阅读说明：本技术 一种全新锡导通工艺线路板及其制作工艺 (All-new tin conduction process circuit board and manufacturing process thereof ) 是由 杨志强 于 2021-10-07 设计创作，主要内容包括：本发明公开了披露了一种全新锡导通工艺线路板,包括正板与背板,该正板为单面板且背面涂覆一层热固胶,背板为铜(铝等金属类)箔,该正板的背面与背板的正面通过正面或反面背胶相粘合,并且正板的表面丝印有线路层,该背板的底部丝印有线路层,该正面和反面涂覆层为膜或白油,本发明涉及线路板设计制造技术领域。该全新锡导通工艺线路板,该产品线路层间导通方式是在线路板设计和制作过程中设置了一层通孔,另一层不设置。当进行SMT焊接时,锡膏经过回流焊后层间直接导通的方式,且在生产工艺中使用了全新的线路层间转移贴合的生产方式,而非传统的先制作好两层铜箔,再在铜箔上制作线路。(The invention discloses a novel tin conduction process circuit board which comprises a front board and a back board, wherein the front board is a single-sided board, the back surface of the front board is coated with a layer of thermosetting adhesive, the back board is a copper (metal such as aluminum) foil, the back surface of the front board is bonded with the front surface of the back board through front surface or back surface adhesive, a circuit layer is printed on the surface of the front board in a silk-screen mode, the bottom of the back board is printed with the circuit layer in a silk-screen mode, and the front surface and the back surface are coated with films or white oil. The novel tin conduction process circuit board has the advantages that the conduction mode among circuit layers of the product is that a layer of through holes is arranged in the design and manufacturing process of the circuit board, and the other layer is not arranged. When SMT welding is carried out, a mode of direct conduction between layers after reflow soldering of solder paste is carried out, and a brand new production mode of transfer bonding between circuit layers is used in a production process, instead of the traditional mode that two layers of copper foil are manufactured firstly and then a circuit is manufactured on the copper foil.)

1. The utility model provides a full new tin conduction technology circuit board, includes positive board and backplate, its characterized in that: the front plate is a single-sided plate, a layer of thermosetting adhesive is coated on the back surface of the front plate, the back plate is made of conductive metal, the back surface of the front plate is bonded with the front surface of the back plate through front or back adhesive, circuit layers are manufactured on the surface of the front plate and the bottom of the back plate through technologies such as screen printing, roll coating, dry/wet film exposure and the like, metal conductive materials such as copper foil and aluminum foil are arranged on the two sides of the bottom of the back plate, and through holes are formed in the surfaces of the front plate and the back plate.

2. A manufacturing process of a circuit board with a novel tin conduction process is characterized by comprising the following steps: the method specifically comprises the following steps:

s1, processing of the front plate: selecting a proper substrate as a front plate, then pasting gum on the back surface of the front plate, carrying out line silk-screen on the surface of the front plate, wherein the mesh number of a silk-screen plate is 120-140T/cm2, the silk-screen speed is 2.5-3.5m/min, the silk-screen pressure is 0.6-1MPa, then carrying out etching operation on the front plate, coating a photosensitive coating on the front plate, carrying out exposure operation under a vacuum condition, removing the photosensitive coating on the unexposed part of the front plate to obtain a plate to be etched, placing the plate into an etching solution for etching operation under the temperature condition of 25-50 ℃ to form a line pattern, and then automatically detecting various different mounting errors and welding defects on the PCB by using a high-speed high-precision visual processing technology;

s2, processing of the back plate: attaching metal conductive materials such as copper foil, aluminum foil and the like to the bottom of the back plate through a micro-adhesive film, then carrying out line silk-screen on the bottom of the back plate, wherein the mesh number of a silk-screen plate is 120-140T/cm2, the silk-screen speed is 2.5-3.5m/min, the silk-screen pressure is 0.6-1MPa, then carrying out etching operation on the back plate, coating a photosensitive coating on the back plate, carrying out exposure operation under a vacuum condition, removing the photosensitive coating on the unexposed part of the back plate to obtain a plate to be etched, placing the plate to be etched into etching liquid for etching operation under the temperature condition of 25-50 ℃ to form a line pattern, and then automatically detecting various different mounting errors and welding defects on the PCB by using a high-speed high-precision visual processing technology;

