阅读说明：本技术 一种基于封装件去离子水的rram阵列水冷散热装置 (RRAM array water-cooling heat dissipation device based on packaging part deionized water ) 是由 张嘉伟 刘林声 刘朝晖 宋宸 秦司晨 于 2021-08-27 设计创作，主要内容包括：本发明公开了一种基于封装件去离子水的RRAM阵列水冷散热装置,包括封装箱,封装箱内部固接有插槽,插槽内插设有RRAM阵列模块,封装箱顶部分别开设第一通水口和第二通水口,第一通水口和第二通水口之间固接有散热机构。本发明利用循环水将RRAM阵列模块产生的热量迅速带到封装箱外部的水冷器进行散热,由于该装置采用去离子水,与RRAM阵列模块传热接触面积更大,且自身不具有导电性,不会引起电路短路故障,导热效果更佳。(The invention discloses a RRAM array water-cooling heat dissipation device based on package deionized water, which comprises a package box, wherein an insertion slot is fixedly connected inside the package box, an RRAM array module is inserted in the insertion slot, the top of the package box is respectively provided with a first water through opening and a second water through opening, and a heat dissipation mechanism is fixedly connected between the first water through opening and the second water through opening. The invention utilizes the circulating water to rapidly bring the heat generated by the RRAM array module to the water cooler outside the packaging box for heat dissipation, and because the device adopts the deionized water, the heat transfer contact area with the RRAM array module is larger, and the device has no electric conductivity, the short circuit fault of a circuit can not be caused, and the heat conduction effect is better.)

1. The utility model provides a RRAM array water-cooling heat abstractor based on packaging part deionized water, its characterized in that, including packaging box (4), the inside rigid coupling of packaging box (4) has slot (2), slot (2) interpolation is equipped with RRAM array module (1), first water service mouth (12) and second water service mouth (13) are seted up respectively at packaging box (4) top, the rigid coupling has heat dissipation mechanism between first water service mouth (12) and the second water service mouth (13).

2. The package deionized water-based RRAM array water-cooling heat dissipation device according to claim 1, wherein the heat dissipation mechanism comprises a water cooler (8), one side of the water cooler (8) is fixedly connected with a pump (6) through a first water conduit (7), the other side of the water cooler (8) is fixedly connected with an ion filter (10) through a second water conduit (9), one side of the ion filter (10) far away from the second conduit (9) is fixedly connected with a first water through opening (12) through a water outlet pipe (11), and one side of the pump (6) far away from the first water conduit (7) is fixedly connected with a second water through opening (13) through a water inlet pipe (5).

3. The package deionized water based RRAM array water-cooling heat dissipation device of claim 1, wherein the first water through opening (12) and the second water through opening (13) are both configured as a concave structure, and the first water through opening (12) and the second water through opening (13) are respectively in threaded connection with the water outlet pipe (11) and the water inlet pipe (5) through threads.

4. The package deionized water based RRAM array water-cooling heat dissipation device of claim 1, wherein the bottom of the slot (2) is adhered to the bottom surface of the package box (4) through heat conductive silica gel.

5. The package deionized water based RRAM array water-cooling heat dissipation device of claim 1, wherein the package box (4) is provided with heat dissipation ports (3) on its opposite outer walls.

Technical Field

The invention belongs to the technical field of water-cooling heat dissipation equipment, and relates to a RRAM array water-cooling heat dissipation device based on package deionized water.

Background

The Resistive Random Access Memory (RRAM) is a nonvolatile memory (NVM) device for recording and storing data information based on resistance value change, is a storage and calculation integrated unit with high density, high availability and simple preparation process, and can be widely applied to development of deep learning modules inspired by nerves and construction of high-performance memory clusters at present. The RRAM adopts a design scheme of high density and high integrated array, and has the advantages of greatly reducing the space occupation, but has the disadvantages of greatly improving the power density, generating a large amount of heat in the operation process, and enabling the RRAM module in the middle layer to escape ions due to the heat effect by array stacking, so that the heat dissipation module operated by the RRAM array becomes the key factor of stable operation of the system.

For a high-density RRAM array, the traditional air-cooled heat dissipation is difficult to meet the heat dissipation efficiency of the RRAM array, and the problems of high energy consumption, strong noise and the like can be caused by adopting the air-cooled heat dissipation.

Disclosure of Invention

The invention aims to provide a RRAM array water-cooling heat dissipation device based on package deionized water, and solves the problem that the existing air-cooling heat dissipation device is difficult to meet the heat dissipation efficiency of an RRAM array.

The invention adopts the technical scheme that the RRAM array water-cooling heat dissipation device based on package deionized water comprises a package box, wherein a slot is fixedly connected inside the package box, an RRAM array module is inserted into the slot, the top of the package box is respectively provided with a first water through opening and a second water through opening, and a heat dissipation mechanism is fixedly connected between the first water through opening and the second water through opening.

