阅读说明：本技术 导电浆料、导电走线的制作方法、显示面板以及拼接屏 (Conductive paste, manufacturing method of conductive routing, display panel and spliced screen ) 是由 段淼 于 2021-08-19 设计创作，主要内容包括：本申请实施例公开了一种导电浆料、导电走线的制作方法、显示面板以及拼接屏,导电浆料包括以下重量份数的组分：45～85份导电剂、0.5～5份微胶囊、5～25份有机载体、10～40份溶剂以及1～5份粘结剂；其中,微胶囊包括壳体以及包裹于壳体内部的产气材料。采用导电浆料在基板上制作导电层,所制得的导电层内含有微胶囊；当导电层上存在短路问题时,可以对导电层的短路部分进行加热,使得短路部分的微胶囊的产气材料受热分解,产生气体并切断导电层的短路部分,本申请的技术方案所需要的光照能量小,只要能使微胶囊的产气材料受热分解并产生气体撑裂导电层即可,不会对导电层下方的膜层造成破坏,有效提高了显示面板的良率。(The embodiment of the application discloses conductive paste, a manufacturing method of conductive wiring, a display panel and a spliced screen, wherein the conductive paste comprises the following components in parts by weight: 45-85 parts of a conductive agent, 0.5-5 parts of a microcapsule, 5-25 parts of an organic carrier, 10-40 parts of a solvent and 1-5 parts of a binder; the microcapsule comprises a shell and a gas generating material wrapped in the shell. Manufacturing a conductive layer on a substrate by adopting conductive paste, wherein the manufactured conductive layer contains microcapsules; when having the short circuit problem on the conducting layer, can heat the short circuit part of conducting layer for the gas production material of the microcapsule of short circuit part is heated and is decomposed, produces gas and cuts off the short circuit part of conducting layer, the required illumination energy of the technical scheme of this application is little, as long as can make the gas production material of microcapsule be heated and decomposed and produce gas burst conducting layer can, can not cause the destruction to the rete of conducting layer below, effectively improved display panel's yield.)

1. The conductive paste is characterized by comprising the following components in parts by weight:

the microcapsule comprises a shell and a gas-generating material wrapped inside the shell.

2. The electroconductive paste according to claim 1, wherein the gas generating material is one or more of sodium bicarbonate, calcium bicarbonate, basic copper carbonate, basic nickel carbonate and basic zinc carbonate.

3. The conductive paste as claimed in claim 1, wherein the shell is selected from one or more of paraffin wax, beeswax and polyethylene wax.

4. The conductive paste according to claim 1, wherein the conductive agent is selected from one or more of gold powder, silver powder, aluminum powder, copper powder, nickel powder, carbon nanotube, graphite, graphene, carbon fiber, and carbon black.

5. The conductive paste as claimed in claim 1, wherein the organic vehicle is selected from one or more of acrylic resin, epoxy resin and silicone resin.

6. The conductive paste according to claim 1, wherein the solvent is selected from one or more of terpineol, turpentine, dimethyl phthalate, dibutyl phthalate, and cyclohexanone.

7. The conductive paste according to claim 1, wherein the binder is selected from one or more of vinyl cellulose, hydroxymethyl cellulose, polybutylmethacrylate, ethyl cellulose, polyvinyl butyral, carboxymethyl cellulose, hydroxyethyl cellulose, and rosin resin.

8. A manufacturing method of a conductive routing is characterized by comprising the following steps:

providing a substrate and the conductive paste according to any one of claims 1 to 7;

and arranging the conductive paste on the substrate, and curing the conductive paste of the substrate to obtain a conductive layer, wherein the conductive layer comprises a plurality of conductive wires.

9. The method for manufacturing the conductive trace according to claim 8, wherein when a short circuit occurs between two conductive traces, the method for manufacturing the conductive trace further includes:

and heating the short circuit part of the conductive wires, wherein the gas production material in the microcapsule of the short circuit part is heated and decomposed to produce gas, so that the short circuit part between the two conductive wires is cut off.

10. The display panel is characterized by comprising a substrate and a conductive wire arranged on the side face of the substrate, wherein microcapsules are contained in the conductive wire, and each microcapsule comprises a shell and a gas generation material wrapped in the shell.

