阅读说明：本技术 一种传感器组件 (Sensor assembly ) 是由 秦长辉 韩冰 曾凡乐 于 2021-08-24 设计创作，主要内容包括：本发明公开了一种传感器组件,包括传感器外壳和与传感器外壳螺纹连接的锁紧螺母,传感器外壳内设有用于安装传感器基座的基座安装孔和与基座安装孔连通的灌胶孔,传感器基座靠近灌胶孔的一侧的外壁面设有挂胶槽；传感器基座内套设有传感器和胶接于传感器底部的PCB,PCB在传感器的焊点上方设有用于容纳线束的焊线槽,焊线槽、线束均与焊点焊接连接。由于PCB、线束和传感器的焊点填充焊接为一体,且PCB和传感器胶接固定连接,线束与传感器的焊接面积增大,焊点更加牢固,线束不易撕掉焊点铜皮,提高了生产良率；同时,PCB的焊线槽可限制产品转移过程中线束的晃动,进一步避免了线束晃动致使焊点铜皮撕裂分离。(The invention discloses a sensor assembly, which comprises a sensor shell and a locking nut in threaded connection with the sensor shell, wherein a base mounting hole for mounting a sensor base and a glue pouring hole communicated with the base mounting hole are formed in the sensor shell; the sensor base endotheca is equipped with the sensor and splices in the PCB of sensor bottom, and PCB is equipped with the bonding wire groove that is used for holding the pencil above the solder joint of sensor, and bonding wire groove, pencil all are connected with solder joint welded connection. The PCB, the wire harness and the welding spot of the sensor are filled and welded into a whole, and the PCB and the sensor are fixedly connected in a glued joint manner, so that the welding area of the wire harness and the sensor is increased, the welding spot is firmer, the copper sheet of the welding spot is not easy to tear off by the wire harness, and the production yield is improved; meanwhile, the welding wire groove of the PCB can limit the shaking of the wire harness in the product transferring process, and further avoids the situation that the wire harness shakes to cause tearing and separation of the copper sheets of the welding points.)

1. A sensor assembly comprises a sensor shell (4) and a locking nut (5) in threaded connection with the sensor shell (4), and is characterized in that a base mounting hole (41) for mounting a sensor base (3) and a glue pouring hole (42) communicated with the base mounting hole (41) are formed in the sensor shell (4), and a glue hanging groove (34) is formed in the outer wall surface of one side, close to the glue pouring hole (42), of the sensor base (3);

sensor (1) and splice in PCB (2) of sensor (1) bottom are equipped with to sensor base (3) endotheca, PCB (2) are in the solder joint top of sensor (1) is equipped with welding wire groove (21) that are used for holding pencil (7), welding wire groove (21) pencil (7) all with solder joint welded connection.

2. The sensor assembly according to claim 1, wherein the sensor base (3) comprises a through sensor mounting hole (31) for mounting the sensor (1) and a PCB positioning block (33) for positioning the PCB (2), the PCB positioning block (33) is connected to an end surface of the sensor base (3) close to the glue filling hole (42), and the glue hanging groove (34) is arranged on an outer wall surface of the PCB positioning block (33);

the end face, close to the glue pouring hole (42), of the sensor mounting hole (31) is provided with a spline groove (32) used for preventing the sensor (1) from rotating.

3. The sensor assembly according to claim 2, characterized in that the end face of the sensor base (3) close to the glue filling hole (42) is provided with four PCB positioning blocks (33), and the positioning surfaces of two adjacent PCB positioning blocks (33) for contacting the PCB (2) are perpendicular to each other.

4. Sensor assembly according to claim 3, wherein the PCB positioning blocks (33) are evenly distributed in the circumferential direction of the sensor base (3).

5. A sensor assembly according to any one of claims 1-4, characterized in that the PCB (2) is provided with a PCB glue hole (22) in the centre.

6. Sensor assembly according to any one of claims 1-4, in which the solder wire groove (21) is a sector groove with a circumferential angle of more than 180 °, the sector groove having a diameter larger than the diameter of the wire harness (7).

7. Sensor assembly according to any one of claims 1-4, characterized in that the surface of the PCB (2) is provided with a fool-proof mark (23), which fool-proof mark (23) is arranged offset from the axis of the PCB (2).

