阅读说明：本技术 一种具有变径流道的控温装置及半导体生产设备 (Temperature control device with reducing flow channel and semiconductor production equipment ) 是由 褚鑫辉 郭月 谭华强 赵婷婷 于 2020-06-15 设计创作，主要内容包括：本发明公开了一种具有变径流道的控温装置及半导体生产设备,其中,所述控温装置将本体中的流道设计为内径由进口至出口大小不均一,即流道内径是大小变化的,通过上述流道的结构设计后,使得冷却液在本体的流道中流动时,随着内径的变化,会产生湍流,利用湍流效应提高控温装置的换热效率,降低对于热水机的能耗；所述半导体生产设备中设置有具有上述流道特征的内置控温管道；所述控温装置,具有结构简单、设计合理、换热效率高、运行成本低等优点。(The invention discloses a temperature control device with a variable-diameter flow channel and semiconductor production equipment, wherein the flow channel in a body is designed into a structure that the inner diameter is not uniform from an inlet to an outlet, namely the inner diameter of the flow channel is variable, and after the structural design of the flow channel is adopted, when cooling liquid flows in the flow channel of the body, turbulence can be generated along with the change of the inner diameter, the heat exchange efficiency of the temperature control device is improved by utilizing the turbulence effect, and the energy consumption of a water heater is reduced; the semiconductor production equipment is internally provided with a built-in temperature control pipeline with the flow channel characteristic; the temperature control device has the advantages of simple structure, reasonable design, high heat exchange efficiency, low operation cost and the like.)

1. A temperature control device with a reducing runner is characterized by comprising: a body (1);

an inlet (11) and an outlet (12) are respectively arranged on the body (1);

a flow passage (13) which is used for communicating the inlet (11) with the outlet (12) is arranged in the body (1);

the inner diameter of the flow channel (13) is non-uniform from the inlet (11) to the outlet (12).

2. The temperature control device with variable diameter flow passage according to claim 1, wherein the inner diameter of the flow passage (13) varies periodically from small to large or from large to small from the inlet (11) to the outlet (12).

3. The temperature control device with a variable-diameter flow channel according to claim 1, wherein the profile of the side wall of the flow channel (13) is periodically changed in a sine shape, a semi-circle shape, a parabola shape and/or a triangle shape.

4. Temperature control device with variable diameter flow channels according to claim 1, characterized in that the traces of the flow channels (13) in the body (1) are distributed in a single ring, multiple rings, disk-like, radial or spiral form.

5. The temperature control device with the variable-diameter flow passage according to claim 1, wherein mounting holes (14) are formed in the body (1) at intervals along the circumferential direction of the body (1).

6. The temperature control device with a variable-diameter flow passage according to claim 1, wherein the temperature control device is a temperature control device for a shower head.

7. The temperature control device with variable diameter flow channels according to claim 1, wherein the temperature control device is a temperature control device in a hot wall type apparatus.

8. The temperature control device with a variable diameter flow passage according to claim 6, wherein the temperature control device is a cooling ring or a cooling plate.

9. The temperature control device with the variable-diameter flow passage according to claim 8, wherein when the spraying device is a cooling ring, mounting holes (14) are respectively arranged on the body (1) at intervals along the circumferential direction of the inner edge and the outer edge of the body (1).

10. The semiconductor production equipment with the built-in temperature control pipeline is characterized in that the size of the inner diameter of the temperature control pipeline in the semiconductor production equipment is not uniform from an inlet to an outlet.

11. The semiconductor production equipment with the built-in temperature control pipeline according to claim 9, wherein the flow rate of the cooling liquid introduced into the temperature control pipeline is not less than 1L/min.

Technical Field

The invention relates to the technical field of equipment for semiconductor processing, in particular to a temperature control device with a reducing flow channel and semiconductor production equipment.

Background

When the coating equipment is used for low-temperature coating of a semiconductor, in order to maintain the stable temperature of the SHD, a large amount of heat needs to be absorbed by a temperature control device in the coating equipment, and when the flow rate of a cooling liquid in the temperature control device is limited, for a general temperature control device, the temperature of the cooling liquid needs to be greatly reduced because the heat exchange efficiency is not high. When the temperature of the cooling liquid is too low (lower than or close to 25 ℃), the selection of the water heater is directly influenced, and a compressor type water heater with a complex structure needs to be selected, so that the early purchase cost and the later operation cost are greatly increased.

