阅读说明：本技术 具有激光阵列照明的系统和装置 (System and apparatus with laser array illumination ) 是由 程思洋 王培金 于 2016-09-12 设计创作，主要内容包括：一种系统包含：热沉模块,热沉模块具有链接其顶部表面和底部表面的多个第一通孔以及底部表面上的多个凹槽,其中每一凹槽通过相应序列的第一通孔；以及驱动电路模块,其具有多个导电引脚连接器和基本上垂直于所述热沉模块的顶部表面和底部表面设置的电驱动表面,其中每一导电引脚连接器部分地位于热沉模块的底部表面中的相应凹槽内,导电引脚连接器包含各自链接相应序列的第一通孔中的第一通孔中的至少两者的内部引脚连接器,以及各自将相应序列的第一通孔中的第一通孔中的至少一者链接到驱动电路模块的电驱动表面的外部引脚连接器。(A system comprising: a heat sink module having a plurality of first vias linking a top surface and a bottom surface thereof and a plurality of grooves on the bottom surface, wherein each groove passes through a respective sequence of first vias; and a drive circuit module having a plurality of electrically conductive pin connectors and an electrically driven surface disposed substantially perpendicular to the top and bottom surfaces of the heat sink module, wherein each electrically conductive pin connector is partially located within a respective recess in the bottom surface of the heat sink module, the electrically conductive pin connectors including internal pin connectors each linking at least two of the first vias of the respective sequence of first vias, and external pin connectors each linking at least one of the first vias of the respective sequence of first vias to the electrically driven surface of the drive circuit module.)

1. A method of assembling a diode pumped solid state laser module, the method comprising:

obtaining a heat sink module, wherein the heat sink module comprises a first surface, a second surface opposite the first surface, and at least a first via linking the first surface and the second surface;

bonding the second surface of the heat sink module to a cooling surface, wherein the cooling surface and the first via form a first cavity having a top opening in the first surface of the heat sink module and a bottom seal in the cooling surface;

bonding at least a first component of the diode pumped solid state laser module to the first surface of the heat sink module such that the first component is in thermal contact with the first surface of the heat sink module;

after bonding the second surface of the heat sink module to the cooling surface to form the first cavity, partially filling a thermally conductive medium into the first cavity such that the thermally conductive medium is in thermal contact with the cooling surface in the first cavity;

inserting a second component of the diode pumped solid state laser module into the first cavity, wherein the second component includes an upper portion and a lower portion supporting the upper portion, and wherein after the inserting, the lower portion of the second component deforms the thermally conductive medium inside the first cavity and thermal contact is achieved with the cooling surface through the deformed thermally conductive medium; and

attaching the second component to the heat sink module.

2. The method of claim 1, wherein at least a portion of the upper portion and the lower portion of the second component remains outside of the first cavity after the inserting, and attaching the second component to the heat sink module includes attaching the lower portion of the second component to the first surface of the heat sink module.

3. The method of any of claims 1-2, wherein the second part of the diode pumped solid state laser module includes a laser chip and an onboard heat sink supporting the laser chip and in thermal contact with the laser chip, and wherein the first part of the diode pumped solid state laser module includes a first laser crystal and a first laser crystal mount supporting and in thermal contact with the first laser crystal.

4. The method of any of claims 1-2, wherein the first part of the diode pumped solid state laser module includes a laser chip and an onboard heat sink supporting the laser chip and in thermal contact with the laser chip, and wherein the second part of the diode pumped solid state laser module includes a first laser crystal and a first laser crystal mount supporting and in thermal contact with the first laser crystal.

5. The method of claim 4, wherein the first laser crystal mount comprises a top surface, a bottom surface, and a body between the top and bottom surfaces of the first laser crystal mount, the first laser crystal mount further comprising a recess in the top surface of the first laser crystal mount that extends completely through the top surface of the first laser crystal mount in a first direction, and wherein the first laser crystal is disposed within the recess of the first laser crystal mount and in thermal contact with two or more interior surfaces of the recess.

6. The method of claim 5, wherein the first cavity is a cylindrical through-hole and the first laser crystal mount is a cylindrical body having a linear recess extending through a top surface of the cylindrical body.

7. The method of any one of claims 1-6, further comprising:

adjusting a vertical position of insertion of the second component into the first cavity while the lower portion of the second component remains in thermal contact with the cooling surface through the deformed thermally conductive medium according to a first optical alignment requirement of the first component relative to the second component of the diode pumped solid state laser module, wherein the adjusting is performed prior to attaching the second component to the heat sink module.

8. The method of any of claims 1-7, wherein the lower portion of the second component is attached around the top opening of the first cavity.

9. The method of claim 8, wherein attaching the second component to the heat sink module includes gluing the lower portion of the second component to the first surface of the heat sink module around the top opening of the first cavity in the first surface of the heat sink module.

10. The method of any one of claims 1-9, further comprising:

adjusting a lateral position of the second component inserted into the first cavity while the lower portion of the second component remains in thermal contact with the cooling surface through the deformed thermally conductive medium according to a second optical alignment requirement of the first component relative to the second component of the diode pumped solid state laser module, wherein the adjusting is performed prior to attaching the second component to the heat sink module.

11. The method of any one of claims 1-10, further comprising:

adjusting an angle of insertion of the second component into the first cavity while the lower portion of the second component remains in thermal contact with the cooling surface through the deformed thermally conductive medium according to a third optical alignment requirement of the first component relative to the second component of the diode pumped solid state laser module, wherein the adjusting is performed prior to attaching the second component to the heat sink module.

12. The method of any of claims 1-11, wherein the first component of the diode pumped solid state laser module includes a laser diode module, wherein the laser diode module includes an onboard heat sink and a laser chip, wherein the onboard heat sink includes a first side attached to the laser chip and a second side opposite the first side, and wherein bonding the first component of the diode pumped solid state laser module to the first surface of the heat sink module further includes:

bonding the second side of the on-board heat sink to the first surface of the heat sink module.

13. The method of any of claims 1-12, wherein the heat sink module further includes a second through via linking the first surface and the second surface, wherein the cooling surface and the second through via form a second cavity having a top opening in the first surface of the heat sink module and a bottom seal in the cooling surface, and wherein the method further includes:

after bonding the second surface of the heat sink module to the cooling surface to form the second cavity, partially filling the heat conducting medium into the second cavity such that the heat conducting medium is in thermal contact with the cooling surface in the second cavity;

inserting a third component of the diode pumped solid state laser module into the second cavity, wherein the third component includes an upper portion and a lower portion supporting the upper portion, and wherein after the inserting, the lower portion of the third component deforms the thermally conductive medium inside the second cavity and thermal contact is made with the cooling surface through the deformed thermally conductive medium; and

attaching the third component to the heat sink module.

14. The method of claim 13, wherein the second component is a laser crystal module comprising a laser crystal and a corresponding crystal mount supporting the laser crystal, and the third component is a nonlinear crystal and a corresponding crystal mount supporting the nonlinear crystal.

15. A diode pumped solid state laser module comprising:

a heat sink module, wherein the heat sink module comprises a first surface, a second surface opposite the first surface, and at least a first via linking the first surface and the second surface;

a cooling module including a cooling surface and a thermoelectric cooling system and a heat spreader, wherein the second surface of the heat sink module is bonded to the cooling surface of the cooling module, and wherein the cooling surface of the cooling module and the first through hole in the heat sink module form a first cavity having a top opening in the first surface of the heat sink module and a bottom seal in the cooling surface of the cooling module;

a heat conducting medium partially filled within the first cavity formed by the cooling surface of the cooling module and the first through-hole in the heat sink module;

a first section of the diode pumped solid state laser module, wherein the first section of the diode pumped solid state laser is bonded to the first surface of the heat sink module such that the first section is in thermal contact with the first surface of the heat sink module; and

a second component of the diode pumped solid state laser module, wherein the second component of the diode pumped solid state laser module is partially inserted into the first cavity formed by the cooling surface of the cooling module and the first via in the heat sink module, wherein the second component includes an upper portion and a lower portion supporting the upper portion, wherein the lower portion of the second component deforms the thermally conductive medium within the first cavity and achieves thermal contact with the cooling surface through the deformed thermally conductive medium, and wherein the second component is attached to the heat sink module.

16. The diode pumped solid state laser module of claim 15, wherein at least a portion of the upper and lower portions of the second component remain outside the first cavity and the lower portion of the second component is attached to the first surface of the heat sink module.

17. The diode pumped solid state laser module of any of claim 15, wherein the second part of the diode pumped solid state laser module includes a laser chip and an onboard heat sink supporting the laser chip and in thermal contact with the laser chip, and wherein the first part of the diode pumped solid state laser module includes a first laser crystal and a first laser crystal mount supporting the first laser crystal and in thermal contact with the first laser crystal.

18. The diode pumped solid state laser module of any of claim 15, wherein the first part of the diode pumped solid state laser module includes a laser chip and an onboard heat sink supporting the laser chip and in thermal contact with the laser chip, and wherein the second part of the diode pumped solid state laser module includes a first laser crystal and a first laser crystal mount supporting and in thermal contact with the first laser crystal.

19. The diode pumped solid state laser module of claim 18, wherein the first laser crystal mount comprises a top surface, a bottom surface, and a body between the top and bottom surfaces of the first laser crystal mount, the first laser crystal mount further comprising a recess in the top surface of the first laser crystal mount, the recess extending completely through the top surface of the first laser crystal mount in a first direction, and wherein the first laser crystal is disposed within the recess of the first laser crystal mount and in thermal contact with two or more interior surfaces of the recess.

20. The diode pumped solid state laser module of claim 19, wherein the first cavity is a cylindrical through hole and the first laser crystal mount is a cylindrical body having a linear recess extending through a top surface of the cylindrical body.

21. The diode pumped solid state laser module of any of claims 15 to 20, wherein a vertical position of the second component inserted into the first cavity is adjusted according to first optical alignment requirements of the first component relative to the second component of the diode pumped solid state laser module.

22. A diode pumped solid state laser module as claimed in any of claims 15 to 21, wherein the lower portion of the second component is attached around the top opening of the first cavity.

23. The diode pumped solid state laser module of claim 22, wherein the lower portion of the second component is glued to the first surface of the heat sink module around the top opening of the first cavity in the first surface of the heat sink module.

24. The diode pumped solid state laser module of any of claims 15 to 23, wherein a lateral position of the second component inserted into the first cavity is adjusted according to second optical alignment requirements of the first component relative to the second component of the diode pumped solid state laser module.

25. The diode pumped solid state laser module of any of claims 15 to 24, wherein an angle at which the second component is inserted into the first cavity is adjusted according to a second optical alignment requirement of the first component relative to the second component of the diode pumped solid state laser module.

26. A diode pumped solid state laser module as claimed in any of claims 15 to 25, wherein the first part of the diode pumped solid state laser module comprises a laser diode module, wherein the laser diode module comprises an on-board heat sink and a laser chip, wherein the on-board heat sink comprises a first side attached to the laser chip and a second side opposite the first side, and the second side of the on-board heat sink is bonded to the first surface of the heat sink module.

27. The diode pumped solid state laser module of any of claims 15 to 26, wherein the heat sink module further comprises a second via linking the first surface and the second surface, wherein the cooling surface and the second via form a second cavity having a top opening in the first surface of the heat sink module and a bottom seal in the cooling surface, and wherein the thermally conductive medium partially fills the second cavity such that the thermally conductive medium is in thermal contact with the cooling surface in the second cavity, wherein the diode pumped solid state laser module further comprises a third component, wherein the third component of the diode pumped solid state laser module is partially inserted into the second cavity formed by the cooling surface of the cooling module and the second via in the heat sink module, wherein the third member includes an upper portion and a lower portion supporting the upper portion, wherein the lower portion of the third member deforms the thermally conductive medium within the second cavity and thermal contact is achieved with the cooling surface through the deformed thermally conductive medium, and wherein the third member is attached to the heat sink module.

28. The diode pumped solid state laser module of claim 27, wherein the second component is a laser crystal module comprising a laser crystal and a respective crystal mount supporting the laser crystal, and the third component is a nonlinear crystal and a respective crystal mount supporting the nonlinear crystal.

Technical Field

The present invention relates to illumination systems, and in particular to illumination systems comprising laser arrays as light sources.

Background

Systems and devices with laser array illumination are widely used in, for example, image projection, lighting, advertising displays, and the like, both in large-scale public viewing locations and in medium or small indoor locations.

When constructing systems and devices with laser array illumination, special care needs to be taken to ensure optical alignment, adequate illumination power, and proper device cooling during normal operation. In addition, electronic drive circuit control of individual laser components is also required. Meeting these design requirements becomes particularly challenging when relatively low cost and compact systems are desired.

In general, many systems and devices that use laser array illumination employ a laser array of semiconductor diode lasers or Diode Pumped Solid State Lasers (DPSSL) as their light sources. Semiconductor diode lasers are typically in the form of TO-CAN packages and are arranged in a grid pattern within a supporting base structure containing integrated drive and cooling layers. The diode pumped solid state lasers may be packaged in separate packages with separate cooling and driving systems and then mounted on a common support structure according to a desired grid pattern. The two types of lasers have different characteristics and advantages and require separate designs to better utilize them in systems and devices for laser array illumination.

Disclosure of Invention

A method of assembling a diode pumped solid state laser module comprising: obtaining a heat sink module, wherein the heat sink module comprises a first surface, a second surface opposite the first surface, and at least a first via linking the first surface and the second surface; bonding the second surface of the heat sink module to a cooling surface, wherein the cooling surface and the first via form a first cavity having a top opening in the first surface of the heat sink module and a bottom seal in the cooling surface; bonding at least a first component of the diode pumped solid state laser module to the first surface of the heat sink module such that the first component is in thermal contact with the first surface of the heat sink module; after bonding the second surface of the heat sink module to the cooling surface to form the first cavity, partially filling a thermally conductive medium into the first cavity such that the thermally conductive medium is in thermal contact with the cooling surface in the first cavity; inserting a second component of the diode pumped solid state laser module into the first cavity, wherein the second component includes an upper portion and a lower portion supporting the upper portion, and wherein after the inserting, the lower portion of the second component deforms the thermally conductive medium inside the first cavity and thermal contact is achieved with the cooling surface through the deformed thermally conductive medium; and attaching the second component to the heat sink module.

A diode pumped solid state laser module comprising: a heat sink module, wherein the heat sink module comprises a first surface, a second surface opposite the first surface, and at least a first via linking the first surface and the second surface; a cooling module including a cooling surface and a thermoelectric cooling system and a heat spreader, wherein the second surface of the heat sink module is bonded to the cooling surface of the cooling module, and wherein the cooling surface of the cooling module and the first through hole in the heat sink module form a first cavity having a top opening in the first surface of the heat sink module and a bottom seal in the cooling surface of the cooling module; a thermally conductive medium partially filled within the first cavity formed by the cooling surface of the cooling module and the first via in the heat sink module; a first section of the diode pumped solid state laser module, wherein the first section of the diode pumped solid state laser is bonded to the first surface of the heat sink module such that the first section is in thermal contact with the first surface of the heat sink module; and a second component of the diode pumped solid state laser module, wherein the second component of the diode pumped solid state laser module is partially inserted into the first cavity formed by the cooling surface of the cooling module and the first through hole in the heat sink module, wherein the second component includes an upper portion and a lower portion supporting the upper portion, wherein the lower portion of the second component deforms the thermally conductive medium within the first cavity and achieves thermal contact with the cooling surface through the deformed thermally conductive medium, and wherein the second component is attached to the heat sink module.

A system (e.g., a laser diode array module or a component thereof) includes: a heat sink module, wherein: the heat sink module includes a respective top surface, a respective bottom surface opposite the respective top surface of the heat sink module, and a plurality of first stepped vias linking the respective top and bottom surfaces of the heat sink module, each first stepped via having a respective cylindrical upper portion and a respective cylindrical lower portion that is narrower than the respective cylindrical upper portion of each first stepped via, the respective cylindrical upper portion and the respective cylindrical lower portion of each first stepped through-hole are joined by a respective first annular surface, and the respective bottom surface of the heat sink module includes a plurality of grooves, wherein each recess passes through the respective lower portion of a respective sequence of first stepped vias among the plurality of first stepped vias in the heat sink module; and a driving circuit module, wherein: the driver circuit module includes a plurality of electrically conductive pin connectors, and one or more electrically driven surfaces disposed substantially perpendicular to the respective top and bottom surfaces of the heat sink module, each electrically conductive pin connector at least partially within a respective one of the plurality of recesses in the respective bottom surface of the heat sink module, the plurality of electrically conductive pin connectors including a set of internal pin connectors and a set of external pin connectors, each of the set of internal pin connectors linking at least two of the first stepped-through holes in the respective sequence of first stepped-through holes traversed by the respective one of the plurality of recesses in the respective bottom surface of the heat sink module, and each of the set of external pin connectors linking a first one of the respective sequence of first stepped-through holes traversed by the respective one of the plurality of recesses in the respective bottom surface of the heat sink module At least one of the first stepped vias in the stepped via is linked to at least one of the one or more electrical driving surfaces of the drive circuit module disposed substantially perpendicular to the respective top and bottom surfaces of the heat sink module.

A system (e.g., a dual sided laser diode array module or component thereof) includes: a cooling module having a first side and a second side opposite the first side, and a cooling mechanism disposed between the first side and the second side of the cooling module; a first heat sink module having a respective top surface, a respective bottom surface opposite the respective top surface of the first heat sink module, and a respective plurality of first vias connecting the respective top and bottom surfaces of the first heat sink module, wherein the respective bottom surface of the heat sink module is disposed proximate the first side of the cooling module; a first plurality of laser diodes, wherein each of the first plurality of laser diodes includes a respective diode body, a respective set of conductive pins, and a respective support plate between the respective diode body and the respective set of conductive pins, wherein each of the first plurality of laser diodes is at least partially disposed within a respective one of the respective plurality of first vias in the first heat sink module, wherein the respective diode body is disposed against the respective top surface of the first heat sink module and the respective set of conductive pins is disposed against the bottom surface of the first heat sink module; a first drive circuit module including a respective plurality of electrically conductive pin connectors and respective one or more electrical drive surfaces, wherein the respective one or more electrical drive surfaces of the first drive circuit module are disposed substantially perpendicular to the respective top and bottom surfaces of the first heat sink module, and wherein the respective plurality of electrically conductive pin connectors of the first drive circuit module connect the respective set of electrically conductive pins of the first plurality of laser diodes to the respective one or more electrical drive surfaces of the first drive circuit module; a second heat sink module having a respective top surface, a respective bottom surface opposite the respective top surface of the second heat sink module, and a respective plurality of second vias linking the respective top and bottom surfaces of the second heat sink module, wherein the respective bottom surface of the heat sink module is disposed proximate the second side of the cooling module; a second plurality of laser diodes, wherein each of the second plurality of laser diodes includes a respective diode body, a respective set of electrically conductive pins, and a respective support plate between the respective diode body and the respective set of electrically conductive pins, wherein each of the second plurality of laser diodes is at least partially disposed within a respective one of the respective plurality of second vias in the second heat sink module, wherein the respective diode body is disposed proximate to the respective top surface of the second heat sink module and the respective set of electrically conductive pins is disposed proximate to the bottom surface of the second heat sink module; and a second drive circuit module including a respective plurality of electrically conductive pin connectors and respective one or more electrical drive surfaces, wherein the respective one or more electrical drive surfaces of the second drive circuit module are disposed substantially perpendicular to the respective top and bottom surfaces of the second heat sink module, and wherein the respective plurality of electrically conductive pin connectors of the second drive circuit module connect the respective set of electrically conductive pins of the second plurality of laser diodes to the respective one or more electrical drive surfaces of the second drive circuit module.

A system comprising: a heat sink module having a respective top surface, a respective bottom surface opposite the respective top surface of the heat sink module, a first plurality of first vias linking the respective top and bottom surfaces of the heat sink module, a second plurality of second vias linking the respective top and bottom surfaces of the heat sink module, wherein the first plurality of first vias are arranged according to a first grid pattern and the second plurality of second vias are arranged according to a second grid pattern, and wherein the first grid pattern and the second grid pattern are offset from each other; a first plurality of laser diodes, wherein each of the first plurality of laser diodes includes a respective diode body, a respective set of conductive pins, and a respective support plate between the respective diode body and the respective set of conductive pins, wherein each of the first plurality of laser diodes is at least partially disposed within a respective one of the first plurality of first vias in the heat sink module, wherein the respective diode body is disposed proximate to the respective top surface of the heat sink module and the respective set of conductive pins is disposed proximate to the respective bottom surface of the heat sink module; a second plurality of laser diodes, wherein each of the second plurality of laser diodes includes a respective diode body, a respective set of conductive pins, and a respective support plate between the respective diode body and the respective set of conductive pins, wherein each of the second plurality of laser diodes is at least partially disposed within a respective one of the second plurality of second vias in the heat sink module, wherein the respective diode body is disposed proximate to the respective bottom surface of the heat sink module and the respective set of conductive pins is disposed proximate to the respective top surface of the heat sink module; and a drive circuit module including a respective plurality of electrically conductive pin connectors and a respective one or more electrically driven surfaces, wherein the respective one or more electrical drive surfaces of the drive circuit module are disposed substantially perpendicular to the respective top and bottom surfaces of the heat sink module, wherein a first subset of conductive pin connectors among the respective plurality of conductive pin connectors of the drive circuit module connect the respective set of conductive pins of the first plurality of laser diodes to the respective one or more electrical drive surfaces of the first drive circuit module, and wherein a second subset of conductive pin connectors among the respective plurality of conductive pin connectors of the drive circuit module connect the respective set of conductive pins of the second plurality of laser diodes to the respective one or more electrical drive surfaces of the drive circuit module.

