阅读说明：本技术 微流控芯片 (Micro-fluidic chip ) 是由 范蓓媛 丁丁 于 2021-09-03 设计创作，主要内容包括：本申请实施例提供一种微流控芯片,包括至少一个控制阀,控制阀包括相对设置的第一芯片层与第二芯片层,以及位于第一芯片层和第二芯片层之间的弹性膜层和第一连接胶层；第一芯片层设置有依次连通的第一沟道、控制阀腔和第二沟道,弹性膜层包括覆盖部和连接部,覆盖部覆盖控制阀腔,连接部位于覆盖部的外周；第一连接胶层设置于连接部的外周,粘接第一芯片层和第二芯片层；还包括增加连接部与第一芯片层贴合力的密封结构,密封结构设置于连接部与第一芯片层之间,和/或连接部与第二芯片层之间。如此设计,通过设置能够增加连接部与第一芯片层贴合力的密封结构,能够提高连接部对控制阀腔的密封性,提高密封效果,能够有效避免漏液的产生。(The embodiment of the application provides a microfluidic chip, which comprises at least one control valve, wherein the control valve comprises a first chip layer and a second chip layer which are oppositely arranged, and an elastic film layer and a first connecting adhesive layer which are positioned between the first chip layer and the second chip layer; the first chip layer is provided with a first channel, a control valve cavity and a second channel which are sequentially communicated, the elastic film layer comprises a covering part and a connecting part, the covering part covers the control valve cavity, and the connecting part is positioned on the periphery of the covering part; the first connecting glue layer is arranged on the periphery of the connecting part and is used for bonding the first chip layer and the second chip layer; the sealing structure is arranged between the connecting part and the first chip layer and/or between the connecting part and the second chip layer. By the design, the sealing structure capable of increasing the attaching force of the connecting part and the first chip layer is arranged, the sealing performance of the connecting part on the control valve cavity can be improved, the sealing effect is improved, and liquid leakage can be effectively avoided.)

1. The microfluidic chip is characterized by comprising at least one control valve, wherein the control valve comprises a first chip layer and a second chip layer which are arranged oppositely, and an elastic film layer and a first connecting glue layer which are arranged between the first chip layer and the second chip layer; the elastic film layer comprises a covering part and a connecting part, the covering part covers the control valve cavity, and the connecting part is positioned on the periphery of the covering part and is in contact with the first chip layer; the first connecting glue layer is arranged on the periphery of the connecting part and is used for bonding the first chip layer and the second chip layer;

the microfluidic chip further comprises a sealing structure for increasing the bonding force between the connecting part and the first chip layer, and the sealing structure is arranged between the connecting part and the first chip layer and/or between the connecting part and the second chip layer.

2. The microfluidic chip according to claim 1, wherein the sealing structure comprises a supporting layer disposed on a side of the second chip layer close to the first chip layer in a region covered by the connecting portion; under the action of the supporting layer, one side of the connecting portion, which is close to the first chip layer, is at least flush with one side, which is close to the first chip layer, of the first connecting adhesive layer.

3. The microfluidic chip according to claim 2, wherein the supporting layer is formed by curing an ultraviolet photoresist.

4. The microfluidic chip according to claim 3, wherein the second chip layer is provided with a molding groove in a region covered by the connection portion, and the support layer is provided in the molding groove.

5. The microfluidic chip according to claim 1, wherein the sealing structure comprises a first intermediate layer and a second intermediate layer, the first intermediate layer is attached to a side of the first chip layer facing the second chip layer, and the second intermediate layer is attached to a side of the second chip layer facing the second chip layer; the first connecting glue layer and the connecting part are positioned between the first middle layer and the second middle layer;

the elastic membrane is made of polydimethylsiloxane, and the first middle layer and the second middle layer respectively comprise at least one of silica gel, rubber or polydimethylsiloxane.

6. The microfluidic chip according to claim 1, wherein the sealing structure comprises a second connection glue layer attached to a side of the first chip layer close to the second chip layer and extending to an edge of the control valve cavity; the first connecting glue layer is arranged on one side, far away from the first chip layer, of the second connecting glue layer.

7. The microfluidic chip according to claim 6, wherein the first and second connection adhesive layers are both double-sided adhesive.

