阅读说明：本技术 一种芯片底部填充胶装置 (Chip bottom glue filling device ) 是由 黄春跃 刘首甫 谢俊 魏维 于 2021-09-17 设计创作，主要内容包括：本发明公开了一种芯片底部填充胶装置,包括底座,底座的一端设有传动机构,另一端设有充胶工作台,充胶工作台的一端与底座活动连接,充胶工作台的另一端与设置在底座上的升降机构连接,在升降机构与传动机构之间的底座是还设有支撑挡板,充胶针设在充胶工作台的上方通过伸缩机构与支撑挡板连接,传动机构为升降机构提供动力使升降机构推动充胶工作台的升降。该装置充胶均匀,利用填充胶的自身重力,加快的底部填充胶的流动速率,进而提高芯片的填充效率,采用排列式的充胶针头,提高了充胶的连续性,降低气泡与空洞的产生。(The invention discloses a chip bottom glue filling device which comprises a base, wherein one end of the base is provided with a transmission mechanism, the other end of the base is provided with a glue filling workbench, one end of the glue filling workbench is movably connected with the base, the other end of the glue filling workbench is connected with a lifting mechanism arranged on the base, the base between the lifting mechanism and the transmission mechanism is also provided with a supporting baffle plate, a glue filling needle is arranged above the glue filling workbench and is connected with the supporting baffle plate through a telescopic mechanism, and the transmission mechanism provides power for the lifting mechanism to enable the lifting mechanism to push the glue filling workbench to lift. The device fills gluey even, utilizes the self gravity of filling gluey for the bottom filling gluey flow rate of speed, and then improves the packing efficiency of chip, adopts the gluey syringe needle of filling of range formula, has improved the continuity of filling gluey, reduces bubble and hollow production.)

1. The utility model provides a mucilage binding is filled to chip bottom, a serial communication port, the on-line screen storage device comprises a base, the one end of base is equipped with drive mechanism, the other end is equipped with fills gluey workstation, fill the one end and the base swing joint of gluey workstation, the other end that fills gluey workstation is connected with the elevating system who sets up on the base, base between elevating system and drive mechanism still is equipped with supporting barrier, it establishes to fill gluey needle and passes through telescopic machanism and supporting barrier in the top of filling gluey workstation to be connected, drive mechanism makes elevating system promote the lift of filling gluey workstation for elevating system provides power.

2. The device according to claim 1, wherein the glue filling table comprises a bottom plate, the bottom plate is provided with positioning protrusions, an assembled chip circuit board with glue to be filled at the bottom is detachably fixed in the middle of the bottom plate and clamped on the positioning protrusions, two sides of the circuit board are fixed on the bottom plate through circuit board fixing mechanisms, three sides of the chip are respectively surrounded by the glue filling baffle plates, the back surface of each glue filling baffle plate is connected with one end of the baffle long rod through a hinge, the other end of the baffle long rod is connected with the slider guide rail mechanism, the slider guide rail mechanism is fixed on the bottom plate, and the needle head of the glue filling needle is aligned with the side where the chip is not surrounded.

3. The device according to claim 2, wherein the glue filling needle is a row-type glue filling needle.

4. The device as claimed in claim 1, wherein the slide block guide mechanism comprises a guide plate, a slide seat is disposed on the guide plate, a hinge structure is disposed on the slide seat, the hinge structure is movably connected to one end of the long bar, and the long bar is pulled by the hinge structure through sliding of the slide seat on the guide plate, so as to drive the glue filling baffle plate and adjust the degree of adhesion between the glue filling baffle plate and the chip.

5. The die underfill apparatus according to claim 4, wherein the hinge structure comprises a primary hinge structure and a secondary hinge structure, the primary hinge structure is disposed on the slider, and the secondary hinge structure is disposed on the primary hinge structure.