A system comprising: a heat sink module, wherein: the heat sink module includes a respective top surface, a respective bottom surface opposite the respective top surface of the heat sink module, and a plurality of first vias linking the respective top surface and the respective bottom surface of the heat sink module, and the respective bottom surface of the heat sink module includes a plurality of grooves, wherein each groove passes through a respective lower portion of a respective sequence of first vias among the plurality of first vias in the heat sink module; and a driving circuit module, wherein: the driver circuit module includes a plurality of electrically conductive pin connectors, and one or more electrically driven surfaces disposed substantially perpendicular to the respective top and bottom surfaces of the heat sink module, each electrically conductive pin connector at least partially within a respective one of the plurality of recesses in the respective bottom surface of the heat sink module, the plurality of electrically conductive pin connectors including a set of internal pin connectors and a set of external pin connectors, each of the set of internal pin connectors linking at least two of the first vias of the respective sequence of first vias traversed by the respective one of the plurality of recesses in the respective bottom surface of the heat sink module, and each of the set of external pin connectors linking the second via of the respective sequence of first vias traversed by the respective one of the plurality of recesses in the respective bottom surface of the heat sink module At least one of a via is linked to at least one of the one or more electrical drive surfaces of the drive circuit module disposed substantially perpendicular to the respective top and bottom surfaces of the heat sink module.

Other embodiments and advantages will be apparent to those skilled in the art from the description and drawings in this specification.

Drawings

Fig. 1A is a side view schematic diagram of an exemplary conventional diode pumped solid state laser module.

Fig. 1B is a side view schematic diagram of an exemplary diode pumped solid state laser module, according to some embodiments.

Fig. 1C shows an exemplary heat sink module, according to some embodiments.

Fig. 1D shows three exemplary laser crystal components according to some embodiments.

Fig. 1E is a side view schematic of a diode pumped solid state laser module according to some embodiments.

Fig. 1F is a flow diagram of an exemplary method 60 for assembling a diode pumped solid state laser module (e.g., the diode pumped solid state lasers 20 and 30 in fig. 1B and 1E), in accordance with some embodiments.

Fig. 2A shows a schematic diagram of an exemplary laser diode.

Fig. 2B shows top and bottom views of an exemplary laser array module, according to some embodiments.

Fig. 2C shows an exploded view of the exemplary laser array module of fig. 2B.

Fig. 2D shows a lens array base layer in the exemplary laser array module shown in fig. 2B and 2C, in accordance with some embodiments.

Fig. 2E shows top and bottom views of a heat sink module in the exemplary laser array module shown in fig. 2B and 2C, in accordance with some embodiments.

Fig. 2F shows a schematic diagram of an L-shaped conductive pin connector and a U-shaped conductive pin connector used in the exemplary laser array module shown in fig. 2B and 2C according to some embodiments.

Fig. 2G shows top and bottom views of an exemplary laser diode array in the exemplary laser array module shown in fig. 2B and 2C, according to some embodiments.

Fig. 2H illustrates bottom and side views of the connections between the laser diodes and the conductive pin connectors in the exemplary laser array module shown in fig. 2B and 2C, in accordance with some embodiments.

Fig. 2I illustrates top and bottom views of another exemplary laser diode array in the exemplary laser array module shown in fig. 2B and 2C, in accordance with some embodiments.

Fig. 2J shows an exemplary arrangement of conductive pin connectors based on the arrangement of laser diodes in fig. 2I, in accordance with some embodiments.

Fig. 2K shows an exemplary groove pattern in the bottom surface of the heatsink module based on the arrangement of conductive pin connectors shown in fig. 2J, in accordance with some embodiments.

Fig. 2L shows top and bottom views of another exemplary laser array module, according to some embodiments.

Fig. 2M shows an exploded view of the exemplary laser array module in fig. 2L.

Fig. 2N shows a heat sink module in the exemplary laser array module shown in fig. 2L and 2M in accordance with some embodiments.

Fig. 2O shows top and bottom views of another heatsink module, in accordance with some embodiments.

Fig. 2P shows top and bottom views of another heatsink module, in accordance with some embodiments.

Fig. 2Q shows top and bottom views of another exemplary laser array module, according to some embodiments.

Fig. 2R shows an exemplary two-sided laser array module according to some embodiments.

Fig. 2S shows top and bottom views of another heat sink module, in accordance with some embodiments.

Fig. 2T shows another exemplary two-sided laser array module, according to some embodiments.

Fig. 2U shows a cross-sectional view of the exemplary dual sided laser array module shown in fig. 2T.

Fig. 2V shows another exemplary two-sided laser array module, according to some embodiments.

Fig. 2W shows a cross-sectional view of the exemplary two-sided laser array module shown in fig. 2V.

Fig. 2X shows the structure of an exemplary lens array module having lenses supported by two adjacent substrate layers, according to some embodiments.

Fig. 2Y shows the structure of an exemplary lens array module with integrated lens domes on a base layer, according to some embodiments.

Fig. 2Z shows top and bottom views of another exemplary heat sink module, in accordance with some embodiments.

Fig. 2AA through 2AB show components of the exemplary heat sink module shown in fig. 2Z in accordance with some embodiments.

Fig. 2a illustrates top and bottom views of another exemplary heat sink module, according to some embodiments.

Fig. 2AD shows top and bottom views of another exemplary heat sink module, in accordance with some embodiments.

Fig. 2AE through 2AG show components and internal structures of the exemplary heat-sink module shown in fig. 2AD, in accordance with some embodiments.

Fig. 2 AH-2 AI show exploded views of two exemplary laser array modules of variations of the laser array module shown in fig. 2C, in accordance with some embodiments.

Fig. 2 AJ-2 AK show varying exemplary lens array substrate layers of the lens array substrate layer shown in fig. 2D, according to some embodiments.

Fig. 2AL illustrates a modified exemplary heat sink module of the exemplary heat sink module shown in fig. 2E, in accordance with some embodiments.

Fig. 2 AM-2 AS show exemplary laser array modules of variations of the laser array module shown in fig. 2H- (2) according to some embodiments.

Fig. 2 AT-2 AU show exploded views of two exemplary laser array modules of variations of the laser array module shown in fig. 2M, according to some embodiments.

Fig. 2AV shows an exemplary integrated heatsink/cooling module that is a variation of the integrated heatsink/cooling module shown in fig. 2N, in accordance with some embodiments.

Fig. 2AW shows an exemplary integrated heat sink/cooling module that is a variation of the integrated heat sink/cooling module shown in fig. 2O, in accordance with some embodiments.

Fig. 2AX shows an exemplary integrated heat sink/cooling module that is a variation of the integrated heat sink/cooling module shown in fig. 2P, in accordance with some embodiments.

Fig. 2AY shows a modified exemplary lens array module of the lens array module shown in fig. 2X according to some embodiments.

Fig. 2AZ shows a modified exemplary heatsink/cooling module of the integrated heatsink/cooling module shown in fig. 2Z, in accordance with some embodiments.

Fig. 2BA shows an exemplary integrated heatsink/cooling module that is a variation of the integrated heatsink/cooling module shown in fig. 2AA in accordance with some embodiments.

Fig. 2BB shows an exemplary integrated heat sink/cooling module that is a variation of the integrated heat sink/cooling module shown in fig. 2AC, in accordance with some embodiments.

Fig. 2BC shows an exemplary integrated heat sink/cooling module that is a variation of the integrated heat sink/cooling module shown in fig. 2AD, in accordance with some embodiments.

Fig. 2BD shows an exemplary heat sink element of a variation of the heat sink element shown in fig. 2AF- (2) in accordance with some embodiments.

Fig. 2BE shows an exemplary integrated heatsink/cooling module of the integrated heatsink/cooling module shown in fig. 2AG, in accordance with some embodiments.

Like reference numerals refer to corresponding parts throughout the drawings.

Detailed Description

As described in the background section, diode pumped solid state lasers, in addition to diode lasers, may also be used in laser illumination, laser imaging, and laser display applications. Typically, diode pumped solid state lasers have a much higher power output than semiconductor diode lasers. For example, the output of a typical diode pumped solid state laser may be several times to several tens of times that of a typical semiconductor diode laser. The higher output of diode pumped solid state lasers can sometimes result in a reduction in the number of lasers required in the device, as well as potentially smaller device footprints and simpler drive controls. In addition, diode pumped solid state lasers also enjoy higher electro-optic conversion efficiency between different types of solid state lasers.

In general, a diode pumped solid state laser includes a diode laser chip, and one or more laser crystals (e.g., including one or more laser crystals, and/or one or more nonlinear frequency conversion crystals). Common examples of laser crystals (also referred to as laser media) include neodymium-doped yttrium aluminum garnet (Nd: YAG), neodymium-doped yttrium vanadate (Nd: YVO4), neodymium-doped gadolinium vanadate (Nd: GdVO4), and the like. Common examples of nonlinear frequency conversion crystals include lithium triborate (LBO), potassium titanyl phosphate (KTP), magnesium oxide-doped periodically poled lithium niobate (MgO: PPLN), Periodically Poled Lithium Tantalate (PPLT), and Periodically Poled Stoichiometric Lithium Tantalate (PPSLT).

Fig. 1A is a side view schematic of an exemplary conventional diode pumped solid state laser 10. The diode pumped solid state laser 10 contains a resonant cavity. Typically, the output wavelength of the diode pumped solid state laser 10 may be 671nm, 532nm, 456nm, etc. As shown in fig. 1A, a diode pumped solid state laser 10 includes a diode laser chip 8, a converging lens 9, a laser crystal 11, a nonlinear frequency conversion crystal 12, an output mirror 14, and various support structures for the above components. For example, the diode laser chips 8 are attached to an onboard heat sink 26, forming respective laser components. The heat generated during operation of the diode laser chip 8 is transferred to the on-board heat sink 26. In some embodiments, the converging lens 9 is attached to the lens holder 27, thereby forming a respective laser component. The laser crystal 11 is attached to the crystal mount 28, thereby forming a respective laser component (e.g., laser crystal module). The heat conducting medium 34 is filled between the laser crystal 11 and the crystal mount 28 to improve the thermal contact between the laser crystal 11 and the crystal mount 28. Heat generated during operation of laser crystal 11 is transferred to crystal mount 28 through thermally conductive medium 34. The nonlinear frequency conversion crystal 12 is attached to the crystal mount 29, thereby forming a corresponding laser component. A heat conducting medium 34 is filled between the non-linear frequency conversion crystal 12 and the crystal mount 29 to improve the thermal contact between the non-linear frequency conversion crystal 12 and the crystal mount 29. Heat generated during operation of the non-linear frequency conversion crystal 12 is transferred to the crystal mount 29 through the heat transfer medium 34. The output mirror 14 for the resonant cavity of the laser 10 is attached to the mirror mount 30, thereby forming a respective laser component. Other laser components are possible with a respective upper portion attached to a respective lower portion, wherein the upper portion generates heat during operation and the heat is transferred to the respective lower portion.

In the conventional diode pumped solid state laser 10, the on-board heat sink 26, the lens mount 27, the crystal mount 28, the crystal mount 29, and the mirror mount 30 are attached to a common laser heat sink module 31 (e.g., to a top surface of the laser heat sink module 31), with the thermal conductive medium 34 filled between the top surface of the common laser heat sink module 31 and the various laser components attached to the laser heat sink 31. During operation, heat generated in the various laser components is transferred from lower portions of the various laser components to laser heat sink module 31 (e.g., from plate heat sink 26, lens mount 27, crystal mount 28, crystal mount 29, and mirror mount 30 to laser heat sink module 31). In addition, the laser heat sink module 31 is rigid and maintains the relative positions of the various components attached to the top surface of the laser heat sink module 31, thereby maintaining the stability of the optical path within the diode pumped solid state laser 10 and ensuring stable operation thereof.

On the other side (e.g., bottom surface) of the laser heat sink module 31, the laser heat sink module 31 is in thermal contact with a cooling surface of a thermoelectric cooling device 32 (e.g., thermoelectric cooler (TEC)). The heating surface of the thermoelectric cooling device 32 is opposite to the cooling surface of the thermoelectric cooling device 32, and is connected to a heat sink 33. The heat transfer medium 34 is filled between the bottom surface of the laser heat sink module 31 and the cooling surface of the thermoelectric cooling device 32, and between the heating surface of the thermoelectric cooling device 32 and the heat sink 33.

The on-board heat sink 26, crystal mount 28, crystal mount 29, laser heat sink module 31 may be made of a conductive or insulating thermal conductive material such as copper, aluminum nitrate ceramic, etc. The lens holder 27 and the lens holder 30 may be made of a conductor or an insulator, such as glass, metal, or the like. The heat sink 33 may be cooled using gas or liquid. The thermally conductive media 34 may be made of a conductor or an insulator, such as indium foil, thermally conductive silicone, electrically conductive silver adhesive, and/or phase change thermally conductive material, among others.

In conventional diode pumped solid state lasers, such as the diode pumped solid state laser 10 shown in fig. 1A, the laser chip, various laser crystals, lenses, and mirrors transmit heat to one or more corresponding heat sinks and mounts, respectively, and thermal exchange with the TEC is achieved through these corresponding heat sinks and mounts. In addition, the heat sink and mount are used to attach the laser chip and various laser crystals, lenses, and mirrors to maintain stability of the optical path in the laser. Some of the drawbacks involved in this conventional configuration include thermal interference of the various components of the laser, as well as inefficient heat transfer due to thermal resistance existing between the various component interfaces.

The improved diode pumped solid state laser disclosed herein allows some components of the laser (e.g., laser components including the laser chip and its onboard heat sink, as well as laser components including various crystals with their respective crystal mounts, etc.) to be directly attached on the cooling surface of the TEC to enable direct thermal contact with the TEC and exchange heat directly with the TEC, thereby reducing thermal interference between these components and other laser components not directly attached to the TEC and improving the efficiency of heat dissipation.

In the example diode pumped solid state laser 10 shown in fig. 1A, the on-board heat sink 26, crystal mount 28, and crystal mount 29 are in thermal contact with the same laser heat sink module 31. Because the diode laser chip 8 is the most heat generating component in the laser 10, most of the heat transferred to the laser heat sink 31 comes from the on-board heat sink 26. As a result, the laser crystal 11 and the nonlinear frequency conversion crystal 12 will be thermally affected by the heat generated by the diode laser chip 8. The operational stability of the laser chip 8 is strongly dependent on the operating temperature. The optical properties of the laser crystal 11 and the nonlinear frequency conversion crystal 12 also depend on efficient heat exchange with the TEC 32.

As shown in fig. 1B, the exemplary diode pumped solid state laser 20 is an improvement over the conventional diode pumped solid state laser 10, according to some embodiments. For ease of illustration, the diode pumped solid state laser 20 is substantially similar to the conventional diode pumped solid state laser 10 except for the configuration of the common laser heat sink and the location of the laser crystal module relative to the common laser heat sink. As shown in fig. 1B, instead of a common laser heat sink 31, a new laser heat sink 35 is used between the various laser components (e.g., the laser chip 8 with the on-board heat sink 26, the lens 9 with the lens holder 27, the laser crystal 11 with its crystal holder, the nonlinear frequency conversion crystal 12 with its crystal holder, and the output mirror 14 with the mirror holder 30) and the TEC 32. In some embodiments, the new laser heat sink module 35 is substantially similar to the conventional laser heat sink module 31, but has at least one via (e.g., two vias 38 and 39) created between its top surface and its bottom surface, as shown in fig. 1B.

As shown in fig. 1B, crystal mount 36 (e.g., a cylindrical crystal mount) and crystal mount 37 are placed within through holes 38 and 39, respectively. The crystal mounts 36 and 37 are placed as close as possible to the cooling surface of the TEC32, with a heat conducting medium 40 (e.g., the heat conducting medium 40 may be the same or different from the heat conducting medium 34) applied between the cooling surface of the TEC32 and the bottom surface of the crystal mounts 36 and 37. In addition, crystal mounts 36 and 37 are attached to laser heat sink 35 (e.g., crystal mounts 36 and 37 are glued to the top surface of laser heat sink 35 by glue dots 41 around one or more dots around the gap between the sides of crystal mounts 36 and 37 and the inner surfaces of through holes 38 and 39 or the top surface of laser heat sink module 35). Other methods of attaching the crystal mount to the laser heat sink (e.g., using screws or other mechanical fastening mechanisms) are possible. During operation, heat is transferred from the laser crystal 11 to the crystal mount 36 (e.g., via the thermally conductive medium 34) and then to the cooling surface of the TEC32 (e.g., via the thermally conductive medium 40); and heat is transferred from the non-linear frequency conversion crystal 12 to the crystal mount 37 (e.g., via the thermally conductive medium 34) and then to the cooling surface of the TEC32 (e.g., via the thermally conductive medium 40). The heat generated by the laser chip 8 is transferred to the on-board heat sink 26 and then from the on-board heat sink 26 to the laser heat sink 35. Since crystal mounts 36 and 37 are not in direct thermal contact with laser heat sink module 35, the heat generated by laser chip 8 does not greatly affect the operating temperatures of laser crystal 11 and nonlinear frequency conversion crystal 12, thereby improving the operating stability of these laser crystals.

Fig. 1C illustrates an exemplary laser heat sink 35 having two cylindrical vias 38 and 39 from the top surface to the bottom surface of laser heat sink module 35, in accordance with some embodiments. In some embodiments, additional vias may be present in the laser heat sink module 35 to accommodate additional laser components (e.g., one or more additional mirrors, lenses, and crystals, and their respective mounts and/or heat sinks) in the diode-pumped solid state laser 20.

Fig. 1D- (1) illustrates an exemplary laser crystal 11 attached to a cylindrical laser crystal mount 36, with a thermal conductive medium 34 applied between the laser crystal 11 and the laser crystal mount 36, according to some embodiments. Fig. 1D- (2) illustrates an exemplary nonlinear frequency conversion crystal 12 attached to a cylindrical laser crystal mount 37, in which a thermally conductive medium 34 is applied between the nonlinear frequency conversion crystal 12 and the crystal mount 37, according to some embodiments.

Although the crystal mounts 36 and 37 and the through holes 38 and 39 are shown in FIGS. 1D- (1) and 1D- (2) as cylindrical with a circular cross-section, other cross-sectional shapes (e.g., oval, square, rectangular, custom, etc.) are possible according to various embodiments. In general, the cross-sectional shape of the crystal mount and the cross-sectional shape of the through hole are geometrically similar such that the crystal mount can be easily centered within the through hole. Additionally, while the crystal mount is used in the examples shown in fig. 1B, 1D- (1), and 1D- (2) as the lower portion of the laser component that is placed in direct contact with the cooling surface of the TEC, it will be understood by those skilled in the art that the lower portion of other types of laser components (e.g., the on-board heat sink of the laser chip, the mirror mount of the mirror, and/or the lens mount of the lens, etc.) may also be placed in direct contact with the TEC through corresponding vias created in a common laser heat sink module placed over the TEC. The key is that some laser components are placed in indirect thermal contact with the TEC through a common heat sink module (e.g., heat sink module 35), while other laser components are placed in direct thermal contact with the TEC through respective vias created in the common heat sink module. Thus, thermal interference between the two sets of laser components may be reduced. In some embodiments, the laser component may be an integrated component that does not have a distinct structural division between its upper and lower portions, and in these cases, the point of attachment to the wall or upper edge of the through-hole may be considered the beginning of the lower portion of the laser component.

