阅读说明：本技术 有机溶剂的处理方法及处理材料 (Method for treating organic solvent and treatment material ) 是由 藤村侑 川胜孝博 田中洋一 于 2020-03-10 设计创作，主要内容包括：一种有机溶剂的处理方法,从电子部件制造工序中使用的有机溶剂中去除微粒,所述有机溶剂的处理方法的特征在于,包括使处理材料与所述有机溶剂接触的工序,所述处理材料是在水中具有正电荷或负电荷且含水率为3质量％以上的处理材料。一种面向电子部件制造工序的有机溶剂处理材料,通过与电子部件制造工序中使用的有机溶剂接触从而从有机溶剂中去除微粒,所述有机溶剂处理材料在水中具有正电荷或负电荷。(A method for treating an organic solvent, which removes fine particles from an organic solvent used in a process for producing an electronic component, is characterized by comprising a step of bringing a treatment material into contact with the organic solvent, wherein the treatment material has a positive or negative charge in water and has a water content of 3 mass% or more. An organic solvent-treated material for an electronic component production process, which removes fine particles from an organic solvent used in the electronic component production process by contacting the material with the organic solvent, wherein the organic solvent-treated material has a positive or negative charge in water.)

1. A method for treating an organic solvent, which removes fine particles from the organic solvent used in the process of manufacturing an electronic component,

the method comprises a contact step of bringing a treatment material, which has a positive or negative charge in water and has a water content of 3 mass% or more, into contact with the organic solvent.

2. The method for treating an organic solvent according to claim 1, wherein,

Adding ultrapure water to the organic solvent prior to the contacting step.

3. The method for treating an organic solvent according to claim 1, wherein,

as the treatment material, a treatment material treated by contacting with water is used.

4. The method of treating an organic solvent according to any one of claims 1 to 3,

the treatment material is composed of a polymer having anion exchange groups.

5. The method of treating an organic solvent according to any one of claims 1 to 3,

the treatment material is constituted by an anion exchange membrane.

6. The method for treating an organic solvent according to claim 4,

the treatment material is in the form of fibers.

7. The method of treating an organic solvent according to any one of claims 1 to 4,

the treatment material is composed of ion exchange fibers.

8. An organic solvent-treated material for use in an electronic component manufacturing process, wherein,

the organic solvent-treated material removes fine particles from an organic solvent used in an electronic component manufacturing process by contacting the organic solvent-treated material with the organic solvent, the organic solvent-treated material having a positive or negative charge in water.

Technical Field

The present invention relates to a processing method and a processing material for removing fine particles from an organic solvent used in an electronic component manufacturing process.

Background

In recent years, with the development of semiconductor manufacturing processes, particle management in water has become more stringent, and for example, in the International Technology Roadmap for semiconductor Technology (ITRS) < 1000/L is required as a guaranteed value of a particle diameter >11.9nm in 2019. In this connection, although a clear particle management is not set for removing particles in a solvent used in semiconductor manufacturing, such as ultrapure water, a solvent having a small surface tension is used in wafer cleaning to prevent pattern collapse in association with miniaturization of a semiconductor structure. As a result, there is an increasing need to remove fine particles and the like in the solvent.

As a method for removing fine particles from an organic solvent, a distillation method has been conventionally employed (patent document 1 and patent document 2). In addition, filtration of the organic solvent with a filter is also employed (patent document 3).

Patent document 4 describes that not only distillation but also contact with an ion exchange resin (cationic resin, anionic resin, or a mixture thereof) is performed to remove fine particles from isopropyl alcohol.

Patent document 5 describes that an anion-adsorbing membrane having an anion-exchange group is brought into contact with water in order to reduce the concentration of silica in ultrapure water.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 58-211000

Patent document 2: japanese patent laid-open publication No. 2016-30233

Patent document 3: japanese laid-open patent publication No. 2-119901

Patent document 4: japanese Kokai publication Hei-2003-535836

Patent document 5: japanese laid-open patent publication No. 10-216721

Disclosure of Invention

Problems to be solved by the invention

The invention aims to provide an organic solvent processing method and a processing material, which can remove particles from an organic solvent used in an electronic component manufacturing process.

Means for solving the problems

The method for treating an organic solvent used in an electronic component manufacturing process of the present invention includes: and a contact step of bringing a treatment material, which has a positive or negative charge in water and has a water content of 3 mass% or more, into contact with the organic solvent.

In one embodiment of the present invention, ultrapure water is added to the organic solvent before the contacting step.

In one aspect of the present invention, a treatment material treated by contacting water is used as the treatment material.

In one embodiment of the present invention, the treatment material is composed of a polymer having an anion exchange group.

In one aspect of the present invention, the treatment material is in the form of fibers.

