Composition for dusting

文档序号:327392 发布日期:2021-11-30 浏览:33次 中文

阅读说明:本技术 撒粉用组合物 (Composition for dusting ) 是由 伊东贵史 藤村亮佑 樋渡总一郎 于 2019-04-18 设计创作,主要内容包括:本发明涉及对提高食材与面衣材料的粘结性和维持烹调后的油炸食品的面衣的口感有用的撒粉用组合物。该撒粉用组合物含有5质量%以上的改性小麦粉,将该改性小麦粉的10质量%水悬浮液升温至85℃后再冷却至25℃时的该水悬浮液的粘度为1000mPa·s以下,并且将该水悬浮液升温至85℃后再冷却至25℃、接着静置24小时时的该水悬浮液的分散度为90%以下。(The present invention relates to a composition for powdering which is useful for improving the adhesion between a food material and a material for a batter and maintaining the texture of a batter of a fried food after cooking. The composition for dusting contains 5 mass% or more of modified wheat flour, and has a viscosity of 1000 mPas or less when a 10 mass% aqueous suspension of the modified wheat flour is heated to 85 ℃ and then cooled to 25 ℃, and a degree of dispersion of 90% or less when the aqueous suspension is heated to 85 ℃ and then cooled to 25 ℃ and then left to stand for 24 hours.)

1. A composition for dusting which comprises 5% by mass or more of modified wheat flour,

the viscosity of an aqueous suspension of the modified wheat flour when heated to 85 ℃ and then cooled to 25 ℃ is 1000 mPas or less, and the degree of dispersion of the aqueous suspension when heated to 85 ℃ and then cooled to 25 ℃ and left to stand for 24 hours is 90% or less.

2. The composition according to claim 1, wherein the viscosity is 800 mPa-s or less and the dispersibility is 10 to 80%.

3. The composition according to claim 1 or 2, wherein the moisture content of the modified wheat flour is 10 to 14 mass%.

4. A composition according to any one of claims 1 to 3, wherein the modified wheat flour isαThe degree of conversion is 12% or less.

5. The composition according to any one of claims 1 to 4, which comprises 5 to 30 mass% of the modified wheat flour and 1 or more selected from the group consisting of grain flour and starch other than the modified wheat flour.

6. A method of preparing a fried food product comprising: a food material having the composition for dusting according to any of claims 1 to 5 attached thereto, followed by frying after having the material for a batter coat attached thereto.

7. Use of modified wheat flour for the preparation of a composition for dusting, wherein,

the composition for dusting comprises 5% by mass or more of the modified wheat flour,

the viscosity of an aqueous suspension of the modified wheat flour when heated to 85 ℃ and then cooled to 25 ℃ is 1000 mPas or less, and the degree of dispersion of the aqueous suspension when heated to 85 ℃ and then cooled to 25 ℃ and left to stand for 24 hours is 90% or less.

Technical Field

The present invention relates to a dusting composition for preparing fried food.

Background

Wheat flour is used as a food material such as a raw material powder for dough of bread or noodles or a material for a batter of fried foods, a base material for sauce, and the like, and is used as a powder for preventing the dough from sticking to hands or tools in the preparation of dough of bread or noodles. When wheat flour is mixed with water, the mixture tends to be unevenly mixed and become crumby (そぼろ状) or sticky, and thus the handling as a food material is not necessarily good. On the other hand, wheat flour which has been mixed with water is preferably used immediately for cooking, otherwise the resulting food product may become hard or form a rough mouthfeel.

