阅读说明：本技术 基于高阶模馈电的太赫兹集成天线 (Terahertz integrated antenna based on high-order mode feed ) 是由 吴鹏 刘克彬 于 2021-09-16 设计创作，主要内容包括：本发明公开了一种基于高阶模馈电的太赫兹集成天线,包括介质基板、接地共面波导、多条激励缝隙、多条辐射缝隙、多个金属墙和多个金属柱等结构。本发明通过使用接地共面波导分成两个缝隙分别激励两个平行的TE-(201)高阶模腔体,能够获得较高的增益。而且,实施例中的基于高阶模馈电的太赫兹集成天线是平面结构,可以使用PCB工艺制作,从而无需多层或立体馈电激励结构,复杂度低、容易加工且集成度高,有利于器件的紧凑化,适用于手机等对体积以及工作频率要求高的应用领域,可以适用于太赫兹通信。本发明广泛应用于天线技术领域。(The invention discloses a terahertz integrated antenna based on high-order mode feed, which comprises a dielectric substrate, a grounded coplanar waveguide, a plurality of excitation gaps, a plurality of radiation gaps, a plurality of metal walls, a plurality of metal columns and other structures. The present invention separately excites two parallel TEs by dividing into two slots using a grounded coplanar waveguide 201 And a high-order mode cavity can obtain higher gain. Furthermore, the terahertz integrated antenna based on high-order mode feeding in the embodiment is a planar structure, and a PC (personal computer) can be usedAnd the manufacturing process B is adopted, so that a multi-layer or three-dimensional feed excitation structure is not needed, the complexity is low, the processing is easy, the integration level is high, the device is compact, and the terahertz wave band-pass filter is suitable for application fields such as mobile phones with high requirements on volume and working frequency and can be suitable for terahertz communication. The invention is widely applied to the technical field of antennas.)

1. Terahertz integrated antenna based on high order mode feed, its characterized in that includes:

a dielectric substrate; the upper surface of the medium substrate is provided with a metal layer, and the lower surface of the medium substrate is provided with a metal ground;

a grounded coplanar waveguide; the grounded coplanar waveguide extends from an excitation port of the upper surface into an interior of the upper surface;

a first excitation slit and a second excitation slit; the first excitation gap and the second excitation gap are both connected with the tail end of the grounded coplanar waveguide, the first excitation gap and the second excitation gap respectively extend along the direction perpendicular to the grounded coplanar waveguide, and the extending direction of the first excitation gap is opposite to that of the second excitation gap;

a first radiation slit, a second radiation slit, a third radiation slit and a fourth radiation slit; the first radiating slot and the second radiating slot are axisymmetrical with respect to the extending direction of the grounded coplanar waveguide, and the third radiating slot and the fourth radiating slot are axisymmetrical with respect to the extending direction of the grounded coplanar waveguide; the first radiation gap and the third radiation gap are axisymmetrical with respect to the extending direction of the first excitation gap, and the second radiation gap and the fourth radiation gap are axisymmetrical with respect to the extending direction of the second excitation gap;

the first metal wall, the second metal wall, the third metal wall and the fourth metal wall; the first metal wall semi-surrounds the first radiation gap, the second metal wall semi-surrounds the second radiation gap, the third metal wall semi-surrounds the third radiation gap, and the fourth metal wall semi-surrounds the fourth radiation gap;

a plurality of metal posts; and the metal posts are periodically and discretely distributed along the outline of the area where the grounding coplanar waveguide, the first excitation gap, the second excitation gap, the first radiation gap, the second radiation gap, the third radiation gap, the fourth radiation gap, the first metal wall, the second metal wall, the third metal wall and the fourth metal wall are located.

2. The integrated terahertz antenna based on high-order mode feeding according to claim 1, wherein the grounded coplanar waveguide, the first excitation slot, the second excitation slot, the first radiation slot, the second radiation slot, the third radiation slot and the fourth radiation slot are all located on the upper surface.

3. The integrated terahertz antenna based on high-order mode feeding according to claim 1, wherein the first excitation slot and the second excitation slot are the same in shape; in the first excitation gap, the width of a part connected with the grounded coplanar waveguide is smaller than that of other parts in the first excitation gap; in the second excitation slot, a width of a portion connected to the ground coplanar waveguide is smaller than other portions in the second excitation slot.