11. A tiled screen comprising at least two display panels according to claim 10, wherein adjacent display panels are tiled with respect to each other.

Technical Field

The application relates to the technical field of display, in particular to a conductive paste, a manufacturing method of conductive routing, a display panel and a spliced screen.

Background

In recent years, Mini/Micro LEDs (Light-emitting diodes) have gradually come into the field of view of consumers. However, the Mini/Micro LED display panel is difficult to be large-sized, and particularly, the size of a single panel is generally less than 10 inches due to the key technical constraints of chip mass transfer and the like of the Mirco LED display panel. However, to realize a large-sized display device such as a television or an outdoor display screen, the display panels must be spliced. However, the splicing screen often has an important problem that the splicing seam is obvious, so that the picture quality is not high. Therefore, large panel factories are continuously developing seamless splicing technology. The key problem to realize seamless tiled display is to enlarge the display area and reduce the area of the non-display area, i.e. reduce the area of peripheral circuits such as metal routing in the Outer Lead Bonding (OLB) area. Among the important techniques involved is side printing.

The side printing technology is to print the conductive traces on the side of the display panel. Generally, the conductive paste is used as a wiring material, and is printed on the side surface of the substrate with the thickness of millimeter order by a process such as pad printing. The side printing technique is more difficult than the commonly used flat screen printing. Because the line width and the line distance of the conductive wires are very small, and the conductive paste has certain fluidity, the problem of short circuit can occur between the conductive wires in the actual side printing process, namely the short circuit phenomenon caused by the fact that the adjacent conductive wires are communicated together.

In order to break the connection between adjacent conductive traces, high-energy laser is usually used to irradiate the connection between adjacent conductive traces, so that the connection is melted and ablated, thereby solving the problem of short circuit between the conductive traces. However, the above method is easy to damage the film structure under the conductive trace, which is likely to cause the defects of the display panel.

Disclosure of Invention

The embodiment of the application provides a conductive paste, a manufacturing method of conductive wires, a display panel and a spliced screen, and can solve the technical problem that when a laser is adopted to break a communication part of adjacent conductive wires, a film structure below the conductive wires is easily damaged, so that the display panel is poor.

The embodiment of the application provides conductive paste which comprises the following components in parts by weight:

the microcapsule comprises a shell and a gas-generating material wrapped inside the shell.

Optionally, in some embodiments of the present application, the gas generating material is one or more of sodium bicarbonate, calcium bicarbonate, basic copper carbonate, basic nickel carbonate, and basic zinc carbonate.

Optionally, in some embodiments of the present application, the shell is selected from one or more of paraffin, beeswax, and polyethylene wax.

Optionally, in some embodiments of the present application, the conductive agent is selected from one or more of gold powder, silver powder, aluminum powder, copper powder, nickel powder, carbon nanotubes, graphite, graphene, carbon fibers, and carbon black.

Optionally, in some embodiments of the present application, the organic carrier is selected from one or more of acrylic resin, epoxy resin and silicone resin.

Optionally, in some embodiments herein, the solvent is selected from one or more of terpineol, turpentine, dimethyl phthalate, dibutyl phthalate, and cyclohexanone.

Optionally, in some embodiments herein, the binder is selected from one or more of vinyl cellulose, hydroxymethyl cellulose, polybutylmethacrylate, ethyl cellulose, polyvinyl butyral, carboxymethyl cellulose, hydroxyethyl cellulose, and rosin resin.

The embodiment of the present application further provides a method for manufacturing a conductive trace, which includes the following steps:

providing a substrate and the conductive paste;

and arranging the conductive paste on the substrate, and curing the conductive paste of the substrate to obtain a conductive layer, wherein the conductive layer comprises a plurality of conductive wires.

Optionally, in some embodiments of the present application, when a short circuit occurs between two conductive traces, the method for manufacturing the conductive traces further includes:

and heating the short circuit part of the conductive wires, wherein the gas production material in the microcapsule of the short circuit part is heated and decomposed to produce gas, so that the short circuit part between the two conductive wires is cut off.