Patent document 1 describes that a low gluten wheat flour dough containing a predetermined amount of flour having a specific particle diameter is less likely to generate lumps and scatter flour, and has good handling properties. Patent document 2 describes that granulated wheat flour with good workability, which is less in lump formation and powder scattering, can be obtained by granulating a starting material powder containing wheat flour and water under non-heating conditions. Patent document 3 describes that a flour having no stickiness and a smooth texture can be obtained by dehydrating wheat flour and then heat-treating the dehydrated wheat flour at 100 ℃ or higher, and then heating the dehydrated wheat flour dispersed in water. Patent document 4 describes that modified wheat flour having an RVA peak viscosity of 3500 to 7000mPas obtained by subjecting raw wheat flour to a wet heat treatment or a dry heat treatment and a gelatinization start temperature lower by 10 ℃ or more than that of the raw wheat flour has good dispersibility in water and good handling properties, and is suitable for a batter for fried foods. Patent documents 5 to 9 disclose the use of a catalyst having a specific particle diameter,αThe wet heat-treated wheat flour having a degree of gelatinization and viscosity is used as wheat flour for baking, for coating material of fried food, for sauce or for miscellaneous pancake.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2014-103860,

patent document 2: japanese patent laid-open publication No. 2014-200208,

patent document 3: japanese patent laid-open publication No. 2013-76090,

patent document 4: international publication No. WO2017/135353,

patent document 5: in japanese patent No. 5069939 a,

patent document 6: in japanese patent No. 5069885 a,

patent document 7: in japanese patent No. 5069886 a,

patent document 8: in japanese patent No. 5069969 a,

patent document 9: japanese patent No. 5069887.

Disclosure of Invention

Problems to be solved by the invention

The present invention relates to a dusting composition for preparing fried food. More specifically, the present invention relates to a composition for dusting which improves the adhesion between a food material and a material for a batter and contributes to maintaining the crispy texture of a fried batter in the preparation of a fried food.

Means for solving the problems

The invention provides a composition for dusting, which contains 5% by mass or more of modified wheat flour,

the viscosity of an aqueous suspension of the modified wheat flour when heated to 85 ℃ and then cooled to 25 ℃ is 1000 mPas or less, and the degree of dispersion of the aqueous suspension when heated to 85 ℃ and then cooled to 25 ℃ and left to stand for 24 hours is 90% or less.

In addition, the present invention provides a method for preparing a fried food, comprising: the composition for dusting is attached to a food material, followed by frying after attaching a material for a batter to the food material.

In addition, the invention provides the use of modified wheat flour for the preparation of a composition for dusting, wherein,

the composition for dusting comprises 5% by mass or more of the modified wheat flour,

the viscosity of an aqueous suspension of the modified wheat flour when heated to 85 ℃ and then cooled to 25 ℃ is 1000 mPas or less, and the degree of dispersion of the aqueous suspension when heated to 85 ℃ and then cooled to 25 ℃ and left to stand for 24 hours is 90% or less.

Effects of the invention

The composition for powdering of the present invention can improve the adhesion between the food material and the material of the batter coating in the preparation of fried foods. In addition, the dusting composition of the present invention may also serve to maintain the crispy texture of the fried batter. Therefore, by using the composition for dusting of the present invention in the preparation of fried foods, the appearance or mouthfeel of the resulting fried foods can be improved.

Detailed Description

In the fried food with a batter coating, since the food material shrinks or deforms by heating, there is a problem that the batter coating peels off from the food material during or after cooking. In order to solve this problem, conventionally, a material is previously dusted and then cooked with a material for a batter so that the material for the batter and the material for the batter are well adhered to each other. In the field of fried food preparation, such a powder attached to the food material before the material of the batter is called dusting. Generally, flour containing wheat flour or starch is mainly used for dusting. Dusting improves the adhesion between the food material and the batter material and also prevents moisture from transferring from the food material before frying to the batter material. On the other hand, in the fried food after cooking, if the food material is in close contact with the batter, moisture in the food material is easily transferred to the batter, and therefore the batter easily loses its crispy texture with time. This tendency is remarkable when the fried food is preserved at low temperature.

