阅读说明：本技术 低介电常数阻焊油墨及其制备方法 (Low-dielectric-constant solder resist ink and preparation method thereof ) 是由 吕赛赛 王�琦 于 2021-07-08 设计创作，主要内容包括：本发明公开了一种低介电常数阻焊油墨及其制备方法,属于阻焊油墨的制备领域,按照质量份计,本发明的阻焊油墨由以下组分制备：聚酯丙烯酸树脂80～100份；环氧树脂80～100份；二氧化硅40～60份；聚四氟乙烯20～30份；PH调节剂1～10份；有机溶剂10～20份。本发明中采用聚四氟乙烯-二氧化硅的共混物作为阻焊油墨的成分,聚四氟乙烯为良好的介电性能材料,但是由于聚四氟乙烯的机械强度不高,本发明中采用将聚四氟乙烯-二氧化硅混合,因此,提高了聚四氟乙烯的机械强度,使得本发明中的阻焊油墨在具备低介电常数的同时,也赋予了更高的机械强度。(The invention discloses a low dielectric constant solder resist ink and a preparation method thereof, belonging to the field of solder resist ink preparation, wherein the solder resist ink is prepared from the following components in parts by mass: 80-100 parts of polyester acrylic resin; 80-100 parts of epoxy resin; 40-60 parts of silicon dioxide; 20-30 parts of polytetrafluoroethylene; 1-10 parts of a pH regulator; 10-20 parts of an organic solvent. In the invention, the polytetrafluoroethylene-silicon dioxide blend is used as a component of the solder resist ink, polytetrafluoroethylene is a material with good dielectric property, but because the mechanical strength of polytetrafluoroethylene is not high, the polytetrafluoroethylene-silicon dioxide blend is adopted in the invention, so that the mechanical strength of polytetrafluoroethylene is improved, and the solder resist ink has low dielectric constant and higher mechanical strength.)

1. The low-dielectric-constant solder resist ink is characterized by being prepared from the following components in parts by mass:

80-100 parts of polyester acrylic resin;

80-100 parts of epoxy resin;

40-60 parts of silicon dioxide;

20-30 parts of polytetrafluoroethylene;

1-10 parts of a pH regulator;

10-20 parts of an organic solvent.

2. The low dielectric constant solder resist ink as claimed in claim 1, wherein the ratio of the polyester acrylic resin to the epoxy resin is 1:1 by weight.

3. The low dielectric constant solder resist ink as claimed in claim 1, wherein the silica is nano silica powder, and the particle size of the powder is 60-90 nm.

4. The low dielectric constant solder resist ink as defined in claim 1, wherein the mass part ratio of the silicon dioxide to the polytetrafluoroethylene is 2: 1.

5. The method for preparing the low dielectric constant solder resist ink as claimed in any one of claims 1 to 4, wherein the method specifically comprises:

step one, adding 40-60 parts of silicon dioxide and 20-30 parts of polytetrafluoroethylene according to the proportion of 2:1 to form a polytetrafluoroethylene-silicon dioxide blend, wherein the silicon dioxide can enhance the mechanical strength of the polytetrafluoroethylene;

step two, mixing 80-100 parts of polyester acrylic resin with 80-100 parts of epoxy resin, fully mixing the polyester acrylic resin with the epoxy resin by using a high-speed dispersant, and dispersing until the fineness is less than or equal to 10 microns after uniform mixing;

adding the fine particles of the polyester acrylic resin-epoxy resin prepared in the step two into the polytetrafluoroethylene-silicon dioxide blend prepared in the step one, simultaneously adding 10-20 parts of organic solvent, and uniformly stirring;

and step four, measuring the PH value in the step three, and adding 1-10 parts of a PH regulator to ensure that the acid value of the mixture is between 80 and 85.

6. The method of claim 5, wherein the organic solvent is ethylene glycol.

Technical Field

The invention belongs to the field of solder resist ink preparation, and particularly relates to a low-dielectric-constant solder resist ink and a preparation method thereof.

Background

With the rapid development of technology and the coming of the 5G era, the requirements for printed circuit boards are also increasing, wherein the performance composition of solder resist ink on the printed circuit boards is the determining performance of the printed circuit boards. Therefore, whether the solder resist ink on the printed circuit board has a low dielectric constant is also a key factor for determining the performance of the 5G device. However, the most straightforward approach in the prior art is to use low dielectric constant ink materials in solder resist inks. Low dielectric constant materials, otherwise known as low-K materials, are used to reduce the leakage current of integrated circuits by reducing the dielectric constant of the dielectric material used in printed circuit boards. Therefore, selecting a reasonable low dielectric constant solder resist ink material becomes a difficult problem for those skilled in the art.