In the prior art, in order to improve the heat exchange efficiency of the temperature control device, it is mostly necessary to determine whether the distribution mode and the number of the coolant flow channels in the temperature control device or the flow direction of the coolant flow channels can be changed in other ways to improve the heat exchange efficiency of the temperature control device, which is a problem to be solved urgently.

Disclosure of Invention

In view of this, the invention provides a temperature control device with a variable-diameter flow channel and semiconductor production equipment, so as to improve heat exchange efficiency.

One aspect of the present invention provides a temperature control device with a variable diameter flow channel, comprising: a body;

the body is respectively provided with an inlet and an outlet;

a flow passage for communicating the inlet with the outlet is arranged in the body;

the inner diameter of the flow passage is not uniform from the inlet to the outlet.

Preferably, the inner diameter of the flow passage varies periodically from small to large or from large to small from the inlet to the outlet.

Further preferably, the profile of the side wall of the flow channel periodically varies in a sinusoidal, semicircular, parabolic and/or triangular manner.

Further preferably, the trace of the flow channel in the body is distributed in a single ring, a plurality of rings, a disc, a radial pattern or a spiral pattern.

Further preferably, the body is provided with mounting holes at intervals in a circumferential direction of the body.

Further preferably, the temperature control device is a temperature control device for a spray header.

Further preferably, the temperature control device is a temperature control device in a hot-wall type device.

Further preferably, the spraying device is a cooling ring or a cooling plate.

Further preferably, when the spraying device is a cooling ring, the body is provided with mounting holes at intervals along the circumferential direction of the inner edge and the outer edge of the body.

In another aspect, the present invention provides a semiconductor manufacturing apparatus with a built-in temperature control pipe, wherein the size of the inner diameter of the temperature control pipe is not uniform from the inlet to the outlet.

Preferably, the flow rate of the cooling liquid introduced into the temperature control pipeline is not less than 1L/min.

According to the temperature control device with the variable-diameter flow channel, the flow channel in the body is designed to have the inner diameter which is not uniform from the inlet to the outlet, namely the inner diameter is variable, and through the structural design of the flow channel, when cooling liquid flows in the flow channel of the body, turbulence can be generated along with the change of the inner diameter, so that the heat exchange efficiency of the temperature control device is improved by utilizing the turbulence effect, and the energy consumption of a water heater is reduced.

The semiconductor production equipment with the built-in temperature control pipeline provided by the invention designs the built-in temperature control pipeline according to the characteristics of the flow channel.

The temperature control device with the variable-diameter flow channel has the advantages of simple structure, reasonable design, high heat exchange efficiency, low operation cost and the like.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a temperature control device with a variable diameter flow channel according to an embodiment of the disclosure;

FIG. 2 is a schematic structural diagram of a temperature control device with a variable diameter flow channel according to an embodiment of the present disclosure, in which the flow channel periodically changes in a semicircular shape;

FIG. 3 is a schematic structural diagram of a temperature control device with a variable diameter flow channel in which the flow channel changes periodically in a parabolic shape according to an embodiment of the disclosure;

FIG. 4 is a schematic structural diagram of a temperature control device with a variable diameter flow channel in which the flow channel changes periodically in a triangular shape according to an embodiment of the disclosure;

FIG. 5 is a schematic structural diagram of a temperature control device with a variable diameter flow channel according to an embodiment of the present disclosure, in which traces of the flow channel are distributed in a disc shape;

FIG. 6 is a thermodynamic simulation temperature distribution diagram of a single-ring runner structure without diameter variation in simulation experiment 1, with a coolant flow of 5L/min;

FIG. 7 is a thermodynamic simulation temperature distribution diagram of a single-ring runner structure without diameter variation in simulation experiment 1, with a coolant flow of 10L/min;

FIG. 8 is a thermodynamic simulation temperature distribution diagram of a single-ring runner structure without diameter variation in simulation experiment 1, with a coolant flow of 40L/min;