s3, integral processing: drilling the front sides of the front board and the back board, bonding the front board and the back board together through a back adhesive on the back side of the front board, cold-pressing the front board and the back board at a cold-pressing pressure of 10-35MPa for 15-30s in an extrusion forming time, naturally airing or drying by blowing at 20-50 ℃, attaching a white film on the surface of the front board, attaching the white film to the surface of the front board in a tight fit manner by using a hot press, coating a layer of solder resist agent on circuits and base materials which do not need to be welded at the bottom of the back board, forming characters on the surface of the front board in a screen printing manner, growing a layer of organic film on the surface of clean bare copper in a chemical manner, finishing the appearance of the formed circuit board, and finally realizing the quality condition of the circuit board, wherein the steps of the method comprise: the appearance inspection, the measurement of the size/aperture, the performance test and the like are carried out comprehensively and for the last time, so that the product is ensured to meet the requirements of shipment specifications, and the product can leave a factory after being packaged.

3. The manufacturing process of the all-new tin conduction process circuit board according to claim 2, characterized in that: the back adhesive used in the step S1 is heat-conducting silica gel, which is formed by adding a specific conductive filler on the basis of silicone rubber.

4. The manufacturing process of the all-new tin conduction process circuit board according to claim 2, characterized in that: in S1, after removing the photosensitive coating on the unexposed portion of the clad substrate, removing burrs formed at the edges of the photosensitive coating remaining on the board to be etched using a plasma device.

5. The manufacturing process of the all-new tin conduction process circuit board according to claim 2, characterized in that: when the front plate and the back plate are drilled in S3, the hole diameters are consistent.

Technical Field

The invention relates to the technical field of circuit boards, in particular to a novel tin conduction process circuit board and a manufacturing process thereof.

Background

The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc., the circuit board miniaturizes and visualizes the circuit, plays an important role in the mass production of fixed circuits and optimizing the layout of electric appliances, the circuit board can be called as a printed circuit board or a printed circuit board, the english name is PCB, FPC circuit board (FPC circuit board is also called as flexible circuit board and is made of polyimide or polyester film as the base material, a flexible printed circuit board with high reliability and excellent flexibility, has the characteristics of high wiring density, light weight, thin thickness and good bending property) and the birth and development of flexible-rigid combination board FPC and PCB, thus, the flexible-rigid combination board, the flexible circuit board and the rigid circuit board are combined together according to relevant process requirements through procedures such as pressing and the like to form the circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics.

In the manufacturing process of circuit board, can carry out the tin-plating with its surface, general operation is punched before the tin-plating, and to tin spraying plate, tin often can be hidden to the via hole of non-consent, and it is opaque to show as the via hole, and the direct harm of hiding tin is exactly that it probably runs out and adheres on the pad, forms the tin pearl, influences the printing of soldering paste, and more concealed harm is exactly that the tin pearl flies out, constitutes the threat to the reliability.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a novel tin conduction process circuit board and a manufacturing process thereof, and solves the problem that tin is hidden in a through hole due to punching before tin plating.

In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a full new tin switches on technology circuit board, includes positive board and backplate, and this positive board is single face board and back coating one deck thermosetting glue, and the backplate is copper (metal class such as aluminium) paper tinsel, the back of positive board and the front of backplate are glued through positive or reverse side gum mutually to the equal silk screen printing of surface of positive board and the bottom of backplate has the circuit layer, the both sides of backplate bottom all are provided with the copper foil, and the through-hole has all been seted up on the surface of positive board and backplate.