The embodiment of the application further provides a display panel, including the base plate and locate the electrically conductive line of the side of base plate, contain the microcapsule in the electrically conductive line, the microcapsule include the casing and wrap up in gas production material in the casing.

The embodiment of the application further provides a spliced screen, which comprises at least two display panels, wherein the adjacent display panels are spliced with each other.

The conductive paste provided by the embodiment of the application comprises microcapsules, wherein each microcapsule comprises a shell and a gas generating material wrapped in the shell, and the gas generating material can generate gas when decomposed; manufacturing a conductive layer on a substrate by adopting conductive paste, wherein the manufactured conductive layer contains microcapsules; when having the short circuit problem on the conducting layer, can heat the short circuit part of conducting layer for the gas production material of the microcapsule of short circuit part is heated and is decomposed, produces gas and cuts off the short circuit part of conducting layer, compare in the traditional mode that adopts high energy laser cutting electrically conductive line, the required illumination energy of technical scheme of this application is little, as long as can make the gas production material of microcapsule heated and decompose and produce gas burst conducting layer can, can not lead to the fact destruction to the rete below the conducting layer, effectively improved display panel's yield.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic flowchart of a method for manufacturing a conductive trace according to an embodiment of the present disclosure;

FIG. 2 is a schematic cross-sectional structural view of a microcapsule provided in an embodiment of the present application;

fig. 3 is a schematic structural diagram of forming a conductive layer on a substrate according to an embodiment of the present disclosure;

FIG. 4 is a schematic structural view of a mold and a transfer member provided in an embodiment of the present application;

fig. 5 is a schematic side view of a substrate with a conductive layer formed thereon according to an embodiment of the present disclosure;

FIG. 6 is a schematic cross-sectional view taken along line A-A of FIG. 5;

FIG. 7 is a schematic structural diagram of heating a via of a conductive layer of a substrate according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram illustrating a connection line of a conductive layer of a substrate cracked by a gas according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram illustrating a broken connection line of a conductive layer of a substrate according to an embodiment of the present disclosure;

FIG. 10 is a schematic diagram illustrating a structure for bonding a circuit board to a conductive layer of a substrate according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a spliced screen provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides a conductive paste, a manufacturing method of a conductive routing, a display panel and a splicing screen. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments. In addition, in the description of the present application, the term "including" means "including but not limited to". Various embodiments of the invention may exist in a range of versions; it is to be understood that the description in the form of a range is merely for convenience and brevity and should not be construed as an inflexible limitation on the scope of the invention; accordingly, the described range descriptions should be considered to have specifically disclosed all the possible sub-ranges as well as individual numerical values within that range. For example, it is contemplated that the description of a range from 1 to 6 has specifically disclosed sub-ranges such as, for example, from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as individual numbers within a range such as, for example, 1, 2, 3, 4, 5, and 6, as applicable regardless of the range. In addition, whenever a numerical range is indicated herein, it is meant to include any number (fractional or integer) recited within the indicated range.

As shown in fig. 2, an embodiment of the present application provides a conductive paste, which includes the following components in parts by weight: 45-85 parts of conductive agent, 0.5-5 parts of microcapsule 200, 5-25 parts of organic carrier, 10-40 parts of solvent and 1-5 parts of binder, wherein the microcapsule 200 comprises a shell 210 and a gas generating material 220 wrapped inside the shell 210, and the gas generating material 220 generates gas when being heated and decomposed.

The conductive paste of the embodiment of the application is used for manufacturing the conductive trace 121, and particularly, but not limited to, the conductive trace 121 may be manufactured in a printing manner, as shown in fig. 3 to 6, the conductive paste is used for manufacturing the conductive layer 120 on the substrate 110, the manufactured conductive layer 120 contains the microcapsule 200, and the conductive layer 120 includes a plurality of conductive traces 121; since the conductive paste has a certain fluidity, after the conductive paste is printed on the substrate 110 according to the pattern of the conductive traces 121, the conductive paste is easy to flow to cause the deformation of the actual printed pattern, so that after the conductive paste on the substrate 110 is cured, a plurality of conductive traces 121 and a connecting line 122 connected to two conductive traces 121 are formed; the connection line 122 connects the two conductive traces 121, so that the two conductive traces 121 are short-circuited.