6. The device for filling the adhesive on the bottom of the chip as claimed in claim 1, wherein the elevating mechanism comprises a screw groove fixed on the base, a screw shaft is arranged in the screw groove, a slide block is arranged on the screw shaft, the slide block is movably connected with one end of a long supporting rod, and the long supporting rod is movably connected with the bottom of the bottom plate of the adhesive filling worktable.

7. The device for filling the adhesive at the bottom of the chip according to claim 1, wherein the transmission mechanism comprises a stepping motor, an output shaft of the stepping motor is connected with a first transmission shaft through a coupling, the first transmission shaft is provided with a first conical helical gear, the first conical helical gear is connected with a second conical helical gear, the second conical helical gear is arranged at one end of a second transmission shaft, the other end of the second transmission shaft is provided with a first straight gear, the first straight gear is connected with a second straight gear, and the second straight gear is connected with one end of a screw shaft of the lifting mechanism.

8. The device for filling the glue at the bottom of the chip according to claim 1, wherein the telescoping mechanism comprises a first telescoping plate and a second telescoping plate; one end of the first expansion plate is connected with one end of the second expansion plate through a screwing nut, and the other end of the second expansion plate is connected with a support of the glue filling needle in a sliding mode, so that the support can slide on the second expansion plate.

9. The method for using the chip underfill dispensing apparatus according to any one of claims 1 to 8, comprising the steps of:

(1) firstly, a circuit board is placed on a bottom plate of a glue filling workbench, one end of the circuit board is clamped on a positioning bulge, and after the position is adjusted, four positioning screws of a circuit board fixing mechanism are screwed to fix the circuit board;

(2) adjusting a slide block guide rail mechanism on the glue filling workbench, adjusting the position of a glue filling baffle plate to enable the lower edge of the glue filling baffle plate to be tightly attached to the chip and the circuit board, and locking a slide seat on a guide plate by using a locking nut when the lower edge of the glue filling baffle plate is adjusted to a proper position so as to fix the position of the glue filling baffle plate;

(3) opening a stepping motor to enable the stepping motor to rotate forwards, enabling a screw shaft to rotate through a transmission structure, enabling a sliding block on the screw shaft to move leftwards, enabling a long support rod to push a glue filling workbench to lift upwards, and turning off the stepping motor when an included angle between a bottom plate and the horizontal plane is 30-45 degrees;

(4) adjusting a first telescopic frame and a second telescopic frame, screwing a screwing screw at the joint of the first telescopic frame and the second telescopic frame to fix the position of a telescopic mechanism, wherein the needle head of a glue filling needle is close to the gap between the chip and the circuit board;

(5) moving a needle head of the glue filling needle to one side of the chip, then pushing a propeller of the glue filling needle to start glue filling, moving the support back and forth in the glue filling process to enable the glue filling to be uniform, and stopping the glue filling when glue overflows near the needle head of the glue filling needle;

(6) and opening the stepping motor to rotate reversely, moving the slide block on the screw shaft rightwards, enabling the long support rod to push the glue filling workbench to descend, closing the stepping motor when the bottom plate falls, and dismounting the circuit board to finish the whole glue filling process.

Technical Field

The invention relates to the technical field of laboratory instruments and equipment, in particular to a device for filling glue at the bottom of a chip.

Background

With the rapid development of electronic products, the packaging density of the electronic products is getting higher, so that the high-integration packaging forms such as BGA, QFN and the like are applied to various electronic products, and especially applied to equipment with higher reliability requirements such as aviation and aerospace. In the actual use process, the electronic product is influenced by various mechanical loads, such as bending, torsional deformation, random vibration, thermal shock and the like. Further, the failure of the interconnection pads in the circuit board can be caused, and in order to improve the reliability of the interconnection pads, the current engineering field adopts a method of filling glue at the bottom of the chip. In the engineering, the bottom replacement filling is generally carried out through the capillary action, the glue filling speed is low in the filling process, the glue filling continuity is poor due to the adoption of the single needle head, and bubbles and cavities are easily generated, so that the service life of the chip after the glue filling is influenced.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a device for filling glue at the bottom of a chip.

