steps included after step S202 in fig. 5. After patterning the two second metal layers 1120 to form the second metal circuit layer 112, the embodiment further includes the following steps:

s301, respectively arranging a fourth insulating layer and a third metal layer on the two second metal circuit layers, and performing press-fit treatment.

Specifically, referring to fig. 8a, fig. 8a is a schematic structural diagram of an embodiment corresponding to step S301 in fig. 7. After the two second metal circuit layers 112 are formed, the fourth insulating layer 24 and the third metal layer 1130 are respectively disposed on the two second metal circuit layers 112, and a pressing process is performed.

And S302, forming a second conductive hole which continuously penetrates from the third metal layer to the adjacent second metal circuit layer.

Specifically, please refer to fig. 8b, wherein fig. 8b is a schematic structural diagram of an embodiment corresponding to step S302 in fig. 7. The second conductive hole 32 penetrating from the third metal layer 1130 to the adjacent second metal wiring layer 112 may be formed by laser drilling and then electroplating, so that after the first metal wiring 111 is communicated to the second metal wiring layer 112 through the first conductive hole 31, the second metal wiring layer 112 can be communicated to the outer layer through the second conductive hole 32. Preferably, only the second conductive via 32 penetrating from the third metal layer 1130 to the adjacent second metal wiring layer 112 needs to be formed at the upper portion of the coupler shown in fig. 8 b.

S303, patterning the two third metal layers to form a third metal circuit layer, wherein the third metal circuit layer, the second conductive hole and the second metal circuit layer are electrically connected.

Specifically, with reference to fig. 2, after the second conductive via 32 is formed, two third metal layers 1130 are patterned to form the third metal circuit layer 113, so as to obtain the coupler structure shown in fig. 2, wherein the third metal circuit layer 113, the second conductive via 32 and the second metal circuit layer 112 are electrically connected. Similar to the manner of patterning the first metal layer 1110 to form the first metal line layer 111, a patterned mask layer is formed on one of the third metal layers 1130, a via hole is formed on the mask layer, then the third metal layer 1130 is etched away in the via hole, and then the mask layer is removed, so as to obtain the patterned third metal line layer 113. In fig. 2, the blank on the third metal wiring layer 113 indicates an etched-out region corresponding to the via hole of the mask layer. And finally, surface coating and silk-screen printing characters can be carried out to obtain a coupler finished product.

In the above embodiments of the present application, the coupler is preferably a 3db coupler, wherein the first metal circuit layer, the second metal circuit layer, the third metal circuit layer and the ground metal layer are preferably made of copper foil, and the circuit patterns of the first metal circuit layer, the second metal circuit layer and the third metal circuit layer may be the same or different.

Different from the prior art, the core plate and the insulating bonding layer are adopted to replace conductive silver paste and green ceramic chips in the prior art, so that the anti-seismic performance of the coupler can be improved; and the core plate is the most common base material in the PCB board, and the expansion coefficient of the coupler provided by the application is basically consistent with that of the PCB board to be welded, so that the probability of poor welding between the coupler and the PCB board caused by heating is reduced, and the reliability of the coupler is improved.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.