Wheat flour contains crystallized starch grains, and enzymes or wheat proteins are present around the starch grains. When wheat flour is heated in the presence of moisture, starch particles in the wheat flour swell and the crystal structure disintegrates, so that a large amount of moisture can be retained. On the other hand, when the heated wheat flour is cooled, the starch is dehydrated and recrystallized. Since the recrystallization forms a crystal structure different from that before heating, the properties of the starch before and after heating and cooling are different. In addition, when moisture is present, proteins in wheat flour undergo structural changes due to the increase of hydrogen bonds or hydrolysis, and undergo irreversible modification by heating.

The structure or properties of starch and protein contained in wheat flour and the change in the structure or properties caused by addition of moisture to the wheat flour or heating are considered to contribute to the properties of the wheat flour, such as the moisture permeation rate, the moisture retention amount, and the texture of the dough after heating. Therefore, the present inventors examined the properties of aqueous suspensions of wheat flour under various conditions and investigated their applicability as dusting powders. As a result, they found that: wheat flour modified so that the viscosity of a suspension of wheat flour when the suspension is heated and then cooled is a predetermined value and the dispersibility of the suspension after a certain period of time from the cooling is a predetermined value has excellent properties when used as dusting.

Accordingly, the present invention provides a composition for dusting, which contains modified wheat flour suitable as an ingredient for preparing dusting for fried foods. The modified wheat flour had the following properties when prepared into a 10 mass% aqueous suspension of the modified wheat flour: the aqueous suspension has a viscosity of 1000 mPas or less when heated to 85 ℃ and cooled to 25 ℃ and a degree of dispersion of 90% or less when heated to 85 ℃ and cooled to 25 ℃ and left to stand for 24 hours. Hereinafter, the modified wheat flour having the above-specified viscosity and dispersibility, which is used in the composition in which the dusting of the present invention is used (hereinafter, also simply referred to as the composition of the present invention), is also referred to as the modified wheat flour of the present invention.

In the present specification, a 10 mass% aqueous suspension of wheat flour (including modified wheat flour) refers to a suspension containing 10 mass% of the wheat flour obtained by suspending the wheat flour in water. The viscosity of the aqueous suspension of wheat flour in the present specification is according to japanese industrial standard JIS Z8803: 2011 "method for measuring viscosity of liquid", the viscosity of the suspension is measured at 12 to 30rpm using a rotary viscometer. The viscosity of the aqueous suspension of wheat flour, preferably measured in the present specification, is a value obtained as follows: the value is obtained by subjecting the aqueous suspension of wheat flour prepared at 25 ℃ to a predetermined treatment (heating, cooling, standing, etc.) as necessary, and then measuring the viscosity by the above-mentioned method.

The 10 mass% aqueous suspension of the modified wheat flour of the present invention may have a viscosity of 1000 mPas or less, preferably 800 mPas or less, more preferably 600 mPas or less, and still more preferably 400 mPas or less, when the aqueous suspension is heated to 85 ℃ and then cooled to 25 ℃. If the viscosity exceeds 1000mPa · s, the crispy texture and the mouth-soluble property of the batter of the fried food obtained by using the batter of the present invention are reduced. The lower limit of the viscosity of the 10 mass% aqueous suspension of modified wheat flour of the present invention is not particularly limited, and the lower the viscosity when the aqueous suspension is heated to 85 ℃ and then cooled to 25 ℃. The viscosity may be preferably a value not more than the detection limit of the rotary viscometer used in the above-mentioned measurement method, that is, as low as a value which cannot be measured with the rotary viscometer, for example, 10 mPas or less.

The dispersion degree of the aqueous suspension of wheat flour in the present specification means a ratio of dispersing the wheat flour particles in the suspension (maintaining a state in which the wheat flour particles are suspended in water without floating or precipitating). The high degree of dispersion indicates that the wheat flour particles are easily dispersed in water and are less likely to be separated from water by floating or settling. The dispersibility of the aqueous suspension of wheat flour in the present specification is a value calculated according to the following procedure: the aqueous suspension of wheat flour was transferred to a container such as a measuring cylinder, the container having a capacity which can be visually observed from the outside, and after standing for a predetermined time, the boundary between the turbid portion containing wheat flour in the suspension and the other transparent portion was visually observed, the volume of the turbid portion was measured based on the boundary, and then the degree of dispersion was calculated based on the volumes and the following formula.