In some embodiments, to improve thermal contact between the upper portion (e.g., laser crystal 11) and the lower portion (e.g., crystal mount 36) of the laser component, and to reduce thermal resistance between the upper portion and the lower portion of the laser component, a linear recess is created within the lower portion (e.g., crystal mount 36) of the laser component to retain its corresponding upper portion (e.g., laser crystal 11). The linear recess extends in the direction of the optical path in the laser and has a cross-sectional shape that matches the shape of the upper portion that will fit within the linear recess. For example, fig. 1D- (3) shows an exemplary crystal mount 42 having a linear recess 43 created in its top surface. The linear recess 43 extends through a top portion of the crystal mount 42 such that when a laser crystal (e.g., laser crystal 11) is placed within the recess 43, the optical path through the laser crystal extends through the recess 43 without being blocked by the crystal mount 42. As shown in fig. 1D- (3), the linear recess 43 is shaped and dimensioned such that its inner surface is in thermal contact with the laser crystal not only on the bottom side of the laser crystal but also on both side walls of the laser crystal 11, thereby increasing the thermal contact area and reducing the thermal resistance between the laser crystal 11 and the crystal mount 42.

While the design in fig. 1D shows that the upper portion of the laser component (e.g., laser crystal 11) within the via (e.g., via 38) remains outside of the via, in some embodiments, the entire component may be located within the via. For example, in some embodiments, the crystal mount 42 shown in fig. 1D can have a linear recess that is sufficiently deep such that the top of the crystal 11 is below the upper surface of the crystal mount 42. In some embodiments, the crystal 11 is still located above the top surface of the heat sink module (e.g., heat sink module 35), while in other embodiments, the crystal 11 may optionally be below the top surface of the heat sink module, provided the heat sink module is structured such that it does not block the optical path of the crystal 11.

The above designs of the laser heat sinks and crystal mounts shown in fig. 1B-1D are illustrative only. In some embodiments, the same principles illustrated by the embodiments shown in fig. 1B through 1D are also applicable to additional components, such as lenses, lens holders, mirrors, mirror holders, diode chips and their respective support structures and/or board-mounted heat sinks. Furthermore, the number of different types of components in a single laser may be more than one. For example, there may be more than one laser crystal, non-linear frequency conversion crystal, lens, mirror, diode chip, etc. in the optical path of a single laser. In some embodiments, more than one laser heat sink module with vias may be used in a laser. For example, fig. 1E illustrates an exemplary diode pumped solid state laser 30, according to some embodiments. The diode pumped solid state laser 30 includes two separate TECs, namely TEC 32-1 and TEC 32-2, with TEC 32-1 in thermal contact with the laser heat sink module 35 and TEC 32-2 in thermal contact with the laser heat sink module 54. As shown in FIG. 1E, TEC 32-1 and TEC 32-2 are in thermal contact with heat sink 33.

As shown in fig. 1E, laser heat sink module 35 includes two through holes 38 and 39, with crystal mount 36 and crystal mount 37 occupying one of through holes 38 and 39, respectively, in laser heat sink module 35. Similarly, the laser heat sink module 54 also contains two through holes 52 and 53, with the crystal mount 51 (e.g., supporting the nonlinear conversion crystal 47) and the on-board heat sink 48 (e.g., supporting the diode laser chip 44) occupying one of the through holes 53 and 52, respectively, in the laser heat sink module 54. Other components of the laser, such as the laser chip 8 with its on-board heat sink 26, the lens 9 with its lens holder 27, the laser crystal 46 with its crystal holder 50, the beam splitter 45 with its holder 49, are attached to the laser heat sink modules 35 and 54, respectively. Other configurations of diode pumped solid state lasers are possible.

Fig. 1F is a flow diagram of a method 60 for assembling a diode pumped solid state laser module (e.g., the diode pumped solid state lasers 20 and 30 in fig. 1B and 1E), according to some embodiments.

In some embodiments, (62) a heatsink module (e.g., laser heat sink module 35 in fig. 1B, 1C, and 1E, and laser heat sink module 54 in fig. 1E) is obtained, where the heatsink module includes a first surface (e.g., a top surface), a second surface (e.g., a bottom surface) opposite the first surface, and at least a first via (e.g., via 38 or 39 in fig. 1B, 1C, and 1E, and via 52 or 53 in fig. 1E) linking the first surface and the second surface.

(64) Bonding a second surface (e.g., a bottom surface) of a heat sink module (e.g., laser heat sink 35 in fig. 1B and 1E or laser heat sink 54 in fig. 1E) to a cooling surface (e.g., a cooling surface of TEC32 in fig. 1B and 1E), wherein the cooling surface and the first via form a first cavity (e.g., a cylindrical cavity) having a top opening in the first surface (e.g., a top surface) of the heat sink module and a bottom seal in the cooling surface (e.g., a cooling surface of TEC32 in fig. 1B and 1E).

(66) At least a first component of the diode pumped solid state laser module (e.g., the on-board heat sink 26 supporting the laser chip 8 in fig. 1B and 1E, the lens 9 having the lens mount 27 in fig. 1B and 1E, the crystal mount 54 supporting the laser crystal 46 in fig. 1E, and the mirror mount 49 supporting the beam splitter 45 in fig. 1E) is bonded to a first surface (e.g., a top surface) of a heat sink module (e.g., the laser heat sink module 35 in fig. 1B or 1E or the laser heat sink 54 in fig. 1E) such that the first component is in thermal contact with the first surface of the heat sink module. For example, there is at least one component in the laser that is in direct thermal contact with the top surface of the laser heat sink and not in direct thermal contact with the cooling surface of the TEC.

In some embodiments, after bonding at least a first component (e.g., some or all of the components that will not be placed in direct contact with the TEC via the vias created in the heatsink module) to a first surface (e.g., a top surface) of the heatsink module, a second surface (e.g., a bottom surface) of the heatsink module is bonded to a cooling surface of the TEC.

(68) After bonding the second surface (e.g., bottom surface) of the heat sink module to the cooling surface (e.g., the cooling surface of the TEC32 in fig. 1B or 1E) to form a first cavity (e.g., a cylindrical cavity), a thermally conductive medium (e.g., thermally conductive medium 40) is partially filled into the first cavity such that the thermally conductive medium is in thermal contact with the cooling surface of the TEC in the first cavity.

(70) A second component of the diode pumped solid state laser module (e.g., crystal mount 36 holding laser crystal 11 in fig. 1B and 1E, crystal mount 37 holding nonlinear frequency conversion crystal 12, crystal mount 51 holding nonlinear frequency conversion crystal 47 in fig. 1E, or on-board heat sink 48 holding diode chip 44 in fig. 1E) is inserted into the first cavity, wherein the second component comprises an upper portion and a lower portion supporting the upper portion, and wherein after insertion, the lower portion of the second component deforms the thermally conductive medium (e.g., thermally conductive medium 40) inside the first cavity and achieves thermal contact with the cooling surface of the TEC through the deformed thermally conductive medium.

(72) A second component (e.g., a lower portion of the second component (e.g., crystal mount 36, crystal mount 37, crystal mount 51 in fig. 1E, or board-mounted heat sink 48 in fig. 1E)) is attached (e.g., glued) to a first surface (e.g., a top surface) of a heat sink module (e.g., laser heat sink module 35 in fig. 1B and 1E, or laser heat sink module 54 in fig. 1E)).

In some embodiments, after the inserting, at least a portion of the upper portion and the lower portion of the second component remain outside of the first cavity, and attaching the second component to the heat sink module includes attaching the lower portion of the second component to the first surface of the heat sink module.

In some embodiments, the second part of the diode pumped solid state laser module includes a laser chip (e.g., laser chip 44 in fig. 1E) and an onboard heat sink (e.g., onboard heat sink 48 in fig. 1E) supporting and in thermal contact with the laser chip, and wherein the first part of the diode pumped solid state laser module includes a first laser crystal (e.g., nonlinear conversion crystal 47 in fig. 1E) and a first laser crystal mount (e.g., crystal mount 51 in fig. 1E) supporting and in thermal contact with the first laser crystal. This is illustrated, for example, by the right portion of the laser 30 shown in FIG. 1E.

In some embodiments, the first component of the diode pumped solid state laser module includes a laser chip (e.g., laser chip 8 in fig. 1B and 1E) and an onboard heat sink (e.g., onboard heat sink 26 in fig. 1B and 1E) supporting the laser chip and in thermal contact with the laser chip, and wherein the second component of the diode pumped solid state laser module includes a first laser crystal (e.g., laser crystal 11 in fig. 1B and 1E, non-linear frequency conversion crystal 12 in fig. 1B and 1E) and a first laser crystal mount (e.g., crystal mount 36 in fig. 1B and 1E, mount crystal 37 in fig. 1B and 1E) supporting the first laser crystal and in thermal contact with the first laser crystal. This is illustrated, for example, in the left portion of the laser 30 in fig. 1B and 1E.

In some embodiments, the first laser crystal mount (e.g., crystal mount 42 in fig. 1D- (3)) comprises a top surface, a bottom surface, and a body between the top surface and the bottom surface of the first laser crystal mount, the first laser crystal mount further comprises a recess in the top surface of the first laser crystal mount (e.g., linear recess 43 in fig. 1D- (3)) that extends completely through the top surface of the first laser crystal mount in a first direction (e.g., the direction of the optical path in the laser), and wherein the first laser crystal (e.g., laser crystal 11) is disposed within the recess of the first laser crystal mount and in thermal contact with two or more interior surfaces of the recess. This is illustrated, for example, in FIG. 1D- (3).

In some embodiments, the first cavity is a cylindrical through-hole and the first laser crystal mount is a cylindrical body having a linear recess extending through a top surface of the cylindrical body. This is illustrated, for example, in FIGS. 1C and 1D- (3).

In some embodiments, a vertical position of insertion of the second component into the first cavity is adjusted according to a first optical alignment requirement of the first component relative to the second component of the diode pumped solid state laser module, while a lower portion of the second component is held in thermal contact with the cooling surface by the deformed heat conducting medium, wherein the adjustment is performed prior to attaching the second component to the heat sink module.

In some embodiments, the lower portion of the second component is attached around the top opening of the first cavity.

In some embodiments, attaching the second component to the heat sink module includes gluing a lower portion of the second component to the first surface of the heat sink module around a top opening of the first cavity in the first surface of the heat sink module.

In some embodiments, a lateral position of the second component inserted into the first cavity is adjusted according to a second optical alignment requirement of the first component relative to the second component of the diode pumped solid state laser module, while a lower portion of the second component is held in thermal contact with the cooling surface by the deformed heat conducting medium, wherein the adjustment is performed prior to attaching the second component to the heat sink module.

In some embodiments, the angle of insertion of the second component into the first cavity is adjusted according to a third optical alignment requirement of the first component relative to the second component of the diode pumped solid state laser module, while a lower portion of the second component is held in thermal contact with the cooling surface by the deformed heat conducting medium, wherein the adjustment is performed prior to attaching the second component to the heat sink module.

In some embodiments, the first component of the diode pumped solid state laser module includes a laser diode module, wherein the laser diode module includes an onboard heat sink and a laser chip, wherein the onboard heat sink includes a first side attached to the laser chip and a second side opposite the first side, and wherein bonding the first component of the diode pumped solid state laser module to the first surface of the heat sink module further includes bonding the second side of the onboard heat sink to the first surface of the heat sink module.

In some embodiments, the heat sink module further includes a second through-hole linking the first surface and the second surface, wherein the cooling surface and the second through-hole form a second cavity having a top opening in the first surface of the heat sink module and a bottom seal in the cooling surface. After bonding the second surface of the heat sink module to the cooling surface to form the second cavity, the heat transfer medium is partially filled into the second cavity such that the heat transfer medium is in thermal contact with the cooling surface in the second cavity. Inserting a third component of the diode pumped solid state laser module into the second cavity, wherein the third component comprises an upper portion and a lower portion supporting the upper portion, and wherein after the inserting, the lower portion of the third component deforms the heat conducting medium inside the second cavity and thermal contact with the cooling surface is achieved by the deformed heat conducting medium. The third component is attached to the heat sink module.

In some embodiments, the second component is a laser crystal module comprising a laser crystal and a corresponding crystal mount supporting the laser crystal, and the third component is a nonlinear crystal and a corresponding crystal mount supporting the nonlinear crystal.

The above process 60 allows for adjustment of the optical alignment of the various components in one or more directions when placing the components in the through holes of the laser heat sink module before the components are securely attached to the laser heat sink module, which in turn reduces the defect rate of the laser assembly.

In some embodiments, a diode pumped solid state laser module (e.g., diode pumped solid state lasers 20 and 30 in fig. 1B and 1E) includes a heat sink module, a cooling module, a thermal conductive medium, a first component of the diode pumped solid state laser module, and a second component of the diode pumped solid state laser module. The diode pumped solid state laser module may be assembled according to some embodiments using the process 60 shown in fig. 1F and the accompanying description.

In some embodiments, a heat sink module includes a first surface, a second surface opposite the first surface, and at least a first via linking the first surface and the second surface. The cooling module includes a cooling surface and a thermoelectric cooling system (e.g., a thermoelectric cooler (TEC)) and a heat spreader, wherein the second surface of the heat sink module is bonded to the cooling surface of the cooling module, and wherein the cooling surface of the cooling module and the first through hole in the heat sink module form a first cavity having a top opening in the first surface of the heat sink module and a bottom seal in the cooling surface of the cooling module. The heat conducting medium partially fills a first cavity formed by the cooling surface of the cooling module and the first through hole in the heat sink module. The first section of the diode pumped solid state laser module is bonded to the first surface of the heat sink module such that the first section is in thermal contact with the first surface of the heat sink module. The second part of the diode pumped solid state laser module is partially inserted into a first cavity formed by a cooling surface of the cooling module and a first through hole in the heat sink module, wherein the second part comprises an upper portion and a lower portion supporting the upper portion, wherein the lower portion of the second part deforms the heat conducting medium inside the first cavity and achieves thermal contact with the cooling surface through the deformed heat conducting medium, and wherein the second part is attached to the heat sink module.

In some embodiments, at least a portion of the upper and lower portions of the second component remain outside of the first cavity, and the lower portion of the second component is attached to the first surface of the heat sink module.

In some embodiments, the second part of the diode pumped solid state laser module includes a laser chip and an onboard heat sink supporting the laser chip and in thermal contact with the laser chip, and wherein the first part of the diode pumped solid state laser module includes a first laser crystal and a first laser crystal mount supporting the first laser crystal and in thermal contact with the first laser crystal. This is illustrated, for example, by the right portion of the laser 30 in fig. 1E.

In some embodiments, the first part of the diode pumped solid state laser module includes a laser chip and an onboard heat sink supporting the laser chip and in thermal contact with the laser chip, and wherein the second part of the diode pumped solid state laser module includes a first laser crystal and a first laser crystal mount supporting the first laser crystal and in thermal contact with the first laser crystal. This is illustrated, for example, in fig. 1B and by the left portion of the laser 30 in fig. 1E.

In some embodiments, the first laser crystal mount includes a top surface, a bottom surface, and a body between the top surface and the bottom surface of the first laser crystal mount, the first laser crystal mount further including a recess in the top surface of the first laser crystal mount that extends completely through the top surface of the first laser crystal mount in the first direction, and wherein the first laser crystal is disposed within the recess of the first laser crystal mount and in thermal contact with two or more inner surfaces of the recess. This is illustrated, for example, in FIG. 1D- (3).

In some embodiments, the first cavity is a cylindrical through hole and the first laser crystal mount is a cylindrical body having a linear recess extending through a top surface of the cylindrical body. This is illustrated, for example, in FIGS. 1C and 1D- (3).

In some embodiments, the vertical position of the second component inserted into the first cavity is adjusted according to a first optical alignment requirement of the first component relative to the second component of the diode pumped solid state laser module.

In some embodiments, the lower portion of the second component is attached (e.g., by glue dots 41 or other fastening mechanisms, such as screws or clamps) around the top opening of the first cavity.

In some embodiments, the lower portion of the second component is glued to the first surface of the heat sink module around the top opening of the first cavity in the first surface of the heat sink module.

In some embodiments, the lateral position of the second component inserted into the first cavity is adjusted according to a second optical alignment requirement of the first component relative to the second component of the diode pumped solid state laser module.

In some embodiments, the angle at which the second component is inserted into the first cavity is adjusted according to a second optical alignment requirement of the first component relative to the second component of the diode pumped solid state laser module.

In some embodiments, the first component of the diode pumped solid state laser module includes a laser diode module, wherein the laser diode module includes an onboard heat sink and a laser chip, wherein the onboard heat sink includes a first side attached to the laser chip and a second side opposite the first side, and the second side of the onboard heat sink is bonded to the first surface of the heat sink module.

In some embodiments, the heat sink module further comprises a second through-hole linking the first surface and the second surface, wherein the cooling surface and the second through-hole form a second cavity having a top opening in the first surface of the heat sink module and a bottom seal in the cooling surface, and wherein the heat conducting medium partially fills the second cavity such that the heat conducting medium is in thermal contact with the cooling surface in the second cavity, wherein the diode pumped solid state laser module further comprises a third component, wherein the third component of the diode pumped solid state laser module is partially inserted into the second cavity formed by the cooling surface of the cooling module and the second through-hole in the heat sink module, wherein the third component comprises an upper portion and a lower portion supporting the upper portion, wherein the lower portion of the third component deforms the heat conducting medium inside the second cavity and achieves thermal contact with the cooling surface through the deformed heat conducting medium, and wherein the third component is attached to the heat sink module.

In some embodiments, the second component is a laser crystal module comprising a laser crystal and a corresponding crystal mount supporting the laser crystal, and the third component is a nonlinear crystal and a corresponding crystal mount supporting the nonlinear crystal. This is illustrated, for example, in fig. 1B or in the left portion of the laser 30 in fig. 1E.

Fig. 2A shows a schematic diagram of an exemplary laser diode (e.g., laser diode 1). Typically, a laser diode includes a diode laser chip packaged in a TO-CAN package. Common CO-CAN packages include TO-38, TO-56, TO-9, and the like. Sometimes, other types of packages may be used to fabricate laser diodes, such as SOT-01, SOT-02, CMT-02, and the like. A laser diode with a TO-CAN-56 package is shown in fig. 2A for illustrative purposes. The laser diode 1 shown in fig. 2A includes a metal support plate 2, a metal can 3, conductive pins 4, an output window 5, and an insulating layer 6. The diode laser chip is mounted on a metal support plate 2. The metal support plate 2 serves to dissipate heat generated by the diode laser chip. The metal casing 3, the output window 5 and the metal support plate 2 together form a sealed space to protect the diode laser chip. Generally, there are several conductive pins 4 coming out of the backside of the metal support plate 2. The conductive pins 4 are used to supply current to drive the diode laser chip or for diagnostic purposes. Each of the conductive pins 4 is insulated from the metal support plate 2 using an insulating layer 6.

During operation, a laser beam 7 generated by the diode laser chip leaves the laser diode 1 through the output window 5. In general, the path of the laser beam 7 is perpendicular to the plane of the metal support plate 2. The conductive pins 4 include at least a cathode pin and an anode pin for supplying current to drive the diode laser chip, and optionally a ground pin.

As described in the background section, many systems and devices that use laser array illumination use a laser array of semiconductor diode lasers (e.g., such as diode laser 1 in fig. 2A). When using a diode laser array module, problems such as optical alignment (e.g., adjustment of the divergence angle of the diode lasers), heat dissipation, and electrical driving efficiency need to be addressed. Typically, heat dissipation/cooling requires exposure and contact of thermal conductors (or other efficient heat transfer media), while electrical driving requires proper insulation between electrical conductors. The requirement for cooling and electrical driving in diode laser arrays presents unique challenges since the medium for thermal conduction/transfer is also typically a good electrical conductor and the medium for electrical insulation is typically a poor thermal conductor.

To address the above challenges, the thermal transfer requirements and electrical drive functions of the laser diode modules are physically separated into different surfaces of the laser array module so that each can be implemented without disturbing the other.

In some embodiments, in a single-sided diode laser array, by utilizing a heat sink module with an embedded via (stepped or through hole), the laser diode may be placed at least partially within the via, and the thermal contact area between the laser diode and the heat sink module may be increased (e.g., due to increased contact area/exposure between the side wall of the via and the laser diode), thereby improving the heat dissipation efficiency of the heat sink module.

In addition to ensuring adequate heat dissipation, it is also necessary to properly house the drive circuitry for the laser array. Conventionally, a PCB circuit or flex circuit layer is connected to the laser diode and disposed between the laser diode layer and the liquid cooling layer. In general, the size of the driver circuit layer is limited by circuit density and cannot be made very small. Thus, the driver circuit layer may interfere with heat transfer between the laser diode layer and the liquid cooling layer. By utilizing a heat sink module having a recess in the bottom surface to link vias, conductive pins can be placed within the recess to link laser diodes placed within vias in the heat sink module, and the conductive pins can thus be connected to driver circuits placed on the sides of the heat sink module. Thus, a physical separation of the drive circuit layer from the heat transfer interface is achieved, and heat dissipation is no longer impeded by the presence of the drive circuit layer. The conductive pins may be insulated from the rest of the heat sink module so that the heat sink module does not significantly affect the drive efficiency of the electrical drive circuit. In addition, generally being a good thermal conductor, electrically conductive electrical pins may also facilitate thermal conduction from the laser diode and the heat sink module and/or the liquid cooling layer. In some embodiments, to further reduce the number of interfaces and improve heat transfer efficiency, the heat sink module may be omitted or integrated with the liquid cooling module to allow the laser diode to be in direct thermal contact with the liquid cooling mechanism and to allow the drive circuitry to be disposed on the rear or vertical side of the liquid cooling module. This configuration also serves to physically separate the thermally conductive layer from the driver circuit layer. Exemplary embodiments of single-sided laser diode arrays are described below with respect to, for example, fig. 2B-2Q and 2X-2 BE.