The invention also discloses a manufacturing process of the all-new tin conduction process circuit board, which specifically comprises the following steps:

s1, processing of the front plate: selecting a proper substrate as a front plate, then pasting gum on the back surface of the front plate, carrying out line silk-screen printing on the surface of the front plate, wherein the mesh number of a silk-screen plate is 90-110T/cm2, the silk-screen printing speed is 2.5-3.5m/min, the silk-screen printing pressure is 0.6-1MPa, then carrying out etching operation on the front plate, coating a photosensitive coating on the front plate, carrying out exposure operation under a vacuum condition, removing the photosensitive coating on the unexposed part of the front plate to obtain a plate to be etched, placing the plate into an etching solution for etching operation under the temperature condition of 25-50 ℃ to form a line pattern, and then automatically detecting various different mounting errors and welding defects on the PCB by using a high-speed high-precision visual processing technology;

s2, processing of the back plate: attaching copper foil to the bottom of a back plate through a micro-adhesive film, then carrying out line silk-screen printing on the bottom of the back plate, wherein the mesh number of a silk-screen plate is 90-110T/cm2, the silk-screen speed is 2.5-3.5m/min, the silk-screen pressure is 0.6-1MPa, then carrying out etching operation on the back plate, coating a photosensitive coating on the back plate, carrying out exposure operation under a vacuum condition, removing the photosensitive coating on the unexposed part of the back plate to obtain a plate to be etched, placing the plate to be etched into etching liquid for etching operation under the temperature condition of 25-50 ℃ to form a line pattern, and then automatically detecting various different mounting errors and welding defects on the PCB by using a high-speed high-precision vision processing technology;

s3, integral processing: drilling the front sides of the front board and the back board, bonding the front board and the back board together through a back adhesive on the back side of the front board, cold-pressing the front board and the back board at a cold-pressing pressure of 10-35MPa for 15-30s in an extrusion forming time, naturally airing or drying by blowing at 20-50 ℃, attaching a white film on the surface of the front board, attaching the white film to the surface of the front board in a tight fit manner by using a hot press, coating a layer of solder resist agent on circuits and base materials which do not need to be welded at the bottom of the back board, forming characters on the surface of the front board in a screen printing manner, growing a layer of organic film on the surface of clean bare copper in a chemical manner, finishing the appearance of the formed circuit board, and finally realizing the quality condition of the circuit board, wherein the steps of the method comprise: the appearance inspection, the measurement of the size/aperture, the performance test and the like are carried out comprehensively and for the last time, so that the product is ensured to meet the requirements of shipment specifications, and the product can leave a factory after being packaged.

Preferably, the back adhesive used in S1 is a heat conductive silicone, and the heat conductive silicone is a silicone formed by adding a specific conductive filler to silicone rubber.

Preferably, in S1, after removing the photosensitive coating on the unexposed portion of the clad substrate, a plasma device is used to remove burrs formed at the edges of the photosensitive coating remaining on the board to be etched.

Preferably, the holes of the front plate and the back plate are drilled in S3, and the holes have the same diameter.

Advantageous effects

The invention provides a novel tin conduction process circuit board and a manufacturing process thereof. Compared with the prior art, the method has the following beneficial effects: this all new tin switches on technology circuit board, this positive board are single-sided board and back coating one deck thermosetting glue, and the backplate is copper (metal class such as aluminium) paper tinsel, the back of positive board bonds through positive or reverse gum with the front of backplate to the equal silk screen printing of the surface of positive board and the bottom of backplate has the circuit layer, the both sides of backplate bottom all are provided with the copper foil, and the through-hole has all been seted up on the surface of positive board and backplate, and the manufacturing process of all new tin switch on technology circuit board specifically includes following step: s1, processing a front plate, S2, processing a back plate, S3 and integrally processing, wherein when the circuit board is manufactured, a front-side and a back-side line are subjected to silk screen printing, a back-side micro-adhesive film copper foil is coated on the front side and the back side, then the front plate and the back plate are separately punched, then the front plate and the back side are bonded, and after the front plate and the back side are subjected to silk screen printing, automatic optical detection is respectively carried out firstly, various different mounting errors and welding defects on the PCB are automatically detected by using a high-speed high-precision visual processing technology, the other side of the circuit is produced in a transfer bonding mode, the design can be used for general double-side SMD/SMT/COM/flip-chip and other post-packaging manufacturing process technologies, the errors of subsequent operation can be timely avoided, the problems can be found in advance, and the problems can be solved.