Disclosure of Invention

Aiming at the problems in the prior art, the invention discloses low-dielectric-constant solder resist ink and a preparation method thereof, and the solder resist ink disclosed by the invention is low-dielectric-constant solder resist ink by adding a multi-component combination in the solder resist ink, so that the requirements of a printed circuit board in the 5G era can be met.

The invention is realized by the following steps:

the low-dielectric-constant solder resist ink is characterized by being prepared from the following components in parts by mass: 80-100 parts of polyester acrylic resin; 80-100 parts of epoxy resin; 40-60 parts of silicon dioxide; 20-30 parts of polytetrafluoroethylene; 1-10 parts of a pH regulator; 10-20 parts of an organic solvent.

Further, the mass part ratio of the polyester acrylic resin to the epoxy resin is 1: 1.

Further, the silicon dioxide is nano silicon dioxide powder, and the particle size of the powder is 60-90 nm.

Further, the mass part ratio of the silicon dioxide to the polytetrafluoroethylene is 2: 1.

The invention also discloses a preparation method of the low-dielectric-constant solder resist ink, which is characterized by comprising the following steps:

step one, adding 40-60 parts of silicon dioxide and 20-30 parts of polytetrafluoroethylene according to the proportion of 2:1 to form a polytetrafluoroethylene-silicon dioxide blend, wherein the silicon dioxide can enhance the mechanical strength of the polytetrafluoroethylene;

step two, mixing 80-100 parts of polyester acrylic resin with 80-100 parts of epoxy resin, fully mixing the polyester acrylic resin with the epoxy resin by using a high-speed dispersant, and dispersing until the fineness is less than or equal to 10 microns after uniform mixing;

adding the fine particles of the polyester acrylic resin-epoxy resin prepared in the step two into the polytetrafluoroethylene-silicon dioxide blend prepared in the step one, simultaneously adding 10-20 parts of organic solvent, and uniformly stirring;

and step four, measuring the PH value in the step three, and adding 1-10 parts of a PH regulator to ensure that the acid value of the mixture is between 80 and 85.

Further, the organic solvent is ethylene glycol.

Compared with the prior art, the invention has the beneficial effects that:

in the invention, the acid value of the solder resist ink is controlled to be 80-85 by using a PH regulator, so that the solder resist ink is prevented from being high in acid value and slow in curing; in addition, the polytetrafluoroethylene-silicon dioxide blend is used as a component of the solder resist ink, polytetrafluoroethylene is a good dielectric material, but the mechanical strength of polytetrafluoroethylene is not high, and the polytetrafluoroethylene-silicon dioxide blend is adopted in the invention, so that the mechanical strength of polytetrafluoroethylene is improved, the solder resist ink has low dielectric constant, and meanwhile, higher mechanical strength is also endowed.

Detailed Description

In order to make the objects, technical solutions and effects of the present invention more clear, the present invention is further described in detail by the following examples. It should be noted that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Example 1

Step one, adding 40 parts of silicon dioxide and 20 parts of polytetrafluoroethylene according to the proportion of 2:1 to form a polytetrafluoroethylene-silicon dioxide blend, wherein the silicon dioxide can enhance the mechanical strength of the polytetrafluoroethylene;

step two, 89 parts of polyester acrylic resin is mixed with 89 parts of epoxy resin, the polyester acrylic resin and the epoxy resin are fully mixed by using a high-speed dispersant, and the mixture is uniformly mixed and then dispersed until the fineness is less than or equal to 10 microns;

step three, adding the fine particles of the polyester acrylic resin-epoxy resin prepared in the step two into the polytetrafluoroethylene-silicon dioxide blend prepared in the step one, simultaneously adding 17 parts of ethylene glycol, and uniformly stirring;

and step four, measuring the PH value in the step three, and adding 1-10 parts of a PH regulator to ensure that the acid value of the mixture is between 80 and 85.

Example 2

Step one, adding 40 parts of silicon dioxide and 20 parts of polytetrafluoroethylene according to the proportion of 2:1 to form a polytetrafluoroethylene-silicon dioxide blend, wherein the silicon dioxide can enhance the mechanical strength of the polytetrafluoroethylene;

step two, mixing 80 parts of polyester acrylic resin with 80 parts of epoxy resin, fully mixing the polyester acrylic resin with the epoxy resin by using a high-speed dispersant, and dispersing until the fineness is less than or equal to 10 micrometers after uniform mixing;

step three, adding the fine particles of the polyester acrylic resin-epoxy resin prepared in the step two into the polytetrafluoroethylene-silicon dioxide blend prepared in the step one, simultaneously adding 10 parts of ethylene glycol, and uniformly stirring;

and step four, measuring the PH value in the step three, and adding 1-10 parts of a PH regulator to ensure that the acid value of the mixture is between 80 and 85.