The invention is also characterized in that:

the heat dissipation mechanism comprises a water cooler, one side of the water cooler is fixedly connected with a pump through a first water guide pipe, the other side of the water cooler is fixedly connected with an ion filter through a second water guide pipe, one side of the ion filter, far away from the second water guide pipe, is fixedly connected with a first water through hole through a water outlet pipe, and one side of the pump, far away from the first water guide pipe, is fixedly connected with a second water through hole through a water inlet pipe;

the first water through opening and the second water through opening are both arranged in a concave structure, and are respectively in threaded connection with the water outlet pipe and the water inlet pipe through threads;

the bottom of the slot is adhered to the bottom surface of the packaging box through heat-conducting silica gel;

the opposite outer walls of the packaging box are provided with heat dissipation ports;

the beneficial effect of the invention is that,

a RRAM array water-cooling heat dissipating double-fuselage based on packaging deionized water, utilize the circulating water to bring the heat that RRAM array module produces to the water cooler outside the packaging box rapidly and dispel the heat, because the device adopts deionized water, it is bigger to have heat transfer contact area with RRAM array module, and do not have conductivity by oneself, can not cause the short circuit trouble of the circuit, the heat conduction effect is better; because the RRAM array module can generate a small amount of ions to escape due to the connection and disconnection of the conductive filaments in the actual operation process, the device can carry out ion cleaning on the array surface so as to enhance the hydrophilicity of the RRAM bottom electrode layer and improve the film forming property of the resistive oxide layer.

Drawings

FIG. 1 is a schematic structural diagram of a RRAM array water-cooling heat dissipation device based on package deionized water according to the present invention;

FIG. 2 is a schematic diagram of a partial structure of a heat dissipation mechanism in a package deionized water based RRAM array water-cooling heat dissipation device according to the present invention;

FIG. 3 is a cross-sectional view of a water inlet of a package DI water based RRAM array water-cooled heat sink of the present invention.

In the figure, 1, an RRAM array module, 2, a slot, 3, a heat dissipation port, 4, a packaging box, 5, a water inlet pipe, 6, a pump, 7, a first water guide pipe, 8, a water cooler, 9, a second water guide pipe, 10, an ion filter, 11, a water outlet pipe, 12, a first water through port and 13, a second water through port are arranged.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

The invention relates to a RRAM array water-cooling heat dissipation device based on package deionized water, which comprises a package box 4, wherein a slot 2 is fixedly connected inside the package box 4, an RRAM array module 1 is inserted into the slot 2, the top of the package box 4 is respectively provided with a first water through opening 12 and a second water through opening 13, and a heat dissipation mechanism is fixedly connected between the first water through opening 12 and the second water through opening 13;

the heat dissipation mechanism comprises a water cooler 8, the water cooler 8 is used for rapidly discharging heat in circulating water to the surrounding environment, the cooled circulating water flows into the packaging box 4 again, one side of the water cooler 8 is fixedly connected with a pump 6 through a first water guide pipe 7, the pump 6 is used for pushing the circulating water to flow in a heat dissipation mechanism to help the circulating water to dissipate heat, the other side of the exchange water cooler 8 is fixedly connected with an ion filter 10 through a second water guide pipe 9, the ion filter 10 is used for enabling the circulating water to clean a small amount of ions escaping from the surface of the RRAM array module 1, and then the water which is filtered and reflowed into the packaging box 4 is electrically neutral, therefore, the deionized water in the packaging box 4 is ensured to be neutral all the time, one side of the ion filter 10 far away from the second guide pipe 9 is fixedly connected with the first water through opening 12 through the water outlet pipe 11, and one side of the pump 6 far away from the first water guide pipe 7 is fixedly connected with the second water through opening 13 through the water inlet pipe 5;

as shown in fig. 3, the first water passage opening 12 and the second water passage opening 13 are both configured as a "concave" structure, and the first water passage opening 12 and the second water passage opening 13 are respectively in threaded connection with the water outlet pipe 11 and the water inlet pipe 5 through threads.

The bottom of the slot 2 is adhered to the bottom surface of the packaging box 4 through heat-conducting silica gel.

The heat dissipation ports 3 are formed in the outer wall, opposite to the packaging box 4, the two heat dissipation ports 3 are arranged oppositely, and the auxiliary heat dissipation mechanism dissipates heat of the packaging box 4.

The RRAM array water-cooling heat dissipation device based on package deionized water has the following working principle:

when the RRAM array module 1 in the packaging box 4 starts to work, the RRAM array module 1 gradually releases heat, the heat is transferred to deionized water in the packaging box 4, the circulating water is pushed to flow in the heat dissipation mechanism by the pump 6, the circulating water absorbing the heat flows into the water inlet pipe 5 from the second water through the second water cooling device 8, the RRAM array module 1 generates a large amount of ions at the side of the polar plate due to the on-off of the conductive filaments during the actual operation, and a small amount of ions are escaped, the deionized water cleans the surface of the RRAM array module 1, the circulating water enters the heat dissipation mechanism after losing the heat and the ions, after ion filtration, the circulating water from the ion filter 10 is electrically neutral.

The invention relates to a package deionized water-based RRAM array water-cooling heat dissipation device, wherein pure deionized water is used for absorbing heat generated by an RRAM array module and cleaning ions escaped from the RRAM array module, the heat absorbed by the pure deionized water and a small amount of escaped ions enter a water cooler through water circulation of a pump through a water inlet pipe, the water cooler cools the pure deionized water which absorbs the heat, the cooled circulating water enters an ion filter again, the circulating water flows back into a packaging box through a water pipe after ion filtration, and at the moment, the water flowing into the packaging box is neutral, so that the circulation of working media is completed.