The treatment material of the present invention is an organic solvent treatment material for removing fine particles from an organic solvent used in an electronic component production process by contacting the material with the organic solvent, and the treatment material has a positive charge or a negative charge in water.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the treatment method and the treatment material of the present invention, the fine particles in the organic solvent can be adsorbed to the treatment material and removed.

Detailed Description

The present invention will be described in more detail below.

In the method of the present invention, an organic solvent used in the electronic component production process is brought into contact with a treatment material having a positive or negative charge in water and a water content of 3 mass% or more in a liquid state to remove fine particles. The fine particles include various inorganic fine particles or organic fine particles, particularly fine particles having a negative charge or a positive charge, in addition to silica fine particles.

In one embodiment of the present invention, a treatment material that has been contacted with water before being contacted with an organic solvent is used as the treatment material.

In another aspect of the present invention, after ultrapure water is added to an organic solvent, the organic solvent is brought into contact with the treatment material.

The treatment material is preferably composed of a polymer to which a cation exchange group or an anion exchange group is imparted.

Examples of the polymer include polyolefins such as polyethylene and polypropylene, polyethers such as polyethylene oxide and polypropylene oxide, fluorine resins such as Polytetrafluoroethylene (PTFE), Chlorotrifluoroethylene (CTFE), Perfluoroalkoxy (PFA) and Polyvinylidene Fluoride (PVDF), halogenated polyolefins such as polyvinyl chloride, polyamides such as nylon-6 and nylon-66, urea resins, phenol resins, melamine resins, polystyrene, cellulose and cellulose acetate, cellulose nitrate, polyether ketone, polyether ether ketone, polysulfone, polyether sulfone, polyimide, polyether imide, polyamide imide, polybenzimidazole, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, polyacrylonitrile, polyether nitrile, polyvinyl alcohol, and copolymers thereof, but is not limited thereto. The material is not particularly limited to one, and various materials can be selected as needed. However, it must have resistance to organic solvents.

When the polymer is imparted with ion exchange capability, examples of the ion exchange group include, but are not limited to, a sulfonic acid group, a phosphoric acid group, a phosphonic acid group, a phosphinic acid group, a carboxylic acid group, a hydroxyl group, a phenol group, a quaternary ammonium group, a primary to tertiary amine group, a pyridyl group, and an amide group. These functional groups may be not only H type, OH type, but also salt type such as Na type. In the present invention, a filament having at least one of these functional groups introduced therein may be used, and a plurality of filaments having different ion exchange groups introduced therein may be used to form a composite filter having different ion exchange groups.

The method of introducing the functional group varies depending on the material of the polymer, and an appropriate method is selected. For example, in the case of polystyrene, a sulfonic acid group can be introduced by adding an appropriate amount of paraformaldehyde to a sulfuric acid solution and heating for crosslinking. In the case of polyvinyl alcohol, functional groups can be introduced by allowing trialkoxysilyl groups, trichlorosilane groups, epoxy groups, or the like to act on hydroxyl groups or the like. When the functional group cannot be directly introduced depending on the material, the target functional group can be introduced through an introduction operation of 2 or more stages, in which a monomer having high reactivity (referred to as a reactive monomer) such as styrene is first introduced and then the functional group is introduced. Examples of the reactive monomer include, but are not limited to, glycidyl methacrylate, styrene, chloromethylstyrene, acrolein, vinylpyridine, and acrylonitrile. The functional group may be introduced before the nanofiber is formed, or may be introduced by coating or kneading a substance obtained by dissolving or finely pulverizing a polymer or resin having ion exchange ability at the time of fiber bundling, or by binding them by a chemical reaction.

The form of the treatment material may be any of a fiber form, a hollow fiber form, and the like, in addition to a planar membrane. The treatment material may also be a porous membrane.

By contacting the treatment material with water before contacting it with the organic solvent, the particulate removal performance of the treatment material can be improved. Thus, it is preferable that the treatment of bringing the treatment material into contact with water (ultrapure water) is performed when the organic solvent to be treated is an organic solvent to which 100% of ultrapure water is not added. In the present invention, a treatment in which a treatment material is brought into contact with ultrapure water and then the treatment material is brought into contact with an organic solvent to be treated may be referred to as a water contact treatment hereinafter.

For the water contact treatment, for example, after a treatment material and ultrapure water are stored in a vessel and brought into contact with each other, an organic solvent for a predetermined treatment is injected into the vessel, and the organic solvent is discharged. Alternatively, the column may be filled with the treating material, and after ultrapure water is circulated, the organic solvent to be treated may be circulated. In the latter case, the organic solvent may be continuously flowed as it is and transferred to the organic solvent treatment step.

In order to bring the treatment material into contact with an organic solvent or an organic solvent to which ultrapure water is added (hereinafter, sometimes referred to as an organic solvent or the like), in addition to a method of introducing the treatment material into a container containing the organic solvent or the like and immersing the treatment material, a method of circulating the organic solvent or the like through a column containing the treatment material, or a method of bringing the treatment material into contact with a porous membrane in a state where the organic solvent or the like is allowed to permeate therethrough, may be mentioned, but the method is not limited thereto.