FIG. 9 is a thermal simulation temperature distribution diagram corresponding to a single-ring channel structure with variable diameter, a coolant flow of 10L/min, in simulation experiment 1;

FIG. 10 is a thermodynamic simulation temperature distribution diagram of a single-ring runner structure without diameter variation in simulation experiment 2, with a coolant flow of 10L/min;

FIG. 11 is a thermodynamic simulation temperature distribution diagram corresponding to a variable diameter single-ring channel structure in simulation experiment 2 with a coolant flow of 10L/min;

FIG. 12 is a thermodynamic simulation temperature distribution diagram corresponding to a double-ring runner structure without diameter variation in simulation experiment 3, with a coolant flow of 10L/min;

FIG. 13 is a thermodynamic simulation temperature distribution diagram corresponding to a double-ring runner structure with variable diameters and a coolant flow of 10L/min in simulation experiment 3.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus consistent with certain aspects of the invention, as detailed in the appended claims.

Based on the prior art, the heat exchange efficiency of the temperature control device is improved by mostly changing the distribution mode and the number of cooling liquid flow channels in the temperature control device or the flowing direction of the cooling liquid. This embodiment attempts to provide a new way to achieve the improvement of the heat exchange efficiency of the temperature control device, specifically, referring to fig. 1, the temperature control device includes: the body 1 is provided with an inlet 11 and an outlet 12 on the body 1, wherein the inlet 11 and the outlet 12 are not limited to 1, and may be a plurality of inlets 11 and outlets 12, a flow channel 13 communicating the inlet 11 and the outlet 12 is provided in the body 1, and the inner diameter of the flow channel 13 is not uniform from the inlet 11 to the outlet 12, that is, the inner diameter of the flow channel 13 is variable. When the temperature control device provided by the above embodiment is used, the cooling liquid flows into the flow channel 13 in the body 1 from the inlet 11, and after the cooling liquid is introduced into the inlet 11 at a constant flow rate, because the flow channel 13 is designed to have a non-uniform inner diameter, and the inner diameter is variable, when the cooling liquid flows in the flow channel 13, a turbulent flow is formed whenever the cooling liquid flows from a small inner diameter to a large inner diameter, and the overall heat exchange efficiency of the temperature control device can be improved by the above turbulent flow effect, and the energy consumption of the water heater is reduced.

Preferably, the inner diameter of the flow channel 13 in the body 1 is designed to vary periodically from small to large or from large to small from the inlet 11 to the outlet 12.

In the above temperature control device, the specific shape of the flow channel 13 is not particularly limited as long as the change of the inner diameter can be realized so that the cooling liquid can form a turbulent flow when flowing in the flow channel 13. For example, referring to fig. 1 to 4, the flow channel 13 may be designed such that the profile of the sidewall varies in a sinusoidal, semicircular, parabolic and/or triangular periodic manner, wherein fig. 1 shows the sinusoidal periodic variation, fig. 2 shows the semicircular periodic variation, fig. 3 shows the parabolic periodic variation, and fig. 4 shows the triangular periodic variation, but the invention is not limited to the above-mentioned 4 shapes.

The distribution form of the flow channels 13 on the body 1 can also be rotated according to actual needs, for example, as shown in fig. 1, the traces of the flow channels 13 on the body 1 are distributed in a single ring along the circumferential direction of the body, can be distributed on the body 1 in the form of a plurality of rings, can be distributed on the body 1 in the form of a disk as shown in fig. 5, and can also be distributed in a radial type or a spiral type.

The number of the flow channels 13 in the body 1 may be one or more.

In order to facilitate the installation of the temperature control device in use, as an improvement of the technical scheme, referring to fig. 1, installation holes 14 are arranged on the body 1 at intervals along the circumferential direction of the body 1, and when in use, bolts can pass through the installation holes 14 to install the temperature control device at a corresponding use position.

The temperature control device provided by the above embodiment may be a temperature control device for a shower head, specifically, a cooling ring or a cooling plate. In the case of the cooling ring, in order to improve the firmness of installation, referring to fig. 1, the installation holes 14 are respectively arranged on the body 1 at intervals along the circumferential direction of the inner edge and the outer edge of the body 1, namely two circles of installation holes are arranged.