Dispersion (%) = volume/total volume of portion where turbidity exists × 100

(Total volume = volume of portion where turbidity is present + volume of transparent portion)

The dispersity of the aqueous suspension of wheat flour, preferably measured in this specification, is a value obtained as follows: the value is obtained by subjecting the aqueous suspension of wheat flour prepared at 25 ℃ to a predetermined treatment (heating, cooling, etc.) as necessary, then leaving the suspension for 24 hours, and measuring the degree of dispersion by the above-mentioned method.

The 10 mass% aqueous suspension of modified wheat flour of the present invention may be obtained by raising the temperature of the aqueous suspension to 85 ℃, cooling the aqueous suspension to 25 ℃, and then leaving the aqueous suspension for 24 hours with a degree of dispersion of 90% or less, preferably 80% or less, more preferably 70% or less, and still more preferably 65% or less. If the dispersion exceeds 90%, the adhesion of the coating of the fried food obtained by using the composition of the present invention and the crispy feeling of the coating are reduced. The dispersion degree of the 10 mass% aqueous suspension of modified wheat flour of the present invention is preferably 10 to 90%, more preferably 10 to 80%, even more preferably 15 to 70%, and still more preferably 20 to 65% when the aqueous suspension is heated to 85 ℃, then cooled to 25 ℃, and left to stand for 24 hours.

The modified wheat flour of the present invention preferably has an average particle diameter of less than 150 μm, more preferably 15 to 120 μm, and still more preferably 20 to 100 μm, from the viewpoint of obtaining an appearance similar to that of ordinary wheat flour. In the present specification, the average particle diameter of wheat flour refers to a volume average diameter measured by a laser diffraction/scattering method. As the measuring apparatus for the average particle diameter, a commercially available laser diffraction particle size distribution measuring apparatus, for example, MICROTRAC MT3000II (japan ltd., ltd.) can be used.

Modified wheat flour of the inventionαThe degree of conversion is preferably 12% or less, more preferably 10% or less, and still more preferably 9% or less. Modified wheat flourαIf the degree of gelatinization is too high, the workability during cooking may be reduced, or the crispiness of the coating of the resulting fried food may be reduced. Of wheat flour in this specificationαThe degree of conversion is determined by the beta-amylase-pullulanase (BAP) methodαDegree of formation.

The modified wheat flour of the present invention may have the same moisture content as that of ordinary wheat flour. The moisture content of wheat flour in a normal environment (an environment with a humidity of about 20 to 90%) is about 10 to 14 mass%. Therefore, the moisture content of the modified wheat flour is preferably 10 to 14 mass%, more preferably 11 to 13 mass%. In the present specification, the moisture content of wheat flour is a value obtained from a change in mass of wheat flour dried at 135 ℃ for 1 hour from that before drying.

The modified wheat flour of the present invention can be produced by subjecting a raw wheat flour to a modification treatment under such treatment conditions that the modified wheat flour has the predetermined values of viscosity and dispersion. The kind of the raw wheat flour is not particularly limited, and high gluten wheat flour, medium gluten wheat flour, low gluten wheat flour, hard grain flour, etc. can be used. Among them, low gluten wheat flour is preferable. Is provided at the modified partThe moisture content of the raw material wheat flour is preferably 10 to 14 mass%, more preferably 11 to 13 mass%. The raw wheat flour may be previously subjected to moisture conditioning as required so that the moisture content is preferably 10 to 14 mass%, more preferably 11 to 13 mass%. In addition, the raw material is wheat flourαThe modified wheat flour of the present invention has a degree of conversion of not higher than that of the modified wheat flour of the present invention, preferably not higher than 12%, more preferably not higher than 10%, and still more preferably not higher than 9%.

