阅读说明：本技术 一种厚膜异形电路连片印刷装置 (Thick film special-shaped circuit connection piece printing device ) 是由 符宏大 尤广为 韦登 王星鑫 陈鹏 于 2021-09-23 设计创作，主要内容包括：本发明涉及一种厚膜异形电路连片印刷装置,包括承载台(1)、承载台吸取装置(2)以及承载台承接体(3),承载台(1)表面上设有一组安装槽(11),每个安装槽(11)内设有定位柱(12)；承载台吸取装置(2),承载台吸取装置(2)包括吊架(21),吊架(21)下端连接一组吸盘(22),每个吸盘通过管道与空气压缩机连接；承载台承接体(3)的上表面设有与承载台(1)外轮廓配合的承接槽(31)；异型电路通过定位柱(12)定位并安装在安装槽(11)内,承载台吸取装置(2)吸取承载台(1)转运,承载台(1)通过其轮廓配合与承接槽(31)连接。本发明可以提高生产效率和产品质量。(The invention relates to a thick film special-shaped circuit connection piece printing device which comprises a bearing table (1), a bearing table suction device (2) and a bearing table bearing body (3), wherein a group of mounting grooves (11) are formed in the surface of the bearing table (1), and a positioning column (12) is arranged in each mounting groove (11); the bearing table suction device (2), the bearing table suction device (2) comprises a hanger (21), the lower end of the hanger (21) is connected with a group of suckers (22), and each sucker is connected with an air compressor through a pipeline; the upper surface of the bearing table bearing body (3) is provided with a bearing groove (31) matched with the outer contour of the bearing table (1); the special-shaped circuit is positioned and installed in the installation groove (11) through the positioning column (12), the bearing platform suction device (2) sucks the bearing platform (1) to transfer, and the bearing platform (1) is connected with the bearing groove (31) through the contour matching of the bearing platform. The invention can improve the production efficiency and the product quality.)

1. The utility model provides a thick film special-shaped circuit even piece printing device which characterized in that includes:

a. the special-shaped circuit mounting structure comprises a bearing table (1), wherein a group of mounting grooves (11) in clearance fit with the outer contour of a special-shaped circuit are formed in the surface of the bearing table (1), and a positioning column (12) is arranged in each mounting groove (11);

b. the bearing platform suction device (2) comprises a hanging bracket (21), the lower end of the hanging bracket (21) is connected with a group of suckers (22), and each sucker is connected with an air compressor through a pipeline;

c. the bearing platform comprises a bearing platform bearing body (3), wherein the upper surface of the bearing platform bearing body (3) is provided with a bearing groove (31) matched with the outer contour of the bearing platform (1);

d. the special-shaped circuit is positioned and installed in the installation groove (11) through the positioning column (12), the bearing platform suction device (2) sucks the bearing platform (1) to transfer, and the bearing platform (1) is connected with the bearing groove (31) through the contour matching of the bearing platform.

2. The thick film special-shaped circuit connection printing device according to claim 1, wherein: the upper surfaces of the positioning columns (12) and the bearing table (1) are coplanar.

3. The thick film special-shaped circuit connection printing device according to claim 2, characterized in that: the thickness of the bearing table (1) is the same as the depth of the bearing groove (31).

4. The thick film special-shaped circuit connection printing device according to claim 3, wherein: the number of the group of suckers (22) is 4, and the suckers are uniformly distributed in 4 vertex angle areas of the lower plane of the hanger (21).

5. The thick film special-shaped circuit connection printing device according to claim 4, wherein: and a suction positioning line (13) corresponding to the position of the sucker (22) is arranged in the vertex angle area of the upper plane of the bearing table (1).

6. The thick film special-shaped circuit connection printing device according to claim 1, wherein: the bearing table (1) is a ceramic bearing table.

Technical Field

The invention relates to the technical field of integrated circuit manufacturing equipment, in particular to a thick film special-shaped circuit connection printing device.

Background

With the market demand and the continuous development of thick film technology, various special-shaped (relative to square) processing circuits with holes exist, such as a processing circuit with a hole in the center and a circular outer contour, a processing circuit with a hole in the center and a rhombic outer contour and the like. The circuit is difficult to process, long in period and difficult to meet the requirements.

At the present stage, the conventional film forming processing mode can only process single sheets, and the specific process is as follows: during the first layer of printing, a single ceramic substrate is placed on a wafer bearing table, fixed by a positioning pin and then printed, and after printing is finished, the single ceramic substrate is placed on a molybdenum wire disc and dried and sintered; when the second layer is printed, the first layer of patterns are selected as reference objects to be aligned, the second layer is printed, each piece needs to be manually aligned, and drying and sintering are carried out after printing is finished; the third layer printing is the same as the second layer printing, and finally drying and sintering are carried out.

