阅读说明：本技术 具有带传感器参考件的光学元件的半导体光刻投射曝光设备和对准传感器参考件的方法 (Semiconductor lithographic projection exposure apparatus having an optical element with a sensor reference and method of aligning a sensor reference ) 是由 P.尼兰德 M.斯特珀 H-M.霍维尔 于 2020-03-02 设计创作，主要内容包括：本发明涉及一种用于在EUV投射曝光设备(1)中将传感器参考件(40)与主体(30)的参考面(31)对准的方法,其中传感器参考件(40)包括参考元件(41、41’)和接收元件(42),其中接收元件(42)布置在主体(30)上或实施为主体(30)的部分,该方法包括以下步骤：-确定参考面(31)在主体(30)的参考坐标系(32)中的取向,-确定参考面(31)的取向与其意图取向的偏差,-将参考元件(41、41’)放置到所述接收元件(42)中,-确定参考元件(41、41’)在主体(30)的参考坐标系(32)中的位置和取向,-考虑到参考元件(41、41’)的先前确定的取向及参考面(31)与其意图取向的偏差,确定参考元件(41、41’)与意图取向的偏差,-将参考元件(41、41’)与所确定的意图取向对准,-将参考元件(41、41’)固定在意图取向上,-检验参考元件(41、41’)在参考坐标系(32)中的意图取向。本发明还涉及一种用于半导体光刻的投射曝光系统(1),包括光学元件(18、19、20),该光学元件(18、19、20)具有主体(30),该主体就其自身包括用于确定光学元件(18、19、20)的位置和取向的传感器参考件(40)的多个参考元件(41、41’)的接收元件(42)。光学元件(18、19、20)还包括设计为光学有效表面的参考面(31),参考元件(41)的取向与参考面(31)的取向对准,并且参考元件(41)以对于参考面(31)的小于100μrad的角度位移布置。(The invention relates to a method for aligning a sensor reference (40) with a reference surface (31) of a body (30) in an EUV projection exposure apparatus (1), wherein the sensor reference (40) comprises a reference element (41, 41') and a receiving element (42), wherein the receiving element (42) is arranged on the body (30) or is embodied as part of the body (30), comprising the following steps: -determining an orientation of a reference plane (31) in a reference coordinate system (32) of the body (30), -determining a deviation of the orientation of the reference plane (31) from its intended orientation, -placing a reference element (41, 41') into the receiving element (42), -determining the position and orientation of the reference element (41, 41') in a reference coordinate system (32) of the body (30), -determining the deviation of the reference element (41, 41') from an intended orientation taking into account a previously determined orientation of the reference element (41, 41') and the deviation of the reference plane (31) from its intended orientation, -aligning the reference element (41, 41') with the determined intended orientation, -fixing the reference element (41, 41') in the intended orientation, -verifying the intended orientation of the reference element (41, 41') in the reference coordinate system (32). The invention further relates to a projection exposure system (1) for semiconductor lithography, comprising an optical element (18, 19, 20), the optical element (18, 19, 20) having a body (30) which itself comprises a receiving element (42) of a plurality of reference elements (41, 41') of a sensor reference (40) for determining the position and orientation of the optical element (18, 19, 20). The optical element (18, 19, 20) further comprises a reference surface (31) designed as an optically active surface, the orientation of the reference element (41) is aligned with the orientation of the reference surface (31), and the reference element (41) is arranged with an angular displacement of less than 100 μ rad to the reference surface (31).)

1. Method for aligning a sensor reference (40) relative to a reference surface (31) of a body (30) in an EUV projection exposure apparatus (1), wherein the sensor reference (40) comprises a reference element (41, 41') and a receiving element (42), wherein the receiving element (42) is fixedly arranged on the body (30) or embodied as part of the body (30), comprising the steps of:

-determining an orientation of the reference surface (31) in a reference coordinate system (32) of the body (30),

-determining a deviation of the orientation of the reference plane (31) from its target orientation (31'),

-inserting the reference element (41, 41') into the receiving element (42),

-determining the position and orientation of the reference element (41, 41') in a reference coordinate system (32) of the body (30),

-determining a deviation of the reference element (41, 41') from its target orientation (31') taking into account a previously determined orientation of the reference element (41, 41') and the deviation of the reference plane (31) from its target orientation (31'),

-aligning the reference element (41, 41') with the determined target orientation,

-fixing the orientation of the reference element (41, 41') with respect to the reference plane (31) in the target orientation,

-checking a target orientation of the reference element (41, 41') in the reference coordinate system (32).

2. The method of claim 1, wherein the first and second light sources are selected from the group consisting of,

it is characterized in that the preparation method is characterized in that,

the orientation of the reference surface (31) in the reference coordinate system (32) is determined by interferometry.