Examples of the method of modification treatment of the raw wheat flour include heat treatment and chemical treatment, and heat treatment is preferable in consideration of the residue of components such as reagents in the obtained modified wheat flour. The heat treatment may be wet heat treatment or dry heat treatment. However, if a large amount of water is present during the heat treatment, the heat-treated wheat flour is generatedαAnd thus, the operability is reduced. On the other hand, it is not preferable that the moisture of the wheat flour is lost during the heat treatment because the wheat flour turns brown.

Therefore, as the heat treatment for obtaining the modified wheat flour of the present invention, it is preferable to heat treat the raw wheat flour under such conditions that the moisture content is not excessively increased or lost during heating and the modified wheat flour after heating can maintain the same moisture content as the raw wheat flour. For example, it is preferable to prepare a modified wheat flour having a moisture content of 10 to 14 mass% by heating a raw wheat flour having a moisture content of 10 to 14 mass% in an environment (e.g., sealed) in which moisture is not scattered by evaporation or the like. If necessary, the raw material wheat flour may be heated while being stirred. Preferably, in the heat treatment of the raw wheat flour, the raw wheat flour is put into a container (for example, a sealed bag, a kiln, a capsule, or the like) in which steam can be sealed, and the raw wheat flour is heated together with the container, preferably while stirring. In the case where the raw wheat flour is heated under a sealed condition, moisture volatilized from the wheat flour is condensed again on the wheat flour, so that the moisture content of the heated wheat flour is hardly changed or slightly reduced from that before heating. On the other hand, a method of directly blowing heat or hot air to wheat flour, baking, and the like are not preferable because moisture of wheat flour is evaporated and removed. When heating the raw wheat flour, it is preferable to heat the raw wheat flour without adding moisture other than the moisture originally contained in the raw wheat flour. However, as long as the moisture content of the modified wheat flour after heating is maintained within the above range, it is permissible to add moisture to the raw wheat flour.

In the heat treatment, the temperature of the heat treatment is preferably 70 to 170 ℃, more preferably 80 to 150 ℃, even more preferably 90 to 140 ℃, and even more preferably 90 to 130 ℃ based on the product temperature of the wheat flour. The heating time is 10 to 80 minutes, preferably 15 to 70 minutes, more preferably 15 to 65 minutes, still more preferably 15 to 60 minutes, still more preferably 20 to 60 minutes, and still more preferably 30 to 60 minutes. The heat treatment under the above-described conditions under sealing can be performed, for example, by using a commercially available sealed heat mixer (for example, Rocking Dryer, manufactured by jeopard electric machinery).

When the raw wheat flour is heated, if the raw wheat flour is heated in the presence of water, the raw wheat flour is heatedαThe degree of formation will increase. Therefore, in the heat treatment of the above-mentioned raw wheat flour, it is preferable to adjust the heating temperature and the moisture content of the raw wheat flour so that the heated wheat flour hasαThe degree of conversion falls within the above-mentioned modified wheat flour of the present inventionαThe degree of formation is within the range.

The obtained heated wheat flour may be pulverized or classified as necessary to prepare a modified wheat flour of the present invention having an average particle diameter as described above. However, in the above-mentioned heat treatment for obtaining the modified wheat flour of the present invention, since the wheat flours hardly stick to each other and are granulated, the pulverization and classification are not substantially required.

The modified wheat flour of the present invention obtained by the above-described steps has excellent properties as a dusting powder in the preparation of fried foods. The fried food prepared using the dusting composition containing the modified wheat flour of the present invention improves the cohesiveness between the food material and the material of the batter coating in the preparation of the fried food, and maintains the crispy texture of the batter coating in the fried food after cooking. Therefore, by using the modified wheat flour of the present invention as an ingredient of the dusting composition, a high-quality fried food having good appearance and mouthfeel can be prepared.