The process shows that the existing thick film circuit printing device can only process the special-shaped circuit by a single chip, the processing efficiency is low, and the output is difficult to meet the requirement; each layer of printing needs manual alignment and positioning, the human influence factor is large, and the product quality is not easy to guarantee. How to improve the processing efficiency, improve the alignment positioning precision and ensure the product quality becomes the problem which needs to be solved urgently at present.

Disclosure of Invention

In order to solve the problems, the invention provides a thick film special-shaped circuit connection printing device.

The invention adopts the following technical scheme:

the utility model provides a thick film special-shaped circuit even piece printing device which characterized in that includes:

a. the surface of the bearing table is provided with a group of mounting grooves in clearance fit with the outer contour of the special-shaped circuit, and each mounting groove is internally provided with a positioning column;

b. the bearing platform suction device comprises a hanger, the lower end of the hanger is connected with a group of suckers, and each sucker is connected with an air compressor through a pipeline;

c. the bearing platform comprises a bearing platform bearing body, wherein the upper surface of the bearing platform bearing body is provided with a bearing groove matched with the outer contour of the bearing platform;

d. the abnormal shape circuit passes through the reference column location and installs in the mounting groove, and plummer suction means absorbs the plummer and transports, and the plummer cooperates through its profile and accepts the groove and be connected.

Furthermore, the upper surface of the positioning column is coplanar with the upper surface of the bearing table.

Further, the thickness of the bearing platform is the same as the depth of the bearing groove.

Furthermore, the group of suckers is 4 in number and uniformly distributed in 4 vertex angle areas of the lower plane of the hanging bracket.

Furthermore, a suction positioning line corresponding to the position of the sucker is arranged in the vertex angle area of the plane on the bearing table.

Further, the bearing table is a ceramic bearing table.

The invention has the following beneficial effects:

1. this scheme can realize that special-shaped circuit even piece printing can large-scale production, has improved machining efficiency.

2. In the scheme, the special-shaped circuit and the bearing table work together in the processes of multilayer printing and drying sintering, and the relative position of the special-shaped circuit and the positioning column is unchanged, so that the situation that the special-shaped circuit is positioned for multiple times is avoided, and the printing quality is improved; meanwhile, the phenomenon that the special-shaped circuit is taken for many times is avoided, the probability of scratching and damaging the film layer of the substrate is reduced, and the product quality is improved on the whole.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic cross-sectional view of a carrier stage;

fig. 3 is a schematic structural diagram of a carrier stage suction device.

Detailed Description

In order to make the present invention more clear, the following describes a thick film shaped circuit connection printing device of the present invention with reference to the attached drawings, and the specific embodiments described herein are only used for explaining the present invention and are not used to limit the present invention.

As shown in figure 1, the thick film special-shaped circuit connection printing device comprises a bearing table 1, a bearing table suction device 2 and a bearing table receiving body 3. Plummer 1 is used for installing special-shaped circuit 4, and plummer suction means 2 absorbs plummer 1 and transports, and plummer 1 that plummer receiver 3 installation has special-shaped circuit 4 carries out the printing process. Wherein, the center of the special-shaped circuit 4 is provided with a round positioning hole 41, and the outer contour thereof is also round.

As shown in fig. 1 and 2, the carrier 1 is made of a high temperature resistant ceramic rectangular plate, 6 mounting grooves 11 are arranged on the upper surface of the carrier, the groove-shaped profile of each mounting groove 11 is matched with the outer profile of the special-shaped circuit, a gap is reserved between the groove-shaped profile of each mounting groove 11 and the outer profile of the special-shaped circuit, the gap has the function of facilitating the special-shaped circuit to be taken out, and meanwhile, the over-positioning is prevented, and the groove-shaped profile of the mounting groove 11 is circular. The center of each mounting groove 11 is provided with a cylindrical positioning column 12, and the cross section of the positioning column 12 is matched with the positioning hole 41 and can form a tight fit. The bottom of the installation groove 11 is parallel to the upper surface of the bearing platform 1, the depth of the installation groove 11 is determined according to the thickness of the special-shaped circuit 4, when the special-shaped circuit 4 is installed in the installation groove 11, the upper plane of the special-shaped circuit 4 is ensured to be coplanar with the upper plane of the bearing platform 1, and in addition, the upper surface of the installation groove positioning column 12 is also coplanar with the upper surface of the bearing platform 1. The absorption positioning lines 13 are symmetrically arranged on the center of the upper surface of the bearing table 1, and the absorption positioning lines 13 are cross lines and are distributed at four vertex angles of the bearing table 1 to be used for positioning the absorption position of the bearing table absorption device 2.