As shown in fig. 7-9, when there is a short circuit problem on the conductive layer 120, the short circuit portion (i.e., the connection line 122) of the conductive layer 120 may be heated, so that the gas-generating material 220 of the microcapsule 200 at the short circuit portion is decomposed by heat, generates gas, and cuts off the short circuit portion of the conductive layer 120, compared with the conventional method of cutting the conductive trace 121 by using high-energy laser, the technical scheme of the present application needs less illumination energy, as long as the gas-generating material 220 of the microcapsule 200 is decomposed by heat and generates gas to crack the conductive layer 120, and the film layer below the conductive layer 120 is not damaged, thereby effectively improving the yield of the display panel 100.

Alternatively, in the conductive paste of the embodiment of the present application, the conductive agent may be 45 parts, 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts, 80 parts or 85 parts by weight, the microcapsule 200 may be 0.5 parts, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts or 5 parts by weight, the organic carrier may be 5 parts, 7.5 parts, 10 parts, 12.5 parts, 15 parts, 17.5 parts, 20 parts, 22.5 parts or 25 parts by weight, the solvent may be 10 parts, 12.5 parts, 15 parts, 17.5 parts, 20 parts, 22.5 parts, 25 parts, 27.5 parts, 30 parts, 32.5 parts, 35 parts, 37.5 parts or 40 parts by weight, the binder may be 1 part, 1.5 parts, 2 parts, 2.5 parts, 3.5 parts, 4.5 parts by weight or 4 parts by weight, or by weight, and the components may be adjusted by weight, the viscosity of the conductive paste can be adjusted so that the conductive paste can be used for printing to obtain conductive traces 121 with different thicknesses. It is understood that the weight parts of the components in the conductive paste can be properly adjusted according to the selection of the actual situation and the specific requirement, and are not limited herein.

In some embodiments of the present application, the conductive agent is used as a conductive phase to form a conductive path in the conductive trace 121, and the conductive agent may be one or more selected from gold powder, silver powder, aluminum powder, copper powder, nickel powder, carbon nanotube, graphite, graphene, carbon fiber, and carbon black, and of course, other conductive materials may be used as the conductive agent according to the selection and specific requirements of the actual situation, which is not limited herein.

In some embodiments of the present application, a solvent is used to disperse each component in the conductive paste, and the conductive agent may be one or more selected from terpineol, turpentine, dimethyl phthalate, dibutyl phthalate, and cyclohexanone, but of course, other organic solvents may be used as the solvent according to the choice of the actual situation and the specific requirement, and are not limited herein.

In some embodiments of the present application, a binder is used to adjust the bonding strength of the conductive paste, and the binder may be selected from one or more of vinyl cellulose, hydroxymethyl cellulose, polybutylmethacrylate, ethyl cellulose, polyvinyl butyral, carboxymethyl cellulose, hydroxyethyl cellulose, and rosin resin, but other materials may be used as the binder according to the choice and specific requirements of the actual situation, and the present invention is not limited thereto.

In some embodiments of the present application, the organic vehicle is dissolved in a solvent to act as a vehicle for the conductive agent, the microcapsules 200, and the binder, such that the conductive agent, the microcapsules 200, and the binder are dispersed into a slurry having fluid properties to facilitate printing on the substrate 110 to form a desired pattern. The organic carrier may be selected from one or more of acrylic resin, epoxy resin and silicone resin, and of course, other materials may be selected for the organic carrier according to the choice of the actual situation and the specific requirements, and the organic carrier is not limited herein.

In some embodiments of the present application, the gas generating material 220 may be decomposed to generate gas when heated, and the generated gas may burst the conductive layer 120, so that the short circuit portion of the conductive layer 120 may be cut off by the above principle. In the embodiment of the application, the gas generating material 220 may be one or more selected from sodium bicarbonate, calcium bicarbonate, basic copper carbonate, basic nickel carbonate and basic zinc carbonate, and the gas generating material 220 may release carbon dioxide after being decomposed by heat, and the carbon dioxide is non-toxic and non-combustible, and has the advantage of high safety. It is understood that the gas generating material 220 may be other materials capable of decomposing under heat and generating gas according to the selection of the actual situation and the specific requirement, and is not limited herein.