The temperature control device can be applied to various hot-wall type production equipment, in particular to semiconductor equipment, such as PECVD, ALD or 3D equipment for processing semiconductors.

In view of the above, the present embodiment is based on the above inventive concept, and further provides a semiconductor production device with a built-in temperature control pipeline, in which the inner diameter of the temperature control pipeline is designed to be non-uniform from an inlet to an outlet, that is, the inner diameter of the temperature control pipeline is varied in size, so that when a cooling liquid flows in the temperature control pipeline, a turbulent flow can be formed, and the heat exchange efficiency is improved by the turbulent flow effect.

Preferably, in the semiconductor production equipment with the built-in temperature control pipeline, the flow rate of the cooling liquid introduced into the temperature control pipeline is not less than 1L/min.

In order to verify that the diameter-variable flow passage structure can improve the heat exchange efficiency of the temperature control device, 3 groups of simulation experiments are respectively carried out as follows:

simulation experiment 1:

simulation conditions are as follows: in the single-ring runner structure without reducing diameter, the temperature of the inlet cooling liquid is 110 ℃, the flow rates of the inlet cooling liquid are 5L/min, 10L/min and 40L/min respectively, the heat exchange energy is 300W, which is 5L/min corresponding to FIG. 6, the temperature change range is 120.3-122.1 ℃, which is 10L/min corresponding to FIG. 7, the temperature change range is 117.8-119.7 ℃, which is 40L/min corresponding to FIG. 8, and the temperature change range is 1132.2-114.9 ℃.

Simulation conditions are as follows: in the single-ring flow channel structure with variable diameter, the temperature of the inlet cooling liquid is 110 ℃, the flow rate of the inlet cooling liquid is 10L/min, the heat exchange energy is 300W, and referring to fig. 9, the temperature variation range is 114.0-115.1 ℃.

According to the simulation experiment, the purpose of improving the heat exchange efficiency of the heat exchange device can be achieved by increasing the flow, in the single-ring runner structure without reducing diameter, when the flow is increased to 40L/min, the cooling effect can be achieved when the flow is 10L/min in the single-ring runner structure with reducing diameter, and therefore the runner with the reducing diameter structure is provided, and the heat exchange efficiency is higher.

As can be seen from fig. 7 and 9, under the same external conditions, the temperature rise of the liquid is reduced by 50% in the single-ring flow channel structure with variable diameter compared with the single-ring flow channel structure without variable diameter, and the heat exchange efficiency is higher.

Simulation experiment 2:

simulation conditions are as follows: in the single-ring runner structure without reducing diameter, the temperature of the inlet cooling liquid is 110 ℃, the flow rate of the inlet cooling liquid is 10L/min, the heat exchange energy is 300W, and referring to fig. 10, the temperature variation range is 129.9-147.2 ℃.

Simulation conditions are as follows: in the single-ring flow channel structure with variable diameter, the temperature of the inlet cooling liquid is 110 ℃, the flow rate of the inlet cooling liquid is 10L/min, the heat exchange energy is 300W, and referring to fig. 11, the temperature variation range is 123.4-138.8 ℃.

According to the simulation experiment, the single-ring flow channel structure with the reducing diameter has higher heat exchange efficiency and better cooling effect compared with the single-ring flow channel structure without the reducing diameter under the same external condition.

Simulation experiment 3:

simulation conditions are as follows: in the double-ring runner structure without reducing diameter, the temperature of the inlet cooling liquid is 110 ℃, the flow rate of the inlet cooling liquid is 10L/min, the heat exchange energy is 300W, and referring to fig. 12, the temperature variation range is 118.4-121.6 ℃.

Simulation conditions are as follows: in the double-ring runner structure with variable diameter, the temperature of the inlet cooling liquid is 110 ℃, the flow rate of the inlet cooling liquid is 10L/min, the heat exchange energy is 300W, and referring to fig. 13, the temperature variation range is 114.3-117.9 ℃.

According to the simulation experiment, the double-ring flow channel structure with the reducing diameter has higher heat exchange efficiency and better cooling effect compared with the double-ring flow channel structure without the reducing diameter under the same external condition.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.