In some embodiments, in a two-sided diode laser array module, to maximize the use of liquid cooling, a liquid cooling layer is used to cool the laser diodes on both sides of the laser array module. The diode laser arrays on each side of the laser array module are in direct contact with the liquid cooling layer. The liquid cooling layer is sandwiched between two laser diode layers of the double-sided diode laser array module, and the driving circuit layer is disposed on a side surface of the laser array module. This configuration allows physical separation of the heat transfer interface from the driver circuit layer.

The configuration of the laser diode array module may include different types and wavelengths of laser diodes. According to some embodiments, the diode lasers in each array may be pointed in different directions. In some embodiments, a lens to collimate the laser beam from the laser diode may also be placed at least partially within the through hole in the heat sink module, further improving heat dissipation efficiency. In some embodiments, different types of cooling mechanisms may be used in the laser array module as desired in different application scenarios. In some embodiments, the lens used to collimate the laser beam from the laser diode array may be fabricated as an integrated sheet with a built-in lens dome or as a separate lens. One advantage of using separate lenses is that a defective lens can be replaced individually without affecting the other lenses. One advantage of using an integrated sheet with built-in lens domes is the easy assembly of the laser array module.

Fig. 2B shows a schematic diagram of an exemplary single-sided diode laser array module 101 with a heat sink module 111 according to some embodiments. Fig. 2B- (1) shows a perspective view of the laser array module 101 from above, and fig. 2B- (2) shows a perspective view of the laser array module 101 from below. As shown in fig. 2B, the laser array module 101 includes a liquid cooling module 102 that cools the laser diodes during operation. The liquid cooling module 102 comprises liquid cooling tubes 103 embedded in a planar base layer. During operation, cooling liquid enters the liquid cooling tubes 103 from the inlet 104 and exits the liquid cooling tubes 103 from the outlet 105. In some embodiments, the cooling liquid may be water or alcohol. The laser array module 101 further includes a lens array layer (having an array of lenses 108 embedded or resting on a lens array base layer 110) over the heat sink module 111, and one or more drive circuit layers 118 disposed perpendicularly with respect to a planar thermal transfer interface between the heat sink module 111 and the liquid cooling module 102.

Fig. 2C is an exploded view of the laser array module 101 showing various components of the laser array module 101 and their relative positions, according to some embodiments. As shown in fig. 2C, the laser array module 101 includes a laser diode array 107 including an array of diode lasers (e.g., an array of diode lasers 1) arranged in a grid pattern (e.g., a rectangular grid pattern with orthogonal rows and columns). The laser array module 101 further includes a lens array 109 that includes an array of lenses 108 at positions corresponding to the diode lasers 1 in the diode laser array 107 (e.g., also in a rectangular grid pattern on the diode lasers). In some embodiments, the lenses 108 are individual lenses placed within an array of through holes 119 in the lens array base layer 110. In some embodiments, the lenses 108 and the lens array base layer 110 are integrated into a single homogeneous body made of a mold, such as an array of lens domes formed on a surface of a planar body. In some embodiments, the lenses 108 are disposed above the lens array base layer 110, e.g., not within the through holes 119.

As shown in fig. 2C, the laser array module 101 further includes a heat sink module 111, and the heat sink module 111 includes an array of vias (e.g., stepped vias 120) at locations corresponding to the laser diodes 1 in the diode laser array 107. The back side of the heat sink module 111 includes a recess 121 (e.g., as also shown in fig. 2E- (2)).

As shown in fig. 2C, the laser array module 101 further includes an insulation array 113, and the insulation array 113 includes an array of insulation tubes 112 at locations corresponding to the laser diodes 1 (and locations of vias (e.g., stepped vias 120)). When the laser array module 101 is assembled, the insulating tube 112 is inserted into the corresponding through hole (e.g., the stepped through hole 120), insulating the conductive pin 4 of the diode laser 1 from the wall of the through hole (e.g., the stepped through hole 120) in the heat sink module 111.

As shown in fig. 2C, the laser array module 101 further includes an inner array 115 of U-shaped conductive pin connectors 114 and an outer array 117 of L-shaped conductive pin connectors 116. The inner array of U-shaped conductive pin connectors 114 has respective connectors (also referred to as legs or arms of the U-shape) that reach into the insulator tube 112 and link the conductive pins 4 of the laser diode 1 into the network, and the outer array of L-shaped conductive pin connectors 116 has respective connectors (also referred to as legs or arms of the L-shape) that reach into the insulator tube 112 and link the pins 4 of the outermost layer of the laser diode 1 to the outer drive circuitry layer 118. As shown in fig. 2B and 2C, in some embodiments, the driver circuit layer 118 includes a driver circuit PCB board attached to the side of the heat sink module 111, where the side of the heat sink module 111 (and the driver circuit layer 118) is perpendicular to the top and bottom surfaces of the heat sink module 111. As shown in fig. 2C, the laser array module 101 further includes a liquid cooling module 102 attached to the bottom side of the heat sink module 111. Recesses in the bottom side of the heat sink module 111 receive horizontal portions of the U-shaped conductive pin connectors 114 and horizontal portions of the L-shaped conductive pin connectors 116 such that the bottom surface of the heat sink module 111 and the top surface of the liquid cooling layer 102 are in close thermal contact with each other for efficient heat exchange.

Fig. 2D shows a schematic diagram of the lens array substrate layer 110 according to some embodiments. As shown in fig. 2D, the lens array base layer 110 is a substantially planar base having an array of through-holes (e.g., stepped through-holes 119) at locations corresponding to the lenses 108 in the lens array 109 (and locations corresponding to the laser diodes 1 in the laser array 107). Each stepped through hole 119 includes an upper portion (e.g., a cylindrical hole having the same diameter and height as the lens 108) that will fit the corresponding lens 108. In addition, each stepped via 119 includes a lower portion that is slightly smaller than the upper portion, such that an annular surface or step is created between the upper and lower portions of the stepped via 119. In some embodiments, the annular surface or step supports the bottom edge of lens 108 while passing the laser beam emitted from the underlying laser diode. In some embodiments, the lens is suspended over the annular surface or step by an optical medium (e.g., a transparent optical gel). In some embodiments, the lenses are attached to the top surface of the lens array base layer 110 with an air gap between each lens and the stepped surface of the stepped through hole in the lens array base layer 110. In some embodiments, the lenses are disposed completely outside of the through holes 109 and are attached to the top surface of the lens array base layer 110 by glue. In some embodiments, the lower portion of the stepped through hole in the lens array base layer 110 has a diameter slightly larger than the metal casing 3 of the laser diode 1, and when the laser array module is assembled, at least the upper portion of the laser diode 1 (e.g., the casing 3) resides within the lower portion of the stepped through hole 119 of the lens array base layer 110, such as illustrated in fig. H- (2). During operation, the laser beam from each laser diode 1 enters from the bottom side of the corresponding stepped through hole 119 and passes through the lens 108 disposed within the corresponding stepped through hole 119, and the lens 108 adjusts the divergence angle of the laser beam. In some embodiments, the alignment between the lens 108 and the laser diodes is separately tuned during fabrication to ensure that the outputs from the plurality of laser diodes align with each other once they pass through the respective lens over the plurality of laser diodes.

In some embodiments, the lens array substrate layer 110 shown in fig. 2D may be replaced by a lens array substrate layer including through holes or through holes having a narrower upper portion and a wider lower portion. In some embodiments, the lenses rest above the lens array base layer above the vias, rather than residing at least partially within the vias. These are illustrated, for example, in the embodiments shown in figures AH to AK, AM to AS, AT, AU and AY.

Fig. 2E shows a schematic diagram of a heat sink module 111 according to some embodiments. As shown in fig. 2E- (1), the heat sink module 111 includes an array of vias (e.g., stepped vias 120) in a planar base at locations corresponding to the laser diodes 1 in the laser array 107. Each stepped via 120 includes an upper portion that is wide enough to fit the upper portion of a respective laser diode 1 (e.g., a cylindrical hole having a diameter slightly larger than the diameter of the support plate 2 of the diode laser 1). In some embodiments, the height of the upper portion of the stepped through hole 120 is less than the thickness of the support plate 2 for the laser diode 1, such that at least a portion of the support plate 2 protrudes above the top surface of the laser diode module 111. In addition, each stepped via 120 includes a lower portion that is slightly smaller than the upper portion, such that an annular surface or step is created between the upper and lower portions of the stepped via 120, and the annular surface or step supports the bottom edge of the support plate 2 of the laser diode 1, while passing the conductive pin 4 of the laser diode 1 into the lower portion of the stepped via 120. The lower portion of the stepped via 120 has a height sufficient to fit the corresponding insulator tube 112 such that the insulator tube 112 insulates the conductive pin of the laser diode 1 from the inner sidewall of the stepped via 120; and a recess having a bottom through a series of stepped vias 120 (e.g., rows or columns of stepped vias 120), the conductive pin connectors 116 and 114 inside these stepped vias 120 being insulated (e.g., physically separated by an air gap) from the inner walls of the recess 121 in the bottom surface of the heat sink module 111. As shown in fig. 2E- (2), on the bottom side of the heat sink module 111, there is a linear groove 121 to accommodate the horizontal portion of the U-shaped conductive pin connector 114 and the horizontal portion of the L-shaped conductive pin connector 116. Each groove 121 passes through a lower portion of at least one row or column of stepped through-holes 120. The heat sink module 111 is made of a good thermal conductor to efficiently transfer heat from the laser diodes 1 to the liquid cooling layer 102 below, while remaining electrically insulated from the conductive pins 4 of the laser diodes 1 in the laser diode array 107.

In some embodiments, the heat sink module 111 shown in FIG. 2E may be replaced with a heat sink module that includes through holes. In some embodiments, the support plate of the laser diode rests above the heat sink module above the via, rather than residing at least partially within the via. These are illustrated, for example, in the embodiments shown in the diagrams AH, AI, AL to AS and AT to AX.

Fig. 2F shows a schematic diagram of an L-shaped conductive pin connector 116 and a U-shaped conductive pin connector 114 according to some embodiments. As shown in fig. 2F- (1), the L-shaped conductive pin connector 116 includes two conductive legs that are angled (e.g., perpendicular) to each other, and one of the legs includes a conductive shoe 124 that encloses a conductive spring-loaded insert 123. The spring-loaded insert 123 includes a plurality of leaves that will open and push against the inner wall of the shoe 124 when the conductive pin of the laser diode 1 is inserted into the spring-loaded insert 123 so that the conductive pin of the laser diode 1 is held in firm contact with the conductive shoe 124 by the spring-loaded conductive insert 123. The U-shaped conductive pin connector 114 is similar to the L-shaped connector 116 except that the U-shaped conductive pin connector 114 has two legs/arms 125 connected by a linear conductor 122. Each of the two arms/legs 125 of the U-shaped connector 114 contains a respective shoe 124 and a corresponding spring-loaded insert 123 for holding the conductive pins of the laser diode 1.

Fig. 2F- (2) shows a view from below of how the leg/arm 125 of the U-shaped conductive pin connector 114 and the leg/arm of the L-shaped conductive pin connector 116 are disposed within the insulator tube 112 when assembled in a laser array module. When connecting the legs of the U-shaped conductive pin connector 114 or the legs of the L-shaped connector 116 with the corresponding conductive pins of the laser diode 1, as shown in fig. 2F- (2), the legs with the shoes 124 and their spring-loaded inserts 123 are placed inside the insulator tube 112 from below, and the appropriate pins of the laser diode (not shown in fig. 2F- (2)) are inserted into the spring-loaded inserts from above. The U-shaped conductive pin connectors 114 are used to connect adjacent laser diodes in the diode array in series (e.g., adjacent laser diodes in a row or column of the laser diode array), while the L-shaped conductive pin connectors 116 are used to connect the laser diodes (and thus other laser diodes connected to the laser diodes by the U-shaped connectors 116) to an external drive circuit layer (e.g., a drive PCB board) (e.g., a drive circuit layer 118 placed on a vertical side of the heat sink module 111). The insulator tube 112 is inserted within a lower portion (or a lower portion or the entirety of a through-hole) of the stepped via 120 in the heat sink module 111 (or a variation thereof) and electrically insulates the conductive pin 4 of the laser diode 1 from the heat sink module 111 (or a variation thereof).

Fig. 2G shows top and bottom views of laser diode array 107 according to some embodiments. For example, FIG. 2G- (1) shows a top view of the laser diode array 107, and FIG. 2G- (2) shows a bottom view of the laser diode array 107, wherein the laser diode array 107 is comprised of laser diodes 1 arranged in 3 rows by 5 columns. In the embodiment shown in fig. 2G, the orientation of the laser diodes is substantially the same (e.g., as indicated by the relative positions of corresponding conductive pins in the different laser diodes in fig. 2G- (2)). In some embodiments, when placing the laser diode 1 within a via (e.g., a stepped via 120 or a through via 120'), small adjustments may be made to the orientation of the laser diode 1 to align the polarization planes of the laser beams from different laser diodes 1. In some embodiments, once the orientation of the laser diode is adjusted, the lens array base layer is placed over the top of the laser diode 1 and fastened to the heat sink module. The lens array base layer thus prevents the laser diodes from moving or rotating during operation of the laser array module.

In some embodiments, using the laser diode array 107 shown in fig. 2G, three laser diodes 1 per row are connected in series by two U-shaped conductive pin connectors 114, and two laser diodes 1 located at the edge of the array 107 are respectively connected to external driving circuitry in a driving circuitry layer 118 by two L-shaped conductive pin connectors 116, as shown in fig. 2H.

Fig. 2H- (1) shows the connection between the laser diode 1 and the conductive pin connectors 114 and 116 from below. Fig. 2H- (2) shows a side view of the laser array module 101. As shown in fig. 2H, the conductive pin 4 of the laser diode 1 is inserted into a spring-loaded insert 123 in the shoe 124 of the conductive pin connectors 116 and 114 to establish electrical contact between the laser diode 1 and the conductive pin connectors 116 and 114. The U-shaped conductive pin connector 114 and the L-shaped conductive pin connector 116 are electrically isolated from the heat sink module 111 (or variations thereof) by the insulator tube 112. In some embodiments, rather than using an insulator tube 112, other insulating materials may be applied between the conductive pin connectors 114 and 116 and the inner walls of the stepped via 120 (or through hole 120') and between the conductive pin connectors 114 and 116 and the recess 121 in the heat sink module 111 (or variations thereof) to electrically insulate the heat sink module 111 (or variations thereof) from the electrical pins 4 of the laser diode 1 and the driver circuit layer 118 of the laser array module 101.

As shown in fig. 2H- (2), the lower portion of the laser diode 1 is inserted into the lower portion of the stepped through-hole 120 in the heat sink module 111, with the support plate 2 of the laser diode 1 resting on the annular stepped surface in the stepped through-hole 120. The metal casing 3 of the laser diode 1 is at least partially inserted into the lower portion of the stepped through hole 119 in the lens base layer 110. The lens array base layer 110 and the heat sink module 111 rest against each other after alignment based on the location of the vias 120 and 119. In some embodiments, the lens array base layer is adhered to the top surface of the heat sink module 111 with some adhesive medium or other securing method (e.g., fasteners, screws, etc.). In some embodiments, the thickness of the support plate 2 of the laser diode 1 is greater than the height of the upper portion of the stepped via 120 such that when the lens array base layer 110 is placed over the heat sink module 111, the bottom surface of the lens array base layer 110 is suspended over the top surface of the heat sink module 111 by the protruding support plate 2 of the laser diode. When the lens array base layer 110 is attached to the heat sink module 111, for example by an adhesive or fasteners, the lens array base layer 110 presses the support plate 2 of the laser diode against the top surface of the heat sink module 111 such that displacement and rotation of the laser diode is prevented. Each lens 108 is placed within an upper portion of a respective via 119 above a corresponding laser diode 1. After the position and orientation of the lenses have been adjusted separately to ensure optical alignment and focusing, the lenses 108 are then attached to the lens base layer 110 at the top edge or inner wall of the stepped through-hole 119, for example using glue or other adhesive. For example, when attaching the lens to the lens base layer 110, the height and orientation of the lens 108 may be adjusted separately as needed so that the gap between the lens 108 and the output window 5 of the laser diode 1 (e.g., an air gap or a gap filled with other high refractive index media) has a suitable width to focus the laser beams from different laser diodes 1 onto a plane at a desired distance. When a defective lens is found during or after assembly of the laser array module 101, the defective lens may be replaced with another non-defective lens without affecting the other lenses in the lens base layer 110.

As shown in fig. 2H- (2), the horizontal portion of the U-shaped conductive pin connector 114 and the horizontal portion of the L-shaped conductive pin connector 116 are placed within a recess 121 in the bottom surface of the heat sink module 111 (or variations thereof). The bottom surface of the heat sink module 111 (or variations thereof) is placed in intimate thermal contact with the liquid-cooled module 102 and transfers heat generated by the laser diodes 1 to the liquid-cooled module 102 to effect cooling of the laser array module 101. At the same time, the U-shaped conductive pin connector 114 and the L-shaped conductive pin connector 116 are electrically separate and insulated from the heat sink module 111 (or variations thereof).

The orientation of the laser diode 1 shown in fig. 2G is merely illustrative. In some embodiments, different arrangements of laser diodes 1 may be used in the laser diode array 107. For example, as shown in fig. 2I, the orientation of the laser diodes 1 is not all the same in the laser diode array 107. According to some embodiments, fig. 2I- (1) shows a top view of the laser diode array 107, and fig. 2I- (2) shows a bottom view of the laser diode array 107. According to some embodiments, based on the arrangement of the laser diode 1 in fig. 2I, the L-shaped conductive pin connector 116 and the U-shaped conductive pin connector 114 may be used to connect the conductive pins of the laser diode according to the arrangement shown in fig. 2J. According to the arrangement of the L-shaped conductive pin connector 116 and the U-shaped conductive pin connector 114 shown in fig. 2J, the groove 112 may be created according to the pattern shown in fig. 2K. The configuration of the laser diode array 107 and the arrangement of the conductive pin connectors 114 and 116 may be based on the laser illumination needs and the specific needs of the design of the driver circuits in the driver circuit layer. The exemplary laser diode array according to the layout and orientation shown in fig. 2I to 2K is also referred to later in the specification as laser diode array 131. In some embodiments, the laser array module includes a laser diode array 131 instead of the laser diode array 101.

As noted earlier, in some embodiments, the stepped through hole 119 in the lens array base layer 110 may be replaced with a through hole without any step inside (e.g., through hole 119'). In some embodiments, the stepped through hole 119 in the lens array base layer 110 may be replaced by a stepped through hole (e.g., stepped through hole 119 ") that is wider at the top and narrower at the bottom. In some embodiments, the stepped through-hole 120 in the heat sink module 111 may be replaced with a through-hole (e.g., through-hole 120') without any step inside. In some embodiments, the lenses (e.g., lenses 108') may be placed over the lens array base layer 110 rather than within the through holes 119 (or 119', or 119 ") in the lens array base layer 110. Depending on the particular combination of types of through holes in the lens array base layer 110 and the heat sink module 111 used in the laser array module, the relative positions of the lenses, the body and support plate of the laser diodes, the through holes in the lens array base module, and the through holes in the heat sink module will be adjusted, for example AS illustrated in fig. 2 AH-2 AS.

As shown in fig. 2AH, the laser array module 101 'includes a heat sink module 111' that includes a via 120', where the via 120' is a through hole that replaces the stepped via 120 shown in fig. 2C. In fig. 2AI, the laser array module 101 "includes a heat sink module 111 'having a through hole 120' and further includes a lens array base layer 110", wherein the lens array base layer 110 "includes a stepped via 119" having a wider upper portion and a narrower lower portion, instead of the stepped via 119. In addition, the diameter of the lens 108 'used in the laser array module 101 "is larger than the diameter of the upper portion of the through hole 119" so that the lens 108' will not fit within the through hole 119 "of the lens array base layer 110".

In some embodiments, in fig. 2AI, the laser array module 101' includes a heat sink module 111' having a through hole 120' and further includes a lens array base layer 110', where the lens array base layer 110' includes a through hole 119' instead of the stepped through hole 119' or 119 ". In addition, the diameter of the lens 108 'used in the laser array module 101' is larger than the diameter of the through hole 119', so that the lens 108' will not fit within the through hole 119 'of the lens array base layer 110'.