4. The terahertz integrated antenna based on high-order mode feeding according to claim 1, wherein the first radiation slot, the second radiation slot, the third radiation slot and the fourth radiation slot are all in the same L shape; the opening direction of the first radiation gap deviates from the first excitation gap, the opening direction of the second radiation gap deviates from the second excitation gap, the opening direction of the third radiation gap deviates from the third excitation gap, and the opening direction of the fourth radiation gap deviates from the fourth excitation gap.

5. The integrated terahertz antenna based on high-order mode feeding according to claim 1, wherein the distribution of the metal posts is axisymmetric with respect to the extending direction of the grounded coplanar waveguide.

6. The terahertz integrated antenna based on high-order mode feeding according to claim 1, wherein the first metal wall, the second metal wall, the third metal wall and the fourth metal wall are formed by injecting copper paste into a rectangular hole in the dielectric substrate.

7. The terahertz integrated antenna based on high-order mode feed according to claim 1, wherein the metal pillar is formed by injecting copper paste into a circular hole on the dielectric substrate.

8. The integrated terahertz antenna based on high-order mode feeding according to claim 1, wherein the dielectric substrate is of a model number Rogers RT/duroid 5880.

9. The integrated terahertz antenna based on high-order mode feeding according to any one of claims 1 to 8, wherein the improved structure of the integrated terahertz antenna based on high-order mode feeding further comprises:

a floor; the medium substrate is arranged on the floor, and the lower surface of the medium substrate faces the floor;

a dielectric plate;

a support pillar; one end of the supporting column is connected with the floor, and the other end of the supporting column is connected with the medium flat plate, so that the floor, the medium substrate and the medium flat plate are parallel to each other.

10. The integrated terahertz antenna based on high-order mode feed according to claim 9, wherein the supporting column is a height-adjustable structure.

Technical Field

The invention relates to the technical field of antennas, in particular to a terahertz integrated antenna based on high-order mode feed.

Background

Communication and radar electronic systems develop towards larger data transmission rate and higher detection precision, and in order to meet the performance development requirement, the radar communication frequency must develop towards a higher frequency band, which has been developed from microwave to a millimeter wave terahertz frequency band. With the increase of the application frequency, the electromagnetic wave conduction loss is increased, and the processing difficulty and the cost of the corresponding device are also increased sharply. In a radar communication application system, a high-gain antenna is often used to achieve higher-precision detection or longer-distance communication. At present, the high-gain antenna applied to millimeter waves mainly uses the technologies of resonant cavity feed, cavity support, E-surface coupling multilayer structure of a power divider and the like, and the technologies have the defects of complex feed network and long transmission path, thereby bringing extra loss and reducing the antenna efficiency; and the multilayer or three-dimensional feed excitation structure ensures that the excitation of the high-order mode is not on the same plane, increases the complexity of the antenna, and is not beneficial to being applied to the application field of millimeter wave terahertz frequency band with high requirement on volume, such as mobile phones and the like.

Disclosure of Invention

In view of at least one of the above technical problems, an object of the present invention is to provide a terahertz integrated antenna based on high-order mode feeding, including:

a dielectric substrate; the upper surface of the medium substrate is provided with a metal layer, and the lower surface of the medium substrate is provided with a metal ground;

a grounded coplanar waveguide; the grounded coplanar waveguide extends from an excitation port of the upper surface in parallel to an interior of the upper surface;

a first excitation slit and a second excitation slit; the first excitation gap and the second excitation gap are both connected with the tail end of the grounded coplanar waveguide, the first excitation gap and the second excitation gap respectively extend along the direction perpendicular to the grounded coplanar waveguide, and the extending direction of the first excitation gap is opposite to that of the second excitation gap;