As shown in fig. 1 and 3, the carrier platform suction device 2 includes a hanger 21, the hanger 21 is a rectangular frame structure formed by welding rectangular pipes, a lifting lug 23 is welded at the center of the hanger 21, the lifting lug 23 is used for connecting a lifting device, and the lifting device can move the carrier platform suction device 2 to a proper position. 4 sucking discs 22 are connected to the lower end plane of the hanger 21, and the sucking discs 22 are symmetrically distributed at four vertex angles around the center of the hanger 21. Every sucking disc 22 is connected with air compressor through soft pipeline, changes the operating condition of sucking disc 22 through switching air compressor's the gas vent of inhaling, when induction port and sucking disc 22 intercommunication, sucking disc 22 work, corresponding absorption plummer 1 absorbs the relevant position of location line 13, when the gas vent communicates with sucking disc 22 (or when sucking disc 22 communicates with outside atmospheric pressure), sucking disc 22 adsorption affinity disappears, and sucking disc 22 breaks away from plummer 1. The four-point distribution of the suckers 22 ensures that the whole force is uniform and stable, and the suckers always keep horizontal movement in the transfer process of the bearing table, so that the precondition guarantee is provided for the uniformity of the film thickness; the air compressor and the switching suction and exhaust structure thereof are all the prior art, and are not repeated here.

As shown in fig. 1, the receiving body 3 of the susceptor is a rectangular body, and can be made of aluminum alloy or stainless steel. The bearing table receiving body 3 is provided with a rectangular receiving groove 31 on the upper surface, and the receiving groove 31 and the outer contour of the bearing table 1 can form clearance fit, so that the bearing table 1 can be positioned and taken conveniently. The bottom of the bearing groove 31 is coplanar with the upper plane of the bearing body 3 of the bearing table, and the depth of the groove is the same as the thickness of the bearing table 1, so that when the bearing table 1 is placed in the bearing groove 31, the upper surface of the bearing table 1 and the upper surface of the bearing body 3 of the bearing table can be ensured to be coplanar. The plummer bearing body 3 is placed for the level at the during operation, can prevent to appear causing the uneven phenomenon of rete thickness of printing because of the upper surface slope.

In addition, the special-shaped circuit 4 may also be: the center is a circular positioning hole, and the outer contour is in other shapes such as rhombus, square and the like.

The working process is as follows:

1. a group of special-shaped circuits 4 to be printed are placed in the mounting groove 11, the positioning holes 41 of the special-shaped circuits are tightly matched with the positioning columns 12, the special-shaped circuits and the positioning columns do not move relatively, and the upper surfaces of the special-shaped circuits 4 and the upper surface of the bearing table 1 are coplanar.

2. After the installation of the special-shaped circuit 4 on the bearing table 1 is completed, the lifting lugs 23 of the bearing table suction device 2 are connected with the lifting device, the suction cups 22 are respectively attached to the suction positioning lines 13 correspondingly, and the air compressor is controlled to enable the suction cups 22 to suck the bearing table 1.

3. The lifting device drives the bearing platform 1 to transfer, the bearing platform 1 is placed into the bearing groove 31 of the bearing platform bearing body 3, the upper plane of the bearing platform 1 and the upper plane of the bearing platform bearing body 3 are coplanar, then the sucking discs 22 are loosened, and the bearing platform suction device 2 is removed.

4. The special-shaped circuit 4 provided with the bearing table 1 is subjected to a printing process.

5. And (4) transferring the first printed special-shaped circuit 4 together with the bearing table 1 to a drying and sintering process for drying and sintering.

6. The 3 rd to 5 th steps are repeated for a plurality of printing and drying sintering processes.

7. After the thick film printing and the drying and sintering are finished, the special-shaped circuit 4 is manually taken out.

In the invention, a plurality of special-shaped circuits are arranged on the bearing platform, so that the bearing platform as a unit is integrally subjected to the working procedures of moving, printing, drying and the like, compared with single-chip printing, in the same working time, the finished product quantity is more, and the processing speed is obviously improved; in the whole printing process, the invention only needs one-time positioning, avoids the problem of poor printing registration precision caused by multiple positioning, and simultaneously avoids the phenomenon that tweezers and other taking tools scratch the film layer when the circuits are taken for multiple times.

In conclusion, the invention can improve the production efficiency and the product quality.