8. The microfluidic chip according to claim 1, wherein the sealing structure comprises a sealing groove provided in at least one of the first chip layer and the second chip layer, and a sealing protrusion provided in the other and engaged with the sealing groove; the sealing groove and the sealing bulge are matched with each other to clamp the connecting part.

9. The microfluidic chip according to claim 8, wherein the sealing groove is larger than the sealing protrusion.

10. The microfluidic chip according to claim 8 or 9, wherein the cross-sectional shape of the sealing groove is semicircular, rectangular, square, arc, trapezoid or triangular.

11. The microfluidic chip according to claim 1, wherein the sealing structure comprises a first sealing protrusion disposed on the first chip layer corresponding to the connection portion, and a second sealing protrusion disposed on the second chip layer corresponding to the connection portion; the second sealing bulge and the first sealing bulge are arranged in a staggered mode.

12. The microfluidic chip according to claim 11, wherein the second sealing protrusion is adjacent to the control valve cavity relative to the first sealing protrusion.

13. The microfluidic chip according to claim 11 or 12, wherein the cross-sectional shape of the first sealing protrusion and the second sealing protrusion is semicircular, rectangular, square, arc-shaped, trapezoidal, or triangular.

14. The microfluidic chip according to claim 1, wherein the sealing structure includes a mounting groove disposed on at least one of the first chip layer and the second chip layer, and a sealing ring mounted in the mounting groove, the mounting groove and the sealing ring are disposed around the middle groove in a region corresponding to the connecting portion, and the sealing ring is mounted in the mounting groove and then seals against the connecting portion.

15. The microfluidic chip according to claim 14, wherein the mounting grooves comprise a first mounting groove provided on the first chip layer, and a second mounting groove provided on the second chip layer; the sealing ring comprises a first sealing ring arranged in the first mounting groove and a second sealing ring arranged in the second mounting groove.

16. The microfluidic chip according to claim 15, wherein the second mounting groove is adjacent to the control valve cavity relative to the first mounting groove.

17. The microfluidic chip according to claim 14, wherein the mounting groove has a cross-sectional shape of a semicircle, an arc, a rectangle, a square, a trapezoid, or a triangle.

18. The microfluidic chip according to claim 1, wherein the second chip layer is provided with a mounting cavity corresponding to the control valve cavity, and an acting element for driving the elastic membrane layer to act is arranged in the mounting cavity.

Technical Field

The embodiment of the application relates to the technical field of micro-fluidic technology, in particular to a micro-fluidic chip.

Background

Microfluidics (Microfluidics) is a technology for the precise control and manipulation of microscale fluids, particularly in the context of submicron structures. The microfluidic Chip is also called a Lab-on-a-Chip (Lab-on-a-Chip) and integrates basic operation units of sample preparation, reaction, separation, detection and the like in biological, chemical and medical analysis processes into a micron-scale Chip to automatically complete the whole analysis process.

The microfluidic chip is widely applied to the field of biochemical analysis, such as the field of bacteria, virus and protein detection, and the like, due to the characteristics of easy integration, automation, controllable fluid and small required sample volume, and the defect that professional nucleic acid detection equipment is difficult to deploy in a non-laboratory area is overcome to a certain extent.

The microfluidic chip usually includes a control valve for controlling the flow channel switch, however, the microfluidic chip in the prior art is prone to leakage at the position of the control valve.

Disclosure of Invention

In view of the above, an object of the embodiments of the present application is to provide a microfluidic chip.

In a first aspect, an embodiment of the present application provides a microfluidic chip, including at least one control valve, where the control valve includes a first chip layer and a second chip layer that are disposed opposite to each other, and an elastic film layer and a first connection adhesive layer that are located between the first chip layer and the second chip layer; the elastic film layer comprises a covering part and a connecting part, the covering part covers the control valve cavity, and the connecting part is positioned on the periphery of the covering part and is in contact with the first chip layer; the first connecting glue layer is arranged on the periphery of the connecting part and is used for bonding the first chip layer and the second chip layer;

the microfluidic chip further comprises a sealing structure for increasing the bonding force between the connecting part and the first chip layer, and the sealing structure is arranged between the connecting part and the first chip layer and/or between the connecting part and the second chip layer.