Drawings

FIG. 1 is a perspective view of the structure of the present invention;

FIG. 2 is a schematic structural view of the bottom of the back plate of the present invention;

FIG. 3 is a process flow diagram of the present invention.

In the figure: 1-positive plate, 2-back plate, 3-circuit, 4-copper foil and 5-through hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides three technical solutions: the utility model provides a full new tin switches on technology circuit board, includes positive board 1 and backplate 2, this positive board 1 is single-sided board and back coating one deck thermosetting glue, backplate 2 is copper (metal class such as aluminium) paper tinsel, the back of positive board 1 bonds through positive or reverse side back glue with 2 front of backplate mutually, and the equal silk screen printing of the surface of positive board 1 and the bottom of backplate 2 has circuit layer 3, the both sides of 2 bottoms of backplate all are provided with copper foil 4, and through-hole 5 has all been seted up on the surface of positive board 1 and backplate 2.

The manufacturing process comprises the following embodiments:

example one

S1, processing of the front plate: selecting a proper substrate as a front plate, then pasting gum on the back surface of the front plate, carrying out line silk-screen printing on the surface of the front plate, wherein the number of silk-screen mesh plates is 100T/cm2, the silk-screen speed is 3m/min, the silk-screen pressure is 0.8MPa, then carrying out etching operation on the front plate, coating a photosensitive coating on the front plate, carrying out exposure operation under a vacuum condition, removing the photosensitive coating on the unexposed part of the front plate to obtain a plate to be etched, placing the plate to be etched into an etching solution for etching operation under the temperature condition of 37 ℃ to form a line pattern, and then automatically detecting various different mounting errors and welding defects on the PCB by using a high-speed high-precision vision processing technology;

s2, processing of the back plate: attaching a copper foil to the bottom of a back plate through a micro-adhesive film, then carrying out line silk-screen printing on the bottom of the back plate, wherein the mesh number of a silk-screen plate is 100T/cm2, the silk-screen speed is 3m/min, the silk-screen pressure is 0.8MPa, then carrying out etching operation on the back plate, carrying out exposure operation under a vacuum condition after coating a photosensitive coating on the back plate, removing the photosensitive coating on the unexposed part of the back plate to obtain a plate to be etched, placing the plate into an etching solution for etching operation under the temperature condition of 37 ℃ to form a line pattern, and then automatically detecting various different mounting errors and welding defects on the PCB by using a high-speed high-precision vision processing technology;

s3, integral processing: drilling the front surfaces of the front board and the back board, bonding the front board and the back board together through a back adhesive on the back surface of the front board, cold-pressing the front board and the back board, wherein the cold-pressing pressure is 22MPa, the extrusion forming time is 22s, then naturally airing or drying by blowing at 35 ℃, then attaching a white film on the surface of the front board, then utilizing a hot press to attach the white film on the surface of the front board in a clinging manner, coating a layer of solder resist agent on a circuit and a base material which do not need to be welded at the bottom of the back board, then forming characters on the surface of the front board in a screen printing manner, then growing a layer of organic film on the surface of clean bare copper in a chemical manner, then arranging the appearance of the formed circuit board, and finally finishing the quality condition of the circuit board, wherein the operation comprises the following steps: the appearance inspection, the measurement of the size/aperture, the performance test and the like are carried out comprehensively and for the last time, so that the product is ensured to meet the requirements of shipment specifications, and the product can leave a factory after being packaged.