Fig. 2AJ illustrates a lens array substrate layer 110 'comprising an array of through holes 119'. The lens array substrate layer 110' may replace the lens array substrate layer 110 in various embodiments of the laser array modules described herein.

Fig. 2AK illustrates a lens array base layer 110 "including an array of stepped vias 119". The stepped through holes 119 "each have a cylindrical upper portion and a cylindrical lower portion joined by respective annular surfaces. The stepped through holes 119 "each have a smaller diameter in the upper portion and a larger diameter in the lower portion. The lens array substrate layer 110 "may replace the lens array substrate layer 110 or the lens array substrate layer 110' in various embodiments of the laser array modules described herein.

Fig. 2AL illustrates a heat sink module 111' that can replace heat sink module 111 in various embodiments of the laser array modules described herein. The heat sink module 111 'includes an array of through vias 120' instead of the stepped vias 120.

Fig. 2 AM-2 AS illustrate some exemplary configurations for the laser array module when various combinations of heat sink modules (e.g., 111 and 111') and lens array base layers (e.g., 110', and 110 ") are used. The description of the example configuration in fig. 2AM to 2AS focuses on the key differences between the earlier illustrated embodiments of the laser array module 101, and the description of the other components and their arrangement in the laser array module shown in fig. 2AM to 2AS can be found, for example, at least in the description of the laser array module 101 and in fig. 2A to 2H, and will not be repeated here.

As shown in fig. 2AM, the laser array module 101-a includes a lens array base layer 110 (with a stepped through hole 119) and a heat sink module 111 (with a stepped through hole 120), but the lens 108 is replaced by a larger lens 108'. The larger lens 108' does not reside within the upper portion of the stepped via 119 of the laser array base layer 110; rather, each lens 108' is disposed on a top surface of the lens array substrate layer 110. In this particular configuration, the stepped through holes 119 are each wider at a top portion and narrower at a lower portion. The diameter of the lens 108' is larger than the diameter of the top portion of the stepped through hole 119. The position of the lens 108' may be adjusted during assembly (prior to gluing to the surface of the lens array base layer 110) so that each laser diode-lens pair meets the alignment and focusing requirements of the laser array module. One advantage of having a stepped via wider at the top is that the diverging output from the laser diode is less likely to be blocked by the top portion of the via 119. In some embodiments, the through-hole 119 need not have a step along its body, and the diameter of the through-hole may gradually increase from bottom to top. In some embodiments, as shown in fig. 2AM, the metal can of the laser diode 1 fits within the lower portion of the stepped through hole 119, and the lower edge of the through hole 119 rests above the edge of the support plate of the laser diode 1. This configuration allows the lens support base layer to press the laser diode 1 against the step within the through hole 120 in the heat sink module 111, so that rotation of the laser diode 1 is prevented.

Fig. 2AN shows another embodiment (e.g., laser array module 101-b) similar to the embodiment shown in fig. 2AM, except that the lens array substrate layer 110 with the stepped through hole 119 is replaced with a lens array substrate layer 110 'with a through hole 119'. In this example embodiment, the lenses 108' rest on the top surface of the lens array substrate layer 110' in the same manner as the lenses 108' rest on the top surface of the lens array substrate layer 110 in fig. 2 AM. In this configuration, the metal casing of the laser diode 1 resides within the lower portion of the through hole 119 'such that the lower edge of the through hole 119' presses against the edge of the support plate of the laser diode 1.

Fig. 2AO shows another embodiment (e.g., laser array module 101-c) similar to the embodiment shown in fig. 2AM, except that the lens array substrate layer 110 "with the stepped through hole 119 is replaced with a lens array substrate layer 110" with a stepped through hole 119 ". In this example embodiment, the lenses 108 'rest on the top surface of the lens array substrate layer 110 "in the same manner as the lenses 108' rest on the top surface of the lens array substrate layer 110 in fig. 2 AM. In some embodiments, as shown in fig. 2AO, the metal can of the laser diode 1 fits within the lower portion of the stepped through hole 119 ", and the lower edge of the through hole 119" rests above the edge of the support plate of the laser diode 1. This configuration allows the lens support base layer to press the laser diode 1 against the step within the through hole 120 in the heat sink module 111, so that rotation of the laser diode 1 is prevented. This configuration is suitable where the size of the laser diode body is relatively large compared to the size of the lens, and the narrow top prevents the lenslets from falling into the stepped through-holes in the base layer of the lens array.

Fig. 2AP illustrates another embodiment (e.g., laser array module 101-d) similar to that shown in fig. 2H, except that the heat sink module 111 having the stepped through-hole 120 is replaced with a heat sink module 111 'having a through-hole 120'. In this example embodiment, the support plate 2 of the laser diode 1 is supported by the top surface of the heat sink module 111' (e.g., on the edges of the vias 120'), and only the conductive pins of the laser diode 1 are within the vias 120 '. In addition, the bottom surface of the lens array base layer 110 rests against the top surface of the support plate 2 of the laser diode 1. When the lens array base layer 110 is attached to the heat sink module 111', the lens array base layer 110 presses the support plate 2 of the laser diode 1 against the top surface of the heat sink module 111' such that rotation and movement of the laser diode 1 is prevented.

Fig. 2AQ illustrates another embodiment (e.g., laser array module 101-e) similar to that shown in fig. 2AP, except that a lens 108' is placed over the top surface of the lens array substrate layer 110.

Fig. 2AR illustrates another embodiment (e.g., laser array module 101-f) similar to that shown in fig. 2AQ, except that the heat sink module 111 with the stepped through hole 120 is replaced with a heat sink module 111 'with a through hole 120'. The lens 108 'has a larger diameter than the through hole 120'.

Fig. 2AS illustrates another embodiment (e.g., laser array module 101-g) similar to that shown in fig. 2AQ, except that the vias in the lens array base layer 110 "have a narrower upper portion and a wider lower portion. For example, in some embodiments, the size of the output window of the laser diode is large, and vias or through holes with wider upper portions in the lens array base layer would require very large lenses (so that they do not fall into the holes), and would increase cost. Therefore, in these cases, a through hole having a narrower upper portion is desirable.

Fig. 2H and 2AM to 2AS are not exhaustive of all possible combinations of different types of vias in the lens array base layer and the heat sink module and different relative positions of the laser diode and the lens. In some embodiments, the lens 108 is attached (e.g., by glue) to the top surface of the lens base layer 110 and suspended over the laser diode 1 by an air gap. In some embodiments, the diameter of the lower portion of the through hole in the lens array base layer is smaller than the diameter of the metal casing 3 of the laser diode 1. In such embodiments the bottom surface of the lens array base layer 110 is optionally supported by the top surface of the metal can 3 of the laser diode 1, and the lens is separated from the top of the metal can 3 by an air gap.

The configuration of the laser array modules (e.g., 101', 101 ", and 101-a through 101-g) shown in fig. 2B through 2K and 2AH through 2AS are merely illustrative. Variations are possible. For example, fig. 2L shows a laser array module 136 similar to the laser array module 101 shown in fig. 2B-2K and 2 AH-2 AS, except that the liquid cooling system is integrated with the heat sink module, and the driver circuit layer is placed on the side of the heat sink module with the built-in liquid cooling system. In other words, in the laser array module shown in fig. 2L, a liquid cooling system with built-in grooves and vias (e.g., stepped vias) is used to accommodate the laser diode array, and thus the heat sink module 111 (or variations thereof) shown in the laser array module 101 (or variations thereof) is omitted. This configuration reduces the number of thermal interfaces and thus improves the heat transfer efficiency of the laser array module.

Fig. 2L- (1) shows a perspective view of the laser array module 136 from above, and fig. 2L- (2) shows a perspective view of the laser array module 136 from below, according to some embodiments. Fig. 2M shows an exploded view of a laser array module 136 according to some embodiments.

As shown in fig. 2L and 2M, the laser array module 136 includes a heat sink module 137 that is an integration of the heat sink module, such as heat sink module 111, shown in fig. 2B-2C with the liquid cooling system 102. As described herein, the heat sink module 137 may also be referred to as a liquid cooling module 137 because it functions as both a heat sink module and a liquid cooling module in the laser array module 136.

As shown in fig. 2L and 2M, the heat sink module/liquid cooling module 137 includes an array of vias (e.g., stepped vias 120) at locations corresponding to the locations of the laser diodes 1 in the laser diode array 107. On the bottom surface of the heat sink module 137, recesses 121 are made to each pass through a plurality of adjacent through holes (e.g., stepped through holes 120) in the heat sink module 137. In addition, as shown in fig. 2L and 2M, the liquid cooling tube 103 is embedded in the base of the heat sink module 137, for example in a channel created in the bottom surface of the heat sink module 137. As shown in fig. 2L and 2M, the laser array module 136 further includes one or more drive circuit layers 138 adhered to the vertical side surfaces of the heat sink module 137. The drive circuit layer 138 includes openings (e.g., slots) to allow the liquid cooling tubes 103 to pass through the drive circuit layer 138 before returning to the channels in the heat sink module 137. In some embodiments, the liquid cooling tube 103 has a section that is parallel to the groove 121 in the bottom surface of the heat sink module 137. In some embodiments, the height of the driver circuit layer 138 is greater than the thickness of the heat sink module 137, and the driver circuit layer 138 may also extend to cover the sides of the lens array module, for example, the sides of the lens base layer 110 (or variations thereof) as shown in fig. 2L and 2M.

As shown in fig. 2L and 2M, the laser array module 136 also includes a lens array (e.g., lens array 109) that includes lenses (e.g., lenses 108) arranged in an array pattern. The laser array module 136 further includes a lens array base layer (e.g., lens array base layer 110) that includes an array of vias (e.g., stepped vias 119) at locations corresponding to laser diodes 1 in the laser diode array 107. The laser array module 136 further includes an array 113 of insulator tubes 112, an array 115 of U-shaped conductive pin connectors 114, and an array 117 of L-shaped conductive pin connectors 116. When assembled, the lens (e.g., lens 108) is placed within (or over) the lens array base layer (e.g., lens array base layer 110, 110', or 110 ") and the laser diode 1 is placed at least partially within the via (e.g., stepped via 120) in the heat sink module 137, in the manner AS shown in fig. 2H- (2) (or a variation thereof AS described in fig. AM-AS). Further, in the manner also shown in fig. 2H (or a variation thereof AS described in fig. AM-AS), the insulator tube 112 is placed within a via (e.g., a stepped via 120) and the laser diode 1 is connected to the U-shaped conductive pin connector 114 and the L-shaped conductive pin connector 116. The L-shaped conductive pin connector 116 connects pin 4 of the laser diode 1 with the driver circuit layer 138.

Although the examples shown in fig. 2L and 2M are based on modifications of the configuration of the laser array module 101 shown in fig. 2B, similar modifications may also be applied to the laser array modules 101', 101 ", 101-a to 101-g shown in fig. 2AM to 2 AS. For example, fig. 2AT and 2AU illustrate example laser array modules 136' and 136 ".

In fig. 2AT, the laser array module 136 'includes a heat sink module 137' that is an integrated heat sink and liquid cooling module. The heat sink module 137 'includes a through hole 120' in place of the stepped through hole 120. The relative positions of the laser array diode 1, the insulator tube 112, the through hole 120 'in the heat sink module 137', the lens array base layer 110, and the lens 108 are similar to those shown, for example, in fig. 2 AP. The relative positions of the driver circuit module 138, the liquid cooling tube 103, the arrays of conductive pins 115 and 117, the insulator tube 112, and the heat sink module 137' are similar to those shown, for example, in fig. 2M.

Similarly, in fig. 2AU, the laser array module 136 "includes an integrated heat sink module 137 'with a through hole 120'. The laser array module 136 "is similar to the laser array module 136' shown in fig. 2AT, except that the lens array base layer 110" includes a stepped through-hole 119 "that is narrower in a lower portion and wider in an upper portion. The relative positions of the laser array diode 1, the insulator tube 112, the through hole 120' in the heat sink module 137', the lens array base layer 110 ", the through hole 119", and the lens 108' are similar to those shown, for example, in fig. 2 AS. The relative positions of the driver circuit module 138, the liquid cooling tube 103, the arrays of conductive pins 115 and 117, the insulator tube 112, and the heat sink module 137' are similar to those shown, for example, in fig. 2M.

Other variations of the heatsink module 137 may be based on configurations such as shown in fig. 2 AM-2 AO and 2 AQ-2 AR (e.g., with various combinations of vias 120 and 120' in the heatsink module, vias 119, 119', 119 "in the lens array base layer, and lenses 108 and 108' in the lens array). Fig. 2L-2M, 2AT, and 2AU show placement of the liquid cooling tube 103 within a channel created in the bottom surface of the heat sink module 137, 137', and/or 137 "according to some embodiments. Fig. 2N shows the heat sink module 137 with the liquid cooling tube 103 placed within a channel carved into the bottom surface of the heat sink module 137. Fig. 2N- (2) also shows that the liquid-cooling tube 103 includes a plurality of linear segments that extend parallel to the grooves 121 in the bottom surface of the heat sink module 137. According to some embodiments, it is also possible to create channels in the top surface of the heat sink module to accommodate the liquid cooling tubes 103. For example, in the heat sink module 139 shown in fig. 2O, the liquid cooling tube 103 is placed within a channel engraved in the top surface of the heat sink module 139.

In some embodiments, when the laser diodes 1 in the diode array 107 are oriented such that only parallel grooves 121 need to be created in the bottom surface of the heatsink module (e.g., as shown in fig. 2G), channels for the liquid cooling tubes 103 may be created on the top or bottom surface of the heatsink module (e.g., as shown in fig. 2N and 2O, respectively). However, in some embodiments, when the laser diodes 1 in the diode array 107 are oriented such that intersection of the grooves 121 in the bottom surface of the heatsink module is desired (e.g., as shown in fig. 2I-2K), a channel for the liquid cooling tube 103 may be created in the top surface of the heatsink module to avoid interfering with the positioning of the grooves 121 in the bottom surface of the heatsink module. For example, as shown in fig. 2P, channels for the liquid cooling tubes 103 are created in the top surface of the heat sink module 147, while grooves 121 for the U-shaped and L-shaped conductive pin connectors are created in the bottom surface of the heat sink module 147. In some embodiments, the intersection of the grooves 121 may coexist with the channels for the liquid cooling tube 103 on the same side of the heat sink module, provided that the depth of the grooves and channels is such that the conductive pins and the cooling tube 103 will not interfere with each other at the same depth level (e.g., the channels are deeper than the grooves, or vice versa).

The examples shown in fig. 2N to 2P are based on a heat sink module with a stepped through hole 120. Similar configurations of heat sink modules, grooves and liquid cooling tubes may also be based on heat sink modules with through holes 120'. For example, fig. 2AV shows top and bottom views of an integrated heat sink module 137 'with a through hole 120'. Similar to the heat sink module 137 shown in fig. 2N, the heat sink module 137' includes a channel on the bottom surface of the heat sink module 137', and the channel includes a segment that is parallel to the linear groove 121 in the bottom surface of the heat sink module 137 '.

In another example, fig. 2AW shows top and bottom views of an integrated heat sink module 139 'with a through hole 120'. Similar to the heat sink module 139 shown in fig. 2O, the heat sink module 139' includes a channel on the top surface of the heat sink module 139', and the channel includes a segment parallel to the linear groove 121 in the bottom surface of the heat sink module 139 '.

In another example, fig. 2AX shows top and bottom views of an integrated heat sink module 147 'with a through hole 120'. Similar to the heat sink module 147 shown in fig. 2P, the heat sink module 147 'includes channels on the top surface of the heat sink module 147', and the channels include segments that are parallel to some of the linear grooves 121 in the bottom surface of the heat sink module 139', but perpendicular to other of the linear grooves 121 in the bottom surface of the heat sink module 139'.

In some embodiments, the layer of the substrate having the grooves 121 may be fabricated separately from the layer of the substrate having the channels for receiving the liquid cooling tubes 103. The layer of the substrate having the channel for accommodating the liquid cooling tube 103 further comprises an upper portion of the stepped through-hole 120, and optionally a portion of a lower portion of the stepped through-hole 120. The layer of the substrate with the recess also contains at least part of the lower portion of the stepped through hole 120. The heat sink module is created by aligning respective portions of the stepped vias 120 in the two base layers and adhering the two layers together. Fig. 2Q illustrates an example heat sink module 149 having a two-layer configuration. The circuit drive layer 138 is placed on the side of the heat sink module 149 not passed by the liquid cooling tube 103.

In some embodiments, when the liquid cooling system is integrated with a heat sink module, it may also be possible to include a drive circuit layer against the bottom surface of the heat sink module, or to wrap a portion of the drive circuit layer from the vertical side of the heat sink module down onto the bottom surface of the heat sink module, according to some embodiments. The heat exchange interface remains separated from the driver circuit layer in these configurations, provided that the conductive pin connectors 114 and 116 remain completely within the recess 121 and are physically separated from the driver circuit layer or portions thereof that are placed adjacent to the bottom surface of the heat sink module.

Fig. 2B through 2Q and 2AH through 2AX illustrate configurations of single-sided laser array modules according to some embodiments. In some embodiments, many of the features of a single-sided laser array module may be suitable for use in a dual-sided laser array module. For example, in some embodiments, two diode laser arrays may share the same liquid cooling system sandwiched between the two diode laser arrays.

Fig. 2R illustrates a two-sided laser array module 157 with a single liquid-cooled layer shared by two diode arrays. Fig. 2R- (1) shows a perspective view of the dual sided laser array module 157 from above, with an upper portion of the laser array module 157 lifted away from a lower portion of the laser array module 157 to reveal internal features of the dual sided laser array module 157. Fig. 2R- (2) shows a perspective view of the two-sided laser array module 157 with the upper and lower portions mated together.

As shown in fig. 2R, the structure of the upper portion of the double-sided laser array module 157 is the same as the single-sided laser array module 101 (or a variation thereof) or the single-sided laser array module 136 (or a variation thereof). The upper portion of the dual-sided laser array module 157 has its own driver circuit layer 118 on the side of the laser array module above the liquid cooling layer 102/137. In some embodiments, the drive circuit layer of the upper portion of the dual-sided laser array module 157 may also cover the sides of the liquid cooling layer 102/137, with slots to allow the passage of the liquid cooling tube 103 (e.g., as in the case of the drive circuit layer 138 shown in fig. 2M, 2AT, and 2 AU).

As shown in fig. 2R, channels are created in the bottom surface of the liquid cooling layer 102/137 for receiving the liquid cooling tubes 103. As shown in fig. 2R, the lower portion of the dual-sided laser array module 157 is the same as the single-sided laser array module 101 (or variation thereof) or the single-sided laser array module 136 (or variation thereof), without the liquid cooling layer 102/137. The lower portion of the dual-sided laser array module 157 shares the liquid cooling layer 102/137 with the upper portion of the dual-sided laser array module 157. The lower portion of the dual-sided laser array module 157 has its own set of lens arrays, heat sink modules, drive circuitry layers, and conductive pin connectors. In the example shown in fig. 2R, the liquid cooling layer and the heat sink modules of the top and bottom laser diode arrays are separate layers, and the liquid cooling layer receives heat transferred from the heat sink modules of both the top and bottom laser diode arrays. Channels are scribed in the top surface of the liquid cooled module (the surface that abuts the bottom surface of the heat sink module) relative to the bottom laser diode array.

Similar two-sided laser array modules may be built based on the laser array modules (e.g., laser array modules 101', 101 ", 101-a through 101-g) and their subcomponents (e.g., heat sink modules 111, 111', 136', 137', 139', 147' and 149 and lens array base layers 110, 110' and 110", etc.), as shown in fig. 2AH through 2 AX.

In some embodiments, the dual-sided laser diode array module may further share a heat sink module and/or a drive circuitry layer in addition to sharing a liquid cooling layer. As shown in fig. 2S and 2T, the dual-sided laser array module 162 includes an integrated heat sink/liquid cooling module 161, with the integrated heat sink/liquid cooling module 161 serving laser array 131 (e.g., laser arrays 131-1 and 131-2) components on both sides of the dual-sided laser array module 162 (and similarly, the suffixes "x-1" and "x-2" are used to refer to subsets of component x associated with laser arrays 131-1 and 131-2, respectively) in the dual-sided laser array module.

In some embodiments, the integrated heat sink/liquid cooling module 161 includes two arrays of vias (e.g., two arrays of stepped vias 120 (e.g., an array of stepped vias 120-1 and an array of stepped vias 120-2)), each via array (e.g., stepped vias 120) housing a respective laser diode array 131 that faces a respective side (e.g., a top side or a bottom side, as described herein, laser diode array 131-1 faces a top side of laser diode array 162, and laser diode array 131-2 faces a bottom side of laser diode array 162) of the dual-sided laser array module 161. Further, the two via arrays (e.g., the stepped vias 120) are offset from each other by a respective distance (e.g., one-half of the grid size of the via arrays (e.g., the stepped vias 120)).