The dusting composition of the present invention is a composition containing the modified wheat flour of the present invention. The content of the modified wheat flour of the present invention in the composition of the present invention is not less than 5% by mass, preferably 5 to 60% by mass, more preferably 5 to 30% by mass, still more preferably 10 to 30% by mass, and yet more preferably 15 to 25% by mass.

Examples of the components other than the modified wheat flour of the present invention contained in the dusting composition of the present invention include, but are not limited to, grain flour other than the modified wheat flour of the present invention, starch, saccharides such as dextrin, syrup, and sugar alcohol, egg powder or protein other than protein powder, thickeners, seasonings such as salt and amino acid, spices, and oils and fats. Examples of the cereal flour other than the modified wheat flour of the present invention include unmodified wheat flour, dry heat-treated wheat flour,αwheat flour other than the modified wheat flour, such as wheat flour, barley flour, rye flour, rice flour, corn flour, sorghum flour, bean flour, etc. Examples of the starch include starches such as potato starch, tapioca starch, corn starch, waxy corn starch and wheat starch, and processed starches thereof (S) ((R))αEsterified starch, etherified starch, esterified starch, acetylated starch, cross-linked starch, etc.). The composition containing the modified wheat flour of the present invention may contain any one kind of component selected from among the aforementioned cereal flour, starch and other raw materials other than the modified wheat flour of the present invention, alone, or may contain any two or more kinds. The content of the components other than the modified wheat flour of the present invention contained in the composition may be 95 mass% or less, which is the balance of the modified wheat flour of the present invention. The dusting composition of the present invention preferably contains 1 or more kinds selected from among the group consisting of grain flour and starch other than the modified wheat flour of the present invention, and the total content thereof is 95% by mass or less, preferably 40 to 95% by mass, more preferably 70 to 95% by mass, even more preferably 70 to 90% by mass, and even more preferably 75 to 85% by mass. More preferably, the cereal flour or starch other than the modified wheat flour of the present invention contains 1 or more kinds selected from the group consisting of raw starch, rice flour and barley flour, and the total content of the raw starch, rice flour and barley flour in the dusting composition of the present invention is preferably 20 to 20 ℃50% by mass.

A fried food can be prepared by attaching the dusting composition of the present invention to a food material, then attaching a batter material thereto, and then frying. The food material of the fried food is not particularly limited, and examples thereof include meat such as chicken, pig, cow, sheep, and goat, fish and shellfish such as cuttlefish, shrimp, and horse mackerel, and vegetables. The composition of the present invention is preferably applied to foods that are easily shrunk by heating, such as meat, fish, and shellfish, from the viewpoint of improving adhesiveness between the foods and the batter. The kind of the fried food prepared by using the composition of the present invention as the dusting powder is not particularly limited as long as it is a fried food with a coating, and examples thereof include a dry fried food, a french fries, tempura or a fried pie, a fried food with a flour, and the like.

In the case of using the dusting composition of the invention in the preparation of fried foods, the powdery composition of the invention may be directly attached to the food material. If desired, the food material may be seasoned prior to application of the composition of the present invention. Next, a suitable material for a top coat is attached to the food material to which the composition of the present invention is attached. The material may be a powdered material (coating) or a liquid material (slurry). The kind of the attached material of the top coat may be an appropriate one depending on the kind of the fried food to be prepared. Examples of the mix include, but are not limited to, bread flour, dry-fried flour, cereal flour, and starch. Examples of the batter slurry include, but are not limited to, egg liquid, batter slurry for fried foods such as tempura and bread powder, and batter slurry for dry fried foods.

Then, the food material to which the batter material is attached is fried to prepare a fried food. Frying can be carried out according to a conventional method, for example, by deep-frying with a large amount of oil or frying with a small amount of oil.