In some embodiments of the present application, housing 210 is used to protect gas-generating material 220 from dispersing gas-generating material 220 in a solvent, which could cause gas-generating material 220 to decompose or react with other components, which could cause gas-generating material 220 to fail. The shell 210 may be selected from one or more of paraffin, beeswax and polyethylene wax, and of course, other materials may be used for the shell 210 according to the choice of actual conditions and specific requirements, which are not limited herein.

In some embodiments of the present application, the conductive paste is prepared by: sequentially stirring and mixing the solvent, the organic carrier, the microcapsule 200, the conductive agent and the binder in sequence to obtain conductive slurry; wherein, in the stirring and mixing process, the temperature during stirring is 20-35 ℃, the rotating speed during stirring is 100-5000 rpm, and the stirring time is 10-60 min.

Optionally, in the process of stirring and mixing the solvent, the organic carrier, the microcapsule 200, the conductive agent and the binder, the temperature during stirring is 20 ℃, 22.5 ℃, 25 ℃, 27.5 ℃, 30 ℃, 32.5 ℃ or 35 ℃, the rotation speed during stirring is 100rpm, 500rpm, 1000rpm, 1500rpm, 2000rpm, 2500rpm, 3000rpm, 3500rpm, 4000rpm, 4500rpm or 5000rpm, the stirring time is 10min, 15min, 20min, 25min, 30min, 35min, 40min, 45min, 50min, 55min or 60min, and the components are uniformly dispersed by adjusting the process parameters. It is understood that the process parameters of the stirring and mixing process can be properly adjusted according to the selection of the actual situation and the specific requirements, and are not limited herein.

It should be noted that other additives may be added to the conductive paste of the embodiments of the present application according to the selection of the actual situation and the specific requirement, that is, the components of the conductive paste of the embodiments of the present application may further include other additives.

Referring to fig. 1, an embodiment of the present application further provides a method for manufacturing a conductive trace, including the following steps:

step B1, as shown in fig. 3, providing the substrate 110 and the conductive paste as described above;

step B2, as shown in fig. 3, disposing a conductive paste on the substrate 110, and curing the conductive paste of the substrate 110 to obtain a conductive layer 120, where the conductive layer 120 includes a plurality of conductive traces 121;

the conductive layer 120 contains a microcapsule 200, the microcapsule 200 includes a shell 210 and a gas generating material 220 wrapped in the shell 210, and the gas generating material 220 generates gas when heated and decomposed and cuts off the conductive layer 120.

As shown in fig. 3-6, a conductive layer 120 is formed on a substrate 110 by using a conductive paste, and microcapsules 200 are contained in the conductive layer 120; since the conductive paste has a certain fluidity, after the conductive paste is printed on the substrate 110 according to a certain pattern, the conductive paste is likely to flow to cause deformation of the actual printed pattern, so that after the conductive paste on the substrate 110 is cured, a short circuit portion may occur in the conductive layer 120.

As shown in fig. 7-9, when there is a short circuit problem on the conductive layer 120, the short circuit portion of the conductive layer 120 may be heated, so that the gas-generating material 220 of the microcapsule 200 at the short circuit portion is decomposed by heat, generates gas, and cuts off the short circuit portion of the conductive layer 120, compared with the conventional method of cutting the conductive trace 121 by using high-energy laser, the light energy required by the technical scheme of the present application is small, as long as the gas-generating material 220 of the microcapsule 200 is decomposed by heat and generates gas to crack the conductive layer 120, the film layer below the conductive layer 120 is not damaged, and the yield of the display panel 100 is effectively improved.

In some embodiments of the present application, the substrate 110 may be an array substrate, a color filter substrate, or a display panel, and the specific type of the substrate 110 may be modified according to the selection and specific requirements of the actual situation, which is not limited herein.