a first radiation slit, a second radiation slit, a third radiation slit and a fourth radiation slit; the first radiating slot and the second radiating slot are axisymmetrical with respect to the extending direction of the grounded coplanar waveguide, and the third radiating slot and the fourth radiating slot are axisymmetrical with respect to the extending direction of the grounded coplanar waveguide; the first radiation gap and the third radiation gap are axisymmetrical with respect to the extending direction of the first excitation gap, and the second radiation gap and the fourth radiation gap are axisymmetrical with respect to the extending direction of the second excitation gap;

the first metal wall, the second metal wall, the third metal wall and the fourth metal wall; the first metal wall semi-surrounds the first radiation gap, the second metal wall semi-surrounds the second radiation gap, the third metal wall semi-surrounds the third radiation gap, and the fourth metal wall semi-surrounds the fourth radiation gap;

a plurality of metal posts; and the metal posts are periodically and discretely distributed along the outline of the area where the grounding coplanar waveguide, the first excitation gap, the second excitation gap, the first radiation gap, the second radiation gap, the third radiation gap, the fourth radiation gap, the first metal wall, the second metal wall, the third metal wall and the fourth metal wall are located.

Further, the grounded coplanar waveguide, the first excitation gap, the second excitation gap, the first radiation gap, the second radiation gap, the third radiation gap and the fourth radiation gap are all located on the upper surface.

Further, the first excitation gap and the second excitation gap are the same in shape; in the first excitation gap, the width of a part connected with the grounded coplanar waveguide is smaller than that of other parts in the first excitation gap; in the second excitation slot, a width of a portion connected to the ground coplanar waveguide is smaller than other portions in the second excitation slot.

Furthermore, the shapes of the first radiation gap, the second radiation gap, the third radiation gap and the fourth radiation gap are all in the same L shape; the opening direction of the first radiation gap deviates from the first excitation gap, the opening direction of the second radiation gap deviates from the second excitation gap, the opening direction of the third radiation gap deviates from the third excitation gap, and the opening direction of the fourth radiation gap deviates from the fourth excitation gap.

Further, the distribution of each metal pillar is axisymmetric with respect to the extending direction of the grounded coplanar waveguide.

Furthermore, the first metal wall, the second metal wall, the third metal wall and the fourth metal wall are formed by injecting copper paste into rectangular holes in the dielectric substrate.

Further, the metal column is formed by injecting copper paste into a circular hole on the dielectric substrate.

Further, the model of the dielectric substrate is Rogers RT/duroid 5880.

Further, the terahertz integrated antenna based on the high-order mode feed further comprises:

a floor; the medium substrate is arranged on the floor, and the lower surface of the medium substrate faces the floor;

a dielectric plate;

a support pillar; one end of the supporting column is connected with the floor, and the other end of the supporting column is connected with the medium flat plate, so that the floor, the medium substrate and the medium flat plate are parallel to each other.

Further, the support column is of a height-adjustable structure.

The invention has the beneficial effects that: in the embodiment, the terahertz integrated antenna based on high-order mode feed excites two parallel TE respectively by using the grounded coplanar waveguide to be divided into two gaps₂₀₁And a high-order mode cavity can obtain higher gain. In addition, the terahertz integrated antenna based on high-order mode feeding in the embodiment is a planar structure and can be manufactured by using a PCB (printed circuit board) process, so that a multilayer or three-dimensional feeding excitation structure is not needed, the complexity is low, the processing is easy, the integration level is high, the device compactness is facilitated, the terahertz integrated antenna is suitable for application fields such as mobile phones and the like with high requirements on volume and working frequency, and can be suitable for terahertz communication.

Drawings

Fig. 1, fig. 2, fig. 3 basic structure and fig. 4 modified structure are schematic structural diagrams of a terahertz integrated antenna based on high-order mode feeding in an embodiment;

FIG. 5 is a working principle diagram of the terahertz integrated antenna based on high-order mode feeding in the embodiment;

FIG. 6 is a diagram illustrating the relationship between the distance between the dielectric plate and the antenna floor and the antenna gain;

FIG. 7 is a schematic diagram showing the relationship between the thickness of a dielectric plate and the gain of an antenna;

FIG. 8 is a diagram illustrating the relationship between the diameter of a dielectric slab and the gain of an antenna;

FIG. 9 is a return loss and gain diagram obtained by simulating the basic structure of the terahertz integrated antenna based on high-order mode feeding in the embodiment;

FIG. 10 is a radiation pattern obtained by simulating the basic structure of the terahertz integrated antenna based on high-order mode feeding in the embodiment;

fig. 11 is a return loss and gain diagram obtained by simulating the improved structure of the terahertz integrated antenna based on high-order mode feeding in the embodiment.