The organic solvent used in the process for producing an electronic component to be processed in the present invention is not particularly limited, and representative examples thereof include the following solvents. Alcohols such as methanol, ethanol and isopropanol; halogenated hydrocarbons such as dichloromethane, chloroform, carbon tetrachloride, trichloroethylene, tetrachloroethylene, 1,1, 1-trichloroethane, chlorofluorocarbon 113, chlorobenzene, o-dichlorobenzene, m-dichlorobenzene, p-dichlorobenzene, o-chlorotoluene, m-chlorotoluene, p-chlorotoluene, and the like; ethers such as diethyl ether; epoxies such as Propylene Oxide (PO) and Butylene Oxide (BO); hydrocarbons such as hexane, cyclohexane, benzene, toluene, and xylene; ketones such as acetone, Methyl Ethyl Ketone (MEK), and methyl isobutyl ketone (MIBK); esters such as ethyl acetate, N-propyl, isopropyl, N-butyl, sec-butyl, and tert-butyl, and N-methyl-2-pyrrolidone (NMP).

The present invention is particularly suitable for treatment of an organic solvent used in a semiconductor production process such as isopropyl alcohol (IPA) (hereinafter, sometimes referred to as IPA) or N-methyl-2-pyrrolidone (NMP).

When the organic solvent to which the ultrapure water is added is brought into contact with the treatment material to remove the fine particles in the organic solvent, the ultrapure water is preferably added so as to be 5 to 80 mass%, particularly 5 to 50 mass% with respect to the total amount of the solvent (the total amount of the organic solvent and the ultrapure water), but the amount is not limited thereto.

[ examples ]

Hereinafter, examples and comparative examples will be described.

In the following examples 1 to 4 and comparative example 1, the following IPA-based test liquids were brought into contact with the following treatment materials by the following contact method 1.

< test solution >

Test solution 1: to IPA (high purity IPA manufactured by Kanto chemical Co., Ltd.) was added 50mg/L of silica fine particles (Sicastar manufactured by Corefront (Corefront) Co., Ltd.: particle diameter: 30 nm).

Test solution 2: mixing the IPA and ultrapure water in a ratio of 50: 50, and adding the silica fine particles in the above amount.

< treatment of Material >

Treatment of the material A: dimethylaminoethyl methacrylate (DMAEMA) fibers 20m (7.7g), manufactured by environmental cleanup research

Treatment of material B: the anion exchange membrane AHA manufactured by Astom (astom) corporation is about 30cm × 20cm in thickness 220 μm (16 g in wet state)

< contact method >

The treatment material was filled in a polyethylene container (250mL capacity), and 100mL of the test solution was injected and immersed for 30 minutes.

Examples 1 to 4, comparative examples 1 and 2

The test solution 1 or the test solution 2 was brought into contact with each of the treatment materials treated in the following manner according to the contact method 1. The silica concentration after the contact was measured by molybdenum absorptiometry, and the silica removal rate was calculated. The results are shown in Table 1.

Example 1: the treatment Material A (used without treatment)

Example 2: the treatment material B (used as it is without treatment)

Example 3: the treatment material B and 100mL of ultrapure water were placed in a polyethylene container (250mL capacity), immersed for 30 minutes, and the ultrapure water was discharged to thereby obtain a water-contact treatment product

Example 4: the treatment Material A (used without treatment)

Comparative example 1: a dried product obtained by drying the treatment Material A at 110 ℃ for 24 hours

Comparative example 2: a dried product obtained by drying the treatment material B at 110 ℃ for 24 hours

TABLE 1

Method for calculating moisture content of color filter

Water content [1- (weight of treated material after drying treatment/weight of treated material before drying treatment) ] × 100 (%)

[ examination ]

In examples 1 and 2 in which the water content was adjusted to 3% or more, a better silica removal rate was obtained than in comparative examples 1 and 2.

If the water content of the treated material is further increased (example 3), a higher silica removal rate can be obtained.

In addition, by adding ultrapure water to IPA, a very good silica removal rate can be obtained even if water conditioning is not performed on the treatment material a.

[ reference examples 1 to 3]

The treatment materials A and B were brought into contact with ultrapure water to which silica fine particles were added (the amount of silica fine particles added was 50. mu.g/L) by the contact method 1, and the silica removal rate was determined.

The results are shown in Table 2.

TABLE 2

(test solution: ultrapure Water containing silica microparticles)

No.	Treatment material	Silica removal (%)
			Reference example 1	Treatment Material A (for direct use)	99
Reference example 2	Treatment Material B (for direct use)	78

The present invention has been described in detail with reference to specific embodiments, but it is apparent to those skilled in the art that various changes can be made without departing from the spirit and scope of the invention.

The present application is based on japanese patent application 2019-.