Examples

Hereinafter, examples are given to explain the present invention more specifically, but the present invention is not limited to the following examples.

Reference example 1

In the following examples, the viscosity and dispersibility of wheat flour were measured by the following methods.

[ measurement of viscosity of wheat flour ]

50g of wheat flour was put into a pan with a measured tare weight, 450mL of 25 ℃ water was added, and the mixture was stirred with a stirrer until the mixture was uniformly dispersed, thereby obtaining a uniform dispersion as a whole. Water was added to the dispersion until the mass of the pan with the tare removed reached 500g, and the mixture was stirred to be uniform as a whole. Heating the small pot, stirring the dispersion liquid and raising the temperature to 85 ℃. After reaching 85 ℃, the pan was placed in an ice bath and the dispersion was cooled to 25 ℃. Next, to replenish the evaporated water, water (25 ℃ C.) was added to the dispersion until the tared weight of the pan became 500g, and the mixture was stirred to make the whole uniform. The viscosity of the obtained dispersion was measured at 25 ℃ and 12 to 30rpm using a type B viscometer.

[ measurement of dispersibility of wheat flour ]

50g of wheat flour was put into a pan with a measured tare weight, 450mL of 25 ℃ water was added, and the mixture was stirred with a stirrer until the mixture was uniformly dispersed, thereby obtaining a uniform dispersion as a whole. Water was added to the dispersion until the mass of the pan with the tare removed reached 500g, and the mixture was stirred to be uniform as a whole. Heating the small pot, stirring the dispersion liquid and raising the temperature to 85 ℃. After reaching 85 ℃, the pan was placed in an ice bath and the dispersion was cooled to 25 ℃. Next, to replenish the evaporated water, water (25 ℃ C.) was added to the dispersion until the tared weight of the pan became 500g, and the mixture was stirred to make the whole uniform. 100mL of the resulting dispersion was poured into a 100mL measuring cylinder, and the mouth of the measuring cylinder was sealed and allowed to stand at 25 ℃ for 24 hours. The boundary between the turbid portion containing wheat flour and the transparent portion other than the turbid portion of the dispersion liquid after 24 hours was visually observed, and the volume of each portion was measured. The dispersion degree of the dispersion liquid was calculated based on the following formula.

Degree of dispersion (%) = volume (mL) of portion where turbidity exists)/100 mL × 100

Test example 1

1. Preparation of modified wheat flour

Heat-treated wheat flour was prepared according to the following procedure. As a starting wheat flour, a low gluten wheat flour (manufactured by Nisshin Foods) having a moisture content of 13 mass% (αDegree of conversion is 4).

[ preparation examples 1 to 3]

The following conditions were used using a closed heating mixer (known as a rock Dryer) in the following conditions: the raw wheat flour was heated at 90 deg.C/60 min (preparation example 1), 110 deg.C/30 min (preparation example 2) or 130 deg.C/60 min (preparation example 3). The moisture content of the wheat flour after heating was about 12 mass%,αthe degree of conversion is in the range of 9-12. The viscosity and dispersibility of the heated wheat flour were measured by the method of reference example 1.

[ comparative preparation examples 1 to 2]

The raw wheat flour was stored in a retort pouch in a flat plate shape having a thickness of about 5mm, and after sealing the mouth, the resultant was heated at 60 ℃ for 1 minute (comparative preparation example 1) or 6 minutes (comparative preparation example 2). The moisture content of the heated wheat flour was 13 mass%,αthe degree of conversion is in the range of 4 to 6. The viscosity and dispersibility of the heated wheat flour were measured by the method of reference example 1.

[ comparative preparation examples 3 to 4]

Water was added to the raw wheat flour in an amount of 15 mass% based on the mass of the wheat flour, and the mixture was sealed in a heat-resistant sealed container. The vessel was heated at 110 ℃ for 2 minutes in an oil bath (comparative preparation 3) or at 110 ℃ for 30 minutes (comparative preparation 4). The moisture content of the heated wheat flour was 27 mass%,αthe degree of conversion is 60 or more. The viscosity and dispersibility of the heated wheat flour were measured by the method of reference example 1.