3. The method according to claim 1 or 2,

it is characterized in that the preparation method is characterized in that,

the receiving element (42) comprises a contact surface (47) embodied as a conical seat (47).

4. The method according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

-the reference element (41, 41') comprises a contact surface (46) embodied as a spherical surface (46).

5. The method according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

the reference element (41, 41') is held by a mounting (60) when inserted into the receiving element (42).

6. The method of claim 5, wherein the first and second light sources are selected from the group consisting of,

it is characterized in that the preparation method is characterized in that,

the mount (60) has at least one actuator (61, 61') for tilting the mount (60) relative to the receiving element (42).

7. The method according to claim 5 or 6,

it is characterized in that the preparation method is characterized in that,

the weight of the reference element (41, 41') is at least partially compensated by the mounting (60).

8. The method according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

-determining the orientation of the reference element (41, 41') by the orientation of a surface (44) of the reference element (41, 41').

9. The method of any one of claims 1 to 7,

it is characterized in that the preparation method is characterized in that,

the orientation of the reference element (41, 41') is determined by the orientation of the auxiliary surface (78).

10. The method according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

the orientation of the reference element (41, 41') relative to the reference coordinate system (32) is determined by a coordinate measuring machine (80).

11. The method of any one of claims 1 to 9,

it is characterized in that the preparation method is characterized in that,

the orientation of the reference element (41, 41') relative to the reference coordinate system (32) is determined by an optical measurement system (85, 85').

12. The method according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

during the alignment of the reference elements (41, 41'), the orientation of the reference elements (41, 41') is determined in situ.

13. The method according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

during the alignment of the reference element (41, 41'), the orientation of the reference element (41, 41') is determined by an optical measuring device (70).

14. The method of claim 13, wherein the first and second light sources are selected from the group consisting of,

it is characterized in that the preparation method is characterized in that,

the optical measurement device (70) is an autocollimator telescope (70).

15. The method according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

fixing the target orientation of the reference element (41, 41') by adhesive bonding to the receiving element (42).

16. The method according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

the target orientation of the reference element (41, 41') is checked by a coordinate measuring machine (80).

17. The method according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

the target orientation of the reference element (41, 41') is checked by an optical measuring system (85, 85').

18. The method according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

the alignment of the reference element (41, 41') with the target orientation is achieved by a change in the geometry of the reference element (40, 41) or the receiving element.

19. The method according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

the alignment of the reference element (41, 41') with the target orientation is achieved by an adaptation of the thickness of the adhesive gap (92, 92').

20. A projection exposure apparatus (1) for semiconductor lithography, the projection exposure apparatus (1) comprising:

-an optical element (18, 19, 20) comprising:

a body (30) comprising a receiving element (42) of a plurality of reference elements (41, 41') of a sensor reference (40) for determining the position and orientation of the optical element (18, 19, 20),

-a reference surface (31) embodied as an optically effective surface, the orientation of the reference element (41) being aligned with respect to the orientation of the reference surface (31),

it is characterized in that the preparation method is characterized in that,

the reference elements (41) are arranged with an angular deviation of less than 100 μ rad relative to the reference plane (31).

21. The projection exposure apparatus (1) according to claim 20,

it is characterized in that the preparation method is characterized in that,

the reference element (42) comprises a contact surface (47) embodied as a conical seat (47).

22. The projection exposure apparatus (1) according to claim 20 or 21,

it is characterized in that the preparation method is characterized in that,

the reference element (41) comprises a contact surface (46) embodied as a spherical surface (46).

23. The projection exposure apparatus (1) according to one of claims 20 to 22,

it is characterized in that the preparation method is characterized in that,

the reference element (41) is fixed in the receiving element (42) by means of an adhesive (53).

24. The projection exposure apparatus (1) according to claim 23,

it is characterized in that the preparation method is characterized in that,

the adhesive (53) at least partially touches a line of contact (45) between the contact surfaces (46, 47).

25. The projection exposure apparatus (1) according to one of claims 22 to 24,

it is characterized in that the preparation method is characterized in that,

the contact surfaces (46, 47) of the reference element (41) and/or the receiving element (42) are at least partially coated to reduce friction.

26. The projection exposure apparatus (1) according to one of claims 22 to 25,

it is characterized in that the preparation method is characterized in that,

the receiving element (42) is configured to generate, in a space (51) delimited by a cut-out (50) in the receiving element (42) and a spherical surface (46) of the reference element (41), an additional pressure for reducing friction at the contact surfaces (46, 47) or a reduced pressure for testing the fixation of the reference element (41).

27. The projection exposure apparatus (1) according to one of claims 22 to 26,

it is characterized in that the preparation method is characterized in that,

the at least one reference element (41) comprises a viewing window (52).