阅读说明：本技术 一种集成有加热模块的数字微流控芯片 (Digital micro-fluidic chip integrated with heating module ) 是由 陈宏� 程浩 姚薇 沈杰男 朱永生 于 2021-09-02 设计创作，主要内容包括：一种集成有加热模块的数字微流控芯片,涉及微流控芯片领域。将温控模块集成在数字微流控芯片的基板上,但与驱动电极阵列(或接地电极)不在基板的同一侧,从而实现温控模块在数字微流控芯片上高效集成。温控模块可由加热丝组成,或由加热丝和测温丝组成。所述温控模块在数字微流控芯片上可集成至少一个。通过在芯片表面集成分别用于加热和测温的电阻丝回路,在实现对微流控芯片的集成式、反馈式的温度控制。得益于反馈控温机制,可用于在数字微流控芯片上进行聚合酶链式反应等需要高精度控温的反应中；由于加热模块集成在芯片表面,还特别适合数字微流控芯片的便携式应用中。(A digital micro-fluidic chip integrated with a heating module relates to the field of micro-fluidic chips. The temperature control module is integrated on the substrate of the digital microfluidic chip, but is not on the same side of the substrate as the driving electrode array (or the grounding electrode), so that the temperature control module is efficiently integrated on the digital microfluidic chip. The temperature control module can be composed of a heating wire or a heating wire and a temperature measuring wire. The temperature control module can be integrated with at least one digital microfluidic chip. Resistance wire loops for heating and temperature measurement are integrated on the surface of the chip, so that integrated and feedback type temperature control of the microfluidic chip is realized. The system is beneficial to a feedback temperature control mechanism, and can be used for performing polymerase chain reaction and other reactions requiring high-precision temperature control on a digital microfluidic chip; the heating module is integrated on the surface of the chip, so that the heating module is particularly suitable for portable application of the digital microfluidic chip.)

1. The digital microfluidic chip integrated with the heating module comprises a digital microfluidic chip, a driving electrode array and a grounding electrode and is characterized in that a temperature control module is integrated on a substrate of the digital microfluidic chip, and the temperature control module, the driving electrode array and the grounding electrode are positioned on different sides of the substrate.

2. The digital microfluidic chip integrated with a heating module according to claim 1, wherein the digital microfluidic chip comprises a parallel plate format and a single-plate format.

3. The digital microfluidic chip integrated with a heating module according to claim 2, wherein when the digital microfluidic chip is in the form of parallel plates, one substrate is provided with a driving electrode array, the other substrate is provided with a grounding electrode, and the temperature control module is integrally arranged on the other side of the substrate provided with the driving electrode array or on the other side of the substrate provided with the grounding electrode; or one side of the two substrates is respectively provided with a driving electrode array and a grounding electrode, and the plurality of temperature control modules are integrated on the other side of the two substrates.

4. The digital microfluidic chip integrated with a heating module as claimed in claim 2, wherein when the digital microfluidic chip is in the form of a single-electrode plate, the driving electrode array and the ground electrode are disposed on the same side of the single-chip substrate, and the temperature control module is integrated on the other side of the substrate of the driving electrode and the ground electrode.

5. The digital microfluidic chip integrated with a heating module as claimed in any one of claims 1 to 4, wherein the temperature control module is composed of a heating wire for heating or a heating wire and a temperature measuring wire for measuring temperature of a temperature control region.

6. The digital microfluidic chip integrated with a heating module as claimed in any one of claims 1 to 4, wherein at least one temperature control module is provided.

Technical Field

The invention relates to the field of microfluidic chips, in particular to a digital microfluidic chip integrated with a heating module.

Background

The micro-fluidic chip is characterized in that micro-channels and micro-structures with micron sizes are manufactured on substrate materials such as silicon, glass and high polymers, and various functions such as reaction, separation, detection and the like are realized on a solution by utilizing the micro-channels and the micro-structures. The characteristic size of the micro-channel and the micro-structure is in the micron level, and the micro-channel and the micro-structure have the capability of rapid mass transfer and heat transfer, so the micro-channel and the micro-structure have excellent performance, and are widely applied to various fields such as chemical analysis, biochemical detection, immunoassay, cell (tissue) culture and the like.