Optionally, in the step B2, the conductive material may be disposed on the substrate 110 by, but not limited to, printing, and the step of disposing the conductive paste on the substrate 110 is: providing a mold 400 having a recess 410 and a transfer member 500, filling the recess 410 with a conductive paste, dipping the conductive paste in the recess 410 using the transfer member 500, and transferring the conductive paste on the transfer member 500 onto the substrate 110. In this embodiment, the transfer member 500 may be, but not limited to, a silicone head, after the conductive paste is filled in the groove 410 of the mold 400, the silicone head is pressed down to the mold 400, the conductive paste in the groove 410 can be dipped after the silicone head is pressed and deformed, and then the silicone head is transferred to the side surface of the substrate 110, so as to complete the side surface printing of the conductive paste, and then the conductive trace 121 is formed on the side surface of the substrate 110. Of course, according to the choice and specific requirements of the actual situation, the conductive paste may also be transferred to the back surface of the substrate 110, so as to form the conductive traces 121 on both the side surface and the back surface of the substrate 110.

Specifically, in the step B2, the temperature for curing the conductive paste of the substrate 110 is 80 to 120 ℃ and the time is 10 to 30 minutes, and in this embodiment, the curing temperature and time are adjusted according to the printing thickness of the conductive paste, so that the conductive paste is cured and the conductive layer 120 is formed.

Alternatively, in the step B2, the temperature for curing the conductive paste of the substrate 110 is 80 ℃, 85 ℃, 90 ℃, 95 ℃, 100 ℃, 105 ℃, 110 ℃, 115 ℃ or 120 ℃, and the curing time is 10 minutes, 12.5 minutes, 15 minutes, 17.5 minutes, 20 minutes, 22.5 minutes, 25 minutes, 27.5 minutes or 30 minutes, and the conductive paste on the substrate 110 is fully cured by adjusting the curing temperature and the curing time. It is understood that the curing temperature and curing time of the conductive paste can be properly adjusted according to the choice of actual conditions and specific requirements, and are not limited herein.

In some embodiments of the present application, when a short circuit occurs between two conductive traces 121, the method for manufacturing the conductive traces further includes:

step B3, heating the short circuit portion of the conductive traces 121, and the gas generating material 220 in the microcapsule 200 at the short circuit portion is heated and decomposed to generate gas, thereby cutting off the short circuit portion between the two conductive traces 121.

Specifically, as shown in fig. 3 to 6, in the step B2, the manufactured conductive layer 120 further includes a connection line 122 connected to the two conductive traces 121, since the conductive paste has a certain fluidity, after the conductive paste is printed on the substrate 110 according to a certain pattern, the conductive paste is easy to flow and causes deformation of the actually printed pattern, the conductive paste in the flowing deformed portion is cured to form the connection line 122, and the connection line 122 connects the two conductive traces 121, so that the two conductive traces 121 are short-circuited, that is, the connection line 122 is a short-circuited portion between the two conductive traces; in this embodiment, the specific steps of step B3 are as follows: as shown in fig. 7-9, when the connecting line 122 is heated, the gas-generating material 220 in the microcapsule 200 of the connecting line 122 is heated and decomposed to generate gas, so as to cut off the connecting line 122 between the two conductive traces 121, thereby solving the short circuit problem between the two conductive traces 121.

Alternatively, in step B3, as shown in fig. 7, the step of heating the short-circuited portion (the connection line 122) includes: the short-circuited portion (the communication line 122) is irradiated with laser light so that the temperature of the short-circuited portion (the communication line 122) is increased. In this embodiment, the short-circuit portion (the connection line 122) is heated by laser irradiation, which is beneficial to heating the short-circuit portion (the connection line 122), so that the conductive trace 121 is not mistakenly heated to be disconnected, and the reliability of the conductive trace 121 is effectively improved. It is understood that the heating of the short-circuit portion (the connection line 122) may be performed in other manners according to the choice of actual conditions and specific requirements, and is not limited herein.

In the embodiment of the present application, as shown in fig. 7 to 9, when the short-circuited portion (the connection line 122) is irradiated by laser, the shell 210 of the microcapsule 200 of the short-circuited portion (the connection line 122) is heated and broken after being irradiated by the laser, the gas generating material 220 inside the shell 210 is released, the laser continuously irradiates the short-circuited portion (the connection line 122), the gas generating material 220 is decomposed by heating and generates gas, and the gas expands to open the short-circuited portion (the connection line 122), thereby cutting the short-circuited portion (the connection line 122).

