阅读说明：本技术 一种变结构的堆叠缆线拓扑及其封装方法 (Variable-structure stacked cable topology and packaging method thereof ) 是由 盛杰 王雪亮 李柱永 王龙彪 于 2021-06-24 设计创作，主要内容包括：本发明公开了一种变结构的堆叠缆线拓扑及其封装方法,涉及电缆线技术领域,其中,变结构的堆叠缆线拓扑包括：多段堆叠缆线,多段堆叠缆线依次连接,每段堆叠缆线包括同等数量的多条基带,多条基带之间相互连接,多条基带中至少一条为超导带。本发明通过多段堆叠缆线依次连接形成缆线拓扑结构,其中,每段堆叠缆线中只设有超导带,或超导带和铜带的组合体以形成变结构的缆线拓扑结构,通过各区域封装的超导带数量不同,将这段缆线用于绕制线圈时,就能够使线圈整体的临界电流沿缆线长度方向上近似均匀,该变结构的堆叠缆线拓扑设计不仅可以提高线圈的磁场参数,还能最大可能地节省超导带材的用量。(The invention discloses a variable-structure stacked cable topology and a packaging method thereof, relating to the technical field of cables, wherein the variable-structure stacked cable topology comprises the following steps: the cable is piled up to the multistage, and the multistage is piled up the cable and is connected gradually, and every section is piled up the cable and is included many basebands of equal quantity, interconnect between many basebands, and at least one in many basebands is the superconductive tape. The invention forms a cable topological structure by sequentially connecting a plurality of sections of stacked cables, wherein each section of stacked cable is only provided with a superconducting tape or a combination of the superconducting tape and a copper tape to form a cable topological structure with a variable structure, and when the section of cable is used for winding a coil, the critical current of the whole coil is approximately uniform along the length direction of the cable through different numbers of the superconducting tapes packaged in each area.)

1. A variable-configuration stacked cable topology, comprising: the cable is piled up to the multistage, the multistage pile up the cable and connect gradually, every section it includes many baseband of equal quantity to pile up the cable, many interconnect between the baseband, many at least one is the superconductive area in the baseband.

2. The varied configuration stacked cable topology of claim 1, wherein at least one of said plurality of base tapes is a copper tape.

3. The variable-structure stacked cable topology of claim 2, wherein if the base bands of corresponding layers in adjacent segments of stacked cables are all superconducting or copper bands, the base bands of adjacent segments are integrally formed; if the base bands of the corresponding layers in the adjacent stacked cables are the superconducting bands and the copper bands respectively, the connection positions of the base bands are welded.

4. A variable configuration stacked cable topology according to claim 1, wherein a plurality of said base strips are connected by solder.

5. A variable-configuration stacked cable topology according to claim 1, wherein a plurality of said base bands are tiled.

6. The variable-structure stacked cable topology of claim 1, further comprising an encapsulation layer disposed on an outer wall of the stacked cable.

7. A packaging method for a variable-structure stacked cable topology is characterized by specifically comprising the following steps:

s10, calculating and analyzing the magnetic field distribution of the coil through finite element simulation;

s20, determining that the stacked cable consists of a plurality of sections according to the magnetic field distribution, and determining the number of base band layers, the number of superconducting bands and the number of copper bands in each section of cable;

s30, forming the base bands of all the sections in the same layer of the cable into an integral structure, wherein if the base bands of the corresponding layers in the adjacent sections of the stacked cable are all superconducting bands or copper bands, the base bands of the adjacent sections adopt an integral forming structure; if the base bands of the corresponding layers in the adjacent sections of the stacked cables are respectively a superconducting band and a copper band, the superconducting band and the copper band between the adjacent sections are connected in a spot welding mode;

and S40, packaging the multilayer base band formed in the S30 by using a soldering tin furnace, pressing the multilayer base band together through the matching of a pay-off reel and a guide wheel, penetrating the multilayer base band through a soldering tin pool, penetrating the base band through soldering tin liquid melted at the ambient temperature of 150-200 ℃, and solidifying the soldering tin carried on the base band in the air to form a complete cable after the base band is discharged from the soldering tin pool.

8. The method of claim 7, further comprising forming an outer package by encapsulating the cable with copper or aluminum to form an encapsulation layer on the outside of the cable.

Technical Field

The invention relates to the technical field of cables, in particular to a variable-structure stacked cable topology and a packaging method thereof.

Background

The second generation high temperature superconducting material (REBCO coated conductor) superconducting material has no direct current resistance loss and high conduction current density, and becomes a research hotspot in the field of power equipment, and the related applications such as superconducting cables, superconducting energy storage, superconducting transformers, superconducting current limiters, superconducting motors and the like develop rapidly, and have great advantages in the application aspect of high field magnets due to the higher upper critical magnetic field. However, due to the existence of high aspect ratio, the second generation high temperature superconducting tapes have anisotropic characteristics, and in order to obtain higher engineering current density and weaken anisotropy, researchers have proposed many different topologies of high temperature superconducting cables, including transpositionally braided robable cables, twisted stacked cables (TSTC), round copper core bunched cables (CORC), and the like. These cables have their own advantages, but have their own disadvantages, among which stacked cables have great potential in high field magnet applications due to the higher engineering current density. When the stacked cable is adopted to wind the coil, the function of the coil is equivalent to that of a local uninsulated coil wound by a strip material, and current can be randomly shared and shunted in the cable, so that the robustness of the magnet is improved. The preparation process of the stacked cable commonly used in the industry at present adopts soldering tin to directly compress and package a plurality of second-generation high-temperature superconducting tapes at 215 ℃, and the preparation of the stacked cable is finished after the soldering tin is solidified, wherein the number of the superconducting tapes can be combined according to the thickness of the stacked cable and the thickness of the tapes.

The critical current of the second generation high temperature superconducting tape is greatly influenced by the magnetic field of the vertical tape, and the stronger the magnetic field is, the lower the critical current is. Because the magnetic field distribution in the high-field magnet is not uniform in the whole space, the critical current of the superconducting material in the coil magnet is also not uniformly distributed, and the actual running current mainly depends on a certain region with the lowest critical current in the whole magnet, namely the so-called short plate effect. In order to overcome the short plate effect, the existing cable structure needs to be further optimized, so that the critical current of the coil formed by winding the cable under the influence of different magnetic fields can reach a relatively uniform level.

Disclosure of Invention

The invention aims to solve at least one technical problem of low etching efficiency to a certain extent. Therefore, the invention aims to provide a variable-structure stacked cable topology and a packaging method thereof, and in order to achieve the purpose, the invention adopts the following technical scheme:

in view of the above, a stacked cable topology of varying structure according to an embodiment of the first aspect of the present invention includes: the cable is piled up to the multistage, the multistage pile up the cable and connect gradually, every section it includes many baseband of equal quantity to pile up the cable, many interconnect between the baseband, many at least one is the superconductive area in the baseband.

Further, at least one of the plurality of base bands is a copper band.

Further, if the base bands of the corresponding layers in the adjacent sections of the stacked cables are all superconducting bands or copper bands, the base bands of the adjacent sections are integrally formed; if the base bands of the corresponding layers in the adjacent stacked cables are the superconducting bands and the copper bands respectively, the connection positions of the base bands are welded.

Furthermore, the base bands are connected through soldering.

Furthermore, a tiled structure is arranged among the plurality of base bands.

Further, the stacked cable topology of the variable structure further comprises an encapsulation layer, and the encapsulation layer is arranged on the outer wall of the stacked cable.

According to the technical scheme, compared with the prior art, the variable-structure stacked cable topology is formed by sequentially connecting multiple sections of stacked cables, wherein each section of stacked cable is only provided with the superconducting tapes or a combination of the superconducting tapes and the copper tapes to form the variable-structure cable topology, the number of the superconducting tapes packaged in each area is different, when the section of cable is used for winding a coil, the critical current of the whole coil can be approximately uniform along the length direction of the cable, and the variable-structure stacked cable topology design not only can improve the magnetic field parameters of the coil, but also can save the consumption of the superconducting tapes to the greatest extent.

In view of this, the method for packaging a variable-structure stacked cable topology according to the embodiment of the second aspect of the present invention specifically includes the following steps:

s10, calculating and analyzing the magnetic field distribution of the coil through finite element simulation;

s20, determining that the stacked cable consists of a plurality of sections according to the magnetic field distribution, and determining the number of base band layers, the number of superconducting bands and the number of copper bands in each section of cable;

s30, forming the base bands of all the sections in the same layer of the cable into an integral structure, wherein if the base bands of the corresponding layers in the adjacent sections of the stacked cable are all superconducting bands or copper bands, the base bands of the adjacent sections adopt an integral forming structure; if the base bands of the corresponding layers in the adjacent sections of the stacked cables are respectively a superconducting band and a copper band, the superconducting band and the copper band between the adjacent sections are connected in a spot welding mode;

and S40, packaging the multilayer base band formed in the S30 by using a soldering tin furnace, pressing the multilayer base band together through the matching of a pay-off reel and a guide wheel, penetrating the multilayer base band through a soldering tin pool, penetrating the base band through soldering tin liquid melted at the ambient temperature of 150-200 ℃, and solidifying the soldering tin carried on the base band in the air to form a complete cable after the base band is discharged from the soldering tin pool.

Furthermore, the packaging method of the variable-structure stacked cable topology further comprises external packaging, and the external packaging is carried out on the cable formed by packaging in a soldering tin furnace by using copper or aluminum to form a packaging layer.

The variable-structure stacked cable topology packaging method uses the variable-structure stacked cable topology, the connection relation and the position relation among the components of the variable-structure stacked cable topology are described above, and the technical effect achieved by the variable-structure stacked cable topology packaging method is described above in the variable-structure stacked cable topology, and is not described herein again.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is a schematic diagram of a variable-configuration stacked cable topology provided by the present invention;

FIG. 2 is a schematic diagram of another alternative construction of a variable-configuration stacked cable topology provided by the present invention;

FIG. 3 is a schematic structural diagram of embodiment 1 provided by the invention;

FIG. 4 is a schematic diagram of an equipotential line structure of magnetic lines on a pancake coil at an operating current of 135A according to the present invention;

fig. 5 is a schematic structural diagram of equipotential lines of magnetic field intensity on a pancake coil when the operating current is 135A according to the present invention.

Wherein: 1 is a superconducting tape; 2 is a copper strip; 3, soldering tin; and 4, an encapsulation layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 and 2, in one aspect, an embodiment of the present invention discloses a stacked cable topology of varying structure, including: the cable is piled up to the multistage, the cable is piled up to the multistage connects gradually and forms a complete cable, every section is piled up the cable and is included many basebands of equal quantity, interconnect between many basebands, at least one is superconductive tape 1 in many basebands, superconductive tape 1 is two take the place ofs high temperature superconducting material, REBCO coated conductor, higher engineering current density has, be the main conductor that is used for transmitting current, every section baseband specifically includes two kinds of modes, one of it, regional baseband is superconductive tape 1 in certain section cable, its two, this section cable region includes superconductive tape 1 and two kinds of materials of copper strips 2, constitute by the combination of superconductive tape 1 and copper strips 2.

According to one embodiment of the invention, if the base bands of the corresponding layers in the adjacent stacked cables are the superconducting bands 1 or the copper bands 2, the base bands of the adjacent sections are integrally formed; if the base bands of the corresponding layers in the adjacent sections of the stacked cables are respectively the superconducting bands 1 and the copper bands 2, the joints of the base bands are welded by spot welding, the base bands are connected through the soldering tin 3, and the base bands are in a tiled structure.

According to an embodiment of the present invention, the stacked cable topology of the variable structure further includes an encapsulation layer 4, the encapsulation layer 4 is disposed on an outer wall of the stacked cable, and the encapsulation layer 4 is a copper layer, an aluminum layer or other layers, preferably a copper layer.

On the other hand, the invention also discloses a packaging method of the variable-structure stacked cable topology, which specifically comprises the following steps:

s10, calculating and analyzing the magnetic field distribution of the coil through finite element simulation;

s20, determining that the stacked cable consists of a plurality of sections according to the magnetic field distribution, and determining the number of base band layers in each section of cable, the number of superconducting tapes 1 and the number of copper tapes 2;

s30, forming the base bands of all the sections in the same layer of the cable into an integral structure, wherein if the base bands of the corresponding layers in the adjacent sections of the stacked cable are all superconducting bands 1 or copper bands 2, the base bands of the adjacent sections adopt an integral forming structure; if the base bands of the corresponding layers in the adjacent sections of the stacked cables are respectively the superconducting tape 1 and the copper tape 2, the superconducting tape 1 and the copper tape 2 between the adjacent sections are connected in a spot welding manner;

and S40, packaging the multilayer base band formed in the S30 by using a soldering tin furnace, pressing the multilayer base band together through the matching of a pay-off reel and a guide wheel, then passing through a soldering tin pool, wherein the base band passes through soldering tin liquid melted at the ambient temperature of 150-200 ℃, the preferred ambient temperature is 200 ℃, and after coming out of the soldering tin pool, the soldering tin 3 carried on the base band is solidified in the air to form a complete cable.

In other embodiments, the packaging method of the variable-structure stacked cable topology further comprises an external packaging, and the external packaging is performed on the cable formed by the packaging of the soldering tin 3 furnace by using copper or aluminum to form the packaging layer 4.

Example 1

Referring to fig. 3, the present embodiment further explains the stacked cable topology with a variable structure by using three-segment five-layer stacked cables, specifically three segments are a region a, a region B and a region C, respectively, and in other embodiments, the number of segments of the stacked cable and the number of base tapes are specifically set according to actual requirements, which are not listed herein.

A variable-configuration stacked cable topology, comprising: three-section stacked cables are sequentially connected to form a complete cable, each section of stacked cable comprises five base bands, wherein the area A comprises two superconducting bands 1 and three copper bands 2, the area B comprises three superconducting bands 1 and two copper bands 2, the area C comprises two superconducting bands 1 and three copper bands 2, in the embodiment, the base bands of the first layer and the fifth layer in the three sections are all integrally formed superconducting bands 1, the base bands of the second layer and the fourth layer are all integrally formed copper bands 2, the base bands of the third layer in the area A, the area B and the area C are respectively copper bands 2, superconducting bands 1 and copper bands 2, the superconducting bands 1 and the copper bands 2 are connected in a mode, the five layers of spot welding base bands are of a tiled structure, and the base bands between the layers are fixedly connected through base band soldering tin 3.

Specifically, the cable is wound into a pancake coil, the magnetic field intensity range of the area A is 0.000274-0.2058T, and the magnetic field intensity range of the area B is 0.0846-0.2511T; the magnetic field intensity range of the C region is 0.0002575-0.2059T, and magnetic lines and magnetic field intensity equipotential lines on the pancake coil at the operating current of 135A are specifically shown in figures 4 and 5.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.