Example two

S1, processing of the front plate: selecting a proper substrate as a front plate, then pasting gum on the back surface of the front plate, carrying out line silk-screen printing on the surface of the front plate, coating a photosensitive coating on the front plate, carrying out exposure operation under a vacuum condition after the screen printing screen plate has the mesh number of 90T/cm2, the screen printing speed is 2.5m/min, the screen printing pressure is 0.6MPa, then carrying out etching operation on the front plate, removing the photosensitive coating on the unexposed part of the front plate to obtain a plate to be etched, placing the plate to be etched into an etching solution to carry out etching operation under the temperature condition of 25 ℃ to form a line pattern, and then automatically detecting various different mounting errors and welding defects on the PCB by using a high-speed high-precision vision processing technology;

s2, processing of the back plate: attaching a copper foil to the bottom of a back plate through a micro-adhesive film, then carrying out line silk-screen printing on the bottom of the back plate, wherein the mesh number of a silk-screen plate is 90T/cm2, the silk-screen speed is 2.5m/min, the silk-screen pressure is 0.6MPa, then carrying out etching operation on the back plate, carrying out exposure operation under a vacuum condition after coating a photosensitive coating on the back plate, removing the photosensitive coating on the unexposed part of the back plate to obtain a plate to be etched, placing the plate into etching liquid for etching operation under the temperature condition of 25 ℃ to form a line pattern, and then automatically detecting various different mounting errors and welding defects on the PCB by using a high-speed high-precision vision processing technology;

s3, integral processing: drilling the front surfaces of the front board and the back board, bonding the front board and the back board together through a back adhesive on the back surface of the front board, cold-pressing the front board and the back board, wherein the cold-pressing pressure is 10MPa, the extrusion forming time is 15s, then naturally airing or drying by blowing at 20 ℃, then attaching a white film on the surface of the front board, then utilizing a hot press to attach the white film on the surface of the front board in a clinging manner, coating a layer of solder resist agent on a circuit and a base material which do not need to be welded at the bottom of the back board, then forming characters on the surface of the front board in a screen printing manner, then growing a layer of organic film on the surface of clean bare copper in a chemical manner, then arranging the appearance of the formed circuit board, and finally finishing the quality condition of the circuit board, wherein the operation comprises the following steps: the appearance inspection, the measurement of the size/aperture, the performance test and the like are carried out comprehensively and for the last time, so that the product is ensured to meet the requirements of shipment specifications, and the product can leave a factory after being packaged.

EXAMPLE III

S1, processing of the front plate: selecting a proper substrate as a front plate, then pasting gum on the back surface of the front plate, carrying out line silk-screen printing on the surface of the front plate, coating a photosensitive coating on the front plate, carrying out exposure operation under a vacuum condition, removing the photosensitive coating on the unexposed part of the front plate to obtain a plate to be etched, placing the plate to be etched into an etching solution to carry out etching operation under the temperature condition of 50 ℃ to form a line pattern, and then automatically detecting various different mounting errors and welding defects on the PCB by using a high-speed high-precision vision processing technology, wherein the number of silk-screen mesh plates is 110T/cm2, the silk-screen printing speed is 3.5m/min, and the silk-screen printing pressure is 1 MPa;

s2, processing of the back plate: attaching a copper foil to the bottom of a back plate through a micro-adhesive film, then carrying out line silk-screen printing on the bottom of the back plate, wherein the mesh number of a silk-screen plate is 110T/cm2, the silk-screen speed is 3.5m/min, the silk-screen pressure is 1MPa, then carrying out etching operation on the back plate, carrying out exposure operation under a vacuum condition after coating a photosensitive coating on the back plate, removing the photosensitive coating on the unexposed part of the back plate to obtain a plate to be etched, placing the plate into an etching solution for etching operation under the temperature condition of 50 ℃ to form a line pattern, and then automatically detecting various different mounting errors and welding defects on the PCB by using a high-speed high-precision vision processing technology;