In the microfluidic chip provided by the embodiment of the application, the sealing structure capable of increasing the attaching force of the connecting part and the first chip layer is arranged, so that the sealing property of the connecting part on the control valve cavity can be improved, the sealing effect is improved, and the leakage can be effectively avoided.

In a possible embodiment, the sealing structure includes a support layer disposed on a side of the second chip layer close to the first chip layer in a region covered by the connection portion; under the action of the supporting layer, one side of the connecting portion, which is close to the first chip layer, is at least flush with one side, which is close to the first chip layer, of the first connecting adhesive layer.

In one possible embodiment, the support layer is formed by curing an ultraviolet photoresist.

In a possible embodiment, the second chip layer is provided with a molding groove in a region covered by the connection portion, and the support layer is provided in the molding groove.

In one possible embodiment, the sealing structure includes a first interlayer attached to a side of the first chip layer facing the second chip layer, and a second interlayer attached to a side of the second chip layer facing the second chip layer; the first connecting glue layer and the connecting part are positioned between the first middle layer and the second middle layer;

the elastic membrane is made of polydimethylsiloxane, and the first middle layer and the second middle layer respectively comprise at least one of silica gel, rubber or polydimethylsiloxane.

In a possible embodiment, the sealing structure comprises a second connecting glue layer, the second connecting glue layer is attached to one side, close to the second chip layer, of the first chip layer and extends to the edge of the control valve cavity; the first connecting glue layer is arranged on one side, far away from the first chip layer, of the second connecting glue layer.

In one possible embodiment, the first adhesive layer and the second adhesive layer are both double-sided adhesive tapes.

In one possible embodiment, the sealing structure includes a sealing groove provided in at least one of the first chip layer and the second chip layer, and a sealing projection provided in the other and fitted into the sealing groove; the sealing groove and the sealing bulge are matched with each other to clamp the connecting part.

In one possible embodiment, the sealing groove is larger than the sealing projection.

In one possible embodiment, the cross-sectional shape of the sealing groove is semicircular, rectangular, square, arc, trapezoid, or triangular.

In a possible embodiment, the sealing structure includes a first sealing bump disposed on the first chip layer corresponding to the connection portion, and a second sealing bump disposed on the second chip layer corresponding to the connection portion; the second sealing bulge and the first sealing bulge are arranged in a staggered mode.

In one possible embodiment, the second sealing bead is adjacent to the control valve chamber relative to the first sealing bead.

In one possible embodiment, the cross-sectional shape of the first sealing protrusion and the second sealing protrusion is semicircular, rectangular, square, arc, trapezoid, or triangular.

In a possible implementation manner, the sealing structure includes a mounting groove disposed on at least one of the first chip layer and the second chip layer, and a sealing ring mounted on the mounting groove, the mounting groove and the sealing ring are disposed around the middle groove in an area corresponding to the connection portion, and the sealing ring is mounted on the mounting groove and then is sealed against the connection portion.

In one possible embodiment, the mounting groove includes a first mounting groove provided on the first chip layer, and a second mounting groove provided on the second chip layer; the sealing ring comprises a first sealing ring arranged in the first mounting groove and a second sealing ring arranged in the second mounting groove.

In one possible embodiment, the second mounting recess is adjacent to the control valve chamber relative to the first mounting recess.

In one possible embodiment, the cross-sectional shape of the mounting groove is semicircular, arc-shaped, rectangular, square, trapezoidal, or triangular.

In a possible implementation manner, the second chip layer is provided with a mounting cavity corresponding to the control valve cavity, and an acting element for driving the elastic membrane layer to act is arranged in the mounting cavity.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or related technologies of the present application, the drawings needed to be used in the description of the embodiments or related technologies are briefly introduced below, it is obvious that the drawings in the following description are only one or more embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is an exploded view of a microfluidic chip provided in the related art;

FIG. 2 is a cross-sectional view of the microfluidic chip of FIG. 1;

fig. 3 is a schematic structural diagram of a microfluidic chip according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of another microfluidic chip provided in an embodiment of the present application;

fig. 5 is a schematic structural diagram of another microfluidic chip provided in an embodiment of the present application;

fig. 6 is an exploded view of another microfluidic chip provided in an embodiment of the present application;

FIG. 7 is a cross-sectional view of the microfluidic chip of FIG. 6;

fig. 8 is a cross-sectional view of another microfluidic chip provided in an embodiment of the present application;

fig. 9 is a cross-sectional view of another microfluidic chip provided in an embodiment of the present application;

fig. 10 is an exploded view of another microfluidic chip provided in an embodiment of the present application;

fig. 11 is a cross-sectional view of the microfluidic chip of fig. 10.