Detailed Description

In this embodiment, the structure of the terahertz integrated antenna based on high-order mode feeding is shown in fig. 1. In this embodiment, the terahertz integrated antenna based on high-order mode feed includes a dielectric substrate 2, a grounded coplanar waveguide 4, a metal wall 5, an excitation gap 6, a radiation gap 7, and a metal column 8. Specifically, referring to fig. 2, the high-order mode feed-based terahertz integrated antenna includes a dielectric substrate 2, a grounded coplanar waveguide 4, a first excitation slot 601, a second excitation slot 602, a first radiation slot 701, a second radiation slot 702, a third radiation slot 703, a fourth radiation slot 704, a first metal wall 501, a second metal wall 502, a third metal wall 503, a fourth metal wall 504, and a plurality of metal pillars 8. The dielectric substrate 2 is manufactured using Rogers RT/duroid 5880 material.

Referring to fig. 1, a metal layer is provided on an upper surface 1 of a dielectric substrate 2, and a metal ground is provided on a lower surface 3 of the dielectric substrate 2. Specifically, a metal layer may be formed on the upper surface 1 of the dielectric substrate 2 and a metal ground may be formed on the lower surface 3 of the dielectric substrate 2 by using a copper-clad method.

Referring to fig. 2, the grounded coplanar waveguide 4, the first excitation slot 601, the second excitation slot 602, the first radiation slot 701, the second radiation slot 702, the third radiation slot 703 and the fourth radiation slot 704 are located at the upper surface 1. Specifically, the grounded coplanar waveguide 4 may be fabricated on the upper surface 1 of the dielectric substrate 2 by using a printed circuit technology, and a portion of copper clad in the upper surface 1 of the dielectric substrate 2 may be removed by using a copper etching method, so that the first excitation slot 601, the second excitation slot 602, the first radiation slot 701, the second radiation slot 702, the third radiation slot 703 and the fourth radiation slot 704 are formed by the portion where the copper clad is absent and the material of the dielectric substrate 2 is exposed.

Referring to fig. 2, a grounded coplanar waveguide 4 extends in parallel from one side of the upper surface 1 to the inside of the upper surface 1, and the end of the grounded coplanar waveguide located at one side of the upper surface 1 serves as an excitation port. The first excitation slot 601 and the second excitation slot 602 are respectively connected to the ends of the grounded coplanar waveguide 4, the first excitation slot 601 and the second excitation slot 602 respectively extend in a direction perpendicular to the grounded coplanar waveguide 4, and the extension direction of the first excitation slot 601 is opposite to the extension direction of the second excitation slot 602. Specifically, the first excitation slot 601 extends from the end of the grounded coplanar waveguide 4 in the peripheral direction of the upper surface 1 perpendicularly to the grounded coplanar waveguide 4, while the second excitation slot 602 extends from the end of the grounded coplanar waveguide 4 in the peripheral direction of the upper surface 1 in the opposite direction to the direction in which the first excitation slot 601 extends.

Referring to fig. 2, the first excitation slit 601 and the second excitation slit 602 have the same shape. Taking the first excitation slot 601 as an example, the shape of the first excitation slot 601 can be seen as being composed of a large-sized rectangle and a small-sized rectangle, wherein the small-sized rectangle is the portion of the first excitation slot 601 connected to the grounded coplanar waveguide 4, and the large-sized rectangle is the rest of the first excitation slot 601, so that the first excitation slot 601 is a structure in which the width of the portion connected to the grounded coplanar waveguide 4 is smaller than that of the other portions. Similarly, the second excitation slot 602 may be considered to be formed of a large-sized rectangle and a small-sized rectangle, wherein the small-sized rectangle is a portion of the second excitation slot 602 connected to the grounded coplanar waveguide 4, and the large-sized rectangle is the remaining portion of the second excitation slot 602. In the present embodiment, the size of the large-sized rectangle in the first excitation slit 601 and the second excitation slit 602 may be 0.715mm × 0.162mm, and the size of the small-sized rectangle may be 0.33mm × 0.135 mm.