The technical scheme for realizing the purpose of the invention is as follows:

the utility model provides a mucilage binding is filled to chip bottom, the on-line screen storage device comprises a base, the one end of base is equipped with drive mechanism, the other end is equipped with fills gluey workstation, fill the one end and the base swing joint of gluey workstation, the other end that fills gluey workstation is connected with the elevating system who sets up on the base, base between elevating system and drive mechanism still is equipped with supporting barrier, it establishes in the top that fills gluey workstation and is connected with supporting barrier through telescopic machanism to fill gluey needle, drive mechanism provides power for elevating system and makes elevating system promote the lift of filling gluey workstation.

Fill and glue workstation, comprising a base plate, it is protruding to be equipped with the location on the bottom plate, the assembled chip circuit board detachable that the bottom needs to fill to glue fixes at the middle part of bottom plate and blocks in the location is protruding, the both sides of circuit board are passed through circuit board fixed establishment and are fixed on the bottom plate, three sides of chip are enclosed by filling the gluey baffle respectively, every back that fills the gluey baffle passes through the hinge and is connected with the one end of baffle stock, the other end and the slider guide rail mechanism of baffle stock are connected, slider guide rail mechanism fixes on the bottom plate, the syringe needle that fills the gluey needle aims at the one side that the chip is not enclosed.

The needle head of the glue filling needle is a row type glue filling needle head.

The sliding block guide rail mechanism comprises a guide plate, a sliding seat is arranged on the guide plate, a hinge structure is arranged on the sliding seat, the hinge structure is movably connected with one end of a baffle long rod, the baffle long rod is driven through the sliding of the sliding seat on the guide plate, so that a glue filling baffle is driven, and the degree of adhesion between the glue filling baffle and a chip is adjusted.

The hinge structure comprises a primary hinge structure and a secondary hinge structure, wherein the primary hinge structure is arranged on the sliding seat, and the secondary hinge structure is arranged on the primary hinge structure.

The lifting mechanism comprises a lead screw groove fixed on the base, a lead screw shaft is arranged in the lead screw groove, a slide block is arranged on the lead screw shaft, the slide block is movably connected with one end of a support long rod, and the support long rod is movably connected with the bottom plate bottom of the glue filling workbench.

The transmission mechanism comprises a stepping motor, an output shaft of the stepping motor is connected with a first transmission shaft through a coupler, a first conical helical gear is arranged on the first transmission shaft and connected with a second conical helical gear, the second conical helical gear is arranged at one end of the second transmission shaft, a first straight gear is arranged at the other end of the second transmission shaft and connected with a second straight gear, and the second straight gear is connected with one end of a screw shaft of the lifting mechanism.

The telescopic mechanism comprises a first telescopic plate and a second telescopic plate; one end of the first expansion plate is connected with one end of the second expansion plate through a screwing nut, and the other end of the second expansion plate is connected with a support of the glue filling needle in a sliding mode, so that the support can slide on the second expansion plate.

The invention provides a device for filling glue at the bottom of a chip, which is characterized in that a circuit board is fixed on a bottom plate of a workbench, a glue filling baffle plate is tightly attached to the chip through a glue filling baffle plate, a baffle plate long rod and a slide block guide rail mechanism, and a screw rod shaft is driven to rotate through a transmission mechanism to move a slide block, so that the workbench is lifted; and the distance between the needle head of the glue filling needle and the chip to be filled with the glue is adjusted through the telescopic mechanism, and the glue is filled more uniformly through the transverse movement on the support telescopic frame of the glue filling needle. The glue filling platform can be restored to the horizontal position by controlling the reverse rotation of the stepping motor, the circuit board after glue filling is disassembled, and the whole glue filling process is completed. The device accelerates the flow rate of the bottom filling adhesive by utilizing the self gravity of the filling adhesive so as to improve the filling efficiency of the chip, and can improve the continuity of the filling adhesive and reduce the generation of bubbles and cavities by adopting the arrayed filling adhesive needles.