Example 3

Step one, adding 60 parts of silicon dioxide and 30 parts of polytetrafluoroethylene according to the proportion of 2:1 to form a polytetrafluoroethylene-silicon dioxide blend, wherein the silicon dioxide can enhance the mechanical strength of the polytetrafluoroethylene;

step two, mixing 100 parts of polyester acrylic resin with 100 parts of epoxy resin, fully mixing the polyester acrylic resin with the epoxy resin by using a high-speed dispersant, and dispersing until the fineness is less than or equal to 10 micrometers after uniform mixing;

step three, adding the fine particles of the polyester acrylic resin-epoxy resin prepared in the step two into the polytetrafluoroethylene-silicon dioxide blend prepared in the step one, simultaneously adding 20 parts of ethylene glycol, and uniformly stirring;

and step four, measuring the PH value in the step three, and adding 1-10 parts of a PH regulator to ensure that the acid value of the mixture is between 80 and 85.

Example 4

Step one, adding 50 parts of silicon dioxide and 25 parts of polytetrafluoroethylene according to the proportion of 2:1 to form a polytetrafluoroethylene-silicon dioxide blend, wherein the silicon dioxide can enhance the mechanical strength of the polytetrafluoroethylene;

step two, mixing 90 parts of polyester acrylic resin with 90 parts of epoxy resin, fully mixing the polyester acrylic resin with the epoxy resin by using a high-speed dispersant, and dispersing until the fineness is less than or equal to 10 micrometers after uniform mixing;

step three, adding the fine particles of the polyester acrylic resin-epoxy resin prepared in the step two into the polytetrafluoroethylene-silicon dioxide blend prepared in the step one, simultaneously adding 16 parts of ethylene glycol, and uniformly stirring;

and step four, measuring the PH value in the step three, and adding 1-10 parts of a PH regulator to ensure that the acid value of the mixture is between 80 and 85.

Example 5

Step one, adding 52 parts of silicon dioxide and 26 parts of polytetrafluoroethylene according to the ratio of 2:1 to form a polytetrafluoroethylene-silicon dioxide blend, wherein the silicon dioxide can enhance the mechanical strength of the polytetrafluoroethylene;

step two, mixing 99 parts of polyester acrylic resin with 99 parts of epoxy resin, fully mixing the polyester acrylic resin with the epoxy resin by using a high-speed dispersant, and dispersing until the fineness is less than or equal to 10 micrometers after uniform mixing;

step three, adding the fine particles of the polyester acrylic resin-epoxy resin prepared in the step two into the polytetrafluoroethylene-silicon dioxide blend prepared in the step one, simultaneously adding 17 parts of ethylene glycol, and uniformly stirring;

and step four, measuring the PH value in the step three, and adding 1-10 parts of a PH regulator to ensure that the acid value of the mixture is between 80 and 85.

Comparative example 1

Step one, 89 parts of polyester acrylic resin is mixed with 89 parts of epoxy resin, the polyester acrylic resin and the epoxy resin are fully mixed by using a high-speed dispersant, and the mixture is uniformly mixed and then dispersed until the fineness is less than or equal to 10 microns;

step two, adding the fine particles of the polyester acrylic resin-epoxy resin prepared in the step two into 20 parts of polytetrafluoroethylene, simultaneously adding 17 parts of ethylene glycol, and uniformly stirring;

and step three, measuring the PH value in the step three, and adding 1-10 parts of a PH regulator to ensure that the acid value of the mixture is between 80 and 85.

This comparative example differs from example 1 in that no silica is added.

Comparative example 2

Step one, 89 parts of polyester acrylic resin is mixed with 89 parts of epoxy resin, the polyester acrylic resin and the epoxy resin are fully mixed by using a high-speed dispersant, and the mixture is uniformly mixed and then dispersed until the fineness is less than or equal to 10 microns;

step two, adding the fine particles of the polyester acrylic resin-epoxy resin prepared in the step two into 40 parts of silicon dioxide, simultaneously adding 17 parts of ethylene glycol, and uniformly stirring;

and step three, measuring the PH value in the step three, and adding 1-10 parts of a PH regulator to ensure that the acid value of the mixture is between 80 and 85.

This comparative example differs from example 1 in that: no 20 parts of polytetrafluoroethylene were added.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that modifications can be made by those skilled in the art without departing from the principle of the present invention, and these modifications should also be construed as the protection scope of the present invention.