Specifically, in the step B3, the short-circuited portion (the connection line 122) is irradiated with an infrared laser, so that the temperature of the short-circuited portion (the connection line 122) is increased, wherein the wavelength of the infrared laser is 900 nm to 1500 nm, for example, the wavelength of the infrared laser may be 900 nm, 950 nm, 1000 nm, 1064 nm, 1100 nm, 1150 nm, 1200 nm, 1250 nm, 1300 nm, 1350 nm, 1400 nm, 1450 nm, or 1500 nm.

Specifically, in step B3, the laser 300 is used to emit laser to irradiate the short-circuit portion (the connection line 122), and the output power of the laser 300 is 10 w to 50 w, so as to prevent the emitted laser from damaging the film layer below the conductive layer 120 due to the excessively high output power of the laser 300.

Optionally, in step B3, the output power of the laser 300 is 10 w, 15 w, 20 w, 25 w, 30 w, 35 w, 40 w, 45 w or 50 w, and the laser 300 with a proper power is selected according to the thickness of the conductive layer 120, so as to prevent the emitted laser from damaging the film layer below the conductive layer 120 due to the too high output power of the laser 300. It is understood that the output power of the laser 300 can be adjusted appropriately according to the choice of actual conditions and specific requirements, and is not limited thereto.

Specifically, in the step B3, when the short-circuited portion (the connection line 122) is irradiated with the laser for 1 to 60 seconds, the shell 210 of the microcapsule 200 at the short-circuited portion (the connection line 122) is broken and the gas generating material 220 is released, the gas generating material 220 generates gas after being heated, and the gas expands to open the short-circuited portion (the connection line 122), thereby cutting the short-circuited portion (the connection line 122).

Optionally, in step B3, when the short-circuited portion (the connection line 122) is irradiated with the laser, the irradiation time is 1 second, 5 seconds, 10 seconds, 15 seconds, 20 seconds, 25 seconds, 30 seconds, 35 seconds, 40 seconds, 45 seconds, 50 seconds, 55 seconds or 60 seconds, and the irradiation time of the laser is adjusted according to the thickness of the conductive layer 120, so that the shell 210 of the microcapsule 200 of the short-circuited portion (the connection line 122) is ruptured and the gas generating material 220 is released, and the gas generating material 220 generates gas after being heated, and the gas expands to open the connection line 122, thereby cutting the short-circuited portion (the connection line 122). It is understood that the time of laser irradiation may be adjusted appropriately according to the choice of actual conditions and specific requirements, and is not limited herein.

In some embodiments of the present application, as shown in fig. 10, the method for manufacturing a conductive trace further includes: a driving Circuit Board 130 (PCB) is bonded (Bonding) to the conductive traces 121 on the side or the back of the substrate 110, so that the operation of the substrate 110 is controlled by the driving Circuit Board 130.

As shown in fig. 10, an embodiment of the present invention further provides a display panel 100, where the display panel 100 includes a substrate 110 and a conductive trace 121 disposed on a side surface of the substrate 110, the conductive trace 121 is manufactured by the above method, the conductive trace 121 contains a microcapsule 200, and the microcapsule 200 includes a casing 210 and a gas-generating material 220 wrapped in the casing 210. Since the display panel 100 provided in this embodiment adopts all technical solutions of all the embodiments described above, all the beneficial effects brought by the technical solutions of the embodiments also exist, and are not described in detail herein.

As shown in fig. 11, an embodiment of the present application further provides a tiled display, which includes at least two display panels 100 as described above, and two adjacent display panels 100 are tiled with each other. Since the spliced screen provided by the embodiment adopts all technical solutions of all the embodiments, all the beneficial effects brought by the technical solutions of the embodiments are also achieved, and are not repeated herein.

The conductive paste, the manufacturing method of the conductive traces, the display panel and the spliced screen provided by the embodiment of the application are introduced in detail, a specific example is applied in the description to explain the principle and the implementation mode of the application, and the description of the embodiment is only used for helping to understand the method and the core idea of the application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.