Drawings

FIG. 1 is a schematic perspective view of a device for filling adhesive on the bottom of a chip;

FIG. 2 is a schematic structural view of a glue filling workbench;

FIG. 3 is a schematic structural view of a slider rail mechanism;

FIG. 4 is a schematic structural view of the transmission mechanism;

FIG. 5 is a schematic structural view of a glue filling needle and a telescoping mechanism;

FIG. 6 is a schematic structural view of the lifting mechanism;

FIG. 7 is a schematic view of an arrayed gel-filled needle;

in the figure: 1. the automatic glue filling machine comprises a base 2, a lifting mechanism 3, a transmission mechanism 4, a support baffle plate 5, a telescopic mechanism 6, a glue filling needle 7, a glue filling workbench 8, a bottom plate 9, a circuit board 10, a chip 11, a glue filling baffle plate 12, a baffle plate long rod 13, a slider guide rail mechanism 14, a positioning bulge 15, a guide plate 16, a slide seat 17, a primary hinge structure 18, a secondary hinge structure 19, a stepping motor 20, a coupler 21, a first conical helical gear 22, a second conical helical gear 23, a first transmission shaft 24, a second transmission shaft 25, a first straight gear 26, a second straight gear 27, a first telescopic plate 28, a screwing screw 29, a second telescopic plate 30, a sliding groove 31, a support 32, a support long rod 33, a screw rod groove 34, a screw rod shaft 35, a slider 36 and a row type glue filling needle head.

Detailed Description

The invention will be further elucidated with reference to the drawings and examples, without however being limited thereto.

Example (b):

as shown in fig. 1, a chip bottom glue filling device, including base 1, the one end of base is equipped with drive mechanism 3, the other end is equipped with fills gluey workstation 7, fill the one end and the base 1 swing joint of gluey workstation 7, the other end that fills gluey workstation 7 is connected with elevating system 2 that sets up on base 1, base 1 between elevating system 2 and drive mechanism 3 still is equipped with supporting barrier 4, it establishes in the top that fills gluey workstation 7 and is connected with supporting barrier 4 through telescopic machanism 5 to fill gluey needle 6, drive mechanism 3 makes elevating system 2 promote the lift of filling gluey workstation 7 for elevating system 2 provides power.

As shown in fig. 2, glue filling workbench 7, including bottom plate 8, be equipped with location arch 14 on bottom plate 8, the assembled chip 10 circuit board 9 that the bottom needs to be filled with glue is detachably fixed at the middle part of bottom plate 8 and is blocked on location arch 14, circuit board 9's both sides are fixed on bottom plate 8 through circuit board fixed establishment, three sides of chip 10 are enclosed by glue filling baffle 11 respectively, the back of every glue filling baffle 11 is connected with the one end of baffle stock 12 through the hinge, the other end of baffle stock 12 is connected with slider guide rail mechanism 13, slider guide rail mechanism 13 is fixed on bottom plate 8, the syringe needle of glue filling needle 6 aims at the one side that chip 10 is not enclosed.

As shown in fig. 7, the needle head of the glue filling needle 6 is an aligned glue filling needle head 36, which can improve the continuity of filling glue and reduce the generation of bubbles and voids.

As shown in fig. 3, the slider rail mechanism 13 includes a guide plate 15, a sliding base 16 is disposed on the guide plate 15, a hinge structure is disposed on the sliding base 16, the hinge structure includes a primary hinge structure 17 and a secondary hinge structure 18, the primary hinge structure 17 is disposed on the sliding base 16, the secondary hinge structure 18 is disposed on the primary hinge structure 17, the secondary hinge structure 18 is movably connected with one end of the baffle long rod 12, the baffle long rod 12 is pulled through the hinge structure by sliding the sliding base 16 on the guide plate 15, so as to drive the glue filling baffle 11, adjust the adhesion degree between the glue filling baffle 11 and the chip 10, and when the slide base 16 is adjusted to a proper position, the sliding base 16 is locked on the guide plate 15 by using a lock nut.