Comparative preparation example 5

Putting wheat flour as raw material into a small pot, putting the pot into an electric furnace, heating at about 120 deg.C while stirring for 30 min to prevent scorching. The moisture content of the heated wheat flour was 4 mass%,αthe degree of conversion was 9. The viscosity and dispersibility of the heated wheat flour were measured by the method of reference example 1.

The heating conditions and properties of the modified wheat flour thus prepared are shown in table 1. Table 1 also shows the properties of the raw wheat flour for reference.

[ Table 1]

2. Preparation method of fried pork chop

A dusting composition containing the modified wheat flour obtained in item 1 was prepared in accordance with the composition shown in table 2. As the untreated wheat flour, the raw wheat flour used in item 1 was used. The composition was allowed to adhere to the entire surface of pork back (thickness 1cm, 200 g). Mixing 30 mass% of low gluten wheat flour, 10 mass% of whole egg and 60 mass% of cold water to prepare a batter, soaking meat attached with the composition therein, spreading bread powder, and frying in oil at 170 deg.C for 4 minutes to prepare fried pork chop. The prepared pork cutlet was kept in a refrigerator for 6 hours and then at room temperature (about 25 ℃ C.) for 1 hour after eliminating the residual heat. The preserved pork cutlet was cut with a kitchen knife, and the adhesiveness of the batter was evaluated. In addition, the mouth feel of the batter was evaluated when the preserved pork steaks were eaten. Evaluation was performed by 10 professional judges (professional panel) according to the following evaluation criteria, and the average score of the evaluation results of 10 persons was obtained. The results are shown in table 2.

Evaluation criteria

[ adhesiveness of the topcoat ]

5: the coating is completely not peeled off when the fried pork chops are cut by the kitchen knife, and is extremely good;

4: the dough cover is hardly peeled off when the fried pork chop is cut by a kitchen knife, and the fried pork chop is good;

3: when the fried pork chops are cut by a kitchen knife, the partial wrappers are peeled off in a part which is 10-20% of the circumference of the wrappers on the cut surfaces;

2: when the pork chop is cut by the kitchen knife, the part of the dough cover which is more than 20 percent and less than 50 percent of the circumference of the dough cover corresponding to the cut surface is peeled off, and the difference is poor;

1: when the fried food is cut with a kitchen knife, the batter peels off at a portion of the batter that is more than 50% of the perimeter of the batter corresponding to the cut surface, and it is extremely poor.

[ texture of the topcoat ]

5: the product is crisp and rich in brittleness, and is extremely good;

4: the product is crisp and good;

3: a slightly crisp feeling is not achieved;

2: slightly moist or slightly tacky, lacking crunchy feel;

1: moist or sticky, no crunchy feeling, poor.

[ Table 2]

Test example 2

Modified wheat flour was prepared by following the same procedure as in preparation example 1 of test example 1 except that the temperature and time of heating were changed as shown in Table 3, and the viscosity and dispersion were measured by the method of reference example 1. Using the obtained modified wheat flour, a dusting composition was prepared in the same composition as in example composition 1 of test example 1. Using the resultant batter material, pork cutlets were prepared and evaluated in the same procedure as in test example 1. The results are shown in table 3.

[ Table 3]

Test example 3

Dusting compositions having the compositions shown in Table 4 were prepared, and using these compositions, pork cutlets were prepared and evaluated in the same manner as in test example 1. The results are shown in table 4.

[ Table 4]

Test example 4

Dusting compositions having the compositions shown in Table 5 were prepared, and using these compositions, pork cutlets were prepared and evaluated in the same manner as in test example 1. The results are shown in table 5.

[ Table 5]

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