s3, integral processing: drilling the front surfaces of the front board and the back board, bonding the front board and the back board together through a back adhesive on the back surface of the front board, cold-pressing the front board and the back board, wherein the cold-pressing pressure is 35MPa, the extrusion forming time is 30s, then naturally airing or drying by blowing at 50 ℃, then attaching a white film on the surface of the front board, then utilizing a hot press to attach the white film on the surface of the front board in a clinging manner, coating a layer of solder resist agent on a circuit and a base material which do not need to be welded at the bottom of the back board, then forming characters on the surface of the front board in a screen printing manner, then growing a layer of organic film on the surface of clean bare copper in a chemical manner, then arranging the appearance of the formed circuit board, and finally finishing the quality condition of the circuit board, wherein the operation comprises the following steps: the appearance inspection, the measurement of the size/aperture, the performance test and the like are carried out comprehensively and for the last time, so that the product is ensured to meet the requirements of shipment specifications, and the product can leave a factory after being packaged.

The product comprises the following materials: 1. one surface (hereinafter referred to as surface A) is made of the following materials: the single-sided adhesive backing material (namely, a layer of special thermosetting adhesive is coated on the back of a traditional single-sided panel by a coating machine), and a release protective film is arranged on the back of the single-sided panel. The metal layer can be made of conductive metals such as pure copper, aluminum, copper-clad aluminum and the like. 2. The other surface material (hereinafter referred to as surface B) is: a carrier film is adhered to the back of the single-sided copper foil. 3. Conventional mulch films or white oils. 4. The insulating layer material comprises: electronic grade insulating materials such as PI and PET.

Through when the circuit board is manufactured, the front-back surface silk-screen circuit and the back-side micro-adhesive film copper foil are used, then the front plate and the back plate are separately punched, then the front plate and the back surface are bonded, and after the front plate and the back surface are separately used for carrying out the silk-screen circuit, automatic optical detection can be respectively carried out firstly, various different mounting errors and welding defects on the PCB are automatically detected by using a high-speed high-precision vision processing technology, the errors of subsequent operation can be timely avoided, the problems can be found in advance and solved.

It can be understood that 1, the back material of the all-new tin conduction process circuit board can be carrier film copper, namely a micro-adhesive film and a copper foil are bonded together, and the thickness of the metal copper foil is more than 5 UM; 2. the production process needs a carrier film transfer process, the carrier film needs to be torn off in the transfer process, and the carrier film is only an auxiliary material in the manufacturing process; 3. the manufacturing process of the circuit on the back side comprises the following steps: the manufacturing process of the lines such as the direct silk-screen line, the exposure line, the die stamping line, the die cutting line and the like; 4. the tin conducting position can be arranged on the front surface and the back surface, and can be arranged according to different requirements.

The production process flow of the product comprises the following key processes, wherein 1, the line production modes of direct screen printing, roll coating, dry/wet film exposure and the like are used for the line production of the line A, and the line is formed after etching. 2. And the B surface forms a circuit by using direct screen printing, roll coating, dry/wet film exposure, stamping, die cutting and the like. 3. The two surfaces of the A, B are cut into single sheets after being automatically punched by 100 percent AOI optical detection of the two layers of outer frames. 4. In principle, the A surface (or the B surface) is used for forming holes needing two layers of conduction in a drilling, laser drilling and stamping mode. 5. Tearing off the release film on the back of the surface A, aligning the B-surface circuit layer (provided with the alignment reference) to the adhesive surface on the back of the surface A, laminating according to the design requirement, and tearing off the carrier film behind the B-surface circuit after standing by cold/hot pressing. The circuit transfer process is completed. I.e. the process is specific. 6. And coating white oil or pasting a covering film on the A, B two-layer circuit surface of the product, and the like, thereby playing the role of solder resistance. 7. And finishing characters or surface treatment according to the requirements of customers. 8. Can be cut or delivered in full edition according to the requirements of customers.

And those not described in detail in this specification are well within the skill of those in the art.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.