8. Sensor assembly according to any one of claims 1 to 4, in which O-rings (6) are provided between the sensor (1) and the sensor base (3) and between the sensor base (3) and the sensor housing (4).

Technical Field

The invention relates to the technical field of sensors, in particular to a sensor assembly.

Background

In prior art, pencil lug weld is on the solder joint of sensor bottom, and the pencil tears the copper sheet of sensor bottom solder joint department easily at product transfer in-process, and then leads to the sensor to scrap, causes the defective rate of sensor assembly production to be high, and then has pulled up sensor assembly's manufacturing cost.

In view of the above, it is an urgent need to solve the problem of improving the production yield of the sensor device by those skilled in the art.

Disclosure of Invention

In view of the above, an object of the present invention is to provide a sensor assembly, which has a simple structure, is easy to produce, has a high production yield, and has a tight package and a high reliability.

In order to achieve the above purpose, the invention provides the following technical scheme:

a sensor assembly comprises a sensor shell and a locking nut in threaded connection with the sensor shell, wherein a base mounting hole for mounting a sensor base and a glue pouring hole communicated with the base mounting hole are formed in the sensor shell, and a glue hanging groove is formed in the outer wall surface of one side, close to the glue pouring hole, of the sensor base;

the sensor base endotheca is equipped with the sensor and splices in the PCB of sensor bottom, PCB is in the solder joint top of sensor is equipped with the bonding wire groove that is used for holding the pencil, the bonding wire groove the pencil all with solder joint welded connection.

Preferably, the sensor base comprises a through sensor mounting hole for mounting the sensor and a PCB positioning block for positioning the PCB, the PCB positioning block is connected to the end face, close to the glue pouring hole, of the sensor base, and the glue hanging groove is formed in the outer wall surface of the PCB positioning block;

the sensor mounting hole is close to the terminal surface in encapsulating hole is equipped with and is used for preventing sensor pivoted spline groove.

Preferably, the end face, close to the glue filling hole, of the sensor base is provided with four PCB positioning blocks, and two adjacent PCB positioning blocks are used for being perpendicular to positioning faces contacted with the PCBs.

Preferably, the PCB positioning blocks are uniformly distributed in the circumferential direction of the sensor base.

Preferably, the center of the PCB is provided with a PCB glue filling hole.

Preferably, the welding wire groove is a sector groove with a circumferential angle larger than 180 degrees, and the diameter of the sector groove is larger than that of the wire harness.

Preferably, the surface of the PCB is provided with a fool-proof mark, and the fool-proof mark deviates from the axis of the PCB.

Preferably, O-shaped sealing rings are arranged between the sensor and the sensor base and between the sensor base and the sensor shell.

When the sensor assembly is produced and assembled, firstly, the PCB is placed at the bottom of the sensor, the wire harness is placed in the welding wire groove of the PCB, soldering tin is filled in the gap between the wire harness and the welding wire groove, and the PCB, the wire harness and the welding spot of the sensor are welded into a whole; adhering and fixing the PCB to the bottom of the sensor, and then installing the sensor and the PCB into a sensor base; the sensor base is arranged in the sensor shell, and glue is poured into a glue pouring hole of the sensor shell so as to glue and fix the sensor base in the base mounting hole; and finally, screwing the locking nut to connect the sensor shell and the locking nut.

The PCB, the wire harness and the welding spot of the sensor are filled and welded into a whole, and the PCB and the sensor are fixedly connected in a glued joint manner, so that the welding area of the wire harness and the sensor is increased, the welding spot is firmer, the copper sheet of the welding spot is not easy to tear off by the wire harness, and the production yield is improved; meanwhile, the welding wire groove of the PCB can limit the shaking of the wire harness in the product transferring process, and further avoids the situation that the wire harness shakes to cause tearing and separation of the copper sheets of the welding points.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of a sensor assembly provided by the present invention;

FIG. 2 is a schematic cross-sectional view of FIG. 1;

FIG. 3 is a schematic structural view of the sensor housing of FIG. 1;

FIG. 4 is a schematic cross-sectional view of FIG. 3;

FIG. 5 is a schematic structural diagram of the sensor base of FIG. 1;

FIG. 6 is a schematic front view of FIG. 1

FIG. 7 is a schematic cross-sectional view of FIG. 5;

FIG. 8 is a schematic view of the assembly of the sensor base, sensor and PCB;

FIG. 9 is a schematic view of the assembly of the sensor, PCB and wiring harness.