Description of reference numerals:

1-a second chip layer, 101-a mounting cavity, 2-an elastic film layer, 3-a first chip layer 3, 31-a first channel, 32-a control valve cavity, 33-a second channel, 4-a first connecting glue layer, 5-a supporting layer, 6-a first intermediate layer, 7-a second intermediate layer, 8-a second connecting glue layer, 9-a sealing groove, 10-a sealing protrusion, 11-a first sealing protrusion, 12-a second sealing protrusion, 13-a first mounting groove, 14-a second sealing ring, 15-a first sealing ring and 16-a second mounting groove.

Detailed Description

Fig. 1 is an exploded view of a microfluidic chip provided in the related art, fig. 2 is a cross-sectional view of the microfluidic chip in fig. 1, as shown in fig. 1 and fig. 2, the microfluidic chip includes at least one control valve, the control valve includes a first chip layer 3, a second chip layer 1, an elastic film layer 2 and a first connection glue layer 4, the first chip layer 3 and the second chip layer 1 are oppositely disposed, taking the orientation shown in fig. 1 and fig. 2 as an example, the first chip layer 3 is located below the second chip layer 1, that is, the first chip layer 3 is a lower chip, and the second chip layer 1 is an upper chip.

The first chip layer 3 and the second chip layer 1 are plate-shaped structures, and are usually made of at least one of Polycarbonate (abbreviated as PC), polymethyl methacrylate (abbreviated as PMMA), or Acrylonitrile Butadiene Styrene (abbreviated as ABS), and the side of the first chip layer 3 facing the second chip layer 1 is provided with a control valve cavity 32, and the first channel 31 and the second channel 33 are both communicated with the control valve cavity 32.

The elastic membrane layer 2 is generally an elastic membrane structure made of Polydimethylsiloxane (PDMS), and is disposed between the first chip layer 3 and the second chip layer 1, and according to the position relative to the control valve cavity 32, the elastic membrane layer 2 is divided into a covering portion covering the control valve cavity 32 and a connecting portion located on the periphery of the covering portion, the connecting portion is in contact with the first chip layer 3 and the second chip layer 1 at the edge of the control valve cavity 32, and is clamped and fixed under the action of a clamping force between the first chip layer 3 and the second chip layer 1.

The first connecting glue layer 4 is arranged between the first chip layer 3 and the second chip layer 1, is positioned at the periphery of the connecting part and is used for bonding the first chip layer 3 and the second chip layer 1. The first chip layer 3 and the second chip layer 1 clamp the elastic film layer 2 under the action of the first connecting glue layer 4; the first adhesive layer 4 may be a double-sided tape.

The elastic film layer 2 is far away from the control valve cavity 32 under the state without other acting force, and the first channel 31 and the second channel 33 are communicated through the control valve cavity 32; the second chip layer 1 is provided with an installation cavity 101 corresponding to the control valve cavity 32, the installation cavity 101 is provided with an acting piece, the acting piece moves in the installation cavity 101 and can drive the elastic film layer 2 to generate elastic deformation, the elastic film layer 2 generates elastic deformation and enters the control valve cavity 32 to block the control valve cavity 32, and therefore disconnection between the first channel 31 and the second channel 33 is achieved; when the acting element does not work, the elastic membrane layer 2 is far away from the control valve cavity 32 under the action of the self elastic force, so that the first channel 31 and the second channel 33 on two sides of the control valve cavity 32 are communicated.

In the use process of the microfluidic chip, the problem of liquid leakage is easy to occur at the outer side of the control valve cavity 32, and analysis shows that complete sealing cannot be realized between the elastic membrane layer 2(PDMS) and the first chip layer 3(PC, PMMA, ABS and the like) due to material difference. When the liquid enters the control valve cavity 32 through the first channel 31 or the second channel 33, the elastic membrane may be separated from the first chip layer 3, thereby causing liquid leakage and affecting normal use.

In view of this, the embodiment of the present application provides a microfluidic chip, which is provided with a sealing structure capable of increasing the adhesion force between the connecting portion and the first chip layer 3, so as to improve the sealing performance of the connecting portion on the control valve cavity 32, improve the sealing effect, and effectively avoid liquid leakage.

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Fig. 3 is a schematic structural diagram of a microfluidic chip according to an embodiment of the present disclosure, and as shown in fig. 3, in the control valve of the microfluidic chip, the sealing structure includes a forming groove and a supporting layer 5, the forming groove is disposed at a position of the second chip layer 1 opposite to the connection portion, and the supporting layer 5 is formed by filling a filling material with a small volume change before and after curing in the forming groove, where the filling material may be an ultraviolet photoresist. One side that first chip layer 3 was kept away from to elasticity rete 2 is laminated with supporting layer 5, and supporting layer 5 and the gluey cooperation of elasticity rete 2, and the thickness of supporting layer 5 should make connecting portion be close to one side parallel and level that one side of first chip layer 3 is close to first chip layer 3 with first connection glue film 4 at least.

Here, at least flush means that one side of the connection portion close to the first chip layer 3 is flush with one side of the first connection glue layer 4 close to the first chip layer 3, or one side of the connection portion close to the first chip layer 3 is closer to the first chip layer 3 than one side of the first connection glue layer 4 close to the first chip layer 3, that is, exceeds the first connection glue layer 4 by a certain distance.

In this application embodiment, the sealing structure adopts the supporting layer 5 to compensate the height difference between the elastic film layer 2 and the first connection glue layer 4 on the side close to the first chip layer 3, and supports the elastic film layer 2 to press against the first chip layer 3 through the supporting layer 5, so that the connection part can be in close contact with the first chip layer 3, the sealing performance between the elastic film layer 2 and the first connection glue layer 4 is increased, and the leakage phenomenon is avoided.

In addition, the side of the elastic film layer 2 far away from the first chip layer 3 and the supporting layer 5 increase the sealing effect through gluing. When the liquid flows in, a large number of parts with adhesive are needed to pass through for leakage, so that the possibility of leakage is reduced. Avoiding leakage of liquid from the control valve chamber 32 to the upper region.

In a possible embodiment, the sealing structure may only include the support layer 5, that is, the molding groove may not be provided, the support layer 5 is directly molded on one side of the second chip layer 1, the support layer 5 is in adhesive fit with the elastic film layer 2, and the thickness of the support layer 5 is such that the side of the connection portion close to the first chip layer 3 is at least flush with the side of the first connection adhesive layer 4 close to the first chip layer 3.

Fig. 4 is a schematic structural diagram of another microfluidic chip provided in an embodiment of the present application, and as shown in fig. 4, in the control valve of the microfluidic chip, the sealing structure includes a first intermediate layer 6 and a second intermediate layer 7, the first intermediate layer 6 is a layered structure attached to a side of the first chip layer 3 facing the second chip layer 1, and the second intermediate layer 7 is a layered structure attached to a side of the second chip layer 1 facing the second chip layer 1; the first connection glue layer 4 and the connection portions are located between the first intermediate layer 6 and the second intermediate layer 7. That is, the first intermediate layer 6 and the second intermediate layer 7 each extend from the edge of the control valve cavity 32 to the edge of the first layer of connection glue 4 remote from the control valve cavity 32.

As can be seen from the above description, the elastic film layer 2 is made of polydimethylsiloxane, and in the present embodiment, the first intermediate layer 6 and the second intermediate layer 7 each include at least one of silicone, rubber, or polydimethylsiloxane. Because the materials adopted by the first intermediate layer 6 and the second intermediate layer 7 are the same as the elastic film layer 2, the bonding force and the sealing property can be greatly improved after heating and curing, and liquid leakage can be greatly reduced.

In a possible embodiment, the first intermediate layer 6 and the second intermediate layer 7 are made of the same material as the elastic film layer 2.

Fig. 5 is a schematic structural diagram of another microfluidic chip provided in an embodiment of the present application, and as shown in fig. 5, in the control valve of the microfluidic chip, the sealing structure includes a second connection adhesive layer 8, and the second connection adhesive layer 8 is attached to a side of the first chip layer 3 close to the second chip layer 1 and extends to an edge of the control valve cavity 32; the first connection glue layer 4 is disposed on a side of the second connection glue layer 8 away from the first chip layer 3.

The second connection adhesive layer 8 is used for bonding the first connection adhesive layer 4, the connection portion and the first chip layer 3, and may be made of the same material as the first connection adhesive layer 4, for example, when the first connection adhesive layer 4 is made of a double-sided adhesive, the second connection adhesive layer 8 and the second connection adhesive layer 8 are also made of a double-sided adhesive.

By providing a first connection glue layer 4 and a second connection glue layer 8. Can realize the secondary sealing-in, liquid flows into the back, need just can arouse through longer route and leak to improve sealed effect, improve and reveal the problem.

Fig. 6 is an exploded view of another microfluidic chip provided in an embodiment of the present application, and fig. 7 is a cross-sectional view of the microfluidic chip in fig. 6, as shown in fig. 6 and 7, in a control valve of the microfluidic chip, a sealing structure includes a sealing groove 9 and a sealing protrusion 10, and a first chip layer 3 is provided with the sealing groove 9 opened toward a second chip layer 1 at a position corresponding to a connection portion; the second chip layer 1 is provided with a sealing bulge 10 extending towards the first chip layer 3 at a position corresponding to the connecting part; during the equipment, sealed arch 10 is relative with sealed recess 9, and during sealed arch 10 stretched into sealed recess 9, presss from both sides elasticity rete 2 and establishes between sealed arch 10 and sealed recess 9, and sealed arch 10 and sealed recess 9 and elasticity rete 2's cooperation can realize the sealed effect to elasticity rete 2.

The cross-sectional shape of the sealing groove 9 may be semicircular, rectangular, square, arc, trapezoidal, triangular, or the like. In the embodiment shown in fig. 6 and 7, the cross-sectional shape of the seal groove 9 is triangular. In a possible embodiment, the sealing groove 9 should be slightly larger than the sealing protrusion 10, so as to better accommodate the elastic film layer 2.

Fig. 8 is a cross-sectional view of another microfluidic chip provided in an embodiment of the present application, and as shown in fig. 8, in a control valve of the microfluidic chip, a sealing structure includes a sealing groove 9 and a sealing protrusion 10, which is different from the embodiments shown in fig. 6 and 7 in that the sealing groove 9 is disposed in the second chip layer 1, and the sealing protrusion 10 is disposed in the first chip layer 3, and other contents can be referred to the above description, and are not repeated herein.

Fig. 9 is a cross-sectional view of another microfluidic chip provided in an embodiment of the present disclosure, as shown in fig. 9, in the control valve of the microfluidic chip, the sealing structure includes a first sealing protrusion 11 and a second sealing protrusion 12, the first sealing protrusion 11 is disposed at a position of the first chip layer 3 corresponding to the connection portion and extends from the first chip layer 3 toward the second chip layer 1, and when assembled, the first sealing protrusion 11 presses the elastic film 2 against the second chip layer 1; the second sealing protrusion 12 is disposed at a position of the second chip layer 1 corresponding to the connecting portion, and extends from the second chip layer 1 toward the first chip layer 3, and when the assembly is performed, the second sealing protrusion 12 presses the elastic film layer 2 against the first chip layer 3; the first sealing protrusion 11 and the second sealing protrusion 12 are arranged in a staggered manner.

The cross-sectional shapes of the first sealing protrusion 11 and the second sealing protrusion 12 are semicircular, rectangular, square, arc, trapezoidal, or triangular. For example, in the present embodiment, the cross-sectional shapes of the first sealing projection 11 and the second sealing projection 12 are both triangular.

Through setting up first sealed arch 11 and second sealed arch 12, can realize the double seal to elasticity rete 2 to improve sealed effect, in possible implementation, can set up two or more sealed archs at same chip level, or set up two or more sealed archs at two chip levels.

In a possible embodiment, the second sealing protrusion 12 is close to the control valve cavity 32 relative to the first sealing protrusion 11, and the design is such that the sealing position abutting against the first chip layer 3 is close to the control valve cavity 32, which can further improve the sealing effect between the elastic film layer 2 and the first chip layer 3 and improve the liquid leakage problem.