As shown in fig. 6, the lifting mechanism 2 includes a screw groove 33 fixed on the base 1, a screw shaft 34 is disposed in the screw groove 33, a slider 35 is disposed on the screw shaft 34, the slider 35 is movably connected with one end of the long support rod 32, and the long support rod 32 is movably connected with the bottom of the bottom plate 8 of the glue filling worktable 7.

As shown in fig. 4, the transmission mechanism 3 includes a stepping motor 19, an output shaft of the stepping motor 19 is connected to a first transmission shaft 23 through a coupling 20, the first transmission shaft 23 is provided with a first conical helical gear 21, the first conical helical gear 21 is connected to a second conical helical gear 22, the second conical helical gear 22 is provided at one end of a second transmission shaft 24, the other end of the second transmission shaft 24 is provided with a first straight gear 25, the first straight gear 25 is connected to a second straight gear 26, the second straight gear 26 is connected to one end of a screw shaft 34 of the lifting mechanism 2, the screw shaft 34 is driven to rotate by the second straight gear 26, so that the slider 35 moves on the screw shaft 34 to lift the support long rod 32, and finally the glue filling worktable 7 is driven to lift.

The telescopic mechanism 5 comprises a first telescopic plate 27 and a second telescopic plate 29; one end of the first expansion plate 27 is connected with one end of the second expansion plate 29 through a screwing nut 28, the other end of the second expansion plate 29 is connected with a support 31 of the glue filling needle 6 in a sliding mode, a sliding groove 30 is formed in the back of the support 31, and the glue filling needle 6 on the support 31 can slide on the second expansion plate 29 by moving on the second expansion plate 29 through the sliding groove 30.

The use method of the device comprises the following steps:

(1) firstly, a circuit board 9 is placed on a bottom plate 8 of a glue filling workbench 7, one end of the circuit board 9 is clamped on a positioning bulge 14, and after the position is adjusted, four positioning screws of a circuit board fixing mechanism are screwed, so that the circuit board 9 is fixed;

(2) adjusting a slide block guide rail mechanism on the glue filling workbench 7, adjusting the position of a glue filling baffle plate 11, enabling the lower edge of the glue filling baffle plate 11 to be tightly attached to the chip 10 and the circuit board 9, and locking a slide seat 16 on a guide plate 15 by using a locking nut when the proper position is adjusted, so as to fix the position of the glue filling baffle plate 11;

(3) turning on the stepping motor 19 to rotate forwards, rotating the screw shaft 34 through a transmission structure, moving the slide block 35 on the screw shaft 34 leftwards, pushing the glue filling workbench 7 to be lifted upwards by the long support rod 32, and turning off the stepping motor when the included angle between the bottom plate 8 and the horizontal plane is 30-45 degrees;

(4) and adjusting the first telescopic frame 27 and the second telescopic frame 29, enabling the needle head 36 of the glue filling needle 6 to be close to the gap between the chip 10 and the circuit board 9, screwing a screwing screw 28 at the joint of the first telescopic frame 27 and the second telescopic frame 29, and fixing the position of the telescopic mechanism.

(5) The needle head 36 of the glue filling needle 6 is moved to one side of the chip 10, then the pusher of the glue filling needle 6 is pushed to start glue filling, the support 31 is moved back and forth in the glue filling process to enable the glue filling to be uniform, and the glue filling is stopped when glue overflows near the needle head 36 of the glue filling needle 6.

(6) And (3) opening the stepping motor 19 to rotate reversely, moving the slide block 35 on the screw shaft 34 rightwards, enabling the long support rod 32 to push the glue filling workbench 7 to descend, closing the stepping motor 19 when the bottom plate 8 falls, and detaching the circuit board 9 to finish the whole glue filling process.