Fig. 2S- (1) shows a perspective view of the integrated heatsink/liquid cooling module 161 from above, and fig. 2S- (2) shows a perspective view of the integrated heatsink/liquid cooling module 161 from below, according to some embodiments. As shown in fig. 2S- (1) and 2T, an array of vias (e.g., stepped vias 120-1 or through vias) is used to accommodate the laser diode array 131-1 facing the topside of the two-sided laser array module 162. As shown in fig. 2S- (2) and 2T, an array of vias (e.g., a stepped via 120-2 or a through via) is used to accommodate the laser diode array 131-2 facing the underside of the two-sided laser array module 162.

As shown in FIG. 2S- (1), recesses 121-2 are formed in the top surface of the heat sink module 161, and each recess 121-2 links a lower portion of a sequence of stepped vias 120-2. As shown in FIG. 2S- (2), grooves 121-1 are formed in the bottom surface of the heat sink module 161, and each groove 121-1 links a lower portion of a sequence of vias (e.g., a stepped via 120-1).

As shown in fig. 2S- (1) and 2S- (2), the liquid cooling tube 103 includes a plurality of linear portions connected by curved portions, and the linear portions extend parallel to one subset of linear grooves (e.g., linear groove 121-1 or linear groove 121-2) and perpendicular to another subset of linear grooves in the same grid pattern.

As shown in fig. 2S- (1) and 2S- (2), according to some embodiments, the liquid cooling tube 103 resides in a channel that is open from the bottom surface of the heat sink module 161. In some embodiments, the channels for the liquid cooling tubes 103 are open from the top surface of the heat sink module 161. In some embodiments, the channels for the liquid cooling module are completely embedded between the top and bottom surfaces of the heat sink module. In some embodiments, the liquid cooling tubes 103 are replaced by fluid channels created within the top and bottom surfaces of the heat sink module, with the beginning of the fluid channel connected to the inlet 104 and the end of the fluid channel connected to the outlet 105, for example as shown in fig. 2AA and 2AE and fig. 2BA and 2 BC.

Fig. 2T shows an exploded view of the dual sided laser array module 162. As shown in fig. 2T, the components of the two-sided laser array module 162 are substantially identical on both sides of the heat sink module 161.

As shown in fig. 2T, on the top side of the laser array module 162, a first lens array 109-1 having an array of lenses 108-1 is placed within an array of first through-holes (e.g., first stepped through-holes 119-1) in a first lens array substrate 110-1 (e.g., lens array substrate 110 in fig. 2D). The first through hole (e.g., the first stepped through hole 119-1) in the first lens array substrate 110-1 also accommodates an upper portion of the laser diode 1-1 in the first laser diode array 131-1, for example, in the manner shown in fig. 2H- (2). The laser diodes 1-1 in the first laser diode array 131-1 are inserted into an array of vias (e.g., the stepped via 120-1) in the heat sink module 161. The lower portion of the laser diodes 1-1 in the first laser diode array 131-1 are separated (and electrically isolated) from the walls of the vias (e.g., the stepped via 120-1) by the first array 113-1 of the respective insulator tubes 112-1. On the bottom surface of the heat sink module 161, a recess 121-1 is created to link a corresponding sequence of through-holes (e.g., the stepped through-hole 120-1). Additionally, in some embodiments, a channel is opened from the bottom surface of the heat sink module 161 to accommodate the liquid cooling tube 103. Finally, the array 115-1 of U-shaped conductive pin connectors 114-1 links the conductive pins of the laser diodes 1-1 in a respective row (or column) in the first laser diode array 131-1, and the array 117-1 of L-shaped conductive pin connectors 116-1 links the conductive pins of the laser diodes 1-1 on the edge of the array 131-1 to a layer of drive circuitry (not shown in FIG. 2T) disposed on a vertical side of the laser array module 162 (e.g., at least partially covering the vertical side of the heat sink module 161).

As shown in fig. 2T, on the opposite side of the laser array module 161, a second lens array 109-2 having an array of lenses 108-2 is placed within a second array of through-holes (e.g., a second array of stepped through-holes 119-2) in a second lens array substrate 110-2 (e.g., the lens array substrate 110 in fig. 2D). The through-hole (e.g., the stepped through-hole 119-2) in the second lens array substrate 110-2 accommodates the upper portion of the laser diode 1-2 in the second laser diode array 131-2, for example, in the manner shown in fig. 2H- (2). The laser diodes 1-2 in the second laser diode array 131-2 are inserted into an array of vias (e.g., stepped via 120-2 (not clearly visible in the view shown in fig. 2T)) in the heat sink module 161. The lower portion of the laser diodes 1-2 in the second laser diode array 131-2 (e.g., including the conductive pins of the laser diodes 1-2) are separated (and electrically isolated) from the walls of the stepped via 120-2 by the second array 113-2 of respective insulator tubes 121-2. On the top surface of the heat sink module 161, a recess 121-2 is created to link the corresponding sequence of through-holes (e.g., the stepped through-hole 120-2).

As shown in FIG. 2T, the via arrays (e.g., stepped vias 119-1 and 119-2) in the lens support module, the via arrays (e.g., stepped vias 120-1 and 120-2) in the heat sink module, and the corresponding laser diode arrays 131-1 and 131-2, respectively, are offset from each other such that each row of laser diodes 1-1 from the first laser diode array 131- (1) is offset from a corresponding row of laser diodes 1-2 from the second laser diode array 131- (2), and each column of laser diodes 1-1 from the first laser diode array 131- (1) is offset from a corresponding column of laser diodes 1-2 from the second laser diode array 131- (2).

Fig. 2U illustrates the relative positions of the lens 108, the laser diode 1, the insulator tube 112, the conductive pin connectors 114 and 116, the through-hole (e.g., the stepped through-hole 119) in the lens support module, the through-hole (e.g., the stepped through-hole 120) in the heat sink module, and the recess 121 in the two-sided laser array module 162. Fig. 2U- (1) shows the two-sided laser array module 162 from a first vertical cross-section through a row or column of laser diodes 1-1 across the top side facing the two-sided laser array module 162. Fig. 2U- (2) shows the dual-sided laser array module 162 from a second vertical cross-section through a row or column of laser diodes 1-2 facing the bottom side of the dual-sided laser array module 162. Fig. 2U is similar to fig. 2H- (2) in the relative positions of the components for each side of the dual sided laser array module 162. Similar two-sided laser array modules may also be built according to configurations such AS those shown in fig. 2AM to 2 AS.

Fig. 2V illustrates an exploded view of another bi-directional laser array module 169, in accordance with some embodiments. When assembled, the dual-sided laser array module 169 is generally similar to the dual-sided laser array module 162, except that the grooves for connecting the conductive pins of the laser diodes 1 are moved to the surface of the lens array base layer rather than the top and bottom surfaces of the heat sink module. Correspondingly, in addition to the through holes for accommodating the respective lens arrays, through holes for accommodating lower portions of the laser diodes 1 in the respective laser diode arrays 131 are created in each lens array base layer.

As shown in fig. 2V, the heat sink module 166 of the dual-sided laser array module 169 includes a first array of vias (e.g., stepped via 120-1 or through via) to accommodate the first array 131-1 of laser diodes 1-1 (bottom side of the dual-sided laser array module 169 facing in fig. 2V), and a second array of vias (e.g., stepped via 120-2 or through via) to accommodate the second array 131-2 of laser diodes 1-2 (top side of the dual-sided laser array module 169 facing in fig. 2V). Two arrays of vias (e.g., stepped vias 120-1 and 120-2 or corresponding through vias) are offset from each other by a respective distance (e.g., half of the grid distance) in each of the row and column directions. As shown in fig. 2V, channels for liquid cooling tubes 103 are created in the top surface of heat sink module 166.

As shown in fig. 2V, the lens array base layer 167 is used to accommodate a first array 109-2 of lenses 108-2 (corresponding to a second array of lenses 108-2 in fig. 2T) residing on the top side of the dual-sided laser array module 169. On the opposite side of the dual-sided laser array module 169, the lens array base layer 168 is used to accommodate a second array 109-1 of lenses 108-1 (corresponding to the first array of lenses 108-1 in FIG. 2T) residing on the bottom side of the dual-sided laser array module 169. In addition, a via 171-1 is created in the lens array base layer 167 at a location corresponding to the laser diode 1-1 in the first laser diode array 131-1 to accommodate a lower portion (e.g., a conductive pin) of the laser diode 1-1 in the first laser diode array 131-1. Grooves 173-1 are created in the top surface of the lens array base layer 167, wherein each groove 173-1 links a respective row or column of through holes 171-1. Similarly, a via 171-2 is created in the lens array base layer 168 at a location corresponding to the laser diode 1-2 in the first laser diode array 131-2 to accommodate a lower portion (e.g., a conductive pin) of the laser diode 1-2 in the first laser diode array 131-2. Grooves 173-2 are created in the bottom surface of the lens array base layer 168, where each groove 173-2 links a respective row or column of vias 171-2.

As shown in fig. 2V, when the two-sided laser array module 169 is assembled, the array 113-1 of insulator tubes 112-1 is inserted into the through-hole 171-1 from the topside of the lens array base layer 167 and (optionally) further into the stepped through-hole 120-1 in the heat sink module 166; the laser diode 1-1 in the first laser diode array 131-1 is inserted into the stepped via 120-1 from the bottom side of the heat sink module 166, and the conductive pin of the laser diode 1-1 passes through the via 171-1 into the lens array base layer 167 and is insulated from the walls of the vias 171-1 and 120-1 by the insulator tube 112-1. Conductive pin connector 114-1 is used to connect the conductive pins of laser diode 1-1 between adjacent vias 171-1 and conductive pin connector 116-1 is used to connect the conductive pins of laser diode 1-1 on the edge of laser diode array 113-1 to the drive circuitry layers (not shown) residing on the vertical side of dual-sided laser array module 169. The horizontal portions of the conductive pin connectors 114-1 and 116-1 in arrays 115-1 and 117-1 reside within recesses 173-1 in the top surface of lens array base layer 167.

As shown in fig. 2V, on the reverse side, when the two-sided laser array module 169 is assembled, the array 113-2 of insulator tubes 112-2 is inserted into the through-hole 171-2 from the bottom side of the lens array base layer 168, and (optionally) further into the stepped through-hole 120-2 in the heat sink module 166; the laser diodes 1-2 in the second laser diode array 131-2 are inserted into the stepped through vias 120-2 from the top side of the heat sink module 166, and the conductive pins of the laser diodes 1-2 pass through the through vias 171-2 into the lens array base layer 168 and are insulated from the walls of the through vias 171-2 and 120-2 by the insulator tubes 112-2. Conductive pin connector 114-2 is used to connect the conductive pins of laser diodes 1-2 between adjacent vias 171-2, and conductive pin connector 116-2 is used to connect the conductive pins of laser diodes 1-2 on the edge of laser diode array 113-2 to a drive circuitry layer (not shown) residing on the vertical side of dual-sided laser array module 169. The horizontal portions of the conductive pin connectors 114-2 and 116-2 in arrays 115-2 and 117-2 reside within recesses 173-2 in the bottom surface of lens array base layer 168.

The lenses 108-1 of the lens array 109-1 for the first laser diode array 131-1 are inserted into the through holes 110-1 from the bottom side of the lens array base layer 168, while the lenses 108-2 of the lens array 109-2 for the second laser diode array 131-2 are inserted into the through holes 110-2 from the top side of the lens array base layer 167.

Fig. 2W shows a cross-sectional view of the two-sided laser array module 169. Fig. 2W- (1) shows a cross-section through a row or column of laser diodes 108-1 in the first laser diode array 131-1. Fig. 2W- (2) shows a cross-section through a row or column of laser diodes 108-2 in the second laser diode array 131-2. As shown in fig. 2W, the structure of the dual-sided laser array module 169 is similar to that of the dual-sided laser array module 162 shown in fig. 2U, except that the groove for receiving the horizontal portion of the electrically conductive pin connectors 114 and 116 is moved farther away from the upper portion of the laser diode 1 (e.g., for a laser diode array facing the top side of the dual-sided laser array module, the groove is moved from the bottom surface of the heat sink module to the bottom surface of the lens array base layer at the bottom side of the dual-sided laser array module). In addition, vias for receiving conductive pins of the laser diodes extend from the heat sink module to the lens array base layer (e.g., for a laser diode array facing the top side of the dual-sided laser array module, vias for receiving the laser diodes extend from the top surface of the heat sink module through the lens array base layer at the bottom side of the dual-sided laser array module).

In the dual-sided laser array module 169 shown in fig. 2V and 2W, the heat sink module 166 may be integrated with the lens array base layers 167 and 168, and the integrated heat sink module is used to support the lenses on both sides of the dual-sided laser array module and acts as a heat sink module and a liquid cooling module for the dual-sided laser array module. Although the drive circuit layer is not shown in fig. 2T-2W, those skilled in the art will appreciate that the drive circuit layer may be attached to one or more vertical sides of the dual-sided laser array module and may extend beyond the layer/module that houses the horizontal portions of the conductive pin connectors 114 and 116.

Similar two-sided laser array modules as those shown in fig. 2S-2W may be built based on the configurations shown with respect to the laser array modules 101', 101 ", 101-a-101-g and their sub-components (e.g., heat sink modules 111, 111', 136', 137', 139', 147', and 149 and lens array base layers 110, 110', and 110", etc.), as shown in fig. 2 AH-2 AX.

As disclosed herein, the lens array module includes a lens array and a lens array base layer that houses the lenses (and, optionally, other structural features and components that house the laser array module (e.g., grooves, conductive pin connectors, conductive pins of the laser diode, housing of the laser diode, etc.)). Fig. 2X illustrates the formation of a lens array module according to some embodiments. In fig. 2X, the lens array module 174 is formed from two separate substrate layers 176 and 178. As shown in fig. 2X- (1), the base layers 176 and 178 each include a respective array of through-holes. The diameter of the through-hole 177 in the base layer 176 is slightly larger than the diameter of the lens 108 so that the lens 108 can fit closely within the through-hole 177. The through holes 179 in the base layer 178 have a slightly smaller diameter than the through holes 177 in the base layer 176. The locations of the vias 177 and 178 in the two base layers correspond to the locations of the laser diodes 1 in the laser array module.

Figure 2X- (2) shows that when two base layers 176 and 178 are placed adjacent to each other, an array of stepped vias is formed. The lens 108 is placed within the stepped through hole and is supported by the edges of the through hole 179 in the lower substrate layer 178. In some embodiments, the thickness of the lower substrate layer 178 is selected based on the size of the gap required between the lens and the laser diode.

In fig. 2AY, the lens array module 174' is formed with a single base layer 178 having an array of through holes 179. The diameter of the through holes 179 in the base layer 174' is slightly smaller than the diameter of the lenses 108 so that the lenses 108 can be positioned over the through holes 179 without falling through. The location of the via 179 corresponds to the location of the laser diode 1 in the laser array module.

Fig. 2Y shows an exemplary lens array module 175 with integrated lens domes on a base layer. In some embodiments, the lens array module 175 optionally houses other structural features and components of the laser array module (e.g., grooves, conductive pin connectors, conductive pins of laser diodes, housings of laser diodes, etc.). As shown in fig. 2Y- (1), the lens array module 175 includes a substantially planar base portion 181 with an array of lens domes 180 protruding from the planar portion. In some embodiments, the integrated lens array module is formed from a high index optical material such as glass or other high index plastic, polymer, or the like using a mold.

Fig. 2Z illustrates another heat sink module 183 that may be used in the laser array modules disclosed herein, in accordance with some embodiments. The heat sink module 183 is integrated with the liquid cooling layer and includes a liquid cooling channel having an inlet 104 and an outlet 105. In some embodiments, the liquid cooling channel is a fluid channel or series of interconnected fluid chambers created within the body of the heat sink module, and need not be in the form of a circular tube embedded in the body of the heat sink module. In some embodiments, the heat sink module 183 may replace the heat sink module 137 or 139 in the laser array module.

Fig. 2Z- (1) shows a perspective view of heat sink module 183 from above, and fig. 2Z- (2) shows a perspective view of heat sink module 183 from below. As shown in fig. 2Z, the heat-sink module 183 includes a first portion 184 and a second portion 185 that are adhered together to form an enclosure in which a cooling liquid may be circulated to cool the heat-sink module 183. The inlet 104 and outlet 105 for the cooling liquid are open in the body (side walls) of the first portion 184 to allow the cooling liquid to enter and exit the enclosure (fluid channel) created by the first portion 184 and the second portion 185 of the heat sink module 183.

As shown in FIG. 2Z- (1), an array of vias (e.g., stepped vias (to serve as the upper portion of the stepped via 120) are opened in the first portion 184 of the heat sink module 183 to accommodate the upper portion of the array of laser diodes 1. As shown in FIG. 2Z- (2), an array of vias (to serve as the lower portion of the stepped via 120) are opened to accommodate the lower portion of the array of laser diodes 1. each via in the first portion 184 corresponds to a respective via in the second portion 185, and both vias have the same lateral position in their respective portions.

In some embodiments (not shown in fig. 2Z- (1)), the through hole array opens at a corresponding location in each of the first and second portions 184, 185 of the heat sink module 183 to accommodate a lower portion of the array of laser diodes 1. In addition, as shown in fig. 2Z- (2), linear grooves 121 are created in the surface of the second portion 185 to each link the through holes of a corresponding row or column in the second portion.

Fig. 2AA shows more detail of the first portion 184 of the heat sink module 183 according to some embodiments. Fig. 2AA- (1) shows a perspective view of the first portion 184 from the first side, and fig. 2AA- (2) shows a perspective view of the first portion 184 from the second side. As shown in fig. 2AA- (1), the interior of the first portion 184 is hollow, leaving solid material (serving as the stepped through-hole 120) only around the position of the stepped through-hole. For example, in some embodiments, the interior of the first portion is hollow, leaving a shell, and a plurality of islands and protrusions of solid material attached to the shell. On each of the islands or protrusions, there is one or more stepped vias (e.g., a row or column of stepped vias from an array of stepped vias that serve as the stepped vias 120). In addition, an inlet 104 and an outlet 105 are created in the side wall of the housing, allowing cooling fluid to enter and exit the hollow interior region within the first portion 184.

Fig. 2AB shows a second portion 185 of a heat sink module 183 according to some embodiments. Fig. 2AB- (1) shows the second portion 185 from the first side, and fig. 2AB- (2) shows the second portion 185 from the second side. As shown in fig. 2AB, the second portion 185 is substantially planar and comprises an array of vias at positions corresponding to the array of laser diodes 1 in the laser array module, each row or column of vias being linked by a respective one of the linear grooves 121.

Fig. 2AZ illustrates another heat sink module 183' that may be used in the laser array modules disclosed herein, in accordance with some embodiments. The heat sink module 183 'is similar to the heat sink module 183 shown in fig. 2Z, except that the heat sink module 183' includes a through hole instead of a stepped through hole. In fig. 2AZ, the heat sink module 183' is integrated with the liquid cooling layer and includes a liquid cooling channel having an inlet 104 and an outlet 105. In some embodiments, the liquid cooling channel is a fluid channel or a series of interconnected fluid chambers created within the body of the heat sink module, and not necessarily in the form of a circular tube embedded in the body of the heat sink module. In some embodiments, heat sink module 183' may replace heat sink module 137' or 139' in a laser array module.

Fig. 2AZ- (1) shows a perspective view of the heat sink module 183 'from above, and fig. 2AZ- (2) shows a perspective view of the heat sink module 183' from below. As shown in fig. 2AZ, the heat-sink module 183 'includes a first portion 184' and a second portion 185 that are adhered together to form an enclosure in which a cooling liquid may be circulated to cool the heat-sink module 183. The inlet 104 and outlet 105 for the cooling liquid are open in the body (side walls) of the first portion 184 to allow the cooling liquid to enter and exit the enclosure (fluid channel) created by the first portion 184 'and the second portion 185 of the heat sink module 183'.

As shown in FIG. 2AZ- (1), an array of vias (e.g., through vias (to serve as the upper portion of the through via 120') are opened in the first portion 184' of the heat sink module 183 '. As shown in FIG. 2AZ- (2), an array of vias (to serve as the lower portion of the through via 120') are opened, each via in the first portion 184' corresponds to a respective via in the second portion 185, and both vias have the same lateral position in their respective portions.