The digital micro-fluidic chip belongs to a micro-fluidic chip, but is different from a conventional micro-fluidic chip in that the droplet is controlled by utilizing the electrowetting phenomenon on a medium. And manufacturing a driving electrode array on the substrate material, and manufacturing a dielectric layer and a hydrophobic layer on the driving electrode array. Whether the drive electrode is energized or not can change the wettability of the dielectric layer (hydrophobic layer) above the drive electrode. The digital microfluidic chip changes the wettability of different areas of the medium layer sequentially by changing the state of the driving electrode array in a programming manner, so that the free movement of liquid drops is controlled. The digital microfluidic chip mainly has two different structures: a parallel plate form and a unipolar plate form. In the parallel plate format, the droplet is sandwiched between two parallel substrates, one of which has an array of drive electrodes fabricated thereon and the other of which has a ground electrode fabricated thereon (to form an electrical circuit with the drive electrodes). In the unipolar plate format, the droplets are on top of a single substrate carrying the drive and ground electrodes.

In many applications, such as specific binding of antigen and antibody in immune reactions and polymerase chain reaction, it is necessary to provide a temperature higher than room temperature on a digital microfluidic chip and to maintain stability, and some attempts have been reported. It is reported that the required temperature is provided by an external heating module (Sista R, Hua Z, Thwar P, et al. development of a digital microfluidic platform for point of card testing [ J ]. Lab on a Chip,2008,8(12):2091-, 2014,14(20):4076-4084.). The mode of using external heating module and heating film, relatively easy realization, but the integrated level is not high and the performance is relatively poor. The temperature control module integrated by using the CMOS integrated circuit process has high integration level and good performance, but has complex processing process and high cost. And the driving electrode array and the temperature control module are manufactured on the same side of the substrate, and are isolated by using an insulating layer or a dielectric layer, but the driving electrode array and the temperature control module are easily influenced mutually and generate interference.

Disclosure of Invention

The invention aims to overcome the defects in the prior art, and provides a digital microfluidic chip integrated with a heating module, which integrates a temperature control module on a substrate of the digital microfluidic chip, but is not on the same side of the substrate as a driving electrode array (or a grounding electrode), so that the temperature control module is efficiently integrated on the digital microfluidic chip.

The digital microfluidic chip integrated with the heating module is characterized in that the temperature control module is integrated on a substrate of the digital microfluidic chip, and the temperature control module and the driving electrode array/grounding electrode are positioned on different sides of the substrate.

The digital microfluidic chip comprises a parallel polar plate form and a unipolar plate form;

when the digital microfluidic chip in the form of a parallel polar plate is adopted, a driving electrode array is manufactured on one substrate, and a grounding electrode is manufactured on the other substrate; the temperature control module is integrated on the other side of the substrate provided with the driving electrode array, or on the other side of the substrate provided with the grounding electrode, or on the other sides of the two substrates respectively provided with the driving electrode array and the grounding electrode.

When the digital microfluidic chip in the form of a single-electrode plate is adopted, the driving electrode array and the grounding electrode are processed on the same side of the single-chip substrate, and the temperature control module is integrated on the other side of the substrate of the driving electrode array and the grounding electrode array.

The temperature control module can be composed of heating wires or heating wires and temperature measuring wires, the heating wires are used for realizing temperature rise, and the temperature measuring wires are used for measuring the temperature of a temperature control area.

The temperature control module can be integrated with at least one digital microfluidic chip.

Compared with the prior art, the invention has the following outstanding advantages:

traditional multi-purpose external heating module of chip heating, its advantage lies in with low costs and the product is ripe, but external module volume is too big, needs extra correcting unit, loses little, the good advantage of portability of micro-fluidic chip original volume. The digital micro-fluidic chip integrated with the heating module provided by the invention realizes integrated and feedback type temperature control of the micro-fluidic chip by integrating resistance wire loops which are respectively used for heating and temperature measurement on the surface of the chip. The system is beneficial to a feedback temperature control mechanism, and can be used for performing polymerase chain reaction and other reactions requiring high-precision temperature control on a digital microfluidic chip; the heating module is integrated on the surface of the chip, so that the heating module is particularly suitable for portable application of the digital microfluidic chip.

Drawings

Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention.

Fig. 2 is a schematic structural diagram of embodiment 2 of the present invention.

Fig. 3 is a schematic structural diagram of embodiment 3 of the present invention.

Fig. 4 is a schematic structural diagram of embodiment 4 of the present invention.

Fig. 5 is a schematic structural view of a temperature control module with only heating wires.

FIG. 6 is a schematic structural diagram of a temperature control module including a heating wire and a temperature measuring wire.