Referring to fig. 2, the first radiation slot 701 and the second radiation slot 702 are axisymmetric, and the third radiation slot 703 and the fourth radiation slot 704 are axisymmetric, with the extending direction of the grounded coplanar waveguide 4 as a symmetry axis. The extending direction of the first excitation gap 601 is taken as a symmetry axis, and the first radiation gap 701 and the third radiation gap 703 are in an axisymmetric relationship; the second radiation gap 702 and the fourth radiation gap 704 are axisymmetrical with respect to the extending direction of the second excitation gap 602 as a symmetry axis.

Referring to fig. 2, the first radiation slit 701, the second radiation slit 702, the third radiation slit 703, and the fourth radiation slit 704 are all shaped in the same L-shape. Taking the first radiation slot 701 as an example, the first radiation slot 701 may be regarded as being composed of a large-size rectangle and a small-size rectangle, wherein the large-size rectangle and the small-size rectangle are respectively used as an arm of an L shape, so as to grow a right-angle opening, and the opening direction of the first radiation slot 701 is away from the first excitation slot 601, the opening direction of the second radiation slot 702 is away from the second excitation slot 602, the opening direction of the third radiation slot 703 is away from the third excitation slot, and the opening direction of the fourth radiation slot 704 is away from the fourth excitation slot. In the present embodiment, the size of the large-sized rectangle among the first radiation slit 701, the second radiation slit 702, the third radiation slit 703, and the fourth radiation slit 704 may be 0.67mm × 0.23mm, and the size of the small-sized rectangle may be 0.33mm × 0.135 mm.

Referring to fig. 2, a first metal wall 501 surrounds a first radiation slot 701 in half, a second metal wall 502 surrounds a second radiation slot 702 in half, a third metal wall 503 surrounds a third radiation slot 703 in half, and a fourth metal wall 504 surrounds a fourth radiation slot 704 in half. Referring to fig. 2 and 3, the areas where the grounded coplanar waveguide 4, the first excitation slot 601, the second excitation slot 602, the first radiation slot 701, the second radiation slot 702, the third radiation slot 703, the fourth radiation slot 704, the first metal wall 501, the second metal wall 502, the third metal wall 503 and the fourth metal wall 504 are located are in a symmetrical pattern, and the metal posts 8 are discretely distributed along the outline of the areas. The distribution of the metal posts 8 is axisymmetric with respect to the extending direction of the grounded coplanar waveguide 4 as a symmetry axis.

In this embodiment, the first metal wall 501, the second metal wall 502, the third metal wall 503, the fourth metal wall 504 and each metal pillar 8 are formed by injecting copper paste into a metalized via on the dielectric substrate 2, wherein the first metal wall 501, the second metal wall 502, the third metal wall 503 and the fourth metal wall 504 correspond to the via and have a rectangular shape, and the metal pillar 8 corresponds to the via and has a circular shape.

The principle of the terahertz integrated antenna based on high-order mode feeding shown in fig. 1, 2 and 3 is as follows: the first radiation slot 701, the second radiation slot 702, the third radiation slot 703 and the fourth radiation slot 704 and the first metal wall 501, the second metal wall 502, the third metal wall 503 and the fourth metal wall 504 which semi-surround them form a 2 x 2 slot array to form two parallel TEs₂₀₁A resonant cavity; a grounded coplanar waveguide 4(GCPW) is used as an antenna interface of a terahertz integrated antenna based on high-order mode feed, the grounded coplanar waveguide 4 is divided into two gaps at the terminal, namely a first excitation gap 601 and a second excitation gap 602, and two parallel TEs are excited respectively₂₀₁And a high-order mode cavity can obtain higher gain. Moreover, the antenna shown in fig. 1, 2 and 3 is a planar structure, and can be manufactured by using a PCB process, so that a multilayer or three-dimensional feed excitation structure is not required, the complexity is low, the processing is easy, the integration level is high, the device is compact, and the terahertz feed antenna is suitable for application fields such as mobile phones and the like with high requirements on volume and working frequency, and can be suitable for terahertz communication. Furthermore, using the L-shaped first radiation slit 701, second radiation slit 702, third radiation slit 703 and fourth radiation slit 704, the radiation patterns of both faces can be modified, and the equivalent distance between the first radiation slit 701 and the second radiation slit 702 can be reduced.

In this embodiment, the structures shown in fig. 1, fig. 2 and fig. 3, that is, the dielectric substrate 2 together with the structures such as the grounded coplanar waveguide 44, the metal wall 5, the excitation slot 6, the radiation slot 7 and the metal pillar 8 on the dielectric substrate 2, may be referred to as a body portion of the thz integrated antenna based on high-order mode feeding. Referring to fig. 4, the dielectric substrate 2 may be mounted on a floor 901 together with structures such as the grounded coplanar waveguide 44, the metal wall 5, the excitation gap 6, the radiation gap 7, and the metal post 8 on the dielectric substrate 2, with the lower surface 3 of the dielectric substrate 2 facing the floor 901. A plurality of supporting columns 903 are installed on the floor 901, one ends of the supporting columns 903 are connected with the floor 901, and the other ends of the supporting columns 903 are connected with the medium flat plate 902, so that the floor 901, the medium substrate 2 and the medium flat plate 902 are parallel to each other.

The principle of the terahertz integrated antenna based on high-order mode feeding shown in fig. 4 is shown in fig. 5. Fig. 5 is an electromagnetic wave propagation diagram of an electromagnetic wave transmitted or received by the body portion of the antenna between the flat medium and the floor 901. When the antenna radiates (or receives) the electromagnetic wave, the electromagnetic wave only transmits and reflects when passing through the dielectric plate 902, and no energy concentration or diffusion occurs. As can be seen from fig. 5, the electromagnetic waves are reflected and transmitted back and forth between the flat plate medium and the floor 901, and as long as the height of the reflective flat plate is selected appropriately, the transmitted electromagnetic waves are superposed in phase, so as to form an F-P (Fabry-Perot) resonator structure, and a higher antenna gain can be obtained. The resonance length of the F-P resonator structure shown in fig. 5 is as follows:

referring to fig. 6, by changing the distance h between the dielectric slab 902 and the antenna floor 901, the gain is greatly changed, and when h is increased to a certain extent, the gain is substantially unchanged.

Referring to fig. 7, it is not intended that the thicker or thinner the dielectric slab 902 lens the more pronounced the gain improvement. The gain can be maximized only by selecting the dielectric slab 902 to have a suitable thickness.

Referring to fig. 8, when the radius r of the circular dielectric slab 902 is changed and r is increased to a certain extent, the antenna gain is maximized, and the gain is decreased while the size of the dielectric slab 902 is increased.

In this embodiment, a height-adjustable structure may be used as the supporting column 903. Specifically, a hydraulic telescopic support structure can be used as the support column 903, and by driving a hydraulic pump by using the driving device 904, the length of the support column 903 can be controlled, so that the distance between the dielectric slab 902 and the antenna floor 901 can be adjusted, and the resonant frequency of the F-P resonator structure shown in fig. 5 can be adjusted, thereby being capable of adapting to different use occasions. In particular, the drive means may be a drive motor.

In this embodiment, the dimensions of the large-size rectangle in the first excitation gap 601 and the second excitation gap 602 are set to be 0.715mm × 0.162mm, the dimensions of the small-size rectangle are set to be 0.33mm × 0.135mm, the dimensions of the large-size rectangle in the first radiation gap 701, the second radiation gap 702, the third radiation gap 703 and the fourth radiation gap 704 are set to be 0.67mm × 0.23mm, the dimensions of the small-size rectangle are set to be 0.33mm × 0.135mm, the metal width of the grounded coplanar waveguide 4 is set to be 0.117mm, the width of the intermetallic gap of the grounded coplanar waveguide 4 is set to be 0.9mm, the width of the metal wall is set to be 0.12mm, the diameter of the metal pillar 8 is set to be 0.15mm, the distance between two adjacent metal pillars 8 is set to be 0.3mm, and the length and width of the dielectric substrate 2 is set to be 3.83mm × 2.95 mm. After the above dimensions are set, the terahertz integrated antenna based on high-order mode feeding shown in fig. 1, fig. 2 or fig. 3 is simulated, and the simulation result is shown in fig. 9, fig. 10 and fig. 11.

Fig. 9 is a graph of return loss and gain obtained by simulation, fig. 10 is a graph of radiation pattern obtained by simulation at 210GHz, and fig. 11 is a graph of return loss and gain obtained by simulation. Referring to fig. 9, 10 and 11, it can be seen that the highest gain of the THz integrated antenna based on the higher-order mode feeding is about 13.8dBi, has a 3dB bandwidth of 24.4% (0.18THz-0.23THz), and S11 is less than-10 dB. The terahertz integrated antenna based on high-order mode feed has good radiation characteristics on the E surface and the H surface in the normal direction, and has excellent characteristics of high gain, low front-to-back ratio, low side lobe and the like.

It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. Furthermore, the descriptions of upper, lower, left, right, etc. used in the present disclosure are only relative to the mutual positional relationship of the constituent parts of the present disclosure in the drawings. As used in this disclosure, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. In addition, unless defined otherwise, all technical and scientific terms used in this example have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the description of the embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this embodiment, the term "and/or" includes any combination of one or more of the associated listed items.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element of the same type from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. The use of any and all examples, or exemplary language ("e.g.," such as "or the like") provided with this embodiment is intended merely to better illuminate embodiments of the invention and does not pose a limitation on the scope of the invention unless otherwise claimed.

It should be recognized that embodiments of the present invention can be realized and implemented by computer hardware, a combination of hardware and software, or by computer instructions stored in a non-transitory computer readable memory. The methods may be implemented in a computer program using standard programming techniques, including a non-transitory computer-readable storage medium configured with the computer program, where the storage medium so configured causes a computer to operate in a specific and predefined manner, according to the methods and figures described in the detailed description. Each program may be implemented in a high level procedural or object oriented programming language to communicate with a computer system. However, the program(s) can be implemented in assembly or machine language, if desired. In any case, the language may be a compiled or interpreted language. Furthermore, the program can be run on a programmed application specific integrated circuit for this purpose.

Further, operations of processes described in this embodiment can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The processes described in this embodiment (or variations and/or combinations thereof) may be performed under the control of one or more computer systems configured with executable instructions, and may be implemented as code (e.g., executable instructions, one or more computer programs, or one or more applications) collectively executed on one or more processors, by hardware, or combinations thereof. The computer program includes a plurality of instructions executable by one or more processors.

Further, the method may be implemented in any type of computing platform operatively connected to a suitable interface, including but not limited to a personal computer, mini computer, mainframe, workstation, networked or distributed computing environment, separate or integrated computer platform, or in communication with a charged particle tool or other imaging device, and the like. Aspects of the invention may be embodied in machine-readable code stored on a non-transitory storage medium or device, whether removable or integrated into a computing platform, such as a hard disk, optically read and/or write storage medium, RAM, ROM, or the like, such that it may be read by a programmable computer, which when read by the storage medium or device, is operative to configure and operate the computer to perform the procedures described herein. Further, the machine-readable code, or portions thereof, may be transmitted over a wired or wireless network. The invention described in this embodiment includes these and other different types of non-transitory computer-readable storage media when such media include instructions or programs that implement the steps described above in conjunction with a microprocessor or other data processor. The invention also includes the computer itself when programmed according to the methods and techniques described herein.

A computer program can be applied to input data to perform the functions described in the present embodiment to convert the input data to generate output data that is stored to a non-volatile memory. The output information may also be applied to one or more output devices, such as a display. In a preferred embodiment of the invention, the transformed data represents physical and tangible objects, including particular visual depictions of physical and tangible objects produced on a display.

The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiment, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention as long as the technical effects of the present invention are achieved by the same means. The invention is capable of other modifications and variations in its technical solution and/or its implementation, within the scope of protection of the invention.