Fig. 2BA shows more details of the first portion 184 'of the heat sink module 183' according to some embodiments. Fig. 2BA- (1) shows a perspective view of the first portion 184 'from the first side, and fig. 2BA- (2) shows a perspective view of the first portion 184' from the second side. As shown in fig. 2BA- (1), the interior of the first portion 184 'is hollow, leaving solid material (acting as the through-hole 120') only around the location of the through-hole. For example, in some embodiments, the interior of the first portion is hollow, leaving a shell, and a plurality of islands and protrusions of solid material attached to the shell. On each of the islands or protrusions, there is one or more through holes (e.g., a row or column of through holes from an array of through holes that serves as through holes 120'). In addition, an inlet 104 and an outlet 105 are created in the side walls of the housing, allowing cooling fluid to enter and exit the hollow interior region within the first portion 184.

As can be appreciated by those skilled in the art, while the laser diodes and array patterns shown in each of the laser array modules disclosed herein appear to be the same, the characteristics (e.g., operating frequency, power, type, etc.) of the individual laser diodes may be different in various applications for adaptation. Furthermore, if a laser source (e.g., laser diode 1) is not needed at the location of a particular stepped via, not all vias (e.g., stepped via 120 or through via 120') in a particular array need to be implemented for a particular application.

Fig. 2a illustrates another heat sink module 187 integrated with a cooling module without the use of a cooling liquid, according to some embodiments. As shown in fig. 2AC, the heat sink module 187 includes a first portion 188 that includes an array of stepped vias 120 for receiving an array of laser diodes 1 of the laser array module, and a second portion 189 that dissipates heat collected from the first portion 188. Fig. 2AC- (1) shows a perspective view of heat sink module 187 from above, and fig. 2AC- (2) shows a perspective view of heat sink module 187 from below.

In the heat sink module 187, a plurality of heat conduction rods 190 (e.g., copper or other metal rods) are inserted into the first portion 188 of the heat sink module 187 on one end and into the heat exchanger 189 on the other end. A plurality of heat conductive rods 190 are positioned within the first portion 188 in a manner that does not touch or pass through the array of stepped through holes 120 in the first portion 188, but is sufficiently close to the stepped through holes 120 so as to efficiently extract heat from the stepped through holes 120. On the back side of the first portion 188, a plurality of linear grooves 121 are created, each linking a corresponding row or column of stepped through holes 120.

The heat sink module 187 shown in fig. 2AC replaces a heat sink module (e.g., heat sink module 137 or 139) in the laser array modules disclosed herein, according to some embodiments. In essence, a first portion of the heat sink module 187 is used to house the components of the laser array module (except for the liquid cooling tube), and a second portion 189 of the heat sink module 187 is used to dissipate heat and replace the liquid cooling tube/liquid cooling layer of the laser array module.

Fig. 2BB illustrates another heat sink module 187 'similar to the heat sink module 187 in fig. 2AC, except that the heat sink module 187' includes a first portion 188 'having a through hole 120' instead of the first portion 188 having a stepped through hole 120, in accordance with some embodiments. The heat sink module 187' shown in fig. 2BB may replace a heat sink module (e.g., heat sink module 137' or 139') in the laser array modules disclosed herein, according to some embodiments. In essence, a first portion of the heat sink module 187 'is used to house the components of the laser array module (except for the liquid cooling tube), and a second portion 189 of the heat sink module 187' is used to dissipate heat and replace the liquid cooling tube/liquid cooling layer of the laser array module.

Fig. 2AD illustrates another heat sink module 191 in accordance with some embodiments. The heat sink module 191 utilizes liquid cooling within an enclosure created within the heat sink module 191. In some embodiments, heat sink module 191 replaces other heat sink modules used in the laser array modules disclosed herein (e.g., heat sink modules 137, 139, 147, 149, 161, 162, or 166, etc.).

Fig. 2AD- (1) shows a perspective view of the heat sink module 191 from above, and fig. 2AD- (2) shows a perspective view of the heat sink module 191 from below. As shown in fig. 2AD, the heat sink module 191 is formed of a first portion 192 and a second portion 193 that are adhered together to create an enclosure in which cooling fluid may be circulated. The cooling liquid may enter the enclosure from an inlet 104 and exit the enclosure from an outlet 105 created on a side wall of the enclosure.

As shown in fig. 2AD- (1), the first portion 192 of the heat sink module 191 includes an array of vias at locations corresponding to the locations of the array of laser diodes 1 in the laser array module. Within each of the through holes 196 (see fig. 2AE), a heat sink element 194 is inserted. The heat sink element 194 includes a stepped through-hole 198 (see fig. 2AF- (2) and 2AF- (3)) which serves as a stepped through-hole 120 for accommodating the respective laser diode 1. As shown in FIG. 2AD- (2), the second portion 193 of the heat sink module 191 includes an array of through-holes 197 (see FIG. 2AF- (1)), and the lower portions of the heat sink elements 194 are inserted into respective through-holes 197 in the second portion 193.

Fig. 2AE illustrates the structure of a first portion 192 of a heat sink module 191 according to some embodiments. FIG. 2AE- (1) shows the first portion 192 from a first side, and FIG. 2AE- (2) shows the first portion 192 from an opposite side.

As shown in fig. 2AE- (1), the interior of the first portion 192 of the heat sink module 191 includes a hollow space that serves as a fluid channel 195 for conveying cooling liquid from the inlet 104 to the outlet 105 on the sidewall of the first portion 192. In some embodiments, the fluidic channels created within the first portion 192 include a series of interconnected linear channels extending along a row or column of through-holes 196, as shown in fig. 2AE- (1). The location of the through holes 196 in the first portion 192 of the heat sink module 191 corresponds to the location of the array of laser diodes 1 in the laser array module.

FIG. 2AF- (1) shows a second portion 193 of the heat sink module 191 according to some embodiments. As shown in fig. 2AF- (1), the second portion 193 of the heat sink module 191 is a substantially planar body having an array of vias 197 created at locations corresponding to the array of laser diodes 1 in the laser array module.

Fig. 2AF- (2) and 2AF- (3) illustrate a heat sink element 194 according to some embodiments. Fig. 2AF- (2) shows a perspective view of the heat sink element 194 from one end, and fig. 2AF- (3) shows a perspective view of the heat sink element 194 from the opposite end. As shown in fig. 2AF- (2), the heat sink element includes a stepped via 198, wherein the stepped via 198 acts as the stepped via 120 to hold the laser diode in place. The stepped through-hole 198 includes an upper portion having a wider diameter and a lower portion that is narrower than the upper portion. When the laser diode 1 is inserted into the stepped through hole 198, the support plate of the laser diode rests on a stepped surface created between the upper and lower portions of the stepped through hole 198.

As shown in fig. 2AF- (2) and 2AF- (3), the heat sink element 194 is composed of a top cylindrical portion and a bottom cylindrical portion narrower than the top cylindrical portion. A stepped surface is created between the top and bottom cylindrical portions and when the heat sink element 194 is inserted into the first portion 192 of the heat sink module 191, the external stepped surface between the upper and lower portions of the heat sink element 191 rests against the top surface of the first portion 192 around the through hole 196. When the lower portion of the heat sink element 194 is inserted into the through-hole 197 in the second portion 193 of the heat sink module, the tip of the lower portion of the heat sink element 194 is flush against the outer surface of the second portion 193.

Fig. 2AG illustrates the assembled heat sink module 191 in a cut-away view at the location of heat sink element 194. As shown in fig. 2AG, when the first and second portions 192, 193 of the heatsink module are adhered together, a cavity is created between the first and second portions 192, 193. The through holes in the first portion and the through holes in the second portion of the heat sink module 191 are in corresponding positions such that an axis through a through hole in the first portion 192 and its corresponding through hole in the second portion 193 is perpendicular to the top surface of the first portion 192 and the bottom surface of the second portion 193. The islands and protrusions within the fluid chamber are arranged such that a continuous flow of cooling liquid is achieved from the inlet 104 to the outlet 105. Furthermore, the cooling fluid will reach the area of each set of through holes 120 (within the heat sink element 194) when flowing through the fluid chamber.

Fig. 2AG further illustrates the insertion of heat sink elements 194 into respective sets of through-holes in the first and second portions of heat sink module 191. The sidewalls of the lower portion of the heat sink element 194, the top wall and sidewalls of the first portion 192 of the heat sink module 191, and the second portion 193 of the heat sink module 191 together form a fully enclosed fluid channel through the heat sink module 191. In some embodiments, the boundaries between different components of heat sink module 191 are sealed such that leakage of cooling fluid is prevented.

As shown in fig. 2AG, the laser diode 1 is inserted into the through hole 198 in the heat sink element 194, and the support plate of the laser diode 1 rests on the stepped surface between the upper portion and the lower portion of the heat sink element 194.

Although not shown in fig. 2AF- (1) and 2AG, the bottom surface of the second portion 193 includes linear grooves that each link a corresponding sequence of vias 197 so that conductive pins from the laser diode 1 within the stepped via 198 of the heat sink element 194 may extend within the linear grooves and ultimately to the driver circuit layer on the side of the heat sink module 191.

Fig. 2BC illustrates another heat sink module 191' in accordance with some embodiments. The heat sink module 191 'is similar to the heat sink module 191 shown in fig. 2AD, except that the heat sink module 191' includes a through hole instead of a stepped through hole. Heat sink module 191 'is cooled with liquid within an enclosure created within heat sink module 191'. In some embodiments, the heat sink module 191' replaces other heat sink modules used in the laser array modules disclosed herein (e.g., heat sink modules 137', 139', 147', 149', 161, 162, or 166, etc.).

Fig. 2BC- (1) shows a perspective view of heat sink module 191 'from above, and fig. 2BC- (2) shows a perspective view of heat sink module 191' from below. As shown in fig. 2BC, heat sink module 191' is formed from a first portion 192 and a second portion 193 that are adhered together to create an enclosure in which cooling fluid may be circulated. The cooling liquid may enter the enclosure from an inlet 104 and exit the enclosure from an outlet 105 created on a side wall of the enclosure. Portions 192 and 193 are the same as those shown in fig. 2 AE.

As shown in fig. 2BC- (1), the first portion 192 of the heat sink module 191' includes an array of vias at locations corresponding to the locations of the array of laser diodes 1 in the laser array module. Within each of the through holes 196 (see fig. 2AE), a heat sink element 194' is inserted. The heat sink element 194' comprises a through hole 198' (see fig. 2BD- (1) and 2BD- (2)) which serves as a through hole 120' for accommodating the respective laser diode 1. As shown in FIG. 2BC- (2), the second portion 193 of the heat sink module 191 'includes an array of vias 197 (see FIG. 2AF- (1)), and the lower portions of the heat sink elements 194' are inserted into respective vias 197 in the second portion 193.

Fig. 2BD- (1) and 2BD- (2) illustrate heat sink elements 194' according to some embodiments. Fig. 2BD- (1) shows a perspective view of the heat sink element 194 'from one end, and fig. 2BD- (2) shows a perspective view of the heat sink element 194' from the opposite end. As shown in fig. 2BD- (1), the heat sink element comprises a through hole 198', wherein the through hole 198' acts as the through hole 120' to hold the laser diode in place. The through bore 198' includes an upper portion formed in the flat annular collar of element 194' and a lower portion formed in the long tubular portion of element 194 '. When the laser diode 1 is inserted into the through hole 198', the support plate of the laser diode rests on the flat annular collar of the element 194'.

As shown in fig. 2BD- (1) and 2BD- (2), the heat sink element 194' is composed of a top cylindrical portion (flat annular collar) and a bottom cylindrical portion narrower than the top cylindrical portion. The central through holes in the top and bottom portions of element 194' have the same diameter; a through hole is thus created between the top cylindrical portion and the bottom cylindrical portion. When the heat sink element 194' is inserted into the first portion 192 of the heat sink module 191', the exterior stepped surface between the upper and lower portions of the heat sink element 191' rests against the top surface of the first portion 192 around the through hole 196. When the lower portion of the heat sink element 194 'is inserted into the through-hole 197 in the second portion 193 of the heat sink module, the tip of the lower portion of the heat sink element 194' is flush against the outer surface of the second portion 193.

Fig. 2BE illustrates the assembled heat sink module 191 'in a cut-away view at the location of the heat sink element 194'. As shown in fig. 2BE, when the first and second portions 192, 193 of the heat sink module are adhered together, a cavity is created between the first and second portions 192, 193. The through holes in the first portion and the through holes in the second portion of the heat sink module 191' are in corresponding positions such that an axis through a through hole in the first portion 192 and its corresponding through hole in the second portion 193 is perpendicular to the top surface of the first portion 192 and the bottom surface of the second portion 193. The islands and protrusions within the fluid chamber are arranged such that a continuous flow of cooling liquid is achieved from the inlet 104 to the outlet 105. Furthermore, the cooling fluid will reach the area of each set of through holes 120 '(within the heat sink element 194') when flowing through the fluid chamber.

Fig. 2BE further illustrates that heat sink elements 194 'are inserted into respective sets of through holes in the first and second portions of heat sink module 191'. The sidewalls of the lower portion of heat sink element 194', the top wall and sidewalls of the first portion 192 of heat sink module 191, and the second portion 193 of heat sink module 191' together form a fully enclosed fluid channel through heat sink module 191 '. In some embodiments, the boundaries between the different components of the heat sink module 191' are sealed such that leakage of cooling fluid is prevented.

As shown in fig. 2BE, the laser diode 1 is inserted into a through hole 198' in the heat sink element 194', and the support plate of the laser diode 1 rests on the top surface of the flat collar of the heat sink element 194 '.

Although not shown in fig. 2AF- (1) and 2BE, the bottom surface of the second portion 193 includes linear grooves that each link a respective sequence of vias 197, such that conductive pins from the laser diode 1 within the vias 198' of the heat sink element 194' may extend within the linear grooves and ultimately to the driver circuit layer on the side of the heat sink module 191 '.

Further details of the heat sink module and its function and location in the laser array module are provided in other parts of the description and are not described here again.

Disclosed herein, a system (e.g., a laser array module, or a partially assembled laser array module) includes at least a heat sink module (e.g., any of heat sink modules 111, 137, 139, 147, 161, 166, 183, 187, and 191, and variations thereof as described herein) and a drive circuit module.

The heat sink module includes a respective top surface, a respective bottom surface opposite the respective top surface of the heat sink module, and a plurality of first stepped vias (e.g., stepped vias 120) linking the respective top surface and the respective bottom surface of the heat sink module. Each first stepped through-hole has a respective cylindrical upper portion and a respective cylindrical lower portion that is narrower than the respective cylindrical upper portion of said each first stepped through-hole, for example as shown in fig. 2E. The respective cylindrical upper portion and the respective cylindrical lower portion of each of the first stepped through holes (e.g., stepped through hole 120) are joined by a respective first annular surface that is substantially perpendicular to the respective cylindrical upper portion and lower portion of each of the first stepped through holes, as shown, for example, in fig. 2E. The respective bottom surfaces of the heat sink modules include a plurality of grooves (e.g., grooves 121). Each recess passes through a respective lower portion of a respective sequence of first stepped vias (e.g., stepped via 120) among the plurality of first stepped vias in the heatsink module, for example, as shown in fig. 2E- (2).

The drive circuit module includes a plurality of conductive pin connectors (e.g., conductive pin connectors 114, 116), and one or more electrical drive surfaces (e.g., drive circuit layers 118, 138) disposed substantially perpendicular to respective top and bottom surfaces of a heat sink module (e.g., any of heat sink modules 111, 137, 139, 147, 161, 166, 183, 187, 191, and so on), for example as shown in fig. 2B-2C, 2L-2M, 2R, 2T, and 2W.

Each conductive pin connector (e.g., conductive pin connectors 114, 116) is at least partially located within a respective one of the plurality of grooves (e.g., groove 121) in a respective bottom surface of the heat sink module. The plurality of conductive pin connectors includes an inner set of pin connectors (e.g., U-shaped conductive pin connector 114) and an outer set of pin connectors (e.g., L-shaped conductive pin connector 116). Each of the set of inner pin connectors links at least two of the first stepped through holes (e.g., stepped through hole 120) in the respective sequence of first stepped through holes traversed by a respective one of the plurality of recesses in the respective bottom surface of the heat sink module, e.g., as shown in 2H, 2J, 2K, 2L, 2Q, 2U, and 2W, etc.

Each of the set of external pin connectors (e.g., L-shaped conductive pin connectors 116) links at least one of the first stepped through holes in the respective sequence of first stepped through holes traversed by a respective one of the plurality of recesses (e.g., recess 121) in the respective bottom surface of the heat sink module to at least one of the one or more electrical drive surfaces (e.g., drive circuit layers 118, 138) of the drive circuit module disposed substantially perpendicular to the respective top and bottom surfaces of the heat sink module, e.g., as shown in 2H, 2J, 2K, 2L, 2Q, 2U, and 2W, etc.

In some embodiments, the system (e.g., laser array module) further includes a plurality of laser diodes (e.g., an array of laser diodes 1). Each of the plurality of laser diodes is disposed in a respective one of the plurality of first stepped vias in the heat sink module. Each laser diode includes a respective laser diode body (e.g., laser diode body 3), a respective set of electrically conductive pins (e.g., electrically conductive pins 4), and a respective electrically conductive support plate (e.g., support plate 2) disposed between the respective laser diode body and the respective set of electrically conductive pins of the each laser diode, for example as shown in fig. 2A.

A respective electrically conductive support plate (e.g., support plate 2) of each laser diode is disposed at least partially within a respective cylindrical upper portion of a respective one of the plurality of first stepped vias (e.g., stepped via 120) in the heat sink module and is supported by a respective first annular surface engaging the respective cylindrical upper and lower portions of the respective one of the plurality of first stepped vias, for example as shown in fig. 2H, 2U and 2W.

A respective set of conductive pins of each laser diode is disposed within a respective cylindrical lower portion of a respective one of the plurality of first stepped vias in the heat sink module, for example as shown in fig. 2H, 2U, and 2W.

In some embodiments, the driver circuit module includes a respective insulating tube (e.g., insulator tube 112) disposed within a respective cylindrical lower portion of each first stepped through-hole (e.g., stepped through-hole 120), for example as shown in fig. 2H, 2U, and 2W.

In some embodiments, each inner pin connector includes a U-shaped conductor (e.g., U-shaped conductive pin connector 114) having a first arm and a second arm connected by a linear body. Each of the first and second arms of the U-shaped conductor is disposed within a respective one of two first stepped through-holes connected by an inner pin connector, and the linear body is disposed within a respective groove through the two first stepped through-holes, for example as shown in fig. 2F, 2H, 2U, and 2W.

In some embodiments, the respective set of conductive pins of the respective laser diodes arranged includes a respective cathode pin, a respective anode pin, and (optionally) a respective ground pin, and wherein each U-shaped conductor connects the respective cathode pin of one laser diode to the respective anode pin of another laser diode along the plurality of laser diodes.

In some embodiments, each external pin connector includes an L-shaped conductor (e.g., L-shaped conductive pin connector 116) having a first leg and a second leg, with the first leg of the L-shaped conductor disposed within a respective first stepped via and the second leg disposed within a respective recess through the respective first stepped via and conductively connected to one of the one or more electrical drive surfaces of the drive circuit module, for example as shown in fig. 2F, 2H, 2U, and 2W.

In some embodiments, each L-shaped conductor connects a respective cathode pin or anode pin of one laser diode to one of the one or more electrical driving surfaces of the drive circuit module, e.g., as shown in fig. 2F, 2H, 2U, and 2W.

In some embodiments, the system further includes a cooling module (e.g., cooling module 102 or a cooling module integrated with a heat sink module). In some embodiments, the cooling module (e.g., cooling module 189) includes a plurality of cooling bars (e.g., bars 190) disposed between the top and bottom surfaces of a heat sink module (e.g., first portion 188 of heat sink module 187), and includes a heat spreader (e.g., second portion 189 of heat sink module 187) connected to a plurality of heating bars and disposed outside of the heat sink module (e.g., first portion 188 of heat sink module 187), for example as shown in fig. 2 AC.

In some embodiments, the heat sink module includes a plurality of interconnecting channels between the top and bottom surfaces of the heat sink module, for example as shown in fig. 2AA and 2AE, and the like. The plurality of interconnecting channels are configured to convey cooling liquid between an inlet and an outlet, and wherein the plurality of first stepped through holes (e.g., stepped through holes 120) are separated from the cooling liquid by respective metal tubes (e.g., heat sink elements 194) connecting top and bottom surfaces of a heat sink module (e.g., heat sink module 191), and inner surfaces of the plurality of first stepped through holes comprise inner surfaces of the metal tubes (e.g., heat sink elements 194), for example as shown in fig. 2 AG.

In some embodiments, the heat sink module includes a plurality of interconnection channels between a top surface and a bottom surface of the heat sink module, wherein the plurality of interconnection channels are configured to convey a cooling liquid between an inlet and an outlet, and wherein the plurality of first stepped vias are present within a row of solid material between the top surface and the bottom surface of the heat sink module (e.g., as shown in fig. 2AA- (1)).