Each of the labels in the figure is: 1 is a substrate; 2 is a drive electrode array; 3 is a ground electrode; 4 is a hydrophobic layer; 5 is a dielectric layer; 6 is a temperature control module; 7 is a heating wire; 8 is a heating wire interface; 9 is a temperature measuring wire; and 10 is a temperature measuring wire interface.

Detailed Description

The following examples will further illustrate the present invention with reference to the accompanying drawings. The present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and process are given, but the scope of the present invention is not limited to the following embodiments.

Example 1

Fig. 1 shows a schematic diagram of a digital microfluidic chip in the form of a parallel plate, and an integrated temperature control module fabricated on the back of a substrate with a driving electrode array. The digital micro-fluidic chip is integrated with three temperature control modules and is in a parallel polar plate form, the digital micro-fluidic chip is composed of an upper substrate and a lower substrate (1), a grounding electrode (3) and a hydrophobic layer (4) are sequentially arranged on the lower surface of the upper substrate, and a driving electrode array (2), a dielectric layer (5) and the hydrophobic layer (4) are sequentially arranged on the upper surface of the lower substrate; the three temperature control modules (6) are integrated on the lower surface of the lower substrate, and a medium layer (5) is arranged in the residual area of the lower surface for protection.

Example 2

FIG. 2 shows a schematic diagram of a digital microfluidic chip in the form of a parallel plate with an integrated temperature control module fabricated on the back side of a substrate with a ground electrode; the digital micro-fluidic chip is integrated with three temperature control modules and is in a parallel polar plate form, the digital micro-fluidic chip is composed of an upper substrate and a lower substrate (1), a grounding electrode (3) and a hydrophobic layer (4) are sequentially arranged on the lower surface of the upper substrate, and a driving electrode array (2), a dielectric layer (5) and the hydrophobic layer (4) are sequentially arranged on the upper surface of the lower substrate; three temperature control modules (6) are integrated on the upper surface of the upper substrate, and a dielectric layer (5) is arranged in the residual area for protection.

Example 3

Fig. 3 shows a schematic diagram of a digital microfluidic chip in the form of a parallel plate, in which integrated temperature control modules are fabricated on both the back of a substrate on which a driving electrode dot array and a ground electrode are processed. The digital micro-fluidic chip is integrated with six temperature control modules and is in a parallel polar plate form, the digital micro-fluidic chip is composed of two substrates (1), a grounding electrode (3) and a hydrophobic layer (4) are sequentially arranged on the lower surface of an upper substrate, and a driving electrode array (2), a dielectric layer (5) and the hydrophobic layer (4) are sequentially arranged on the upper surface of a lower substrate; three temperature control modules (6) are integrated on the upper surface of the upper substrate, and a dielectric layer (5) is arranged in the rest area for protection; the other three temperature control modules (6) are integrated on the lower surface of the lower substrate, and the rest area is provided with a dielectric layer (5) for protection.

Example 4

Fig. 4 shows a schematic diagram of a digital microfluidic chip in the form of a single-electrode plate, and an integrated temperature control module fabricated on the back of a substrate with a driving electrode array and a power connection electrode. The digital micro-fluidic chip is integrated with two temperature control modules and is in a single-pole plate form, the digital micro-fluidic chip is composed of a substrate (1), a driving electrode array (2) and a grounding electrode (3) are manufactured on the upper surface of the substrate, a dielectric layer is arranged on the dielectric layer, and a hydrophobic layer (4) is arranged on the dielectric layer; two temperature control modules (6) are integrated on the lower surface of the substrate, and a dielectric layer (5) is manufactured in the residual area for protection.

Fig. 5 shows a schematic view of the structure of a temperature control module with only heating wires. The temperature control module only comprises a heating wire (7) which is in a winding shape, and two ends of the temperature control module are connected with an external circuit through a heating wire interface (8).

Fig. 6 is a schematic structural diagram of a temperature control module including both a heating wire and a temperature measuring wire. The temperature control module is composed of a heating wire (7) and a temperature measuring wire (9) together and is in a winding shape. Two ends of the heating wire are connected with an external circuit through heating wire interfaces (8), and two ends of the temperature measuring wire are connected with an external temperature measuring circuit through temperature measuring wire interfaces (10).

The invention realizes the integrated and feedback temperature control of the micro-fluidic chip by integrating resistance wire loops which are respectively used for heating and temperature measurement on the surface of the chip. The system is beneficial to a feedback temperature control mechanism, and can be used for performing polymerase chain reaction and other reactions requiring high-precision temperature control on a digital microfluidic chip; the heating module is integrated on the surface of the chip, so that the volume is small and the carrying is convenient.