In fig. 1-9:

the sensor comprises a sensor 1, a PCB2, a welding line groove 21, a PCB glue filling hole 22, a fool-proof mark 23, a sensor base 3, a sensor mounting hole 31, a spline groove 32, a PCB positioning block 33, a glue hanging groove 34, a sensor shell 4, a base mounting hole 41, a glue filling hole 42, a locking nut 5, an O-shaped sealing ring 6 and a wiring harness 7.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The core of the invention is to provide a sensor assembly which has simple structure, convenient production, high production yield, tight packaging of the sensor and strong reliability.

Please refer to fig. 1-9.

The sensor assembly provided by the invention comprises a sensor shell 4 and a locking nut 5 in threaded connection with the sensor shell 4, wherein a base mounting hole 41 for mounting a sensor base 3 and a glue pouring hole 42 communicated with the base mounting hole 41 are arranged in the sensor shell 4, and a glue hanging groove 34 is arranged on one side, close to the glue pouring hole 42, of the sensor base 3; the sensor base 3 endotheca is equipped with sensor 1 and the PCB2 of gluing in the sensor 1 bottom, and PCB2 is equipped with the solder wire groove 21 that is used for holding pencil 7 above the solder joint of sensor 1, and solder wire groove 21, pencil 7 all with solder joint welded connection.

Referring to fig. 1, the sensor housing 4 is provided with a threaded section that cooperates with the lock nut 5, and the threaded section cooperates with the lock nut 5 to mount the sensor assembly to a designed mounting position of an external device. Preferably, in order to ensure the tight sealing between the sensor housing 4 and the equipment installation surface, the outer wall surface of the sensor housing 4 is provided with a sealing ring installation groove for installing the O-shaped sealing ring 6.

The external structure, shape, size, material and the like of the sensor housing 4 are determined according to the actual production requirements, and are not described in detail herein.

The sensor 1 is a main element of the sensor assembly, and the sensor 1 is arranged in a sensor mounting hole 31 of the sensor base 3; the bottom of the sensor 1 is provided with the PCB2, the PCB2 is used for enhancing the connection strength of the wiring harness 7 and the welding spot at the bottom of the sensor 1, and the wiring harness 7 is restrained from shaking through the wiring groove 21, so that the situation that the wiring harness 7 tears the copper sheet of the welding spot in the process of transferring the product process is avoided.

In order to avoid the movement of the PCB2 relative to the sensor 1, the PCB2 is glued to the bottom of the sensor 1, and the specific size and position of the PCB potting hole 22 for potting and reinforcement on the PCB2 are determined according to the needs of actual production, and will not be described herein again.

Sensor base 3 splices with sensor housing 4, and in order to guarantee the joint strength of the two junction, the outer wall of sensor base 3 is equipped with rubber coating groove 34, and rubber coating groove 34 has increased the area of contact of binder with the outer wall of sensor base 3, and then has improved the joint strength of junction.

The shape of the hanging glue groove 34 is not limited, and the specific shape and size are determined according to the requirements in actual production, and are not described in detail herein.

During production and assembly, referring to fig. 9, firstly, the PCB2 is placed at the bottom of the sensor 1, the wire harness 7 is placed in the solder wire groove 21 of the PCB2, solder is filled in a gap between the wire harness 7 and the solder wire groove 21, and the PCB2, the wire harness 7 and the solder point of the sensor 1 are welded into a whole; the PCB2 is fixed on the bottom of the sensor 1 by gluing, and then the sensor 1 and the PCB2 are arranged in the sensor base 3, as shown in FIG. 8; the sensor base 3 is arranged in the sensor shell 4, and glue is poured into the glue pouring hole 42 of the sensor shell 4 so as to glue and fix the sensor base 3 in the base mounting hole 41; and finally, screwing the locking nut 5 to connect the sensor shell 4 and the locking nut 5.