In some embodiments, the system further includes a cooling tube (e.g., cooling tube 103) disposed between the top and bottom surfaces of the heat sink module for transporting a cooling liquid between the top and bottom surfaces of the heat sink module, e.g., as shown in fig. 2B, 2L, 2N, 2O, 2P, 2Q, 2R, 2S, 2T, and 2V, etc.

In some embodiments, the heat sink module includes a plurality of channels extending parallel to the plurality of grooves in the respective bottom surface of the heat sink module, and wherein the cooling tube includes a plurality of parallel segments disposed within the plurality of channels, and a plurality of turnaround segments each connecting a respective pair of adjacent parallel segments of the cooling tube, for example as shown in fig. 2B, 2L, 2N, 2O, 2P, 2Q, 2R, 2S, 2T, and 2V, and so forth.

In some embodiments, the plurality of channels are open channels in the top surface of the heatsink module, e.g., as shown in fig. 2O, 2P, and 2Q, etc.

In some embodiments, the plurality of channels are open channels in the bottom surface of the heatsink module, e.g., as shown in fig. 2B, 2L, and 2N, etc.

In some embodiments, the plurality of channels are internal channels disposed between the top and bottom surfaces of the heat sink module, for example as shown in fig. 2AA and 2AE, and so forth.

In some embodiments, the cooling tubes (e.g., cooling tube 103) pass through at least one of one or more electrical drive surfaces (e.g., drive circuitry layer 138) disposed substantially perpendicular to respective top and bottom surfaces of the heat sink module, for example as shown in fig. 2L.

In some embodiments, the cooling tubes (e.g., cooling tubes 103) do not pass through one or more electrical drive surfaces (e.g., drive circuitry layer 118) disposed substantially perpendicular to the respective top and bottom surfaces of the heat sink module, e.g., as shown in fig. 2B and 2R, etc.

In some embodiments, the system further comprises a cooling module. The cooling module includes a respective first surface, a respective second surface opposite the respective first surface of the cooling module, and one or more cooling channels embedded between the respective first surface and the respective second surface of the cooling module. For example, the cooling module may be integrated into a heat sink module, as shown in fig. 2AA and 2 AG. In some embodiments, such as when the cooling module is a separate layer from the heat sink module, the respective first surface of the cooling module is disposed against the heat sink module and in thermal contact with the bottom surface of the heat sink module.

In some embodiments, a cooling tube is disposed between the first and second surfaces of a cooling module (e.g., cooling module 102) for transporting a cooling liquid between the first and second surfaces of a heat sink module.

In some embodiments, the one or more cooling channels include a plurality of channels extending parallel to the plurality of grooves in the respective bottom surface of the heat sink module, and the cooling tube includes a plurality of parallel segments disposed within the plurality of channels, and a plurality of turn segments each connecting a respective pair of adjacent parallel segments of the cooling tube, for example as shown in fig. 2L.

In some embodiments, the plurality of channels are open channels in a top surface of the cooling module. In some embodiments, the plurality of channels are open channels in a bottom surface of the cooling module. In some embodiments, the plurality of channels are internal channels disposed between the top surface and the bottom surface of the cooling module.

In some embodiments, the system further includes a lens support module (e.g., lens base layer 110). The lens support modules include respective top surfaces, respective bottom surfaces opposite the respective top surfaces of the lens support modules, and a plurality of second stepped through holes (e.g., stepped through holes 119) linking the respective top surfaces and the respective bottom surfaces of the lens support modules (e.g., lens base layer 110), for example as shown in fig. 2D. Each second stepped through-hole (e.g., stepped through-hole 119) has a respective cylindrical upper portion and a respective cylindrical lower portion that is narrower than the respective cylindrical upper portion of said each second stepped through-hole, for example as shown in fig. 2D. The respective cylindrical upper portion and the respective cylindrical lower portion of each of the second stepped through holes are joined by a second annular surface that is substantially perpendicular to the respective cylindrical upper portion and lower portion of each of the second stepped through holes. Respective bottom surfaces of the lens support modules are disposed on respective top surfaces of the heatsink modules, and the plurality of second stepped through-holes in the lens support modules are aligned with the plurality of first stepped through-holes in the heatsink modules, e.g., as shown in fig. 2C, 2H, 2M, 2T, and 2V, etc.

In some embodiments, for each laser diode having its respective electrically conductive support plate at least partially disposed within a respective one of the plurality of first stepped vias in the heat sink module, its respective laser diode body is disposed within a respective cylindrical lower portion of a respective one of the plurality of second stepped vias in the lens support module aligned with the respective one of the plurality of first stepped vias in the heat sink module, e.g., as shown in fig. 2H, 2U, and 2W, etc.

In some embodiments, a respective lens (e.g., lens 108) is disposed at least partially within a respective upper portion of each of the plurality of second stepped vias (e.g., stepped via 119) in the lens support module (e.g., lens base layer 110), wherein the respective lens is separated from the laser diode body in a respective lower portion of said each second stepped via by a respective gap, e.g., as shown in fig. 2H- (2), 2U, and 2W, etc.

In some embodiments, the lens support module includes a top plate (e.g., top plate 176) and a bottom plate (e.g., bottom plate 178) coupled to the top plate. The top plate includes a plurality of first holes (e.g., through-hole 177) forming respective cylindrical upper portions of the plurality of second stepped through-holes (e.g., stepped through-hole 119), and the bottom plate includes a plurality of second holes (e.g., through-hole 179) forming respective cylindrical lower portions of the plurality of second stepped through-holes (e.g., stepped through-hole 119), for example as shown in fig. 2X.

In some embodiments, the system further includes a lens module disposed on a top surface of the heat sink module, the lens module including a planar surface (e.g., base 181) having a plurality of lens domes (e.g., lens dome 180) thereon, wherein the plurality of lens domes are aligned with the plurality of first stepped vias (e.g., stepped via 120) in the heat sink module, for example as illustrated in fig. 2Y.

In some embodiments, a system (a dual sided laser array module or a portion thereof) includes a cooling module, a first heat sink module, a first plurality of laser diodes, a first drive circuit module, a second heat sink module, a second plurality of laser diodes, and a second drive circuit module.

The cooling module has a first side and a second side opposite the first side, and a cooling mechanism disposed between the first and second sides of the cooling module. The first heat sink module has a respective top surface, a respective bottom surface opposite the respective top surface of the first heat sink module, and a respective plurality of first vias (e.g., stepped vias 120) linking the respective top and bottom surfaces of the first heat sink module. The respective bottom surface of the heat sink module is arranged against said first side of the cooling module.

Each of the first plurality of laser diodes includes a respective diode body, a respective set of conductive pins, and a respective support plate between the respective diode body and the respective set of conductive pins. Each of the first plurality of laser diodes is disposed at least partially within a respective one of a respective plurality of first vias in the first heat sink module, with the respective diode body disposed against a respective top surface of the first heat sink module and the respective set of conductive pins disposed against a bottom surface of the first heat sink module.

The first drive circuit module includes a respective plurality of conductive pin connectors and a respective one or more electrical drive surfaces. The respective one or more electrical drive surfaces of the first drive circuit module are disposed substantially perpendicular to the respective top and bottom surfaces of the first heat sink module. A respective plurality of conductive pin connectors of a first drive circuit module connect the respective set of conductive pins of the first plurality of laser diodes to respective one or more electrical drive surfaces of the first drive circuit module.

The second heat sink module has a respective top surface, a respective bottom surface opposite the respective top surface of the second heat sink module, and a respective plurality of first vias (e.g., stepped vias 120) connecting the respective top and bottom surfaces of the second heat sink module. The respective bottom surfaces of the heat sink modules are disposed against the second side of the cooling module.

Each of the second plurality of laser diodes includes a respective diode body, a respective set of conductive pins, and a respective support plate between the respective diode body and the respective set of conductive pins. Each of the second plurality of laser diodes is disposed at least partially within a respective one of a respective plurality of first vias (stepped vias 120) in the second heat sink module, with the respective diode body disposed against a respective top surface of the second heat sink module and the respective set of conductive pins disposed against a bottom surface of the second heat sink module.

The second drive circuit modules include respective pluralities of electrically conductive pin connectors and respective one or more electrical drive surfaces. The respective one or more electrical drive surfaces of the second drive circuit module are disposed substantially perpendicular to the respective top and bottom surfaces of the second heat sink module. A respective plurality of conductive pin connectors of a second drive circuit module connect the respective set of conductive pins of the second plurality of laser diodes to a respective one or more electrical drive surfaces of a second drive circuit module.

In various embodiments, the system (e.g., the two-sided laser array modules 157, 162, 169, etc.) further includes features described elsewhere in this specification.

In some embodiments, a system (e.g., a two-sided laser array module) includes a heat sink module (e.g., heat sink modules 161, 166), a first plurality of laser diodes, a second plurality of laser diodes, and a drive circuit module. The heat sink module has a respective top surface, a respective bottom surface opposite the respective top surface of the heat sink module, a first plurality of first vias (e.g., stepped vias 120-1) linking the respective top and bottom surfaces of the heat sink module, and a second plurality of second vias (e.g., stepped vias 120-2) linking the respective top and bottom surfaces of the heat sink module. The first plurality of first vias is arranged according to a first grid pattern and the second plurality of first vias is arranged according to a second grid pattern, and the first and second grid patterns are offset from each other, for example as shown in fig. 2T and 2V.

Each of the first plurality of laser diodes includes a respective diode body, a respective set of conductive pins, and a respective support plate between the respective diode body and the respective set of conductive pins. Each of the first plurality of laser diodes is disposed at least partially within a respective one of the first plurality of first vias in the heat sink module, with the respective diode body disposed against a respective top surface of the heat sink module and the respective set of conductive pins disposed against a respective bottom surface of the heat sink module.

Each of the second plurality of laser diodes includes a respective diode body, a respective set of conductive pins, and a respective support plate between the respective diode body and the respective set of conductive pins, wherein each of the second plurality of laser diodes is disposed at least partially within a respective one of a second plurality of first vias in a heat sink module, wherein the respective diode body is disposed against a respective bottom surface of the heat sink module and the respective set of conductive pins is disposed against a respective top surface of the heat sink module.

The drive circuit module (e.g., a module including drive circuit layer 118, conductive pin connectors 114 and 116, and insulator tube 112) includes a respective plurality of conductive pin connectors and a respective one or more electrical drive surfaces. The respective one or more electrical drive surfaces of the drive circuit module are disposed substantially perpendicular to the respective top and bottom surfaces of the heat sink module. A first subset of conductive pin connectors among a respective plurality of conductive pin connectors of a drive circuit module connects a respective set of conductive pins of the first plurality of laser diodes to a respective one or more electrical drive surfaces of a first drive circuit module. A second subset of conductive pin connectors among a respective plurality of conductive pin connectors of a drive circuit module connects a respective set of conductive pins of the second plurality of laser diodes to a respective one or more electrical drive surfaces of the drive circuit module.

In various embodiments, the system (e.g., the two-sided laser array modules 162, 169, etc.) further includes features described elsewhere in this specification.

In some embodiments, through-holes without steps along the body of the through-hole are used in the heat sink module and/or the lens array support module instead of stepped through-holes. As described in fig. AI to BC, various combinations of stepped through holes and through holes in the heat sink module and the lens array support substrate bring about different configurations of the laser array module. In some embodiments, a system includes a heatsink module (e.g., any of the heatsink modules shown in fig. 2B-2C, 2H, 2L-2Q, and 2Z, 2AC, 2AD, 2AH, 2AI, 2 AM-2 AS, 2 AT-2 AX, 2AZ, 2BB, 2BC, and variations thereof AS described herein) and a driver circuit module. The heat sink module includes a respective top surface, a respective bottom surface opposite the respective top surface of the heat sink module, and a plurality of first vias linking the respective top surface and the respective bottom surface of the heat sink module, and the respective bottom surface of the heat sink module includes a plurality of grooves, wherein each groove passes through a respective lower portion of a respective sequence of first vias among the plurality of first vias in the heat sink module. The driver circuit module includes a plurality of electrically conductive pin connectors, and one or more electrically driven surfaces disposed substantially perpendicular to respective top and bottom surfaces of the heat sink module, each electrically conductive pin connector at least partially within a respective one of the plurality of recesses in the respective bottom surface of the heat sink module, the plurality of electrically conductive pin connectors including a set of internal pin connectors and a set of external pin connectors, each of the set of internal pin connectors linking at least two of the first vias of the respective sequence of first vias traversed by a respective one of the plurality of recesses in the respective bottom surface of the heat sink module, and each of the set of external pin connectors linking at least one of the first vias of the respective sequence of first vias traversed by a respective one of the plurality of recesses in the respective bottom surface of the heat sink module to a respective one of the heat sink module At least one of the one or more electrical driving surfaces of the driving circuit module disposed against the top surface and the bottom surface.

In some embodiments, the system further includes a plurality of laser diodes, wherein each of the plurality of laser diodes is disposed in a respective one of the plurality of first vias in the heat sink module, the each laser diode includes a respective laser diode body, a respective set of conductive pins, and a respective conductive support plate disposed between the respective laser diode body and the respective set of conductive pins of the each laser diode, the respective conductive support plate of the each laser diode is disposed on the top surface of the heat sink module, and the respective set of conductive pins of the each laser diode is disposed within a respective one of the plurality of first vias in the heat sink module.

In some embodiments, the driving circuit module includes a respective insulating tube disposed within each first through hole.

In some embodiments, each inner pin connector includes a U-shaped conductor having a first arm and a second arm connected by a linear body, wherein each of the first and second arms of the U-shaped conductor is disposed within a respective one of two first vias connected by the inner pin connector, and the linear body is disposed within a respective groove through the two first vias.

In some embodiments, the respective set of conductive pins of the respective laser diodes provided includes a respective cathode pin and a respective anode pin, and wherein each U-shaped conductor connects the respective cathode pin of one laser diode to the respective anode pin of another laser diode along the plurality of laser diodes.

In some embodiments, each external pin connector includes an L-shaped conductor having a first leg and a second leg, wherein the first leg of the L-shaped conductor is disposed within a respective first via and the second leg is disposed within a respective groove that passes through the respective first via and is conductively connected to at least one of the one or more electrical drive surfaces of the drive circuit module.

In some embodiments, each L-shaped conductor connects a respective cathode pin or anode pin of one laser diode to at least one of the one or more electrical driving surfaces of the drive circuit module.

In some embodiments, the system further includes a cooling module, wherein the cooling module includes a plurality of cooling rods disposed between the top surface and the bottom surface of the heat sink module, and includes a heat spreader connected to the plurality of heating rods and disposed outside of the heat sink module.

In some embodiments, the heat sink module includes a plurality of interconnection channels between a top surface and a bottom surface of the heat sink module, wherein the plurality of interconnection channels are configured to convey cooling liquid between an inlet and an outlet, and wherein the plurality of first vias are separated from the cooling liquid by respective metal tubes connecting the top surface and the bottom surface of the heat sink module, and inner surfaces of the plurality of first vias comprise inner surfaces of the metal tubes.

In some embodiments, the system includes a cooling tube disposed between the top and bottom surfaces of the heat sink module for transporting a cooling liquid between the top and bottom surfaces of the heat sink module.

In some embodiments, the heat sink module includes a plurality of channels extending parallel to the plurality of grooves in the bottom surface of the heat sink module, and wherein the cooling tube includes a plurality of parallel segments disposed within the plurality of channels, and a plurality of turnaround segments each connecting a respective pair of adjacent parallel segments of the cooling tube. In some embodiments, the plurality of channels are open channels in the top surface of the heat sink module. In some embodiments, the plurality of channels are open channels in the bottom surface of the heat sink module. In some embodiments, the plurality of channels are internal channels disposed between the top surface and the bottom surface of the heat sink module.

In some embodiments, the heat sink module includes a plurality of interconnection channels between a top surface and a bottom surface of the heat sink module, wherein the plurality of interconnection channels are configured to convey a cooling liquid between an inlet and an outlet, and wherein the plurality of first vias are present within a row of solid material between the top surface and the bottom surface of the heat sink module.

In some embodiments, the cooling tube passes through at least one of the one or more electrically driven surfaces disposed substantially perpendicular to the respective top and bottom surfaces of the heat sink module.

In some embodiments, the cooling tubes do not pass through one or more electrically driven surfaces disposed substantially perpendicular to the respective top and bottom surfaces of the heat sink module.

In some embodiments, the system includes a cooling module, wherein the cooling module includes a respective first surface, a respective second surface opposite the respective first surface of the cooling module, and one or more cooling channels embedded between the respective first surface and the respective second surface of the cooling module, and the respective first surface of the cooling module is disposed against the heat sink module and in thermal contact with the bottom surface of the heat sink module. In some embodiments, the system includes a cooling tube disposed between the first and second surfaces of the cooling module for conveying a cooling liquid between the first and second surfaces of the heat sink module.

In some embodiments, the one or more cooling channels include a plurality of channels extending parallel to the plurality of grooves in the respective bottom surface of the heat sink module, and wherein the cooling tube includes a plurality of parallel segments disposed within the plurality of channels, and a plurality of turnaround segments each connecting a respective pair of adjacent parallel segments of the cooling tube. In some embodiments, the plurality of channels are open channels in a top surface of the cooling module. In some embodiments, the plurality of channels are open channels in a bottom surface of the cooling module. In some embodiments, the plurality of channels are internal channels disposed between the top surface and the bottom surface of the cooling module.

In some embodiments, the system includes a lens support module (e.g., any of the lens array base layers shown in fig. 2B-2D, 2H, 2L-2M, and 2X-2Y and variations thereof as described herein), wherein: the lens support module includes a respective top surface, a respective bottom surface opposite the respective top surface of the lens support module, and a plurality of second through holes linking the respective top surface and the respective bottom surface of the lens support module, and the respective bottom surface of the lens support module is disposed above the top surface of the heat sink module, and the plurality of second through holes in the lens support module are aligned with the plurality of first through holes in the heat sink module.

In some embodiments, each laser diode has its respective laser diode body disposed at least partially within a respective lower portion of a respective one of the plurality of second vias in the lens support module.

In some embodiments, a respective lens is disposed at least partially within a respective upper portion of each of the plurality of second through holes in the lens support module, wherein the respective lens is separated from the laser diode body in a respective lower portion of the each second through hole by a respective gap.

In some embodiments, the lens support module comprises a top plate and a bottom plate bonded to the top plate, and wherein the top plate includes a plurality of first holes forming respective cylindrical upper portions of the plurality of second through holes, and the bottom plate includes a plurality of second holes forming respective cylindrical lower portions of the plurality of second through holes.

In some embodiments, the system includes a lens module disposed over a top surface of the heat sink module, the lens module including a planar surface having a plurality of lens domes thereon, wherein the plurality of lens domes are aligned with the plurality of first through holes in the heat sink module.

In some embodiments, the first through-hole is a through-hole having no steps along the respective body of the first through-hole. In some embodiments, the second through-hole is a through-hole having no steps along the respective body of the second through-hole. In some embodiments, the diameter of each first via is less than the diameter of the support plate of the corresponding laser diode having its conductive pin disposed within said each first via. In some embodiments, the diameter of each second via is greater than the diameter of the support plate of the corresponding laser diode.

In the above detailed description, numerous specific details are set forth in order to provide a thorough understanding of various described embodiments. It will be apparent, however, to one skilled in the art that the various described embodiments may be practiced without these specific details. In other instances, well-known methods, procedures, components, circuits, and networks have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.

It will also be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first lens array may be referred to as a second lens array, and similarly, the second lens array may be referred to as a first array, without departing from the scope of the various described embodiments. The first lens array and the second lens array are both lens arrays, but they are not identical lens arrays unless the context clearly indicates otherwise.

The terminology used in the description of the various described embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description of the various described embodiments and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

The use of terms such as "front," "back," "top," "bottom," "left," "right," "upper," "over," and "under" throughout the description and claims is used to describe the relative positions of various components of the systems described herein as well as the relative positions of various portions of various components. Similarly, the use of any horizontal or vertical term throughout the specification and claims is used to describe the relative orientation of various components of the systems described herein as well as the relative orientation of various portions of the various components. Unless a relative orientation or position set forth below is expressly stated in the description for a particular component, system, or apparatus, the use of these terms does not imply any particular position or orientation of the system, apparatus, component, or portion thereof relative to: (1) the direction of the earth's gravity, (2) the earth's ground or ground surface, (3) the direction that the system, apparatus, or particular component thereof may have in actual manufacture, use, or transportation; or (4) the surface upon which the system, device, or specific components thereof may be disposed during actual manufacture, use, or transportation.

A number of embodiments of the present invention have been described above. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the invention. For example, some process steps may be performed in a different order, modified or omitted. The layout and configuration of the vibrating elements, electrodes, and electrical connections may be varied.

The foregoing description has been provided with reference to specific embodiments. However, the illustrative discussions above are not intended to be exhaustive or to be limited to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles disclosed and its practical application, to thereby enable others to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated.