阅读说明：本技术 终端设备 (Terminal device ) 是由 刘入忠 于 2021-06-29 设计创作，主要内容包括：本申请提供一种终端设备,涉及通信设备技术领域,用于解决终端设备中NR和LTE等多模式同时接入时,各模式之间信号相互干扰的问题,该终端设备包括PCB板和通信模块,通信模块包括基板和数个元器件,各元器件分别分布在基板相背的两个第一承载面上,两个第一承载面上分别设有至少一个地,且各元器件分别与地和基板电连接,PCB板上设有与基板相匹配的通孔,基板嵌设在通孔中并与PCB板电导通,以使两个第一承载面上的各元器件分别凸出PCB板相背的两个第二承载面。本申请提供的终端设备能够改善各模式之间的信号相互干扰的问题,从而提高接收各模式信号的各元器件的信号接受性能。(The utility model provides a terminal equipment, relate to communication equipment technical field, when being used for solving multimode such as NR and LTE and insert simultaneously among the terminal equipment, the problem of signal mutual interference between each mode, this terminal equipment includes PCB board and communication module, communication module includes base plate and several components and parts, each components and parts distribute respectively on two first loading faces that the base plate carried on the back mutually, be equipped with at least one ground on two first loading faces respectively, and each components and parts are connected with ground and base plate electricity respectively, be equipped with on the PCB board with base plate assorted through-hole, the base plate inlays to be established in the through-hole and switches on with PCB board electricity, so that each components and parts on two first loading faces protrude two second loading faces that the PCB board carried on the back mutually respectively. The terminal equipment provided by the application can improve the problem of mutual interference of signals among the modes, so that the signal receiving performance of each component for receiving signals of the modes is improved.)

1. A terminal device, comprising: the communication module comprises a substrate and a plurality of components, wherein each component is respectively distributed on two first bearing surfaces which are opposite to each other on the substrate, at least one ground is respectively arranged on the two first bearing surfaces, each component is respectively electrically connected with the ground and the substrate, a through hole matched with the substrate is arranged on the PCB, and the substrate is embedded in the through hole and is electrically conducted with the PCB so as to enable each component on the two first bearing surfaces to protrude out of two second bearing surfaces which are opposite to each other on the PCB.

2. The terminal equipment of claim 1, wherein the number of said lands on each of said first bearing surfaces is at least two, and at least two of said lands are spaced on said first bearing surface.

3. A terminal device according to claim 2, characterized in that the ground is a ground pad.

4. A terminal device according to any of claims 1-3, characterized in that the substrate is soldered to the PCB board and electrically conductive.

5. The terminal device according to claim 4, wherein the PCB board is provided with a pad, the substrate is provided with a solder joint, and the PCB board and the substrate are soldered to the solder joint through the pad and are electrically conducted.

6. The terminal device of claim 5, wherein the pads are disposed at an edge of at least one of the second carrying surfaces near the through-holes, and the solder joints are disposed at an edge of the first carrying surface on a same side as the pads.

7. The terminal device as claimed in claim 6, wherein a plurality of pads are provided and spaced apart on at least one of the second carrying surfaces near the edge of the through hole.

8. The terminal device according to claim 5, wherein the pad is disposed on a wall of the through hole, and the solder bump is disposed on a sidewall of the substrate.

9. A terminal device according to claim 5, characterized in that said pads are LGA pads.

10. A terminal device according to any of claims 1-3, characterized in that the substrate is glued and electrically connected to the PCB board by means of a conductive glue.

Technical Field

The application relates to the technical field of communication equipment, in particular to terminal equipment.

Background

Outdoor wireless Customer Premises Equipment (CPE) is a mobile signal access device that receives a mobile signal and forwards the mobile signal as a wireless signal, for example, a 4G or 5G signal is converted into a wireless signal, and the terminal device is generally applied to wireless coverage areas such as rural areas, towns, hospitals, units, factories, and cells, and can save the cost of laying a line network. However, when the terminal device simultaneously accesses multiple modes such as a New Radio (NR) 5G and a Long Term Evolution (LTE) of the universal mobile telecommunications technology, the receiving performance of the device receiving each mode is poor.

Disclosure of Invention

In view of the above, embodiments of the present invention provide a terminal device that can improve signal reception performance of each component that receives signals of each mode by improving the problem of mutual interference between signals of each mode when used for simultaneous access of multiple modes such as NR and LTE.

In order to achieve the above object, the embodiments of the present application provide the following technical solutions:

an embodiment of the present application provides a terminal device, which includes: the communication module comprises a substrate and a plurality of components, wherein each component is respectively distributed on two first bearing surfaces which are opposite to each other on the substrate, at least one ground is respectively arranged on the two first bearing surfaces, each component is respectively electrically connected with the ground and the substrate, a through hole matched with the substrate is arranged on the PCB, the substrate is embedded in the through hole and is electrically conducted with the PCB, so that the components on the two first bearing surfaces respectively protrude out of two second bearing surfaces which are opposite to each other on the PCB.

The terminal device provided by the embodiment of the application comprises: the communication module comprises a substrate and a plurality of components, each component is distributed on two first bearing surfaces which are opposite to each other on the substrate, at least one ground is arranged on each of the two first bearing surfaces, each component is electrically connected with the ground and the substrate, a through hole matched with the substrate is formed in the PCB, and the substrate is embedded in the through hole and is electrically conducted with the PCB. Through set up on the PCB board with base plate assorted through-hole, the base plate inlays to be established in the through-hole, thus, can distribute the several components and parts on the communication module respectively and set up on two first loading faces that the base plate is carried on the back mutually, thereby make each components and parts be located the relative both sides of PCB board respectively, realize the purpose that the two-sided components and parts that set up of communication module, thereby reduce the concentration of the components and parts on the single first loading face of base plate, increase the isolation interval between each components and parts, in addition, all be equipped with ground on two first loading faces on the base plate, and each components and parts are connected with the ground electricity on the first loading face that corresponds respectively rather than, like this, ground can play good isolation to the interference signal between each components and parts, avoid the mutual interference between each components and parts when the multi-mode is connected, and then promote the signal reception performance of each components and parts.

In an alternative embodiment, there are at least two of the lands on each first bearing surface, and at least two of the lands are spaced on the first bearing surface.

The terminal equipment provided by the embodiment of the application is provided with at least two ground through the first bearing surfaces, so that each component can be electrically conducted with the ground with a short distance, the problem that the signal receiving performance of the component is influenced by interference signals due to the fact that the distance from the component to the ground is large is avoided, and the signal receiving performance of each component can be improved.

In an alternative embodiment, the ground is a ground pad.

In an alternative embodiment, the substrate is soldered to and electrically connected to the PCB board.

The terminal equipment provided by the embodiment of the application is connected and electrically conducted through the welding mode of the base plate and the PCB, and is simple in structure, convenient to operate and low in cost.

In an optional implementation manner, a pad is disposed on the PCB, a solder joint is disposed on the substrate, and the PCB and the substrate are soldered to the solder joint through the pad and electrically conducted.

The terminal equipment provided by the embodiment of the application sets up the welding spot on the substrate through setting up the welding pad on the PCB board, and is in the same place through welding the welding spot and the welding pad to the realization is connected and the electric conduction with base plate and PCB board.

In an alternative embodiment, the pad is disposed at an edge of at least one of the second carrying surfaces near the through hole, and the solder joint is disposed at an edge of the first carrying surface on the same side as the pad.

The terminal equipment provided by the embodiment of the application is characterized in that the pad is arranged at the edge of at least one second bearing surface close to the through hole, and the welding spot is arranged at the edge of the first bearing surface at the same side with the pad, so that the pad is welded with the welding spot, the process is simple, and the operation is convenient.

In an alternative embodiment, a plurality of pads are provided, and a plurality of pads are spaced apart from one another on at least one of the second carrying surfaces near the edge of the through hole.

The terminal equipment that this application embodiment provided, through setting up the several pad, it is corresponding, the solder joint also is the several, like this, can improve the reliability that base plate and PCB board are connected and electric conduction.

In an alternative embodiment, the pad is disposed on a wall of the through hole, and the pad is disposed on a sidewall of the substrate.

The terminal equipment that this application embodiment provided, through with the pad setting on the pore wall of through-hole, set up the solder joint on the lateral wall of base plate, the base plate passes through the pore wall of lateral wall and through-hole and is connected and the electric conduction, like this, can reduce the volume after base plate and the PCB board welding to reduce terminal equipment's overall dimension.

In an alternative embodiment, the pads are LGA pads.

In an alternative embodiment, the substrate is clamped to the through hole and electrically connected.

The terminal equipment that this application embodiment provided does not need other installation procedure, simple structure, convenient to detach through with base plate and through-hole joint in order to realize being connected and the electric conduction between base plate and the through-hole.

In an optional implementation manner, a conductive clamping portion is disposed on a sidewall of the substrate, a conductive clamping portion is disposed on a hole wall of the through hole, and the conductive clamping portion is clamped with the conductive clamping portion and is electrically conducted.

The terminal equipment that this application embodiment provided sets up electrically conductive joint portion through setting up on the lateral wall of base plate, sets up electrically conductive block portion on the pore wall of through-hole to realize being connected between base plate and the through-hole through electrically conductive joint portion and electrically conductive block portion joint, thereby be convenient for installation and dismantlement between base plate and the through-hole.

In an optional implementation manner, the conductive clamping portion is a conductive clip, the conductive clamping portion is a conductive slot, and the conductive clip is clamped with and electrically connected to the conductive slot.

The terminal equipment that this application embodiment provided sets up electrically conductive block portion into electrically conductive buckle through with electrically conductive joint portion, sets up electrically conductive block portion into electrically conductive draw-in groove, through electrically conductive buckle and electrically conductive draw-in groove joint in order to realize being connected and the electric conductance between base plate and the through-hole, simple structure, easily processing, and easy dismounting.

In an alternative embodiment, the substrate and the through hole are adhered by a conductive adhesive and electrically connected.

The terminal equipment that this application embodiment provided bonds and the electric conduction through conducting resin between through with base plate and through-hole to realize being connected and the electric conduction between base plate and the through-hole, can improve the connection reliability between base plate and the through-hole.

In an alternative embodiment, the conductive adhesive is a conductive silver adhesive.

In addition to the technical problems solved by the embodiments of the present application, the technical features constituting the technical solutions, and the advantages brought by the technical features of the technical solutions described above, other technical problems solved by the terminal device provided by the embodiments of the present application, other technical features included in the technical solutions, and advantages brought by the technical features will be further described in detail in the detailed description.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a top view of a prior art telecommunications module disposed on a PCB;

FIG. 2 is a cross-sectional view of FIG. 1;

FIG. 3 is a top view of the PCB board of FIG. 1;

fig. 4 is a top view of a communication module disposed on a PCB in a terminal device according to an embodiment of the present disclosure;

FIG. 5 is a cross-sectional view of FIG. 4;

FIG. 6 is a top view of the PCB board of FIG. 4;

FIG. 7 is a cross-sectional view of FIG. 6;

fig. 8 is a top view of the telecommunications module of fig. 4;

fig. 9 is a bottom view of the communication module of fig. 4.

Reference numerals:

100-a PCB board;

101-a through hole;

102-a pad;

103-ground;

200-a communication module;

201-a substrate;

202-components;

203-welding spot.

Detailed Description

Fig. 1 is a top view of a prior art telecommunications module disposed on a PCB; FIG. 2 is a cross-sectional view of FIG. 1; fig. 3 is a top view of the PCB board of fig. 1.

Referring to fig. 1 to 3, in the related art, a terminal device such as CPE includes a Printed Circuit Board (PCB) and a communication module 200, a pad 102 and a ground 103 are disposed on the PCB 100, the communication module 200 includes a substrate 201 and a plurality of components 202 disposed on an upper surface of the substrate 201, each component 202 is electrically connected to the substrate 201 and the ground 103, the substrate 201 is soldered to the pad 102, so that the substrate 201 is electrically connected to the PCB 100, and with the continuous update of a network, the terminal device such as CPE includes multi-mode accesses such as 5G New air interface (NR) and Long Term Evolution (LTE) of the universal mobile communication technology, so that the terminal device such as CPE supports a 4G/5G frequency band and some New frequency bands, so as to improve the distribution flexibility of a frequency spectrum and thus improve a coverage area, generally, each component 202 for receiving each mode signal on the communication module 200 in the terminal device such as CPE is disposed on one surface of the communication module 200, with the increasing of the frequency band of the terminal equipment, the number of the components on the substrate is more and more, and the components are electrically connected with the ground to isolate mutual interference among signals of the components through the ground, so that when the terminal equipment such as the CPE is in a multi-mode access state such as NR and LTE, the isolation distance between the components 202 is insufficient, and the distances from some components to the ground are far, so that mutual interference among multi-mode signals cannot be isolated timely, and further the signal receiving performance of some components 202 is poor.

Through repeated thinking and verification, the inventor of the application finds that if a plurality of components are respectively arranged on two first bearing surfaces which are back to back on the substrate, the components are arranged on the two sides of the communication module, so that the density of the components on a single first bearing surface can be reduced, a ground for isolating signals between the components is arranged on each first bearing surface, mutual interference between mode signals when multiple modes are accessed between the components is avoided, and the signal receiving performance of the components is improved.

In view of this, the present application provides a terminal device, in which through holes matched with a substrate are formed in a PCB, and the substrate is embedded in the through holes, so that a plurality of components on a communication module can be respectively distributed on two first bearing surfaces opposite to the substrate, so that the components are respectively located on two opposite sides of the PCB, thereby achieving the purpose of disposing the components on two sides of the communication module, thereby reducing the density of the components on a single first bearing surface of the substrate, increasing the isolation distance between the components, in addition, the two first bearing surfaces on the substrate are both provided with a ground, and the components are respectively electrically connected with the ground on the corresponding first bearing surfaces, so that the ground can perform a good isolation function on interference signals between the components, and avoid mutual interference between mode signals when the components are connected in a multi-mode, thereby improving the signal receiving performance of each component.

In order to make the aforementioned objects, features and advantages of the embodiments of the present application more comprehensible, embodiments of the present application are described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Fig. 4 is a top view of a communication module disposed on a PCB in a terminal device according to an embodiment of the present disclosure; FIG. 5 is a cross-sectional view of FIG. 4; FIG. 6 is a top view of the PCB board of FIG. 4; FIG. 7 is a cross-sectional view of FIG. 6; fig. 8 is a top view of the telecommunications module of fig. 4; fig. 9 is a bottom view of the communication module of fig. 4.

Referring to fig. 4 to 9, a terminal device provided in an embodiment of the present application includes: the communication module 200 comprises a substrate 201 and a plurality of components 202, wherein each component 202 is respectively distributed on two first bearing surfaces opposite to the substrate 201, at least one ground 103 is respectively arranged on the two first bearing surfaces, each component 202 is respectively electrically connected with the ground 103 and the substrate 201, a through hole 101 matched with the substrate 201 is arranged on the PCB 100, and the substrate 201 is embedded in the through hole 101 and is electrically connected with the PCB 100, so that each component on the two first bearing surfaces protrudes out of two second bearing surfaces opposite to the PCB.

In the communication module 200, for example, each component 202 that is switched into the NR mode may be disposed on the first carrying surface of the front surface of the substrate 201, and electrically connected to the ground 103 on the front surface of the substrate 201; and each device accessed into the LTE mode is arranged on the first bearing surface back to front and is electrically connected with the ground 103 on the first bearing surface back to front, so that a plurality of devices can be respectively positioned on two opposite sides of the PCB, the purpose of arranging the devices on two sides of the communication module is realized, the density of each device on the single first bearing surface of the substrate is reduced, the isolation distance between the two modes is increased, the interference signals of each device on each first bearing surface are isolated through the ground on each first bearing surface, the mutual interference of the signals between the modes when the multiple modes are accessed can be avoided, and the signal receiving performance of each device 202 is further improved.

The substrate 201 may be a regular substrate such as a rectangular plate, a circular plate, an elliptical plate, or an irregular substrate, and the through hole 101 matches the shape of the substrate 201, for example, the through hole 101 may be a regular or irregular shape such as a rectangular hole, a circular hole, an elliptical hole, or the like.

In addition, the through hole 101 may be integrally formed with the PCB 100, so that the number of processes may be reduced, for example, by integrally forming through casting; of course, the through hole 101 may also be formed on the PCB 100 by stamping, and is symmetrical, and the embodiment is not limited in particular.

In the terminal device provided by the embodiment of the application, the through hole 101 matched with the substrate 201 is arranged on the PCB 100, and the substrate 201 is embedded in the through hole 101, so that the plurality of components 202 on the communication module 200 can be respectively distributed on the two first bearing surfaces opposite to the substrate 201, so that the components 202 are respectively located on the two opposite sides of the PCB, thereby achieving the purpose of arranging the components 202 on the two sides of the communication module 200, and further reducing the density of the components 202 on the single first bearing surface of the substrate 201, in addition, the two first bearing surfaces on the substrate 201 are respectively provided with the ground 103, and each component 202 is respectively electrically connected with the ground 103 on the corresponding first bearing surface, so that the ground 103 can play a good role in isolating interference signals between the components 202, and avoid mutual interference among the mode signals when the components 202 are connected in a multi-mode, thereby improving the signal receiving performance of each component 202.

In an alternative embodiment, when at least two components 202 are disposed on each first carrying surface, the at least two components 202 on each first carrying surface may be uniformly distributed on the corresponding first carrying surface.

Specifically, each component 202 connected to the same mode is disposed on the same first carrying surface of the substrate 201, each component 202 connected to another mode is disposed on the other first carrying surface opposite to the first carrying surface, and each component 202 on each first carrying surface is uniformly distributed on the corresponding first carrying surface and electrically connected to the ground 103, so that the spacing distance between each component 202 can be increased, thereby preventing each component 202 from interfering with each other when receiving signals, and further improving the signal receiving performance of each component 202.

The terminal device provided by the embodiment of the application, through with at least two components 202 evenly distributed on each bearing surface of the substrate 201 and electrically connected with the ground 103, can increase the isolation distance between each component 202, avoid the mutual interference of signals between each component 202, thereby promoting the signal receiving performance of each component 202.

In order to increase the isolation effect of the ground 103 on each component 202, in this embodiment, at least two grounds 103 on each first carrying surface are arranged on the first carrying surface at intervals, and the distance between each component 202 and the ground 103 electrically connected with the component 202 is reduced by arranging at least two grounds 103 on a single first carrying surface so that the at least two grounds are respectively arranged at positions close to each component 202, so that interference signals can be better isolated, and the signal receiving performance of each component can be improved.

For example, the Ground 103 may be a Ground pad, for example, the Ground 103 may be a Ground (GND) pad, and the like, and the embodiment is not particularly limited.

In an alternative embodiment, the substrate 201 is soldered to and electrically connected to the PCB board 100.

It can be understood that the substrate 201 and the PCB 100 are connected and electrically conducted by soldering, for example, soldering is performed by soldering tin, and the structure is simple, the operation is convenient, and the cost is low.

Furthermore, the PCB 100 is provided with a pad 102, the substrate 201 is provided with a solder 203, and the PCB 100 and the substrate 201 are soldered to the solder 203 through the pad 102 and electrically conducted.

Specifically, the pad 102 and the pad 203 may be soldered by solder or the like and electrically connected.

In an alternative embodiment, the pads 102 are arranged at the edge of at least one second carrier surface near the through holes 101, and the pads 203 are arranged at the edge of the first carrier surface on the same side as the pads 102.

It is understood that the pads 102 may be disposed on only one second carrying surface near the edge of the through hole, so that the substrate 201 is soldered to the PCB 100 on one side; or, the two second bearing surfaces are provided with the pads 102 at the edges close to the through holes, and correspondingly, the edges of the two first bearing surfaces on the substrate 201 are also provided with the welding spots corresponding to the positions of the pads 102, so that the substrate 201 and the PCB 100 are welded on both sides, and the connection reliability of the substrate 201 and the PCB 100 is improved.

In addition, the bonding pad 102 is arranged on the second bearing surface, and the welding point is arranged on the first bearing surface, so that the welding difficulty is low, the welding is easy, the process is simple, and the operation is convenient.

The pads 102 may be formed by surrounding the edge of the through hole on the second supporting surface by one circle, or the second supporting surface is provided with a plurality of pads 102, and the plurality of pads 102 are arranged at intervals on the edge of the through hole, correspondingly, the pads 203 on the first supporting surface may be formed by surrounding the edge of the first supporting surface by one circle, or a plurality of pads 203 may be arranged, and the plurality of pads 203 are arranged at intervals on the edge of the first supporting surface and respectively correspond to the positions of the plurality of pads 102 one by one, that is, one pad 203 corresponds to one pad 102.

In another alternative embodiment, the pad 102 is disposed on the wall of the through hole 101, the pad 203 is disposed on the sidewall of the substrate 201, and the substrate 201 and the PCB 100 are soldered to the pad 102 through the pad 203 and electrically conducted.

The pad 10 can surround the hole wall of the through hole 101 for a circle by 2, the substrate 201 is provided with a welding point 203 welded with the pad 102, and the welding point 203 is arranged on the bottom wall of the substrate 201 for a circle around the substrate 201; alternatively, a plurality of solder joints 203 are disposed on the bottom wall of the substrate 201, and the solder joints 203 are circumferentially spaced on the bottom wall of the substrate 201, so that the solder joints 203 and the pads 102 are soldered and electrically connected.

Or, a plurality of pads 102 are disposed on the hole wall of the through hole 101, the plurality of pads 102 are arranged at intervals along the circumferential direction of the hole wall of the through hole 101, a plurality of solder joints 203 are disposed on the bottom wall or the side wall of the substrate 201, and each solder joint 203 corresponds to each pad 102 one by one, that is, one solder joint 203 corresponds to one pad 102, so that the solder joint 203 and the pad 102 are soldered and electrically conducted, thereby electrically conducting the substrate 201 and the PCB 100.

According to the terminal device provided by the embodiment of the application, the pad 102 is arranged on the hole wall of the through hole 101, the welding point 203 is arranged on the side wall of the substrate 201, and the welding point 203 and the pad 102 are welded together to realize the connection and the electric conduction of the substrate 201 and the through hole 101, so that the volume of the whole structure after the substrate 201 and the PCB 100 are welded can be reduced, and the magnetic appearance size of the terminal device is reduced.

Illustratively, the pads may be Land Grid Array (LGA) pads.

In another alternative embodiment, the substrate 201 and the through hole 101 may be engaged and electrically connected.

The terminal equipment provided by the embodiment of the application does not need other installation procedures, and is simple in structure and convenient to detach by clamping the substrate 201 and the through hole 101 so as to realize connection and electric conduction between the substrate 201 and the through hole 101.

In an alternative embodiment, a conductive clamping portion is disposed on a sidewall of the substrate 201, and a conductive clamping portion is disposed on a wall of the through hole 101, and the conductive clamping portion is clamped with the conductive clamping portion and is electrically conducted.

It should be noted that the conductive clamping portion has conductivity, and the conductive engaging portion also has conductivity, so that the conductive clamping portion and the conductive engaging portion can be electrically connected after the conductive clamping portion is clamped with the conductive engaging portion, so as to electrically connect the substrate 201 and the PCB 100.

The terminal device provided by the embodiment of the application sets up the conductive clamping part on the side wall of the substrate 201, sets up the conductive clamping part on the hole wall of the through hole 101, and realizes the connection between the substrate 201 and the through hole 101 through the conductive clamping part and the conductive clamping part clamping, thereby being convenient for the installation and the disassembly between the substrate 201 and the through hole 101.

In an optional embodiment, the conductive clamping portion may be a conductive clip, the conductive engaging portion may be a conductive slot, and the conductive clip is clamped with the conductive slot and electrically connected to the conductive slot.

Wherein, electrically conductive buckle is the electrically conductive buckle that electrically conductive material made, and the surface of electrically conductive draw-in groove is electric conductivity, perhaps whole electrically conductive draw-in groove has electric conductivity, like this, after electrically conductive buckle and electrically conductive draw-in groove joint to make electrically conductive buckle and electrically conductive draw-in groove electrically conductive, thereby realize base plate 201 and PCB board 100 electrically conductive expert.

The terminal equipment that this application embodiment provided sets up electrically conductive joint portion into electrically conductive buckle through with electrically conductive joint portion, sets up electrically conductive block portion into electrically conductive draw-in groove, connects in order to realize being connected and the electric conduction between base plate 201 and the through-hole 101 through electrically conductive buckle and electrically conductive draw-in groove joint, simple structure, easily processing, and easy dismounting.

In yet another alternative embodiment, the substrate 201 and the through hole 101 are adhered and electrically connected by a conductive adhesive.

In a specific implementation, the substrate 201 is embedded in the through hole 101, and a conductive adhesive is injected into a gap between the substrate 201 and the through hole 101, so that the substrate 201 is bonded with the through hole 101 through the conductive adhesive, and in addition, the conductive adhesive has conductivity, and after the substrate 201 is bonded with the through hole 101 through the conductive adhesive, the substrate 201 is electrically conducted with the PCB 100 through the conductive adhesive, so that the structure is simple, the operation is convenient, and the cost is low.

The terminal device provided by the embodiment of the application is bonded and electrically conducted between the substrate 201 and the through hole 101 through the conductive adhesive, so that the substrate 201 and the through hole 101 are connected and electrically conducted, and the connection reliability between the substrate 201 and the through hole 101 can be improved.

In an alternative embodiment, the conductive adhesive is a conductive silver adhesive.

The conductive adhesive may be made of other materials having adhesiveness and conductivity, and the embodiment is not limited to this, as long as the substrate 201 and the through hole 101 can be adhered by the conductive adhesive to be electrically conducted.

The terminal equipment that this application embodiment provided includes PCB board and communication module, and communication module includes base plate and several components and parts, and each components and parts distribute respectively on two first loading faces that the base plate carried on the back mutually, are equipped with at least one ground on two first loading faces respectively, and each components and parts are connected with ground and base plate electricity respectively, be equipped with on the PCB board with base plate assorted through-hole, the base plate inlays to be established in the through-hole and switches on with PCB board electricity. Through set up on the PCB board with base plate assorted through-hole, the base plate inlays to be established in the through-hole, thus, can distribute the several components and parts on the communication module respectively and set up on two first loading faces that the base plate is carried on the back mutually, thereby make each components and parts be located the relative both sides of PCB board respectively, realize the purpose that the two-sided components and parts that set up of communication module, thereby reduce the concentration of the components and parts on the single first loading face of base plate, increase the isolation interval between each components and parts, in addition, all be equipped with ground on two first loading faces on the base plate, and each components and parts are connected with the ground electricity on the first loading face that corresponds respectively rather than, like this, ground can play good isolation to the interference signal between each components and parts, avoid the mutual interference between each components and parts when the multi-mode is connected, and then promote the signal reception performance of each components and parts.

The embodiments or implementation modes in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In the description above, it should be understood that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning a fixed connection, an indirect connection through intervening media, a connection between two elements, or an interactive relationship between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations. The terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless specifically stated otherwise.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.