Preferably, in order to ensure that the sensor 1 is tightly packaged, O-shaped sealing rings 6 are arranged between the sensor 1 and the sensor base 3 and between the sensor base 3 and the sensor shell 4, so that the sealing performance of the sensor assembly is improved, and foreign matters such as external dust and rainwater are effectively prevented from entering the sensor.

In the embodiment, the PCB2, the wire harness 7 and the welding spot of the sensor 1 are filled and welded into a whole, the PCB2 and the sensor 1 are fixedly connected in an adhesive joint mode, the welding area of the wire harness 7 and the sensor 1 is increased, the welding spot is firmer, the copper sheet of the welding spot is not easy to tear off from the wire harness 7, and the production yield is improved; meanwhile, the welding wire groove 21 of the PCB2 can limit the shaking of the wire harness 7 in the product transferring process, and further avoids the situation that the wire harness 7 shakes to cause the tearing and the separation of the copper sheets of the welding points.

Preferably, the PCB2 is provided with a PCB glue hole 22 at the center, and the glue joint between the PCB2 and the sensor 1 is reinforced by the glue filled in the hole.

Preferably, the wire groove 21 is a sector groove having a circumferential angle larger than 180 ° and a diameter larger than that of the wire harness 7, so that a gap between the wire groove 21 and the wire harness 7 is filled with solder.

The specific diameter and the central angle of the fan-shaped groove are determined according to factors such as the size of the sensor 1 and the diameter of the wire harness 7 in actual production, and are not described in detail herein.

On the basis of the above embodiment, the structure of the sensor base 3 is limited, the sensor base 3 includes a through sensor mounting hole 31 for mounting the sensor 1 and a PCB positioning block 33 for positioning the PCB2, the PCB positioning block 33 is connected to the end surface of the sensor base 3 close to the glue filling hole 42, and the glue hanging groove 34 is arranged on the outer wall surface of the PCB positioning block 33; the end face of the sensor mounting hole 31 near the potting hole 42 is provided with a spline groove 32 for preventing the sensor 1 from rotating.

Referring to fig. 5, four corners of the sensor 1 are clamped in the spline grooves 32, so that the rotation of the sensor 1 is effectively limited, and the size of the spline grooves 32 is determined according to the size of the sensor 1; the PCB positioning block 33 is used for positioning the PCB2, and the PCB positioning block 33 should be disposed at a position that does not obstruct the bonding of the PCB2 and the sensor 1.

Preferably, four PCB positioning blocks 33 are disposed on the end surface of the sensor base 3 close to the glue filling hole 42, and the positioning surfaces of two adjacent PCB positioning blocks 33 for contacting with the PCB2 are perpendicular to each other. Referring to fig. 8, the PCB2 is a rectangular plate, and the four PCB positioning blocks 33 are respectively in contact with four sides of the rectangular plate, so as to effectively position the PCB 2.

Of course, the PCB positioning block 33 may be configured as a positioning column, and a semicircular positioning hole matched with the positioning column is disposed at the edge of the PCB 2.

In the embodiment, the spline groove 32 limits the bottom of the sensor 1, so that the sensor 1 is prevented from rotating in the transportation or working process; the PCB positioning block 33 can position the installation position of the PCB2, so that the positioning installation of the PCB2 and the sensor base 3 is facilitated, and the assembly process is simplified.

Preferably, the PCB positioning blocks 33 may be arranged to be evenly distributed in the circumferential direction of the sensor base 3, so as to facilitate the processing and manufacturing of the sensor base 3.

Because the wiring harnesses 7 connected to the welding points of the sensor 1 are different, in order to avoid the corresponding connection error between the wiring harnesses 7 and the welding points, preferably, referring to fig. 9, the surface of the PCB2 is provided with the fool-proof mark 23, and the fool-proof mark is arranged deviating from the axis of the PCB2, so that the partition of each welding line groove 21 on the PCB2 can be rapidly judged through the fool-proof mark 23.

The fool-proof mark 23 may be a fool-proof hole, a fool-proof number, etc., as long as it can help workers to judge and distinguish the wire grooves 21. For example, in fig. 9, the fool-proof mark 23 is disposed at the wire groove No. 1, and the wire groove No. 2, the wire groove No. 3, and the wire groove No. 4 are distributed clockwise with the wire groove No. 1 as the starting point.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The sensor assembly provided by the present invention is described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.