Fig. 10 is an exploded view of another microfluidic chip according to an embodiment of the present disclosure, and fig. 11 is a cross-sectional view of the microfluidic chip in fig. 10, as shown in fig. 10 and 11, in a control valve of the microfluidic chip, a sealing structure includes a first mounting groove 13 and a first sealing ring 15, and a second mounting groove 16 and the first sealing ring 15. The first mounting groove 13, the second mounting groove 16, the first seal ring 15 and the second seal ring 14 are all arranged around the control valve cavity 32 at the periphery of the control valve cavity 32.

The first mounting groove 13 is disposed at a position corresponding to the connecting portion of the first chip layer 3, and the first seal ring 15 is disposed in the first mounting groove 13 and exposed after being mounted in the first mounting groove 13, and the exposed portion abuts against the elastic film layer 2 to press against the second chip layer 1. The second mounting groove 16 is disposed at a position of the second chip layer 1 corresponding to the connecting portion, the second seal ring 14 is disposed in the second mounting groove 16 and exposed after being mounted in the second mounting groove 16, and the exposed portion presses the elastic film layer 2 against the first chip layer 3.

As shown in fig. 10, the first mounting groove 13 and the second mounting groove 16 are disposed opposite to each other, the first sealing ring 15 and the second sealing ring 14 are disposed opposite to each other, and by disposing two sets of opposite sealing rings, sealing structures are formed between the elastic film layer 2 and the first chip layer 3 and between the elastic film layer 2 and the second chip layer 1, so that the sealing performance can be improved and the leakage can be reduced.

In a possible embodiment, the second mounting recess 16 is located close to the control valve chamber 32 with respect to the first mounting recess 13. So design for support and press close to control valve pocket 32 in the sealed position of first chip layer 3, can further improve the sealed effect between elasticity rete 2 and the first chip layer 3, improve the weeping problem.

The cross-sectional shapes of the first and second mounting grooves 13 and 16 may be semicircular, arc-shaped, rectangular, square, trapezoidal, or triangular. The first sealing ring 15 and the second sealing ring 14 may be O-rings, V-rings, rectangular rings, wedge-shaped rings, X-rings, L-rings, U-rings, or the like.

Fig. 10 and 11 illustrate an example in which mounting grooves and sealing rings are provided on both sides of the elastic film layer 2, but the embodiment of the present invention is not limited thereto, for example, in a possible embodiment, the mounting grooves and the sealing rings are only provided between the elastic film layer 2 and the first chip layer 3, or only between the elastic film layer 2 and the second chip layer 1; in another possible embodiment, two or more mounting grooves and sealing rings may be disposed between the elastic film layer 2 and the first chip layer 3, or/and two or more mounting grooves and sealing rings may be disposed between the elastic film layer 2 and the second chip layer 1.

It should be noted that the sealing protrusion, the sealing groove and the mounting groove in the above different embodiments are all as close to the control valve chamber 31 as the machining precision allows.

The second chip layer 1 is provided with a mounting cavity 101, an acting piece is arranged in the mounting cavity 101, and the acting piece moves in the mounting cavity 101 to drive the elastic film layer 2 to move. The acting piece corresponds to the type of the control valve, for example, the control valve can be an electromagnetic control valve, and the acting piece is an iron block which is arranged in the installation cavity 101 and moves under the action of an electromagnet; the control valve can be a camshaft pressure lever valve, and the acting element is a sliding block which can move in the installation cavity under the driving of a camshaft; the control valve can be an air pressure driving valve, and the acting element is a sliding block which can move in the mounting cavity under the drive of air pressure; the control valve can also be an electrothermal expansion valve, and the action element is a thermal expansion element which deforms at high temperature.

In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present application, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless explicitly stated or limited otherwise; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. Specific meanings of the above terms in the embodiments of the present application can be understood in specific cases by those of ordinary skill in the art.

In addition, the technical features mentioned in the different embodiments of the present application can be combined with each other as long as they do not conflict with each other.

So far, the technical solutions of the present application have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present application is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the present application, and the technical scheme after the changes or substitutions will fall into the protection scope of the present application.